JPH0722750A - Method for soldering printed wiring board - Google Patents

Method for soldering printed wiring board

Info

Publication number
JPH0722750A
JPH0722750A JP16580293A JP16580293A JPH0722750A JP H0722750 A JPH0722750 A JP H0722750A JP 16580293 A JP16580293 A JP 16580293A JP 16580293 A JP16580293 A JP 16580293A JP H0722750 A JPH0722750 A JP H0722750A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
solder
soldering
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP16580293A
Other languages
Japanese (ja)
Inventor
Naoki Yamazaki
直樹 山崎
Kenji Iketaki
憲治 池滝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16580293A priority Critical patent/JPH0722750A/en
Publication of JPH0722750A publication Critical patent/JPH0722750A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To perform soldering treatment without oxidizing parts or printed wiring boards by using a high boiling point inactive liquid as a cover liquid and then allowing a printed wiring board where parts were mounted gets into the melted solder of a solder bath where the melted solder is emitted and is circulating under it. CONSTITUTION:An inactive organic compound liquid solution 9 with a higher boiling point than the melting temperature of solder 8, for example fluorocarbon, is covered as a covering liquid of a melted solder, thus preventing a printed wiring board 1 from being exposed to atmosphere from the inactive organic compound liquid solution 9 during soldering treatment and hence preventing oxidation. Also, the body part of surface-mount parts is fixed on a printed wiring board 1 with a heat resistance adhesive and then flow soldering is performed in this state. Then, finally the printed wiring board 1 is gets into a solvent to eliminate the high boiling-point organic compound 9.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は部品装着の終わったプリ
ント配線基板の半田付け方法に関する。プリント配線基
板に搭載される回路部品には半導体ＩＣで代表される能
動部品とコンデンサや抵抗で代表される受動部品とがあ
り、集積度を向上するため何れも小形化したものが使用
されて高密度実装が行なわれている。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for soldering a printed wiring board on which components have been mounted. Circuit components mounted on a printed wiring board include active components typified by semiconductor ICs and passive components typified by capacitors and resistors, all of which are miniaturized in order to improve the degree of integration. Density packaging is done.

【０００２】[0002]

【従来の技術】プリント配線基板への部品装着について
は、当初は総てがリード挿入型であり、自動挿入機など
を用いてプリント配線基板に設けてあるスルーホールに
挿入する実装方法が採られていたが、セラミックコンデ
ンサなど、受動部品にチップ部品が増え、また、半導体
ＩＣも表面実装型（フラットパッケージ型）が使用され
るようになったことから、二種類の半田付け方法が併用
されるようになった。2. Description of the Related Art For mounting components on a printed wiring board, all of them are initially lead insertion type, and a mounting method is adopted in which they are inserted into through holes provided in the printed wiring board using an automatic insertion machine or the like. However, since the number of chip components has increased to passive components such as ceramic capacitors, and the surface mounting type (flat package type) has also been used for semiconductor ICs, two types of soldering methods are used together. It became so.

【０００３】すなわち、プリント配線基板のランドに半
田ペーストをスクリーン印刷して後、ＩＣなどの表面実
装部品のリードをランドに位置決めして当接し、この状
態で半田の融点以上の温度に保持されている電気炉を通
すことにより半田付け（リフロー半田付け）を行い、次
に、印刷基板に設けてあるスルーホールにリード挿入部
品の装着を行い、この印刷基板の裏面にフラックスを塗
布した後、半田の噴流が流れている溶融半田の上をスラ
イドさせることにより半田付け（フロー半田付け）を行
なっている。That is, after the solder paste is screen-printed on the land of the printed wiring board, the lead of the surface mounting component such as IC is positioned and brought into contact with the land, and in this state, the temperature is kept above the melting point of the solder. Soldering (reflow soldering) is performed by passing it through an existing electric furnace, and then lead insertion parts are mounted in through holes provided in the printed circuit board. After applying flux to the back surface of this printed circuit board, solder The soldering (flow soldering) is performed by sliding on the molten solder in which the jet flow of.

【０００４】[0004]

【発明が解決しようとする課題】プリント配線基板への
装着する部品の形態として表面実装型とリード挿入型と
があり、これが混在している場合が多いことから、リフ
ロー半田付けを行なって表面実装型部品を装着して後、
フロー半田付けを行ってリード挿入型部品の装着を行な
っている。そのために半田付け工数が増していること
ゝ、それぞれの工程で異なるフラックスを使用している
ことから、工程終了後に二種類のフラックスが装着位置
に残存していると云う問題があった。There are a surface mounting type and a lead insertion type as a form of a component to be mounted on a printed wiring board, and since these are often mixed, reflow soldering is performed to perform surface mounting. After mounting the mold parts,
Flow-soldering is used to mount lead insertion type parts. For this reason, the number of soldering steps is increasing, and since different fluxes are used in each process, there is a problem that two types of flux remain at the mounting position after the process is completed.

【０００５】[0005]

【課題を解決するための手段】上記の課題はＩＣ搭載用
としてプリント配線基板にパターン形成してあるランド
の上に半田ペーストを印刷する工程と、この基板に予め
設けてあるバイアホールにリード挿入実装部品の装着を
行なう工程と、部品底部に接着剤を付けた表面実装部品
のリードをＩＣ搭載用ランドに当接すると共に部品を配
線基板に接着し固定する工程と、高沸点の不活性溶液を
カバー液とし、その下に溶融半田が噴流し循環している
半田槽の溶融半田の中を部品搭載を終えた配線基板を潜
らせる工程とからプリント配線基板の半田付け方法を構
成することにより解決することができる。The above-mentioned problems are solved by printing a solder paste on a land formed by patterning on a printed wiring board for mounting an IC, and inserting a lead into a via hole previously provided on this board. The step of mounting the mounted component, the step of abutting the lead of the surface mounted component with an adhesive on the bottom of the component to the IC mounting land and fixing and bonding the component to the wiring board, and the high boiling point inert solution Solved by configuring the soldering method of the printed wiring board from the step of making the wiring board that has finished mounting the component submerged in the molten solder in the solder bath in which the molten solder is jetted and circulates as the cover liquid. can do.

【０００６】[0006]

【作用】本発明はフロー半田槽の構造を変え、プリント
配線基板を溶融半田の中を潜らせる方法をとるものであ
る。こゝで問題となることは、 プリント配線基板と
装着部品の酸化を防ぐこと、 表面実装部品の位置ず
れを無くすること、であり、この対策としてについて
は、半田の溶融温度よりも沸点の高い不活性有機化合物
溶液（例えばフロロカーボン）を溶融半田のカバー液と
して覆っておき、プリント配線基板は半田付け処理中は
不活性有機化合物溶液より大気中に出ないようにするこ
とにより酸化を防ぐ、また、としては表面実装部品は
予め本体部を耐熱性接着剤でプリント配線基板に固定し
ておき、この状態でフロー半田付けを行なうものであ
る。そして、最後にプリント配線基板を溶剤の中を潜ら
せて高沸点有機化合物を溶解除去すると部品やプリント
配線基板を酸化させることなく半田付け処理を行なうこ
とができる。The present invention adopts a method in which the structure of the flow solder bath is changed and the printed wiring board is dipped in the molten solder. The problem here is to prevent oxidation of the printed wiring board and the mounted parts, and to eliminate the misalignment of the surface mount parts. As a countermeasure for this, the boiling point is higher than the melting temperature of the solder. The inert organic compound solution (eg, fluorocarbon) is covered as a cover solution for the molten solder, and the printed wiring board is prevented from being exposed to the atmosphere from the inert organic compound solution during the soldering process. As for the surface mount component, the main body is fixed to the printed wiring board with a heat resistant adhesive in advance, and flow soldering is performed in this state. Finally, when the printed wiring board is dipped in a solvent to dissolve and remove the high boiling point organic compound, the soldering process can be performed without oxidizing the components and the printed wiring board.

【０００７】[0007]

【実施例】図１は本発明に係るフロー半田付け装置の構
成を示す断面図であり、図２は本発明を実施した両面実
装プリント配線基板の断面図であって、プリント配線基
板１の上面にＩＣ２と抵抗器３とチップコンデンサ４
を、また、裏面にチップコンデンサ５と６を装着した場
合を示している。1 is a sectional view showing the structure of a flow soldering apparatus according to the present invention, and FIG. 2 is a sectional view of a double-sided mounting printed wiring board embodying the present invention. IC2, resistor 3 and chip capacitor 4
And the case where the chip capacitors 5 and 6 are mounted on the back surface.

【０００８】図１のフロー半田付け装置が従来と異なる
ところは噴流して循環する半田浴８の上に高沸点の不活
性溶液９がカバー液として存在し、常に半田浴８を覆っ
て酸化を防いでいることゝで、半田浴として融点が183
℃のSn62Pb38半田が多く使用されることから沸点が200
℃以上の不活性溶液を使用することが必要で、この場合
沸点が215 ℃のN(C4F9)3 (品名フロリナートFC-70J) を
使用した。Where the flow soldering apparatus of FIG. 1 is different from the conventional one, a high boiling point inert solution 9 is present as a cover liquid on a solder bath 8 which is jetted and circulated, and the solder bath 8 is always covered to prevent oxidation. It has a melting point of 183 as a solder bath.
Since Sn 62 Pb 38 solder at ℃ is often used, the boiling point is 200
It was necessary to use an inert solution above ℃, in this case N (C 4 F 9 ) 3 (product name Fluorinert FC-70J) having a boiling point of 215 ℃ was used.

【０００９】すなわち、半田浴８の下に設けてあるヒー
タ10により半田を200 ℃に加熱して矢印の方向に循環さ
せておく。一方、プリント配線基板１に設けてあるラン
ド12の上にはスクリーン印刷法により半田ペーストを印
刷した後、エポキシ接着剤13を本体の中央に付けたＩＣ
２とチップコンデンサ４，５，６をプリント配線基板１
に位置決めしてＩＣ２のリードとチップコンデンサ４，
５，６の端子電極をランド12に一致させた。また、抵抗
器３のリード線をプリント配線基板１のスルーホールに
挿入して固定した。That is, the solder is heated to 200 ° C. by the heater 10 provided below the solder bath 8 and circulated in the direction of the arrow. On the other hand, after the solder paste is printed on the land 12 provided on the printed wiring board 1 by the screen printing method, the epoxy adhesive 13 is attached to the center of the main body of the IC.
2 and the chip capacitors 4, 5 and 6 on the printed wiring board 1
The IC2 lead and chip capacitor 4,
The terminal electrodes 5 and 6 were aligned with the land 12. Further, the lead wire of the resistor 3 was inserted into the through hole of the printed wiring board 1 and fixed.

【００１０】次に、このようにして部品装着の終わった
プリント配線基板１は図１に示すフロー半田付け装置の
コンベア15に設けてある止め具16で固定した後、半田浴
８の中を通過させた。その結果、一回の半田付け処理で
表面実装型とリード挿入型部品の双方について半田付け
を行なうことができた。なお、プリント配線基板と部品
の表面に付着している不活性溶液９は有機溶媒に浸漬し
て除去した。Next, the printed wiring board 1 on which the components have been mounted in this manner is fixed by a stopper 16 provided on the conveyor 15 of the flow soldering apparatus shown in FIG. 1 and then passed through the solder bath 8. Let As a result, it was possible to perform soldering for both the surface mount type and the lead insertion type components by one soldering process. The inert solution 9 adhering to the surfaces of the printed wiring board and the parts was removed by immersing it in an organic solvent.

【００１１】[0011]

【発明の効果】本発明の実施により一回の処理で表面実
装型とリード挿入型部品の半田付けができるので、工程
を短縮することができる。According to the present invention, the surface mounting type and the lead insertion type parts can be soldered by a single treatment, so that the process can be shortened.

【図面の簡単な説明】[Brief description of drawings]

【図１】 本発明に係るフロー半田付け装置の構成を示
す断面図である。FIG. 1 is a cross-sectional view showing the configuration of a flow soldering device according to the present invention.

【図２】 両面実装を行なったプリント配線基板の断面
図である。FIG. 2 is a cross-sectional view of a printed wiring board mounted on both sides.

【符号の説明】[Explanation of symbols]

１ プリント配線基板 ８ 半田浴 ９ 不活性溶液 10 ヒータ 12 ランド 13 接着剤 1 Printed wiring board 8 Solder bath 9 Inert solution 10 Heater 12 Land 13 Adhesive

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 ＩＣ搭載用としてプリント配線基板にパ
ターン形成してあるランドの上に半田ペーストを印刷す
る工程と、該基板に予め設けてあるバイアホールにリー
ド挿入実装部品の装着を行なう工程と、部品底部に接着
剤を付した表面実装部品のリードを前記ＩＣ搭載用ラン
ドに当接すると共に該部品を配線基板に接着して固定す
る工程と、高沸点の不活性溶液をカバー液とし、その下
に溶融半田が噴流し循環している半田槽の溶融半田の中
を部品搭載を終えた前記配線基板を潜らせる工程と、か
らなることを特徴とするプリント配線基板の半田付け方
法。1. A step of printing a solder paste on a land formed by patterning on a printed wiring board for mounting an IC, and a step of mounting a lead insertion mounting component in a via hole previously provided in the board. A step of abutting the leads of a surface-mounted component having an adhesive on the bottom of the component with the IC mounting land and adhering and fixing the component to a wiring board; and using a high boiling point inert solution as a cover liquid, A method of soldering a printed wiring board, comprising the step of immersing the wiring board, on which component mounting is completed, in the molten solder in a solder bath in which molten solder is jetted and circulated.
JP16580293A 1993-07-06 1993-07-06 Method for soldering printed wiring board Withdrawn JPH0722750A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16580293A JPH0722750A (en) 1993-07-06 1993-07-06 Method for soldering printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16580293A JPH0722750A (en) 1993-07-06 1993-07-06 Method for soldering printed wiring board

Publications (1)

Publication Number Publication Date
JPH0722750A true JPH0722750A (en) 1995-01-24

Family

ID=15819276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16580293A Withdrawn JPH0722750A (en) 1993-07-06 1993-07-06 Method for soldering printed wiring board

Country Status (1)

Country Link
JP (1) JPH0722750A (en)

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20001003