JPH01290293A - Soldering equipment - Google Patents

Abstract

PURPOSE:To protect soldered parts of components which are soldered in a previous process from contact with melted solder by using a soldering mask plate. CONSTITUTION:Apertures 10 are provided in a soldering mask plate 2 at the positions where the leads 8 of leaded components 7 are brought into contact with melted solder. The soldering mask plate 2 on which a circuit board 3 is placed is brought into contact with melted solder 1. The melted solder 1 is spouted up into the apertures 10 of the soldering mask plate 2 but leads 9 of surface mount type flat package IC's are protected from penetration of the melted solder. With this constitution, the parts which need not be soldered are covered with the soldering mask plate 2, so that those parts are protected from contact with the melted solder 1.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a soldering device for soldering lead components in a circuit board assembly process.

Conventional technology In recent years, with the miniaturization of electronic devices, the configuration of circuit components has also changed.
For example, semiconductor integrated circuit devices (hereinafter referred to as ICs) are changing from lead-type to surface-mounted flat packages, and resistors, capacitors, etc. are also changing from lead-type to chip-structured components. However, on the other hand,
Depending on the circuit requirements, there are times when it is not possible to use conventional lead-type components.
Even in the soldering process of circuit board assembly, the conventional dip method soldering using a molten solder tank and the soldering method using melted solder paste in a reflow oven are sometimes used in parallel. . Here, soldering by the dip method is used when soldering the leads of a lead component to a circuit board. In addition, soldering using the reflow one-way method can be applied to two-sided mount flat package I for chip components.
Used when soldering C leads to a circuit board.

A conventional method of assembling a circuit board using a lead component and a single-side-mounted flat package IC as components as described above will be described below.

First, solder paste is applied to a soldering pattern on a circuit board on which a chip component or a surface-mounted flat package IC is mounted. Thereafter, the aforementioned components are mounted on the board, and the components are soldered by solder reflow.

Next, a lead component is inserted into the board, and the lead portion of the lead component is soldered. In soldering the lead components, a dipping method is used in a molten solder bath, and the lead portions of the lead components are soldered to the circuit board. At this time, the entire surface of the circuit board comes into contact with the solder surface of the molten solder bath, and the soldered portions of ICs and chip components that have already been soldered on the board are remelted by heating.

Problems to be Solved by the Invention However, in the above-mentioned prior art, the parts of surface-mounted flat package ICs and chip components that have been soldered in the previous process may be re-soldered due to the second contact with molten solder. This causes problems such as melting, parts coming off, and short circuits when soldering between leads in ICs. The present invention solves the above-mentioned conventional problems, and aims to eliminate the need for a second soldering contact of parts soldered in a previous process.

Means for Solving the Problems In order to achieve this object, the soldering device of the present invention has a mask plate that is resistant to melted solder (liquid) and has openings only in the areas necessary for soldering. The soldered parts are masked to prevent solder contact.

This structure prevents the soldered portions of already soldered components from being exposed to solder contact, and prevents short-circuits when soldering between the leads of two components.

EXAMPLE An example of the present invention will be described below with reference to the drawings. The drawing shows a sectional view of a mask plate of a soldering device in an embodiment of the present invention. In the figure, 1
is molten solder (liquid), 2 is a mask board for soldering, 3 is a circuit board for mounting components, 4 is a surface-mounted flat package ICl 3 is a chip resistor, 6 is a chip capacitor, 7 is a lead 8 is a lead portion of a lead component, 9 is a lead portion of a surface-mounted flat package IC, 10 is an opening of a soldering mask, and 11 is a soldering portion of a component.

First, solder paste is applied onto the soldering pattern on the circuit board 3, and then the surface mount type flat package IC4, the chip resistor 5. A chip capacitor 6 is arranged on the substrate,
The solder paste is melted by heating using a reflow method, and the components are soldered. As a result, the above-mentioned surface mount type flat package IC4 and chip resistor 5
．． Chip capacitor 6 is fixed and electrical connections are made.

Next, the lead component 7 is similarly inserted into the circuit board 3. Here, during soldering, the circuit board 3 is placed on the upper surface of the mask board 2. In this half soldering process, an opening 10 is provided in the mask plate 2 at a portion where the lead portion 8 of the lead component 7 contacts. Next, the mask plate 2 on which the circuit board 3 is mounted is brought into contact with the molten solder 1. Upon contact with the molten solder 1, the molten solder 1 squirts upward into the opening 10 of the mask plate 2, and the lead portion 8 is soldered. At this time, the lead portions 9 of the surface-mounted flat package IC are soldered using the mask plate 2 to prevent solder from entering, so the molten solder 1 does not come into contact with them. Also, in this soldering, the temperature of part 11 is 1
The temperature rises to only about 0.00°C, and the solder does not remelt. As described above, according to this embodiment, soldering is performed on the mask plate 2.
By using the mask plate 2, soldering is performed only on the opening 10 of the mask plate 2, and parts unnecessary for soldering are covered with the mask plate 2 to prevent contact with the molten solder 1. be able to.

Effects of the Invention As described above, according to the present invention, by using a mask plate for soldering, the soldered portions of components soldered in the previous process are not exposed to molten solder. The effect of preventing parts soldered to a circuit board from coming off and short circuits can be achieved by soldering between leads.

[Brief explanation of the drawing]

The figure is a sectional view showing an example of the use of a mask plate for soldering in an apparatus according to an embodiment of the present invention. 1...Melted solder, 2...Mask board for soldering, 3...Circuit board, 4...Surface mount type flat package ICl3... ...Chip resistor, 6...Chip capacitor, 7...Lead parts, 8...Lead part, 9...
Lead part of surface mount type flat package IC, 10.
...Opening part, 11...Soldering is part, 1
2... Molten solder bath.

Claims (1)

[Claims] A mask plate that is not thermally destroyed by molten solder and an opening that allows solder to penetrate into a part of the mask plate, and is used to solder parts of a circuit board and components already soldered on the circuit board. A soldering device that has a shielded structure that prevents molten solder from coming into contact with the parts, making it possible to solder only the necessary parts.