KR19990026398A - Parts mounting method of printed circuit board - Google Patents
Parts mounting method of printed circuit board Download PDFInfo
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- KR19990026398A KR19990026398A KR1019970048496A KR19970048496A KR19990026398A KR 19990026398 A KR19990026398 A KR 19990026398A KR 1019970048496 A KR1019970048496 A KR 1019970048496A KR 19970048496 A KR19970048496 A KR 19970048496A KR 19990026398 A KR19990026398 A KR 19990026398A
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- printed circuit
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Abstract
본 발명은 삽입부품의 리드단자에 플럭스층 및 솔더층을 순차적으로 형성시킴으로서 표면실장부품(SMD)과 삽입부품(IMD)의 혼재 실장시 1회의 리플로우 솔더링으로 표면실장부품과 삽입부품의 납땜을 동시에 수행할 수 있도록 하는 인쇄회로기판의 부품 실장방법에 관한 것으로서, 인쇄회로기판(PCB) 상의 표면실장부품(SMD) 위치에 솔더크림(solder cream)을 도포하는 제1 과정과,According to the present invention, a flux layer and a solder layer are sequentially formed on a lead terminal of an insert, thereby resolving soldering of the surface mount component and the insert by one reflow soldering at the time of mixing the surface mount component and the insert. A method of mounting a component of a printed circuit board that can be simultaneously performed, comprising: a first process of applying solder cream to a surface mounted component (SMD) position on a printed circuit board (PCB);
표면실장부품(SMD)을 인쇄회로기판에 장착하는 제2 과정과,A second process of mounting the surface mount component (SMD) to the printed circuit board;
리드(lead)에 플럭스층 및 솔더층이 순차적으로 형성된 삽입부품(IMD)을 인쇄회로기판에 장착하는 제3 과정과,A third process of mounting an insert part (IMD) having a flux layer and a solder layer sequentially formed on a lead to a printed circuit board;
상기 표면실장부품과 삽입부품이 장착된 인쇄회로기판을 리플로우 솔더링 장치를 통과시켜 납땜을 수행하는 제4 과정으로 이루어지는 것을 특징으로 한다.And a fourth process of performing soldering by passing the printed circuit board on which the surface mount component and the insert component are mounted, through a reflow soldering apparatus.
Description
본 발명은 인쇄회로기판의 부품 실장방법( Element mounting method for PCB )에 관한 것으로서 특히, 표면실장부품(SMD)과 삽입부품(IMD)의 혼재 실장시 납땜공정을 줄일 수 있도록 하는 인쇄회로기판의 부품 실장방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element mounting method for a printed circuit board, and more particularly, to a component of a printed circuit board which can reduce a soldering process when mixing a surface mount component (SMD) and an insert component (IMD) in a mixed manner. It is about a mounting method.
일반적으로 부품을 인쇄회로기판에 삽입하여 납땜을 수행하여 고정시키는데, 상기 납땜을 수행하는 방법으로는 리플로우 솔더링(reflow soldering)과 플로우 솔더링(flow soldering)이 있다. 이때, 상기 리플로우 솔더링은 표면실장부품의 실장시 주로 사용하고, 플로우 솔더링은 삽입부품의 실장시 주로 사용한다.In general, a component is inserted into a printed circuit board to perform soldering to fix the solder. A method of performing the soldering includes reflow soldering and flow soldering. In this case, the reflow soldering is mainly used when mounting the surface mounting component, and the flow soldering is mainly used when mounting the insertion component.
도 1은 종래 기술의 제1 실시예에 의하여 양면기판에 표면실장부품(SMD)과 삽입부품(IMD)을 실장하는 동작을 나타내는 단면도들이다.1 is a cross-sectional view illustrating an operation of mounting a surface mounting component SMD and an inserting component IMD on a double-sided board according to a first embodiment of the prior art.
도 1을 참조하면, 먼저 기판(110) 상에 표면실장부품(120)의 위치를 결정하여 칩본드(chip bond)(130)를 도포하고 표면실장부품(120)을 장착한 후 고온의 경화로를 통과하여 상기 칩본드(130)를 경화시킨다. (도 1의 (A) 참조)Referring to FIG. 1, first, a position of the surface mounting component 120 is determined on a substrate 110, a chip bond 130 is applied, and the surface mounting component 120 is mounted. The chip bond 130 is cured by passing through. (See FIG. 1A)
그후, 기판(110)을 반전시켜 삽입부품(140)을 장착하고(도 1의 (B) 참조), 플럭스(flux)를 도포한다.Thereafter, the substrate 110 is inverted to mount the insert 140 (see FIG. 1B), and flux is applied.
그후, 상기 표면실장부품(120)과 삽입부품(140)이 장착된 기판(110)을 플로우 솔더링 장치를 통과시켜 리드 단자에 땜납(150)을 형성시켜 상기 표면실장부품(120)과 삽입부품(140)의 납땜이 동시에 이루어지도록 한다.Thereafter, the substrate 110 on which the surface mounting component 120 and the insertion component 140 are mounted is passed through a flow soldering device to form solder 150 at the lead terminal, thereby forming the surface mounting component 120 and the insertion component ( The soldering of 140 is performed at the same time.
도 2는 종래 기술의 제2 실시예에 의하여 기판에 표면실장부품(SMD)과 삽입부품(IMD)을 혼재 실장하는 동작을 나타내는 단면도들이다.2 is a cross-sectional view illustrating an operation of mixing and mounting a surface mounting component SMD and an inserting component IMD on a substrate in accordance with a second embodiment of the prior art.
도 2를 참조하면, 먼저 기판(210) 상에 표면실장부품의 위치를 결정하여 솔더크림(solder cream)(220)를 인쇄하고(도 2의 (A) 참조), 표면실장부품(230)을 장착한 후 리플로우 솔더링 장치를 통과시켜 상기 표면실장부품(230)을 납땜한다. (도 2의 (B) 참조)Referring to FIG. 2, first, the position of the surface mounting component is determined on the substrate 210 to print the solder cream 220 (see FIG. 2A), and the surface mounting component 230 is removed. After mounting, the surface mount component 230 is soldered through a reflow soldering apparatus. (See FIG. 2B)
그후, 삽입부품(240)을 장착하고, 플럭스(flux)를 도포한다.(도 2의 (C) 참조)Thereafter, the insert 240 is mounted and flux is applied (see FIG. 2C).
그후, 상기 기판(210)을 플로우 솔더링 장치를 통과시켜 삽입부품(240)의 납땜이 이루어지도록 한다.(도 2의 (D) 참조)Thereafter, the substrate 210 is passed through the flow soldering device so that the insertion part 240 is soldered (see FIG. 2D).
상기에서 설명한 바와 같은 종래의 인쇄회로기판의 부품 실장방법은 제1,2 실시예 모두 고온의 경화로 또는 리플로우 솔더링 장치를 통과한 후 플로우 솔더링 장치를 통과시키기 때문에 열피로가 누적되어 부품의 열파괴 현상이 발생되며, 그에 따라 제품의 신뢰성을 저하시키는 문제점이 있다.In the conventional method of mounting a component of a printed circuit board as described above, since both the first and second embodiments pass the flow soldering apparatus after passing through the high temperature curing furnace or the reflow soldering apparatus, thermal fatigue accumulates and heat Destructive phenomenon occurs, thereby reducing the reliability of the product.
또한, 제조공정의 수가 많기 때문에 제조 시간이 많이 소요되어 생산성을 저하시키는 문제점이 있다.In addition, since the number of manufacturing processes is large, it takes a lot of manufacturing time and there is a problem of lowering productivity.
본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로서, 그 목적은 삽입부품의 리드단자에 플럭스층 및 솔더층을 순차적으로 형성시킴으로서 표면실장부품(SMD)과 삽입부품(IMD)의 혼재 실장시 1회의 리플로우 솔더링 방법으로 표면실장부품과 삽입부품의 납땜을 동시에 수행할 수 있도록 하는 인쇄회로기판의 부품 실장방법을 제공하는데 있다.The present invention has been made to solve the above problems, the object of which is to form a flux layer and a solder layer in the lead terminal of the insertion part in sequence when mounting the surface mounting component (SMD) and the insertion component (IMD) The present invention provides a component mounting method of a printed circuit board which enables simultaneous soldering of surface mount components and insert components by a single reflow soldering method.
도 1 및 도 2는 종래 기술에 의한 표면실장부품과 삽입부품의 혼재실장 동작을 나타내는 단면도들이고,1 and 2 are cross-sectional views showing the mixed mounting operation of the surface mount component and the insert component according to the prior art,
도 3은 본 발명에 의한 표면실장부품과 삽입부품의 혼재실장 동작을 나타내는 단면도들이고,3 is a cross-sectional view showing a mixed mounting operation of the surface mount component and the insert component according to the present invention;
도 4는 본 발명에 의한 삽입부품의 리드 구성을 나타내는 도면.4 is a view showing a lead configuration of an insert according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
310 : 기판 320 : 솔더크림(solder cream)310: substrate 320: solder cream
330 : 표면실장부품 340 : 삽입부품330: surface mounting parts 340: insertion parts
상기와 같은 목적을 달성하기 위한 본 발명의 특징에 따르면, 인쇄회로기판(PCB) 상의 표면실장부품(SMD) 위치에 솔더크림(solder cream)을 도포하는 제1 과정과, 표면실장부품(SMD)을 인쇄회로기판에 장착하는 제2 과정과, 리드(lead)에 플럭스층 및 솔더층이 순차적으로 형성된 삽입부품(IMD)을 인쇄회로기판에 장착하는 제3 과정과, 상기 표면실장부품과 삽입부품이 장착된 인쇄회로기판을 리플로우 솔더링 장치를 통과시켜 납땜을 수행하는 제4 과정으로 이루어지는 인쇄회로기판의 부품 실장방법을 제공한다.According to a feature of the present invention for achieving the above object, a first process of applying a solder cream to the surface mounting component (SMD) position on the printed circuit board (PCB), and the surface mounting component (SMD) A second process of mounting the PCB on the printed circuit board, a third process of mounting the insertion part (IMD) having the flux layer and the solder layer sequentially formed on the lead on the printed circuit board, and the surface mounting component and the insertion component. Provided is a component mounting method of a printed circuit board comprising a fourth process of performing soldering by passing the mounted printed circuit board through a reflow soldering apparatus.
이하, 본 발명에 의한 인쇄회로기판의 부품 실장방법의 바람직한 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, with reference to the accompanying drawings, a preferred embodiment of a method for mounting a component of a printed circuit board according to the present invention will be described in detail.
도 3은 본 발명에 의한 혼재 실장동작을 순차적으로 나타내는 단면도들이다.3 is a cross-sectional view sequentially showing a mixed mounting operation according to the present invention.
도 3을 참조하면, 먼저 기판(310) 상에 표면실장부품의 위치를 결정하여 솔더크림(solder cream)(320)를 도포하고(도 3의 (A) 참조), 표면실장부품(330)을 장착한다.(도 3의 (B) 참조)Referring to FIG. 3, first, the position of the surface mounting component is determined on the substrate 310 to apply solder cream 320 (see FIG. 3A), and the surface mounting component 330 is applied. (See Fig. 3 (B)).
그후, 삽입부품(340)을 장착한다.(도 3의 (C) 참조) 이때, 상기 삽입부품(340)의 리드는 도 4에 도시된 바와 같이 구리(Cu) 모재에 플럭스(flux)를 충진하고 외부에 솔더(solder)가 도포되어 이루어지는데, 기판(310)의 홀(hole)에 완전히 삽입된 후 바깥쪽으로 클린징(clinching )이 이루어진다.Thereafter, the insert 340 is mounted (see FIG. 3C). At this time, the lead of the insert 340 is filled with flux in a copper base material as shown in FIG. 4. And the solder (solder) is applied to the outside, it is completely inserted into the hole (hole) of the substrate 310, and the clinching is performed to the outside.
그후, 상기 표면실장부품(330)과 삽입부품(340)이 장착된 기판(210)을 리플로우 솔더링 장치를 통과시켜 상기 표면실장부품(330)과 삽입부품(340)의 납땜이 동시에 이루어지도록 한다.(도 3의 (D) 참조) 이때, 리플로우 솔더링 장치를 통과하는 동안 상기 표면실장부품(330)에서는 솔더크림(320)이 녹으면서 납땜이 수행되고, 삽입부품(340)에서는 리드의 외부에 도포되어 있던 솔더층이 녹아 흘러내리면서 기판(310)의 하면에 형성된 패턴과 결합되면서 납땜이 수행된다.Thereafter, the surface mounting component 330 and the substrate 210 on which the insertion component 340 is mounted are passed through a reflow soldering device so that the surface mounting component 330 and the insertion component 340 are simultaneously soldered. (Refer to FIG. 3 (D)) At this time, soldering is performed while the solder cream 320 is melted in the surface-mounted component 330 while passing through the reflow soldering apparatus, and in the insert 340, the outside of the lead. Solder is applied while the solder layer applied to the melt melts down and is combined with the pattern formed on the lower surface of the substrate 310.
이상에서 설명한 바와 같은 본 발명의 인쇄회로기판의 부품 실장방법은 표면실장부품과 삽입부품을 혼재 실장하는 경우에 리플로우 솔더링과 플로우 솔더링을 2회로 수행하지 않고 리플로우 솔더링 만을 1회 수행하여 표면실장부품과 삽입부품을 동시에 실장시키기 때문에 작업공정이 간단하게 되어 생산성을 향상시킬 수 있으며, 부품의 열피로가 줄어 제품불량을 줄일 수 있어서 제품의 신뢰성을 향상시킬 수 있는 효과가 있다.As described above, the component mounting method of the printed circuit board of the present invention performs surface mount by performing reflow soldering only once without performing reflow soldering and flow soldering twice when surface mounting components and insertion components are mixed. Since the parts and inserts are mounted at the same time, the work process can be simplified to improve productivity, and the thermal fatigue of the parts can be reduced to reduce product defects, thereby improving the reliability of the product.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970048496A KR19990026398A (en) | 1997-09-24 | 1997-09-24 | Parts mounting method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970048496A KR19990026398A (en) | 1997-09-24 | 1997-09-24 | Parts mounting method of printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| KR19990026398A true KR19990026398A (en) | 1999-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1019970048496A KR19990026398A (en) | 1997-09-24 | 1997-09-24 | Parts mounting method of printed circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020039116A (en) * | 2000-11-20 | 2002-05-25 | 송재인 | Junction structure of printed circuit board and dual in line package parts |
| KR101473478B1 (en) * | 2008-07-24 | 2014-12-24 | 한국단자공업 주식회사 | Module mounting structure of PCB |
| KR20160028015A (en) | 2014-09-02 | 2016-03-11 | 에이에치코리아주식회사 | Pb FREE SOLDERING MATERIALS FOR MOUNTING ELECTRONIC COMPONENT |
-
1997
- 1997-09-24 KR KR1019970048496A patent/KR19990026398A/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020039116A (en) * | 2000-11-20 | 2002-05-25 | 송재인 | Junction structure of printed circuit board and dual in line package parts |
| KR101473478B1 (en) * | 2008-07-24 | 2014-12-24 | 한국단자공업 주식회사 | Module mounting structure of PCB |
| KR20160028015A (en) | 2014-09-02 | 2016-03-11 | 에이에치코리아주식회사 | Pb FREE SOLDERING MATERIALS FOR MOUNTING ELECTRONIC COMPONENT |
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