CN207884997U - It is a kind of to cross tin carrier and welder - Google Patents
It is a kind of to cross tin carrier and welder Download PDFInfo
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- CN207884997U CN207884997U CN201820039077.3U CN201820039077U CN207884997U CN 207884997 U CN207884997 U CN 207884997U CN 201820039077 U CN201820039077 U CN 201820039077U CN 207884997 U CN207884997 U CN 207884997U
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Abstract
The utility model discloses a kind of tin carrier and welder, the carriers excessively to include：Fixation kit and shutter (5)；Wherein, the fixation kit is used to form accommodating space, and circuit board to be welded is fixed in the accommodating space；The shutter (5), is set in the accommodating space, for during carrying out wave soldering to the circuit board to be welded, blocking backing run element and/or the corresponding pad locations of power module in the circuit board to be welded.The embodiment of the utility model, for backing run element and/or power module, the defects of mainboard is yielding, operating process is cumbersome and waste high tempreture tape can be overcome in the prior art, realize that mainboard is unlikely to deform, operating process is succinct and the advantageous effect of saving high tempreture tape.
Description
Technical field
The utility model belongs to welding technology field, and in particular to a kind of mistake for backing run element and/or power module
Tin carrier and welder more particularly to a kind of used tin carrier of the novel production welding technique of convertible frequency air-conditioner mainboard power module,
The welder of tin carrier is crossed with this and crosses the welding method that tin carrier is welded using this.
Background technology
Currently, rectifier bridge, diode, IGBT (the Insulated Gate Bipolar of the outer mainboard of air-conditioning frequency conversion
Transistor, insulated gate bipolar transistor), the work(such as IPM (Intelligent Power Module, intelligent power module)
Rate module needs the pad locations patch high tempreture tape to these elements before wave-soldering, tears high tempreture tape again after wave-soldering, use
Manual welding or selection Welding welding.Wherein, Welding is selected, can be the work welded using selection Wave soldering apparatus
Skill can replace manual welding.
Due to having welded power module so that the width of the outer mainboard of air-conditioning frequency conversion increases to 189.8mm by 169mm, increases
Add 20mm.Moreover, after crossing wave-soldering, mainboard deformation is serious, will appear upper tin report in the case of using gear tin bar
It is useless；In addition, it is bad to may also result in tin on the element of board edges.
In the prior art, the defects of that there are mainboards is yielding, operating process is cumbersome and waste high tempreture tape.
Utility model content
The purpose of this utility model is that in view of the foregoing drawbacks, a kind of tin carrier and welder excessively are provided, it is existing to solve
There is external convertible frequency air conditioner mainboard yielding problem of mainboard after crossing wave soldering in technology, reaches the on-deformable effect of mainboard
Fruit.
The utility model provides a kind of tin carrier excessively, including：Fixation kit and shutter；Wherein, the fixation kit is used
In formation accommodating space, and circuit board to be welded is fixed in the accommodating space；The shutter is set to described accommodating
In space, for during carrying out wave soldering to the circuit board to be welded, blocking and being carried on the back in the circuit board to be welded
Weld element and/or the corresponding pad locations of power module.
Optionally, further include：Cross tin hole and void region；It is described to cross tin hole and the void region, it is set to the appearance
Other regions between emptying in addition to region residing for the shutter；Wherein, described to cross tin hole, for described to be welded
During circuit board carries out wave soldering, scolding tin is made to flow into the corresponding welding hole of the circuit board to be welded；The vacancy section
Domain, for during carrying out wave soldering to the circuit board to be welded, the component that needs expose being made to expose.
Optionally, the tin hole excessively, including：First tin hole, second excessively crosses at least one of tin hole；The vacancy section,
Including：At least one of first vacancy section, the second vacancy section；Wherein, described first tin hole and first vacancy section are crossed,
With setting；Described second crosses tin hole and second vacancy section, matching setting.
Optionally, further include：At least one of grip part, moving assembly；Wherein, the grip part, close to the screening
Baffle and be arranged on the fixation kit, for pick and place it is described cross tin carrier when grasp；The moving assembly, far from described
Shutter and it is arranged in the outside or bottom of the fixation kit, described tin carrier is crossed for moving.
Optionally, wherein the grip part, including：Groove on the fixation kit is set, and the groove is interior
Wall surface is arcwall face；And/or the quantity of the grip part is at least a pair of；At least a pair of grip part, is symmetrically disposed on institute
It states on fixation kit；And/or the moving assembly, including：At least one of chain claw, guide rail, conveyer belt moving member；It is described
The quantity of moving member is two；Two moving members are symmetrically disposed on the outside or bottom of the fixation kit.
Optionally, the fixation kit, including：Bottom plate and fixed card buckle；Wherein, the bottom plate, structure in the shape of a frame, is used for
Form the accommodating space；The fixed card buckle is arranged in the frame like structure, for fixing the circuit board to be welded.
Optionally, the quantity of the fixed card buckle is six；Six fixed card buckles, close to the shutter and right
Title is arranged on a pair of of frame of the frame like structure.
Optionally, the fixation kit further includes：Keep off tin bar；The gear tin bar, is correspondingly arranged at the frame like structure
Outside, and the height of the gear tin bar is higher than the height of the frame like structure, for the circuit board to be welded into traveling wave
During peak welds, block that scolding tin is excessive or spluttering.
Matching with above-mentioned tin carrier of crossing, on the other hand the utility model provides a kind of welder, including：It is described above
Cross tin carrier.
The embodiment of the utility model, by the welding process to external convertible frequency air conditioner mainboard power module, using screening
That keeps off power module position crosses tin carrier, can solve mainboard problem on deformation, reach the on-deformable effect of mainboard.
Further, the embodiment of the utility model can also be cancelled by using the tin carrier excessively for blocking power module position
The process pasted high tempreture tape, tear high tempreture tape, simplifies operating process.
Further, the embodiment of the utility model, by using the tin carrier excessively for blocking power module position, it is thus also avoided that make
With high tempreture tape, high tempreture tape has been saved, has reduced cost.
The embodiment of the utility model as a result, is solved existing by the way that the tin carrier excessively for blocking power module position is arranged
External convertible frequency air conditioner mainboard yielding problem of mainboard after crossing wave soldering in technology, to overcome mainboard in the prior art
Yielding, operating process is cumbersome and the defect of waste high tempreture tape, realizes that mainboard is unlikely to deform, operating process is succinct and it is high to save
The advantageous effect of warm gummed paper.
Other features and advantages of the utility model will illustrate in the following description, also, partly from specification
In become apparent, or understood by implementing the utility model.
Below by drawings and examples, the technical solution of the utility model is described in further detail.
Description of the drawings
Fig. 1 is the structural schematic diagram of the embodiment for crossing tin carrier of the utility model；
Fig. 2 is the structural schematic diagram using the embodiment for crossing the mainboard that tin carrier is welded of the utility model；
Fig. 3 is the process flow chart for the embodiment welded using high tempreture tape；
Fig. 4 is the process flow chart of an embodiment of the welding method of the utility model.
In conjunction with attached drawing, reference numeral is as follows in the utility model embodiment：
1- keeps off tin bar (for keeping off tin)；2- bottom plates；3- chain claws (for being moved through tin carrier)；4- fixed card buckles are (for solid
Determine pcb board)；5- shutters (for blocking power module)；The tin holes excessively 6- first (such as：First occlusion area)；7- first is engraved
Dead zone；The tin holes excessively 8- second (such as：Second occlusion area)；The second vacancy sections 9-；10- grip parts.
Specific implementation mode
It is specific below in conjunction with the utility model to keep the purpose of this utility model, technical solution and advantage clearer
Technical solutions of the utility model are clearly and completely described in embodiment and corresponding attached drawing.Obviously, described embodiment
Only it is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, this field
The every other embodiment that those of ordinary skill is obtained without making creative work, belongs to the utility model
The range of protection.
In one embodiment, welding procedure as shown in Figure 3 may include：Patch high tempreture tape, is torn at wave soldering
High tempreture tape and power module welding.The welding procedure, can complete the welding of power module on convertible frequency air-conditioner mainboard, but also deposit
In following disadvantage：
(1) technological process is more complicated, needs to increase PCB (Printed Circuit Board, printed circuit board) turnovers.
Such as：High tempreture tape is pasted by SMT (Surface Mount Technology, surface mounting technology) workshop, then carries out patch patch
Dress needs to tear high tempreture tape again after crossing wave-soldering.It pastes high tempreture tape process and increases a PCB turnover.
(2) high tempreture tape is wasted, and the high tempreture tape torn belongs to harmful influence waste product, it is also necessary to special disposal.
(3) the upper tin of the serious appearance of mainboard deformation is scrapped；
(4) hidden danger of quality there is, and tin is bad on the element of board edges.Such as：Since pcb board deforms, cause near chain claw
Element wicking it is shallow, and then can go up that tin is bad, and hidden danger of quality refers to that upper tin is bad.
Embodiment according to the present utility model, provides a kind of tin carrier excessively, and the tin of crossing of the utility model as shown in Figure 1 carries
The structural schematic diagram of one embodiment of tool.This crosses tin carrier：Fixation kit and shutter 5.
In an optional example, the fixation kit can be used for being formed accommodating space, and circuit board to be welded consolidated
It is scheduled in the accommodating space.
Optionally, the fixation kit may include：Bottom plate 2 and fixed card buckle 4.
In an optional specific example, the bottom plate 2, structure in the shape of a frame can be used for being formed the accommodating space.
In an optional specific example, the fixed card buckle 4 is arranged in the frame like structure, can be used for fixing
The circuit board to be welded.
Accommodating space is formed by bottom plate as a result, circuit board to be welded is fixed by fixed card buckle, simple in structure, operation
It is convenient, and reliability is high.
More optionally, the quantity of the fixed card buckle 4 is six.Six fixed card buckles 4, the close shutter 5,
And it is symmetricly set on a pair of of frame of the frame like structure.
As a result, by symmetrically arranged six fixed card buckles, can be promoted treat the fixed reliability of soldered circuit board and
Safety, and then the efficiency and effect for treating soldered circuit board welding can be promoted.
Optionally, the fixation kit can also include：Keep off tin bar 1.
In an optional specific example, the gear tin bar 1 is correspondingly arranged at the outside of the frame like structure, and described
The height for keeping off tin bar 1 is higher than the height of the frame like structure, can be used for carrying out wave soldering to the circuit board to be welded
During, block that scolding tin is excessive or spluttering.
Such as：The gear tin bar 1, frame in a strip shape.The strip frame is correspondingly arranged at the outer of the frame like structure
Side, and the height of the strip frame be higher than the frame like structure height, can be used for the circuit board to be welded into
During row wave soldering, block that scolding tin is excessive or spluttering.
Scolding tin is blocked by keeping off tin bar as a result, can be promoted and be treated during soldered circuit board welded, scolding tin is not
Excessive or spluttering, ensure that the safety of welding process, also avoids scolding tin excessive or spluttering is treated soldered circuit board and damaged.
In an optional example, the shutter 5 is set in the accommodating space, can be used for waiting for described
During soldered circuit board carries out wave soldering, backing run element and/or power module pair in the circuit board to be welded are blocked
The pad locations answered.
Such as：A kind of tin carrier excessively blocking power module position is developed, mainboard problem on deformation can be not only solved, may be used also
With the process cancelled patch high tempreture tape, tear high tempreture tape.
Circuit board to be welded is housed and fixed by fixation kit as a result, and by shutter during wave soldering
Fold the corresponding welding position of power module so that mainboard is unlikely to deform, and also as save high temperature paster, is eliminated patch, is torn high temperature
The process of gummed paper.
Optionally, the circuit board to be welded may include：External convertible frequency air conditioner mainboard to be welded.
It, can be with as a result, by the welding process of external convertible frequency air conditioner mainboard, using tin carrier to substitute high temperature paster
Ensure the welding efficiency and welding quality of external convertible frequency air conditioner mainboard, and save material, saves operational sequence.
Optionally, the power module may include：At least one of rectifier bridge, diode, IGBT, IPM.
The power module of diversified forms is blocked by using tin carrier excessively as a result, circuit to be welded can be protected
The corresponding welding position of on-board power module, to protect circuit board to be welded, so that the welding effect of circuit board to be welded
Rate and welding effect are ensured.
In an optional embodiment, can also include：Cross tin hole and void region.It is described to cross tin hole and the hollow out
Region is set in the accommodating space other regions in addition to region residing for the shutter 5.
It is described to cross tin hole in an optional example, it can be used for carrying out wave soldering to the circuit board to be welded
During, so that scolding tin is flowed into the corresponding welding hole of the circuit board to be welded.
Wherein, the tin hole excessively can be occlusion area relative to the void region.
In an optional example, the void region can be used for carrying out wave-soldering to the circuit board to be welded
During connecing, the component that needs expose is made to expose.
As a result, by the way that tin hole and void region was arranged, welding component progress can be treated during wave soldering
It reliably and securely welds, and can guarantee welding effect.
Optionally, described to cross tin hole, may include：First, which crosses tin hole 6, second, crosses at least one of tin hole 8.It is described to engrave
Dead zone may include：At least one of first vacancy section 7, the second vacancy section 9.
Wherein, described first tin hole 6 and first vacancy section 7, matching setting are crossed.Described second crosses tin hole 8 and described
Second vacancy section 9, matching setting.
Tin hole and void region are crossed by the way that setting is multiple as a result, it can be during wave soldering to multiple members to be welded
Device is welded, and flexibility and the reliability of welding are improved.
In an optional embodiment, can also include：At least one of grip part 10, moving assembly.
In an optional example, the grip part 10 close to the shutter 5 and is arranged on the fixation kit,
It is grasped when can be used for picking and placeing the tin carrier excessively.
Optionally, the grip part 10 may include：It is arranged on the fixation kit and meets human finger work
The groove of structure is learned, and the internal face of the groove is arcwall face.
As a result, by the way that grip part is arranged, personnel easy to operation grasp, improve the convenience for picking and placeing tin carrier, also carry
The efficiency for picking and placeing tin carrier in welding process has been risen, and then has been conducive to promote welding efficiency.
Optionally, the quantity of the grip part 10 is at least a pair of.At least a pair of grip part 10, is symmetrically disposed on institute
It states on fixation kit.Such as：At least a pair of grip part 10, is symmetrically disposed on an opposite side of the fixation kit.
As a result, by being arranged in pairs grip part so that the stability and reliability of grasping can be protected, so as to
To ensure to pick and place the safety of tin carrier in welding process.
In an optional example, the moving assembly far from the shutter 5 and is arranged in the fixation kit
Outside or bottom can be used for the mobile tin carrier excessively.
Tin carrier is moved through by moving assembly as a result, so that can be needed according to welding in welding process flexibly mobile
Tin carrier is crossed, the convenience and versatility that promote welding are conducive to.
Optionally, the moving assembly may include：At least one of chain claw 3, guide rail, conveyer belt moving member.It is described
The quantity of moving member is two.Two moving members are symmetrically disposed on the outside or bottom of the fixation kit.Such as：Two
A chain claw 3 is symmetrically disposed on the outside of an opposite side of the fixation kit.
As a result, by the moving assembly of diversified forms, mobile flexibility and convenience are improved.
Through a large amount of verification experimental verification, using the technical solution of the present embodiment, by external convertible frequency air conditioner mainboard power
In the welding process of module, using the tin carrier excessively for blocking power module position, mainboard problem on deformation can be solved, mainboard is reached
On-deformable effect.
Embodiment according to the present utility model, additionally provide corresponding to tin carrier a kind of welder.The welding fills
It sets and may include：It is above-described to cross tin carrier.
In an optional embodiment, for the big plate of machine outside frequency conversion cross problem on deformation after wave-soldering (there are failure welding,
The problems such as upper tin is scrapped), propose new solution：A kind of tin carrier excessively blocking power module position is developed, can not only be solved
Certainly mainboard problem on deformation, the process that patch high tempreture tape can also be cancelled, tear high tempreture tape.
In an optional example, using the tin carrier excessively for blocking power module position, to external convertible frequency air conditioner mainboard work(
The technological process that rate module is welded may refer to example shown in Fig. 4.
The technological process welded below to external convertible frequency air conditioner mainboard power module is specifically described.
Step 1 lets off tin carrier.
It is alternatively possible to which inserting first post of section in hand lets off tin carrier.
Step 2, wave soldering.
It is alternatively possible to suitably adjust the width of conveying according to the size of adjustable carrier, ensure the elastic conjunction of carrier
It is suitable.Adjusting welding inclination angle (such as：Orbit inclination angle), wave-soldering crossbeam angle is adjusted in 5~7 degree, specifically good with welding quality
It is advisable.Scaling powder nozzle and air valve are adjusted, the welding surface of mainboard is made equably, to be significantly coated with a thin layer of scaling powder, and
Scaling powder should enter in the through-hole of pcb board.
Optionally, according to the size of different mainboards and component size, tightness degree, preheating temperature and tin stove are adjusted
Temperature adjusts crest height and tin mouth flow, makes that welding is abundant, solder joint is full.
Optionally, after links adjustment is stablized, observation, analysis welding situation can be mass after meeting the requirements.
Step 3 removed tin carrier.
Optionally, after mainboard crosses wave-soldering, tin carrier was removed, effect (backing run similar with high tempreture tape is pasted can be reached
Not upper tin in component hole).
Step 4, module welding.
Rectifier bridge, diode, IGBT, IPM constant power module are inserted, determines high positioning tool constant power mould using module
Block.After checking that the positioning column of tooling is adjacent to plate face, the pin of manual welding (or selection wave-soldering) power module will be led after being soldered
Plate is positioned on assembly line.
In step 4, some points for attention are as follows：
1. must assure that the positioning column of tooling is close to plate face after fixed high positioning.
2. tooling is using preceding having to check for, whether tooling is correct, whether have the screw of damage, tooling everywhere to fix good
Whether whether suitable, tooling and IPM contact surfaces have the foreign matters such as rosin to good, tool locating column height.
3. soldering iron must use constant-temperature soldering iron, the temperature of soldering iron is 390 ± 10 DEG C.
4. welding in the hole that must assure that module soldering pads and filling out tin 100%.
Further, cancel high tempreture tape and through step 1 to the soldered frequency conversion of step 4 to using tin carrier
Outdoor machine of air-conditioner mainboard (such as：The mainboard of model GRJW842-A32V1.2 or mainboard as shown in Figure 2) test in batches
Card, obtained related experiment result are as follows：
1) tin situation on component pin (50 times of amplifications are under the microscope) after wave-soldering, meet THT examination requirements.
2) metallographic is tested：In place, solder joint is qualified for IPM1-26 feet fill solder.
To sum up, during crossing wave-soldering to external convertible frequency air conditioner mainboard, by using blocking power module position
Tin carrier is crossed, following advantageous effect can be at least reached：
(1) new technological flow reduces the turnover of pcb board.
(2) high tempreture tape is saved, harmful influence waste disposal is reduced.
(3) when reducing wave-soldering, mainboard upper tin caused by deforming is scrapped.
(4) solve the problems, such as that tin is bad on board edges element.
The processing and function realized by the welder of the present embodiment essentially correspond to earlier figures 1 to shown in Fig. 2
Cross the embodiment, principle and example of tin carrier, therefore not detailed place in the description of the present embodiment, it may refer in previous embodiment
Related description, this will not be repeated here.
Through a large amount of verification experimental verification, using the technical solution of the utility model, by using blocking power module position
Tin carrier is crossed, the process that can also cancel patch high tempreture tape, tear high tempreture tape simplifies operating process.
Embodiment according to the present utility model additionally provides a kind of welding method corresponding to welder.The welding side
Method (even if the welding method welded with above-described welder) may include：
Step S1, before carrying out wave soldering to the circuit board to be welded, using the welder, described wait for is blocked
Backing run element and/or the corresponding pad locations of power module in soldered circuit board.
Such as：First post of section can be inserted in hand let off tin carrier.
Step S2, backing run element and/or power module in blocking the circuit board to be welded using the welder
After corresponding pad locations, wave soldering is carried out to the circuit board to be welded.
Optionally, wave soldering is carried out to the circuit board to be welded in step S2, may include in the following terms operation
At least one of：
Step S21, when the welder can also include moving assembly, according to the width adjusting of the fixation kit
The width of the moving assembly.
Step S22, the welding inclination angle during the wave soldering is adjusted, the crossbeam angle during the wave soldering is made
Degree is adjusted in 5~7 degree.
Step S23, the scaling powder nozzle and air valve during the wave soldering are adjusted, the circuit board to be welded is made
Welding surface is evenly coated with the scaling powder of required thickness and the scaling powder is made to flow on the circuit board to be welded and accordingly welds
It connects in the PCB plate through hole at position.
Such as：The width of conveying can be suitably adjusted according to the size of adjustable carrier, ensure that carrier is elastic suitable.
Welding inclination angle is adjusted, wave-soldering crossbeam angle adjusts in 5~7 degree, is specifically advisable so that welding quality is good.Adjust scaling powder nozzle
And air valve, so that the welding surface of mainboard equably, is significantly coated with a thin layer of scaling powder, and scaling powder should enter pcb board
In through-hole.
Such as：According to the size of different mainboards and component size, tightness degree, preheating temperature and tin furnace temperature are adjusted
Degree adjusts crest height and tin mouth flow, makes that welding is abundant, solder joint is full.After links adjustment is stablized, observation, analysis weldering
Situation is connect, can be mass after meeting the requirements.
As a result, by the way that welding parameter is adjusted flexibly during wave soldering, welding efficiency and welding effect can be promoted.
Step S3, after the completion of the described wave soldering, the welder is removed, to the backing run element and/or the work(
Rate module is welded.Such as：After mainboard crosses wave-soldering, tin carrier was removed, effect similar with high tempreture tape is pasted can be reached
(not upper tin in hole).
Such as：Using the tin carrier excessively for blocking power module position, external convertible frequency air conditioner mainboard power module is welded
The technological process connect may refer to example shown in Fig. 4.
As a result, by using tin carrier progress wave soldering is crossed, ensures that mainboard is unlikely to deform, has eliminated high temperature paster,
The process for also ing save patch, tearing high tempreture tape.
Optionally, the backing run element and/or the power module are welded in step S3, may include：It removes
After the welder, the backing run element and/or the power module are inserted into described in the circuit board to be welded and carried on the back
It welds at element and/or the corresponding pad locations of the power module, the backing run is fixed using preset fixed high and positioning tool
Element and/or the power module, and after determining that described fixed high and positioning tool positioning column is adjacent to the circuit board to be welded,
The pin of the backing run element and/or the power module is welded on the circuit board to be welded.
Such as：Rectifier bridge, diode, IGBT, IPM constant power module are inserted, work(is fixed using the fixed high positioning tool of module
Rate module.After checking that the positioning column of tooling is adjacent to plate face, the pin of manual welding (or selection wave-soldering) power module, after being soldered
Mainboard is positioned on assembly line.
Power module is welded by using Ding Gao and positioning tool as a result, can be promoted and power module is welded
Reliability, also ensure welding quality.
The processing and function realized by the welding method of the present embodiment essentially correspond to the implementation of aforementioned welder
Example, principle and example, therefore not detailed place in the description of the present embodiment, may refer to the related description in previous embodiment,
This is not repeated.
Through a large amount of verification experimental verification, using the technical solution of the utility model, by using blocking power module position
Cross tin carrier, it is thus also avoided that use high tempreture tape, saved high tempreture tape, reduced cost.
To sum up, it will be readily appreciated by those skilled in the art that under the premise of not conflicting, above-mentioned each advantageous manner can be certainly
It combined, be superimposed by ground.
The above description is only the embodiments of the present invention, is not intended to limit the utility model, for this field
Technical staff for, various modifications and changes may be made to the present invention.Within the spirit and principle of the utility model,
Any modification, equivalent replacement, improvement and so on should be included within the right of the utility model.
Claims (9)
1. a kind of crossing tin carrier, which is characterized in that including：Fixation kit and shutter (5)；Wherein,
The fixation kit is used to form accommodating space, and circuit board to be welded is fixed in the accommodating space；
The shutter (5), is set in the accommodating space, for carrying out wave soldering to the circuit board to be welded
In the process, backing run element and/or the corresponding pad locations of power module in the circuit board to be welded are blocked.
2. carrier according to claim 1, which is characterized in that further include：Cross tin hole and void region；It is described cross tin hole and
The void region is set to other regions in addition to region residing for the shutter (5) in the accommodating space；Wherein,
It is described to cross tin hole, it is waited for described in scolding tin inflow for during carrying out wave soldering to the circuit board to be welded, making
In the corresponding welding hole of soldered circuit board；
The void region, the member for during carrying out wave soldering to the circuit board to be welded, needs being made to expose
Device exposes.
3. carrier according to claim 2, which is characterized in that wherein,
The tin hole excessively, including：First tin hole (6), second excessively crosses at least one of tin hole (8)；The vacancy section, including：
At least one of first vacancy section (7), the second vacancy section (9)；
Wherein, described first tin hole (6) and first vacancy section (7), matching setting are crossed；Described second crosses tin hole (8) and institute
State the second vacancy section (9), matching setting；
And/or
The circuit board to be welded, including：External convertible frequency air conditioner mainboard to be welded；
And/or
The power module, including：At least one of rectifier bridge, diode, IGBT, IPM.
4. according to the carrier described in one of claim 1-3, which is characterized in that further include：In grip part (10), moving assembly
At least one；Wherein,
The grip part (10) close to the shutter (5) and is arranged on the fixation kit, for picking and placeing the tin excessively
It is grasped when carrier；
The moving assembly far from the shutter (5) and is arranged in the outside or bottom of the fixation kit, for moving
It is described to cross tin carrier.
5. carrier according to claim 4, which is characterized in that wherein,
The grip part (10), including：Groove on the fixation kit is set, and the internal face of the groove is arc
Face；
And/or
The quantity of the grip part (10) is at least a pair of；At least a pair of grip part (10), is symmetrically disposed on the fixation
On component；
And/or
The moving assembly, including：At least one of chain claw (3), guide rail, conveyer belt moving member；The quantity of the moving member
It is two；Two moving members are symmetrically disposed on the outside or bottom of the fixation kit.
6. according to the carrier described in one of claim 1-3, which is characterized in that the fixation kit, including：Bottom plate (2) and solid
Fixed buckle (4)；Wherein,
The bottom plate (2), structure in the shape of a frame are used to form the accommodating space；
The fixed card buckle (4) is arranged in the frame like structure, for fixing the circuit board to be welded.
7. carrier according to claim 6, which is characterized in that the quantity of the fixed card buckle (4) is six；Described in six
Fixed card buckle (4) close to the shutter (5) and is symmetricly set on a pair of of frame of the frame like structure.
8. carrier according to claim 6, which is characterized in that the fixation kit further includes：Keep off tin bar (1)；
The gear tin bar (1) is correspondingly arranged at the outside of the frame like structure, and the height of the gear tin bar (1) is higher than described
The height of frame like structure, for during carrying out wave soldering to the circuit board to be welded, it is excessive or outer to block scolding tin
It splashes.
9. a kind of welder, which is characterized in that including：As claim 1-8 any one of them crosses tin carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820039077.3U CN207884997U (en) | 2018-01-10 | 2018-01-10 | It is a kind of to cross tin carrier and welder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820039077.3U CN207884997U (en) | 2018-01-10 | 2018-01-10 | It is a kind of to cross tin carrier and welder |
Publications (1)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135098A (en) * | 2018-01-10 | 2018-06-08 | 格力电器（石家庄）有限公司 | It is a kind of to cross tin carrier, welder and welding method |
| CN112004335A (en) * | 2020-08-11 | 2020-11-27 | 格力电器（郑州）有限公司 | Tin carrier |
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2018
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135098A (en) * | 2018-01-10 | 2018-06-08 | 格力电器（石家庄）有限公司 | It is a kind of to cross tin carrier, welder and welding method |
| CN112004335A (en) * | 2020-08-11 | 2020-11-27 | 格力电器（郑州）有限公司 | Tin carrier |
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