CN110560819B - Full-automatic dip soldering machine and corresponding dip soldering control method - Google Patents
Full-automatic dip soldering machine and corresponding dip soldering control method Download PDFInfo
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- CN110560819B CN110560819B CN201910875917.9A CN201910875917A CN110560819B CN 110560819 B CN110560819 B CN 110560819B CN 201910875917 A CN201910875917 A CN 201910875917A CN 110560819 B CN110560819 B CN 110560819B
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- conveying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a full-automatic dip soldering machine and a corresponding dip soldering control method. According to the full-automatic dip soldering machine, the first conveying platform, the second conveying platform and the plurality of sensors are arranged, so that a circuit board can be efficiently subjected to the processes of flux spraying, primary preheating, secondary preheating and the like, then dip soldering operation is performed, real-time start and stop of the conveying platforms can be controlled according to the states of different processes, the degree of automation is high, the working efficiency is high, in addition, the adhesion of the flux is more stable through two times of preheating by gradual temperature rise, and the dip soldering effect is good.
Description
Technical Field
The invention relates to the field of dip soldering equipment, in particular to a full-automatic dip soldering machine and a corresponding dip soldering control method.
Background
The dip soldering is a method for completing soldering of a plurality of welding points at one time by boiling tin in a tin furnace and then dipping the circuit board inserted with the electronic element in the molten tin furnace. At present, each manufacturer gradually changes manual dip soldering, and adopts an automatic dip soldering mode to complete dip soldering operation, but automatic dip soldering equipment in the prior art has various defects, and the design is not optimized enough, so that the working efficiency is low, and the dip soldering effect is poor.
Therefore, it is necessary to provide a fully automatic dip soldering machine and a corresponding dip soldering control method to solve the above technical problems.
Disclosure of Invention
The invention provides a full-automatic dip soldering machine and a corresponding dip soldering control method, and aims to solve the problems that dip soldering equipment in the prior art is low in working efficiency and poor in dip soldering effect.
In order to solve the technical problems, the technical scheme of the invention is as follows: a full-automatic dip soldering machine is used for soldering the electronic element inserted on the circuit board with the circuit board, and comprises:
the first conveying platform is used for conveying the circuit board and is driven by a first stepping motor connected with a first encoder;
the second conveying platform is butted behind the first conveying platform and used for conveying the circuit board, and the second conveying platform is driven by a second stepping motor connected with a second encoder;
the spraying device is arranged below the first conveying platform and used for spraying soldering flux on the circuit board on the first conveying platform;
the first preheating device is arranged on the first conveying platform and behind the spraying device and used for preheating the sprayed circuit board;
the second preheating device is arranged on the second conveying platform and behind the first preheating device and used for preheating the circuit board, and the preheating temperature of the second preheating device is higher than that of the first preheating device;
the dip soldering device is butted at the rear part of the second conveying platform and comprises a support, a dip soldering conveying mechanism movably connected to the support and a tin furnace positioned below the dip soldering conveying mechanism, the dip soldering conveying mechanism is used for being butted with the second conveying platform and lowering a received circuit board into the tin furnace for soldering, and the dip soldering conveying mechanism is driven by a third stepping motor connected with a third encoder;
the output platform is butted behind the dip soldering device and used for outputting the dip soldered circuit board;
the dip soldering sensor is arranged on the bracket and is positioned above the dip soldering conveying mechanism; and
the controller is electrically connected with the dip soldering sensor to control the start and stop of the dip soldering conveying mechanism according to a sensing signal of the dip soldering sensor, so that the circuit board moves and stops at a set position on the dip soldering conveying mechanism to perform soldering operation.
In the invention, the full-automatic dip welding machine further comprises:
the first inductor is arranged on the first conveying platform, is positioned at the front end of the spraying device and is used for inducing the circuit board to convey the circuit board to a set position on the first conveying platform;
the second inductor is arranged between the first conveying platform and the second conveying platform and used for inducing the circuit board to convey the circuit board to a set position on the second conveying platform;
the third inductor is arranged between the second conveying platform and the dip soldering device and used for inducing a circuit board to control the first conveying platform and the second conveying platform to stop and control the dip soldering conveying mechanism to receive the circuit board on the second conveying platform; and
the fourth inductor is arranged between the dip soldering device and the output platform and used for inducing the output of the circuit board;
the controller is electrically connected with the spraying device, the first preheating device, the second preheating device, the dip-soldering device, the output platform, the first inductor, the second inductor, the third inductor and the fourth inductor, so that the start and stop of the first conveying platform, the first preheating device and the sprayer are controlled according to the induction signal of the first inductor, the start and stop of the second conveying platform and the second preheating device are controlled according to the induction signal of the second inductor, the stop of the second conveying platform and the start and stop of the dip-soldering conveying mechanism are controlled according to the induction signal of the third inductor, the induction signal of the third inductor is prior to the induction signal of the second inductor, and the start and stop of the output platform are controlled according to the induction signal of the fourth inductor.
In the invention, the full-automatic dip soldering machine further comprises a movable plate and an air cylinder, the air cylinder is arranged on one side of the top of the tin furnace, and the movable plate is connected to a telescopic rod of the air cylinder so as to drive the movable plate to move to the position below the dip soldering sensor through the air cylinder and be used for being sensed by the dip soldering sensor.
In the invention, the full-automatic dip welding machine further comprises a tin scraping mechanism, and the tin scraping mechanism comprises:
the two sliding rails are respectively positioned at the two outer sides of the tin furnace;
two ends of the rotating shaft are respectively connected with the two sliding rails in a sliding manner;
the tin scraping plate is fixedly connected to the rotating shaft on one side so as to scrape oxides on the liquid surface by moving, and a track of the tin scraping plate rotating along with the rotating shaft comprises a tin scraping position for scraping the oxides and a avoiding position for avoiding tin liquid; and
and the driving part is used for driving the rotating shaft to slide along the sliding rail.
Further, under the action of gravity, the tin scraping plate rotates to the tin scraping position;
the tin scraping mechanism further comprises:
the extrusion strip and one sliding rail are arranged on the same side of the tin furnace and are parallel to the extending direction of the sliding rail;
the regulating part rotates to be connected the one end of pivot, and is provided with the restriction position on rotating the orbit, be used for when the pivot slides, with the extrusion strip forms the extrusion and rotates, and through rotating extremely thereby the restriction position drives the pivot rotates, and then makes scrape the tin plate and rotate extremely keep away the position.
In the invention, the dip soldering device also comprises a pressing and fixing mechanism, and the pressing and fixing mechanism comprises a pressing and fixing piece;
the dip-soldering conveying mechanism comprises a conveying chain, an adapter connected to the outer side of the conveying chain, a main body rod used for arranging the conveying chain and a telescopic device used for connecting the main body rod and the support;
the two groups of conveying chains are arranged oppositely, the circuit board is positioned on the adapter between the two groups of conveying chains, the adapter is driven by the conveying chains to operate, and then the circuit board is conveyed, and the pressing piece is used for pressing and fixing the circuit board on the adapter.
The pressing and fixing mechanism further comprises an adjusting plate, a sliding connection rod, a bolt piece and a spring;
the sliding connection rod is fixedly arranged on the main body rod, the adjusting plate is connected to the sliding connection rod in a sliding mode through a sliding connection hole, the spring is sleeved on the sliding connection rod and is arranged between the main body rod and the adjusting plate in a compression mode, a first threaded hole is formed in the main body rod, a through hole is formed in the adjusting plate, the bolt penetrates through the through hole and is connected with the first threaded hole, and the distance between the main body rod and the adjusting plate is adjusted through screwing of the bolt;
the pressing and fixing piece is connected with the adjusting plate, so that the pressing and fixing space between the pressing and fixing piece and the adapter piece for the circuit board can be adjusted by adjusting the adjusting plate.
Furthermore, the pressing piece comprises a pressing plate and a connecting plate, the pressing plate is connected to one end of the connecting plate, the surface of the pressing plate is approximately vertical to the surface of the connecting plate, the connecting plate is connected to the top of the adjusting plate, and the pressing plate is located on one side of the main body rod and used for pressing and fixing the circuit board;
the adjusting plate is provided with a second threaded hole, the connecting plate is provided with a connecting groove corresponding to the second threaded hole, and the connecting groove extends in the direction away from the pressing plate and penetrates through the edge of the connecting plate.
In addition, a feeding support piece for supporting the circuit board is arranged at one end, close to the dip soldering device, of the second conveying platform, the feeding support piece extends between the two sets of adapter pieces of the conveying chains, a receiving support piece for supporting the circuit board is arranged at one end, close to the dip soldering device, of the output platform, and the receiving support piece extends between the two sets of adapter pieces of the conveying chains.
Furthermore, the second conveying platform and the output platform both comprise fixed rods, the feeding support piece and the receiving support piece are consistent in structure and both comprise a support piece, a connecting piece and an intermediate piece for connecting the support piece and the connecting piece;
the supporting sheet and the connecting sheet are respectively connected to two sides of the fixing rod in the vertical direction, a long-strip-shaped connecting hole for fixedly connecting the fixing rod is formed in the connecting sheet, and the length direction of the connecting hole is in the vertical direction so as to be used for adjusting the supporting height of the supporting sheet.
The invention also comprises a dip soldering control method for dip soldering by using the full-automatic dip soldering machine, which comprises the following steps:
controlling the start and stop of the first conveying platform according to a sensing signal of the first sensor, so that the circuit board is conveyed to a position opposite to the first preheating device through the spraying device and stays for a set preheating time;
controlling the second conveying platform to start and stop according to the sensing signals of the second sensor and the third sensor, so that the circuit board is conveyed to a position opposite to the second preheating device, stays for a set preheating time, and is conveyed to a position close to the dip soldering device;
controlling the movable plate to move according to the sensing signals of the third sensor and the dip soldering sensor;
controlling the dip soldering device to operate according to the sensing signals of the third sensor and the dip soldering sensor, so as to receive the circuit board on the second conveying platform and dip solder the circuit board;
and controlling the start and stop of the output platform according to the sensing signal of the fourth sensor, so as to receive the circuit board on the dip soldering device for output.
When the dip soldering device receives the circuit board and carries out dip soldering operation, the dip soldering device comprises the following steps:
controlling the second conveying platform to convey the circuit board to the dip soldering device, and enabling the conveying chain to convey the circuit board to a set position through induction of the dip soldering inductor;
controlling the expansion device to extend according to a sensor signal of the dip soldering sensor so that the circuit board descends and obliquely enters tin liquid of the tin furnace, and the circuit board is finally horizontally immersed in the tin liquid;
controlling the telescopic device to contract so that the circuit board rises to a critical position in a horizontal state;
controlling the telescopic device to contract so that the circuit board rises from a critical position and is obliquely moved out of the tin furnace, and when the dip soldering device rises to an output position, the circuit board is in a horizontal state;
and controlling the output platform to receive the circuit board on the dip soldering device for outputting.
Preferably, when the circuit board is horizontally immersed in the tin liquid, the telescopic device is controlled to stretch, so that the circuit board vibrates in the tin liquid.
The dip soldering control method further comprises the following steps:
when the circuit board rises and inclines to move out of the tin furnace, the conveying chain is controlled to operate so that the circuit board moves transversely, and tension generated when the tin liquid is separated from the circuit board is restrained.
Wherein, control the conveyor chain operation makes circuit board lateral shifting specifically include:
when the telescopic device contracts by a first contraction amount, controlling the conveying chain to operate so that the circuit board transversely moves towards the higher end of the circuit board;
and when the telescopic device contracts by a second contraction amount, controlling the conveying chain to operate so that the circuit board transversely moves towards the lower end of the circuit board, wherein the second contraction amount is greater than the first contraction amount.
The step of controlling the telescopic device to contract so that the circuit board rises and is obliquely moved out of the tin furnace comprises the following steps:
controlling the first telescopic part to contract at a first speed and then at a second speed, and controlling the second telescopic part to contract at a third speed, wherein the contraction of the second telescopic part is earlier than that of the first telescopic part, the third speed is higher than the first speed, and the third speed is equal to the second speed.
Compared with the prior art, the invention has the beneficial effects that: according to the full-automatic dip soldering machine, the first conveying platform, the second conveying platform and the plurality of sensors are arranged, so that a circuit board can be efficiently subjected to the processes of flux spraying, primary preheating, secondary preheating and the like, then dip soldering operation is performed, real-time start and stop of the conveying platforms can be controlled according to the states of different processes, the degree of automation is high, the working efficiency is high, in addition, the adhesion of the flux is more stable through two times of preheating by gradual temperature rise, and the dip soldering effect is good;
in addition, still penetrate the tin liquid level in order to avoid the dip soldering inductor through setting up the fly leaf to obtain stable sensing signal, through setting up pay-off support piece and connecing material support piece, improve and pass on stability, reduce the trouble, raise the efficiency, improve the steadiness of circuit board through setting up the solid mechanism of pressure simultaneously, thereby obtain stable dip soldering effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments are briefly introduced below, and the drawings in the following description are only corresponding to some embodiments of the present invention.
FIG. 1 is a schematic structural diagram of a preferred embodiment of the fully automatic dip soldering machine of the present invention.
FIG. 2 is a top view of the full-automatic dip soldering machine of the present invention with the bracket removed.
FIG. 3 is a schematic structural diagram of a tin furnace, a tin scraping mechanism and a movable plate of the full-automatic dip soldering machine of the present invention.
FIG. 4 is a schematic structural diagram of a tin furnace and a tin scraping mechanism of the full-automatic dip soldering machine of the invention.
Fig. 5 is a schematic structural diagram of a dip soldering conveying mechanism of the full-automatic dip soldering machine.
FIG. 6 is a schematic structural view of a dip soldering device of the full-automatic dip soldering machine of the present invention
Fig. 7 is a partial structural schematic view of a feeding support part and a dip-soldering conveying mechanism of the full-automatic dip soldering machine.
Fig. 8 is a partial structural schematic view of a feeding support member of the fully automatic dip welding machine of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, directional terms such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", "top" and "bottom" are used only with reference to the orientation of the drawings, and the directional terms are used for illustration and understanding of the present invention, and are not intended to limit the present invention.
The terms "first," "second," and the like in the terms of the invention are used for descriptive purposes only and not for purposes of indication or implication relative importance, nor as a limitation on the order of precedence.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly, e.g., the connection may be a detachable connection or a connection in a unitary structure; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Automatic dip-soldering equipment in the prior art has various defects, and the design is not optimized enough, so that the working efficiency is low, and the dip-soldering effect is poor.
The following is a preferred embodiment of the present invention for providing a fully automatic dip soldering machine capable of solving the above technical problems.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a preferred embodiment of the full-automatic dip soldering machine of the present invention, and fig. 2 is a top view of the full-automatic dip soldering machine of the present invention after a bracket is removed.
In the drawings, elements having similar structures are denoted by the same reference numerals.
The invention provides a full-automatic dip soldering machine which is used for soldering and connecting electronic elements inserted on a circuit board with the circuit board and comprises a first conveying platform 101, a second conveying platform 102, a spraying device 103, a first preheating device 104, a second preheating device 105, a dip soldering device, an output platform 117, a controller and a plurality of inductors.
The first conveying platform 101 is used for conveying a circuit board, and the first conveying platform 101 is driven by a first stepping motor 106 connected with a first encoder, so as to accurately control the conveying circuit board to move to a set position.
The second conveying platform 102 is butted behind the first conveying platform 101 and used for conveying the circuit board, and the second conveying platform 102 is driven by a second stepping motor 107 connected with a second encoder and used for accurately controlling the circuit board to move to a set position.
The spraying device 103 is arranged below the first conveying platform 101 and is used for spraying the soldering flux on the circuit board on the first conveying platform 101.
The first preheating device 104 is arranged on the first conveying platform 101 and behind the spraying device 103 and used for preheating the sprayed circuit board, the first preheating device 104 comprises a first outer cover, a first air guide channel arranged in the first outer cover, a first heat-emitting pipe and a first fan 118 (the reference numeral 104 indicates the first outer cover), the first fan 118 is arranged below, the circuit board sprayed with soldering flux passes above the first heat-emitting pipe, the first air guide channel is communicated with an inner cavity of the first outer cover through a plurality of air outlet holes, heat generated by the heat-emitting pipe of the first preheating device 104 is blown to the air guide channel through blowing of the first fan 118, and then the heat is diffused into the inner cavity of the first outer cover, so that the circuit board is heated more comprehensively.
The second preheating device 105 is arranged on the second conveying platform 102 and behind the first preheating device 104 and used for preheating the circuit board, the second preheating device 105 is consistent with the first preheating device 104 and comprises a second outer cover, a second air guide channel arranged in the second outer cover, a second heating tube and a second fan 119, the preheating temperature of the second preheating device 105 is higher than that of the first preheating device 104, and soldering flux is more stably adhered and the dip soldering effect is good through two times of preheating which are gradually increased in temperature.
The dip soldering device is connected behind the second conveying platform 102 in a butt joint mode and comprises a support 113, a dip soldering conveying mechanism 114 movably connected to the support 113 and a tin furnace 116 located below the dip soldering conveying mechanism 114, the dip soldering conveying mechanism 114 is used for being in butt joint with the second conveying platform 102 and placing the received circuit board into the tin furnace 116 for soldering, and the dip soldering conveying mechanism 114 is driven by a third stepping motor 108 connected with a third encoder and used for accurately controlling the circuit board to be moved to a set position.
The output platform 117 is butted at the rear part of the dip soldering device and is used for outputting the dip soldered circuit board.
The dip soldering sensor 121 is disposed on the support 113 above the dip soldering conveying mechanism 114.
The controller is electrically connected with the dip soldering sensor 121 to control the start and stop of the dip soldering conveying mechanism 114 according to the sensing signal of the dip soldering sensor 121, so that the circuit board moves and stops at the set position on the dip soldering conveying mechanism 114 to perform soldering operation.
It should be noted that, the sensor in this embodiment can sense the time when the head and the tail of the circuit board pass through the sensor, so as to feed back the data to the controller, and the encoder controls the motor to operate a corresponding stroke, so as to accurately control the circuit board to move to a set position.
Specifically, the full-automatic dip welding machine of the present invention further includes a first inductor 109, a second inductor 120, a third inductor 110, and a fourth inductor 111.
The first inductor 109 is arranged on the first conveying platform 101 and located at the front end of the spraying device 103, and is used for inducing the circuit board to convey the circuit board to a set position on the first conveying platform 101;
the second inductor 120 is disposed between the first conveying platform 101 and the second conveying platform 102, and is used for inducing the circuit board to convey the circuit board to a set position on the second conveying platform 102;
the third sensor 110 is disposed between the second conveying platform 102 and the dip soldering device, and is used for sensing the circuit board to control the stop of the second conveying platform 102 and the receiving of the circuit board on the second conveying platform 102 by the dip soldering conveying mechanism 114;
the fourth inductor 111 is arranged between the dip soldering device and the output platform 117 and is used for sensing the output of the circuit board;
the controller is electrically connected with the spraying device 103, the first preheating device 104, the second preheating device 105, the dip soldering device, the output platform 117, the first sensor 109, the second sensor 120, the third sensor 110 and the fourth sensor 111, so as to control the start and stop of the first conveying platform 101, the first preheating device 104 and the sprayer according to the sensing signal of the first sensor 109, control the start and stop of the second conveying platform 102 and the second preheating device 105 according to the sensing signal of the second sensor 120, control the stop of the first conveying platform 101 and the second conveying platform 102 and the start and stop of the dip soldering conveying mechanism 114 according to the sensing signal of the third sensor 110, give priority to the sensing signal of the third sensor 110 over the sensing signal of the second sensor 120, and control the start and stop of the output platform 117 according to the sensing signal of the fourth sensor 111.
In addition, a fifth sensor 112 may be disposed at the end of the output platform 117 for sensing a board signal when the end is connected to other corresponding receiving devices.
Referring to fig. 1 and 3, preferably, the full-automatic dip soldering machine of the present invention further includes a movable plate 122 and a cylinder 115, the cylinder 115 is disposed at one side of the top of the solder pot 116, the movable plate 122 is connected to an expansion rod of the cylinder 115 to drive the movable plate 122 to move to a position below the dip soldering sensor 121 through the cylinder 115 for being sensed by the dip soldering sensor 121, so as to obtain a stable sensing signal, thereby preventing the fault from being easily generated, and the work efficiency is higher, thereby preventing the infrared signal from being incident on the white reflective solder liquid, which is reflected by the mirror surface, causing unstable sensing of the dip soldering sensor 121, and the liquid level of the solder liquid from fluctuating, so that the dip soldering sensor 121 easily generates an error signal.
It should be noted that the dip soldering sensor 121 senses different signals from the circuit board and the movable sensing plate, and the control can make corresponding control signals according to the change of the signals.
The cylinder 115 is arranged on the base through a fixing frame 124 and is positioned at one side of the tin furnace 116, dust is easy to generate in various operations in a factory, and the protective cover 123 is arranged outside the cylinder 115, so that the working efficiency and the service life of the cylinder are improved.
Referring to fig. 3 and 4, the full-automatic dip soldering machine of the present invention further includes a tin scraping mechanism, wherein the tin scraping mechanism includes a slide rail 127, a rotating shaft 126, a tin scraping plate 125, an extrusion bar 129, an adjusting member 130, and a driving portion.
The two slide rails 127 are respectively located at two outer sides of the tin furnace 116, and the slide rails 127 are fixedly connected to the two outer sides of the tin furnace 116 through corresponding plates.
Two ends of the rotating shaft 126 are slidably connected to the two sliding rails 127 through connecting members 128, respectively.
One side of the tin scraping plate 125 is fixedly connected to the rotating shaft 126, so that oxides on the liquid surface can be scraped by moving, the oxides can affect the dip soldering effect, and the track of the tin scraping plate 125 rotating along with the rotating shaft 126 comprises a tin scraping position for scraping the oxides and an escape position for avoiding the tin liquid.
The driving part is used for driving the rotating shaft 126 to slide along the sliding rail 127, which is not shown in the figure, and the driving part may be composed of a motor and a chain, the chain is driven by the motor, and then the connecting part 128 is driven by the chain to slide, but the driving method is not limited thereto.
Wherein, the extrusion strip 129 and a slide rail 127 are arranged at the same side of the tin furnace 116 and are parallel to the extending direction of the slide rail 127;
the adjusting member 130 is rotatably connected to one end of the rotating shaft 126, and a limiting position is arranged on the rotating track, so that when the rotating shaft 126 slides, the rotating shaft and the extrusion strip 129 form extrusion and rotate, and the rotating shaft 126 is driven to rotate through rotating to the limiting position, so that the tin scraping plate 125 rotates to the open position, and when the tin scraping plate 125 is located at the open position, the tin scraping plate 125 is away from the liquid level of the tin liquid by a set distance.
As shown in fig. 4, when the rotating shaft 126 slides to the back side of the illustrated orientation, the adjusting member 130 gradually presses against the pressing strip 129 and rotates around the rotating shaft 126, and when the rotating shaft rotates to the limiting position, the adjusting member cannot rotate any more, and the rotating shaft 126 is driven to rotate together, so that the tin scraping plate 125 can rotate to the open position.
The scraping plate 125 in this embodiment rotates to the scraping position under the action of gravity, and when the scraping plate 125 is located the scraping position, it is a certain inclination angle with the liquid level of tin liquid, thereby facilitating the scraping, and the scraping plate 125 keeps sliding to the second end at the first end of the scraping position, then rotates to the avoiding position, and then slides from the second end and returns to the first end.
Referring to fig. 5 and 6, the dip soldering apparatus includes a support 113, a dip soldering conveying mechanism 114, and a telescopic device, wherein a substrate 140 is disposed on the top of the support 113, and the telescopic device is disposed on the substrate 140.
The dip-soldering conveying mechanism 114 comprises conveying chains, adapters 132 connected to the outer sides of the conveying chains, main body rods 131 used for arranging the conveying chains, connecting shafts 138 and a pressing mechanism, wherein the two ends between the two main body rods 131 are connected with the connecting shafts 138, the two groups of conveying chains are arranged oppositely, a circuit board is arranged on the adapters 132 between the two groups of conveying chains, the adapters 132 are driven by the conveying chains to operate, the circuit board is further conveyed, and the pressing mechanism is used for pressing and fixing the circuit board on the adapters 132.
The telescopic device comprises a first telescopic part and a second telescopic part, as shown in fig. 6, the lifting motor 141, the lead screw 144, the nut member, the connecting frame 143 and the guide column 142 at one end form the first telescopic part, and the lifting motor 141, the lead screw 144, the nut member, the connecting frame 143 and the guide column 142 at the other end form the second telescopic part.
The first telescopic part and the second telescopic part are in one-to-one correspondence to be rotatably connected with the two connecting shafts 138, and the rotating axis is consistent with the axial direction of the connecting shafts 138, so that the first telescopic part and the second telescopic part can be controlled to obliquely enter the molten tin dip soldering process or obliquely separate the molten tin from the circuit board.
The first end and the first flexible portion swing joint of dip-soldering conveying mechanism 114, the second end with second flexible portion swing joint, the one end that dip-soldering conveying mechanism 114 is close to dip-soldering inductor 121 is the second end.
The first telescopic part and the second telescopic part have the same structure and respectively comprise a lifting motor 141, a lead screw 144, a nut piece, a connecting frame 143 and a guide post 142;
the lifting motor 141 is arranged at the top of the base plate, the screw 144 is connected with the middle of the connecting frame 143 through a nut member, one end of the guide post 142 is connected with the base plate in a sliding manner, the other end of the guide post 142 is fixedly connected with the connecting frame 143, the two guide posts 142 are respectively connected with two ends of the connecting frame 143, two ends of the connecting frame 143 are rotatably connected with two ends of the connecting shaft, and the two guide posts 142 of the same telescopic part are fixedly connected through a connecting rod 145, so that the sliding stability of the guide post 142 is enhanced.
Two ends of the connecting shaft 138 are connected with a main body rod 131 in a transmission mode, and a hand wheel is arranged at one end of the connecting shaft 138 to drive the connecting shaft 138 to rotate through the hand wheel, so that the distance between the two main body rods is adjusted.
The press-fixing mechanism in this embodiment includes a press-fixing member, an adjusting plate 133, a slide bar 136, a bolt member 139, and a spring 137.
The sliding rod 136 is fixedly arranged on the main body rod 131, the adjusting plate 133 is connected to the sliding rod 136 in a sliding mode through a sliding hole, the spring 137 is sleeved on the sliding rod 136 and is arranged between the main body rod 131 and the adjusting plate 133 in a compression mode, a first threaded hole is formed in the main body rod 131, a through hole is formed in the adjusting plate 133, the bolt piece 139 penetrates through the through hole to be connected with the first threaded hole, the adjusting plate 133 can be pressed and fixed through a handle on the bolt piece 137, the pressure degree of the adjusting plate 133 is changed through screwing the bolt piece 139, the compression degree of the spring 137 is adjusted, and therefore the distance between the main body rod 131 and the adjusting plate 133 is adjusted.
Wherein the pressure firmware is connected with regulating plate 133 to can adjust the solid space of pressure to the circuit board between pressure firmware and the adaptor through adjusting regulating plate 133, can pass through the solid space of pressure smoothly when making the circuit board transported, during the dip-soldering simultaneously, the pressure firmware can form stable pressure to the circuit board again and solidly.
Specifically, the press-fixing member includes a press plate 134 and a connecting plate 135, the press plate 134 is connected to one end of the connecting plate 135, the plate surface is approximately vertical, the connecting plate 135 is connected to the top of the adjusting plate 133, and the press plate 134 is located on one side of the main body rod 131 and used for press-fixing the circuit board;
be provided with the second screw hole on regulating plate 133, be provided with the connecting groove corresponding with the second screw hole on connecting plate 135, the connecting groove extends and link up to connecting plate 135's edge to the direction of keeping away from clamp plate 134 for can be earlier with the screw connection on the second screw hole, connecting plate 135 passes through the connecting groove and pegs graft with the screw, screws up the screw at last again and fastens, and it is convenient to install, and the adjustability is strong.
Referring to fig. 7 and 8, fig. 7 is a partial structural schematic view of a feeding support member and a dip soldering conveying mechanism of the full-automatic dip soldering machine of the present invention, and fig. 8 is a partial structural schematic view of the feeding support member of the full-automatic dip soldering machine of the present invention.
In this embodiment, a feeding support member for supporting the circuit board is disposed at one end of the second conveying platform 102 close to the dip soldering device, the feeding support member extends between the adapters 132 of the two sets of conveying chains, a receiving support member for supporting the circuit board is disposed at one end of the output platform 117 close to the dip soldering device, and the receiving support member extends between the adapters 132 of the two sets of conveying chains.
The second conveying platform 102 and the output platform 117 both include fixing rods, the fixing rods are used for arranging conveying chains and other components, the feeding support and the receiving support are consistent in structure and both include a support sheet 146, a connecting sheet 148 and a middle sheet 147 for connecting the support sheet 146 and the connecting sheet 148;
the support sheet 146 and the connection sheet 148 are respectively connected to two sides of the fixing rod in the vertical direction, a long strip-shaped connection hole 149 for fixedly connecting the fixing rod is arranged on the connection sheet 148, and the length direction of the connection hole 149 is the vertical direction so as to adjust the support height of the support sheet 146.
The dip soldering control method for dip soldering of the full-automatic dip soldering machine comprises the following steps:
according to the sensing signal of the first sensor 109, the first conveying platform 101 is controlled to start and stop, so that the circuit board is conveyed to pass through the spraying device 103 and is conveyed to a position opposite to the first preheating device 104 for a set preheating time.
Controlling the second conveying platform 102 to start and stop according to the sensing signals of the second sensor 120 and the third sensor 110, so that the circuit board is conveyed to a position opposite to the second preheating device 105, stays for a set preheating time, and is conveyed to a position close to the dip soldering device;
specifically, when the second sensor 120 senses the circuit board, the second transportation platform 102 is controlled to operate to transport the circuit board to a position opposite to the second preheating device 105;
preferably, the sensing signal of the third sensor 110 is prior to the sensing signal of the second sensor 120, and when there is a signal of the second sensor 120 and the signal of the third sensor 110, the sensing signal 101 of the third sensor 110 is preferentially executed to stop the circuit board from being conveyed to the second conveying platform 102, and the control unit controls the second conveying platform 102 to stop, controls the solder dip conveying mechanism 114 to be in butt joint with the second conveying platform 102, and receives the circuit board.
It should be noted that, when the circuit board is conveyed on the first conveying platform 101 and the controller receives a signal of the third sensor 110 sensing the circuit board, the first conveying platform 101 stops conveying the circuit board to the second conveying platform 102 when the circuit board is sensed by the second sensor 120;
until the third sensor 110 does not sense the circuit board, the controller controls the first transportation platform 101 and the second transportation platform 102 to operate according to the sensing signal of the second sensor, so as to transport the circuit board to the set position on the second transportation platform 102.
Therefore, the circuit boards can be prevented from being abnormally transferred due to various reasons, for example, the circuit boards are clamped between the second conveying platform 102 and the dip soldering conveying mechanism 114, and when similar conditions occur, the first conveying platform 101 continues to convey the circuit boards to the second conveying platform 102, so that the machine is easy to operate disorderly, the machine breaks down, and even the circuit boards are damaged.
It should be further understood that the time for dip soldering the solder conveying mechanism 114 is shorter than the time for preheating, and in general, normally, when the third sensor 110 senses the circuit board, the solder conveying mechanism 114 can immediately receive the circuit board;
in addition, the first preheating device 104 and the second preheating device 105 preheat for an equal time, and the former circuit board generally arrives at the second preheating device 105 first, and the latter circuit board arrives at the first preheating device 104 later, so the second preheating device 105 can preheat the circuit board and transport the circuit board to the dip soldering transport mechanism 114 through the second transport platform 102, and then the first transport platform 101 can transport the latter circuit to the second transport platform 102.
The movable plate 122 is controlled to move according to sensing signals of the third sensor 110 and the dip soldering sensor 121, the movable plate 122 extends below the dip soldering sensor 121 when the third sensor 110 senses a circuit board, and the movable plate 122 retracts when the dip soldering sensor 121 senses a circuit board, so that the descending dip soldering operation of the dip soldering conveying mechanism 114 is not disturbed.
And controlling the operation of the dip soldering device according to the sensing signals of the third sensor 110 and the dip soldering sensor 121, so as to receive the circuit board on the second conveying platform 102 and perform dip soldering on the circuit board.
And controlling the start and stop of the output platform 117 according to the sensing signal of the fourth sensor 111, so as to receive the circuit board on the dip soldering device for outputting.
When the dip soldering device receives the circuit board and carries out dip soldering operation, the dip soldering device comprises the following steps:
and controlling the second conveying platform 102 to convey the circuit board to the dip soldering device, and enabling the conveying chain to convey the circuit board to the set position through the induction of the dip soldering inductor 121.
According to the sensor signal of the dip soldering sensor 121, the extension of the telescopic device is controlled to enable the circuit board to descend and obliquely enter the tin liquid of the tin furnace 116, and the circuit board is finally horizontally immersed in the tin liquid, wherein the circuit board is generally arranged in a jig for dip soldering, and the circuit board and the pins are immersed in the tin liquid at the moment.
The shrinkage of the telescopic device is controlled, so that the circuit board rises to a critical position in a horizontal state, the critical position refers to the position where the circuit board is attached to the liquid level of the tin liquid, and only the pins of the electronic elements are immersed in the tin liquid, so that when the circuit board is separated from the tin liquid, excessive adhesion between the circuit board and the tin liquid can be reduced, and the circuit board can be quickly separated from the tin liquid by subsequent operation.
The retraction of the retractable device is controlled so that the circuit board rises from the critical position and is tilted out of the solder pot 116, and when the dip soldering device rises to the output position, the circuit board is horizontal.
The control output platform 117 receives the circuit board on the dip soldering apparatus for output.
Preferably, when the circuit board level soaks in tin liquid, the control telescoping device is flexible for the circuit board shakes in tin liquid, because the circuit board is more and more accurate, the space region between some pins is less, and the tin liquid is because having viscidity tension and filling clearance region that can not be very smooth, and the mode that adopts vibrations in this embodiment can be fine fills tin liquid to clearance region, thereby obtains better dip-soldering effect.
The dip soldering control method further comprises the following steps:
when the circuit board rises and slantingly moves out of the tin furnace 116, the operation of the conveying chain is controlled to enable the circuit board to transversely move so as to inhibit the tension generated when the tin liquid is separated from the circuit board and prevent poor dip soldering effect caused by tin adhesion.
Wherein, control conveyor chain operation makes circuit board lateral shifting specifically include:
when the telescopic device contracts by a first contraction amount, the conveying chain is controlled to operate, so that the circuit board transversely moves towards the higher end of the circuit board, namely towards the end close to the dip soldering sensor 121.
When the telescopic device contracts by a second contraction amount, the operation of the conveying chain is controlled to enable the circuit board to transversely move towards the lower end of the circuit board, namely, towards the end far away from the dip soldering sensor 121,
wherein, the second shrinkage is greater than first shrinkage, and when the telescoping device shrink second shrinkage, the circuit board only has the length that is less than 2cm to soak in tin liquid, deviate from the anterior segment process of tin liquid at the circuit board slope, should be to the higher one end lateral shifting of circuit board, the face and the tin liquid of avoiding the circuit board that can be best are glued even, when the circuit board is about to deviate from, should be to the lower one end lateral shifting of circuit board, reverse direction movement promptly, the terminal portion and the tin liquid of avoiding the circuit board that can be best are glued even.
The steps of controlling the retraction device to retract so that the circuit board rises and moves out of the solder pot 116 in an inclined manner are as follows:
the first telescopic part is controlled to contract at a first speed and then at a second speed, the second telescopic part is controlled to contract at a third speed, the contraction of the second telescopic part is earlier than that of the first telescopic part, the third speed is higher than the first speed, and the third speed is equal to the second speed.
Here, the end of the circuit board close to the first expansion part is taken as the first end, and the end close to the second expansion part is taken as the second end.
Firstly, the second telescopic part shrinks at a third speed, so that the second end of the circuit board firstly inclines to remove the tin liquid, and the tin soldering precision of the second end of the circuit board removed firstly is ensured;
then, the first telescopic part contracts at a first speed, and the third speed is higher than the first speed, so that the circuit board is continuously inclined and separated, and meanwhile, the first end is gradually separated from the tin liquid, the bonding degree of the first end and the tin liquid is reduced, the tin liquid can be rapidly separated from the first end in subsequent operation, and the tin liquid is prevented from being bonded;
when the circuit board reaches predetermined inclination, first pars contractilis contracts with the second speed, and the third speed equals the second speed for the circuit board is deviate from with predetermined inclination, and it is little to glue, and the dip soldering is effectual.
Thus, the process of dip-soldering the circuit board by the full-automatic dip soldering machine of the embodiment is completed.
This full-automatic dip soldering machine of preferred embodiment is through setting up first conveying platform, second conveying platform and a plurality of inductor for the circuit board can the efficient through the scaling powder spraying, preheat for the first time and preheat for the second time after the process such as, then carry out the dip soldering operation, and can be according to the state of different processes, control conveying platform opens in real time and stops, degree of automation is high, work efficiency is high, in addition still preheat through the twice of progressively rising temperature, make the scaling powder adhere more stably, the dip soldering is effectual.
In addition, still penetrate the tin liquid level in order to avoid the dip soldering inductor through setting up the fly leaf to obtain stable sensing signal, through setting up pay-off support piece and connecing material support piece, improve and pass on stability, reduce the trouble, raise the efficiency, improve the steadiness of circuit board through setting up the solid mechanism of pressure simultaneously, thereby obtain stable dip soldering effect.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (9)
1. The utility model provides a full-automatic dip soldering machine for carry out soldering tin with circuit board with the electronic component of pegging graft on the circuit board and be connected, its characterized in that includes:
the first conveying platform is used for conveying the circuit board and is driven by a first stepping motor connected with a first encoder;
the second conveying platform is butted behind the first conveying platform and used for conveying the circuit board, and the second conveying platform is driven by a second stepping motor connected with a second encoder;
the spraying device is arranged below the first conveying platform and used for spraying soldering flux on the circuit board on the first conveying platform;
the first preheating device is arranged on the first conveying platform and behind the spraying device and used for preheating the sprayed circuit board;
the second preheating device is arranged on the second conveying platform and behind the first preheating device and used for preheating the circuit board, and the preheating temperature of the second preheating device is higher than that of the first preheating device;
the dip soldering device is butted at the rear part of the second conveying platform and comprises a support, a dip soldering conveying mechanism movably connected to the support and a tin furnace positioned below the dip soldering conveying mechanism, the dip soldering conveying mechanism is used for being butted with the second conveying platform and lowering a received circuit board into the tin furnace for soldering, and the dip soldering conveying mechanism is driven by a third stepping motor connected with a third encoder;
the output platform is butted behind the dip soldering device and used for outputting the dip soldered circuit board;
the dip soldering sensor is arranged on the bracket and is positioned above the dip soldering conveying mechanism; and
the controller is electrically connected with the dip soldering sensor and used for controlling the start and stop of the dip soldering conveying mechanism according to a sensing signal of the dip soldering sensor, so that the circuit board moves and stops at a set position on the dip soldering conveying mechanism to perform soldering operation;
the full-automatic dip-soldering machine further comprises a movable plate and an air cylinder, the air cylinder is arranged on one side of the top of the tin furnace, and the movable plate is connected to a telescopic rod of the air cylinder so as to be driven by the air cylinder to move to the position below the dip-soldering sensor and be used for being sensed by the dip-soldering sensor.
2. The fully automatic dip welder according to claim 1, further comprising:
the first inductor is arranged on the first conveying platform, is positioned at the front end of the spraying device and is used for inducing the circuit board to convey the circuit board to a set position on the first conveying platform;
the second inductor is arranged between the first conveying platform and the second conveying platform and used for inducing the circuit board to convey the circuit board to a set position on the second conveying platform;
the third inductor is arranged between the second conveying platform and the dip soldering device and used for inducing a circuit board to control the first conveying platform and the second conveying platform to stop and control the dip soldering conveying mechanism to receive the circuit board on the second conveying platform; and
the fourth inductor is arranged between the dip soldering device and the output platform and used for inducing the output of the circuit board;
the controller is electrically connected with the spraying device, the first preheating device, the second preheating device, the dip-soldering device, the output platform, the first inductor, the second inductor, the third inductor and the fourth inductor, so that the start and stop of the first conveying platform, the first preheating device and the sprayer are controlled according to the induction signal of the first inductor, the start and stop of the second conveying platform and the second preheating device are controlled according to the induction signal of the second inductor, the stop of the second conveying platform and the start and stop of the dip-soldering conveying mechanism are controlled according to the induction signal of the third inductor, the induction signal of the third inductor is prior to the induction signal of the second inductor, and the start and stop of the output platform are controlled according to the induction signal of the fourth inductor.
3. The fully automatic dip welder according to claim 1, further comprising a tin scraping mechanism, the tin scraping mechanism comprising:
the two sliding rails are respectively positioned at the two outer sides of the tin furnace;
two ends of the rotating shaft are respectively connected with the two sliding rails in a sliding manner;
the tin scraping plate is fixedly connected to the rotating shaft on one side so as to scrape oxides on the liquid surface by moving, and a track of the tin scraping plate rotating along with the rotating shaft comprises a tin scraping position for scraping the oxides and a avoiding position for avoiding tin liquid; and
and the driving part is used for driving the rotating shaft to slide along the sliding rail.
4. The fully automatic dip soldering machine according to claim 3, wherein the tin scraping plate rotates to the tin scraping position under the action of gravity;
the tin scraping mechanism further comprises:
the extrusion strip and one sliding rail are arranged on the same side of the tin furnace and are parallel to the extending direction of the sliding rail;
the regulating part rotates to be connected the one end of pivot, and is provided with the restriction position on rotating the orbit, be used for when the pivot slides, with the extrusion strip forms the extrusion and rotates, and through rotating extremely thereby the restriction position drives the pivot rotates, and then makes scrape the tin plate and rotate extremely keep away the position.
5. The fully automatic dip welding machine according to claim 1, characterized in that said dip welding device further comprises a press-fixing mechanism, said press-fixing mechanism comprising a press-fixing member;
the dip-soldering conveying mechanism comprises a conveying chain, an adapter connected to the outer side of the conveying chain, a main body rod used for arranging the conveying chain and a telescopic device used for connecting the main body rod and the support;
the two groups of conveying chains are arranged oppositely, the circuit board is positioned on the adapter between the two groups of conveying chains, the adapter is driven by the conveying chains to operate, and then the circuit board is conveyed, and the pressing piece is used for pressing and fixing the circuit board on the adapter.
6. The fully automatic dip welding machine according to claim 5, wherein the press-fixing mechanism further comprises an adjusting plate, a sliding connecting rod, a bolt member and a spring;
the sliding connection rod is fixedly arranged on the main body rod, the adjusting plate is connected to the sliding connection rod in a sliding mode through a sliding connection hole, the spring is sleeved on the sliding connection rod and is arranged between the main body rod and the adjusting plate in a compression mode, a first threaded hole is formed in the main body rod, a through hole is formed in the adjusting plate, the bolt penetrates through the through hole and is connected with the first threaded hole, and the distance between the main body rod and the adjusting plate is adjusted through screwing of the bolt;
the pressing and fixing piece is connected with the adjusting plate, so that the pressing and fixing space between the pressing and fixing piece and the adapter piece for the circuit board can be adjusted by adjusting the adjusting plate.
7. The full-automatic dip welding machine according to claim 6, wherein the press fixing piece comprises a press plate and a connecting plate, the press plate is connected to one end of the connecting plate, the plate surface of the press plate is approximately vertical, the connecting plate is connected to the top of the adjusting plate, and the press plate is located on one side of the main body rod and used for pressing and fixing a circuit board;
the adjusting plate is provided with a second threaded hole, the connecting plate is provided with a connecting groove corresponding to the second threaded hole, and the connecting groove extends in the direction away from the pressing plate and penetrates through the edge of the connecting plate.
8. The full-automatic dip welding machine according to claim 5, wherein a feeding support member for supporting a circuit board is arranged at one end of the second conveying platform close to the dip welding device, the feeding support member extends between the adapters of the two sets of conveying chains, a receiving support member for supporting a circuit board is arranged at one end of the output platform close to the dip welding device, and the receiving support member extends between the adapters of the two sets of conveying chains.
9. A dip soldering control method characterized by performing a dip soldering operation using the full-automatic dip soldering machine according to claim 1, the dip soldering control method comprising the steps of:
controlling the start and stop of the first conveying platform according to a sensing signal of the first sensor, so that the circuit board is conveyed to a position opposite to the first preheating device through the spraying device and stays for a set preheating time;
controlling the second conveying platform to start and stop according to the sensing signals of the second sensor and the third sensor, so that the circuit board is conveyed to a position opposite to the second preheating device, stays for a set preheating time, and is conveyed to a position close to the dip soldering device;
controlling the movable plate to move according to the sensing signals of the third sensor and the dip soldering sensor;
controlling the dip soldering device to operate according to the sensing signals of the third sensor and the dip soldering sensor, so as to receive the circuit board on the second conveying platform and dip solder the circuit board;
and controlling the start and stop of the output platform according to the sensing signal of the fourth sensor, so as to receive the circuit board on the dip soldering device for output.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910875917.9A CN110560819B (en) | 2019-09-17 | 2019-09-17 | Full-automatic dip soldering machine and corresponding dip soldering control method |
| CN202111156232.2A CN113732430B (en) | 2019-09-17 | 2019-09-17 | Full-automatic dip soldering machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910875917.9A CN110560819B (en) | 2019-09-17 | 2019-09-17 | Full-automatic dip soldering machine and corresponding dip soldering control method |
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| CN202111156232.2A Division CN113732430B (en) | 2019-09-17 | 2019-09-17 | Full-automatic dip soldering machine |
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| CN110560819A CN110560819A (en) | 2019-12-13 |
| CN110560819B true CN110560819B (en) | 2021-10-29 |
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| CN202111156232.2A Active CN113732430B (en) | 2019-09-17 | 2019-09-17 | Full-automatic dip soldering machine |
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| CN117156713B (en) * | 2023-08-18 | 2024-08-23 | 宜宾卓邦科技有限公司 | Circuit board soldering tin equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110560819A (en) | 2019-12-13 |
| CN113732430B (en) | 2023-01-10 |
| CN113732430A (en) | 2021-12-03 |
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