CN108135098A - It is a kind of to cross tin carrier, welder and welding method - Google Patents
It is a kind of to cross tin carrier, welder and welding method Download PDFInfo
- Publication number
- CN108135098A CN108135098A CN201810024260.0A CN201810024260A CN108135098A CN 108135098 A CN108135098 A CN 108135098A CN 201810024260 A CN201810024260 A CN 201810024260A CN 108135098 A CN108135098 A CN 108135098A
- Authority
- CN
- China
- Prior art keywords
- welded
- circuit board
- tin
- power module
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 125
- 238000003466 welding Methods 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000005476 soldering Methods 0.000 claims abstract description 60
- 230000008569 process Effects 0.000 claims abstract description 29
- 239000000843 powder Substances 0.000 claims description 15
- 239000011800 void material Substances 0.000 claims description 10
- 210000000078 claw Anatomy 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 13
- 239000002699 waste material Substances 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 3
- 239000000969 carrier Substances 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000012795 verification Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of tin carrier, welder and welding method, carriers crossed to include：Fixation kit and shutter (5)；Wherein, the fixation kit is used to form accommodating space, and circuit board to be welded is fixed in the accommodating space；The shutter (5), is set in the accommodating space, for during wave soldering is carried out to the circuit board to be welded, blocking backing run element and/or the corresponding pad locations of power module in the circuit board to be welded.The solution of the present invention for backing run element and/or power module, can overcome in the prior art the defects of mainboard is yielding, operating process is cumbersome and wastes high tempreture tape, realize that mainboard is unlikely to deform, operating process is succinct and the advantageous effect of saving high tempreture tape.
Description
Technical field
The invention belongs to welding technology fields, and in particular to a kind of tin of crossing for backing run element and/or power module carries
Tool, welder and welding method more particularly to a kind of novel used tin of production welding technique of convertible frequency air-conditioner mainboard power module
There is this to cross the welder of tin carrier and cross the welding method that tin carrier welded using this for carrier.
Background technology
At present, rectifier bridge, diode, IGBT (the Insulated Gate Bipolar of the outer mainboard of air-conditioning frequency conversion
Transistor, insulated gate bipolar transistor), the work(such as IPM (Intelligent Power Module, intelligent power module)
Rate module needs to paste high tempreture tape to the pad locations of these elements before wave-soldering, tears high tempreture tape again after wave-soldering, use
Manual welding or selection Welding welding.Wherein, Welding is selected, can utilize the work that Wave soldering apparatus is selected to be welded
Skill can replace manual welding.
Due to having welded power module so that the width of the outer mainboard of air-conditioning frequency conversion increases to 189.8mm by 169mm, increases
Add 20mm.Moreover, after crossing wave-soldering, mainboard deformation is serious, will appear tin report even if using in the case of gear tin bar
It is useless；In addition, it is bad to may also result in tin on the element of board edges.
In the prior art, there are the defects of mainboard is yielding, operating process is cumbersome and wastes high tempreture tape.
Invention content
It is an object of the present invention in view of the foregoing drawbacks, a kind of tin carrier, welder and welding method excessively are provided, with
Solve the problems, such as that external convertible frequency air conditioner mainboard mainboard after wave soldering is crossed is yielding in the prior art, reaches mainboard and is unlikely to deform
Effect.
Present invention offer is a kind of to cross tin carrier, including：Fixation kit and shutter；Wherein, the fixation kit, for shape
It is fixed in the accommodating space into accommodating space, and by circuit board to be welded；The shutter is set to the accommodating space
In, for during wave soldering is carried out to the circuit board to be welded, blocking backing run member in the circuit board to be welded
Part and/or the corresponding pad locations of power module.
Optionally, it further includes：Cross tin hole and void region；It is described to cross tin hole and the void region, it is set to the appearance
Other regions between emptying in addition to region residing for the shutter；Wherein, it is described to cross tin hole, for described to be welded
During circuit board carries out wave soldering, scolding tin is made to flow into the corresponding welding hole of the circuit board to be welded；The vacancy section
Domain, for during wave soldering is carried out to the circuit board to be welded, exposing the component that needs expose.
Optionally, it is described to cross tin hole, including：First tin hole, second excessively crosses at least one of tin hole；The vacancy section,
Including：At least one of first vacancy section, the second vacancy section；Wherein, described first tin hole and first vacancy section are crossed,
With setting；Described second crosses tin hole and second vacancy section, matching setting.
Optionally, it further includes：At least one of grip part, moving assembly；Wherein, the grip part, close to the screening
Baffle and be arranged on the fixation kit, for pick and place it is described cross tin carrier when grasp；The moving assembly, far from described
Shutter and the outside or bottom for being arranged on the fixation kit, for moving the tin carrier excessively.
Optionally, wherein, the grip part, including：The groove being arranged on the fixation kit, and the groove is interior
Wall surface is arcwall face；And/or the quantity of the grip part is at least a pair of；At least a pair of grip part, is symmetrically disposed on institute
It states on fixation kit；And/or the moving assembly, including：At least one of chain claw, guide rail, conveyer belt moving member；It is described
The quantity of moving member is two；Two moving members are symmetrically disposed on the outside or bottom of the fixation kit.
Optionally, the fixation kit, including：Bottom plate and fixed card buckle；Wherein, the bottom plate, structure in the shape of a frame, is used for
Form the accommodating space；The fixed card buckle is arranged in the frame like structure, for fixing the circuit board to be welded.
Optionally, the quantity of the fixed card buckle is six；Six fixed card buckles, close to the shutter and right
Title is arranged on a pair of of frame of the frame like structure.
Optionally, the fixation kit, further includes：Keep off tin bar；The gear tin bar, is correspondingly arranged at the frame like structure
Outside, and the height of the gear tin bar is higher than the height of the frame like structure, for the circuit board to be welded into traveling wave
During peak welds, block that scolding tin is excessive or spluttering.
Matching with above-mentioned tin carrier of crossing, another aspect of the present invention provides a kind of welder, including：Above-described mistake
Tin carrier.
Match with above-mentioned welder, further aspect of the present invention offer is a kind of to be carried out using above-described welder
The welding method of welding, including：Using the welder, backing run element and/or power in the circuit board to be welded are blocked
The corresponding pad locations of module；Wave soldering is carried out to the circuit board to be welded；After the completion of the wave soldering, remove described
Welder welds the backing run element and/or the power module.
Optionally, wherein, wave soldering is carried out to the circuit board to be welded, including：When the welder further includes
During moving assembly, according to the width of moving assembly described in the width adjusting of the fixation kit；And/or adjust the wave-soldering
Welding inclination angle in termination process makes the crossbeam angle during the wave soldering be adjusted in 5~7 degree；And/or adjust institute
State the scaling powder nozzle and air valve during wave soldering, make the circuit board to be welded welding surface be evenly coated with needed for
The scaling powder of thickness and the scaling powder is made to flow into the PCB plate through hole on the circuit board to be welded at corresponding welding position；
And/or the backing run element and/or the power module are welded, including：By the backing run element and/or the work(
Rate module is inserted at backing run element described in the circuit board to be welded and/or the corresponding pad locations of the power module,
The backing run element and/or the power module are fixed using preset fixed high and positioning tool, and is determined described fixed high and fixed
After the positioning column of position tooling is adjacent to the circuit board to be welded, the pin of the backing run element and/or the power module is welded
It is connected on the circuit board to be welded.
The solution of the present invention, by the welding process to external convertible frequency air conditioner mainboard power module, using blocking work(
Rate module position crosses tin carrier, can solve mainboard problem on deformation, reach the on-deformable effect of mainboard.
Further, by using the tin carrier excessively for blocking power module position, it is high can also to cancel patch for the solution of the present invention
Warm gummed paper, the process for tearing high tempreture tape, simplify operating process.
Further, the solution of the present invention, by using the tin carrier excessively for blocking power module position, it is thus also avoided that using high
Warm gummed paper, has saved high tempreture tape, reduces cost.
The solution of the present invention as a result, by setting the tin carrier excessively for blocking power module position, solves the prior art
Middle external convertible frequency air conditioner mainboard mainboard is yielding after crossing wave soldering the problem of, so as to, overcome in the prior art mainboard it is variable
Shape, operating process be cumbersome and the defects of waste high tempreture tape, realizes that mainboard is unlikely to deform, operating process is succinct and saves high-temp glue
The advantageous effect of paper.
Other features and advantages of the present invention will be illustrated in the following description, also, partly becomes from specification
It obtains it is clear that being understood by implementing the present invention.
Below by drawings and examples, technical scheme of the present invention is described in further detail.
Description of the drawings
Fig. 1 is the structure diagram of the embodiment for crossing tin carrier of the present invention；
Fig. 2 is the structure diagram of an embodiment of mainboard crossed tin carrier and welded using the present invention；
Fig. 3 is the process flow chart of an embodiment welded using high tempreture tape；
Fig. 4 is the process flow chart of an embodiment of the welding method of the present invention.
With reference to attached drawing, reference numeral is as follows in the embodiment of the present invention：
1- gears tin bar (for keeping off tin)；2- bottom plates；3- chain claws (for being moved through tin carrier)；4- fixed card buckles are (for solid
Determine pcb board)；5- shutters (for blocking power module)；The tin holes excessively of 6- first (such as：First occlusion area)；7- first is engraved
Dead zone；The tin holes excessively of 8- second (such as：Second occlusion area)；The second vacancy sections of 9-；10- grip parts.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the specific embodiment of the invention and
Technical solution of the present invention is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the present invention one
Section Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Go out all other embodiments obtained under the premise of creative work, shall fall within the protection scope of the present invention.
In one embodiment, welding procedure as shown in Figure 3 can include：Patch high tempreture tape, is torn at wave soldering
High tempreture tape and power module welding.The welding procedure, can complete the welding of power module on convertible frequency air-conditioner mainboard, but also deposit
In following shortcoming：
(1) technological process is more complicated, and needing, which increases PCB (Printed Circuit Board, printed circuit board), has enough to meet the need.
Such as：High tempreture tape is pasted, then carry out patch patch by SMT (Surface Mount Technology, surface mounting technology) workshop
Dress after crossing wave-soldering, needs to tear high tempreture tape again.Pasting high tempreture tape process increases a PCB turnover.
(2) high tempreture tape is wasted, and the high tempreture tape torn belongs to harmful influence waste product, it is also necessary to special disposal.
(3) the upper tin of the serious appearance of mainboard deformation is scrapped；
(4), there are hidden danger of quality, tin is bad on the element of board edges.Such as：Since pcb board deforms, cause near chain claw
Element wicking it is shallow, and then can go up that tin is bad, and hidden danger of quality refers to that tin is bad.
According to an embodiment of the invention, provide it is a kind of cross tin carrier, the present invention crosses the one real of tin carrier as shown in Figure 1
Apply the structure diagram of example.This, which crosses tin carrier, to include：Fixation kit and shutter 5.
In an optional example, the fixation kit can be used for forming accommodating space, and circuit board to be welded consolidated
It is scheduled in the accommodating space.
Optionally, the fixation kit can include：Bottom plate 2 and fixed card buckle 4.
In an optional specific example, the bottom plate 2, structure in the shape of a frame can be used for forming the accommodating space.
In an optional specific example, the fixed card buckle 4 is arranged in the frame like structure, can be used for fixing
The circuit board to be welded.
Accommodating space is formed by bottom plate as a result, circuit board to be welded is fixed by fixed card buckle, simple in structure, operation
It is convenient, and reliability is high.
More optionally, the quantity of the fixed card buckle 4 is six.Six fixed card buckles 4, the close shutter 5,
And it is symmetricly set on a pair of of frame of the frame like structure.
As a result, by symmetrically arranged six fixed card buckles, can be promoted treat the fixed reliability of soldered circuit board and
Safety, and then the efficiency and effect for treating soldered circuit board welding can be promoted.
Optionally, the fixation kit can also include：Keep off tin bar 1.
It is described to keep off tin bar 1 in an optional specific example, the outside of the frame like structure is correspondingly arranged at, and described
The height for keeping off tin bar 1 is higher than the height of the frame like structure, can be used for carrying out wave soldering to the circuit board to be welded
During, block that scolding tin is excessive or spluttering.
Such as：The gear tin bar 1, in strip frame.The strip frame is correspondingly arranged at the outer of the frame like structure
Side, and the height of the strip frame be higher than the frame like structure height, can be used for the circuit board to be welded into
During row wave soldering, block that scolding tin is excessive or spluttering.
Scolding tin is blocked by keeping off tin bar as a result, can be promoted and treated during soldered circuit board welded, scolding tin is not
Excessive or spluttering, ensure that the safety of welding process, also avoids scolding tin excessive or spluttering is treated soldered circuit board and damaged.
In an optional example, the shutter 5 is set in the accommodating space, can be used for treating to described
During soldered circuit board carries out wave soldering, backing run element and/or power module pair in the circuit board to be welded are blocked
The pad locations answered.
Such as：A kind of tin carrier excessively for blocking power module position is developed, mainboard problem on deformation can be not only solved, may be used also
With the process cancelled patch high tempreture tape, tear high tempreture tape.
It is housed as a result, by fixation kit and fixes circuit board to be welded, and pass through shutter during wave soldering
Fold the corresponding welding position of power module so that mainboard is unlikely to deform, and also as save high temperature paster, is eliminated patch, is torn high temperature
The process of gummed paper.
Optionally, the circuit board to be welded, can include：External convertible frequency air conditioner mainboard to be welded.
It, can be with as a result, by the way that tin carrier in the welding process of external convertible frequency air conditioner mainboard, was used to substitute high temperature paster
Ensure the welding efficiency and welding quality of external convertible frequency air conditioner mainboard, and save material, save operational sequence.
Optionally, the power module can include：At least one of rectifier bridge, diode, IGBT, IPM.
The power module of diversified forms is blocked by using tin carrier excessively as a result, circuit to be welded can be protected
The corresponding welding position of on-board power module, so as to protect circuit board to be welded, so that the welding effect of circuit board to be welded
Rate and welding effect are ensured.
In an optional embodiment, it can also include：Cross tin hole and void region.It is described to cross tin hole and the hollow out
Region is set to other regions in addition to region residing for the shutter 5 in the accommodating space.
It is described to cross tin hole in an optional example, it can be used for carrying out wave soldering to the circuit board to be welded
During, scolding tin is made to flow into the corresponding welding hole of the circuit board to be welded.
Wherein, it is described to cross tin hole, can be occlusion area relative to the void region.
In an optional example, the void region can be used for carrying out wave-soldering to the circuit board to be welded
During connecing, expose the component that needs expose.
As a result, by setting tin hole and void region, welding component progress can be treated during wave soldering
It reliably and securely welds, and can ensure welding effect.
Optionally, it is described to cross tin hole, it can include：First, which crosses tin hole 6, second, crosses at least one of tin hole 8.It is described to engrave
Dead zone can include：At least one of first vacancy section 7, the second vacancy section 9.
Wherein, described first tin hole 6 and first vacancy section 7, matching setting are crossed.Described second crosses tin hole 8 and described
Second vacancy section 9, matching setting.
It, can be during wave soldering to multiple members to be welded as a result, by setting multiple tin hole and void regions excessively
Device is welded, and improves flexibility and the reliability of welding.
In an optional embodiment, it can also include：At least one of grip part 10, moving assembly.
In an optional example, the grip part 10 close to the shutter 5 and is arranged on the fixation kit,
It can be used for grasping when picking and placeing the tin carrier excessively.
Optionally, the grip part 10, can include：It is arranged on the fixation kit and meets human finger work
The groove of structure is learned, and the internal face of the groove is arcwall face.
As a result, by setting grip part, personnel easy to operation grasp, improve the convenience for picking and placeing tin carrier, also carry
The efficiency that tin carrier was picked and placeed in welding process has been risen, and then has been conducive to promote welding efficiency.
Optionally, the quantity of the grip part 10 is at least a pair of.At least a pair of grip part 10, is symmetrically disposed on institute
It states on fixation kit.Such as：At least a pair of grip part 10, is symmetrically disposed on an opposite side of the fixation kit.
As a result, by being arranged in pairs grip part so that the stability and reliability of grasping can be protected, so as to
To ensure to pick and place the safety of tin carrier in welding process.
In an optional example, the moving assembly far from the shutter 5 and is arranged on the fixation kit
Outside or bottom can be used for the mobile tin carrier excessively.
Tin carrier is moved through by moving assembly as a result, so that can be needed in welding process according to welding flexibly mobile
Tin carrier is crossed, is conducive to be promoted the convenience and versatility of welding.
Optionally, the moving assembly can include：At least one of chain claw 3, guide rail, conveyer belt moving member.It is described
The quantity of moving member is two.Two moving members are symmetrically disposed on the outside or bottom of the fixation kit.Such as：Two
A chain claw 3 is symmetrically disposed on the outside of an opposite side of the fixation kit.
As a result, by the moving assembly of diversified forms, mobile flexibility and convenience are improved.
Through a large amount of verification experimental verification, using the technical solution of the present embodiment, by external convertible frequency air conditioner mainboard power
In the welding process of module, using the tin carrier excessively for blocking power module position, mainboard problem on deformation can be solved, reaches mainboard
On-deformable effect.
According to an embodiment of the invention, additionally provide corresponding to tin carrier a kind of welder.The welder can
To include：It is above-described to cross tin carrier.
In an optional embodiment, for the big plate of machine outside frequency conversion cross problem on deformation after wave-soldering (there are failure welding,
The problems such as upper tin is scrapped), propose new solution：A kind of tin carrier excessively for blocking power module position is developed, can not only be solved
Certainly mainboard problem on deformation, the process for patch high tempreture tape can also be cancelled, tearing high tempreture tape.
In an optional example, using the tin carrier excessively for blocking power module position, to external convertible frequency air conditioner mainboard work(
The technological process that rate module is welded may refer to example shown in Fig. 4.
The technological process welded below to external convertible frequency air conditioner mainboard power module is specifically described.
Step 1 lets off tin carrier.
It is alternatively possible to inserting first post of section in hand lets off tin carrier.
Step 2, wave soldering.
It is alternatively possible to suitably adjust the width of conveying according to the size of adjustable carrier, ensure the elastic conjunction of carrier
It is suitable.Adjusting welding inclination angle (such as：Orbit inclination angle), wave-soldering crossbeam angle is adjusted in 5~7 degree, specifically good with welding quality
It is advisable.Scaling powder nozzle and air valve are adjusted, the welding surface of mainboard is made equably, to be significantly coated with a thin layer of scaling powder, and
Scaling powder should enter in the through-hole of pcb board.
Optionally, according to the size of different mainboards and component size, tightness degree, preheating temperature and tin stove are adjusted
Temperature adjusts crest height and tin mouth flow, makes that welding is abundant, solder joint is full.
Optionally, after links adjustment is stablized, observation, analysis welding situation can be mass after meeting the requirements.
Step 3 removed tin carrier.
Optionally, after mainboard crosses wave-soldering, tin carrier was removed, effect (backing run similar with high tempreture tape is pasted can be reached
Not upper tin in component hole).
Step 4, module welding.
Rectifier bridge, diode, IGBT, IPM constant power module are inserted, determines high positioning tool constant power mould using module
Block.After checking that the positioning column of tooling is adjacent to plate face, the pin of manual welding (or selection wave-soldering) power module will be main after being soldered
Plate is positioned on assembly line.
In step 4, some points for attention are as follows：
1. it must assure that the positioning column of tooling is close to plate face after fixed high positioning.
2. tooling is using preceding having to check for, whether tooling is correct, whether have the screw of damage, tooling everywhere to fix good
Whether whether suitable, tooling and IPM contact surfaces have the foreign matters such as rosin to good, tool locating column height.
3. soldering iron must use constant-temperature soldering iron, the temperature of soldering iron is 390 ± 10 DEG C.
4. welding, which must assure that in the hole of module soldering pads, fills out tin 100%.
Further, cancel high tempreture tape and through step 1 to the soldered frequency conversion of step 4 to using tin carrier
Outdoor machine of air-conditioner mainboard (such as：The mainboard of model GRJW842-A32V1.2 or mainboard as shown in Figure 2) test in batches
Card, obtained related experiment result are as follows：
1) tin situation on component pin (50 times of amplification Microscopic observations) after wave-soldering, meets THT examination requirements.
2) metallographic is tested：In place, solder joint is qualified for IPM1-26 feet fill solder.
To sum up, during wave-soldering is crossed to external convertible frequency air conditioner mainboard, by using blocking power module position
Tin carrier is crossed, can at least reach following advantageous effect：
(1) new technological flow reduces the turnover of pcb board.
(2) high tempreture tape is saved, reduces harmful influence waste disposal.
(3) when reducing wave-soldering, mainboard upper tin caused by deforming is scrapped.
(4) solve the problems, such as that tin is bad on board edges element.
The processing and function realized by the welder of the present embodiment essentially correspond to earlier figures 1 to shown in Fig. 2
Cross the embodiment, principle and example of tin carrier, therefore not detailed part in the description of the present embodiment, it may refer in previous embodiment
Related description, this will not be repeated here.
Through a large amount of verification experimental verification, technical solution using the present invention, by using the tin excessively for blocking power module position
Carrier, the process for can also cancel patch high tempreture tape, tearing high tempreture tape, simplifies operating process.
According to an embodiment of the invention, a kind of welding method corresponding to welder is additionally provided.The welding method is (i.e.
The welding method welded using above-described welder) it can include：
Step S1, before wave soldering is carried out to the circuit board to be welded, using the welder, described treat is blocked
Backing run element and/or the corresponding pad locations of power module in soldered circuit board.
Such as：First post of section can be inserted in hand let off tin carrier.
Step S2, backing run element and/or power module in the welder is used to block the circuit board to be welded
After corresponding pad locations, wave soldering is carried out to the circuit board to be welded.
Optionally, wave soldering is carried out to the circuit board to be welded in step S2, can included in the following terms operation
At least one of：
Step S21, when the welder can also include moving assembly, according to the width adjusting of the fixation kit
The width of the moving assembly.
Step S22, the welding inclination angle during the wave soldering is adjusted, makes the crossbeam angle during the wave soldering
Degree is adjusted in 5~7 degree.
Step S23, the scaling powder nozzle and air valve during the wave soldering are adjusted, makes the circuit board to be welded
Welding surface is evenly coated with the scaling powder of required thickness and makes accordingly to weld on the scaling powder inflow circuit board to be welded
It connects in the PCB plate through hole at position.
Such as：The width of conveying can be suitably adjusted according to the size of adjustable carrier, ensures that carrier is elastic suitable.
Welding inclination angle is adjusted, wave-soldering crossbeam angle is adjusted in 5~7 degree, is specifically advisable so that welding quality is good.Adjust scaling powder nozzle
And air valve, the welding surface of mainboard is made equably, to be significantly coated with a thin layer of scaling powder, and scaling powder should enter pcb board
In through-hole.
Such as：According to the size of different mainboards and component size, tightness degree, preheating temperature and tin furnace temperature are adjusted
Degree adjusts crest height and tin mouth flow, makes that welding is abundant, solder joint is full.After links adjustment is stablized, observation, analysis weldering
Situation is connect, can be mass after meeting the requirements.
As a result, by the way that welding parameter is adjusted flexibly during wave soldering, welding efficiency and welding effect can be promoted.
Step S3, after the completion of described wave soldering, the welder is removed, to the backing run element and/or the work(
Rate module is welded.Such as：After mainboard crosses wave-soldering, tin carrier was removed, effect similar with high tempreture tape is pasted can be reached
(not upper tin in hole).
Such as：Using the tin carrier excessively for blocking power module position, external convertible frequency air conditioner mainboard power module is welded
The technological process connect may refer to example shown in Fig. 4.
As a result, by using tin carrier progress wave soldering is crossed, ensure that mainboard is unlikely to deform, eliminated high temperature paster,
Also a save patch, the process for tearing high tempreture tape.
Optionally, the backing run element and/or the power module are welded in step S3, can included：It removes
After the welder, the backing run element and/or the power module are inserted into described in the circuit board to be welded and carried on the back
It welds at element and/or the corresponding pad locations of the power module, the backing run is fixed using preset fixed high and positioning tool
Element and/or the power module, and after determining that described fixed high and positioning tool positioning column is adjacent to the circuit board to be welded,
The pin of the backing run element and/or the power module is welded on the circuit board to be welded.
Such as：Rectifier bridge, diode, IGBT, IPM constant power module are inserted, work(is fixed using the fixed high positioning tool of module
Rate module.After checking that the positioning column of tooling is adjacent to plate face, the pin of manual welding (or selection wave-soldering) power module, after being soldered
Mainboard is positioned on assembly line.
Power module is welded by using Ding Gao and positioning tool as a result, can be promoted and power module is welded
Reliability, also ensure welding quality.
The processing and function realized by the welding method of the present embodiment essentially correspond to the implementation of aforementioned welder
Example, principle and example, therefore not detailed part in the description of the present embodiment, may refer to the related description in previous embodiment,
This is not repeated.
Through a large amount of verification experimental verification, technical solution using the present invention, by using the tin excessively for blocking power module position
Carrier, it is thus also avoided that using high tempreture tape, saved high tempreture tape, reduced cost.
To sum up, it will be readily appreciated by those skilled in the art that under the premise of not conflicting, above-mentioned each advantageous manner can be certainly
It is combined, is superimposed by ground.
The foregoing is merely the embodiment of the present invention, are not intended to restrict the invention, for those skilled in the art
For member, the invention may be variously modified and varied.Any modification for all within the spirits and principles of the present invention, being made,
Equivalent replacement, improvement etc., should be included within scope of the presently claimed invention.
Claims (11)
1. a kind of cross tin carrier, which is characterized in that including：Fixation kit and shutter (5)；Wherein,
The fixation kit is used to form accommodating space, and circuit board to be welded is fixed in the accommodating space；
The shutter (5), is set in the accommodating space, for carrying out wave soldering to the circuit board to be welded
In the process, backing run element and/or the corresponding pad locations of power module in the circuit board to be welded are blocked.
2. carrier according to claim 1, which is characterized in that further include：Cross tin hole and void region；It is described cross tin hole and
The void region is set to other regions in addition to region residing for the shutter (5) in the accommodating space；Wherein,
It is described to cross tin hole, for during wave soldering is carried out to the circuit board to be welded, making to treat described in scolding tin inflow
In the corresponding welding hole of soldered circuit board；
The void region, for the member for during wave soldering is carried out to the circuit board to be welded, exposing needs
Device exposes.
3. carrier according to claim 2, which is characterized in that wherein,
It is described to cross tin hole, including：First tin hole (6), second excessively crosses at least one of tin hole (8)；The vacancy section, including：
At least one of first vacancy section (7), the second vacancy section (9)；
Wherein, described first tin hole (6) and first vacancy section (7), matching setting are crossed；Described second crosses tin hole (8) and institute
State the second vacancy section (9), matching setting；
And/or
The circuit board to be welded, including：External convertible frequency air conditioner mainboard to be welded；
And/or
The power module, including：At least one of rectifier bridge, diode, IGBT, IPM.
4. according to the carrier described in one of claim 1-3, which is characterized in that further include：In grip part (10), moving assembly
At least one；Wherein,
The grip part (10) close to the shutter (5) and is arranged on the fixation kit, for picking and placeing the tin excessively
It is grasped during carrier；
The moving assembly, the separate shutter (5) and the outside or bottom for being arranged on the fixation kit, for moving
It is described to cross tin carrier.
5. carrier according to claim 4, which is characterized in that wherein,
The grip part (10), including：The groove being arranged on the fixation kit, and the internal face of the groove is arc
Face；
And/or
The quantity of the grip part (10) is at least a pair of；At least a pair of grip part (10), is symmetrically disposed on the fixation
On component；
And/or
The moving assembly, including：At least one of chain claw (3), guide rail, conveyer belt moving member；The quantity of the moving member
It is two；Two moving members are symmetrically disposed on the outside or bottom of the fixation kit.
6. according to the carrier described in one of claim 1-5, which is characterized in that the fixation kit, including：Bottom plate (2) and solid
Fixed buckle (4)；Wherein,
The bottom plate (2), structure in the shape of a frame are used to form the accommodating space；
The fixed card buckle (4), is arranged in the frame like structure, for fixing the circuit board to be welded.
7. carrier according to claim 6, which is characterized in that the quantity of the fixed card buckle (4) is six；Described in six
Fixed card buckle (4) close to the shutter (5) and is symmetricly set on a pair of of frame of the frame like structure.
8. the carrier described according to claim 6 or 7, which is characterized in that the fixation kit further includes：Keep off tin bar (1)；
The gear tin bar (1) is correspondingly arranged at the outside of the frame like structure, and the height of the gear tin bar (1) is higher than described
The height of frame like structure, for during wave soldering is carried out to the circuit board to be welded, it is excessive or outer to block scolding tin
It splashes.
9. a kind of welder, which is characterized in that including：As claim 1-8 any one of them crosses tin carrier.
10. a kind of welding method welded using welder as claimed in claim 9, which is characterized in that including：
Using the welder, backing run element and/or the corresponding pad position of power module in the circuit board to be welded are blocked
It puts；
Wave soldering is carried out to the circuit board to be welded；
After the completion of the wave soldering, the welder is removed, the backing run element and/or the power module are welded
It connects.
11. according to the method described in claim 10, it is characterized in that, wherein,
Wave soldering is carried out to the circuit board to be welded, including：
When the welder further includes moving assembly, according to the width of moving assembly described in the width adjusting of the fixation kit
Degree；And/or
The welding inclination angle during the wave soldering is adjusted, makes the crossbeam angle during the wave soldering in 5~7 degree
It adjusts；And/or
The scaling powder nozzle and air valve during the wave soldering are adjusted, makes the welding surface of the circuit board to be welded equably
Scaling powder coated with required thickness and the scaling powder is made to flow on the circuit board to be welded at corresponding welding position
In PCB plate through hole；
And/or
The backing run element and/or the power module are welded, including：
By the backing run element and/or the power module be inserted into backing run element described in the circuit board to be welded and/or
At the corresponding pad locations of the power module, preset fixed high and positioning tool is used to fix the backing run element and/or institute
Power module is stated, and after determining that fixed high and positioning tool the positioning column is adjacent to the circuit board to be welded, by the backing run
The pin of element and/or the power module is welded on the circuit board to be welded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810024260.0A CN108135098A (en) | 2018-01-10 | 2018-01-10 | It is a kind of to cross tin carrier, welder and welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810024260.0A CN108135098A (en) | 2018-01-10 | 2018-01-10 | It is a kind of to cross tin carrier, welder and welding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108135098A true CN108135098A (en) | 2018-06-08 |
Family
ID=62399698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810024260.0A Pending CN108135098A (en) | 2018-01-10 | 2018-01-10 | It is a kind of to cross tin carrier, welder and welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108135098A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112004335A (en) * | 2020-08-11 | 2020-11-27 | 格力电器（郑州）有限公司 | Tin carrier |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01290293A (en) * | 1988-05-18 | 1989-11-22 | Matsushita Electric Ind Co Ltd | Soldering equipment |
| EP0346228A1 (en) * | 1988-06-08 | 1989-12-13 | Bull S.A. | Masking plate for equipped printed-circuit boards, and method of manufacturing the same |
| JP2005044998A (en) * | 2003-07-22 | 2005-02-17 | Nissan Motor Co Ltd | Mask for partial soldering, and partial soldering method |
| CN1620228A (en) * | 2003-11-21 | 2005-05-25 | 华为技术有限公司 | Method of realizing local crest welding and printed circuit board |
| CN201491403U (en) * | 2009-06-26 | 2010-05-26 | 厦门天能电子有限公司 | Over wave crest carrier for replacing sticker adhesive |
| CN202979486U (en) * | 2012-12-04 | 2013-06-05 | 西安卓成信息科技有限责任公司 | Peak-welding special-purpose fixture |
| CN203261581U (en) * | 2013-05-10 | 2013-10-30 | 珠海格力电器股份有限公司 | Automatic welding installing positioning tool for power module of variable frequency air conditioner |
| CN104717844A (en) * | 2015-03-16 | 2015-06-17 | 珠海格力电器股份有限公司 | Wiring welding method of PCB and PCB welding structure |
| CN204560047U (en) * | 2015-02-16 | 2015-08-12 | 惠州顺源科技有限公司 | A kind of Wave soldering fixture |
| CN204795894U (en) * | 2015-06-17 | 2015-11-18 | 广东美的暖通设备有限公司 | A cross stove device for wave -soldering |
| CN206196160U (en) * | 2016-08-15 | 2017-05-24 | 惠州市海顺电子有限公司 | Synthetic stone wave -soldering support plate in aluminium track limit |
| CN207884997U (en) * | 2018-01-10 | 2018-09-18 | 格力电器（石家庄）有限公司 | It is a kind of to cross tin carrier and welder |
-
2018
- 2018-01-10 CN CN201810024260.0A patent/CN108135098A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01290293A (en) * | 1988-05-18 | 1989-11-22 | Matsushita Electric Ind Co Ltd | Soldering equipment |
| EP0346228A1 (en) * | 1988-06-08 | 1989-12-13 | Bull S.A. | Masking plate for equipped printed-circuit boards, and method of manufacturing the same |
| JP2005044998A (en) * | 2003-07-22 | 2005-02-17 | Nissan Motor Co Ltd | Mask for partial soldering, and partial soldering method |
| CN1620228A (en) * | 2003-11-21 | 2005-05-25 | 华为技术有限公司 | Method of realizing local crest welding and printed circuit board |
| CN201491403U (en) * | 2009-06-26 | 2010-05-26 | 厦门天能电子有限公司 | Over wave crest carrier for replacing sticker adhesive |
| CN202979486U (en) * | 2012-12-04 | 2013-06-05 | 西安卓成信息科技有限责任公司 | Peak-welding special-purpose fixture |
| CN203261581U (en) * | 2013-05-10 | 2013-10-30 | 珠海格力电器股份有限公司 | Automatic welding installing positioning tool for power module of variable frequency air conditioner |
| CN204560047U (en) * | 2015-02-16 | 2015-08-12 | 惠州顺源科技有限公司 | A kind of Wave soldering fixture |
| CN104717844A (en) * | 2015-03-16 | 2015-06-17 | 珠海格力电器股份有限公司 | Wiring welding method of PCB and PCB welding structure |
| CN204795894U (en) * | 2015-06-17 | 2015-11-18 | 广东美的暖通设备有限公司 | A cross stove device for wave -soldering |
| CN206196160U (en) * | 2016-08-15 | 2017-05-24 | 惠州市海顺电子有限公司 | Synthetic stone wave -soldering support plate in aluminium track limit |
| CN207884997U (en) * | 2018-01-10 | 2018-09-18 | 格力电器（石家庄）有限公司 | It is a kind of to cross tin carrier and welder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112004335A (en) * | 2020-08-11 | 2020-11-27 | 格力电器（郑州）有限公司 | Tin carrier |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4934582A (en) | Method and apparatus for removing solder mounted electronic components | |
| CN207884997U (en) | It is a kind of to cross tin carrier and welder | |
| US20080302861A1 (en) | Method and apparatus for wave soldering an electronic substrate | |
| CN113068324A (en) | Method for manufacturing circuit board by using remelting solder as weldability protective layer | |
| CN108135098A (en) | It is a kind of to cross tin carrier, welder and welding method | |
| CN110402038A (en) | A kind of method of welding circuit board element | |
| US6572009B2 (en) | Passive and active heat retention device for solder fountain rework | |
| CN206879235U (en) | One kind welding containment mould and welding structure | |
| CN108207088A (en) | A kind of efficient multiple-printed-panel for circuit board mode and connector welding procedure | |
| CN101283632B (en) | Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board | |
| CN112888188A (en) | PCBA (printed circuit board assembly) paster processing technology | |
| CN206993499U (en) | A kind of lamp plate fixing device for wave-soldering | |
| CN208214537U (en) | A kind of wave soldering machine nitrogen filled protection device | |
| CN106604566A (en) | Wave soldering method for printed circuit board | |
| CN219421196U (en) | Secondary automatic welding device for PCBA welding spots of washing machine | |
| CN105033382A (en) | Series welding method for solar cell, welding production line used for solar cell and solder strip flux spraying device | |
| CN221157884U (en) | Inspection cleaning device for PCB steel mesh | |
| CN109587971B (en) | FPC welding jig | |
| CN210548679U (en) | Automatic soldering tin tool table | |
| JPH0969680A (en) | Mounting of electronic component | |
| US6116494A (en) | Method for re-attachment of a SMT component using a heated air jet | |
| CN213560399U (en) | Double-track-driven eight-temperature-zone lead-free reflow soldering equipment | |
| JPS63284892A (en) | Mounting method for flat package type electronic part | |
| JPH0730014A (en) | Solder bump forming method | |
| CN1429683A (en) | Welding method of electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |