CN101652024B - Method for deploying component on circuit board - Google Patents
Method for deploying component on circuit board Download PDFInfo
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- CN101652024B CN101652024B CN2008101308300A CN200810130830A CN101652024B CN 101652024 B CN101652024 B CN 101652024B CN 2008101308300 A CN2008101308300 A CN 2008101308300A CN 200810130830 A CN200810130830 A CN 200810130830A CN 101652024 B CN101652024 B CN 101652024B
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- circuit board
- zone
- stress value
- configuring areas
- customized configuration
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Abstract
The invention discloses a method for deploying a component on a circuit board, which comprises the following steps: firstly, reading multi-pen force data to judge the size distribution of an external force borne by the circuit board; secondly, dividing the circuit board into a plurality of deployment areas according to the size distribution of the external force borne by the circuit board, wherein the plurality of deployment areas correspond to a force value interval respectively; thirdly, selecting one of the plurality of deployment areas as a specific area according to a force critical value, the weight of an electronic component and the force value intervals of the plurality of deployment areas; and finally, deploying the electronic component in the specific area. Therefore, the service quality of the circuit board can be improved, and the occurrence of damage to the circuit board can be reduced.
Description
Technical field
The invention relates to a kind of collocation method of component on circuit board, and particularly dispose the collocation method of electronic building brick relevant for a kind of size distribution that can bear external force according to circuit board.
Background technology
Development rapidly along with electronic industry, stimulated printed circuit board (PCB) (Printed Circuit Board, PCB) extensive application, by early stage broadcast receiver, television set, phonograph, what replace it has walkman, calculator, desktop PC, notebook, a mobile phone ... come one after another Deng product.The product of printed circuit board (PCB) can be divided into three major types haply, is respectively: 1. computer and Related product thereof: desktop PC, notebook, server and LCD; 2. communication class product: WLAN (wireless LAN, WLAN), mobile phone (mobile phone) and smart mobile phone (smart phone); 3. consumer electronics product (consumer electronic): personal digital assistant (Personal Digital Assistant, PDA), the digital scanning transducer (digital scan converter, DSC), game host (game console).
Along with the extensive application of printed circuit board (PCB), its relevant making flow process is also got over complicated and meticulous.Wherein, the manufacturing process of printed circuit board (PCB) comprises haply: issuance of materials (issue material), internal layer, melanism, pressing plate, boring, de-smear, flash removal, chemical copper, electric plating of whole board, outer dry film, circuit are electroplated, are sprayed tin, plating pure tin, circuit etching, stripping tin, anti-welding lacquer, tin plumbous coating, lettering, moulding, hypotenuse, cut folding section groove, cleaning, inspection, baking and packaging and other steps.
It should be noted that in the manufacturing process of printed circuit board (PCB) many steps will cause printed circuit board (PCB) to have the different force intensitys that is subjected to, step such as pressing plate and boring for example, and then cause the quality of printed circuit board (PCB) to reduce.In addition, if being subjected to the lower zone of force intensity to be configured heavier electronic building brick or louvre be set of printed circuit board (PCB), the risk that will cause printed circuit board (PCB) to break then, and and then increase later period maintenance and problem such as directly scrap.
Summary of the invention
The invention provides a kind of collocation method of component on circuit board, furnish electronic building brick according to the size distribution that indivedual different weight of electronic building brick and circuit board can bear external force.By this, the present invention can reduce the spoilage of circuit board and improve the quality of circuit board simultaneously.
The invention provides a kind of collocation method of component on circuit board and comprise the following steps.At first, read many stress datas, to differentiate the size distribution that described circuit board can bear external force.Afterwards, bear the size distribution of external force and described circuit board is divided into a plurality of configuring areas, the corresponding separately stress value interval of wherein said a plurality of configuring areas according to described circuit board.Next, according to stressed critical value, the weight of electronic building brick and the stress value interval of described a plurality of configuring areas, and from described a plurality of configuring areas, choose one as the specific region.Then, described electronic building brick is configured in described specific region.
In one embodiment of this invention, the collocation method of assembly more comprises and sets up database and call described electronic building brick on the foregoing circuit plate.Wherein, described database is in order to store many stress datas.
In one embodiment of this invention, the weight of the stressed critical value of above-mentioned foundation, electronic building brick and the stress value interval of a plurality of configuring areas, and the step that chooses one as the specific region from a plurality of configuring areas comprises: the stress value interval of stressed critical value and a plurality of configuring areas is compared one by one, can not furnish the zone a plurality of configuring areas are divided into a plurality of zones of furnishing with a plurality of; And, the weight of electronic building brick and a plurality of stress value interval of furnishing the zone are compared one by one, to choose one as the specific region the zone from a plurality of the ornament.
In one embodiment of this invention, above-mentioned stress value interval with stressed critical value and a plurality of configuring areas compares one by one, comprises with a plurality of steps that can not furnish the zone described a plurality of configuring areas are divided into a plurality of zones of furnishing: choose one as the customized configuration zone from a plurality of configuring areas; When the minimum stress value in the stress value interval in customized configuration zone less than stressed critical value, then the customized configuration zone is considered as a plurality of one that can not furnish the zone; In addition, when the minimum stress value in the stress value interval in described customized configuration zone during, then described customized configuration zone is considered as described a plurality of one of furnishing the zone greater than described stressed critical value; And, repeat above steps, till described a plurality of configuring areas are chosen as described customized configuration zone one by one.
In one embodiment of this invention, above-mentionedly can not furnish not configurable louvre in zone and signal wiring.
The present invention furnishes electronic building brick according to the size distribution that indivedual different weight of electronic building brick and circuit board can bear external force.By this, just can take into account the stressed size of circuit board when electronic building brick is disposed at circuit board, and then reduce the spoilage of circuit board effectively and improve the quality of circuit board simultaneously.
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is the collocation method flow chart of component on circuit board according to an embodiment of the invention.
Fig. 2 is the distribution map in order to the stressed size of circuit board of key diagram 1 embodiment.
Embodiment
Fig. 1 is the collocation method flow chart of component on circuit board according to an embodiment of the invention.Please refer to Fig. 1, at first, as step S110, set up in order to store the database of many stress datas, the source of wherein said many stress datas can for example be the process data and analysis data of circuit board.Then as step S120, the stress data in the reading database can bear the size distribution of external force to come the judging circuit plate by this.Next as step S130, can bear the size distribution of external force according to circuit board, circuit board is divided into a plurality of configuring areas.Wherein, corresponding separately stress value interval of described a plurality of configuring area.
For instance, Fig. 2 is the distribution map in order to the stressed size of circuit board of key diagram 1 embodiment.Please refer to Fig. 1 and Fig. 2, the described collocation method of present embodiment can be according to the stress data of database, and circuit board 200 is distinguished into three configuring areas 220,240 and 260.Wherein, the stressed interval value of configuring area 220 is 50mg to 100mg, and the stressed interval value of configuring area 240 is 200mg to 800mg, and the stressed interval value of configuring area 240 is 1g to 2g.
Then, from a plurality of configuring areas, select one as the customized configuration zone as described in the step S140.Next as step S150, whether the minimum stress value in stress value interval of judging the customized configuration zone is less than stressed critical value.If the minimum stress value in the stress value interval in customized configuration zone is greater than stressed critical value (just step S150 is indicated " deny "), then as described in the step S161, the customized configuration zone will be set to can furnish the zone.Otherwise if the minimum stress value in the stress value interval in customized configuration zone is less than stressed critical value (just step S150 is indicated " be "), then as described in the step S162, the customized configuration zone will be set to can not furnish the zone.
For instance, suppose that the described stressed critical value setting of present embodiment is 70mg.Under this assumed condition, with reference to Fig. 2, because the minimum value of the stressed interval value of configuring area 220 is 50mg, just under the condition of the minimum value of its stressed interval value less than stressed critical value (70mg), so configuring area 220 will be set to and can not furnish the zone.Relatively, because the minimum value of the stressed interval value of configuring area 240 and 260 is respectively 200mg and 1g, so configuring area 240 and 260 can be furnished the zone with being set to respectively.
It should be noted that in the present embodiment any assembly, signal wiring and louvre can not be furnished in the described zone of can not furnishing.In addition, this area has and knows that usually the knowledgeable can set up described stressed critical value on their own according to design.For instance, the designer can infer that circuit board can bear the maximum critical value of external force, and then set out described stressed critical value by analyzing the circuit board that has damaged.
Please continue with reference to Fig. 1,, judge whether described a plurality of configuring area is chosen as the customized configuration zone one by one in step S170.If described a plurality of configuring area is not chosen as the customized configuration zone as yet one by one, then represents described a plurality of configuring area not to be divided into a plurality of zones of furnishing as yet and can not furnish the zone with a plurality of.At this moment, with repeating step S140, step S150, step S161, step S162 and step S170, till described a plurality of configuring areas are all finished by differentiation.
On the other hand, if described a plurality of configuring area is chosen as the customized configuration zone one by one, that is to say that described a plurality of configuring area has been divided into a plurality of zones of furnishing and can not furnish the zone time, has then called an electronic building brick of desiring to be disposed on the circuit board in step S180 with a plurality of.Then, gravimetric value and described a plurality of stress value interval of furnishing the zone of described electronic building brick are compared one by one, to choose one as the specific region the zone from a plurality of the ornament as step S191.
At last, as step S192, electronic building brick is disposed at selected specific region.For instance, the weight of supposing electronic building brick is 1.2g.With this understanding, with reference to Fig. 2, the weight of electronic building brick will be compared with all the stressed interval values that can furnish zone 240 and 260.Because the weight of electronic building brick (1.2g) corresponds to stressed interval value for to be the configuring area 240 of 1g to 2g, so electronic building brick will be configured in the zone 240.
In sum, but the stress data size in the collocation method data-driven storehouse of component on circuit board of the present invention, the size distribution that the judging circuit plate is stressed, and then the circuit board branch held a plurality of configuring areas.In addition, collocation method of the present invention is also according to the stressed interval value and the stressed critical value of configuring area, can furnish the zone and can not furnish the zone and circuit board is divided into, and then select corresponding furnished zone to do ornaments according to the weight of electronic building brick.Therefore,, when being disposed at circuit board, electronic building brick just can take into account the stressed size of circuit board and the weight of assembly by collocation method of the present invention, thus the quality that can reduce the probability of circuit board damage and improve circuit board, and and then reduce the cost of circuit board.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limiting the present invention, anyly has the knack of this skill person, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when with being as the criterion that claim was defined.
Claims (6)
1. the collocation method of a component on circuit board is characterized in that, it comprises the following steps:
Read many stress datas, to differentiate the size distribution that described circuit board can bear external force;
Bear the size distribution of external force and described circuit board is divided into a plurality of configuring areas, the corresponding separately stress value interval of wherein said a plurality of configuring areas according to described circuit board;
According to stressed critical value, the weight of electronic building brick and the stress value interval of described a plurality of configuring areas, and from described a plurality of configuring areas, choose one as the specific region; And
Described electronic building brick is configured in described specific region.
2. the collocation method of component on circuit board according to claim 1 is characterized in that, it further comprises:
Set up database, wherein said database is in order to store described many stress datas.
3. the collocation method of component on circuit board according to claim 1 is characterized in that, it further comprises:
Call described electronic building brick.
4. the collocation method of component on circuit board according to claim 1, it is characterized in that, according to described stressed critical value, the weight of described electronic building brick and the stress value interval of described a plurality of configuring areas, and the step that chooses one as described specific region from described a plurality of configuring areas comprises:
The stress value interval of described stressed critical value and described a plurality of configuring areas is compared one by one, can not furnish the zone with a plurality of described a plurality of configuring areas are divided into a plurality of zones of furnishing; And
Weight and described a plurality of stress value interval of furnishing the zone of described electronic building brick are compared one by one, to choose one as described specific region the zone from described a plurality of the ornament.
5. the collocation method of component on circuit board according to claim 4, it is characterized in that, the stress value interval of described stressed critical value and described a plurality of configuring areas is compared one by one, comprises with the described a plurality of steps that can not furnish the zone described a plurality of configuring areas are divided into described a plurality of zone of furnishing:
Choose one as the customized configuration zone from described a plurality of configuring areas;
Whether the minimum stress value in stress value interval of differentiating described customized configuration zone is less than described stressed critical value;
When the minimum stress value in the stress value interval in described customized configuration zone less than described stressed critical value, then described customized configuration zone is set at the described a plurality of one that can not furnish the zone;
When the minimum stress value in the stress value interval in described customized configuration zone during, then described customized configuration zone is set at described a plurality of one of furnishing the zone greater than described stressed critical value; And
Repeat above steps, till described a plurality of configuring areas are chosen as described customized configuration zone one by one.
6. the collocation method of component on circuit board according to claim 4 is characterized in that, wherein saidly a plurality ofly can not furnish not configurable louvre in zone and signal wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101308300A CN101652024B (en) | 2008-08-12 | 2008-08-12 | Method for deploying component on circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101308300A CN101652024B (en) | 2008-08-12 | 2008-08-12 | Method for deploying component on circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN101652024A CN101652024A (en) | 2010-02-17 |
| CN101652024B true CN101652024B (en) | 2011-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008101308300A Expired - Fee Related CN101652024B (en) | 2008-08-12 | 2008-08-12 | Method for deploying component on circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104093276B (en) * | 2014-06-13 | 2017-06-06 | 江苏博敏电子有限公司 | A kind of liquid crystal display PCB manufacture crafts |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6678877B1 (en) * | 2001-08-15 | 2004-01-13 | National Semiconductor Corporation | Creating a PC board (PCB) layout for a circuit in which the components of the circuit are placed in the determined PCB landing areas |
| CN1620228A (en) * | 2003-11-21 | 2005-05-25 | 华为技术有限公司 | Method of realizing local crest welding and printed circuit board |
| CN1987874A (en) * | 2005-12-21 | 2007-06-27 | 英业达股份有限公司 | Method for verifying part placing distance with dynamic regulation part height parameter |
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2008
- 2008-08-12 CN CN2008101308300A patent/CN101652024B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6678877B1 (en) * | 2001-08-15 | 2004-01-13 | National Semiconductor Corporation | Creating a PC board (PCB) layout for a circuit in which the components of the circuit are placed in the determined PCB landing areas |
| CN1620228A (en) * | 2003-11-21 | 2005-05-25 | 华为技术有限公司 | Method of realizing local crest welding and printed circuit board |
| CN1987874A (en) * | 2005-12-21 | 2007-06-27 | 英业达股份有限公司 | Method for verifying part placing distance with dynamic regulation part height parameter |
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| CN101652024A (en) | 2010-02-17 |
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