CN218851068U - Mini/micro LED laser bonding equipment - Google Patents
Mini/micro LED laser bonding equipment Download PDFInfo
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- CN218851068U CN218851068U CN202222208028.7U CN202222208028U CN218851068U CN 218851068 U CN218851068 U CN 218851068U CN 202222208028 U CN202222208028 U CN 202222208028U CN 218851068 U CN218851068 U CN 218851068U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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Abstract
The utility model relates to a Mini micro LED laser bonding equipment, including the installation frame, be provided with in the installation frame and be used for controlling the three-dimensional regulating unit that the laser head carries out position control, the laser head sets up on the three-dimensional regulating unit, be provided with the conveying mechanism who is used for transmitting the work piece in the installation frame, be provided with the location adsorption equipment who is used for adjusting the work piece position of will processing in the installation frame and construct. The utility model provides a when using laser bonding's mode to weld Mini micro LED to the glass substrate, there is the soldering paste between glass substrate and the Mini micro LED, the soldering paste is in the molten state after passing through laser heating, the condition that skew can appear in Mini micro LED this moment, the region that the laser head work was placed to the glass substrate leads to the glass substrate to take place physical change because of being heated the condition of uneven or high temperature and leads to the Mini micro LED error of bonding on the glass substrate big, influence the condition scheduling problem of Mini micro LED use quality.
Description
Technical Field
The utility model relates to a LED laser bonding technical field, in particular to Mini/micro LED laser bonding equipment.
Background
With the progress of LED luminescent materials, the distance between pixel points of an LED display module is smaller and smaller, innovative products based on a Mini LED and a MicroLED are continuously provided, how to bond the Mini/MicroLED to a glass substrate in the actual production and manufacturing process to improve the welding yield of the Mini/MicroLED is a technical problem for the development of the Mini/MicroLED at present, the traditional bonding mode is mostly processed by adopting a reflow soldering technology, however, the position deviation of the Mini/MicroLED in the bonding process with the glass substrate is easily caused by adopting a reflow soldering mode to cause poor effects of the products after welding forming, so that the Mini/MicroLED is bonded and welded to the glass substrate by adopting a laser bonding and welding mode, and the trend of the current Mini/MicroLED bonding and processing is formed.
When the Mini/micro LED is welded on the glass substrate in a laser bonding mode, a soldering paste exists between the glass substrate and the Mini/micro LED, the soldering paste is in a molten state after being heated by laser, the Mini/micro LED can deviate at the moment, and the problems that the Mini/micro LED bonded on the glass substrate has large error and the service quality of the Mini/micro LED is influenced due to the fact that the glass substrate is prone to physical change in a working area of a laser head caused by uneven heating or high temperature are caused easily when the glass substrate is placed on the working area of the laser head.
Disclosure of Invention
Technical problem to be solved
An object of the utility model is to provide a Mini/micro LED laser bonding equipment to solve the problem of proposing among the above-mentioned background art.
(II) technical scheme
In order to achieve the above purpose, the utility model adopts the following technical scheme: a Mini/micro LED laser bonding device comprises an installation rack, wherein a three-dimensional adjusting unit used for controlling a laser head to adjust the position is arranged on the installation rack, the laser head is arranged on the three-dimensional adjusting unit, a conveying mechanism used for conveying workpieces is arranged on the installation rack, and a positioning adsorption mechanism used for adjusting the position of the workpiece to be processed is arranged on the installation rack;
the conveying mechanism comprises conveying supports symmetrically arranged on the mounting rack, the conveying supports are connected with the mounting rack in a sliding fit mode, conveying branched chains are mounted on the conveying supports, and distance-adjusting branched chains used for controlling the conveying supports to adjust positions are arranged on the mounting rack;
three-dimensional regulating unit is including setting up the slide rail of installation frame up end one side, just set up on the installation frame up end opposite side be used for controlling the adjustment mechanism of laser head seesaw on the installation frame, just a slide rail with be provided with the movable plate between the adjustment mechanism, be provided with No. two adjustment mechanism that are used for controlling the laser head side to side motion on the movable plate, be provided with No. three adjustment mechanism that are used for controlling the laser head and carry out regulation from top to bottom on No. two adjustment mechanism, be provided with the mounting bracket that is used for installing the laser head on No. three adjustment mechanism, and be provided with the dust catcher that is used for absorbing the high temperature flue gas that the laser head produced when welding the work piece on the mounting bracket, adjustment mechanism, no. two adjustment mechanism and No. three adjustment mechanism are the looks isostructure.
Preferably, the first adjusting mechanism comprises an adjusting motor installed on the upper end face of the installing frame through a motor base, a lead screw is connected to an output shaft of the adjusting motor through a coupler, one end, far away from the output shaft of the adjusting motor, of the lead screw is connected with a fixed vertical plate through a bearing, the fixed vertical plate is installed on the installing frame, a moving block is connected to the lead screw in a traditional thread meshing mode, a sliding block is arranged on the installing frame, the sliding block is connected with the moving block in a sliding fit mode, and the moving block is connected with the moving plate.
Preferably, the transmission branched chain comprises a conveying chain wheel arranged on the conveying support through a bearing, the conveying chain wheel is symmetrically arranged on the front side and the rear side of the conveying support, the conveying chain wheel is connected with the conveying chain wheel through a conveying chain, a conveying motor is arranged on the conveying support through a motor base, and an output shaft of the conveying motor is connected with the conveying chain wheel.
Preferably, the distance-adjusting branched chain comprises a distance-adjusting cylinder installed on the installation rack, the output end of the distance-adjusting cylinder is connected with the conveying support through a flange, a guide block is arranged on the installation rack, and a guide groove in sliding fit with the guide block is formed in the conveying support.
Preferably, the positioning and adsorbing mechanism comprises a supporting and fixing frame arranged on the mounting frame, positioning operation holes are uniformly formed in the supporting and fixing frame, an adjusting cylinder is arranged on the mounting frame, an adjusting support plate is arranged on the adjusting cylinder, a positioning rod is arranged on the adjusting support plate, the positioning rod penetrates through the positioning operation holes in a sliding mode, and a sucker is arranged on the positioning rod.
(III) advantageous effects
1. The utility model places the base plate on which the Mini/micro LED is stacked on the conveying mechanism in the actual operation, drives the base plate to move to the designated position working position through the conveying mechanism, ensures that the laser head can carry out laser bonding treatment on all the Mini/micro LED on the base plate in the process of following the movement of the three-dimensional adjusting unit, ensures that the laser head can comprehensively carry out laser bonding on the Mini/micro LED,
2. the utility model discloses earlier jack-up base plate through location adsorption mechanism in actual operation, and at first carry out the rigidity to the base plate through the sucking disc at inferior in-process, base plate and the conveying mechanism separation this moment, conveying mechanism carries out position control under this state, and location adsorption mechanism drives the base plate and descends to operating position, then three-dimensional regulating unit controls the laser head at this in-process and carries out laser bonding processing operation to Mini/micro LED on the base plate one by one, can improve the stability of Mini/micro LED in laser bonding operation, and can carry out the regulation of automatic adaptation to the base plate of multiple specification, application scope has been improved.
Drawings
The present invention will be further described with reference to the accompanying drawings and examples.
Fig. 1 is a schematic view of a first three-dimensional structure of the present invention;
fig. 2 is a schematic view of a second three-dimensional structure of the present invention;
fig. 3 is a schematic structural diagram between the mounting frame and the three-dimensional adjusting unit of the present invention;
fig. 4 is a schematic structural view between the mounting frame, the conveying mechanism and the positioning and adsorbing mechanism of the present invention;
fig. 5 is a schematic view of the three-dimensional structure of the positioning and adsorbing mechanism of the present invention.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
As shown in fig. 1 to 5, a Mini/micro led laser bonding apparatus includes an installation frame 1, a three-dimensional adjustment unit 2 for controlling a laser head to perform position adjustment is disposed on the installation frame 1, the laser head is disposed on the three-dimensional adjustment unit 2, a conveying mechanism 3 for conveying a workpiece is disposed on the installation frame 1, and a positioning and adsorbing mechanism 4 for adjusting a position of the workpiece to be processed is disposed on the installation frame 1;
the conveying mechanism 3 comprises conveying supports 31 symmetrically arranged on the mounting rack 1, the conveying supports 31 are connected with the mounting rack 1 in a sliding fit manner, a transmission branched chain 32 is arranged on each conveying support 31, and a distance-adjusting branched chain 33 used for controlling the conveying supports 31 to adjust the positions is arranged on the mounting rack 1;
the transmission branched chain 32 comprises a conveying chain wheel 321 arranged on the conveying support 31 through a bearing, the conveying chain wheel 321 is symmetrically arranged on the front side and the rear side of the conveying support 31, the conveying chain wheels 321 are connected through a conveying chain 322, the conveying support 31 is provided with a conveying motor 323 through a motor base, and an output shaft of the conveying motor 323 is connected with the conveying chain wheel 321.
Adopt above-mentioned technical scheme to place the base plate on two conveyor chains 322 in actual operation, start conveying motor 323 and drive conveyor chain 321 and rotate, conveyor chain 321 drives the base plate at the pivoted in-process and removes.
The adjustable-pitch branched chain 33 comprises an adjustable-pitch cylinder 331 installed on the installation rack 1, the output end of the adjustable-pitch cylinder 331 is connected with the conveying support 31 through a flange, a guide block 332 is arranged on the installation rack 1, and a guide groove in sliding fit with the guide block 332 is formed in the conveying support 31.
The distance-adjusting branched chain 33 is divided into two states in the operation, one of the two states can start the adjusting cylinder 331 to drive the conveying brackets 31 to perform the adjusting operation according to the specification of the substrate, so that the distance between the two conveying brackets 31 can meet the placing requirement of the substrate, the substrate can be stably placed on the conveying chain 322, and the requirement of conveying the substrate with different specifications can be met while the substrate can be stably conveyed; secondly, after the substrate moves to the designated working position, the positioning and adsorbing mechanism 4 firstly adsorbs the substrate and drives the substrate to move upwards, the substrate at the moment is not in contact with the conveying chain 322, and the adjusting cylinder 331 drives the conveying support to move towards two sides under the state, so that the substrate can be attached to the jacking and adsorbing mechanism 4 to ensure the stability of the laser head in Mini/micro LED laser bonding treatment on the substrate.
Through adopting above-mentioned technical scheme transmission branch 32 can drive the base plate and carry out at the uniform velocity and accurate motion in concrete operation for the base plate can move to the laser head and follow the within range that three-dimensional adjusting unit 2 can move, and the automatic interval of adjusting between the branch chain 32 of carrying of change that the base plate specification can be followed to roll adjustment branch chain 33, make and carry the branch chain 32 and carry the processing to the base plate of different specifications, and roll adjustment branch chain 33 is at operation control transmission branch chain 32 regulation pitch, make the base plate can laminate on location adsorption apparatus 4 in bonding operation in order to ensure the stability of laser head in to Mini/microLED bonding processing operation.
The positioning and adsorbing mechanism 4 comprises a supporting and fixing frame 41 installed on the installation frame 1, positioning operation holes are evenly formed in the supporting and fixing frame 41, an adjusting cylinder 42 is installed on the installation frame 1, an adjusting support plate 43 is installed on the adjusting cylinder 42, a positioning rod 44 is installed on the adjusting support plate 43, the positioning rod 44 slides to penetrate through the positioning operation holes, and a sucker 45 is arranged on the positioning rod 44.
Through adopting above-mentioned technical scheme to start actuating cylinder 42 at the in-process of actual work and drive the board 43 upward movement of regulation, the board 43 of regulation drives sucking disc 45 and base plate laminating through locating lever 44 at the in-process of upward movement, and sucking disc 45 external current air pump, the air pump carries out the steady absorption to the base plate through sucking disc 45 in the operation, treat that conveying support 31 adjusts to suitable state and can make the smooth position to supporting the mount 41 laminating of base plate, then actuating cylinder 42 drives and adjusts the position that supporting plate 43 downstream made the base plate can laminate on supporting the mount 41.
Three-dimensional regulating unit 2 is including setting up slide rail 21 of 1 up end one side of the installation frame, just set up on the 1 up end opposite side of installation frame and be in an adjustment mechanism 22 that is used for controlling the laser head seesaw on the installation frame 1, just slide rail 21 with be provided with movable plate 23 between an adjustment mechanism 22, be provided with No. two adjustment mechanism 24 that are used for controlling the laser head side-to-side movement on the movable plate 23, be provided with No. three adjustment mechanism 25 that are used for controlling the laser head and adjust from top to bottom on No. two adjustment mechanism 24, be provided with the mounting bracket 26 that is used for installing the laser head on No. three adjustment mechanism 25, and be provided with the dust catcher that is used for absorbing the high temperature flue gas that the laser head produced when welding the work piece on the mounting bracket 26, an adjustment mechanism 22, no. two adjustment mechanism 24 are the same structure with No. three adjustment mechanism 25.
The first adjusting mechanism 22 comprises an adjusting motor 221 mounted on the upper end surface of the mounting frame 1 through a motor base, an output shaft of the adjusting motor 221 is connected with a lead screw 222 through a coupler, one end, far away from the output shaft of the adjusting motor 221, of the lead screw 222 is connected with a fixed vertical plate 223 through a bearing, the fixed vertical plate 223 is mounted on the mounting frame 1, a moving block 224 is connected to the lead screw 222 in a traditional thread meshing manner, a sliding block 225 is arranged on the mounting frame 1, the sliding block 225 is connected with the moving block 224 in a sliding fit manner, and the moving block 224 is connected with the moving plate 23.
The adjusting motor 221 is started to drive the lead screw 222 to rotate, the lead screw 222 drives the moving block 224 to move in the rotating process, and the moving block 223 can move and adjust in the horizontal direction in the moving process.
Through adopting above-mentioned technical scheme can control the laser head through mutually supporting between adjustment mechanism 22, no. two adjustment mechanism 24 and carry out the motion in two degree of freedom directions all around in the actual operation to guarantee that the laser head can move as the position top to arbitrary Mini/micro LED on the base plate, and No. three adjustment mechanism 25 controls the laser head at this in-process and carries out lift adjustment, thereby makes the laser head can carry out laser heating to Mini/micro LED and accomplish bonding processing operation.
After the Mini/micro led on the substrate is processed by the laser key, the air pump stops working, the adjusting cylinder 42 controls the substrate to move to the initial position, at this time, the conveying support 31 resets to enable the substrate to fall on the conveying chain 322 again, and the substrate is driven to be conveyed through the conveying branched chain 32.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A Mini/micro LED laser bonding device comprises an installation rack (1) and is characterized in that a three-dimensional adjusting unit (2) used for controlling a laser head to adjust the position is arranged on the installation rack (1), the laser head is arranged on the three-dimensional adjusting unit (2), a conveying mechanism (3) used for conveying workpieces is arranged on the installation rack (1), and a positioning adsorption mechanism (4) used for adjusting the position of the workpiece to be processed is arranged on the installation rack (1);
the conveying mechanism (3) comprises conveying supports (31) symmetrically arranged on the mounting rack (1), the conveying supports (31) are connected with the mounting rack (1) in a sliding fit mode, a transmission branched chain (32) is installed on each conveying support (31), and a distance-adjusting branched chain (33) used for controlling the conveying supports (31) to adjust positions is arranged on the mounting rack (1);
three-dimensional regulating unit (2) is including setting up slide rail (21) of installation frame (1) up end one side, just set up on installation frame (1) up end opposite side and be used for controlling adjustment mechanism (22) of laser head seesaw on installation frame (1), just slide rail (21) with be provided with movable plate (23) between adjustment mechanism (22), be provided with No. two adjustment mechanism (24) that are used for controlling the laser head side-to-side movement on movable plate (23), be provided with No. three adjustment mechanism (25) that are used for controlling the laser head and adjust from top to bottom on No. two adjustment mechanism (24), be provided with mounting bracket (26) that are used for installing the laser head on No. three adjustment mechanism (25), and be provided with the dust catcher that is used for absorbing the high temperature flue gas that the laser head produced when welding to the work piece on mounting bracket (26), adjustment mechanism (22), no. two adjustment mechanism (24) and No. three adjustment mechanism (25) are the same structure.
2. The Mini/micro LED laser bonding device according to claim 1, wherein the first adjusting mechanism (22) comprises an adjusting motor (221) installed on the upper end surface of the installation rack (1) through a motor base, an output shaft of the adjusting motor (221) is connected with a lead screw (222) through a coupler, one end, far away from the output shaft of the adjusting motor (221), of the lead screw (222) is connected with a fixed vertical plate (223) through a bearing, the fixed vertical plate (223) is installed on the installation rack (1), a moving block (224) is connected to the lead screw (222) in a threaded engagement traditional manner, a sliding block (225) is arranged on the installation rack (1), the sliding block (225) is connected with the moving block (224) through a sliding fit manner, and the moving block (224) is connected with the moving plate (23).
3. The Mini/micro LED laser bonding device according to claim 1, wherein the transmission branch chain (32) comprises conveying chain wheels (321) arranged on the conveying support (31) through bearings, the conveying chain wheels (321) are symmetrically arranged on the front side and the rear side of the conveying support (31), the conveying chain wheels (321) are connected through conveying chains (322), a conveying motor (323) is arranged on the conveying support (31) through a motor base, and an output shaft of the conveying motor (323) is connected with the conveying chain wheels (321).
4. The Mini/micro LED laser bonding device according to claim 3, wherein the distance-adjusting branched chain (33) comprises a distance-adjusting cylinder (331) installed on the installation rack (1), the output end of the distance-adjusting cylinder (331) is connected with the conveying support (31) through a flange, a guide block (332) is arranged on the installation rack (1), and a guide groove in sliding fit with the guide block (332) is formed in the conveying support (31).
5. The Mini/micro LED laser bonding equipment according to claim 1, wherein the positioning and adsorbing mechanism (4) comprises a supporting and fixing frame (41) installed on the installation rack (1), positioning operation holes are uniformly formed in the supporting and fixing frame (41), an adjusting cylinder (42) is installed on the installation rack (1), an adjusting support plate (43) is installed on the adjusting cylinder (42), a positioning rod (44) is installed on the adjusting support plate (43), the positioning rod (44) penetrates through the positioning operation holes in a sliding manner, and a sucker (45) is arranged on the positioning rod (44).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222208028.7U CN218851068U (en) | 2022-08-22 | 2022-08-22 | Mini/micro LED laser bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222208028.7U CN218851068U (en) | 2022-08-22 | 2022-08-22 | Mini/micro LED laser bonding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218851068U true CN218851068U (en) | 2023-04-11 |
Family
ID=87307102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222208028.7U Active CN218851068U (en) | 2022-08-22 | 2022-08-22 | Mini/micro LED laser bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218851068U (en) |
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2022
- 2022-08-22 CN CN202222208028.7U patent/CN218851068U/en active Active
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