JP2534837B2 - Method of soldering parts to circuit board - Google Patents
Method of soldering parts to circuit boardInfo
- Publication number
- JP2534837B2 JP2534837B2 JP6226503A JP22650394A JP2534837B2 JP 2534837 B2 JP2534837 B2 JP 2534837B2 JP 6226503 A JP6226503 A JP 6226503A JP 22650394 A JP22650394 A JP 22650394A JP 2534837 B2 JP2534837 B2 JP 2534837B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- component
- solder
- pad
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、回路基板に集積回路等
の部品を半田付けして実装する回路基板への部品の半田
付け方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for soldering a component such as an integrated circuit to a circuit board by soldering the component to the circuit board.
【０００２】[0002]
【従来の技術】従来、回路基板の両面に回路部品を半田
付実装する場合、または、回路基板に複数の部品を段階
的に半田付実装する場合等は、部品を回路基板に接着剤
でも固定するか融点の異なる半田を使用し、回路基板の
裏面部品や初めに回路基板に実装された部品の半田の再
溶融による部品の欠落、位置ずれの発生を防止してい
た。2. Description of the Related Art Conventionally, when mounting circuit components on both sides of a circuit board by soldering, or when mounting a plurality of components on the circuit board in stages, the components are fixed to the circuit board with an adhesive. Alternatively, solders having different melting points are used to prevent the components on the back surface of the circuit board or the components mounted on the circuit board from being remelted and missing or displaced.
【０００３】[0003]
【発明が解決しようとする課題】このような従来の回路
基板への部品の半田付け方法は、接着剤若しくは融点の
異なる半田が必要となり、また、これらを供給する工程
が必要となるという欠点があった。The conventional method of soldering components to a circuit board as described above has a drawback in that an adhesive or a solder having a different melting point is required and a step of supplying them is required. there were.
【０００４】そこで本発明の目的は、接着剤若しくは融
点の異なる半田を供給せずとも、裏面部品や初めに回路
基板に実装された部品の半田の再溶融による欠落、位置
ずれの発生を防止できる回路基板への部品の半田付け方
法を提供することにある。Therefore, it is an object of the present invention to prevent the back surface component and the component mounted on the circuit board from being missing or displaced due to remelting of the solder without supplying an adhesive or a solder having a different melting point. It is to provide a method of soldering a component to a circuit board.
【０００５】[0005]
【課題を解決するための手段】本発明の回路基板への部
品の半田付け方法は、回路基板上の対向電極に接続され
た前記回路基板上の第１のパッドに第１の部品を前記対
向電極を構成する金属とは異なる２種以上の金属の合金
からなる半田で半田付けしてから前記回路基板を電解質
溶液中に浸漬した後に、前記第１の部品を半田付けした
もとの同一種類の半田を用いて前記回路基板上の第２の
パッドに第２の部品を半田付けすることを特徴とする。According to a method of soldering a component to a circuit board of the present invention, the first component is opposed to a first pad on the circuit board connected to a counter electrode on the circuit board. The same kind of soldering the first component after soldering with a solder composed of an alloy of two or more kinds of metals different from the metal forming the electrodes and then immersing the circuit board in an electrolyte solution The second component is soldered to the second pad on the circuit board by using the above solder.
【０００６】本発明の回路基板への部品の半田付け方法
は、第１の部品の対向電極に接続された第１のパッドに
前記対向電極を構成する金属とは異なる２種以上の金属
の合金からなる半田を供給して前記第１の部品を電解質
溶液中に浸漬した後に前記第１の部品を前記回路基板上
の第１のパッドに半田付けしてから前記第１のパッドに
供給したものと同一種類の半田を用いて第２の部品を前
記回路基板上の第２のパッドに半田付けすることを特徴
とする。According to the method of soldering a component to a circuit board of the present invention, an alloy of two or more kinds of metals different from the metal forming the counter electrode is attached to the first pad connected to the counter electrode of the first component. And then soldering the first component to the first pad on the circuit board and then supplying the first component to the first pad. The second component is soldered to the second pad on the circuit board by using the same type of solder.
【０００７】[0007]
【作用】本発明において、２種以上の金属の合金からな
る半田と、この半田と接続されこの半田とは異なる金属
からなる対向電極は、その金属元素の組合せにより電解
質溶液中では、いわゆる電池作用により電極間で電位差
を生じさせることができ、これにより、半田の一部の種
類の金属を選択的に電解質溶液中に溶出させることがで
きる。従ってこれにより、任意の半田の金属合金の組成
を変化せしめ、この組成の変化に伴う融点の変化を利用
し、あらかじめ接着剤若しくは融点の異なる半田を供給
することなく、裏面部品や始めに実装された部品の半田
の再溶融による欠落、位置ずれの発生を防止することが
できる。In the present invention, the solder made of an alloy of two or more kinds of metals and the counter electrode made of a metal different from the solder and connected to the solder are so-called battery action in the electrolyte solution due to the combination of the metal elements. By this, a potential difference can be generated between the electrodes, and thereby, some kinds of metals of the solder can be selectively eluted into the electrolyte solution. Therefore, by changing the composition of the metal alloy of any solder by this, by utilizing the change of the melting point due to the change of this composition, without mounting adhesive or solder with a different melting point in advance, it is mounted on the back surface component or at the beginning. It is possible to prevent the occurrence of misalignment and misalignment due to remelting of the solder of the parts.
【０００８】[0008]
【実施例】次に本発明について図面を参照して説明す
る。 〔実施例１〕図１は、本発明の回路基板への部品の半田
付け方法の実施例１を示す断面図、図２は本実施例によ
り両面に回路部品が実装された回路基板の断面図であ
る。The present invention will be described below with reference to the drawings. [Embodiment 1] FIG. 1 is a sectional view showing Embodiment 1 of a method for soldering a component to a circuit board according to the present invention, and FIG. 2 is a sectional view of a circuit board having circuit components mounted on both sides according to this embodiment. Is.
【０００９】図１に示す回路基板１の第１の面に（ただ
し回路基板１を図１に示す電解質溶液６に浸漬させない
状態で）、回路部品２ａを実装する際は、回路基板１上
に設けられた接続用パッド３ａ上に、接続用半田４ａを
供給し、加熱することにより、回路部品２ａのリード９
ａとパッド３ａとが半田付けされる。接続用パッド３ａ
と回路基板１の第２の面に設けられた対向電極５とが内
部配線１０によって接続されている。接続用半田４ａに
は、Ｓｎ−Ｐｂ系、Ｓｎ基、Ｐｂ基、Ａｕ基、Ｉｎ基、
Ａｌ基の半田等を使用する。一方、対向電極５には、接
続用半田４ａとは異なる金属を使用する。本実施例で
は、例えば、一般的な半田付に使用される低融点半田で
あるＳｎ−Ｐｂ系の半田において、共晶となる組成（Ｓ
ｎ６３％−Ｐｂ３７％）のものを接続用半田４ａに用
い、対向電極５は、Ａｕで形成されたものとする。When the circuit component 2a is mounted on the first surface of the circuit board 1 shown in FIG. 1 (however, the circuit board 1 is not soaked in the electrolyte solution 6 shown in FIG. 1), the circuit component 2a is mounted on the circuit board 1. By supplying the connecting solder 4a onto the provided connecting pad 3a and heating the same, the leads 9 of the circuit component 2a are formed.
a and the pad 3a are soldered. Connection pad 3a
And the counter electrode 5 provided on the second surface of the circuit board 1 are connected by the internal wiring 10. The connection solder 4a includes a Sn-Pb system, a Sn group, a Pb group, an Au group, an In group,
Al-based solder or the like is used. On the other hand, a metal different from the connecting solder 4a is used for the counter electrode 5. In the present embodiment, for example, in a Sn—Pb based solder which is a low melting point solder used for general soldering, a composition (S
n63% -Pb37%) is used as the connecting solder 4a, and the counter electrode 5 is made of Au.
【００１０】パッド３ａに回路部品２ａのリード９ａが
半田付けされた基板１を図１に示すように電解質溶液６
中に浸漬させると、半田接続部（パッド３ａ、接続用半
田４ａ）と対向電極５の間に、いわゆる電池作用により
電位差が生じ、この結果、接続用半田４ａ中のＰｂのみ
を選択的に溶液６中に溶出させることになる。これによ
り、接続用半田４ａの金属合金の組成が変化し、Ｓｎの
割合が当初より高くなる。The substrate 1 in which the leads 9a of the circuit component 2a are soldered to the pads 3a is provided with an electrolyte solution 6 as shown in FIG.
When immersed in the solder, a potential difference is generated between the solder connection portion (pad 3a, connection solder 4a) and the counter electrode 5 due to a so-called battery action, and as a result, only Pb in the connection solder 4a is selectively dissolved in the solution. Will be eluted in 6. As a result, the composition of the metal alloy of the connecting solder 4a changes, and the proportion of Sn becomes higher than initially.
【００１１】ところで、Ｓｎ−Ｐｂ系の半田は、図７に
示す平衡状態図であることが知られている。これによれ
ば、Ｓｎ６１．９％−Ｐｂ残部で共晶状態となりその融
点は１８３℃である。以降Ｓｎの割合を高くしていく
と、その融点はＳｎ１００％−Ｐｂ０％において２３２
℃まで上昇することとなる。従って、本実施例において
当初供給されたＳｎ６３％−Ｐｂ３７％の半田は、その
後Ｐｂの溶出により、徐々にその融点が上昇することと
なる。By the way, it is known that the Sn--Pb type solder has an equilibrium state diagram shown in FIG. According to this, the balance of Sn61.9% -Pb becomes a eutectic state, and the melting point is 183 ° C. When the ratio of Sn is increased thereafter, the melting point is 232 at Sn100% -Pb0%.
It will rise to ℃. Therefore, the melting point of the Sn63% -Pb37% solder initially supplied in this embodiment gradually rises due to the elution of Pb thereafter.
【００１２】その後、図２に示すように回路基板１の第
２の面に回路部品２ｂを実装する。この時に回路基板１
のパッド３ｂと回路部品２ｂのリード９ｂを半田付けす
る接続用半田４ｂは、電解質溶液６中に浸漬される前に
接続用半田４ａと同一の半田を使用することにより、浸
漬された後の接続用半田４ａよりも低い融点で溶けるこ
ととなる。After that, as shown in FIG. 2, the circuit component 2b is mounted on the second surface of the circuit board 1. Circuit board 1 at this time
The connection solder 4b for soldering the pad 3b and the lead 9b of the circuit component 2b is made by using the same solder as the connection solder 4a before being immersed in the electrolyte solution 6, so that the connection after the immersion is performed. It will melt at a lower melting point than the solder 4a for use.
【００１３】このように、電解質溶液６中に浸漬後の半
田４ａは、後から回路基板１の第２の面に回路部品２ｂ
を実装する際に用いた接続用半田４ｂより高い融点をも
つため、回路部品２ｂを実装する際に加熱温度を溶液６
中に浸漬後の半田４ａの融点より低くなるように制御す
れば、半田４ａは再溶融することがなく、従って、回路
部品２ｂの実装時の回路部品２ａの欠落、位置ずれを防
止することができる。As described above, the solder 4a after being dipped in the electrolyte solution 6 is later applied to the second surface of the circuit board 1 on the circuit component 2b.
Since it has a melting point higher than that of the connecting solder 4b used when mounting the circuit component, the heating temperature is set to the solution 6 when mounting the circuit component 2b.
If the melting point of the solder 4a is controlled to be lower than the melting point of the solder 4a, the solder 4a will not be remelted, and therefore, the circuit component 2a can be prevented from being lost or displaced when the circuit component 2b is mounted. it can.
【００１４】〔実施例２〕図３は、本発明の回路基板へ
の部品の半田付け方法の実施例２を示す断面図、図４は
本実施例により両面に回路部品が実装された回路基板の
断面図である。[Embodiment 2] FIG. 3 is a sectional view showing Embodiment 2 of a method for soldering components to a circuit board according to the present invention, and FIG. 4 is a circuit board having circuit components mounted on both sides according to this embodiment. FIG.
【００１５】図１の実施例がＱＦＰ（quad flat packag
e ）を実装するものであるのに対し本実施例は、フリッ
プチップ接合の回路部品７ａ，７ｂを実装するものであ
る。この回路部品７ａ，７ｂには、接続用パッド８が設
けられており、この接続用パッド８と、回路基板１上の
接続用パッド３ａ，３ｂを接続用半田４ａ，４ｂを用い
て接続する。パッド３ａは内部配線１０により対向電極
５に接続されている。回路部品７ａのパッド８をパッド
３ａに半田４ａにより接続してから、図３に示すように
電解質溶液６に浸漬し、この後に図４に示すように回路
部品７ｂのパッド８をパッド３ｂに半田４ｂにより接続
する。本実施例でも図１の実施例と全く同一の効果を得
ることができる。 〔実施例３〕図５は、本発明の回路基板への部品の半田
付け方法の実施例３を示す断面図、図６は本実施例によ
り回路部品が実装された回路基板の断面図である。The embodiment shown in FIG. 1 is a QFP (quad flat packag).
In this embodiment, the circuit components 7a and 7b of flip-chip bonding are mounted, while the component e) is mounted. Connection pads 8 are provided on the circuit components 7a and 7b, and the connection pads 8 are connected to the connection pads 3a and 3b on the circuit board 1 by using connection solders 4a and 4b. The pad 3a is connected to the counter electrode 5 by the internal wiring 10. After the pad 8 of the circuit component 7a is connected to the pad 3a by the solder 4a, it is immersed in the electrolyte solution 6 as shown in FIG. 3, and then the pad 8 of the circuit component 7b is soldered to the pad 3b as shown in FIG. Connect with 4b. Also in this embodiment, the same effect as that of the embodiment of FIG. 1 can be obtained. [Embodiment 3] FIG. 5 is a sectional view showing Embodiment 3 of a method for soldering components to a circuit board according to the present invention, and FIG. 6 is a sectional view of a circuit board on which circuit components are mounted according to this embodiment. .
【００１６】本実施例は、図１および図３の実施例が回
路基板１側に対向電極５を有していなのに対し、本実施
例では図５に示すように対向電極５が、回路部品１１ａ
側に設けられている。すなわち回路部品１１ａのパッド
８は内部配線１０によって対向電極５に接続されてい
る。本実施例では、回路部品１１ａのパッド８上に接続
用半田４ａを供給してから、図５に示すように回路部品
１１ａを電解質溶液６中に浸漬することにより、基板へ
実装前の回路部品の段階で、接続用パッド８上の接続用
半田４ａの融点を高くなるように変化させておく。一
方、回路部品１１ｂのパッド８に供給した接続用半田４
ｂについては、このパッド８が対向電極に接続されてな
く、また電解質溶液中に浸漬することなく融点が低く保
たれている。回路基板１に回路部品１１ａを実装すべく
パッド８をパッド３ａに半田４ａにより接続してから、
段階的に次に回路基板１に回路部品１１ｂを実装すべ
く、接続用半田４ａの融点より低い温度に加熱してパッ
ド８をパッド３ｂに半田４ｂにより接続する。In the present embodiment, the counter electrode 5 is not provided on the circuit board 1 side in the embodiments of FIGS. 1 and 3, but in the present embodiment, the counter electrode 5 is the circuit component 11a as shown in FIG.
It is provided on the side. That is, the pad 8 of the circuit component 11a is connected to the counter electrode 5 by the internal wiring 10. In this embodiment, after the connection solder 4a is supplied on the pad 8 of the circuit component 11a, the circuit component 11a is immersed in the electrolyte solution 6 as shown in FIG. At this stage, the melting point of the connecting solder 4a on the connecting pad 8 is changed to be high. On the other hand, the connecting solder 4 supplied to the pad 8 of the circuit component 11b
Regarding b, the melting point is kept low without the pad 8 being connected to the counter electrode and being immersed in the electrolyte solution. After connecting the pad 8 to the pad 3a by the solder 4a to mount the circuit component 11a on the circuit board 1,
In order to mount the circuit component 11b on the circuit board 1 step by step, the pad 8 is connected to the pad 3b by the solder 4b by heating to a temperature lower than the melting point of the connecting solder 4a.
【００１７】本実施例においても、回路部品１１ｂを実
装する時に既に実装してある回路部品１１ａの欠落、位
置ずれを防止でき、前述の実施例１および実施例２と全
く同一の効果を有する。しかも、回路部品１１ａのみを
電解質溶液６に浸漬し基板１を電解質溶液に浸漬する必
要がないので電解質溶液６を保持する設備が小型化でき
るという長所をも有する。なお、以上の説明ではＱＦ
Ｐ、フリップチップ接合の回路部品について説明した
が、本発明はその他の半田付接続部品に関して適用する
ことも可能である。Also in the present embodiment, when the circuit component 11b is mounted, it is possible to prevent the circuit component 11a already mounted from being missing or displaced, and the effect is exactly the same as in the first and second embodiments. Moreover, since it is not necessary to immerse only the circuit component 11a in the electrolyte solution 6 and the substrate 1 in the electrolyte solution, there is an advantage that the equipment for holding the electrolyte solution 6 can be downsized. In the above explanation, QF
Although the P and flip-chip bonded circuit components have been described, the present invention can also be applied to other soldered connection components.
【００１８】なお、実施例１で一つの回路部品２ａの複
数のリード９ａを回路基板１の複数のパッド３ａの半田
付けする場合は、全てのパッド３ａに対向電極５を接続
してもよいし、一部分のパッド３ａにのみ対向電極５を
接続してもよい。When the plurality of leads 9a of one circuit component 2a are soldered to the plurality of pads 3a of the circuit board 1 in the first embodiment, the counter electrodes 5 may be connected to all the pads 3a. The counter electrode 5 may be connected to only a part of the pads 3a.
【００１９】[0019]
【発明の効果】以上説明したように本発明は、２種以上
の金属の合金からなる半田で部品を回路基板に半田付け
し、部品を半田付けした回路基板または半田をパッドに
供給した部品を電解質溶液中に浸漬することにより、半
田の融点を変化させ、接着剤又は融点の異なる半田を予
め供給することなく、前後して段階的に部品を回路基板
に半田付けする場合に、後の部品の一定温度下での半田
付け時に前に半田付けした部品における半田再溶融を防
止し、部品の欠落、位置ずれの発生を防止することがで
きるという効果を有する。As described above, according to the present invention, a component is soldered to a circuit board with solder composed of an alloy of two or more kinds of metals, and a circuit board on which the component is soldered or a component to which solder is supplied to a pad is provided. By changing the melting point of the solder by immersing it in an electrolyte solution, and when soldering parts to the circuit board in a stepwise manner without supplying adhesive or solder with different melting points in advance, the subsequent parts It is possible to prevent the remelting of the solder in the component previously soldered at the time of soldering at a constant temperature, and to prevent the component from missing and the position from being displaced.
【図１】本発明の回路基板への部品の半田付け方法の実
施例１を示す断面図である。FIG. 1 is a cross-sectional view showing a first embodiment of a method for soldering a component to a circuit board according to the present invention.
【図２】図１に示す実施例１により両面に回路部品が実
装された回路基板を示す断面図である。FIG. 2 is a cross-sectional view showing a circuit board having circuit components mounted on both surfaces according to the first embodiment shown in FIG.
【図３】本発明の回路基板への部品の半田付け方法の実
施例２を示す断面図である。FIG. 3 is a cross-sectional view showing a second embodiment of a method for soldering a component to a circuit board according to the present invention.
【図４】図３に示す実施例２により両面に回路部品が実
装された回路基板を示す断面図である。FIG. 4 is a cross-sectional view showing a circuit board having circuit components mounted on both sides according to the second embodiment shown in FIG.
【図５】本発明の回路基板への部品の半田付け方法の実
施例３を示す断面図である。FIG. 5 is a cross-sectional view showing a third embodiment of a method for soldering a component to a circuit board according to the present invention.
【図６】図５に示す実施例３により両面に回路部品が実
装された回路基板を示す断面図である。FIG. 6 is a cross-sectional view showing a circuit board having circuit components mounted on both surfaces according to the third embodiment shown in FIG.
【図７】Ｓｎ−Ｐｂ系の半田の平衡状態図である。FIG. 7 is an equilibrium state diagram of Sn—Pb based solder.
１ 回路基板 ２ａ，２ｂ 回路部品 ３ａ，３ｂ 接続用パッド ４ａ，４ｂ 接続用半田 ５ 対向電極 ６ 電解質溶液 ７ａ，７ｂ 回路部品 ８ 接続用パッド 1 Circuit Board 2a, 2b Circuit Parts 3a, 3b Connection Pads 4a, 4b Connection Solder 5 Counter Electrode 6 Electrolyte Solution 7a, 7b Circuit Parts 8 Connection Pad
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 23/50 Ｈ０１Ｌ 23/50 Ｗ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location H01L 23/50 H01L 23/50 W
Claims (2)
回路基板上の第１のパッドに第１の部品を前記対向電極
を構成する金属とは異なる２種以上の金属の合金からな
る半田で半田付けしてから前記回路基板を電解質溶液中
に浸漬した後に、前記第１の部品を半田付けしたもとの
同一種類の半田を用いて前記回路基板上の第２のパッド
に第２の部品を半田付けすることを特徴とする回路基板
への部品の半田付け方法。1. A solder composed of an alloy of two or more kinds of metals different from the metal forming the counter electrode, and the first component on the first pad on the circuit board connected to the counter electrode on the circuit board. After dipping the circuit board in an electrolyte solution after soldering with, the same type of solder from which the first component is soldered is used to form a second pad on the second pad on the circuit board. A method for soldering a component to a circuit board, which comprises soldering the component.
のパッドに前記対向電極を構成する金属とは異なる２種
以上の金属の合金からなる半田を供給して前記第１の部
品を電解質溶液中に浸漬した後に前記第１の部品を前記
回路基板上の第１のパッドに半田付けしてから前記第１
のパッドに供給したものと同一種類の半田を用いて第２
の部品を前記回路基板上の第２のパッドに半田付けする
ことを特徴とする回路基板への部品の半田付け方法。2. The first part connected to the counter electrode of the first part.
After supplying the solder composed of an alloy of two or more kinds of metals different from the metal forming the counter electrode to the pad and immersing the first component in the electrolyte solution, the first component is placed on the circuit board. After soldering to the first pad of the
Second, using the same type of solder that was supplied to the pad
2. A method for soldering a component to a circuit board, the method comprising: soldering the component to a second pad on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6226503A JP2534837B2 (en) | 1994-09-21 | 1994-09-21 | Method of soldering parts to circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6226503A JP2534837B2 (en) | 1994-09-21 | 1994-09-21 | Method of soldering parts to circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0897550A JPH0897550A (en) | 1996-04-12 |
| JP2534837B2 true JP2534837B2 (en) | 1996-09-18 |
Family
ID=16846142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6226503A Expired - Lifetime JP2534837B2 (en) | 1994-09-21 | 1994-09-21 | Method of soldering parts to circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2534837B2 (en) |
-
1994
- 1994-09-21 JP JP6226503A patent/JP2534837B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0897550A (en) | 1996-04-12 |
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