CN100455165C - Method of realizing local crest welding and printed circuit board - Google Patents
Method of realizing local crest welding and printed circuit board Download PDFInfo
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- CN100455165C CN100455165C CNB2003101167757A CN200310116775A CN100455165C CN 100455165 C CN100455165 C CN 100455165C CN B2003101167757 A CNB2003101167757 A CN B2003101167757A CN 200310116775 A CN200310116775 A CN 200310116775A CN 100455165 C CN100455165 C CN 100455165C
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- printed circuit
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Abstract
The present invention discloses an implementation method of local wave welding, which comprises the steps: providing a printed circuit board to be welded, wherein the welding surface of the printed circuit board is divided into a surface adhered device region and a pluggable device region; sending the printed circuit board to be welded into a welding flux spraying region in a wave welding device, and limiting the spraying range of welding flux, so that the device only sprays the pluggable device region of the printed circuit board; sending the printed circuit board to be welded which is sprayed into a preheating region to be preheated; sending the printed circuit board to be welded which is preheated into the welding region of the wave welding, and limiting the welding range of the wave welding, so that wave peak welding materials only contact the pluggable device region of the printed circuit board so as to weld the pluggable device region. The present invention simultaneously discloses a printed circuit board which comprises a surface adhered device a pluggable device, wherein the surface adhered device and the pluggable device of the welding surface of the printed circuit board are respectively arranged in the surface adhered device region and the pluggable device region which are independent oppositely.
Description
Technical field
The present invention relates to the wave-soldering technology, relate in particular to a kind of implementation method and printed circuit board of local wave-soldering.
Background technology
At present, conventional Wave soldering apparatus mainly contains three partial functions zone formation: spraying scaling powder, preheating, wave soldering.
Wave soldering apparatus as shown in Figure 1, the wave-soldering work flow as shown in Figure 2, the wave-soldering machining process is shown in Fig. 3 (side diagrammatic sketch).
Wave-soldering welding functional area is one and adds hot melting furnace, the liquid solder for melting in the stove.By the effect of rotary pump, liquid solder is poured into end face, form a dynamic crest.Printed circuit board to be welded (the being called for short PCB) back side of moving together along with the equipment track contacts with solder wave, finishes the welding of PCB.As shown in Figure 4.
As shown in Figure 3, PCB to be welded is from the left side of Wave soldering apparatus inlet access arrangement, and by the both sides of the track chain clamping PCB of Wave soldering apparatus.The track chain drives PCB operation to be welded with a constant speed.The PCB to be welded of operation at first arrives spraying scaling powder zone.Wave soldering apparatus uniformly sprays the whole back side at PCB to be welded by certain way with scaling powder; After finishing scaling powder spraying, PCB to be welded enters the preheating zone immediately; Behind the preheating zone, PCB to be welded enters the wave-soldering welding region.In this zone, the whole back side of PCB to be welded is with the wave solder contact of fusing, and after PCB broke away from wave solder along with orbital motion, PCB finished welding.As shown in Figure 4
Current production designs more and more densification, and the integrated level degree is more and more higher, and the PCB back side must the close spacing device of layout.Conventional wave-soldering is that the whole back side with pcb board all is immersed in the scolder of fusing.If PCB back side layout has the device of close spacing, conventional wave-soldering processing technology can not be suitable for.This also is the restricted main cause of present conventional wave-soldering process application.Therefore, if adopt this welding manner, the PCB to be welded back side can not the close spacing device of layout, and this is to deviate from mutually with product design development.
If PCB back side layout close spacing device, and PCB to go up the plug-in unit device a lot, can not use conventional wave-soldering processing technology again, this will cause working (machining) efficiency, production capacity, product quality low of product.In order to address this is that, according to PCB back side device layout characteristics, make special-purpose anchor clamps, cover with the special fixture sealing in the local area zone of the close spacing device in the PCB back side, make this zone different scaling powders, melting solder contact when conventional wave-soldering.Anchor clamps only hollow out need the zone of wave-soldering welding.Though this method can realize wave-soldering to close spacing device, has following deficiency:
A, cost height.Clamp material needs that heat resistance is very good, indeformable, the characteristics of antistatic.The price height of this material, and the special fixture of making needs tens covers just to reach circulation consumption of wave-soldering usually.
B, have the situation that scolder pierces the anchor clamps protected area, may cause scrapping of product.
C, because PCB is covered protection by anchor clamps zone is few in the heat absorption of wave-soldering warm-up phase, the openwork part heat absorption is big, PCB is subjected to thermoae inhomogeneous, the PCB distortion is big.The PCB area is big more, plate thickness is more little, is subjected to this factor affecting just big more.
There are the problem of aspects such as useful life and maintenance in D, anchor clamps.
Summary of the invention
The object of the present invention is to provide a kind of implementation method and printed circuit board of local wave-soldering, to solve the deficiency that exists of the complex product of close spacing of having used conventional wave-soldering processes back side layout in the prior art.
Technical scheme of the present invention:
A kind of implementation method of local wave-soldering comprises step:
A, provide the printed circuit board to be welded that is divided into surface mount device zone and plug-in area;
B, printed circuit board to be welded is sent into scaling powder spraying zone in the Wave soldering apparatus, and the spraying scope of restriction scaling powder, equipment is only sprayed the plug-in area of this printed circuit board;
C, the printed circuit board to be welded after will spraying are sent into the preheating zone and are carried out preheating;
D, the printed circuit board to be welded after the preheating is sent into the wave-soldering weld zone, and, wave solder is only contacted with the plug-in area of this printed circuit board, this plug-in area is welded by wave-soldering furnace being carried out the welding scope that partial occlusion limits wave-soldering.
According to technique scheme:
The least possible layout plug-in unit device in surface mount device zone of described printed circuit board to be welded.
The line of demarcation of certain width is set between the surface mount device zone of the solder side of described printed circuit board to be welded and plug-in area.
Described line of demarcation is parallel with wave-soldering track transmission edges of boards.
By the scaling powder spout being sheltered from or limits the spraying scope of scaling powder by the stroke of control moving nozzle.
A kind of printed circuit board comprises surface mount device and plug-in unit, and described surface mount device and plug-in unit difference layout are in relatively independent surface mount device zone and plug-in area.
The present invention has following beneficial effect:
A, the PCB to be welded back side can the close spacing devices of layout, meet the high-density development direction of product design.Widened the range of application of conventional wave-soldering technology.
B, working (machining) efficiency, production capacity and the product quality of product have been improved greatly.
C, cost are low, do not need the maintenance of anchor clamps, also do not have the anchor clamps problem in useful life.
D, PCB are heated evenly at warm-up phase, and PCB can not cause distortion because of being heated inhomogeneous.
Description of drawings
Fig. 1 is the wave-soldering flow process chart;
Fig. 2 is the side diagrammatic sketch of wave-soldering machining process;
Fig. 3 wave-soldering furnace operation principle schematic diagram;
Fig. 4 is a printed circuit board structural representation to be welded of the present invention;
Fig. 5 is the scaling powder spraying zone of the Wave soldering apparatus among the present invention schematic diagram after by partial occlusion;
Fig. 6 is the wave-soldering furnace of the Wave soldering apparatus among the present invention schematic diagram after by partial occlusion;
Fig. 7 is a flow chart of the present invention.
Embodiment
Consult shown in Figure 4ly, printed circuit board (be called for short PCB) includes devices such as surface mount device and plug-in unit, is separated into two zones at the solder side device layout of PCB: surface mount device (being called for short SMD) zone and plug-in area.Do not comprise any SMD device in the plug-in area scope of the back side, and the least possible layout plug-in unit device in the SMD zone.
SMD zone and plug-in area keep the border width of 5～10mm, and this border width is determined according to concrete Wave soldering apparatus ability.
Have a line of demarcation between plug-in area and the SMD zone, this line of demarcation also can be the zone that does not have device of certain width.This line of demarcation should be parallel with wave-soldering track transmission edges of boards.
In order to realize local wave-soldering, need conventional Wave soldering apparatus is simply improved.
Consult shown in Figure 5ly,, scaling powder spout in the Wave soldering apparatus is sheltered from, arrive SMD zone, the PCB to be welded back side to avoid scaling powder spraying according to the width size in SMD zone, the PCB back side.If equipment is moving nozzle, and the haul distance of nozzle can utilize software to control, and the parameter of then directly changing software limits the spraying scope of spray Zi, one of the lunar mansions.
Consult shown in Figure 6, according to the width size in SMD zone, the PCB back side, the restriction wave-soldering furnace the welding scope.Use and can wetting material not take place and become baffle plate, for example use stainless steel with scolder, be used for blocking wave solder on the wave-soldering furnace wherein on one side, make the width on other one side equal the width of PCB back side plug-in area.
Have only plug-in area just to contact with scolder during welding, the SMD zone does not then contact with scolder fully.
Consult Fig. 7, the flow process of local wave-soldering is as follows,
Step 10: make printed circuit board to be welded, the solder side of this circuit board is divided into surface mount device zone and plug-in area;
Step 20: printed circuit board to be welded is sent into the scaling powder spraying zone of Wave soldering apparatus by the track of Wave soldering apparatus, make the scaling powder nozzle only to the plug-in area spraying scaling powder of printed circuit board to be welded;
Step 30: the printed circuit board to be welded after will spraying is sent into the preheating zone and is carried out preheating;
Step 40: the weld zone of the printed circuit board to be welded after the preheating being sent into wave-soldering welds.Because brazier and the contacted zone of printed circuit board to be welded are blocked, wave solder only can contact and this plug-in area is welded with the plug-in area of this printed circuit board.
Step 50: the printed circuit after will welding cools off and ejecting plate, finishes local wave-soldering.
Find out by above-mentioned, the employing method, the back side plug-in area of PCB to be welded has used conventional wave-soldering to weld, and SMD has avoided the contact wave solder in the zone simultaneously.
Claims (12)
1, a kind of implementation method of local wave-soldering is characterized in that comprising the steps:
A, provide solder side to be divided into the printed circuit board to be welded of surface mount device zone and plug-in area;
B, printed circuit board to be welded is sent into scaling powder spraying zone in the Wave soldering apparatus, and the spraying scope of restriction scaling powder, equipment is only sprayed the plug-in area of this printed circuit board;
C, the printed circuit board to be welded after will spraying are sent into the preheating zone and are carried out preheating;
D, the printed circuit board to be welded after the preheating is sent into the wave-soldering weld zone, and, wave solder is only contacted with the plug-in area of this printed circuit board, this plug-in area is welded by wave-soldering furnace being carried out the welding scope that partial occlusion limits wave-soldering.
2, the method for claim 1 is characterized in that, the least possible layout plug-in unit device in surface mount device zone of described printed circuit board to be welded.
3, the method for claim 1 is characterized in that, the line of demarcation of certain width is set between the surface mount device zone of the solder side of described printed circuit board to be welded and plug-in area.
4, method as claimed in claim 3 is characterized in that, described line of demarcation is parallel with wave-soldering track transmission edges of boards.
5, the method for claim 1 is characterized in that, on the surface mount device zone of the solder side of described printed circuit board to be welded and the border of plug-in area maintenance certain width.
6, the method for claim 1 is characterized in that, among the step B, by the scaling powder spout being sheltered from or limit by the stroke of control moving nozzle the spraying scope of scaling powder.
7, the method for claim 1 is characterized in that, does not adopt wetting material to take place as shelter with scolder.
8, method as claimed in claim 7 is characterized in that, described material is a stainless steel material.
9, a kind of printed circuit board, comprise surface mount device and plug-in unit, it is characterized in that, the surface mount device of this printed circuit board solder side and plug-in unit difference layout are in relatively independent surface mount device zone and plug-in area, when welding, only the wave solder in the wave-soldering furnace behind this plug-in area and the partial occlusion contacts.
10, printed circuit board as claimed in claim 9 is characterized in that, described surface mount device zone and plug-in area have 5～10mm border width.
11, printed circuit board as claimed in claim 9 is characterized in that, described surface mount device zone layout has a spot of plug-in unit.
12, as the described printed circuit board of one of claim 9 to 11, it is characterized in that having a watershed area between described surface mount device zone and the plug-in area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101167757A CN100455165C (en) | 2003-11-21 | 2003-11-21 | Method of realizing local crest welding and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101167757A CN100455165C (en) | 2003-11-21 | 2003-11-21 | Method of realizing local crest welding and printed circuit board |
Publications (2)
| Publication Number | Publication Date |
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| CN1620228A CN1620228A (en) | 2005-05-25 |
| CN100455165C true CN100455165C (en) | 2009-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2003101167757A Expired - Fee Related CN100455165C (en) | 2003-11-21 | 2003-11-21 | Method of realizing local crest welding and printed circuit board |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101652024B (en) * | 2008-08-12 | 2011-05-18 | 英业达股份有限公司 | Method for deploying component on circuit board |
| CN101707857B (en) * | 2009-11-25 | 2011-05-04 | 深圳市诺斯达科技有限公司 | PCB welding machine and welding method |
| CN105025664A (en) * | 2015-07-03 | 2015-11-04 | 湖北飞利信电子设备有限公司 | Board-edge-free insertion method of PCBA |
| CN106413282B (en) * | 2016-09-28 | 2019-04-09 | 佛山市国立光电科技有限公司 | A kind of local crest Welding of electronic circuit board |
| CN107172816B (en) * | 2017-06-20 | 2020-03-06 | 郑州云海信息技术有限公司 | Method and system for creating DIP type part package |
| CN108365371B (en) * | 2017-11-07 | 2020-10-02 | 得意精密电子(苏州)有限公司 | Electric connector and manufacturing method thereof |
| CN108135098A (en) * | 2018-01-10 | 2018-06-08 | 格力电器（石家庄）有限公司 | It is a kind of to cross tin carrier, welder and welding method |
| CN108401379A (en) * | 2018-04-11 | 2018-08-14 | 广州视源电子科技股份有限公司 | Welding method and two-sided plug in circuit card |
| US10780516B2 (en) * | 2018-06-14 | 2020-09-22 | Illinois Tool Works Inc. | Wave solder nozzle with automated adjustable sliding plate to vary solder wave width |
| US11389888B2 (en) | 2020-08-17 | 2022-07-19 | Illinois Tool Works Inc. | Wave solder nozzle with automated exit wing |
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| US5373984A (en) * | 1993-09-27 | 1994-12-20 | Sundstrand Corporation | Reflow process for mixed technology on a printed wiring board |
| JPH07249857A (en) * | 1994-03-10 | 1995-09-26 | Nippon Avionics Co Ltd | Part mounting method of printed wiring board |
| JPH0888463A (en) * | 1994-09-19 | 1996-04-02 | Fujitsu Ltd | Soldering packaging method of electronic parts |
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2003
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Patent Citations (3)
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|---|---|---|---|---|
| US5373984A (en) * | 1993-09-27 | 1994-12-20 | Sundstrand Corporation | Reflow process for mixed technology on a printed wiring board |
| JPH07249857A (en) * | 1994-03-10 | 1995-09-26 | Nippon Avionics Co Ltd | Part mounting method of printed wiring board |
| JPH0888463A (en) * | 1994-09-19 | 1996-04-02 | Fujitsu Ltd | Soldering packaging method of electronic parts |
Non-Patent Citations (7)
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| 单面电路板通孔再流焊接技术. 褚玉福，袁娅婷.电子工艺技术，第24卷第02期. 2003 |
| 单面电路板通孔再流焊接技术. 褚玉福，袁娅婷. 电子工艺技术，第24卷第02期. 2003 * |
| 用于PCB的一种新型焊接技术-选择性焊接. 黄强.电子与封装，第3卷第5期. 2003 |
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| CN1620228A (en) | 2005-05-25 |
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