JPH05191093A - Electronic component mounting method and device - Google Patents

Abstract

PURPOSE:To enable the leads of an electronic component to be inserted into lead inserting holes provided to a board, then tentatively fixed without clinching, and soldered. CONSTITUTION:A first process where solder flux bumps 3 are formed around a lead inserting hole 5 where the leads 7 of an electronic component 6 formed on a board 4 are inserted, a second process where the leads 7 of the component 6 are inserted into the hole 5, and a third process where the side of the board from which the leads 7 are projected out from the board 4 is brought into contact with molten solder to solder the leads 7 to the wiring of the board 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method and an electronic component mounting apparatus in which a lead of an electronic component is inserted into a lead insertion hole of a substrate and the lead and the wiring of the substrate are connected by soldering.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become smaller and lighter, higher density of circuit boards and smaller electronic components have been required.

A conventional electronic component mounting method will be described below. 2A to 2C are process diagrams of a conventional electronic component mounting method. First, as shown in FIG.
The lead 7 of the electronic component 6 is inserted into the lead insertion hole 5 provided in the. Next, as shown in FIG. 2B, the tip of the lead 7 is bent (hereinafter referred to as a clinch). Next, FIG. 2 (c)
As shown in, the side of the substrate 4 where the lead 7 protrudes is brought into contact with the molten solder 9 of the jet solder bath 8, and the lead 7 and the wiring (not shown) of the substrate 4 are connected by soldering.

Clinching the leads 7 means that when the substrate 4 is brought into contact with the molten solder 9, the leads 7 are pushed up by the molten solder 9 and the electronic component 6 falls out, or the solder connection is made while the position is displaced. This is to prevent

[0005]

However, in the above-mentioned conventional structure, as shown in FIG. 3 (a), when the leads 7 are clinched, the leads 7 of the adjacent electronic components 6 are provided with the tip portions 7.
There is a problem in that the leads 7 a of the same electronic component 6 come into contact with each other at the tips 7 b, as shown in FIG. 3B.

Furthermore, when clinching the lead 7,
The impact force may destroy the electronic component 6, which has been a cause of reducing the reliability of the circuit board, even if the electronic component 6 is not destroyed.

The present invention solves the above-mentioned conventional problems. An electronic component mounting method and an electronic component in which the leads of the electronic component are inserted into the lead insertion holes of the substrate and then temporarily fixed without clinching and soldered An object is to provide a mounting device.

[0008]

In order to achieve this object, the electronic component mounting method of the present invention is a viscous oil that improves the compatibility between the lead and the solder in the peripheral portion of the lead insertion hole provided in the substrate. A step of applying a substance, a step of inserting the lead of the electronic component into the lead insertion hole, and a step of connecting the lead and the wiring of the substrate by soldering by making the side of the substrate of the electronic component where the lead of the electronic component protrudes into contact with the molten solder. Have.

[0009]

With this structure, the leads of the electronic component are temporarily fixed by the oily substance, so that the electronic component does not rise or fall off during the solder connection process. Further, since the oily substance adhered to the lead is selected to improve the compatibility between the lead and the solder, the quality of the electronic component is not deteriorated.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1A to 1C are process diagrams of an electronic component mounting method according to an embodiment of the present invention. In FIG. 1, 1 is a syringe, 2 is a solder flux, 3 is a solder flux block applied, 4 is a substrate, 5 is a lead insertion hole for inserting the lead 7 of the electronic component 6, 8 is a jet solder bath,
9 is molten solder. First, as shown in FIG. 1A, a solder flux 2 is supplied from a syringe 1 to form a solder flux mass 3 around a lead insertion hole 5 provided in a substrate 4. Next, as shown in FIG. 1B, the lead 7 of the electronic component 6 is inserted into the lead insertion hole 5. At this time, part of the solder flux mass 3 is pushed into the lead insertion hole 5 to temporarily fix the lead 7, and the viscosity of the solder flux mass 3 holds the posture of the electronic component 6. Next, as shown in FIG. 1C, the side where the lead 7 of the substrate 4 projects is brought into contact with the molten solder 9 in the jet solder bath 8. The substrate 4 is exposed to high temperature as it enters the jet solder bath 8,
When the temperature reaches 0 ° C., the solder flux mass 3 evaporates by boiling, spreads over the leads 7 of the electronic component 6 and the wiring (not shown) on the substrate 4 to which the leads 7 are connected, and improves the wettability of the molten solder 9 to be sprayed. As the solder flux 2, it is possible to easily select a solder flux that can maintain the viscosity even at high temperatures and can maintain the attitude of the electronic component 6.

In this embodiment, the example in which the flux mass 3 is formed on the lead insertion hole 5 has been described, but the solder flux mass 3 may be formed only on the peripheral portion of the lead insertion hole 5 without overlapping. The effect of is obtained.

In this embodiment, an example in which a highly viscous solder flux is used as the viscous oily substance has been described, but the wettability between the lead 7 and the wiring of the substrate 4 and the solder is improved regardless of the solder flux. As long as the posture of the electronic component 6 can be maintained, the same effect can be obtained.

An electronic component mounting apparatus according to an embodiment of the present invention includes an ejector or a printing machine having a syringe 1 filled with a solder flux 2 as shown in FIG. It is composed of an inserter and a soldering machine such as a jet solder bath 8.

[0014]

INDUSTRIAL APPLICABILITY As described above, according to the present invention, after the lead of the electronic component is inserted into the lead insertion hole of the board, the lead and the wiring of the board are solder-connected by using the solder bath without clinching the tip of the lead. It is possible to realize an excellent electronic component mounting method and electronic component mounting apparatus that can be realized. Further, the electronic component mounting method of the present invention makes it possible to improve the quality and mounting density of a circuit board on which electronic components are mounted.

[Brief description of drawings]

FIG. 1 is a process diagram of an electronic component mounting method according to an embodiment of the present invention.

FIG. 2 is a process diagram of a conventional electronic component mounting method.

FIG. 3 is a diagram of a defect example that occurs in a conventional electronic component mounting method.

[Explanation of symbols]

 3 Solder flux (viscous oily substance) 4 Substrate 5 Lead insertion hole 6 Electronic component 7 Lead 8 Molten solder

Claims (4)

[Claims] 1. A step of applying a viscous oily substance for improving the compatibility between the lead and the solder to the periphery of a lead insertion hole provided in a substrate into which the lead of the electronic component is inserted; An electronic component mounting method comprising: a step of inserting the lead into the lead insertion hole; and a step of connecting the lead of the electronic component of the substrate to a molten solder so as to connect the lead and the wiring of the substrate by soldering. 2. The electronic component mounting method according to claim 1, wherein the viscous oily substance is solder flux. 3. A means for applying a viscous oily substance for improving the compatibility between the lead and the solder to the peripheral portion of a lead insertion hole provided in a substrate into which the lead of the electronic component is inserted, and the lead of the electronic component. An electronic component mounting apparatus comprising: means for inserting the lead into the lead insertion hole; and means for connecting the lead and the wiring of the board by soldering by making the side of the board of the electronic component protruding from the lead contact with the molten solder. 4. The electronic component mounting apparatus according to claim 3, wherein the viscous oily substance is solder flux.