JPH0787266B2 - Soldering device - Google Patents

Soldering device

Info

Publication number
JPH0787266B2
JPH0787266B2 JP12101088A JP12101088A JPH0787266B2 JP H0787266 B2 JPH0787266 B2 JP H0787266B2 JP 12101088 A JP12101088 A JP 12101088A JP 12101088 A JP12101088 A JP 12101088A JP H0787266 B2 JPH0787266 B2 JP H0787266B2
Authority
JP
Japan
Prior art keywords
soldering
solder
lead
circuit board
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP12101088A
Other languages
Japanese (ja)
Other versions
JPH01290293A (en
Inventor
久夫 大門
勝利 開
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP12101088A priority Critical patent/JPH0787266B2/en
Publication of JPH01290293A publication Critical patent/JPH01290293A/en
Publication of JPH0787266B2 publication Critical patent/JPH0787266B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 本発明は回路基板の組立工程における、リード部品を半
田付けするための半田付け装置に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering device for soldering lead parts in a circuit board assembling process.

従来の技術 近年、電子機器の小型化に伴ない、回路部品の構成も、
たとえば、半導体集積回路装置（以下、ICと記す）は、
リードタイプから面実装型のフラットパッケージを使用
し、また、抵抗，コンデンサ等も、リードタイプからチ
ップ構造の部品に変わりつつある。しかし、一方で、回
路の要求においては、従来のリード型の部品を使用しな
くてはならない時もある。このような状況において、回
路基板の組立の半田付け工程においても、従来の溶融半
田槽を使ったディップ方式による半田付け方法と、リフ
ロー炉による半田ペーストの溶融による半田付け方法と
を並用して使う場合もある。ここで、ディップ方式によ
る半田付けは、リード部品のリードを回路基板に半田付
けする際に用いられる。また、リフロー方式による半田
付けは、チップ部品，面実装型フラットパッケージICの
リードを回路基板に半田付けする際に用いられる。2. Description of the Related Art In recent years, with the miniaturization of electronic devices, the configuration of circuit parts has become
For example, a semiconductor integrated circuit device (hereinafter referred to as IC) is
The lead type is used instead of the surface mount type flat package, and the resistors and capacitors are changing from the lead type to the chip structure parts. However, on the other hand, there are times when the conventional lead-type components must be used in order to meet the requirements of the circuit. In such a situation, also in the soldering process of assembling the circuit board, the conventional dipping method using the molten solder bath and the soldering method using the melting of the solder paste in the reflow furnace are used in parallel. In some cases. Here, the soldering by the dip method is used when soldering the leads of the lead component to the circuit board. Further, the reflow soldering is used when soldering chip components and leads of a surface mounting type flat package IC to a circuit board.

前記のような、リード部品とチップ部品，面実装型フラ
ットパッケージICを構成部品として扱った回路基板の従
来の組立方法について以下に述べる。A conventional method of assembling a circuit board that handles lead components, chip components, and surface-mounted flat package ICs as components as described above will be described below.

まず、チップ部品、もしくは面実装型フラットパッケー
ジICの搭載される回路基板上の半田付パターンに、半田
ペーストが塗布される。その後基板上に前記の部品が搭
載され、半田リフローにより、部品が半田付される。つ
ぎに、同基板にリード部品が挿入配置され、今度はリー
ド部品のリード部分を半田付けする。このリード部品の
半田付けにおいては、溶融半田槽へのディップ方式が用
いられ、回路基板にリード部品のリード部が半田付けさ
れることになる。この時は、回路基板の面全体が溶融半
田槽の半田面に接触し、基板上ですでに半田付けされた
ICや、チップ部品の半田付け部が、加熱により再溶融す
ることになる。First, a solder paste is applied to a soldering pattern on a chip component or a circuit board on which a surface mounting type flat package IC is mounted. After that, the above components are mounted on the substrate, and the components are soldered by solder reflow. Next, the lead parts are inserted and arranged on the same board, and the lead parts of the lead parts are soldered this time. In the soldering of the lead components, a dipping method into a molten solder bath is used, and the lead parts of the lead components are soldered to the circuit board. At this time, the entire surface of the circuit board came into contact with the solder surface of the molten solder bath and was already soldered on the board.
The soldering parts of the IC and chip parts will be remelted by heating.

発明が解決しようとする課題 しかしながら上記の従来技術では、前工程で半田付けさ
れた、面実装型フラットパッケージICや、チップ部品の
半田付け部分が、２度目の溶融半田接触により、半田の
再溶融をおこしてしまい、部品のはずれや、ICではリー
ド間の半田付けショートが発生するという問題があっ
た。本発明は上記従来の問題を解決するもので、前工程
で半田付けされた部品の半田付け部分を２度目の半田付
けの接触を行なわずにすむことを目的とする。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in the above-mentioned conventional technique, the soldering portion of the surface mounting type flat package IC or the chip component soldered in the previous step is remelted by the second molten solder contact. As a result, there is a problem in that the parts come off and the IC causes a soldering short circuit between the leads. The present invention solves the above-mentioned conventional problem, and an object of the present invention is to avoid the soldering portion of the component soldered in the previous step without making a second soldering contact.

課題を解決するための手段 この目的を達成するため、本発明の半田付け装置は耐溶
融半田（液）性を有するマスク板に、半田付けに必要な
部分のみに開口部を設けて、すでに半田付けされた部品
の半田付け部分はマスクによって、半田接触を防ぐよう
な構造にしている。Means for Solving the Problem In order to achieve this object, the soldering apparatus of the present invention has a mask plate having resistance to molten solder (liquid), in which an opening is provided only in a portion necessary for soldering, and the soldering is already performed. The soldered portion of the attached component is structured to prevent solder contact with a mask.

作用 この構造によって、すでに半田付けされた部品の半田付
部分が半田接触を受けずにすみ、部品のはずれ，部品の
リード間の半田付けショートを防ぐことができる。By this structure, the soldered portion of the already soldered component can be prevented from receiving solder contact, and the component can be prevented from coming off and the soldering short circuit between the leads of the component can be prevented.

実施例 以下本発明の一実施例について、図面を参照しながら説
明する。図面は本発明の実施例における、半田付け装置
のマスク板の断面図を示すものである。図において、１
は溶融半田（液）、２は半田付けマスク板、３は部品を
搭載するための回路基板、４は搭載部品である面実装型
フラットパッケージIC、５はチップ抵抗、６はチップコ
ンデンサ、７はリード部品、８はリード部品のリード部
分、９は面実装型フラットパッケージICのリード部分、
10は半田付マスクの開口部、11は部品の半田付け部分で
ある。Embodiment An embodiment of the present invention will be described below with reference to the drawings. The drawing shows a cross-sectional view of a mask plate of a soldering device in an embodiment of the present invention. In the figure, 1
Is molten solder (liquid), 2 is a soldering mask plate, 3 is a circuit board for mounting components, 4 is a surface mounting type flat package IC which is a mounting component, 5 is a chip resistor, 6 is a chip capacitor, and 7 is Lead parts, 8 lead parts of lead parts, 9 lead parts of surface mount type flat package IC,
Reference numeral 10 is an opening of the soldering mask, and 11 is a soldering portion of the component.

まず回路基板３に半田ペーストが半田付パターン上に塗
布され、次に面実装型フラットパッケージIC4,チップ抵
抗5,チップコンデンサ６が基板上に配置され、リフロー
方式による加熱により、前記の半田ペーストを溶融させ
て、部品の半田付けを行なう。これにより、前記の面実
装型フラットパッケージIC4,チップ抵抗5,チップコンデ
ンサ６が固定され、また電気的接続がなされる。First, the circuit board 3 is applied with the solder paste on the soldering pattern, then the surface mount type flat package IC 4, the chip resistor 5 and the chip capacitor 6 are placed on the board, and the solder paste is heated by the reflow method to remove the solder paste. Melt and solder parts. As a result, the surface mount type flat package IC 4, the chip resistor 5 and the chip capacitor 6 are fixed and electrically connected.

次に同じく回路基板３にリード部品７が挿入される。こ
こで、半田付けマスク板２の上面に回路基板３を乗せ
る。この時半田付けマスク板２において、リード部品７
のリード部分８が接触する部分には開口部10が設けられ
ている。次に回路基板３を乗せた半田付けマスク板２
を、溶融半田１へ接触させる。この溶融半田１へ接触す
ると、半田付けマスク板２の開口部10へ溶融半田１が上
方へ噴きあがり、リード部分８へ半田付けがなされるの
である。この時、面実装型フラットパッケージICのリー
ド部分９については、半田付けマスク板２により、半田
の浸入を防ぐようにしてあるため、溶融半田１が接触す
ることはない。またこの半田付け部分11の温度は100℃
程度しか上昇せず、半田が再溶融することはない。以上
のように本実施例によれば、半田付けマスク板２を使う
ことにより、半田付けマスク板２の開口部10のみに半田
付けがなされ、半田付に不必要な部分は、半田付けマス
ク板２でおおうことにより、溶融半田１との接触を防ぐ
ことができる。Next, the lead component 7 is similarly inserted into the circuit board 3. Here, the circuit board 3 is placed on the upper surface of the soldering mask plate 2. At this time, in the soldering mask plate 2, the lead component 7
An opening 10 is provided at a portion where the lead portion 8 comes into contact. Next, the soldering mask plate 2 on which the circuit board 3 is placed
To the molten solder 1. When the molten solder 1 is brought into contact with the molten solder 1, the molten solder 1 is jetted upward into the opening 10 of the soldering mask plate 2 to be soldered to the lead portion 8. At this time, since the solder mask plate 2 prevents the solder from entering the lead portion 9 of the surface-mounted flat package IC, the molten solder 1 does not come into contact with the lead portion 9. The temperature of this soldering part 11 is 100 ° C.
It rises only to the extent that the solder does not remelt. As described above, according to this embodiment, by using the soldering mask plate 2, only the opening 10 of the soldering mask plate 2 is soldered, and unnecessary portions for soldering are soldered mask plate. By covering with the molten solder 1, it is possible to prevent contact with the molten solder 1.

発明の効果 以上のように、本発明によれば、半田付けマスク板を用
いることにより、前工程で半田付けされた部品の半田付
部分が溶融半田の接触を受けずにすみ、したがって、予
め回路基板に半田付けされた部品のはずれや、リード間
の半田付けショートを防ぐという効果が得られる。EFFECTS OF THE INVENTION As described above, according to the present invention, by using the soldering mask plate, the soldered portion of the component soldered in the previous step does not have to be contacted with the molten solder, and therefore, the circuit is previously prepared. The effect of preventing the detachment of the components soldered to the board and the soldering short circuit between the leads can be obtained.

【図面の簡単な説明】[Brief description of drawings]

図は本発明の一実施例装置における半田付けマスク板の
使用例を示す断面図である。 １……溶融半田、２……半田付けマスク板、３……回路
基板、４……面実装型フラットパッケージIC、５……チ
ップ抵抗、６……チップコンデンサ、７……リード部
品、８……リード部分、９……面実装型フラットパッケ
ージICのリード部分、10……開口部、11……半田付け部
分、12……溶融半田槽。The drawing is a cross-sectional view showing an example of use of a soldering mask plate in an apparatus according to an embodiment of the present invention. 1 ... Molten solder, 2 ... Solder mask plate, 3 ... Circuit board, 4 ... Surface mount type flat package IC, 5 ... Chip resistor, 6 ... Chip capacitor, 7 ... Lead component, 8 ... … Lead part, 9 …… Lead part of surface mounting type flat package IC, 10 …… Opening part, 11 …… Soldering part, 12 …… Melting solder bath.

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】溶融半田により熱的破壊されないマスク板
と、前記のマスク板の一部に半田の浸入を可能にした開
口部とをそなえ、回路基板ならびに同回路基板上にすで
に半田付された部品の半田付部分への溶融半田接触を防
ぐようにしゃへいした構造を有して必要な部分のみを半
田付可能にした半田付け装置。1. A circuit board and a circuit board and the same circuit board already soldered, comprising a mask plate which is not thermally destroyed by molten solder and an opening through which solder can penetrate into a part of the mask plate. A soldering device that has a structure in which it is shielded to prevent molten solder from contacting the soldered part of a component, and can solder only the necessary part.
JP12101088A 1988-05-18 1988-05-18 Soldering device Expired - Lifetime JPH0787266B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12101088A JPH0787266B2 (en) 1988-05-18 1988-05-18 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12101088A JPH0787266B2 (en) 1988-05-18 1988-05-18 Soldering device

Publications (2)

Publication Number Publication Date
JPH01290293A JPH01290293A (en) 1989-11-22
JPH0787266B2 true JPH0787266B2 (en) 1995-09-20

Family

ID=14800562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12101088A Expired - Lifetime JPH0787266B2 (en) 1988-05-18 1988-05-18 Soldering device

Country Status (1)

Country Link
JP (1) JPH0787266B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536302Y2 (en) * 1988-06-11 1993-09-14
JPH0666544B2 (en) * 1988-06-11 1994-08-24 太陽誘電株式会社 Circuit board manufacturing method
US5148961A (en) * 1991-12-23 1992-09-22 Motorola, Inc. Selective wave solder apparatus
DE19618227A1 (en) * 1996-05-07 1997-11-13 Herbert Streckfus Gmbh Method and device for soldering electronic components on a printed circuit board
CN108135098A (en) * 2018-01-10 2018-06-08 格力电器（石家庄）有限公司 It is a kind of to cross tin carrier, welder and welding method

Also Published As

Publication number Publication date
JPH01290293A (en) 1989-11-22

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