JPH03145193A - Manufacture of hybrid integrated circuit device - Google Patents

Manufacture of hybrid integrated circuit device

Info

Publication number
JPH03145193A
JPH03145193A JP28359789A JP28359789A JPH03145193A JP H03145193 A JPH03145193 A JP H03145193A JP 28359789 A JP28359789 A JP 28359789A JP 28359789 A JP28359789 A JP 28359789A JP H03145193 A JPH03145193 A JP H03145193A
Authority
JP
Japan
Prior art keywords
board
circuit device
integrated circuit
parts
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28359789A
Other languages
Japanese (ja)
Inventor
Masaji Nakamura
中村 正次
Kazutoshi Tanaka
田中 和敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP28359789A priority Critical patent/JPH03145193A/en
Publication of JPH03145193A publication Critical patent/JPH03145193A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To surely fix various parts, lead wires, and the like without causing damage to their main bodies by a method wherein high temperature solder is placed at prescribed positions on a board, various parts are arranged, and a laser or a light beam is made to irradiate the high temperature solders through a shielding plate provided with slits which are located in accordance with the parts to be soldered. CONSTITUTION:Prescribed various parts 21 and 23 are mounted at prescribed positions on a board 24 on which cream solder bumps 26 are printed. The board 24 mounted with the parts is set on a prescribed jig, a shielding plate 28 provided with holes located corresponding to the terminals of the parts 21 and 23 or soldering lands is set at a prescribed position, laser rays are made to irradiate the solders 26 from above to fuse, and the various parts 21 and 23 are soldered to a connection pattern formed on the board 24.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は一般的な半田付方法(フロー、リフロー半田ゴ
テ付vps法)等、どの様な方法でも面実装可能な混成
集積回路装置の製造方法に関するものである〇 従来の技術 近年、混成集積回路の需要は年々増加の一途をたどり、
ビデオ、0ム等さ!ざまの分野に利用されている。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a hybrid integrated circuit device that can be surface-mounted by any method including general soldering methods (flow, reflow soldering iron VPS method), etc. 〇 Conventional technology In recent years, the demand for hybrid integrated circuits has been increasing year by year.
Video, 0m etc! It is used in various fields.

以下図面を用いて従来の製造方法による混成集積回路装
置について説明する。
A hybrid integrated circuit device manufactured by a conventional manufacturing method will be described below with reference to the drawings.

第4図は従来の混成集積回路装置の標準的な構造を示す
。すなわち、11はSOタイプ半導体IC112はミニ
モールドトランジスタあるいはダイオード、13はチッ
プコンデンサ、14はセラミック材等で成る基板、16
はリード線、16は共晶点ハンダ、17はモールド樹脂
である。
FIG. 4 shows the standard structure of a conventional hybrid integrated circuit device. That is, 11 is an SO type semiconductor IC 112 which is a mini-molded transistor or diode, 13 is a chip capacitor, 14 is a substrate made of ceramic material, etc., and 16 is a chip capacitor.
16 is a lead wire, 16 is a eutectic point solder, and 17 is a mold resin.

発明が解決しようとする課題 前記の様な混成集積回路装置を用い電子回路装置を作る
時、まずこのようなSIPタイプの混成集積回路装置は
マザーボードに挿入され、マザーボードの裏側で、リー
ド線15が70−半田付される。
Problems to be Solved by the Invention When making an electronic circuit device using a hybrid integrated circuit device as described above, first, such a SIP type hybrid integrated circuit device is inserted into a motherboard, and the lead wire 15 is connected to the back side of the motherboard. 70-Soldered.

この混成集積回路装置の共晶点ハンダ16は共晶点温度
183℃を超えないので特に問題はない。
Since the eutectic point solder 16 of this hybrid integrated circuit device does not exceed the eutectic point temperature of 183° C., there is no particular problem.

しかし上記のような各種電子部品およびリード線16を
共晶点半田(183℃)で基板と接続している構造では
、リード形状をDIP型、SO型またはQFP型にした
場合に面実装部品として使用することはできない。
However, in the structure where various electronic components and lead wires 16 are connected to the board using eutectic point solder (183°C) as described above, when the lead shape is DIP type, SO type or QFP type, it cannot be used as a surface mount component. cannot be used.

なぜならば、たとえば上記部品をリフローで半田付する
場合を考えると、リフロー中にその温度により混成集積
回路装置の内部の共晶半田が再溶融し、損傷するのであ
る。
This is because, for example, when the above-mentioned components are soldered by reflow, the eutectic solder inside the hybrid integrated circuit device is remelted due to the temperature during reflow, causing damage.

本発明は上記欠点に鑑み、各種電子部品およびリード線
の半田付に高温半田(例えば融点が260℃以上のもの
)を使用した混成集積・回路装置の製造方法を提供しリ
ード形状をSOタイプに加工することによって面実装可
能な混成集積回路装置を実現することを目的とする。
In view of the above drawbacks, the present invention provides a method for manufacturing a hybrid integrated circuit device using high-temperature solder (for example, one with a melting point of 260°C or higher) for soldering various electronic components and lead wires, and changing the lead shape to SO type. The purpose is to realize a hybrid integrated circuit device that can be surface-mounted by processing.

課題を解決するための手段 上記目的を達成するために、本発明は基板上の所定の位
置に高温ハンダをのせ、所定の位置に各種電子部品を配
置し、ハンダ付すべき箇所にスリットを有する遮蔽板を
介して高温ハンダにレーザ筺たは光ビームを照射して電
子部品を基板上に接続するものである。
Means for Solving the Problems In order to achieve the above objects, the present invention places high-temperature solder on a predetermined position on a board, arranges various electronic components at the predetermined positions, and provides a shield with slits at the locations to be soldered. Electronic components are connected to a board by irradiating the high-temperature solder with a laser beam or a light beam through a plate.

作用 本発明によれば、リード形状をD I Pa、SO型、
またはQFP型にした場合にも、フロー、リフロー、v
ps、半田ゴテ付をはじめあらゆる半田付方法によって
面実装することができる。なぜなら、スリットを有する
遮蔽板を用いて半田付するため、半田付時の熱で電子部
品やリード線を損傷することなく面実装することができ
るからである0 実施例 以下本発明の一実施例について、図面を用いて説明する
According to the present invention, the lead shape is D I Pa, SO type,
Or when using QFP type, flow, reflow, v
PS, surface mounting can be performed by any soldering method including soldering iron. This is because soldering is performed using a shielding plate with slits, so surface mounting can be performed without damaging electronic components or lead wires due to heat during soldering. will be explained using drawings.

第1図a、b、cは本発明の実施例により製造される混
成集積回路装置の構造を示すものである。
1a, b, and c show the structure of a hybrid integrated circuit device manufactured according to an embodiment of the present invention.

第1図a、b、cにおいて1はSOタイプ半導体IC,
2はミニモールド型トランジスタまたはダイオード、3
はチップコンデンサ、4は面に印刷・焼成等により抵抗
・コンデンサ・接続用パターンを設けたアルミナ材等で
戊る基板、6はリード線、6は前記の各種部品やリード
線を接続用パターンに接続させる半田(高温半田)、ア
は外装用のモールド樹脂である。
In Fig. 1 a, b, and c, 1 is an SO type semiconductor IC,
2 is a mini mold type transistor or diode, 3
1 is a chip capacitor, 4 is a board made of alumina material, etc., with resistors, capacitors, and connection patterns formed by printing and firing on its surface, 6 is a lead wire, and 6 is a connection pattern using the various parts and lead wires mentioned above. The solder (high-temperature solder) to be connected is the molding resin for the exterior.

以上のように構成された混成集積回路装置の製造方法に
おいて、本発明の特徴である各種部品と基板電極を高温
半田で接続する方法について説明すると、第2図C9第
3図aのように基板24上にクリーム半田26を印刷方
法等によう塗布する。
In the method for manufacturing a hybrid integrated circuit device configured as described above, the method of connecting various components and substrate electrodes using high-temperature solder, which is a feature of the present invention, will be explained. Cream solder 26 is applied onto 24 using a printing method or the like.

次に第2図す、第3図すに示すようにクリーム半田26
印刷された基板24上の所定の位置に所定の各種部品2
1.23をマウントする。次に第2図C9第3図Cに示
すようにマウントされた基板24を所定の治具にセット
し、各種部品21゜23の端子部あるいはハンダ付はラ
ンド部付近に所定の穴の設けられた遮蔽板28を所定の
位置にセットし、上方からレーザー光を照射して半田を
溶融させ、各種部品21.23を基板24上の接続用パ
ターンに半田付をする。
Next, as shown in Figures 2 and 3, the cream solder 26
Predetermined various parts 2 are placed at predetermined positions on the printed board 24.
Mount 1.23. Next, set the mounted board 24 in a predetermined jig as shown in FIG. 2C and FIG. The shielding plate 28 is set in a predetermined position, the solder is melted by irradiating the laser beam from above, and the various parts 21 and 23 are soldered to the connection patterns on the board 24.

この時、レーザー(例えばYAGレーザ−)に対する遮
蔽板は例えば銅製あるいはセラミック材製であり、また
レーザーの代わりに光ビームを用いる場合には例えばム
l製の遮蔽板を用いる。
At this time, a shielding plate for a laser (for example, a YAG laser) is made of copper or a ceramic material, for example, and when a light beam is used instead of a laser, a shielding plate made of, for example, mulberry is used.

前記のような遮蔽板を用いることにより、各種部品21
.23の端子部分の高温半田を溶融させた時、部品21
.23本体はそれより低い温度に保つことが可能となり
、部品21.23自体にはダメージを与えず、半田付す
ることができる0さらに第2図C9第3図dのように部
品21゜23実装された基板24にさらにクリーム半田
26を印刷方法等により塗布して、リード線25を前記
と同様の方・法で取付ける。ただしリード付の場合、本
図では部品実装の反対面につけているが、これは部品実
装面でも同様に出来る。またリード付はレーザー、光ビ
ームの他に半田ゴテによる方法にて取付けてもよい。
By using the shielding plate as described above, various parts 21
.. When the high temperature solder on the terminal part of part 23 is melted, part 21
.. The main body of 23 can be kept at a lower temperature than that, and the parts 21.23 can be soldered without damaging them. Furthermore, as shown in Figure 2 C9 and Figure 3 d, the parts 21 and 23 can be mounted. Cream solder 26 is further applied to the printed circuit board 24 by a printing method or the like, and the lead wires 25 are attached in the same manner as described above. However, in the case of a lead, it is attached to the side opposite to the component mounting side in this figure, but this can be done on the component mounting side as well. In addition to using a laser or light beam, attachment with leads may also be performed using a soldering iron.

そしてリード付後、第2図C9第3図0のようにモール
ド樹脂27でモールドし、及び第2図f。
After attaching the leads, molding is performed with molding resin 27 as shown in FIG. 2 C9 and FIG. 3 0, and as shown in FIG. 2 f.

第3図fのようにリード加工を行う。Lead processing is performed as shown in Fig. 3f.

以上のように本実施例によれば、部品実装およびリード
付をレーザー、光ビームと遮蔽板とを使用して高温半田
(融点260℃以上)で実施することにより、またリー
ド加工を面実装型にすることにより、あらゆる半田付方
法(半田フロー、リフロー、半田ゴテ付、vps )で
使用できる面実装混成集積回路装置を実現することがで
きる。
As described above, according to this embodiment, component mounting and lead attachment are performed using high-temperature solder (melting point of 260°C or higher) using a laser, a light beam, and a shielding plate, and lead processing is performed using a surface mount type. By doing so, it is possible to realize a surface mount hybrid integrated circuit device that can be used with any soldering method (solder flow, reflow, soldering iron, VPS).

発明の効果 以上のように本発明によれば、各種部品、リード線等を
それらの本体を損傷することなく、確実に取付けること
ができ、その完成品をあらゆる半・田付方法(半田フロ
ー、リフロー、半田ゴテ付、vps )で、面実装する
ことができる混成集積回路装置を実現することが可能と
なりその実用的効果は大なるものがある。
Effects of the Invention As described above, according to the present invention, various parts, lead wires, etc. can be reliably attached without damaging their bodies, and the finished product can be soldered using any soldering method (soldering flow, reflow soldering, etc.). , soldering iron, VPS), it is possible to realize a hybrid integrated circuit device that can be surface mounted, and the practical effects thereof are great.

の構造図、第2図a−wf、第3図ロ −f’は本発明
的な構造図である。
The structural diagrams of FIG. 2 a-wf and FIG. 3 lo-f' are structural diagrams of the present invention.

1・・・・・・SOタイプ半導体IC12・・・・・・
ミニモールド型トランジスタ、3・・・・・・チップコ
ンデンサ、4.24・・・・・・基板、6,26・・・
・・・リード線、6・・・・・・半田、7,27・・・
・・・モールド樹脂、21.23・・・・・・部品、2
6・・・・・・クリーム半田、28・山・・遮蔽板0
1...SO type semiconductor IC12...
Mini-mold transistor, 3... Chip capacitor, 4.24... Substrate, 6, 26...
...Lead wire, 6...Solder, 7,27...
...Mold resin, 21.23...Parts, 2
6... Cream solder, 28. Mountain... Shielding plate 0

Claims (1)

【特許請求の範囲】[Claims] 基板上の所定の位置に高温ハンダをのせ、所定の位置に
各種電子部品を配置し、ハンダ付けすべき箇所にスリッ
トを有する遮蔽板を介して高温ハンダにレーザまたは光
ビームを照射して電子部品を基板上に接続する混成集積
回路装置の製造方法。
High-temperature solder is placed on a predetermined position on the board, various electronic components are placed in the predetermined positions, and the high-temperature solder is irradiated with a laser or light beam through a shielding plate with slits at the locations to be soldered. A method for manufacturing a hybrid integrated circuit device that connects a circuit board to a substrate.
JP28359789A 1989-10-31 1989-10-31 Manufacture of hybrid integrated circuit device Pending JPH03145193A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28359789A JPH03145193A (en) 1989-10-31 1989-10-31 Manufacture of hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28359789A JPH03145193A (en) 1989-10-31 1989-10-31 Manufacture of hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPH03145193A true JPH03145193A (en) 1991-06-20

Family

ID=17667565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28359789A Pending JPH03145193A (en) 1989-10-31 1989-10-31 Manufacture of hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPH03145193A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641174U (en) * 1992-10-30 1994-05-31 ミツミ電機株式会社 Soldering equipment
JP2007201286A (en) * 2006-01-27 2007-08-09 Kyocera Corp Surface-mounting module, and method of manufacturing same
JP2010051989A (en) * 2008-08-27 2010-03-11 Sharp Corp Laser joining method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641174U (en) * 1992-10-30 1994-05-31 ミツミ電機株式会社 Soldering equipment
JP2007201286A (en) * 2006-01-27 2007-08-09 Kyocera Corp Surface-mounting module, and method of manufacturing same
JP2010051989A (en) * 2008-08-27 2010-03-11 Sharp Corp Laser joining method

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