JP6645990B2 - Soldering apparatus and soldering method - Google Patents

Description

  The present invention relates to a soldering device and a soldering method for soldering terminals of circuit components mounted on a printed wiring board on the back side of the printed wiring board.

  Conventionally, as this type of soldering device, there has been a multipoint jet soldering device for a post-installed component that automatically performs a flux process, a preheating process, and a soldering process, as disclosed in Patent Document 1, for example. . The multi-point jet soldering apparatus includes: a substrate mounting unit for mounting an electronic substrate and a component to be mounted on the electronic substrate; and a coating unit for applying a flux to the electronic substrate mounted on the substrate mounting unit. A flux applying unit, a preheating unit for preheating the electronic substrate on which the flux is applied, a soldering unit for flow soldering a component to be retrofitted to the preheated electronic substrate, and a substrate mounting unit. It is composed of a lift means and a slide means which move up and down or slide to transfer to each of the above means.

  In addition, a soldering device of a type that performs dip soldering is widely used. In dip soldering, components are soldered by immersing an electronic substrate in a liquid surface of molten solder that is almost stationary.

JP 2002-50859 A

  In the case of the multi-point jet soldering apparatus of Patent Document 1, the soldering means is a flow type, and clean portions inside the molten solder are blown up one after another and come into contact with air, so that the oxidation of the molten solder easily proceeds, and However, there is a problem that the consumption amount of this is increased. In addition, since the jet motor and the pump are driven continuously, the burden of electricity and other utilities is not small. Furthermore, dross tends to accumulate in the jet duct or nozzle through which the molten solder passes, and the work of removing the dross must be performed frequently, resulting in a problem that cleaning and maintenance are troublesome.

  Furthermore, the multi-point jet soldering apparatus of Patent Document 1 is configured to perform a preheating step using a preheating means before soldering for degassing the flux. The flux gas is a solvent (for example, IPA or the like) for diluting a main agent such as rosin. If a large amount of gas is generated at the time of soldering, the gas adheres to a terminal of a component and a gas pool is formed. Is no longer supplied, and a connection failure is likely to occur. Therefore, a preheating step is performed to remove excess gas before soldering. The preheating step is usually performed by irradiating an electronic substrate with hot air or irradiating infrared rays, and takes a very long time (for example, several tens of seconds), which is an obstacle to shortening the tact time.

  In the case of a soldering apparatus of the type that performs dip soldering, there is an advantage that the oxidation of the molten solder hardly progresses, so that the consumption of the solder can be reduced. In addition, since a motor and a pump for jet flow are not required, the cost of electricity such as electricity is suppressed, and cleaning and maintenance are easy. However, since the molten solder in the solder pot is almost stationary without flowing, there is a problem that a temperature difference easily occurs inside the molten solder, and it is difficult to control the soldering temperature. For example, when the electronic substrate is immersed during soldering, the temperature of the immersed liquid surface part locally decreases, and there is a possibility that insufficient soldering due to insufficient heating may occur.

  Further, since the molten solder is almost stationary, the flux gas tends to remain on the terminals of the component during soldering, and soldering failure due to the flux gas is more likely to occur than in the multipoint jet soldering apparatus. Therefore, the preheating step before soldering must be performed more carefully, and the tact time of the soldering operation is further lengthened.

  The present invention has been made in view of the above background art, and provides a soldering apparatus and a soldering method that can efficiently perform good soldering, have relatively low running costs, and easily maintain equipment. The purpose is to provide.

The present invention has a flux coating device for applying a liquid flux through a spray nozzle to a lower surface of a work on which a circuit component is mounted on a printed wiring board, and a solder pot, wherein the lower surface of the work is melted in the solder pot. A dip solder tank for soldering the terminals of the circuit components to the lower surface side of the printed wiring board by being immersed in solder, and supporting the work horizontally, and positioning the work at appropriate positions in the vertical and horizontal directions. And a work transfer mechanism for transferring to
The work transfer mechanism transfers the work to which the flux has been applied to above the solder pot, and lowers the work so that the lower surface of the work is immersed in the molten solder. A soldering apparatus for reciprocating a work in a horizontal direction, soldering the terminals of the circuit components by the molten solder, and raising the work to separate the work from the molten solder.

  The work transfer mechanism includes a work support member that horizontally supports the work, and an actuator that transfers the work support member. The work support member includes a plate that supports a lower surface of the printed wiring board on an upper surface. A mask plate in which a soldering hole for exposing terminals of the circuit component is formed, and the flux coating device is configured such that the work is placed on an upper surface of the mask plate. The flux may be applied in a state, and the dip solder bath may be configured to perform soldering in a state where the work is placed on an upper surface of the mask plate.

  In this case, the thickness of the mask plate is such that the terminals of the circuit components do not protrude from the lower surface of the mask plate and fall within the soldering holes when the work is placed on the upper surface of the mask plate. The work transfer mechanism is configured to transfer the work support member from the position of the flux applying device to above the solder pot, and the work support member does not contact the molten solder on the lower surface of the work. It is possible to reciprocate in the vertical direction of lowering the mask plate to the height, immersing the lower surface of the mask plate in the molten solder, raising the work supporting member again to separate the mask plate from the molten solder, It is preferable that the work supporting member is lowered so that the lower surface of the work can be immersed in the molten solder.

  The flux coating device is provided with a spray nozzle transfer mechanism for transferring the spray nozzle in a horizontal direction, and the spray nozzle and the work are moved in a direction crossing each other in a horizontal plane, whereby the lower surface of the work is moved. It is preferable to adopt a configuration in which the flux is applied to a predetermined area.

  The dip solder bath is provided with an elongated plate-shaped scraper, and a scraper transfer mechanism that horizontally supports the scraper and transfers the scraper vertically and horizontally, and the scraper transfer mechanism melts the scraper. By disposing in the solder and transferring in the horizontal direction, the molten solder is agitated, and the scraper transfer mechanism arranges the scraper at the liquid level of the molten solder and transfers the solder in the horizontal direction, It is preferable that an oxide film generated on the liquid surface of the molten solder is removed.

  Further, the present invention performs a flux application step of applying a liquid flux through a spray nozzle to a lower surface of a work on which a circuit component is mounted on a printed wiring board.After the flux application step, the work is leveled, The lower surface of the work is immersed in molten solder in a dipping type solder pot, and the work is reciprocated in the horizontal direction in the immersed state, and the terminals of the circuit components are moved by the molten solder to the lower surface of the printed wiring board. This is a soldering method for performing a work immersion step of soldering to a workpiece.

  Prepare a mask plate, which is a plate-shaped member that supports the lower surface of the printed wiring board on the upper surface, and has a soldering hole formed inside to expose terminals of the circuit component. The process may be performed in a state where the work is placed on the upper surface of the mask plate.

  In this case, the thickness of the mask plate is such that the terminals of the circuit components do not protrude from the lower surface of the mask plate and fit inside the soldering holes when the work is placed on the upper surface of the mask plate. After the flux application step, the mask plate and the work are made horizontal, and the lower surface of the work is lowered to a height at which the lower surface of the work does not contact the molten solder, and the lower surface of the mask plate is immersed in the molten solder. It is preferable that a mask plate immersion step of separating from the molten solder is performed again, and the work immersion step is performed after the mask plate immersion step.

  According to the soldering apparatus of the present invention, a series of operations of applying flux to a work to be soldered, immersing the work in molten solder, and performing dip soldering can be performed fully automatically. Further, since the apparatus is a dip type apparatus, the running cost is lower than that of the flow type apparatus, and cleaning and maintenance are easy.

  According to the soldering apparatus and the soldering method of the present invention, the work is immersed in the liquid surface of the molten solder, and the work is reciprocated in the horizontal direction in this state. Even if the temperature drops, the work is quickly transferred to a portion where the temperature has not dropped, so that the work can be soldered at an appropriate temperature.

  In addition, since a liquid flux is sprayed on the lower surface of the work, a necessary and sufficient amount of flux can be evenly applied. Further, by immersing the work in the molten solder and reciprocating the work, the flux gas is less likely to remain at the terminals of the circuit components, so that the preheating time for degassing the flux can be shortened.

  Also, after applying the flux with the work placed on the mask plate, the lower surface of the mask plate is immersed in the liquid surface of the molten solder and separated from the liquid surface again to perform a unique process. The degassing of the flux (excessive flux that does not contribute to the quality of soldering) applied to the metal can be effectively performed in a short time. As a result, soldering failure due to flux gas is less likely to occur, so the preheating time can be significantly reduced or the preheating itself can be omitted, and the tact time of a series of soldering work Can be significantly reduced.

It is the front view (a) and AA sectional view (b) which show the structure inside a housing | casing of one Embodiment of the soldering apparatus of this invention. It is a top view (a), a front view (b), and a BB sectional view (c) which show a career in which a work was set. It is the top view (a) and front view (b) which show a work supporting member. FIG. 7A is a cross-sectional view illustrating a detailed structure of a work supporting member, taken along a line CC, and FIG. 7B is a cross-sectional view illustrating a state where a work mounted on a carrier is set on the work supporting member. It is a figure (a) which shows operation of a soldering device of this embodiment, and (b). It is a figure (a) showing operation of a soldering device of this embodiment, and a figure (b) which expanded a part of dip soldering tub. It is a figure (a) which shows operation of a soldering device of this embodiment, and (b). FIG. 7B is an enlarged view of a part of the work and the work supporting member of FIG. 7B, showing a state where the lower surface of the mask plate is immersed in the molten solder, and thereafter, the mask plate is separated from the molten solder; It is a figure (b) showing a state. It is a figure (a) which shows operation of a soldering device of this embodiment, and (b). FIG. 9B is an enlarged view of a part of the work and the work supporting member in FIG. 9B, showing a state in which the lower surface of the work is immersed in the molten solder, and FIG. FIG. It is a figure (a) showing operation of a soldering device of this embodiment, and a figure (b) which expanded a part of dip soldering tub.

  Hereinafter, an embodiment of a soldering apparatus and a soldering method of the present invention will be described with reference to the drawings. In the soldering apparatus 10 of this embodiment, a work 3 in which a circuit component 2 is mounted on a printed wiring board 1 is carried in, and the terminals 2a of the circuit component 2 are soldered to the lower surface of the printed wiring board 1 and carried out. It is a device that performs a series of operations fully automatically. The soldering method according to this embodiment is performed by the soldering device 10.

  As shown in FIGS. 1A and 1B, the soldering device 10 has a housing 12 that covers the entire device, and the opening of the side surface of the housing 12 is a work loading / unloading port 12a. I have. By sharing the loading port and the loading port, it is possible to obtain a compact outer shape suitable for installation in a cell production system line.

  Before describing the internal configuration of the soldering apparatus 10, the work 3 carried into the soldering apparatus 10 will be described with reference to FIG. The printed wiring board 1 is a substantially rectangular copper-clad laminate having, for example, a glass epoxy material or a glass composite material as a base material. A copper pattern for circuit wiring is laid out on the lower surface, and the land 1a and the through-hole are provided at appropriate positions. A hole 1b is provided. The circuit component 2 to be soldered here is a semiconductor or a capacitor having a lead-like terminal 2a. The circuit component 2 is mounted on the upper surface side of the printed wiring board 1 by inserting the terminal 2a into the through hole 1c of the printed wiring board 1.

  The work 3 (where the circuit components 2 are mounted on the printed wiring board 1) is handled one by one or a plurality of them on the carrier 4. The carrier 4 is a plate material formed of a heat-resistant resin or the like having a small heat capacity, and has through holes 4 a slightly smaller than the printed wiring board 1 by the number of the works 3. A step 4b for positioning and supporting the end is provided. Also, a pair of handles 4c used when the operator carries the work 3 and the carrier 4 is provided.

  Next, the configuration inside the soldering apparatus 10 will be described. As shown in FIG. 1, inside the casing 12, a flux coating device 14 is installed below the work loading / unloading port 12 a, a dip solder tank 16 is installed beside the flux application device 14, and a side of the dip solder tank 16 is provided. Is provided with a work transfer mechanism 18. Hereinafter, the left-right direction in FIG. 1A is referred to as an X-axis direction (horizontal direction), the depth direction is referred to as a Y-axis direction (horizontal direction), and the up-down direction is referred to as a Z-axis direction.

  The flux spraying device 14 is a device that applies a liquid flux F to the lower surface of the work 3 through a spray nozzle 14a. The spray nozzle 14a is transferred to an appropriate position in the Y-axis direction by the spray nozzle transfer device 14b.

  The dip solder tank 16 has a solder pot 16a, and the lower surface of the work 3 is immersed in the liquid surface Ha of the molten solder H in the solder pot 16a, so that the terminals 2a of the circuit component 2 are printed on the printed wiring board 1. This is a device for soldering to the lower surface side (land 1a) of. An elongated plate-shaped scraper 16b is provided in the dip solder tank 16, and the scraper 16b is supported substantially horizontally by a scraper transfer mechanism (not shown). Then, the scraper transfer mechanism arranges the scraper 16b in the molten solder H, moves the scraper 16b in the X-axis direction to stir the molten solder H, and arranges the scraper 16b at the level of the liquid surface Ha of the molten solder H. , The operation of removing the oxide film S generated on the liquid surface Ha by transferring in the X-axis direction is performed.

  The work transfer mechanism 18 is a device that supports the work 3 and transfers the work 3 to an appropriate position in the Z-axis direction and the X-axis direction. Specifically, the work transfer member 18 includes a work support member 20 that supports the work 3 substantially horizontally, And an actuator 22 for transferring the support member 20.

  As shown in FIGS. 3 (a) and 3 (b), the work supporting member 20 has a bottom plate 24 provided with a through-hole 24a having substantially the same size as the printed wiring board 1 inside, and a peripheral portion of the bottom plate 24. And a mounting portion 28 extending from the side plate 26 and attached to the actuator 22. These are integrally formed by combining a heat-resistant resin or a metal material having a small heat capacity. ing. Then, a pair of mask plates 30 are attached so as to cover the through holes 24a of the bottom plate 24.

  The mask plate 30 is a plate-like member that supports the lower surface of the printed wiring board 1 on the upper surface, as shown in FIGS. 4A and 4B, and soldering that exposes the terminals 2a of the circuit component 2 inside the mask plate 30. A hole 30a is formed. The mask plate 30 functions to support the lower surface of the printed wiring board 1 and cover an area (for example, an area where a surface mount component is mounted) that is not to be brought into contact with the molten solder. The material of the mask plate 30 is preferably a metal having excellent solder corrosion resistance or a heat-resistant resin. The thickness of the mask plate 30 is such that the terminal 2a of the circuit component 2 is masked with the work 3 placed on the upper surface. It is set so as not to protrude from the lower surface of the plate 30 and to fit inside the soldering hole 30a. Since the work 3 is placed on the work supporting member 20 while being mounted on the carrier 4, a step portion 24b for positioning and supporting the carrier 4 is provided on the bottom plate 24 and the upper surface of the mask plate 30. Have been.

  The actuator 22 includes a Z-axis slider 22a and an X-axis slider 22b, as indicated by phantom lines in FIGS. 3 (a) and 3 (b). The Z-axis slider 22a has the movable portion to which the mounting portion 28 of the work supporting member 20 is attached, and transfers the work supporting member 20 in the Z-axis direction with the bottom plate 24 and the mask plate 30 being substantially horizontal. The X-axis slider has a movable portion to which the rail portion of the Z-axis slider 22a is attached, and transfers the Z-axis slider 22a in the X-axis direction. Thereby, the work 3 carried into the work support member 20 can be horizontally supported, and the work 3 can be transferred to appropriate positions in the Z-axis direction and the X-axis direction.

  In addition, the work transfer mechanism 18 includes a liquid level detection device (not shown). The liquid level detecting device is a device that detects the height of the liquid surface Ha of the molten solder H using a sensor or the like, and the position in the Z-axis direction when the work 3 is transferred is detected by the liquid level detecting device. It is determined based on the height of the liquid surface Ha. When the height of the liquid level Ha is managed so as to be substantially constant, the liquid level detecting device can be omitted.

  Next, a soldering method performed by the soldering apparatus 10 will be described with reference to FIGS. First, the work support member 20 is transferred to the work loading / unloading port 12a, and the worker sets the work 3 (and the carrier 4) on the work support member 20, as shown in FIG. The state in which the work 3 is set on the work support member 20 is as shown in FIG.

  Although not shown in FIG. 4B, a temporary fixing jig for lightly pressing the circuit component 2 so that the circuit component 2 does not fall off the printed wiring board 1 due to vibration or the like when the work 3 is transferred is used. You may make it attach. Further, a human error detection device that detects that the temporary fixing jig is not set correctly and outputs an alarm signal may be added to the soldering device 10.

  Thereafter, as shown in FIG. 5B, the work 3 and the work supporting member 20 are transferred above the spray nozzle 14a of the flux spray device 14 by the Z-axis and X-axis sliders 22a and 22b. Then, the flux coating device 14 performs a flux coating process by ejecting a predetermined amount of the flux F in a mist form from the spray nozzle 14a.

  In the flux application step, as shown in FIG. 6A, the X-axis slider 22b transfers the Z-axis slider 22a supporting the work 3 and the work supporting member 20 at a predetermined speed in the X-axis direction (left direction). I do. At the same time, the spray nozzle 14a is transferred in the Y-axis direction at a predetermined speed by the spray nozzle transfer mechanism 14b. By this operation, an appropriate amount of flux F can be applied evenly to a predetermined area on the lower surface of the work 3 and the work supporting member 20.

  The predetermined regions on the lower surfaces of the work 3 and the work supporting member 20 are at least a portion of the lower surface of the work 3 exposed from the solder hole 30a of the mask plate 30 and a solder hole of the lower surface of the mask plate. This is the periphery of 30a. The flux F may be applied to other regions (the lower surface of the bottom plate 24 of the work supporting member 20 and the like), but it is preferable to minimize the flux F because it causes extra gas to be generated during soldering.

  In addition, the scraper 16b also operates using the time during which the flux application step is being performed. In other words, as shown in FIGS. 6A and 6B, the scraper transport mechanism arranges the scraper 16b in the molten solder H and transports the scraper 16b in the X-axis direction (left direction) to agitate the molten solder H. To equalize the internal temperature. Further, the oxide film S generated on the liquid surface Ha is moved to the end of the solder pot 16a by disposing the scraper 16b at the height of the liquid surface Ha of the molten solder H and transferring the scraper 16b in the opposite direction (rightward). , To clean the liquid surface Ha. The operation of stirring the molten solder and the operation of removing the oxide film may be performed at a timing other than when the flux applying step is performed.

  When the flux application step is completed, as shown in FIG. 7A, the work 3 and the work supporting member 20 are transferred above the solder pot 16a by the X-axis slider 22b, and the mask plate immersion step is performed.

  In the mask plate immersion step, as shown in FIG. 7B, the work 3 and the work supporting member 20 are lowered by the Z-axis slider 22a, and then raised again. This step will be described in detail. First, as shown in FIG. 8A, the lower surface of the work 3 is lowered to a level where the lower surface does not come into contact with the molten solder H, and the lower surface of the mask plate 30 is immersed in the molten solder H. As shown in FIG. 8B, the solder is separated from the molten solder H again. By this operation, the flux F (excess flux F not contributing to the quality of soldering) applied to the lower surface of the mask plate 30 is degassed. The mask plate immersion step may be repeated a plurality of times to perform sufficient degassing.

  When the mask plate immersion step is completed, a work immersion step is performed next. In the work immersion step, as shown in FIG. 9A, the work 3 and the work support member 20 above the solder pot 16a are lowered by the Z-axis slider 22a, and thereafter, as shown in FIG. 9B. Then, the X-axis slider 22b transfers the Z-axis slider 22a that supports the work 3 and the work supporting member 20 in the X-axis direction (rightward and leftward), and then the Z-axis slider 22a supports the work 3 and the work. The member 20 is raised.

  The process shown in FIG. 9 will be described in detail. First, as shown in FIG. 10A, the work 3 and the work support member 20 are lowered, and the lower surface of the work 3 is immersed in the molten solder H. Then, as shown in FIG. 10B, the work 3 is reciprocated in the X-axis direction (right and left directions) in a state of being immersed, and the terminals 2a of the circuit component 2 are printed wiring board by the molten solder H. 1 is soldered to the lower surface. The number of reciprocating movements of the work 3 may be one or more. Then, the work 3 and the work supporting member 20 are raised, and the work 3 is separated from the molten solder H. With this operation, even if the work 3 or the like is immersed and the temperature of the liquid surface Ha is locally lowered, the work 3 is quickly transferred to a portion where the temperature has not been lowered. Can be soldered.

  Further, in the previous mask plate immersion step, extra flux F that does not contribute to the quality of soldering is degassed, so that the gas generated in the work immersion step is extremely small, and almost no gas is generated on the lower surface of the work (mask plate). Only the flux F gas applied to the portion (exposed from the 30 soldering holes 30a). In addition, when the work 3 reciprocates in the X-axis direction, the gas does not adhere to the terminals 2a of the circuit component 2a and easily escapes, so that poor soldering hardly occurs.

  When the work immersion step is completed, as shown in FIG. 11A, the work 3 and the work supporting member 20 are transferred to the work loading / unloading port 12a by the Z-axis and X-axis sliders 22a and 22b. Then, the worker takes out the work 3 on which the soldering is completed from the work support member 20 and sets a new work 3.

  In addition, the scraper 16b operates again using the time during which the work 3 after soldering is taken out or the like. Here, as shown in FIG. 11 (b), the oxide film S is scraped out of the solder pot portion 16a in order to discard the oxide film S which has been brought to the end of the solder pot portion 16a first, and is put into the collection box 16c. Perform the sending operation. The operation of scraping out the oxide film S may be performed once in a plurality of times instead of every time the soldering is completed once. Further, it may be performed at a timing other than when the work 3 is taken out or the like.

  As described above, according to the soldering apparatus 10, the flux F is applied to the work 3 carried into the work loading / unloading port 12a, immersed in the molten solder H, subjected to dip soldering, and transferred to the work loading / unloading port 12a. Can be performed fully automatically. Further, since the apparatus is a dip type apparatus, the running cost is lower than that of the flow type apparatus, and cleaning and maintenance are easy.

  According to the soldering apparatus 10 and the soldering method, the work 3 is immersed in the liquid surface Ha of the molten solder H, and the work 3 The work 3 can be soldered at an appropriate temperature by performing a unique operation of reciprocally moving the work 3 in the horizontal direction.

  Further, since the liquid flux F is sprayed through the spray nozzle 14a, it is possible to easily manage conditions such as the amount of jet per unit time. Further, when applying the flux, the relative positional relationship between the work 3 and the spray nozzle 14a can be easily managed by controlling the transfer speeds of the work transfer mechanism 18 and the spray nozzle transfer mechanism 14b. Therefore, the necessary and sufficient amount of the flux F can be uniformly and uniformly applied to the lower surface of the work 3 under constant conditions.

  After the flux F is applied to the work 3 or the like, the flux F (excess flux that does not contribute to the quality of soldering) applied to the mask plate 30 or the like is degassed, and then the circuit component 2 is soldered. Therefore, soldering failure due to the gas of the flux F is unlikely to occur. Therefore, the preheating time can be significantly reduced or the preheating itself can be omitted, and the tact time of a series of soldering operations can be significantly reduced.

  The soldering device and the soldering method of the present invention are not limited to the above embodiment. For example, in the case of the soldering apparatus 10, the work 3 is supported by the work supporting member 20 and the mask plate 30, and a region that does not want to be in contact with the molten solder of the printed wiring board 1 (for example, a region where a surface mount component or the like is mounted) ) Is covered by the mask plate 30, but when there is no area on the lower surface of the printed wiring board 1 where it is not desired to make contact with the molten solder, the mask plate 30 is omitted and the work 3 is supported by another method. You may make it. In this case, the mask plate immersion step can also be omitted.

  Since the flux application device 14 is configured to move one spray nozzle 14a by the spray nozzle transfer mechanism 14b, when a different work 3 is carried in, the application area of the flux F can be easily adjusted according to the size and shape of the work 3. Although there is a feature that it can be changed, for example, when the size of the work to be carried in is almost constant, the spray nozzle transfer mechanism 14b is omitted, and a plurality of spray nozzles are arranged in a predetermined position and arranged. It may be.

  Since the scraper transfer mechanism of the dip solder tank 16 can move the scraper 16b in the Z-axis direction and the X-axis direction, the two operations of stirring the inside of the molten solder and removing the oxide film on the liquid surface are performed in one operation. Although there is a feature that the scraper 16b can perform the operation, two scrapers (a stirring member and an oxide film removing member) may be separately provided to simplify the configuration of the scraper transfer mechanism. Further, the scraper and the scraper transfer mechanism may be omitted as necessary.

  The layout inside the soldering device 10, that is, the layout of the flux coating device 14, the dip solder tank 16, and the loading / unloading port 12a (loading port and loading / unloading port) is an example, and may vary depending on the configuration of the line where the soldering device is used. It can be changed as appropriate. Also, the configurations of the actuator and the work support member used for the work transfer mechanism can be appropriately changed according to the layout inside the soldering apparatus and the form of the work.

  In the description of the above-described embodiment, the vertical direction and the horizontal direction have been described with reference to the X, Y, and Z axis directions that are orthogonal to each other. There is no. Similarly, when the work is supported by the work transfer mechanism, the work does not need to be strictly horizontal, and may be slightly inclined as long as the lower surface of the work can be soldered by the above-described operation.

DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Circuit component 2a Terminal 3 Work 10 Soldering device 14 Flux coating device 14a Spray nozzle 14b Spray nozzle transfer mechanism 16 Dip solder tank 16a Solder pot 16b Scraper 18 Work transfer mechanism 20 Work support member 22 Actuator 30 Mask plate 30a soldering hole H molten solder Ha liquid level S oxide film

Claims (4)

A flux application device for applying a liquid flux through a spray nozzle to a lower surface of a work on which circuit components are mounted on a printed wiring board, and a solder pot, and the lower surface of the work is immersed in molten solder in the solder pot. A dip solder tank for soldering the terminals of the circuit components to the lower surface side of the printed wiring board; and a work for horizontally supporting the work and transferring the work to appropriate positions in the vertical and horizontal directions. With a transfer mechanism,
The work transfer mechanism transfers the work to which the flux has been applied to above the solder pot, and lowers the work so that the lower surface of the work is immersed in the molten solder. In a soldering apparatus that reciprocates the work in the horizontal direction, solders the terminals of the circuit components by the molten solder, and raises the work to separate it from the molten solder .
The work transfer mechanism includes a work support member that horizontally supports the work, and an actuator that transfers the work support member. The work support member includes a plate that supports a lower surface of the printed wiring board on an upper surface. -Shaped member, provided with a mask plate in which a soldering hole for exposing the terminal of the circuit component is formed,
The flux applying device applies the flux in a state where the work is placed on the upper surface of the mask plate, and the dip solder tank performs soldering in a state where the work is mounted on the upper surface of the mask plate. And do
The thickness of the mask plate is set so that the terminals of the circuit components do not protrude from the lower surface of the mask plate and fit inside the soldering holes when the work is placed on the upper surface of the mask plate. And
The work transfer mechanism transfers the work support member from the position of the flux coating device to above the solder pot, and lowers the work support member to a height at which the lower surface of the work does not contact the molten solder. The lower surface of the mask plate is immersed in the molten solder, the work support member is raised again to separate the mask plate from the molten solder, and a reciprocating operation in the vertical direction is possible, and the work support member is moved. A lower surface of the work can be immersed in the molten solder by lowering the work .   The flux coating device is provided with a spray nozzle transfer mechanism for transferring the spray nozzle in a horizontal direction, and the spray nozzle and the work are moved in a direction crossing each other in a horizontal plane, whereby the lower surface of the work is moved. 2. The soldering apparatus according to claim 1, wherein the flux is applied to a predetermined area of the solder. The dip solder bath is provided with an elongated plate-shaped scraper, and a scraper transfer mechanism that horizontally supports the scraper and transfers the scraper vertically and horizontally,
The scraper transfer mechanism arranges the scraper in the molten solder and transfers the scraper in the horizontal direction, whereby the molten solder is stirred, and the scraper transfer mechanism arranges the scraper at a liquid level of the molten solder. 3. The soldering device according to claim 1, wherein the oxide film generated on the liquid surface of the molten solder is removed by transferring the molten solder horizontally. Performs a flux application process of applying a liquid flux through a spray nozzle to the lower surface of the work on which the circuit components are mounted on the printed wiring board,
After the flux application step, the work is made horizontal, and the lower surface of the work is immersed in the molten solder in the dipping type solder pot, and the work is reciprocated in the horizontal direction in the immersed state. In a soldering method for performing a work immersion step of soldering the terminals of the circuit component to the lower surface of the printed wiring board by soldering,
Prepare a mask plate, which is a plate-shaped member that supports the lower surface of the printed wiring board on the upper surface, and has a soldering hole formed inside to expose terminals of the circuit component. Performing the step in a state where the work is placed on the upper surface of the mask plate,
The thickness of the mask plate is set so that the terminals of the circuit components do not protrude from the lower surface of the mask plate and fit inside the soldering holes when the work is placed on the upper surface of the mask plate. ,
After the flux application step, the mask plate and the work are made horizontal, and the lower surface of the work is lowered to a height at which the lower surface of the work does not come into contact with the molten solder, and the lower surface of the mask plate is immersed in the molten solder. A soldering method, comprising: performing a mask plate dipping step of separating from a solder; and performing the work dipping step after the mask plate dipping step .

Images