CN110560818B - High-yield full-automatic dip soldering machine and corresponding dip soldering method - Google Patents
High-yield full-automatic dip soldering machine and corresponding dip soldering method Download PDFInfo
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- CN110560818B CN110560818B CN201910875582.0A CN201910875582A CN110560818B CN 110560818 B CN110560818 B CN 110560818B CN 201910875582 A CN201910875582 A CN 201910875582A CN 110560818 B CN110560818 B CN 110560818B
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- circuit board
- dip soldering
- dip
- conveying
- soldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Abstract
The invention provides a high-yield full-automatic dip soldering machine and a corresponding dip soldering method. The dip soldering method adopts the modes of obliquely entering the circuit board into the molten tin, obliquely separating from the molten tin, carrying out vibration dip soldering on the circuit board, transversely moving the dip soldering process, differentially ascending strokes at two ends of the circuit board and the like, thereby improving the quality and yield of soldering tin.
Description
Technical Field
The invention relates to the field of dip soldering equipment, in particular to a high-yield full-automatic dip soldering machine and a corresponding dip soldering method.
Background
Dip soldering is a multi-spot soldering method which is widely applied to plug-in processes and SMT red glue surfaces (SMT is a surface assembly technology and is the most popular technology and process in the electronic assembly industry at present), and a large amount of tin is boiled and melted by hands or machines, and a soldering surface is immersed so that tin is applied to soldering points.
At present, the dip soldering operation of most circuit boards gradually begins to be changed from manual operation to mechanical operation, but dip soldering equipment in the prior art has various defects, such as poor fixing stability of the circuit boards, unstable induction systems, or the problems of poor dip soldering effect, low yield and low efficiency caused by the reasons of simple dip soldering method, poor optimization and the like.
Therefore, it is necessary to provide a high yield fully automatic dip soldering machine and a corresponding dip soldering method to solve the above technical problems.
Disclosure of Invention
The invention provides a full-automatic dip soldering machine with high yield and a corresponding dip soldering method, and aims to solve the problems of poor dip soldering effect, low yield and low efficiency caused by the facts that dip soldering equipment in the prior art has various defects, for example, fixing of a circuit board is not stable enough, an induction system is not stable enough, or a dip soldering method is simple and not optimized enough.
In order to solve the technical problems, the technical scheme of the invention is as follows: a high-yield full-automatic dip soldering machine is used for soldering and connecting electronic elements inserted on a circuit board with the circuit board, and comprises:
the input platform is used for conveying circuit board feeding;
the output platform is used for conveying the circuit board to discharge;
the tin furnace is positioned between the input platform and the output platform and used for loading tin liquid for dip soldering the circuit board;
the bracket is fixedly arranged above the tin furnace and is of a frame-shaped structure;
the telescopic device is arranged on the inner side of the bracket and comprises a first telescopic part and a second telescopic part;
the dip soldering conveying mechanism is positioned above the tin furnace, and a first end of the dip soldering conveying mechanism is movably connected with the first telescopic part, and a second end of the dip soldering conveying mechanism is movably connected with the second telescopic part, and is used for receiving the circuit board from the input platform, performing dip soldering on the received circuit board, and conveying the dip soldered circuit board to the output platform;
the dip-soldering conveying mechanism comprises conveying chains, a transfer piece and a pressing piece, wherein the transfer piece is connected to the outer side of the conveying chains, the conveying chains are arranged in an opposite mode, a circuit board is located on the transfer piece between the conveying chains in two modes, the transfer piece is driven by the conveying chains to run, the circuit board is conveyed, and the pressing piece is used for pressing and fixing the circuit board on the transfer piece.
According to the invention, the dip welding conveying mechanism further comprises a main body rod, an adjusting plate, a sliding connecting rod, a bolt piece and a spring, wherein the main body rod is used for being connected with the telescopic device and used for arranging the conveying chain;
the sliding connection rod is fixedly arranged on the main body rod, the adjusting plate is connected to the sliding connection rod in a sliding mode through a sliding connection hole, the spring is sleeved on the sliding connection rod and is arranged between the main body rod and the adjusting plate in a compression mode, a first threaded hole is formed in the main body rod, a first through hole is formed in the adjusting plate, the bolt penetrates through the through hole and is connected with the first threaded hole, and the distance between the main body rod and the adjusting plate is adjusted through screwing the bolt;
the pressing and fixing piece is connected with the adjusting plate, so that the pressing and fixing space between the pressing and fixing piece and the adapter piece for the circuit board can be adjusted by adjusting the adjusting plate.
The pressing and fixing part comprises a pressing plate and a connecting plate, the pressing plate is connected to one end of the connecting plate, the surface of the pressing plate is approximately vertical to the surface of the connecting plate, the connecting plate is connected to the top of the adjusting plate, and the pressing plate is located on one side of the main body rod and used for pressing and fixing the circuit board;
the adjusting plate is provided with a second threaded hole, the connecting plate is provided with a connecting groove corresponding to the second threaded hole, and the connecting groove extends in the direction away from the pressing plate and penetrates through the edge of the connecting plate.
In the invention, the full-automatic dip welding machine also comprises a dip welding sensor, a movable plate and a cylinder for driving the movable plate;
the dip soldering sensor is arranged on the dip soldering conveying mechanism and located above the conveying chain, and the dip soldering sensor is close to the second end of the dip soldering conveying mechanism and used for sensing the position of the circuit board on the conveying chain;
the cylinder is arranged on one side of the top of the tin furnace, and the movable plate is connected to an expansion rod of the cylinder so as to be driven by the cylinder to move to the position below the dip soldering sensor and be sensed by the sensor.
In the invention, along the conveying direction of the conveying chain, two ends of the dip soldering conveying mechanism are respectively movably connected with the first telescopic part and the second telescopic part, one end of the input platform close to the dip soldering conveying mechanism is provided with a feeding support member for supporting a circuit board, the feeding support member extends between two sets of adapter members of the conveying chain, one end of the output platform close to the dip soldering conveying mechanism is provided with a receiving support member for supporting the circuit board, and the receiving support member extends between two sets of adapter members of the conveying chain.
The invention comprises a dip soldering method for dip soldering by using the full-automatic dip soldering machine with high yield, which comprises the following steps:
the input platform is controlled to convey the circuit board to the dip soldering conveying mechanism, and the conveying chain is used for conveying the circuit board to a set position through the induction of the dip soldering inductor;
controlling the expansion device to extend according to a sensor signal of the dip soldering sensor so that the circuit board descends and obliquely enters tin liquid of the tin furnace, and the circuit board is finally horizontally immersed in the tin liquid;
controlling the telescopic device to contract so that the circuit board rises to a critical position in a horizontal state;
controlling the telescopic device to contract so that the circuit board rises from a critical position and is obliquely moved out of the tin furnace, and when the dip soldering conveying mechanism rises to an output position, the circuit board is in a horizontal state;
and controlling the output platform to receive the circuit board on the dip soldering conveying mechanism for outputting.
Preferably, the dip soldering method further comprises:
when the circuit board is horizontally immersed in the tin liquid, the telescopic device is controlled to stretch, so that the circuit board vibrates in the tin liquid.
Wherein, the dip soldering method further comprises:
when the circuit board rises and inclines to move out of the tin furnace, the conveying chain is controlled to operate so that the circuit board moves transversely, and tension generated when the tin liquid is separated from the circuit board is restrained.
Further, controlling the operation of the conveyor chain to enable the circuit board to move transversely specifically comprises:
when the telescopic device contracts by a first contraction amount, controlling the conveying chain to operate so that the circuit board transversely moves towards the higher end of the circuit board;
and when the telescopic device contracts by a second contraction amount, controlling the conveying chain to operate so that the circuit board transversely moves towards the lower end of the circuit board, wherein the second contraction amount is larger than the first contraction amount, and when the telescopic device contracts by the second contraction amount, the tail end part of the circuit board is soaked in the tin liquid.
In addition, the step of controlling the telescopic device to contract so that the circuit board rises and is obliquely moved out of the tin furnace comprises the following steps:
controlling the first telescopic part to contract at a first speed and then at a second speed, and controlling the second telescopic part to contract at a third speed, wherein the contraction of the second telescopic part is earlier than that of the first telescopic part, the third speed is higher than the first speed, and the third speed is equal to the second speed.
Compared with the prior art, the invention has the beneficial effects that: according to the high-yield full-automatic dip soldering machine, the movable plate is arranged to prevent the dip soldering sensor from directly irradiating the tin liquid level, so that stable sensing signals are obtained, the feeding support piece and the receiving support piece are arranged, so that the transfer stability is improved, the faults are reduced, the efficiency is improved, and meanwhile, the stability of a circuit board is improved by arranging the pressing mechanism, so that a stable dip soldering effect is obtained.
Meanwhile, the dip soldering method adopts the modes of obliquely entering the circuit board into the molten tin, obliquely separating from the molten tin, carrying out vibration dip soldering on the circuit board, transversely moving the dip soldering process, differentially ascending strokes at two ends of the circuit board and the like, so that the quality and the yield of soldering tin are improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments are briefly introduced below, and the drawings in the following description are only corresponding to some embodiments of the present invention.
FIG. 1 is a schematic structural diagram of a preferred embodiment of the fully automatic dip soldering machine of the present invention.
FIG. 2 is a top view of the full-automatic dip soldering machine of the present invention with the bracket removed.
FIG. 3 is a schematic structural diagram of a tin furnace, a tin scraping mechanism and a movable plate of the full-automatic dip soldering machine of the present invention.
FIG. 4 is a schematic structural diagram of a tin furnace and a tin scraping mechanism of the full-automatic dip soldering machine of the invention.
Fig. 5 is a schematic structural diagram of a dip soldering conveying mechanism of the full-automatic dip soldering machine.
FIG. 6 is a schematic structural view of a dip soldering device of the full-automatic dip soldering machine of the present invention
Fig. 7 is a partial structural schematic view of a feeding support part and a dip-soldering conveying mechanism of the full-automatic dip soldering machine.
Fig. 8 is a partial structural schematic view of a feeding support member of the fully automatic dip welding machine of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, directional terms such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", "top" and "bottom" are used only with reference to the orientation of the drawings, and the directional terms are used for illustration and understanding of the present invention, and are not intended to limit the present invention.
The terms "first," "second," and the like in the terms of the invention are used for descriptive purposes only and not for purposes of indication or implication relative importance, nor as a limitation on the order of precedence.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly, e.g., the connection may be a detachable connection or a connection in a unitary structure; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The dip soldering equipment in the prior art has various defects, such as poor fixation of a circuit board, unstable induction system, simple dip soldering method, poor optimization and the like, and the problems of poor dip soldering effect, low yield and low efficiency.
The following is a preferred embodiment of the present invention for providing a fully automatic dip soldering machine capable of solving the above technical problems.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a preferred embodiment of the full-automatic dip soldering machine of the present invention, and fig. 2 is a top view of the full-automatic dip soldering machine of the present invention after a bracket is removed.
In the drawings, elements having similar structures are denoted by the same reference numerals.
The invention provides a full-automatic dip soldering machine which is used for soldering and connecting electronic elements inserted on a circuit board with the circuit board and comprises a first conveying platform 101, a second conveying platform 102, a spraying device 103, a first preheating device 104, a second preheating device 105, a dip soldering device, an output platform 117, a controller and a plurality of inductors.
The first conveyance stage 101 and the second conveyance stage constitute an input stage for inputting a circuit board to the dip soldering apparatus.
The first conveying platform 101 is used for conveying a circuit board, and the first conveying platform 101 is driven by a first stepping motor 106 connected with a first encoder, so as to accurately control the conveying circuit board to move to a set position.
The second conveying platform 102 is butted behind the first conveying platform 101 and used for conveying the circuit board, and the second conveying platform 102 is driven by a second stepping motor 107 connected with a second encoder and used for accurately controlling the circuit board to move to a set position.
The spraying device 103 is arranged below the first conveying platform 101 and is used for spraying the soldering flux on the circuit board on the first conveying platform 101.
The first preheating device 104 is arranged on the first conveying platform 101 and behind the spraying device 103 and used for preheating the sprayed circuit board, the first preheating device 104 comprises a first outer cover, a first air guide channel arranged in the first outer cover, a first heat-emitting pipe and a first fan 118 (the reference numeral 104 indicates the first outer cover), the first fan 118 is arranged below, the circuit board sprayed with soldering flux passes above the first heat-emitting pipe, the first air guide channel is communicated with an inner cavity of the first outer cover through a plurality of air outlet holes, heat generated by the heat-emitting pipe of the first preheating device 104 is blown to the air guide channel through blowing of the first fan 118, and then the heat is diffused into the inner cavity of the first outer cover, so that the circuit board is heated more comprehensively.
The second preheating device 105 is arranged on the second conveying platform 102 and behind the first preheating device 104 and used for preheating the circuit board, the second preheating device 105 is consistent with the first preheating device 104 and comprises a second outer cover, a second air guide channel arranged in the second outer cover, a second heating tube and a second fan 119, the preheating temperature of the second preheating device 105 is higher than that of the first preheating device 104, and soldering flux is more stably adhered and the dip soldering effect is good through two times of preheating which are gradually increased in temperature.
The dip soldering device is connected behind the second conveying platform 102 in a butt joint mode and comprises a support 113, a dip soldering conveying mechanism 114 movably connected to the support 113 and a tin furnace 116 located below the dip soldering conveying mechanism 114, the dip soldering conveying mechanism 114 is used for being in butt joint with the second conveying platform 102 and placing the received circuit board into the tin furnace 116 for soldering, and the dip soldering conveying mechanism 114 is driven by a third stepping motor 108 connected with a third encoder and used for accurately controlling the circuit board to be moved to a set position.
The output platform 117 is butted at the rear part of the dip soldering device and is used for outputting the dip soldered circuit board.
The dip soldering sensor 121 is disposed on the support 113 above the dip soldering conveying mechanism 114.
The controller is electrically connected with the dip soldering sensor 121 to control the start and stop of the dip soldering conveying mechanism 114 according to the sensing signal of the dip soldering sensor 121, so that the circuit board moves and stops at the set position on the dip soldering conveying mechanism 114 to perform soldering operation.
It should be noted that, the sensor in this embodiment can sense the time when the head and the tail of the circuit board pass through the sensor, so as to feed back the data to the controller, and the encoder controls the motor to operate a corresponding stroke, so as to accurately control the circuit board to move to a set position.
Specifically, the full-automatic dip welding machine of the present invention further includes a first inductor 109, a second inductor 120, a third inductor 110, and a fourth inductor 111.
The first inductor 109 is arranged on the first conveying platform 101 and located at the front end of the spraying device 103, and is used for inducing the circuit board to convey the circuit board to a set position on the first conveying platform 101;
the second inductor 120 is disposed between the first conveying platform 101 and the second conveying platform 102, and is used for inducing the circuit board to convey the circuit board to a set position on the second conveying platform 102;
the third sensor 110 is disposed between the second conveying platform 102 and the dip soldering device, and is used for sensing the circuit board to control the stop of the second conveying platform 102 and the receiving of the circuit board on the second conveying platform 102 by the dip soldering conveying mechanism 114;
the fourth inductor 111 is arranged between the dip soldering device and the output platform 117 and is used for sensing the output of the circuit board;
the controller is electrically connected with the spraying device 103, the first preheating device 104, the second preheating device 105, the dip soldering device, the output platform 117, the first sensor 109, the second sensor 120, the third sensor 110 and the fourth sensor 111, so as to control the start and stop of the first conveying platform 101, the first preheating device 104 and the sprayer according to the sensing signal of the first sensor 109, control the start and stop of the second conveying platform 102 and the second preheating device 105 according to the sensing signal of the second sensor 120, control the stop of the first conveying platform 101 and the second conveying platform 102 and the start and stop of the dip soldering conveying mechanism 114 according to the sensing signal of the third sensor 110, give priority to the sensing signal of the third sensor 110 over the sensing signal of the second sensor 120, and control the start and stop of the output platform 117 according to the sensing signal of the fourth sensor 111.
In addition, a fifth sensor 112 may be disposed at the end of the output platform 117 for sensing a board signal when the end is connected to other corresponding receiving devices.
Referring to fig. 1 and 3, preferably, the full-automatic dip soldering machine of the present invention further includes a movable plate 122 and a cylinder 115, the cylinder 115 is disposed at one side of the top of the solder pot 116, the movable plate 122 is connected to an expansion rod of the cylinder 115 to drive the movable plate 122 to move to a position below the dip soldering sensor 121 through the cylinder 115 for being sensed by the dip soldering sensor 121, so as to obtain a stable sensing signal, thereby preventing the fault from being easily generated, and the work efficiency is higher, thereby preventing the infrared signal from being incident on the white reflective solder liquid, which is reflected by the mirror surface, causing unstable sensing of the dip soldering sensor 121, and the liquid level of the solder liquid from fluctuating, so that the dip soldering sensor 121 easily generates an error signal.
It should be noted that the dip soldering sensor 121 senses different signals from the circuit board and the movable sensing plate, and the control can make corresponding control signals according to the change of the signals.
The cylinder 115 is arranged on the base through a fixing frame 124 and is positioned at one side of the tin furnace 116, dust is easy to generate in various operations in a factory, and the protective cover 123 is arranged outside the cylinder 115, so that the working efficiency and the service life of the cylinder are improved.
Referring to fig. 3 and 4, the full-automatic dip soldering machine of the present invention further includes a tin scraping mechanism, wherein the tin scraping mechanism includes a slide rail 127, a rotating shaft 126, a tin scraping plate 125, an extrusion bar 129, an adjusting member 130, and a driving portion.
The two slide rails 127 are respectively located at two outer sides of the tin furnace 116, and the slide rails 127 are fixedly connected to the two outer sides of the tin furnace 116 through corresponding plates.
Two ends of the rotating shaft 126 are slidably connected to the two sliding rails 127 through connecting members 128, respectively.
One side of the tin scraping plate 125 is fixedly connected to the rotating shaft 126, so that oxides on the liquid surface can be scraped by moving, the oxides can affect the dip soldering effect, and the track of the tin scraping plate 125 rotating along with the rotating shaft 126 comprises a tin scraping position for scraping the oxides and an escape position for avoiding the tin liquid.
The driving part is used for driving the rotating shaft 126 to slide along the sliding rail 127, which is not shown in the figure, and the driving part may be composed of a motor and a chain, the chain is driven by the motor, and then the connecting part 128 is driven by the chain to slide, but the driving method is not limited thereto.
Wherein, the extrusion strip 129 and a slide rail 127 are arranged at the same side of the tin furnace 116 and are parallel to the extending direction of the slide rail 127;
the adjusting member 130 is rotatably connected to one end of the rotating shaft 126, and a limiting position is arranged on the rotating track, so that when the rotating shaft 126 slides, the rotating shaft and the extrusion strip 129 form extrusion and rotate, and the rotating shaft 126 is driven to rotate through rotating to the limiting position, so that the tin scraping plate 125 rotates to the open position, and when the tin scraping plate 125 is located at the open position, the tin scraping plate 125 is away from the liquid level of the tin liquid by a set distance.
As shown in fig. 4, when the rotating shaft 126 slides to the back side of the illustrated orientation, the adjusting member 130 gradually presses against the pressing strip 129 and rotates around the rotating shaft 126, and when the rotating shaft rotates to the limiting position, the adjusting member cannot rotate any more, and the rotating shaft 126 is driven to rotate together, so that the tin scraping plate 125 can rotate to the open position.
The scraping plate 125 in this embodiment rotates to the scraping position under the action of gravity, and when the scraping plate 125 is located the scraping position, it is a certain inclination angle with the liquid level of tin liquid, thereby facilitating the scraping, and the scraping plate 125 keeps sliding to the second end at the first end of the scraping position, then rotates to the avoiding position, and then slides from the second end and returns to the first end.
Referring to fig. 5 and 6, the dip soldering apparatus includes a support 113, a dip soldering conveying mechanism 114, and a telescopic device, wherein a substrate 140 is disposed on the top of the support 113, and the telescopic device is disposed on the substrate 140.
The dip-soldering conveying mechanism 114 comprises conveying chains, adapters 132 connected to the outer sides of the conveying chains, main body rods 131 used for arranging the conveying chains, connecting shafts 138 and a pressing mechanism, wherein the two ends between the two main body rods 131 are connected with the connecting shafts 138, the two groups of conveying chains are arranged oppositely, a circuit board is arranged on the adapters 132 between the two groups of conveying chains, the adapters 132 are driven by the conveying chains to operate, the circuit board is further conveyed, and the pressing mechanism is used for pressing and fixing the circuit board on the adapters 132.
The telescopic device comprises a first telescopic part and a second telescopic part, as shown in fig. 6, the lifting motor 141, the lead screw 144, the nut member, the connecting frame 143 and the guide column 142 at one end form the first telescopic part, and the lifting motor 141, the lead screw 144, the nut member, the connecting frame 143 and the guide column 142 at the other end form the second telescopic part.
The first telescopic part and the second telescopic part are in one-to-one correspondence to be rotatably connected with the two connecting shafts 138, and the rotating axis is consistent with the axial direction of the connecting shafts 138, so that the first telescopic part and the second telescopic part can be controlled to obliquely enter the molten tin dip soldering process or obliquely separate the molten tin from the circuit board.
The first end and the first flexible portion swing joint of dip-soldering conveying mechanism 114, the second end with second flexible portion swing joint, the one end that dip-soldering conveying mechanism 114 is close to dip-soldering inductor 121 is the second end.
The first telescopic part and the second telescopic part have the same structure and respectively comprise a lifting motor 141, a lead screw 144, a nut piece, a connecting frame 143 and a guide post 142;
the lifting motor 141 is arranged at the top of the base plate, the screw 144 is connected with the middle of the connecting frame 143 through a nut member, one end of the guide post 142 is connected with the base plate in a sliding manner, the other end of the guide post 142 is fixedly connected with the connecting frame 143, the two guide posts 142 are respectively connected with two ends of the connecting frame 143, two ends of the connecting frame 143 are rotatably connected with two ends of the connecting shaft, and the two guide posts 142 of the same telescopic part are fixedly connected through a connecting rod 145, so that the sliding stability of the guide post 142 is enhanced.
Two ends of the connecting shaft 138 are connected with a main body rod 131 in a transmission mode, and a hand wheel is arranged at one end of the connecting shaft 138 to drive the connecting shaft 138 to rotate through the hand wheel, so that the distance between the two main body rods is adjusted.
The press-fixing mechanism in this embodiment includes a press-fixing member, an adjusting plate 133, a slide bar 136, a bolt member 139, and a spring 137.
The sliding rod 136 is fixedly arranged on the main body rod 131, the adjusting plate 133 is connected to the sliding rod 136 in a sliding mode through a sliding hole, the spring 137 is sleeved on the sliding rod 136 and is arranged between the main body rod 131 and the adjusting plate 133 in a compression mode, a first threaded hole is formed in the main body rod 131, a through hole is formed in the adjusting plate 133, the bolt piece 139 penetrates through the through hole to be connected with the first threaded hole, the adjusting plate 133 can be pressed and fixed through a handle on the bolt piece 137, the pressure degree of the adjusting plate 133 is changed through screwing the bolt piece 139, the compression degree of the spring 137 is adjusted, and therefore the distance between the main body rod 131 and the adjusting plate 133 is adjusted.
Wherein the pressure firmware is connected with regulating plate 133 to can adjust the solid space of pressure to the circuit board between pressure firmware and the adaptor through adjusting regulating plate 133, can pass through the solid space of pressure smoothly when making the circuit board transported, during the dip-soldering simultaneously, the pressure firmware can form stable pressure to the circuit board again and solidly.
Specifically, the press-fixing member includes a press plate 134 and a connecting plate 135, the press plate 134 is connected to one end of the connecting plate 135, the plate surface is approximately vertical, the connecting plate 135 is connected to the top of the adjusting plate 133, and the press plate 134 is located on one side of the main body rod 131 and used for press-fixing the circuit board;
be provided with the second screw hole on regulating plate 133, be provided with the connecting groove corresponding with the second screw hole on connecting plate 135, the connecting groove extends and link up to connecting plate 135's edge to the direction of keeping away from clamp plate 134 for can be earlier with the screw connection on the second screw hole, connecting plate 135 passes through the connecting groove and pegs graft with the screw, screws up the screw at last again and fastens, and it is convenient to install, and the adjustability is strong.
Referring to fig. 7 and 8, fig. 7 is a partial structural schematic view of a feeding support member and a dip soldering conveying mechanism of the full-automatic dip soldering machine of the present invention, and fig. 8 is a partial structural schematic view of the feeding support member of the full-automatic dip soldering machine of the present invention.
In this embodiment, a feeding support member for supporting the circuit board is disposed at one end of the second conveying platform 102 close to the dip soldering device, the feeding support member extends between the adapters 132 of the two sets of conveying chains, a receiving support member for supporting the circuit board is disposed at one end of the output platform 117 close to the dip soldering device, and the receiving support member extends between the adapters 132 of the two sets of conveying chains.
The second conveying platform 102 and the output platform 117 both include fixing rods, the fixing rods are used for arranging conveying chains and other components, the feeding support and the receiving support are consistent in structure and both include a support sheet 146, a connecting sheet 148 and a middle sheet 147 for connecting the support sheet 146 and the connecting sheet 148;
the support sheet 146 and the connection sheet 148 are respectively connected to two sides of the fixing rod in the vertical direction, a long strip-shaped connection hole 149 for fixedly connecting the fixing rod is arranged on the connection sheet 148, and the length direction of the connection hole 149 is the vertical direction so as to adjust the support height of the support sheet 146.
The dip soldering method for dip soldering by the full-automatic dip soldering machine comprises the following steps:
according to the sensing signal of the first sensor 109, the first conveying platform 101 is controlled to start and stop, so that the circuit board is conveyed to pass through the spraying device 103 and is conveyed to a position opposite to the first preheating device 104 for a set preheating time.
Controlling the second conveying platform 102 to start and stop according to the sensing signals of the second sensor 120 and the third sensor 110, so that the circuit board is conveyed to a position opposite to the second preheating device 105, stays for a set preheating time, and is conveyed to a position close to the dip soldering device;
specifically, when the second sensor 120 senses the circuit board, the second transportation platform 102 is controlled to operate to transport the circuit board to a position opposite to the second preheating device 105;
preferably, the sensing signal of the third sensor 110 is prior to the sensing signal of the second sensor 120, and when there is a signal of the second sensor 120 and the signal of the third sensor 110, the sensing signal 101 of the third sensor 110 is preferentially executed to stop the circuit board from being conveyed to the second conveying platform 102, and the control unit controls the second conveying platform 102 to stop, controls the solder dip conveying mechanism 114 to be in butt joint with the second conveying platform 102, and receives the circuit board.
It should be noted that, when the circuit board is conveyed on the first conveying platform 101 and the controller receives a signal of the third sensor 110 sensing the circuit board, the first conveying platform 101 stops conveying the circuit board to the second conveying platform 102 when the circuit board is sensed by the second sensor 120;
until the third sensor 110 does not sense the circuit board, the controller controls the first transportation platform 101 and the second transportation platform 102 to operate according to the sensing signal of the second sensor, so as to transport the circuit board to the set position on the second transportation platform 102.
Therefore, the circuit boards can be prevented from being abnormally transferred due to various reasons, for example, the circuit boards are clamped between the second conveying platform 102 and the dip soldering conveying mechanism 114, and when similar conditions occur, the first conveying platform 101 continues to convey the circuit boards to the second conveying platform 102, so that the machine is easy to operate disorderly, the machine breaks down, and even the circuit boards are damaged.
It should be further understood that the time for dip soldering the solder conveying mechanism 114 is shorter than the time for preheating, and in general, normally, when the third sensor 110 senses the circuit board, the solder conveying mechanism 114 can immediately receive the circuit board;
in addition, the first preheating device 104 and the second preheating device 105 preheat for an equal time, and the former circuit board generally arrives at the second preheating device 105 first, and the latter circuit board arrives at the first preheating device 104 later, so the second preheating device 105 can preheat the circuit board and transport the circuit board to the dip soldering transport mechanism 114 through the second transport platform 102, and then the first transport platform 101 can transport the latter circuit to the second transport platform 102.
The movable plate 122 is controlled to move according to sensing signals of the third sensor 110 and the dip soldering sensor 121, the movable plate 122 extends below the dip soldering sensor 121 when the third sensor 110 senses a circuit board, and the movable plate 122 retracts when the dip soldering sensor 121 senses a circuit board, so that the descending dip soldering operation of the dip soldering conveying mechanism 114 is not disturbed.
And controlling the operation of the dip soldering device according to the sensing signals of the third sensor 110 and the dip soldering sensor 121, so as to receive the circuit board on the second conveying platform 102 and perform dip soldering on the circuit board.
And controlling the start and stop of the output platform 117 according to the sensing signal of the fourth sensor 111, so as to receive the circuit board on the dip soldering device for outputting.
When the dip soldering device receives the circuit board and carries out dip soldering operation, the dip soldering device comprises the following steps:
and controlling the second conveying platform 102 to convey the circuit board to the dip soldering device, and enabling the conveying chain to convey the circuit board to the set position through the induction of the dip soldering inductor 121.
According to the sensor signal of the dip soldering sensor 121, the extension of the telescopic device is controlled to enable the circuit board to descend and obliquely enter the tin liquid of the tin furnace 116, and the circuit board is finally horizontally immersed in the tin liquid, wherein the circuit board is generally arranged in a jig for dip soldering, and the circuit board and the pins are immersed in the tin liquid at the moment.
The shrinkage of the telescopic device is controlled, so that the circuit board rises to a critical position in a horizontal state, the critical position refers to the position where the circuit board is attached to the liquid level of the tin liquid, and only the pins of the electronic elements are immersed in the tin liquid, so that when the circuit board is separated from the tin liquid, excessive adhesion between the circuit board and the tin liquid can be reduced, and the circuit board can be quickly separated from the tin liquid by subsequent operation.
The retraction of the retractable device is controlled so that the circuit board rises from the critical position and is tilted out of the solder pot 116, and when the dip soldering device rises to the output position, the circuit board is horizontal.
The control output platform 117 receives the circuit board on the dip soldering apparatus for output.
Preferably, when the circuit board level soaks in tin liquid, the control telescoping device is flexible for the circuit board shakes in tin liquid, because the circuit board is more and more accurate, the space region between some pins is less, and the tin liquid is because having viscidity tension and filling clearance region that can not be very smooth, and the mode that adopts vibrations in this embodiment can be fine fills tin liquid to clearance region, thereby obtains better dip-soldering effect.
The dip soldering method further comprises the following steps:
when the circuit board rises and slantingly moves out of the tin furnace 116, the operation of the conveying chain is controlled to enable the circuit board to transversely move so as to inhibit the tension generated when the tin liquid is separated from the circuit board and prevent poor dip soldering effect caused by tin adhesion.
Wherein, control conveyor chain operation makes circuit board lateral shifting specifically include:
when the telescopic device contracts by a first contraction amount, the conveying chain is controlled to operate, so that the circuit board transversely moves towards the higher end of the circuit board, namely towards the end close to the dip soldering sensor 121.
When the telescopic device contracts by a second contraction amount, the operation of the conveying chain is controlled to enable the circuit board to transversely move towards the lower end of the circuit board, namely, towards the end far away from the dip soldering sensor 121,
wherein, the second shrinkage is greater than first shrinkage, and when the telescoping device shrink second shrinkage, the circuit board only has the length that is less than 2cm to soak in tin liquid, deviate from the anterior segment process of tin liquid at the circuit board slope, should be to the higher one end lateral shifting of circuit board, the face and the tin liquid of avoiding the circuit board that can be best are glued even, when the circuit board is about to deviate from, should be to the lower one end lateral shifting of circuit board, reverse direction movement promptly, the terminal portion and the tin liquid of avoiding the circuit board that can be best are glued even.
The steps of controlling the retraction device to retract so that the circuit board rises and moves out of the solder pot 116 in an inclined manner are as follows:
the first telescopic part is controlled to contract at a first speed and then at a second speed, the second telescopic part is controlled to contract at a third speed, the contraction of the second telescopic part is earlier than that of the first telescopic part, the third speed is higher than the first speed, and the third speed is equal to the second speed.
Here, the end of the circuit board close to the first expansion part is taken as the first end, and the end close to the second expansion part is taken as the second end.
Firstly, the second telescopic part shrinks at a third speed, so that the second end of the circuit board firstly inclines to remove the tin liquid, and the tin soldering precision of the second end of the circuit board removed firstly is ensured;
then, the first telescopic part contracts at a first speed, and the third speed is higher than the first speed, so that the circuit board is continuously inclined and separated, and meanwhile, the first end is gradually separated from the tin liquid, the bonding degree of the first end and the tin liquid is reduced, the tin liquid can be rapidly separated from the first end in subsequent operation, and the tin liquid is prevented from being bonded;
when the circuit board reaches predetermined inclination, first pars contractilis contracts with the second speed, and the third speed equals the second speed for the circuit board is deviate from with predetermined inclination, and it is little to glue, and the dip soldering is effectual.
Thus, the process of dip-soldering the circuit board by the full-automatic dip soldering machine of the embodiment is completed.
This full-automatic dip soldering machine of preferred embodiment is through setting up first conveying platform, second conveying platform and a plurality of inductor for the circuit board can the efficient through the scaling powder spraying, preheat for the first time and preheat for the second time after the process such as, then carry out the dip soldering operation, and can be according to the state of different processes, control conveying platform opens in real time and stops, degree of automation is high, work efficiency is high, in addition still preheat through the twice of progressively rising temperature, make the scaling powder adhere more stably, the dip soldering is effectual.
In addition, still penetrate the tin liquid level in order to avoid the dip soldering inductor through setting up the fly leaf to obtain stable sensing signal, through setting up pay-off support piece and connecing material support piece, improve and pass on stability, reduce the trouble, raise the efficiency, improve the steadiness of circuit board through setting up the solid mechanism of pressure simultaneously, thereby obtain stable dip soldering effect.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (9)
1. The utility model provides a full-automatic dip soldering machine of high yield for carry out soldering tin with the circuit board with the electronic component of pegging graft on the circuit board and be connected, its characterized in that includes:
the input platform is used for conveying circuit board feeding;
the output platform is used for conveying the circuit board to discharge;
the tin furnace is positioned between the input platform and the output platform and used for loading tin liquid for dip soldering the circuit board;
the bracket is fixedly arranged above the tin furnace and is of a frame-shaped structure;
the telescopic device is arranged on the inner side of the bracket and comprises a first telescopic part and a second telescopic part;
the dip soldering conveying mechanism is positioned above the tin furnace, and a first end of the dip soldering conveying mechanism is movably connected with the first telescopic part, and a second end of the dip soldering conveying mechanism is movably connected with the second telescopic part, and is used for receiving the circuit board from the input platform, performing dip soldering on the received circuit board, and conveying the dip soldered circuit board to the output platform;
the dip-soldering conveying mechanism comprises conveying chains, a transfer piece and a pressing piece, wherein the transfer piece is connected to the outer side of each conveying chain;
the full-automatic dip welding machine also comprises a dip welding sensor, a movable plate and a cylinder for driving the movable plate;
the dip soldering sensor is arranged on the dip soldering conveying mechanism and located above the conveying chain, and the dip soldering sensor is close to the second end of the dip soldering conveying mechanism and used for sensing the position of the circuit board on the conveying chain;
the cylinder sets up one side at the tin stove top, the fly leaf is connected on the telescopic link of cylinder to through cylinder drive the fly leaf removes to the below of dip soldering inductor, be used for by the dip soldering inductor response.
2. The high-yield full-automatic dip welding machine according to claim 1, wherein the dip welding conveying mechanism further comprises a main body rod, an adjusting plate, a sliding connecting rod, a bolt piece and a spring, wherein the main body rod is used for being connected with the telescopic device and used for arranging the conveying chain;
the sliding connection rod is fixedly arranged on the main body rod, the adjusting plate is connected to the sliding connection rod in a sliding mode through a sliding connection hole, the spring is sleeved on the sliding connection rod and is arranged between the main body rod and the adjusting plate in a compression mode, a first threaded hole is formed in the main body rod, a first through hole is formed in the adjusting plate, the bolt penetrates through the through hole and is connected with the first threaded hole, and the distance between the main body rod and the adjusting plate is adjusted through screwing the bolt;
the pressing and fixing piece is connected with the adjusting plate, so that the pressing and fixing space between the pressing and fixing piece and the adapter piece for the circuit board can be adjusted by adjusting the adjusting plate.
3. The high-yield full-automatic dip welding machine according to claim 2, wherein the press fixing member comprises a press plate and a connecting plate, the press plate is connected to one end of the connecting plate, the surface of the press plate is approximately vertical, the connecting plate is connected to the top of the adjusting plate, and the press plate is located on one side of the main body rod and used for pressing and fixing a circuit board;
the adjusting plate is provided with a second threaded hole, the connecting plate is provided with a connecting groove corresponding to the second threaded hole, and the connecting groove extends in the direction away from the pressing plate and penetrates through the edge of the connecting plate.
4. The high-yield full-automatic dip welding machine according to claim 1, wherein two ends of the dip welding conveying mechanism are movably connected with the first telescopic portion and the second telescopic portion respectively along the conveying direction of the conveying chains, a feeding support member for supporting a circuit board is arranged at one end of the input platform close to the dip welding conveying mechanism, the feeding support member extends between the adapters of the two groups of conveying chains, a receiving support member for supporting the circuit board is arranged at one end of the output platform close to the dip welding conveying mechanism, and the receiving support member extends between the adapters of the two groups of conveying chains.
5. A dip soldering method for dip soldering using the high-yield fully automatic dip soldering machine according to claim 1, characterized by comprising the steps of:
the input platform is controlled to convey the circuit board to the dip soldering conveying mechanism, and the conveying chain is used for conveying the circuit board to a set position through the induction of the dip soldering inductor;
controlling the expansion device to extend according to a sensor signal of the dip soldering sensor so that the circuit board descends and obliquely enters tin liquid of the tin furnace, and the circuit board is finally horizontally immersed in the tin liquid;
controlling the telescopic device to contract so that the circuit board rises to a critical position in a horizontal state;
controlling the telescopic device to contract so that the circuit board rises from a critical position and is obliquely moved out of the tin furnace, and when the dip soldering conveying mechanism rises to an output position, the circuit board is in a horizontal state;
and controlling the output platform to receive the circuit board on the dip soldering conveying mechanism for outputting.
6. The dip soldering method according to claim 5, further comprising:
when the circuit board is horizontally immersed in the tin liquid, the telescopic device is controlled to stretch, so that the circuit board vibrates in the tin liquid.
7. The dip soldering method according to claim 5, further comprising:
when the circuit board rises and inclines to move out of the tin furnace, the conveying chain is controlled to operate so that the circuit board moves transversely, and tension generated when the tin liquid is separated from the circuit board is restrained.
8. The dip soldering method according to claim 7, wherein the controlling the conveyor chain to run so that the circuit board moves laterally specifically comprises:
when the telescopic device contracts by a first contraction amount, controlling the conveying chain to operate so that the circuit board transversely moves towards the higher end of the circuit board;
and when the telescopic device contracts by a second contraction amount, controlling the conveying chain to operate so that the circuit board transversely moves towards the lower end of the circuit board, wherein the second contraction amount is larger than the first contraction amount, and when the telescopic device contracts by the second contraction amount, the tail end part of the circuit board is soaked in the tin liquid.
9. The dip soldering method according to claim 5, wherein the step of controlling the retraction device to retract so that the circuit board is lifted and tilted out of the solder pot comprises:
controlling the first telescopic part to contract at a first speed and then at a second speed, and controlling the second telescopic part to contract at a third speed, wherein the contraction of the second telescopic part is earlier than that of the first telescopic part, the third speed is higher than the first speed, and the third speed is equal to the second speed.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910875582.0A CN110560818B (en) | 2019-09-17 | 2019-09-17 | High-yield full-automatic dip soldering machine and corresponding dip soldering method |
| CN202111158286.2A CN113798619B (en) | 2019-09-17 | 2019-09-17 | High-yield dip soldering method |
| CN202111156646.5A CN113751817B (en) | 2019-09-17 | 2019-09-17 | Dip soldering device and corresponding full-automatic dip soldering machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910875582.0A CN110560818B (en) | 2019-09-17 | 2019-09-17 | High-yield full-automatic dip soldering machine and corresponding dip soldering method |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111158286.2A Division CN113798619B (en) | 2019-09-17 | 2019-09-17 | High-yield dip soldering method |
| CN202111156646.5A Division CN113751817B (en) | 2019-09-17 | 2019-09-17 | Dip soldering device and corresponding full-automatic dip soldering machine |
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| CN110560818A CN110560818A (en) | 2019-12-13 |
| CN110560818B true CN110560818B (en) | 2021-10-29 |
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| CN202111156646.5A Active CN113751817B (en) | 2019-09-17 | 2019-09-17 | Dip soldering device and corresponding full-automatic dip soldering machine |
| CN202111158286.2A Active CN113798619B (en) | 2019-09-17 | 2019-09-17 | High-yield dip soldering method |
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| CN202111156646.5A Active CN113751817B (en) | 2019-09-17 | 2019-09-17 | Dip soldering device and corresponding full-automatic dip soldering machine |
| CN202111158286.2A Active CN113798619B (en) | 2019-09-17 | 2019-09-17 | High-yield dip soldering method |
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| CN114669815B (en) * | 2022-04-01 | 2023-11-03 | 烟台鑫瑞半导体有限公司 | PPTC protector processing equipment for power type battery and production process |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0679767B2 (en) * | 1989-08-19 | 1994-10-12 | 株式会社日立製作所 | Soldering equipment |
| JP2903595B2 (en) * | 1990-02-09 | 1999-06-07 | ソニー株式会社 | Solder dip method and device |
| JP2515168B2 (en) * | 1990-07-19 | 1996-07-10 | 株式会社内山機械製作所 | Solder dipping device |
| JPH06226444A (en) * | 1993-01-29 | 1994-08-16 | Nec Kansai Ltd | Solder dipping device |
| US6257480B1 (en) * | 1998-07-07 | 2001-07-10 | Denso Corporation | Jet soldering method and apparatus |
| JP2005167170A (en) * | 2003-12-03 | 2005-06-23 | Shoei Banzu:Kk | Molten soldering apparatus or molten solder plating apparatus |
| CN201151017Y (en) * | 2008-01-28 | 2008-11-19 | 环旭电子(深圳)有限公司 | Tin furnace with clamp plate device |
| CN201906779U (en) * | 2010-10-29 | 2011-07-27 | 东莞市众信电子涂装自动化设备厂(普通合伙) | Full-automatic pin cutter |
| CN104014894B (en) * | 2014-06-18 | 2016-02-03 | 温州市正邦电子设备有限公司 | Full-automatic dip-soldering machine |
| CN105499737A (en) * | 2014-09-24 | 2016-04-20 | 余姚微奇电子科技有限公司 | Dip-soldering pin shearing machine |
| CN104439598B (en) * | 2014-12-05 | 2016-04-13 | 乐清市浙佳电子科技有限公司 | A kind of automatic infiltration welding machine and immersed solder method |
| CN106385773B (en) * | 2016-10-27 | 2023-06-23 | 江门市众能电控科技有限公司 | Automatic tin dipping equipment and method for circuit board |
| JP6645990B2 (en) * | 2017-01-13 | 2020-02-14 | コーセル株式会社 | Soldering apparatus and soldering method |
| CN107335882A (en) * | 2017-08-28 | 2017-11-10 | 山东鸿荣电子有限公司 | Dip-soldering machine and production line |
| CN208374412U (en) * | 2018-06-07 | 2019-01-15 | 深圳市力拓创能电子设备有限公司 | The full-automatic dip-soldering machine of strong leakproofness |
| CN208374411U (en) * | 2018-06-07 | 2019-01-15 | 深圳市力拓创能电子设备有限公司 | Full-automatic dip-soldering machine |
| CN208374432U (en) * | 2018-06-07 | 2019-01-15 | 深圳市力拓创能电子设备有限公司 | Efficient full-automatic dip-soldering machine |
-
2019
- 2019-09-17 CN CN201910875582.0A patent/CN110560818B/en active Active
- 2019-09-17 CN CN202111156646.5A patent/CN113751817B/en active Active
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| Publication number | Publication date |
|---|---|
| CN113751817B (en) | 2022-11-25 |
| CN113751817A (en) | 2021-12-07 |
| CN110560818A (en) | 2019-12-13 |
| CN113798619A (en) | 2021-12-17 |
| CN113798619B (en) | 2023-02-07 |
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