CN210030845U - Immersion plating production line - Google Patents

Immersion plating production line Download PDF

Info

Publication number
CN210030845U
CN210030845U CN201920462681.1U CN201920462681U CN210030845U CN 210030845 U CN210030845 U CN 210030845U CN 201920462681 U CN201920462681 U CN 201920462681U CN 210030845 U CN210030845 U CN 210030845U
Authority
CN
China
Prior art keywords
conveying
plating
conveyor
immersion plating
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201920462681.1U
Other languages
Chinese (zh)
Inventor
丁瑞荣
吉祥勤
蔡文清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changzhou Wujin Huarui Electronic Co Ltd
Original Assignee
Changzhou Wujin Huarui Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changzhou Wujin Huarui Electronic Co Ltd filed Critical Changzhou Wujin Huarui Electronic Co Ltd
Priority to CN201920462681.1U priority Critical patent/CN210030845U/en
Application granted granted Critical
Publication of CN210030845U publication Critical patent/CN210030845U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

The utility model provides a dip plating production line, which comprises a dip plating device, a plating solution box and a conveying part, wherein the conveying part conveys a component to be plated to the plating solution box for continuous dip plating; conveying device, including transfer chain and turnover portion, the butt joint of turnover portion and conveying portion is passed through at the both ends of transfer chain, and the liquid component that treats to plate loops through transfer chain and turnover portion and transports to conveying portion. The utility model discloses in treat in proper order and dip the electronic component on the component and carry out the immersion plating processing, dip in succession and plate the efficiency that can improve the immersion plating operation, through first identification module and second identification module, and then through the removal of control system control turnover portion, ensure the alternate movement of two turnover portions and remain the tool of immersion plating component in order to transport to bear to guarantee the continuous immersion plating of immersion plating device, can improve the efficiency of immersion plating greatly.

Description

Immersion plating production line
Technical Field
The utility model relates to a dip-plating technical field especially relates to a dip-plating production line.
Background
In the prior art, an element to be dip-plated usually needs to be soldered with an electronic element, specifically, a pin of the electronic element is inserted into a slot of a circuit board, and then soldering is performed to fix a connection position of the pin and the slot. The traditional process is generally manual welding, but the production efficiency is low, and the process is not suitable for large-scale production, so a scheme is proposed, automatic welding is realized through a manipulator, and the manipulator needs to pick and place the element to be subjected to immersion plating in a reciprocating manner, so that continuous welding operation cannot be performed, and the operation efficiency is reduced. The tin soldering scheme that sprays is also proposed, lets wait to soak the component and electronic component bear on the assembly line promptly, and the below of assembly line is equipped with spray assembly and supplies tin liquid device, and spray assembly sprays tin liquid to waiting to soak the component, waits to soak the component and solidifies on waiting to soak the component after keeping away from spray assembly tin liquid cooling after, realizes that the soldering tin of electronic component pin is fixed, but above-mentioned scheme still has following problem: 1. a certain spraying distance is reserved between the spraying assembly and the production line, and during the spraying process, the tin liquid can contact with air to cause partial tin liquid to be oxidized to form waste residues, so that materials are wasted; 2. some electronic component's pin length is longer, can receive spray assembly's hindrance when moving to spray assembly top, if increase the distance between spray assembly and the assembly line, then the waste residue rate can be higher, and spout and cover the effect poor.
Therefore, the dip plating production line adopts two conveying lines and a dip plating device to operate in a matched mode, the two conveying lines bear elements to be subjected to dip plating through a jig, the elements to be subjected to dip plating are further conveyed to the dip plating device alternately, and the dip plating device can carry out continuous dip plating, so that the dip plating efficiency is greatly improved, and the productivity of the production line is effectively improved; and the tin liquor can be prevented from being oxidized to form waste residues, and the material is saved.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an overcome above-mentioned problem or solve the immersion plating production line of above-mentioned problem at least partially to solve traditional production line immersion plating inefficiency, tin liquid and by the problem of oxidation formation waste residue.
In order to achieve the above object, the technical solution of the present invention is specifically realized as follows:
the utility model provides a dip-plating production line, include:
the immersion plating device comprises a plating solution box and a conveying part, wherein the conveying part conveys a component to be plated to the plating solution box for continuous immersion plating;
the conveying device comprises a conveying line and a turnover part, wherein the two ends of the conveying line are butted with the conveying part through the turnover part, and the elements to be plated sequentially pass through the conveying line and the turnover part and are conveyed to the conveying part.
Preferably, the conveying line comprises a first conveying assembly, the first conveying assembly is used for driving a jig, and the jig bears the component to be plated.
Preferably, the turnover part comprises a second conveying assembly and a moving platform, the second conveying assembly is mounted on the moving platform, the conveying part comprises a third conveying assembly, and the moving platform drives the second conveying assembly to be in butt joint with the first conveying assembly or in butt joint with the third conveying assembly.
Preferably, the first conveying assembly comprises a conveying chain and a plurality of clamping jaws, the clamping jaws are fixed on the conveying chain, and the clamping jaws bear the jig.
Preferably, the conveyor chain is replaced by a conveyor belt.
Preferably, the second conveying assembly and the third conveying assembly have the same structure as the first conveying assembly.
Preferably, the plating solution box is provided with a cavity for accommodating plating solution, the cavity is positioned below the conveying part, the conveying part is provided with at least one section of protruding part, the protruding part is positioned above the plating solution box and protrudes towards the plating solution box, and a through gap is formed between the bottom wall of the plating solution box and the conveying part.
Preferably, a guide rail is disposed above the conveyor chain of the conveying unit, the conveyor chain moves along the guide rail, and the guide rail is configured to have at least one section of protrusion, and the protrusion is located above the plating solution box and protrudes toward the plating solution box.
Preferably, the conveying lines are two groups and are arranged on two sides of the immersion plating device.
Preferably, the two groups of conveying lines are respectively a first conveying line and a second conveying line, the jig on the first conveying line is provided with a first identification module, the jig on the second conveying line is provided with a second identification module, when the first identification module is identified, the jig corresponding to the first identification module is conveyed to the first conveying line, and when the second identification module is identified, the jig corresponding to the second identification module is conveyed to the first conveying line.
Preferably, the first identification module and the second identification module are photoelectric sensors or reed sensors.
The utility model has the advantages that: the staff places the component of treating to dip-plate on the tool, then enter into first transfer chain and second transfer chain along the line of plugging into, under the effect of turnover portion, bear the weight of the tool of treating the component of waiting to dip-plate and be transported on the conveying part of dip-plating device, treat the electronic component on the component of treating to dip-plate in proper order and carry out the dip-plating processing, the efficiency of dip-plating operation can be improved to continuous dip-plating, in addition, through first identification module and second identification module, and then the removal of turnover portion is controlled through control system, ensure the alternate movement of two turnover portions in order to transport the tool of bearing the component of waiting to dip-plate, in order to ensure the continuous dip-plating of dip-plating device, can improve the efficiency of dip-plating greatly.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a top view of an immersion plating production line provided by the present invention;
FIG. 2 is an isometric view of a dip-plating production line provided by the present invention;
FIG. 3 is an isometric view of an immersion plating apparatus of an immersion plating production line provided by the present invention;
FIG. 4 is a schematic view of a projection of the immersion plating apparatus of the immersion plating production line according to the present invention;
FIG. 5 is a schematic view of a first conveying assembly of the immersion plating production line according to the present invention;
fig. 6 is a schematic view of the turnover part of the dip plating production line provided by the utility model.
In the figure: the plating device 1, the plating bath box 11, the conveying part 12, the protrusion part 121, the conveying device 2, the conveying line 21, the first conveying assembly 211, the conveying chain 2111, the claws 2112, the guide rails 2113, the turnover part 22, the second conveying assembly 221 and the moving platform 222.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Fig. 1-5 show the utility model provides an immersion plating production line, including immersion plating device 1 and conveyor 2, wherein, immersion plating device 1 includes plating liquid box 11 and conveying part 12, and conveyor 2 includes transfer chain 21 and turnover part 22, and the butt joint of turnover part 22 and conveying part 12 is passed through at the both ends of transfer chain 21, waits to plate the liquid component and loops through transfer chain 21 and turnover part 22 and transports to conveying part 12, and conveying part 12 will wait to plate the liquid component and carry to plating bath box 11 and carry out the immersion plating in succession.
As an embodiment of the utility model discloses a transfer chain 21, as shown in fig. 2, transfer chain 21 includes first conveyor components 211, first conveyor components 211 is used for driving the tool, the tool bears the weight of and treats the liquid component that plates, specifically, first conveyor components 211 includes conveying chain 2111 and a plurality of jack catch 2112, jack catch 2112 is fixed on conveying chain 2111, jack catch 2112 bears the weight of the tool, wherein, jack catch 2112 is "L" shape claw, the vertical portion of "L" shape claw is fixed in conveying chain 2111, the horizontal portion of "L" shape claw is used for bearing the tool, in this embodiment, conveying chain 2111 is two cooperations uses, jack catch 2112 in two such conveying chains 2111 alright realize the bearing effect to the tool, drive the tool motion simultaneously.
Those skilled in the art will appreciate that the first conveyor assembly 211 may also include associated drive mechanisms, such as sprockets used with the conveyor chain 2111 and motors for driving the sprockets.
As an embodiment of the utility model discloses a turnover portion 22, turnover portion 22 includes second conveyor assembly 221 and moving platform 222, and the structure of second conveyor assembly 221 is the same with first conveyor assembly 211's structure, and second conveyor assembly 221 installs on moving platform 222, and moving platform 222 can drive second conveyor assembly 221 global movement.
In this embodiment, a support frame is disposed below the moving platform 222, the moving platform 222 is in sliding fit with the support frame, and a servo electric cylinder is installed on the support frame and drives the moving platform 222 to move.
As an embodiment of the conveying part 12 of the present invention, the conveying part 12 includes a third conveying assembly, and the structure of the third conveying assembly is the same as that of the first conveying assembly.
From the above, the moving platform 222 can drive the second conveying component 221 to be in butt joint with the first conveying component 211 or in butt joint with the third conveying component, so that continuous transfer of the jig is realized, a circulating production line is formed, an operator only needs to place a component to be dip-plated on the jig in the input direction of the dip-plating device, and then the dip-plated component is taken out in the output direction of the dip-plating device, so that continuous dip-plating is realized.
As an embodiment of the immersion plating apparatus 1 of the present invention, a guide rail 2113 is disposed above a conveying chain 2111 of a conveying portion 12, the conveying chain 2111 moves along the guide rail 2113, and the guide rail 2113 is configured to have at least one section of protrusion, which is located above a plating solution box 11 and protrudes toward the plating solution box 11; plating solution is put into the plating solution box 11, the plating solution box 11 needs to be connected with a heating device to ensure that the plating solution is always in a liquid state, the plating solution is obtained by heating and melting solid solder, the solid solder comprises but is not limited to tin, zinc and nickel, the conveying part 12 is used for driving a jig carrying a component to be dipped to continuously move, when the component to be dipped moves to the position of the protruding part 121, pins of the electronic component are soaked by the plating solution and then moved away under the action of the conveying part 12 to be separated from the plating solution in the plating solution box 11, so that the plating solution on the pins of the electronic component is cooled and solidified to achieve the purpose of welding, the continuous moving arrangement of the electronic component replaces the traditional manipulator to repeatedly pick and place, the efficiency of dipping can be improved, meanwhile, the traditional spraying plating solution is replaced, the plating solution is prevented from being partially oxidized into waste residues, materials are saved, and the jig is tightly pressed by the guide rail 2113 in the, the jig is prevented from shaking up and down, the stable movement of the element to be dip-plated is ensured, and the quality of the plating solution for the pins of the electronic element is improved.
Example two:
this embodiment is substantially the same as the first embodiment, except that: the conveying chain 2111 in the first embodiment is replaced by a conveying belt.
Example three:
this embodiment is substantially the same as the first embodiment, except that: as shown in fig. 1, the two sets of conveying lines 21 are disposed on two sides of the immersion plating device 1, specifically, the two sets of conveying lines 21 are respectively a first conveying line and a second conveying line, and the two sets of conveying lines 21 simultaneously provide the immersion plating device 1 with the components to be immersion plated, so that the production efficiency can be greatly improved.
In order to realize the feeding function in order of two sets of transfer chains 21, the tool on the first transfer chain is configured with first identification module, the tool on the second transfer chain is configured with second identification module, after first identification module is discerned, the tool that first identification module corresponds is carried to first transfer chain, after second identification module is discerned, the tool that second identification module corresponds is carried to first transfer chain, first identification module and second identification module are photoelectric sensor or dry reed sensor.
Specifically, at the discharge end of the production line, taking a dry reed sensor as an example, the dry reed sensor is installed on a fixture, a magnet is disposed at the end of the conveying line, the fixture can move to drive the dry reed sensor to move, when the dry reed sensor passes through the magnet, the magnetic field of the magnet can trigger the dry reed sensor to close, and then the dry reed sensor can send a signal to a controller, the controller triggers a motor on the revolving portion 22 to rotate, the output shaft of the motor rotates to drive a belt to rotate through a belt wheel, and then drives the moving platform 222 to move transversely, the moving platform 222 drives the second conveying assembly 221 to move transversely, when the fixture is in specific revolving, the second conveying assembly 221 on the revolving portion 22 is firstly butted with the third conveying assembly on the conveying portion 12, so that the fixture for the electronic component on the third conveying assembly is carried on the second conveying assembly 221, and then the moving platform 222 drives the second conveying assembly 221 to move transversely to the position of the conveying line 21, make second conveying assembly 221 and first conveying assembly 211 butt joint, operate the tool from second conveying assembly 221 to first conveying assembly 211 on to accomplish the turnover of tool, ensure the transport of tool circulation, in addition, the transport principle of two transfer chains is the same, can ensure like this that the tool advances in proper order, and the pay-off principle of immersion plating production line at feed end and discharge end is the same.
Preferably, the jig is controlled to be sequentially sent to the first conveying line and the second conveying line so as to continuously convey the components to be dip-plated to the dip-plating device 1 from two sides of the dip-plating device 1, continuous dip plating is ensured, and the dip plating efficiency of the electronic components is greatly improved.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims (11)

1. The immersion plating production line is characterized in that: the method comprises the following steps:
the immersion plating device (1) comprises a plating solution box (11) and a conveying part (12), wherein the conveying part (12) conveys a component to be plated to the plating solution box (11) for continuous immersion plating;
conveyor (2), including transfer chain (21) and turnover portion (22), the both ends of transfer chain (21) through turnover portion (22) with conveying portion (12) butt joint, wait to plate liquid component and pass through in proper order conveying chain (21) and turnover portion (22) transport extremely conveying portion (12).
2. The immersion plating production line according to claim 1, characterized in that the conveying line (21) comprises a first conveying assembly (211), the first conveying assembly (211) is used for driving a jig, and the jig carries a component to be plated.
3. The immersion plating line according to claim 2, characterized in that the turnaround portion (22) comprises a second conveyor assembly (221) and a moving platform (222), the second conveyor assembly (221) being mounted on the moving platform (222), the conveyor portion (12) comprising a third conveyor assembly, the moving platform (222) bringing the second conveyor assembly (221) into abutment with the first conveyor assembly (211) or with the third conveyor assembly.
4. The immersion plating line according to claim 3, characterized in that the first conveyor assembly (211) comprises a conveyor chain (2111) and a plurality of jaws (2112), the jaws (2112) being fixed on the conveyor chain (2111), the jaws (2112) carrying jigs.
5. The immersion plating production line according to claim 4, characterized in that the conveyor chain (2111) is replaced by a conveyor belt.
6. The immersion plating line according to claim 3 or 4, characterized in that the second conveyor assembly (221) and the third conveyor assembly have the same structure as the first conveyor assembly (211).
7. The immersion plating line according to claim 4, characterized in that the plating bath cassette (11) has a chamber containing a plating solution, the chamber being located below a conveyor (12), the conveyor (12) having at least one section of a protrusion (121), the protrusion (121) being located above the plating bath cassette (11) and protruding towards the plating bath cassette (11), there being a through gap between the plating bath cassette (11) bottom wall and the conveyor (12).
8. The immersion plating line according to claim 7, characterized in that a guide rail (2113) is arranged above the conveyor chain (2111) of the conveyor section (12), the conveyor chain (2111) moving along the guide rail (2113), and the guide rail (2113) is configured to have at least one section of protrusion, which is located above the plating bath cassette (11) and protrudes toward the plating bath cassette (11).
9. The immersion plating line according to any one of claims 1, 2, 3, 4, 5, 7, 8, characterized in that the conveyor lines (21) are two groups and arranged on both sides of the immersion plating device (1).
10. The dip plating production line according to claim 9, wherein the two sets of conveying lines (21) are a first conveying line and a second conveying line, respectively, the jig on the first conveying line is provided with a first identification module, the jig on the second conveying line is provided with a second identification module, when the first identification module is identified, the jig corresponding to the first identification module is conveyed to the first conveying line, and when the second identification module is identified, the jig corresponding to the second identification module is conveyed to the first conveying line.
11. The immersion plating production line of claim 10, wherein the first and second identification modules are photoelectric sensors or reed sensors.
CN201920462681.1U 2019-04-08 2019-04-08 Immersion plating production line Active CN210030845U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920462681.1U CN210030845U (en) 2019-04-08 2019-04-08 Immersion plating production line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920462681.1U CN210030845U (en) 2019-04-08 2019-04-08 Immersion plating production line

Publications (1)

Publication Number Publication Date
CN210030845U true CN210030845U (en) 2020-02-07

Family

ID=69358237

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920462681.1U Active CN210030845U (en) 2019-04-08 2019-04-08 Immersion plating production line

Country Status (1)

Country Link
CN (1) CN210030845U (en)

Similar Documents

Publication Publication Date Title
CN109175587B (en) DC wire welding machine
CN210030845U (en) Immersion plating production line
JPH09246785A (en) Method and device for transferring board
JP5533650B2 (en) Automatic soldering equipment
CN115070151A (en) SMT reflow soldering machine for welding PCB
JP6737527B2 (en) Surface treatment equipment
CN218135542U (en) Automatic wicking machine
CN111050488B (en) SMT automatic production system
JP3065970B2 (en) Electroplating system that enables uniform plating
CN110142478A (en) A kind of automated circuit plate welder
CN216237357U (en) Electroplating equipment
US4570569A (en) Soldering apparatus
CN210030858U (en) Immersion plating device
CN211711894U (en) Track handling device of vacuum welding furnace
CN215145457U (en) Common rail double-speed wave soldering conveying device
CN111086844A (en) Track handling device of vacuum welding furnace
CN210633068U (en) Circuit board welding device
CN219321793U (en) Automatic peeling and wire bending machine for single-core wire
CN215100438U (en) Feeding device for SMT surface mounting equipment
CN211276852U (en) Circuit board welding device
CN219093902U (en) Automatic reflow mechanism of wave soldering carrier
CN213907331U (en) Tool conveying mechanism in tool dismouting system
CN213043912U (en) Circuit board conveying mechanism of circuit board inserting machine
CN213266750U (en) Plating apparatus
CN214481512U (en) Chemical deposition metal processing line and unit carrying and transporting structure

Legal Events

Date Code Title Description
GR01 Patent grant