CN210030858U

CN210030858U - Immersion plating device

Info

Publication number: CN210030858U
Application number: CN201920462664.8U
Authority: CN
Inventors: 丁瑞荣; 吉祥勤; 蔡文清
Original assignee: Changzhou Wujin Huarui Electronic Co Ltd
Current assignee: Changzhou Wujin Huarui Electronic Co Ltd
Priority date: 2019-04-08
Filing date: 2019-04-08
Publication date: 2020-02-07
Anticipated expiration: 2029-04-08

Abstract

The utility model provides a dip plating device, including plating the liquid box, plating the liquid box has the cavity that holds the plating bath, and the cavity is located the below of conveying part, and conveying part, conveying part have one section at least bellying, and the bellying is located the top of plating the liquid box and is protruding towards plating the liquid box, has between plating liquid box lateral wall and the conveying part through the clearance, bears the weight of the component of treating dip plating in the conveying part, and the component salient passes through the clearance in the part of conveying part bottom from passing through. The utility model discloses well conveying part drives and waits to dip the device and move, waits to dip the device and passes through the clearance, waits to dip the device and moves to the bellying and can immerse in the plating bath of plating solution box, can effectively avoid the plating bath to be oxidized into the waste residue; a nozzle is not needed, and the pin of the nozzle blocking element is avoided; the continuous movement of the conveying part can drive the immersion plating element to carry out continuous immersion plating, the element does not need to be repeatedly taken and placed, and the immersion plating efficiency is improved.

Description

Immersion plating device

Technical Field

The utility model relates to a dip-plating field especially relates to a dip-plating device.

Background

The PCB board among the prior art usually needs to weld electronic component, specifically insert electronic component's pin in the slot of circuit board earlier, then it is fixed to carry out soldering tin to the junction of pin and slot, manual welding usually among the traditional art, but low in production efficiency, be not suitable for large-scale production, so someone proposes a scheme, realize automatic welding through the manipulator, and the manipulator need reciprocal getting PCB board, unable continuous welding operation, for this reason someone proposes a spraying soldering tin scheme, let PCB board and electronic component bear on the assembly line, the below of assembly line is equipped with spray assembly and supplies the tin liquid device, spray assembly sprays the tin liquid to the PCB board, the PCB board is kept away from after the spray assembly tin liquid cooling solidification on the PCB board, realize that the soldering tin of electronic component pin is fixed, but above-mentioned scheme still has following problem: 1. a certain spraying distance is reserved between the spraying assembly and the production line, and during the spraying process, the tin liquid can contact with air to cause partial tin liquid to be oxidized to form waste residues, so that materials are wasted; 2. some electronic component's pin length is longer, can receive spray assembly's hindrance when moving to spray assembly top, if increase the distance between spray assembly and the assembly line, then the waste residue rate can be higher, and spout and cover the effect poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an overcome above-mentioned problem or solve the device that plates of soaking of above-mentioned problem at least partially to solve the problem that the waste residue rate is high and long pin is difficult to pass through.

In order to achieve the above object, the technical solution of the present invention is specifically realized as follows: the utility model provides a dip-plating device, include:

the plating solution box is provided with a cavity for containing plating solution, and the cavity is positioned below the conveying part;

the conveying part is provided with at least one section of protruding part, the protruding part is positioned above the plating solution box and protrudes towards the plating solution box, and a passing gap is formed between the side wall of the plating solution box and the conveying part.

Preferably, the conveying part carries the components to be dip-plated, and the parts of the components protruding from the bottom of the conveying part pass through the passing gap.

Preferably, the plating device further comprises a melting box, the plating solution box is accommodated in the melting box, and the plating solution box is provided with a through hole communicated with the melting box.

Preferably, the melting box further comprises a heating device, and the heating device is arranged at the bottom or on the periphery of the melting box.

Preferably, the melting box further comprises a vibrating device installed on the top or on the circumference of the melting box.

Preferably, the melting box is slidably mounted on a frame.

The utility model has the advantages that: the conveying part drives the device to be dip-plated to move, the device to be dip-plated penetrates through the gap, and the device to be dip-plated is moved to the protruding part and can be immersed in the plating solution of the plating solution box, so that the plating solution can be effectively prevented from being oxidized into waste residues; a nozzle is not needed, and the pin of the nozzle blocking element is avoided; the continuous movement of the conveying part can drive the immersion plating element to carry out continuous immersion plating, the element does not need to be repeatedly taken and placed, and the immersion plating efficiency is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural view of an immersion plating apparatus according to the present invention;

FIG. 2 is a schematic structural view of a plating solution box of the immersion plating apparatus according to the present invention;

FIG. 3 is a schematic structural view of a conveying part of the immersion plating apparatus according to the present invention;

FIG. 4 is a schematic structural diagram of another embodiment of a plating bath box of the immersion plating apparatus provided by the present invention;

FIG. 5 is a schematic structural view of another embodiment of a conveying part of the immersion plating apparatus according to the present invention;

FIG. 6 is an isometric view of an immersion plating apparatus provided by the present invention;

fig. 7 is an enlarged view of a portion a in fig. 1 according to the present invention.

In the figure: the device comprises a frame 1, a conveying part 2, a plating solution box 3, a protruding part 4, a melting box 5, a vibrating device 6, a through hole 7, a heating device 8, a guide rail 9, a chain claw 10 and a guide wheel 11.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

Fig. 1 shows the immersion plating device provided by the embodiment of the present invention, referring to fig. 1, the immersion plating device provided by the embodiment of the present invention includes a plating solution box 3 and a conveying part 2, the plating solution box 3 has a cavity for holding plating solution, the cavity is located below the conveying part 2, the plating solution box 3 is used for holding plating solution, and the conveying part 2 conveys the device to be immersion plated to the plating solution box 3 for hot immersion plating.

As an embodiment of the plating bath box 3 of the present invention, the plating bath box 3 is configured into a groove shape, the inside of the groove defines a chamber for accommodating the plating bath, and the solid solder can be directly put into the plating bath box 3, and then melted into the plating bath by heating. As another embodiment of the utility model discloses a plating bath box 3, plating bath box 3 is configured to recess form and the bottom is opened there is through-hole 7, plating bath box 3's below still is configured with melting box 5, plating bath box 3 holds in melting box 5 and through-hole 7 and melting box 5 intercommunication, place solid solder in melting box 5, melt solid solder for the plating bath through the mode of heating, then the plating bath in melting box 5 can pass through-hole 7 and enter into plating bath box 3 in, preferably, plating bath box 3 is with the help of bolt and melting box 5 fixed connection, the bottom surface of plating bath box 3 leaves the clearance with the interior upper surface of melting box 5, make the plating bath can enter into plating bath box 3 through-hole 7 smoothly.

The plating solution box 3 and the conveying part 2 are matched to carry out hot dip plating, in order to enable the device to be subjected to hot dip plating to be immersed in the plating solution of the plating solution box 3 and prevent the protruding pins of the device to be subjected to hot dip plating from being blocked by the side wall of the plating solution box 3, the conveying part 2 is configured to be provided with at least one section of protruding part 4, the protruding part 4 is located above the plating solution box 3 and protrudes towards the plating solution box 3, a passing gap is formed between the side wall of the plating solution box 3 and the conveying part 2, and the passing gap is used for the protruding pins of the device to be subjected to hot dip plating to pass.

As an embodiment of the utility model discloses a conveying part 2, conveying part 2 includes the conveying chain, conveying chain top disposes guided way 9, the conveying chain moves along guided way 9, and guided way 9 is configured to have at least one section protruding, it is protruding to be located the top of plating bath box 3 and protruding towards plating bath box 3, thereby the conveying chain also can be protruding towards plating bath box 3 along the direction of guided way 9, treat that plating bath component on conveying part 2 can be soaked in the plating bath of plating bath box 3 when this is protruding and carry out hot dipping, as for the distance through the clearance can be adjusted through the degree of protrusion of adjustment guided way 9, as long as can make the pin that the component of waiting to plate stretches out can pass through smoothly.

As another embodiment of the conveying part 2 of the present invention, the conveying part 2 includes a conveying chain, the conveying chain is configured with a plurality of guide wheels 11, the movement track of the conveying chain is limited by the guide wheels 11, that is, the conveying chain is provided with at least one section of protruding part 4 by the guide wheels 11, the protruding part 4 is located above the plating solution box 3 and protrudes toward the plating solution box 3, the above object can be achieved, and the distance passing through the gap can be adjusted by adjusting the protruding degree of the conveying chain, as long as the pins extending from the element to be plated can pass through smoothly.

As other various modified examples of the conveying section 2 of the present invention, the conveying chain may be replaced with a conveying belt, a conveying link plate, or the like, without limitation.

It should be known to those skilled in the art that the conveying part 2 of the present invention may further include a power mechanism, wherein the power mechanism is used for providing power for the conveying part 2, specifically, the power mechanism includes a driving motor, a driving wheel driven by the driving motor and a plurality of driven wheels driven by the driving wheel, the plurality of driven wheels and the conveying chain form a complete transmission system, and the conveying chain may be replaced by a conveying belt, a conveying chain plate, etc.

In addition, the conveying part 2 is also provided with a tool clamp for bearing a tool, the tool bears a device to be dip-plated, the power mechanism drives the tool to move through a chain, the tool clamp of the utility model is a chain claw 10 fixed on a transmission chain, correspondingly, the side edge of the tool is provided with a clamping groove matched with the chain claw 10, the clamping groove of the tool is buckled on the chain claw 10 to form the limit of the tool, the tool is used for bearing the device to be dip-plated, thus, the device to be dip-plated can continuously carry out the hot dip plating work through the matching of the conveying part 2 and the plating solution box 3, compared with the mechanical arm, the efficiency is obviously improved, compared with the spray plating mode, the utility model can reduce the rate of waste residue formed by the contact of the plating solution and the air, and the pin extending out of the device to be dip-plated can not be obstructed by the spray nozzle, even if the distance through the clearance is very big, can not cause the waste residue rate to improve yet, consequently the utility model discloses can adapt to the electronic component's of multiple different types of specification welded fastening.

It should be noted that the utility model discloses a dip plating device can be adapted to the soldering tin of circuit board and fixed, specifically carry plating liquid box 3 through transport unit 2 PCB board and the electronic component that will need welded fastening, and electronic component's pin can dip in the plating bath with the junction of PCB board, and after the PCB board breaks away from plating liquid box 3, the plating bath cooling solidification to realize electronic component's pin and the welded fastening of PCB board, but the utility model discloses a plating bath device is not only fixed for the soldering tin of circuit board, and it can also be used for hot dipping.

The plating solution is obtained by heating and melting solid solder, and the solid solder comprises but is not limited to tin, zinc and nickel.

According to an embodiment of the present invention, the immersion plating apparatus further comprises a heating device 8, the heating device 8 being disposed at the bottom or in the circumferential direction of the melting box 5; put solid solder into melting box 5, start heating device 8, heat solid solder through heating device 8 and make it melt into the plating bath, as an embodiment of the utility model discloses a heating device 8, heating device 8 can be configured as electric heater, for example resistance wire heating, ceramic heater, resistance ring heating and quartz capsule heating etc..

According to the utility model discloses an embodiment, the dip coating device still includes vibrator 6, and vibrator 6 is installed in the top or the week of melting box 5, starts vibrator 6 and drives and melt box 5 vibrations, makes the plating bath liquid level in melting box 5 produce undulantly, and the plating bath can cover the contact site of component pin and circuit board comprehensively, improves the plating bath quality of component pin, and vibrator 6 specifically can be configured into vibrating motor or electromagnetic shaker, as the utility model discloses an embodiment of vibrator 6, the top or the upwards spiro union of circumference of melting box 5 have the mounting bracket, and the mounting bracket top surface is fixed through a plurality of support columns and is equipped with vibrating motor, and in order to further provide the vibrations effect, vibrating motor's output shaft is equipped with vibrations.

In order to improve the vibration effect, the melting box 5 is slidably mounted on the frame 1; melt box 5 and can follow 1 reciprocating motion of frame, do benefit to the vibrations that melt box 5, improve hot dipping quality, slidable mounting specifically can adopt slide rail slider cooperation or the cooperation of gyro wheel spout, as the utility model discloses an embodiment of slidable mounting, the spout is fixed to be set up on the frame top surface, and the gyro wheel rotates to set up on melting box 5 bottom surfaces, and the gyro wheel setting is in the spout.

The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. An immersion plating apparatus, characterized in that: the method comprises the following steps:

a plating solution box (3), wherein the plating solution box (3) is provided with a chamber for containing plating solution, and the chamber is positioned below the conveying part (2);

the conveying part (2), conveying part (2) have at least one section of jut (4), jut (4) are located plating solution box (3) top and towards plating solution box (3) are protruding, have between plating solution box (3) lateral wall and the conveying part (2) and pass through the clearance.

2. An immersion plating apparatus according to claim 1, characterized in that the conveying section (2) carries thereon components to be immersion plated, the parts of said components protruding from the bottom of the conveying section (2) passing through said passage gap.

3. The immersion plating apparatus according to claim 1, characterized in that the conveying section (2) comprises a conveyor chain above which a guide rail (9) is arranged, the conveyor chain moving along the guide rail (9), and the guide rail (9) is configured to have at least one length of protrusion that is located above the plating bath cassette (3) and protrudes toward the plating bath cassette (3), thereby forming a protruding structure in which the guide rail (9) and the conveyor chain together protrude toward the plating bath cassette (3), the protruding structure being a protruding portion of the conveying section (2).

4. The immersion plating device according to claim 3, wherein a tooling fixture for bearing a jig is further arranged on the conveying part (2), the tooling fixture is a chain claw (10) fixed on the transmission chain, a clamping groove matched with the chain claw (10) is arranged on the side edge of the jig, the clamping groove of the jig is buckled on the chain claw (10) to limit the jig, and the jig is used for bearing a device to be immersion plated.

5. The immersion plating apparatus according to claim 1, further comprising a melting box (5), wherein said plating box (3) is housed within said melting box (5), and wherein said plating box (3) is provided with a through hole (7) communicating with said melting box (5).

6. The immersion plating apparatus according to claim 5, further comprising a heating device (8), wherein the heating device (8) is provided on a bottom or a circumferential direction of the melting box (5).

7. An immersion plating apparatus according to claim 6, characterized in that said heating device (8) is an electric heater.

8. The immersion plating apparatus according to claim 5, further comprising a vibrating device (6), wherein the vibrating device (6) is installed on the top or on the circumference of the melting box (5).

9. The immersion plating apparatus according to claim 8, wherein the vibrating device (6) is a vibrating motor, a mounting frame is screwed to one side of the melting box (5), and the vibrating motor is fixedly arranged on the top surface of the mounting frame through a plurality of supporting columns.

10. An immersion plating apparatus according to claim 5, characterized in that said melting box (5) is slidably mounted on a frame (1).