JP2017162846A - Circuit module and method of manufacturing circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive circuit module.SOLUTION: A circuit module 1 includes: a printed board 2; a plurality of surface mount components 3 (3a, 3b, 3c, 3d) mounted on the printed board 2; a plurality of sockets 4 mounted on the printed board 2; and a plurality of insertion mounting components 5 mounted on the printed board 2 via the sockets 4. Each of the insertion mounting components 5 is attached to the printed board 2 by inserting a lead 5b into an insertion hole 4a of each socket 4. Thus, the insertion mounting components 5 are attached to the printed board 2 without soldering.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a circuit module in which a surface mounting component and an insertion mounting component are mounted on the same printed circuit board, and a manufacturing method thereof.

  The components mounted on the printed circuit board include surface mounting components and insertion mounting components. A preflux is applied to the printed circuit board in advance. When a surface mounting component and an insertion mounting component are mixedly mounted on a printed board, post flux is further applied when mounting the insertion mounting component.

  The preflux is used for the purpose of protecting the circuit (pattern) on the surface of the printed circuit board and performing good solder bonding during the reflow process.

  However, in the reflow process, high heat exceeding 200 ° C. is applied to the printed circuit board, which may change the properties of the preflux. Therefore, when the flow process is performed after the reflow process, there is a possibility that good solder bonding cannot be obtained in the flow process. The flow process is a process of performing soldering, for example, by passing the printed circuit board over a molten solder jet. Also, in such a flow process, if the solder of a mounted component that has already been soldered is re-dissolved, the mounted component may be misaligned or standing, and the quality of the printed circuit board may be degraded. It was.

  Therefore, for example, in Patent Document 1, before the step of applying the postflux, the preflux whose compatibility has already deteriorated due to heat during the reflow step is washed and removed, and the postflux directly acts on the circuit on the surface of the printed circuit board. The technique made to do is disclosed.

  Further, in Patent Document 2, by using two types of solder having different melting points in the reflow process and the flow process, the quality of both the soldering of the surface mounting component in the reflow process and the soldering of the insertion mounting component in the flow process is determined. Techniques for improving are disclosed.

JP-A-5-63355 JP 2002-158436 A

  However, the techniques disclosed in Patent Documents 1 and 2 require two kinds of soldering processes, that is, a reflow process and a flow process, and there is a problem that the manufacturing cost increases.

  A circuit module of the present invention includes a printed circuit board, a surface-mounted component joined to the printed circuit board by reflow soldering, a socket joined to the printed circuit board by reflow soldering, and a lead that can be inserted into the socket. And the insertion mounting component is attached to the printed circuit board via the socket.

  The insertion mounting component is a component that generates heat when energized, and the printed circuit board may have an opening formed in a portion facing the insertion mounting component.

  In the method of manufacturing a circuit module according to the present invention, a surface mounting component and an insertion mounting component are joined to the same printed board, and the surface mounting component and the lead of the insertion mounting component are inserted into the printed board. After the socket is joined by reflow soldering, the lead of the insertion mounting component is inserted into the socket, and the insertion mounting component is attached to the printed circuit board.

  In the circuit module manufacturing method of the present invention, the soldering step is only the step of joining the surface mount component and the socket to the printed circuit board by reflow soldering.

  According to the present invention, the surface mounting component and the insertion mounting component can be joined to the same printed circuit board by reflow soldering, and the circuit module can be manufactured at low cost.

Explanatory drawing which showed typically schematic structure of the circuit module which concerns on this invention. Process explanatory drawing which showed typically the manufacture procedure of the circuit module which concerns on this invention.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is an explanatory view schematically showing a schematic configuration of a circuit module 1 according to the present invention.

  The circuit module 1 includes a printed circuit board 2, a plurality of surface mount components 3 (3a, 3b, 3c, 3d) mounted on the printed circuit board 2, a plurality of sockets 4 mounted on the printed circuit board 2, and the socket 4. And a plurality of insertion mounting components 5 mounted on the printed circuit board 2. The surface mount component 3 and the socket 4 are mixedly mounted on the same surface of the printed circuit board 2. That is, the surface mounting component 3 and the insertion mounting component 5 are mixedly mounted on the same surface of the printed circuit board 2.

  The printed circuit board 2 is incorporated in an electrical product or the like for fixing and wiring various components. For example, a copper foil or the like is formed on a base material impregnated with a resin that is insulative to a base material. Circuit (pattern) wiring is performed with a conductor.

  The surface-mounted component 3 is also referred to as SMD (Surface Mount Device), is disposed on a paste-like solder previously applied on the printed circuit board 2, and is soldered to the printed circuit board 2 in a reflow process. Specifically, the surface-mounted component 3 is an electronic component such as an LSI, an IC, a resistor, or a capacitor. Further, examples of the package of the semiconductor chip such as LSI or IC which is the surface mounting component 3 include SOP (Small Outline Package), QFP (Quad Flat Package) and the like. Moreover, as a terminal shape of the semiconductor chip which is the surface mounting component 3, there exists BGA (Ball Grid Array) etc., for example.

  The socket 4 has an insertion port 4a through which an electronic component can be inserted and removed, and is used by being soldered to the printed circuit board 2. Such sockets are classified into a surface mount type and an insertion mount type. In this embodiment, a surface mount type is used. Therefore, the socket 4 is soldered to the printed circuit board 2 in a reflow process for mounting the surface mount component 3 on the printed circuit board 2. In this embodiment, a pair of sockets 4, 4 each having a plurality of insertion openings 4 a are arranged on the printed circuit board 2. Ten insertion mounting components 5 can be mounted by the pair of sockets 4 and 4. The insertion port 4 a is opened at the upper end surface of the socket 4. Since the socket 4 has a predetermined height (thickness), the opening position of the insertion port 4 a is from the surface of the printed circuit board 2 on which the socket 4 is mounted in the thickness direction of the printed circuit board 2. Separate according to the height.

  The socket 4 of this embodiment has ten insertion openings 4a, but the number of insertion openings 4a formed in one socket 4 is not limited to ten. The number can be changed as appropriate according to the number and the like.

  In the reflow process, the circuit module 1 of the present embodiment heats the printed circuit board 2 in a state where the surface mount component 3 and the socket 4 are arranged. That is, in the reflow process of the present embodiment, the solder previously applied to the printed circuit board 2 is melted, and the surface mount component 3 and the socket 4 are electrically and mechanically connected to the printed circuit board 2.

  The insertion mounting component 5 includes a main body 5 a and a pair of leads 5 b and 5 b that extend from the main body 5 a and can be inserted into the socket 4.

  The insertion mounting component 5 is an electronic device that can be soldered to the printed circuit board by so-called flow soldering such as immersing the printed circuit board in a molten jet solder after inserting a lead into a through-hole provided in the printed circuit board in advance. It refers to all parts. Specifically, the insertion mounting component 5 is a resistor having a large rated power, such as a cement resistor or an oxide film resistor.

  However, the insertion mounting component 5 in this embodiment is not soldered by inserting the lead 5b into the through hole, and the socket 5 is inserted by inserting the lead 5b into the insertion port 4a of the socket 4 after the reflow process. It is attached to the printed circuit board 2 via That is, the insertion mounting component 5 in this embodiment is connected to the printed board 2 both electrically and mechanically by inserting the lead 5b into the insertion port 4a of the socket 4.

  The insertion port 4a of the socket 4 into which the lead 5b of the insertion mounting component 5 is inserted opens at a position spaced from the mounting surface of the printed board 2 in the thickness direction of the printed board 2. Therefore, the insertion mounting component 5 is mounted on the printed circuit board 2 with the main body 5 a being separated from the mounting surface of the printed circuit board 2. Therefore, even if the insertion mounting component 5 is a cement resistor or a metal oxide film resistor that generates heat when energized, the printed circuit board 2 can be protected from the heat of the insertion mounting component 5.

  Further, in the printed circuit board 2 of the present embodiment, a hole-like opening 6 is formed through the portion facing the insertion mounting component 5. The opening 6 in the present embodiment is formed between the sockets 4 and 4.

  FIG. 2 is a process explanatory view schematically showing a manufacturing procedure of the circuit module 1 according to the present invention.

  In step 1, solder 11 is applied to a predetermined position on the printed board 2. The solder 11 can be a general reflow solder, a lead-free solder, or the like.

  In step 2, which is the next step of step 1, the surface mount component 3 and the socket 4 are arranged at predetermined positions on the printed circuit board 2. In step 3, which is the next step of step 2, the entire printed circuit board 2 is heated to melt the solder 11, and the surface mount component 3 and the socket 4 are fixed in place by the solder 11. This step 3 is fixing corresponding to a so-called reflow step, and the surface mount component 3 and the socket 4 are soldered to the printed circuit board 2. In step 4, which is the next step of step 3, the lead 5 b of the insertion mounting component 5 is inserted into the socket 4 fixed to the printed circuit board 2 in step 3, and the insertion mounting component 5 is mounted on the printed circuit board 2. That is, the circuit module 1 performs only one reflow process as a soldering process.

  As described above, the circuit module 1 according to the present embodiment can mount the surface mounting component 3 and the insertion mounting component 5 on the same printed circuit board 2 by only one reflow process as a soldering process. . Therefore, the circuit module 1 can be manufactured at a low cost.

  In addition, since the insertion mounted component 5 is fixed by the socket 4, the circuit module 1 can prevent a short circuit due to the fall of the inserted mounted component 5.

  And since the opening part 6 is formed in the part facing the main body 5a of the insertion mounting component 5, the printed circuit board 2 of the circuit module 1 can improve the thermal radiation environment of the insertion mounting component 5. FIG. That is, the printed circuit board 2 is configured to be hardly affected by the heat from the insertion mounting component 5 by the opening 6 even if the insertion mounting component 5 is an electronic component having a large calorific value. Moreover, by providing the opening 6, the material used for the printed circuit board 2 can be relatively reduced, and the weight can be reduced and the cost can be reduced.

  Further, in the circuit module 1 of the present embodiment, since the insertion mounting component 5 is attached to the printed circuit board 2 via the socket 4, the insertion mounting component 5 and the printed circuit board 2 are not directly joined by soldering. At the time of the reflow process, the reliability of joining by soldering of both is not lowered. In detail, since there is no mounting component soldered before the reflow process, distortion occurs due to the difference in linear expansion coefficient between the mounting component already soldered and the printed circuit board during the reflow process, and the soldering has already been performed. The reliability of bonding between the mounted component and the printed circuit board by soldering does not deteriorate.

  The printed circuit board 2 of the above-described embodiment has the surface mounting component 3 and the insertion mounting component 5 mounted on only one side. However, in the present invention, the surface mounting component 3 and the insertion mounting component 5 are mounted on both surfaces of the printed circuit board 2. It is also applicable to what is done. Further, a multilayer board can be adopted as the printed board 2.

  The opening 6 of the printed circuit board 2 can be omitted. That is, in the printed circuit board 2 of the circuit module 1 of the above-described embodiment, the opening 6 may not be formed in a portion facing the main body 5a of the insertion mounted component 5.

DESCRIPTION OF SYMBOLS 1 ... Circuit module 2 ... Printed circuit board 3 ... Surface mount component 4 ... Socket 4a ... Insert port 5 ... Insert mount component 5a ... Main body 5b ... Lead 6 ... Opening part 11 ... Solder

Claims (4)

A printed circuit board,
Surface mount components joined to the printed circuit board by reflow soldering;
A socket joined to the printed circuit board by reflow soldering;
An insertion mounting component having a lead that can be inserted into the socket;
The circuit module, wherein the insertion mounting component is attached to the printed circuit board via the socket. The insertion mounting component is a component that generates heat when energized,
The circuit module according to claim 1, wherein the printed circuit board has an opening formed in a portion facing the insertion mounting component. In the manufacturing method of the circuit module formed by joining the surface mounting component and the insertion mounting component to the same printed circuit board,
After the surface mount component and the socket into which the lead of the insert mount component is inserted are joined to the printed board by reflow soldering, the lead of the insert mount component is inserted into the socket and the insert mount component is attached to the print board. A method of manufacturing a circuit module, wherein the circuit module is attached to a circuit board.   4. The method of manufacturing a circuit module according to claim 3, wherein the soldering step is only a step of joining the surface mount component and the socket to the printed board by reflow soldering.

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