JPH0357295A - Method of mounting electronic components on double-sided mounting board - Google Patents
Method of mounting electronic components on double-sided mounting boardInfo
- Publication number
- JPH0357295A JPH0357295A JP19153689A JP19153689A JPH0357295A JP H0357295 A JPH0357295 A JP H0357295A JP 19153689 A JP19153689 A JP 19153689A JP 19153689 A JP19153689 A JP 19153689A JP H0357295 A JPH0357295 A JP H0357295A
- Authority
- JP
- Japan
- Prior art keywords
- component
- double
- printed board
- mounting
- sided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 28
- 239000006071 cream Substances 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 16
- 238000007650 screen-printing Methods 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 238000005476 soldering Methods 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 239000007767 bonding agent Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 238000007796 conventional method Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 101100508810 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) INP53 gene Proteins 0.000 description 1
- 101100366621 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) SRO77 gene Proteins 0.000 description 1
- 101100217143 Schizosaccharomyces pombe (strain 972 / ATCC 24843) arc1 gene Proteins 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 101150083500 sop-2 gene Proteins 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
電子機器に用いられる両面実装プリント板への電子部品
実装方法に関し、
両面実装プリント板への部品実装工程数の節減を目的と
し、
両面実装プリント板の一方の面の表面実装部品半田付け
部及びディップ部品取付用スルーホールの一方のランド
部にメタルマスクを用いてスクリーン印刷により半田ク
リームを塗布する工程、前記両面実装プリント板の一方
の面に接着剤を用いて表面実装部品を所定位置に接着す
る工程、前記両面実装プリント板の他方の面の表面実装
部品半田付け部及びディップ部品取付用スルーホールの
他方のランド部にメタルマスクを用いてスクリーン印刷
により半田クリームを塗布する工程、上記両面実装プリ
ント板の他方の面に表面実装部品及びディップ部品を所
定位置に装着する工程、上記両面実装プリント板を加熱
炉にて加熱し、半田クリームを溶融させて各部品を半田
付けする工程、を順次行うように構成する。[Detailed Description of the Invention] [Summary] Regarding a method for mounting electronic components on a double-sided printed circuit board used in electronic equipment, the present invention aims to reduce the number of steps for mounting components on a double-sided printed circuit board. A process of applying solder cream by screen printing using a metal mask to the soldering part of the surface mount component and the land part of one of the through holes for attaching the dip component on the surface, and applying adhesive to one surface of the double-sided mount printed board. A step of bonding the surface mount components in a predetermined position using a metal mask on the surface mount component soldering portion on the other side of the double-sided mount printed board and the other land portion of the through hole for attaching the dip component by screen printing using a metal mask. a step of applying solder cream; a step of mounting surface mount components and dip components in predetermined positions on the other side of the double-sided printed board; heating the double-sided printed board in a heating furnace to melt the solder cream; The process of soldering each component is performed sequentially.
〔産業上の利用分野コ
本発明は電子機器に用いられる両面実装プリント板への
電子部品実装方法に関する。[Industrial Application Field] The present invention relates to a method for mounting electronic components on a double-sided printed circuit board used in electronic equipment.
従来より電子機器には部品の搭載と配線の合理化のため
にプリント配線板が用いられており、さらに部品実装密
度の向上のため両面に部品を実装する両面実装プリント
板が用いられている。また実装される部品としては、実
装密度の高密度化に伴って第３図に示すような抵抗、コ
ンデサ等のチップ部品１． ＳＯＰ ２． ＰＬＣＣ
３ ＱＦＰ ４など端子５が平面的に配置された表面
実装部品が用いられているが、従来のスルーホールに半
田付けされるディップ邪品も用いられ、両者が混用され
ている。Conventionally, printed wiring boards have been used in electronic devices to rationalize component mounting and wiring, and double-sided mounting printed boards, in which components are mounted on both sides, have been used to improve component mounting density. As for the parts to be mounted, as the packaging density increases, chip parts such as resistors and capacitors as shown in FIG. SOP2. P.L.C.C.
Although surface mount components such as 3 QFP 4 in which terminals 5 are arranged in a plane are used, dip products soldered to conventional through holes are also used, and both are used in combination.
表面実装部品とディップ部品とを混用して搭載する従来
の両面実装プリント板への部品搭載方法を第４図により
説明する。この方法は、先ず第４図（ａ）に示すように
両面実装プリント板１の一方の面１ａの表面実装部品半
田付け部２にスクリーン印刷にて半田クリーム３を塗布
し、そこに第４図（ｂ）に示すように接着剤４を用いて
表面実装部品５を所定位置に接着する。次に第４図（Ｃ
）に示すように両面実装プリント板１の他方の面１ｂの
表面実装部品半田付け部６にスクリーン印刷にて半田ク
リーム７を塗布し、そこに第４図（ｄ）に示すように表
面実装部品８を所定位置に載置した後、ペーパー炉に挿
入して加熱し、半田クリーム３・７を溶融させて両面の
表面実装部品５及び８を半田付けする。次に第４ｆｆｌ
（ｅ）に示すようにスルーホール９にピン１０ａを挿
入してディップ部品１０を装着する。最後に第４図（ｆ
）に示すようにウエーブ半田付け装置を用いてデイツプ
部品１０のビン１０ａをスルーホール９に半田付けする
のである。A conventional method of mounting components on a double-sided printed circuit board in which surface mount components and dip components are mixed will be explained with reference to FIG. In this method, first, as shown in FIG. 4(a), solder cream 3 is applied by screen printing to the surface mount component soldering area 2 on one side 1a of the double-sided printed circuit board 1, and then solder cream 3 is applied thereto by screen printing. As shown in (b), the surface mount component 5 is adhered to a predetermined position using an adhesive 4. Next, Figure 4 (C
), a solder cream 7 is applied by screen printing to the surface mount component soldering area 6 on the other side 1b of the double-sided printed circuit board 1, and the surface mount component is applied thereto as shown in FIG. 4(d). 8 is placed in a predetermined position, it is inserted into a paper oven and heated to melt the solder creams 3 and 7 and solder the surface mount components 5 and 8 on both sides. Next, the 4th ffl
As shown in (e), the pin 10a is inserted into the through hole 9 and the dip component 10 is attached. Finally, Figure 4 (f
), the pin 10a of the dip component 10 is soldered to the through hole 9 using a wave soldering device.
上記従来の両面実装プリント板への電子部品実装方法で
は、工程数が多いという問題がある。The conventional method of mounting electronic components on a double-sided printed board has a problem in that it requires a large number of steps.
本発明は上記従来の問題点に鑑み、部品実装工程数を節
減した両面実装プリント板への電子部品実装方法を提供
することを目的とする。SUMMARY OF THE INVENTION In view of the above conventional problems, an object of the present invention is to provide a method for mounting electronic components on a double-sided printed board, which reduces the number of component mounting steps.
上記目的を達戊するために、本発明の両面実装プリント
板への電子部品実装方法では、両面実装プリント板１ｌ
の一方の面１１ａの表面実装部品半田付け部ｌ２及びデ
ィップ部品取付用スルーホール１３の一方のランド部１
３ａにメタルマスクを用いてスクリーン印刷により半田
クリーム１４を塗布する工程、前記両面実装プリント板
１１の一方の面１１ａに接着剤１５を用いて表面実装部
品ｌ６を所定位置に接着する工程、前記両面実装プリン
ト板１１の他方の面１ｌｂの表面実装部品半田付け部１
７及びディップ部品取付用スルーホール１３の他方のラ
ンド部１３ｂにメタルマスクを用いてスクリーン印刷に
より半田クリームｔ８を塗布する工程、上記両面実装プ
リント板１１の他方の面１ｌｂに表面実装部品１９及び
ディップ部品２０を所定位置に装着する工程、上記両面
実装プリント板１ｌを加熱炉にて加熱し、半田クリーム
１４．１８を溶融させて各部品を半田付けする工程、を
順次行うことを特徴とする。In order to achieve the above object, in the method of mounting electronic components on a double-sided printed board of the present invention, a double-sided printed board 1l.
The surface mount component soldering portion l2 on one surface 11a of
3a, a step of applying solder cream 14 by screen printing using a metal mask, a step of bonding a surface mount component 16 to a predetermined position using adhesive 15 on one surface 11a of the double-sided mounting printed board 11, Surface mount component soldering part 1 on the other side 1lb of the mounting printed board 11
7 and the step of applying solder cream T8 to the other land portion 13b of the through hole 13 for attaching the dip component by screen printing using a metal mask, and applying the solder cream T8 to the other surface 1lb of the double-sided mounting printed board 11 with the surface mount component 19 and the dip component mounting step. It is characterized in that the steps of mounting the component 20 in a predetermined position, heating the double-sided printed board 1l in a heating furnace, melting the solder cream 14 and 18, and soldering each component are sequentially performed.
両面実装プリント板１１の表面実装部品半田付け部１２
．１７とディップ部品取付用のスルーホール１３のラン
ド部に同時に半田クリーム１４．１８を塗布することに
より、両面に装着した表面実装部品１６，ｌ９とディッ
プ部品２０を一度に半田付けすることができ、従来方法
より１工程節減することができる。Surface mount component soldering part 12 of double-sided mount printed board 11
．． By simultaneously applying solder cream 14 and 18 to the lands of the through holes 13 and 17 for attaching dip components, the surface mount components 16 and 19 mounted on both sides and the dip components 20 can be soldered at the same time. One step can be saved compared to the conventional method.
第１図は本発明の実施例を説明するための図である。 FIG. 1 is a diagram for explaining an embodiment of the present invention.
本実施例を第１図により説明すると、先ず同図（ａ）図
に示すように両面実装プリント板１１の一方の面１１ａ
の表面実装部品半田付け部１２とスルーホール１３の一
方のランド部１３ａにメタルマスクを用いてスクリーン
印刷により半田クリーム１４を塗布する。このとき用い
るメタルマスク２１は第２図に示すように半田クリーム
をスルーホールに塗布する部分は、スルーホールのラン
ド部にのみ半田を塗布し、スルーホールの孔内には入ら
ないようにするため、スルーホールの孔をマスクする部
分２２を有する窓２３を設けている。次に第１図（ｂ）
に示すように半田を塗布した方の面１１ａに表面実装部
品１６を接着剤１５を用いて所定位置に接着する。To explain this embodiment with reference to FIG. 1, first, as shown in FIG.
Solder cream 14 is applied to the surface mount component soldering portion 12 and one land portion 13a of the through hole 13 by screen printing using a metal mask. As shown in Figure 2, the metal mask 21 used at this time is used to apply solder cream to the through-holes so that the solder is applied only to the lands of the through-holes and does not enter into the holes of the through-holes. , a window 23 having a portion 22 masking the hole of the through hole is provided. Next, Figure 1(b)
As shown in FIG. 3, a surface mount component 16 is bonded to a predetermined position on the solder-applied surface 11a using an adhesive 15.
次に第１８９ （ｃ）に示すように両面実装プリント板
１１の他方の面１ｌｂの表面実装部品半田付け部１７と
スルーホール１３の他方のランド部１３ｂにメタルマス
クを用いてスクリーン印刷により半田クリームｌ８を塗
布する。このとき用いるメタルマスクのスルーホール部
分は前記のメタルマスクと同様のものである。次に第１
図（ｄ）に示すように表面実装部品１９を所定の位置に
載置し、さらにディップ部品２０のビン２０ａをスルー
ホール１３に挿入して該ディップ部品を装着する。最後
に各部品１６，１９、２０が装着された両面実装プリン
ト板１１をベーバー炉（加熱炉）に挿入して加熱し、半
田クリーム１４．１８を溶融させ、各部品１６．１９．
２０をそれぞれ所定位置に半田付けするのである。Next, as shown in No. 189 (c), solder cream is applied to the surface mount component soldering portion 17 on the other side 1lb of the double-sided printed circuit board 11 and the other land portion 13b of the through hole 13 by screen printing using a metal mask. Apply l8. The through-hole portion of the metal mask used at this time is similar to the metal mask described above. Next, the first
As shown in Figure (d), the surface mount component 19 is placed in a predetermined position, and the vial 20a of the dip component 20 is further inserted into the through hole 13 to mount the dip component. Finally, the double-sided printed circuit board 11 with each of the parts 16, 19, 20 mounted thereon is inserted into a Baber furnace (heating furnace) and heated to melt the solder cream 14, 18, and each part 16, 19.
20 are each soldered to a predetermined position.
本実施例によれば、（ａ）〜（ｅ）の５工程となり、第
４図で説明した従来例の６工程に比し１工程節減される
。またディップ部品の半田付けにウエーブ半田付け装置
によるディッピングを行わないので表面実装部品の熱劣
化が防止され信頼性の向上が得られる。According to this embodiment, there are five steps (a) to (e), which is one step less than the six steps of the conventional example explained in FIG. Further, since dipping is not performed using a wave soldering device for soldering dip components, thermal deterioration of surface mount components is prevented and reliability is improved.
以上説明した様に、本発明によれば、両面の全べての実
装部品を一度に半田付けすることにより、従来に比し工
程数の節減が可能となり、またディッピングによる半田
付けを用いないので実装部品の熱劣化がなく信頼性の向
上が得られる。As explained above, according to the present invention, by soldering all the mounted components on both sides at once, it is possible to reduce the number of steps compared to the conventional method, and also because soldering by dipping is not used. There is no thermal deterioration of mounted components and reliability is improved.
第１図は本発明の実施例を示す図、
第２図は本発明の実施例に用いるメタルマスクの要部を
示す図、
第３図は従来の表面実装部品を示す図、第４図は従来の
両面実装プリント板への電子部品実装方法を説明するた
めの図である。
図において、
１１は両面実装プリント板、
■２・１７は表面実装部品半田付け部、１３はスルーホ
ール、
１４・１８は半田クリーム、
１５は接着剤、
１６．１９は表面実装部品、
２０はディップ部品
を示す。
１ｂ
本発明の実施例を説明するための図
第１図
本発明の実施例に用し１るメタルマスクの要部を示す図
第
２
図
従来の表面実装部品を示す図
第
３
図Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is a diagram showing main parts of a metal mask used in an embodiment of the present invention, Fig. 3 is a diagram showing a conventional surface mount component, and Fig. 4 is a diagram showing a conventional surface mount component. FIG. 2 is a diagram for explaining a conventional method for mounting electronic components on a double-sided printed board. In the figure, 11 is a double-sided mounting printed board, 2 and 17 are surface mount parts soldering parts, 13 is a through hole, 14 and 18 are solder cream, 15 is an adhesive, 16 and 19 are surface mount parts, and 20 is a dip. Parts shown. 1b A diagram for explaining an embodiment of the present invention. FIG. 1 A diagram showing the main parts of a metal mask used in an embodiment of the present invention. FIG. 2 A diagram showing a conventional surface mount component.
Claims (1)
の表面実装部品半田付け部（１２）及びディップ部品取
付用スルーホール（１３）の一方のランド部（１３ａ）
にメタルマスクを用いてスクリーン印刷により半田クリ
ーム（１４）を塗布する工程、前記両面実装プリント板
（１１）の一方の面（１１ａ）に接着剤（１５）を用い
て表面実装部品（１６）を所定位置に接着する工程、 前記両面実装プリント板（１１）の他方の面（１１ｂ）
の表面実装部品半田付け部（１７）及びディップ部品取
付用スルーホール（１３）の他方のランド部（１３ｂ）
にメタルマスクを用いてスクリーン印刷により半田クリ
ーム（１８）を塗布する工程、上記両面実装プリント板
（１１）の他方の面（１１ｂ）に表面実装部品（１９）
及びディップ部品（２０）を所定位置に装着する工程、 上記両面実装プリント板（１１）を加熱炉にて加熱し、
半田クリーム（１４，１８）を溶融させて各部品を半田
付けする工程、 を順次行うことを特徴とする両面実装プリント板への電
子部品実装方法。1. One side (11a) of the double-sided printed board (11)
One land portion (13a) of the surface mount component soldering portion (12) and the through hole (13) for attaching the dip component.
a step of applying solder cream (14) by screen printing using a metal mask, and attaching a surface mount component (16) to one side (11a) of the double-sided mount printed board (11) using an adhesive (15). a step of gluing the other side (11b) of the double-sided mounting printed board (11) in a predetermined position;
The surface mount component soldering part (17) and the other land part (13b) of the dip component mounting through hole (13)
A process of applying solder cream (18) by screen printing using a metal mask, and applying a surface mount component (19) to the other side (11b) of the double-sided mount printed board (11).
and a step of mounting the dip component (20) in a predetermined position, heating the double-sided mounting printed board (11) in a heating furnace,
A method for mounting electronic components on a double-sided printed circuit board, characterized by sequentially performing the steps of melting solder cream (14, 18) and soldering each component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19153689A JPH0357295A (en) | 1989-07-26 | 1989-07-26 | Method of mounting electronic components on double-sided mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19153689A JPH0357295A (en) | 1989-07-26 | 1989-07-26 | Method of mounting electronic components on double-sided mounting board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0357295A true JPH0357295A (en) | 1991-03-12 |
Family
ID=16276303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19153689A Pending JPH0357295A (en) | 1989-07-26 | 1989-07-26 | Method of mounting electronic components on double-sided mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0357295A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0735808A1 (en) * | 1995-03-27 | 1996-10-02 | Robert Bosch Gmbh | SMD correction for electronic control devices in vehicles |
| WO2003079743A3 (en) * | 2002-03-15 | 2003-12-24 | Endress & Hauser Gmbh & Co Kg | Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| JP2010212591A (en) * | 2009-03-12 | 2010-09-24 | Sanyo Electric Co Ltd | Circuit board and method for manufacturing the same |
| JP2012100251A (en) * | 2010-10-08 | 2012-05-24 | Nippon Dempa Kogyo Co Ltd | Crystal oscillator with thermostat, and method for manufacturing the same |
| JP2019067835A (en) * | 2017-09-29 | 2019-04-25 | パナソニックＩｐマネジメント株式会社 | Manufacturing method of mounting board and mounting board manufacturing line |
| CN112840545A (en) * | 2018-10-19 | 2021-05-25 | 索尼互动娱乐股份有限公司 | Power supply apparatus |
| US12009750B2 (en) | 2018-10-19 | 2024-06-11 | Sony Interactive Entertainment Inc. | Power source device |
-
1989
- 1989-07-26 JP JP19153689A patent/JPH0357295A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0735808A1 (en) * | 1995-03-27 | 1996-10-02 | Robert Bosch Gmbh | SMD correction for electronic control devices in vehicles |
| WO2003079743A3 (en) * | 2002-03-15 | 2003-12-24 | Endress & Hauser Gmbh & Co Kg | Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| JP2010212591A (en) * | 2009-03-12 | 2010-09-24 | Sanyo Electric Co Ltd | Circuit board and method for manufacturing the same |
| JP2012100251A (en) * | 2010-10-08 | 2012-05-24 | Nippon Dempa Kogyo Co Ltd | Crystal oscillator with thermostat, and method for manufacturing the same |
| JP2019067835A (en) * | 2017-09-29 | 2019-04-25 | パナソニックＩｐマネジメント株式会社 | Manufacturing method of mounting board and mounting board manufacturing line |
| CN112840545A (en) * | 2018-10-19 | 2021-05-25 | 索尼互动娱乐股份有限公司 | Power supply apparatus |
| US11824429B2 (en) | 2018-10-19 | 2023-11-21 | Sony Interactive Entertainment Inc. | Multi-phase step-down DC/DC power source device |
| US12009750B2 (en) | 2018-10-19 | 2024-06-11 | Sony Interactive Entertainment Inc. | Power source device |
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