JPH03145193A - Manufacture of hybrid integrated circuit device - Google Patents
Manufacture of hybrid integrated circuit deviceInfo
- Publication number
- JPH03145193A JPH03145193A JP28359789A JP28359789A JPH03145193A JP H03145193 A JPH03145193 A JP H03145193A JP 28359789 A JP28359789 A JP 28359789A JP 28359789 A JP28359789 A JP 28359789A JP H03145193 A JPH03145193 A JP H03145193A
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit device
- integrated circuit
- parts
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 abstract description 15
- 239000006071 cream Substances 0.000 abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000008708 Morus alba Nutrition 0.000 description 1
- 240000000249 Morus alba Species 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は一般的な半田付方法（フロー、リフロー半田ゴ
テ付ｖｐｓ法）等、どの様な方法でも面実装可能な混成
集積回路装置の製造方法に関するものである〇
従来の技術
近年、混成集積回路の需要は年々増加の一途をたどり、
ビデオ、０ム等さ！ざまの分野に利用されている。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a hybrid integrated circuit device that can be surface-mounted by any method including general soldering methods (flow, reflow soldering iron VPS method), etc. 〇 Conventional technology In recent years, the demand for hybrid integrated circuits has been increasing year by year.
Video, 0m etc! It is used in various fields.
以下図面を用いて従来の製造方法による混成集積回路装
置について説明する。A hybrid integrated circuit device manufactured by a conventional manufacturing method will be described below with reference to the drawings.
第４図は従来の混成集積回路装置の標準的な構造を示す
。すなわち、１１はＳＯタイプ半導体ＩＣ１１２はミニ
モールドトランジスタあるいはダイオード、１３はチッ
プコンデンサ、１４はセラミック材等で成る基板、１６
はリード線、１６は共晶点ハンダ、１７はモールド樹脂
である。FIG. 4 shows the standard structure of a conventional hybrid integrated circuit device. That is, 11 is an SO type semiconductor IC 112 which is a mini-molded transistor or diode, 13 is a chip capacitor, 14 is a substrate made of ceramic material, etc., and 16 is a chip capacitor.
16 is a lead wire, 16 is a eutectic point solder, and 17 is a mold resin.
発明が解決しようとする課題
前記の様な混成集積回路装置を用い電子回路装置を作る
時、まずこのようなＳＩＰタイプの混成集積回路装置は
マザーボードに挿入され、マザーボードの裏側で、リー
ド線１５が７０−半田付される。Problems to be Solved by the Invention When making an electronic circuit device using a hybrid integrated circuit device as described above, first, such a SIP type hybrid integrated circuit device is inserted into a motherboard, and the lead wire 15 is connected to the back side of the motherboard. 70-Soldered.
この混成集積回路装置の共晶点ハンダ１６は共晶点温度
１８３℃を超えないので特に問題はない。Since the eutectic point solder 16 of this hybrid integrated circuit device does not exceed the eutectic point temperature of 183° C., there is no particular problem.
しかし上記のような各種電子部品およびリード線１６を
共晶点半田（１８３℃）で基板と接続している構造では
、リード形状をＤＩＰ型、ＳＯ型またはＱＦＰ型にした
場合に面実装部品として使用することはできない。However, in the structure where various electronic components and lead wires 16 are connected to the board using eutectic point solder (183°C) as described above, when the lead shape is DIP type, SO type or QFP type, it cannot be used as a surface mount component. cannot be used.
なぜならば、たとえば上記部品をリフローで半田付する
場合を考えると、リフロー中にその温度により混成集積
回路装置の内部の共晶半田が再溶融し、損傷するのであ
る。This is because, for example, when the above-mentioned components are soldered by reflow, the eutectic solder inside the hybrid integrated circuit device is remelted due to the temperature during reflow, causing damage.
本発明は上記欠点に鑑み、各種電子部品およびリード線
の半田付に高温半田（例えば融点が２６０℃以上のもの
）を使用した混成集積・回路装置の製造方法を提供しリ
ード形状をＳＯタイプに加工することによって面実装可
能な混成集積回路装置を実現することを目的とする。In view of the above drawbacks, the present invention provides a method for manufacturing a hybrid integrated circuit device using high-temperature solder (for example, one with a melting point of 260°C or higher) for soldering various electronic components and lead wires, and changing the lead shape to SO type. The purpose is to realize a hybrid integrated circuit device that can be surface-mounted by processing.
課題を解決するための手段
上記目的を達成するために、本発明は基板上の所定の位
置に高温ハンダをのせ、所定の位置に各種電子部品を配
置し、ハンダ付すべき箇所にスリットを有する遮蔽板を
介して高温ハンダにレーザ筺たは光ビームを照射して電
子部品を基板上に接続するものである。Means for Solving the Problems In order to achieve the above objects, the present invention places high-temperature solder on a predetermined position on a board, arranges various electronic components at the predetermined positions, and provides a shield with slits at the locations to be soldered. Electronic components are connected to a board by irradiating the high-temperature solder with a laser beam or a light beam through a plate.
作用
本発明によれば、リード形状をＤ Ｉ Ｐａ、ＳＯ型、
またはＱＦＰ型にした場合にも、フロー、リフロー、ｖ
ｐｓ、半田ゴテ付をはじめあらゆる半田付方法によって
面実装することができる。なぜなら、スリットを有する
遮蔽板を用いて半田付するため、半田付時の熱で電子部
品やリード線を損傷することなく面実装することができ
るからである０
実施例
以下本発明の一実施例について、図面を用いて説明する
。According to the present invention, the lead shape is D I Pa, SO type,
Or when using QFP type, flow, reflow, v
PS, surface mounting can be performed by any soldering method including soldering iron. This is because soldering is performed using a shielding plate with slits, so surface mounting can be performed without damaging electronic components or lead wires due to heat during soldering. will be explained using drawings.
第１図ａ、ｂ、ｃは本発明の実施例により製造される混
成集積回路装置の構造を示すものである。1a, b, and c show the structure of a hybrid integrated circuit device manufactured according to an embodiment of the present invention.
第１図ａ、ｂ、ｃにおいて１はＳＯタイプ半導体ＩＣ，
２はミニモールド型トランジスタまたはダイオード、３
はチップコンデンサ、４は面に印刷・焼成等により抵抗
・コンデンサ・接続用パターンを設けたアルミナ材等で
戊る基板、６はリード線、６は前記の各種部品やリード
線を接続用パターンに接続させる半田（高温半田）、ア
は外装用のモールド樹脂である。In Fig. 1 a, b, and c, 1 is an SO type semiconductor IC,
2 is a mini mold type transistor or diode, 3
1 is a chip capacitor, 4 is a board made of alumina material, etc., with resistors, capacitors, and connection patterns formed by printing and firing on its surface, 6 is a lead wire, and 6 is a connection pattern using the various parts and lead wires mentioned above. The solder (high-temperature solder) to be connected is the molding resin for the exterior.
以上のように構成された混成集積回路装置の製造方法に
おいて、本発明の特徴である各種部品と基板電極を高温
半田で接続する方法について説明すると、第２図Ｃ９第
３図ａのように基板２４上にクリーム半田２６を印刷方
法等によう塗布する。In the method for manufacturing a hybrid integrated circuit device configured as described above, the method of connecting various components and substrate electrodes using high-temperature solder, which is a feature of the present invention, will be explained. Cream solder 26 is applied onto 24 using a printing method or the like.
次に第２図す、第３図すに示すようにクリーム半田２６
印刷された基板２４上の所定の位置に所定の各種部品２
１．２３をマウントする。次に第２図Ｃ９第３図Ｃに示
すようにマウントされた基板２４を所定の治具にセット
し、各種部品２１゜２３の端子部あるいはハンダ付はラ
ンド部付近に所定の穴の設けられた遮蔽板２８を所定の
位置にセットし、上方からレーザー光を照射して半田を
溶融させ、各種部品２１．２３を基板２４上の接続用パ
ターンに半田付をする。Next, as shown in Figures 2 and 3, the cream solder 26
Predetermined various parts 2 are placed at predetermined positions on the printed board 24.
Mount 1.23. Next, set the mounted board 24 in a predetermined jig as shown in FIG. 2C and FIG. The shielding plate 28 is set in a predetermined position, the solder is melted by irradiating the laser beam from above, and the various parts 21 and 23 are soldered to the connection patterns on the board 24.
この時、レーザー（例えばＹＡＧレーザ−）に対する遮
蔽板は例えば銅製あるいはセラミック材製であり、また
レーザーの代わりに光ビームを用いる場合には例えばム
ｌ製の遮蔽板を用いる。At this time, a shielding plate for a laser (for example, a YAG laser) is made of copper or a ceramic material, for example, and when a light beam is used instead of a laser, a shielding plate made of, for example, mulberry is used.
前記のような遮蔽板を用いることにより、各種部品２１
．２３の端子部分の高温半田を溶融させた時、部品２１
．２３本体はそれより低い温度に保つことが可能となり
、部品２１．２３自体にはダメージを与えず、半田付す
ることができる０さらに第２図Ｃ９第３図ｄのように部
品２１゜２３実装された基板２４にさらにクリーム半田
２６を印刷方法等により塗布して、リード線２５を前記
と同様の方・法で取付ける。ただしリード付の場合、本
図では部品実装の反対面につけているが、これは部品実
装面でも同様に出来る。またリード付はレーザー、光ビ
ームの他に半田ゴテによる方法にて取付けてもよい。By using the shielding plate as described above, various parts 21
．． When the high temperature solder on the terminal part of part 23 is melted, part 21
．． The main body of 23 can be kept at a lower temperature than that, and the parts 21.23 can be soldered without damaging them. Furthermore, as shown in Figure 2 C9 and Figure 3 d, the parts 21 and 23 can be mounted. Cream solder 26 is further applied to the printed circuit board 24 by a printing method or the like, and the lead wires 25 are attached in the same manner as described above. However, in the case of a lead, it is attached to the side opposite to the component mounting side in this figure, but this can be done on the component mounting side as well. In addition to using a laser or light beam, attachment with leads may also be performed using a soldering iron.
そしてリード付後、第２図Ｃ９第３図０のようにモール
ド樹脂２７でモールドし、及び第２図ｆ。After attaching the leads, molding is performed with molding resin 27 as shown in FIG. 2 C9 and FIG. 3 0, and as shown in FIG. 2 f.
第３図ｆのようにリード加工を行う。Lead processing is performed as shown in Fig. 3f.
以上のように本実施例によれば、部品実装およびリード
付をレーザー、光ビームと遮蔽板とを使用して高温半田
（融点２６０℃以上）で実施することにより、またリー
ド加工を面実装型にすることにより、あらゆる半田付方
法（半田フロー、リフロー、半田ゴテ付、ｖｐｓ ）で
使用できる面実装混成集積回路装置を実現することがで
きる。As described above, according to this embodiment, component mounting and lead attachment are performed using high-temperature solder (melting point of 260°C or higher) using a laser, a light beam, and a shielding plate, and lead processing is performed using a surface mount type. By doing so, it is possible to realize a surface mount hybrid integrated circuit device that can be used with any soldering method (solder flow, reflow, soldering iron, VPS).
発明の効果
以上のように本発明によれば、各種部品、リード線等を
それらの本体を損傷することなく、確実に取付けること
ができ、その完成品をあらゆる半・田付方法（半田フロ
ー、リフロー、半田ゴテ付、ｖｐｓ ）で、面実装する
ことができる混成集積回路装置を実現することが可能と
なりその実用的効果は大なるものがある。Effects of the Invention As described above, according to the present invention, various parts, lead wires, etc. can be reliably attached without damaging their bodies, and the finished product can be soldered using any soldering method (soldering flow, reflow soldering, etc.). , soldering iron, VPS), it is possible to realize a hybrid integrated circuit device that can be surface mounted, and the practical effects thereof are great.
の構造図、第２図ａ−ｗｆ、第３図ロ −ｆ’は本発明
的な構造図である。The structural diagrams of FIG. 2 a-wf and FIG. 3 lo-f' are structural diagrams of the present invention.
１・・・・・・ＳＯタイプ半導体ＩＣ１２・・・・・・
ミニモールド型トランジスタ、３・・・・・・チップコ
ンデンサ、４．２４・・・・・・基板、６，２６・・・
・・・リード線、６・・・・・・半田、７，２７・・・
・・・モールド樹脂、２１．２３・・・・・・部品、２
６・・・・・・クリーム半田、２８・山・・遮蔽板０1...SO type semiconductor IC12...
Mini-mold transistor, 3... Chip capacitor, 4.24... Substrate, 6, 26...
...Lead wire, 6...Solder, 7,27...
...Mold resin, 21.23...Parts, 2
6... Cream solder, 28. Mountain... Shielding plate 0
Claims (1)
各種電子部品を配置し、ハンダ付けすべき箇所にスリッ
トを有する遮蔽板を介して高温ハンダにレーザまたは光
ビームを照射して電子部品を基板上に接続する混成集積
回路装置の製造方法。High-temperature solder is placed on a predetermined position on the board, various electronic components are placed in the predetermined positions, and the high-temperature solder is irradiated with a laser or light beam through a shielding plate with slits at the locations to be soldered. A method for manufacturing a hybrid integrated circuit device that connects a circuit board to a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28359789A JPH03145193A (en) | 1989-10-31 | 1989-10-31 | Manufacture of hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28359789A JPH03145193A (en) | 1989-10-31 | 1989-10-31 | Manufacture of hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03145193A true JPH03145193A (en) | 1991-06-20 |
Family
ID=17667565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28359789A Pending JPH03145193A (en) | 1989-10-31 | 1989-10-31 | Manufacture of hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03145193A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0641174U (en) * | 1992-10-30 | 1994-05-31 | ミツミ電機株式会社 | Soldering equipment |
| JP2007201286A (en) * | 2006-01-27 | 2007-08-09 | Kyocera Corp | Surface-mounting module, and method of manufacturing same |
| JP2010051989A (en) * | 2008-08-27 | 2010-03-11 | Sharp Corp | Laser joining method |
-
1989
- 1989-10-31 JP JP28359789A patent/JPH03145193A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0641174U (en) * | 1992-10-30 | 1994-05-31 | ミツミ電機株式会社 | Soldering equipment |
| JP2007201286A (en) * | 2006-01-27 | 2007-08-09 | Kyocera Corp | Surface-mounting module, and method of manufacturing same |
| JP2010051989A (en) * | 2008-08-27 | 2010-03-11 | Sharp Corp | Laser joining method |
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