JP5533650B2 - Automatic soldering equipment - Google Patents

Description

  The present invention relates to an automatic soldering apparatus for performing soldering on a printed circuit board.

  In general, printed circuit boards used for household electrical appliances such as television apparatuses and playback / recording apparatuses are often single-sided boards on which electronic components are mounted on one side. A single-sided board is mounted with a discrete component having a long lead on its front surface, and the lead is inserted into a hole drilled in the printed board at a soldering portion and soldered to a land on the back side.

  In addition, since products called mobile devices such as personal computers and portable terminal devices are required to be miniaturized, both sides of mounting electronic components on both sides of a printed circuit board in order to efficiently mount electronic components. A substrate is used. The double-sided substrate is coated with a solder paste composed of solder, an organic solvent, or the like on the surface, and surface-mounted components are mounted on the application part. The solder paste is melted and soldered by heating the printed circuit board on which the surface mount components are mounted with a heat treatment apparatus such as a reflow furnace. Then, the surface-mounted components mounted on the surface of the double-sided board are temporarily fixed with an adhesive, and discrete components are mounted on the back surface of the components so that the leads protrude from the surface, and this surface is brought into contact with the molten solder. Solder parts.

  In a general automatic soldering apparatus, each processing apparatus such as a fluxer, a preheater, a jet solder bath, and a cooler is arranged in a straight line, and a chain conveyor with a large number of conveying claws is run on the processing apparatus. . Soldering of the back surface of the single-sided board or the double-sided board is performed by such an automatic soldering apparatus. The reason why each processing apparatus of the automatic soldering apparatus is arranged in a straight line is that it is performed by an in-line method in which apparatuses in each process for producing an electronic device are connected and conveyed.

  The in-line method means that a printed circuit board is automatically transferred between each dedicated device and production is continuously performed by each dedicated device. For example, in the assembly of printed circuit boards, a mounter that mounts electronic components on the printed circuit board, an automatic soldering device that solders the printed circuit board on which the electronic components are mounted, and an inspection device that inspects the printed circuit board after soldering are in a row. Are lined up. The printed circuit board is automatically transferred between these devices and produced by each dedicated device. A method produced by such a method is an in-line method.

  Therefore, the automatic soldering device used for the in-line method can easily move the printed circuit board to the preceding and following processing devices by arranging each processing device such as pre-heater, fluxer, jet solder bath and cooling machine in a straight line. There must be. The automatic soldering apparatus in which each processing apparatus is arranged in a straight line has a feature that soldering can be efficiently performed on a large amount of home appliances to be produced.

  By the way, in the era when home appliances are not produced as much as they are now, the assembly of printed circuit boards has not been done in-line. At that time, the batch system was adopted in which the work of each process was not performed on a series of lines, but a dedicated worker performed each process. In the batch method, electronic components are manually mounted on a printed circuit board by an operator, and automatic soldering equipment is used for soldering the printed circuit board after mounting electronic components. Carrying in and taking out the apparatus was manually performed by an operator. For this reason, the batch type automatic soldering apparatus is a round type automatic soldering apparatus in which the conveying device travels in an elliptical manner.

  Such a round type automatic soldering apparatus has a plate-like traveling path laid down as in Patent Documents 1 to 3, and a fluxer, a preheater, a jet solder tank, a cooler, and the like are provided below the traveling path. Each processing device is installed.

  In the round type automatic soldering apparatus, a printed circuit board is mounted on a carrier, and the carrier is run to perform soldering. The carrier has a door frame attached to a rectangular frame, and the door wheel runs on a thin plate-shaped travel path formed in a round type automatic soldering apparatus. The carrier travels by engaging one end of the carrier with an endless chain that rotates inside the travel path, and the carrier is drawn by the rotation of the endless chain so that it travels on a flat travel path. It has become.

  In this land-type automatic soldering device, an operator mounts a printed circuit board on a carrier in a work area, and the carrier is processed by each processing device by making a circle on an elliptical traveling path and soldered to the printed circuit board. Is made. Then, the operator removes the printed circuit board from the carrier returned after being soldered in the work area. In other words, the round type automatic soldering apparatus is not used at present because the operator manually mounts and removes the printed circuit board on the carrier and is not suitable for mass production.

  However, in recent years, it has been found that this round type automatic soldering apparatus is suitable for soldering special printed circuit boards, and has been reviewed. This special printed circuit board is a printed circuit board for controlling industrial equipment such as elevators and machine tools. A round type automatic soldering apparatus is suitable for a printed circuit board for industrial equipment, because the specifications change each time and mass production is not performed.

JP-A-55-139168 JP 58-81556 A JP 59-124191 A

  However, when trying to solder a recent printed circuit board for industrial equipment with a conventional automatic soldering apparatus of a loud type, many problems occur. In other words, since modern industrial equipment has become multifunctional, printed circuit boards used for industrial equipment must be very large, heavy, or special jigs must be used when soldering. The conventional round type automatic soldering device transport device, that is, a carrier to which a door pulley is attached, runs on a plate-shaped transport rail and is soldered by each processing device. It was a thing.

  One of the problems is a crack generated in the soldering portion and the peeling of the solder. This is due to the use of lead-free solder. That is, recently, Pb—Sn solder cannot be used due to Pb usage restrictions, and lead-free solder that does not use Pb must be used even in a round type automatic soldering apparatus. In the conventional round type automatic soldering apparatus, there was no problem when Pb-Sn solder was used. However, when lead-free solder is used in this automatic soldering apparatus, the solder in the soldering part is cracked, The solder is peeled off.

  Also, the conventional round type automatic soldering apparatus has a large printed circuit board and a printed circuit board with a high mounting density. There is a problem of generating.

  In the conventional round type automatic soldering apparatus, when the lead-free solder is put into the solder bath and the printed circuit board is soldered, the soldered portion is cracked or the soldered portion is As a result of diligent investigations on the causes of peeling and unsoldering on large printed circuit boards and printed circuit boards with high mounting density, the conventional round type automatic soldering device has a problem with the transport means. I understood.

  In other words, the conventional round type automatic soldering apparatus is dragged by an endless chain on which the carrier rotates, and the door wheel attached to the carrier travels on a plate-like traveling path. A rut and unevenness due to a door wheel are formed on the travel path, and the travel path becomes unsmooth, and vibration is generated during travel. Also, the chain that pulls the carrier has a shock when starting and stopping the motor that rotates the chain, and the long chain shakes and vibrates during rotation, and the shock and vibration propagate to the printed circuit board through the carrier. To do. Then, immediately after soldering in the solder bath and immediately after entering the cooler, lead-free solder with a wide solidification range is in a molten or semi-molten state, so it has not yet completely solidified due to shock or vibration. Cracks and peeling occur in the solder.

  The reason why unsolder is generated in a large printed circuit board or a printed circuit board mounted with high density is that the printed circuit boards are all conveyed at the same speed in each processing apparatus. That is, a large printed circuit board may not be sufficiently heated uniformly by preheating with a preheater after flux application. As a result, thermal segregation can occur on large printed circuit boards, and flux activity is not sufficient in low-temperature areas, and the attached molten solder does not spread rapidly due to rapid cooling. It will end up. If printed circuit boards having different mounting densities do not take sufficient time when they are brought into contact with the molten solder in the solder bath, the solder will not be sufficiently wetted and spread in the parts having a high mounting density.

  Therefore, the present inventors have found that when the printed circuit board after soldering is run, a shock is not applied by a motor that rotates the chain that pulls the carrier, or vibration caused by the chain swinging during rotation. This book focuses on the fact that cracks and delamination do not occur, and that defects such as unsoldering will not occur if the processing time on each processing device is set to a time suitable for each printed circuit board. Completed the invention.

In order to solve the above-described problems, an automatic soldering apparatus according to the present invention is a round type automatic soldering apparatus having a rectangular conveyance path , and includes a conveyance unit that conveys a printed circuit board in a predetermined direction, and a conveyance unit. the printed circuit boards that are conveyed by a soldering process unit for performing soldering processes, transport unit has a Kororeru arranged side by side a plurality of roller members for conveying the printed circuit board, redirecting the conveying unit Means and a transfer means are provided, the direction changing means is composed of a pair of roller rails orthogonal to each other, one fixed to the outside of the transport path, and the other being movable in the vertical direction inside the transport path, transfer means includes a shaft provided in parallel to the direction in which the printed circuit board proceeds, and a movable mobile along the shaft, turning means, a printed circuit board When entering, move the roller rail parallel to the transport direction of the printed circuit board to the raised position and move the roller rail perpendicular to the transport direction to the lowered position. After entering the printed circuit board, the transport direction of the printed circuit board Move the roller rail perpendicular to the position to the raised position, and move the roller rail parallel to the transfer direction to the lowered position. In the transfer means, the moving body moves along the shaft and transfers the printed circuit board when entering. It conveys in the direction orthogonal to a direction .

According to the round type automatic soldering apparatus according to the present invention, the transport unit transports the printed circuit board in a predetermined direction, and the solder processing unit performs soldering on the printed circuit board transported by the transport unit. On the premise of this, the transport unit is configured to include a roller rail in which a plurality of roller members for transporting the printed circuit board are arranged in parallel . In addition, the direction changing means provided in the transport unit is composed of a pair of roller rails that are orthogonal to each other, one is fixed to the outside of the transport path, and the other is movable up and down inside the transport path. . The delivery means includes a shaft provided in parallel with the direction in which the printed circuit board travels, and a movable body that is movable along the shaft . When the printed circuit board enters, the direction changing means moves the roller rail parallel to the transport direction of the printed circuit board to the raised position, and moves the roller rail perpendicular to the transport direction to the lowered position. After entering the printed circuit board, the roller rail perpendicular to the transport direction of the printed circuit board is moved to a raised position, and the roller rail parallel to the transport direction is moved to a lowered position. In the delivery means, the moving body moves along the shaft and conveys the printed circuit board in a direction orthogonal to the conveying direction when entering .

  Accordingly, the movement of the printed board is assisted in a state where the roller member is rotated and placed on the roller member. As a result, there is no factor that gives vibration to the printed circuit board, such as rubbing or unevenness, and it is possible to prevent the vibration of the transport unit from being transmitted to the printed circuit board.

The automatic soldering apparatus according to the present invention is a round type automatic soldering apparatus in which a carrier carrying path for holding a printed circuit board is a rectangular type, and includes a conveying unit that conveys the carrier in a predetermined direction, and a conveying unit. The printed circuit board transported and held by the carrier is provided with a solder processing section for performing a soldering process, and the transport section includes a roller rail in which a plurality of roller members for transporting the carrier are arranged in parallel. Direction changing means and delivery means are provided, and the direction changing means is composed of a pair of roller rails that are orthogonal to each other, one fixed to the outside of the conveyance path, and the other being vertically movable inside the conveyance path. is, transfer means includes a shaft provided in parallel to the direction in which the carrier is advanced, the movable moving body along the shaft, turning means When the carrier enters, the roller rail parallel to the carrier transport direction is moved to the raised position, and the roller rail perpendicular to the carrier direction is moved to the lowered position. After the carrier enters, the carrier carrier direction and it is moved, in a position raised a Kororeru perpendicular to, is moved to a position down the parallel Kororeru the conveying direction, the transfer means, the transport direction at the time of entering the carrier moving body moves along the shaft It conveys in the direction orthogonal to .

According to the round type automatic soldering apparatus according to the present invention, the transport unit transports the carrier holding the printed circuit board in a predetermined direction, and the solder processing unit is transported by the transport unit to the printed circuit board held by the carrier. Perform soldering. On the premise of this, the transport unit is configured to include a roller rail in which a plurality of roller members for transporting the carrier are arranged in parallel . In addition, the direction changing means provided in the transport unit is composed of a pair of roller rails that are orthogonal to each other, one is fixed to the outside of the transport path, and the other is movable up and down inside the transport path. . The delivery means has a shaft provided in parallel to the direction in which the carrier travels, and a moving body that can move along the shaft . When the carrier enters, the direction changing means moves the roller rail parallel to the carrier conveyance direction to the raised position, and moves the roller rail perpendicular to the carrier direction to the lowered position. After entering the carrier, the roller rail orthogonal to the carrier transport direction is moved to the raised position, and the roller rail parallel to the carrier direction is moved to the lowered position. In the delivery means, the moving body moves along the shaft and transports the carrier in a direction orthogonal to the transport direction when entering .

  Thereby, the movement of the carrier is assisted in a state where the roller member is rotated and placed on the roller member. As a result, there are no factors that cause the carrier to vibrate, such as rubbing or unevenness, and it is possible to prevent the vibration of the transport unit from being transmitted to the printed circuit board.

  The conveyance part which concerns on this invention is equipped with a roller rail, a roller claw, and a roller chain. The roller rail is provided with a plurality of roller members on a pair of plates, and the roller rail conveys a printed circuit board or a carrier.

  A plurality of roller members are provided on a pair of plates connected to the roller claws, and the roller rail moves the roller claws after bringing the printed circuit board or carrier onto the roller members of the roller claws. Then, the printed circuit board or the carrier is transported in a state of being placed on the plurality of roller members.

  The roller chain is formed by connecting a plurality of chain members, each having a predetermined width and a rotatable roller member having a diameter larger than the width of the connection plate, in an endless manner. Is carried on the roller member or with the roller member.

  The printed circuit board or the carrier is transported by placing the carrier on a roller member and a roller member provided in the transport unit. The conveyance by the roller member and the roller member is different from the door carriage conveyance in which the door wheel runs on a flat rail pulled by a conventional chain, and the vibration transmitted to the printed circuit board or the carrier is very small.

  Moreover, in the automatic soldering apparatus according to the present invention, a conveying section is provided independently on each solder processing section. This is for stopping the traveling of the carrier in each solder processing section and sufficiently performing the processing in the solder processing section. That is, the printed circuit board must have different conditions for flux application time, preheating time, contact time with molten solder, and cooling time depending on its size, weight, mounting density of electronic components, and the like. However, in the conventional round type automatic soldering apparatus, because the carrier is pulled by the chain and travels, the processing time in each processing unit is the same, and the processing in each processing unit cannot be performed sufficiently. Large printed boards and high-density mounting boards may cause poor soldering. In the present invention, the carrier can be stopped on each processing section, and a processing time suitable for the printed circuit board can be selected to complete the processing.

According to the automatic soldering apparatus according to the present invention, it is possible to prevent the vibration of the transport unit from being transmitted to the printed circuit board when the direction is changed, and thus it is possible to prevent the solder formed on the printed circuit board from being cracked or peeled off. . In addition, the transport section on each solder processing section is independent of each other, and the carrier travels on each solder processing section to perform sufficient processing, resulting in unsoldering and insufficient soldering. Therefore, it is possible to provide an automatic soldering apparatus for producing a printed circuit board with excellent reliability.

It is a top view which shows the structural example of the automatic soldering apparatus 1 which concerns on this invention. FIG. 3 is an enlarged perspective view showing a configuration example of roller chains 7, 8, 13, and 14. FIG. 3 is an enlarged perspective view showing a configuration example of a first direction changing unit 17. It is an expansion perspective view which shows the structural example of the roller claws 33 and 34.

[Configuration example of automatic soldering apparatus 1]
Hereinafter, an automatic soldering apparatus 1 according to the present invention will be described with reference to the drawings. As shown in FIG. 1, an automatic soldering apparatus 1 according to the present invention includes a solder processing unit including a fluxer 3, a preheater 4, a jet solder bath 5 and a cooler 6, a double pitch large roller chain (hereinafter referred to as a roller chain 7). , 8, 13, and 14), roller rails 18, 19, 20, 21, 27, 28, 29, 30, 43, 44, 45, 46, 50, 51, 52, and 53, and a roller claw transport unit 60. It consists of parts.

  In the automatic soldering apparatus 1, the carrier conveyance path is rectangular, and a carrier (not shown) is conveyed clockwise and processed by each processing apparatus. That is, the automatic soldering apparatus 1 of this example is a so-called round type soldering apparatus.

  A work area 2 is provided in a part of the long side of the rectangular conveying path of the automatic soldering apparatus 1 (lower part of FIG. 1). The work area 2 is provided with a fluxer 3 adjacent in the carrier transport direction. In addition, a preheater 4 is installed on a part of the short side of the conveyance path (upper left in FIG. 1), and is slightly away from the preheater 4 in the carrier conveyance direction and at the approximate center of the long side of the conveyance path (upper center in FIG. 1) A jet solder bath 5 is installed. And the cooler 6 is installed in the other part (upper right of FIG. 1) of the short side of a conveyance path.

  A pair of roller chains 7 and 8 are installed on both sides of the work area 2 in parallel with the transport direction. A stopper 9, which is an example of a stopping unit, is attached above the end of the roller chain 8 in the conveyance direction. The stopper 9 has a bar 9a. When the bar 9a protrudes on the roller chain 8, the stopper 9 comes into contact with the front part of the carrier to stop the carrier conveyance. After the stop, the bar 9a is retracted from the roller chain 8. The carrier is stopped from being separated from the front part of the carrier. Incidentally, FIG. 1 shows a state in which the bar 9a protrudes.

Incidentally, when the carrier to the position of the bar 9a of the stopper 9 is reached, to stop the rotation of the roller chain 7,8 by a control unit (not shown), may be a case where Ru is stopped traveling of the carrier. In this case, again, the driving the carrier again to start the rotation of the roller chain 7,8 by the controller. In the case of this example, description will be made assuming that the rotation of the roller chains 7 and 8 is not stopped.

  As shown in FIG. 2, the roller chains 7 and 8 are freely rotatable having an outer plate 10 and an inner plate 11, which are examples of connection plates, and a diameter larger than the height of the outer plate 10 and the inner plate 11 in the height direction. The roller 12 which is a roller member. A chain member is formed by sandwiching the roller 12 between the outer plate 10 and the inner plate 11, and the roller chains 7 and 8 are endlessly connected by using a plurality of the chain members.

  The carrier holding the printed circuit board is placed on a number of rollers 12. The carrier travels with the rotation of the roller chains 7, 8. When the bar 9 a of the stopper 9 protrudes on the roller chain 8, the carrier abuts and the traveling is stopped. At this time, the carrier stops at the position of the bar 9a of the stopper 9 because the roller 12 rotates even when the roller chains 7 and 8 are rotating. Then, when the bar 9 a of the stopper 9 is retracted from the roller chain 8, the carrier is conveyed along with the rotation of the roller chains 7 and 8.

  A pair of roller chains 13 and 14 are also installed on both sides of the fluxer 3 in the same manner as the work area 2 described above. The carriers on the roller chains 7 and 8 rotating in the work area 2 are rotated on the fluxer 3 adjacent to the work area 2 when the bar 9a of the stopper 9 is retracted. Move up. Accordingly, the roller chains 7 and 8 in the work area 2 also have a function of a delivery device.

  A stopper 15 having a bar 15a is attached above the end of the roller chain 14 in the traveling direction. The fluxer 3 is provided with a spray nozzle 16 that can move in a direction perpendicular to and parallel to the traveling direction of the printed circuit board. The fluxer 3 applies a mist-like flux with the spray nozzle 16 over the entire lower surface of the printed circuit board held by the carrier while the carrier is stopped by the bar 15 a of the stopper 15.

  A pusher 57 which is an example of a carrier delivery device is installed in the vicinity of the roller chain 13. The pusher 57 is connected to a shaft 58 installed in parallel with the traveling direction of the carrier. A plate material 59 is provided on the shaft 58 perpendicularly to the shaft 58. The pusher 57 slides the shaft 58 to move the plate material 59 as indicated by an arrow E, thereby bringing the plate material 59 into contact with the rear portion of the carrier and transporting the carrier in the traveling direction.

  While the carrier placed on the roller chains 13 and 14 is stopped by the bar 15a of the stopper 15, the flux is applied to the printed circuit board fixed to the carrier by the fluxer 3. When the bar 15a of the stopper 15 is retracted after the flux is applied, the carrier on the roller chains 13 and 14 is moved to the first direction changing portion (hereinafter referred to as the flux changer 3) adjacent to the fluxer 3 by the rotation of the roller chains 13 and 14. To the direction changer 17). However, since the carrier cannot be moved to the predetermined position of the direction changing portion 17 only by the roller chains 13 and 14, the carrier is pushed to the predetermined position by the pusher 57.

  A direction changing portion 17 is provided on a part of the short side (lower left in FIG. 1) of the rectangular traveling path adjacent to the fluxer 3, and roller rails 18, 19, 20, and 21 are provided on four sides of the direction changing portion 17. Installed. As shown in FIG. 3, the roller rails 18, 19, 20, and 21 are formed by arranging a plurality of rollers 23 that are roller members on the rail plate 22.

  The roller rails 18 and 19 parallel to the pair of roller chains 13 and 14 on the fluxer 3 are entry roller rails (hereinafter also referred to as entry roller rails 18 and 19). The rail plate 22 of the entrance roller rail 18 is fixed at a predetermined position, and the rail plate 22 of the entrance roller rail 19 is movable in the vertical direction (arrow A) with respect to the entrance roller rail 18.

  The cororails 20 and 21 orthogonal to the entrance roller rails 18 and 19 are exit roller rails (hereinafter also referred to as exit roller rails 20 and 21). The rail plate 22 of the exit roller rail 20 is fixed at a predetermined position, and the rail plate 22 of the exit roller rail 21 is movable in the vertical direction (arrow B) with respect to the exit roller rail 20.

  A pusher 24 as an example of a delivery device for moving the carrier to the next processing device is installed in the vicinity of the exiting roller rail 20. The pusher 24 is provided with a shaft 25 parallel to the exit roller rail 20 (relative to the direction in which the carrier travels). A plate member 26 perpendicular to the exit roller rail 20 is slidable on the shaft 25. Is arranged. The plate member 26 is movable in the direction of arrow C along the shaft 25 by a moving device (not shown), and moves the carrier in the direction changing portion 17 in the direction of the preheater 4 by pressing.

The same roller rails 27, 28, 29, 30 as the direction changing part 17 are also installed on the four sides of the preheater 4. The roller rails 27 and 28 in the extension lines of the exit roller rails 20 and 21 of the direction changing portion 17 are the roller rails for entering (hereinafter also referred to as the roller rails 27 and 28 for entering). The rail plate of the entrance roller rail 27 is fixed at a predetermined position, and the rail plate of the entrance roller rail 28 moves in the vertical direction with respect to the entrance roller rail 27 in the same manner as the rail plate 22 of the entrance roller rail 19. It is free. Incidentally, the exit roller rail 20 of the direction changer 17 and the entrance roller rail 27 of the preheater 4 are integrally formed in the case of this example.
Are the same.

  The roller rails 29 and 30 orthogonal to the entrance roller rails 27 and 28 are exit roller rails (hereinafter also referred to as the exit roller rails 29 and 30). The rail plate of the exit roller rail 29 is fixed at a predetermined position, and the rail plate of the exit roller rail 30 is similar to the rail plate 22 of the exit roller rail 21 of the direction changing portion 17 with respect to the exit roller rail 29. Can be moved up and down.

  A pusher 31, which is an example of a delivery device, is installed in the vicinity of the exit roller rail 29. The pusher 31 has the same structure as the pusher 24 provided in the direction changing portion 17 described above, and moves the carrier on the preheater 4 toward the jet solder tank 5.

  A plurality of halogen lamps 32 are arranged in the preheater 4. Halogen lamps emit near-infrared rays, and near-infrared rays can be heated more quickly than far-infrared rays, and thus are excellent in productivity. Further, since the halogen lamp instantaneously stops heating when the energization is stopped, even if the transport device breaks down when the printed circuit board is heated on the preheater 4, the printed circuit board is thermally damaged if the energization to the halogen lamp is stopped. There is nothing wrong. In other words, printed circuit boards used in industrial equipment are very expensive, and a large loss will occur if they are thermally damaged during soldering. However, automatic soldering equipment using halogen lamps detects pre-heaters by detecting abnormalities in the transport equipment. If energization to 4 is stopped, thermal damage to the printed circuit board does not occur.

  Above the jet solder tank 5, a roller claw transport unit 60 is installed. The roller claw transport unit 60 includes a pair of roller claws 33 and 34, a holding plate 35, suspension members 37 and 38, and an intermediate (not shown). As shown in FIG. 4, the roller claws 33 and 34 are formed by arranging a large number of rollers 36 on the holding plate 35.

  The roller claws 33 and 34 are fixed to the suspension members 37 and 38. The suspension members 37 and 38 are moved by sliding a pair of upper slide rails 39 shown in FIG. In addition, the suspension members 37 and 38 change the angle with respect to the traveling direction, and can move up and down. The roller claw transport unit 60 holds the carrier between the pair of roller claws 33, 34 after bringing the carrier onto the plurality of rollers 36 included in the roller claws 33, 34. The roller claw transport unit 60 transports the carrier in the direction of the jet solder tank 5 in a state where the carrier is placed on the plurality of rollers 36 by the intermediary. The printed circuit board conveyed to the roller claw conveying unit 60 is brought into contact with the molten solder in the jet solder bath 5.

  Various jet nozzles can be attached to the jet solder bath 5 depending on the type of printed circuit board. A primary jet nozzle 40 that jets a rough wave and a secondary jet nozzle 41 that jets gently are attached to the jet solder tank 5 shown in FIG.

  A pusher 42, which is an example of a carrier delivery device, is installed below the pair of slide rails 39 and on the exit side (right side in FIG. 1) of the jet solder bath 5. The pusher 42 moves the carrier after soldering toward the cooler 6.

  The roller rails 43, 44, 45, 46 are installed on the four sides of the cooler 6 in the same manner as the direction changing unit 17 described above. The roller rails 43 and 44 on the extension line of the pair of sliding rails 39 are entry roller rails (hereinafter also referred to as entry roller rails 43 and 44). The rail plate of the entrance roller rail 43 is fixed at a predetermined position, and the rail plate of the entrance roller rail 44 is movable up and down with respect to the entrance roller rail 43.

  The roller rails 45 and 46 orthogonal to the entrance roller rails 43 and 44 are exit roller rails (hereinafter also referred to as the exit roller rails 45 and 46). The rail plate of the exit roller rail 45 is fixed at a predetermined position, and the rail plate of the exit roller rail 46 is movable in the vertical direction with respect to the exit roller rail 45.

  A pusher 47 as an example of a delivery device is installed in the vicinity of the exit roller rail 45. This pusher 47 has the same structure as the pusher 24 provided in the above-described direction changing portion 17 and moves the carrier on the cooler 6 in a second direction changing portion (hereinafter referred to as the direction changing portion 49) described later. It is.

  A plurality of cooling fans 48 are installed in the cooler 6. By installing a plurality of cooling fans 48 in the cooler 6, the entire printed circuit board can be uniformly cooled even with a large printed circuit board. Therefore, solidification can be accelerated even with lead-free solder having a wide solidification range.

  The cooler 6 is provided with a direction changing portion 49 adjacent (lower right in FIG. 1). Roller rails 50, 51, 52, 53 are installed on the four sides of the direction changing portion 49. The roller rails 50 and 51 on the extended lines of the exit roller rails 45 and 46 of the cooler 6 are roller rails for entry (hereinafter also referred to as roller rails 50 and 51 for entry). The rail plate of the entrance roller rail 50 is fixed at a predetermined position, and the rail plate of the entrance roller rail 51 is movable in the vertical direction with respect to the entrance roller rail 50. Incidentally, the exit roller rail 45 and the entrance roller rail 50 are integrally formed in this example.

  The roller rails 52 and 53 orthogonal to the entrance roller rails 50 and 51 are exit roller rollers (hereinafter also referred to as the exit roller rails 52 and 53). The rail plate of the exit roller rail 52 is fixed at a predetermined position, and the rail plate of the exit roller rail 53 is movable in the vertical direction with respect to the exit roller rail 52.

  A pusher 54 as an example of a delivery device is installed in the vicinity of the exit roller rail 52. The pusher 54 has the same structure as the pusher 24 provided in the direction changing portion 17 described above, and moves the carrier of the direction changing portion 49 in the direction of the work area 2.

  In addition, a roller rail 55 is installed between the exit roller rail 21 provided in the direction changing portion 17 and the door roller rail 28 provided in the preheater 4. In addition, a roller rail 56 is installed between the exit roller rail 46 provided in the cooler 6 and the entrance roller rail 51 provided in the direction changing portion 49.

[Example of operation of automatic soldering apparatus 1]
Next, soldering of the printed circuit board in the automatic soldering apparatus 1 according to the present embodiment having the above structure will be described. In the following description, each operation is controlled to operate at a preset value by a control device (not shown).

  The operator holds a printed circuit board (not shown) on a carrier (not shown) and then places the carrier on the pair of roller chains 7 and 8 in the work area 2. At this time, the roller chains 7 and 8 in the work area 2 are rotating, and the bar 9 a of the stopper 9 protrudes on the roller chain 8. The carrier placed on the roller chains 7 and 8 moves to the left in FIG. 1 by the rotation of the roller chains 7 and 8, and is stopped by the bar 9 a of the stopper 9.

  When the bar 9a of the stopper 9 is retracted, the carrier is transferred onto the pair of roller chains 13 and 14 on the fluxer 3 by the rotation of the roller chains 7 and 8. At this time, the roller chains 13 and 14 on the fluxer 3 are also rotated, and the bar 15 a of the stopper 15 protrudes on the roller chain 14. Therefore, the carrier stops on the fluxer 3, and during that time, the spray nozzle 16 moves in the vertical and horizontal directions and applies the flux to the entire lower surface of the printed circuit board held by the carrier.

When the bar 15a of the stopper 15 is retracted after the application of the flux, the carrier moves to the direction changing portion 17 by the rotation of the roller chains 13 and 14, but the movement of only the roller chains 13 and 14 causes the direction changing portion 17 to move. Since it cannot be moved to a predetermined position, the pusher 57 pushes the carrier. At this time, the exit roller rail 21 is moved downward so as not to obstruct the carrier from entering the direction changing section 17. When the carrier enters the direction changing portion 17, the carrier detecting sensor (not shown) detects it and raises the exit roller rail 21 to the position of the carrier, and the pusher 24 is operated to bring the plate material 26 to the direction changing portion 17. The carrier is moved in the direction of the preheater 4. At this time, the entrance roller rail 19 of the direction changing portion 17 and the exit roller rail 30 of the preheater 4 are lowered downward so as not to hinder the movement of the carrier.

  The pre-heater 4 is provided with a carrier detection sensor (not shown). When the sensor detects that the carrier has entered the pre-heater 4, the halogen lamp 32 is energized to pre-heat the printed circuit board. This preheating time is input to the control device in advance according to the size of the printed board, the thickness of the printed board, the mounting density of electronic components, and the like. When the printed circuit board is preheated for a predetermined time, the halogen lamp 32 is de-energized. Then, the exit roller rail 30 is raised to the position of the carrier, the roller roller for entry 28 is lowered, and the pusher 31 is operated to move the carrier toward the jet solder bath 5.

  When the pusher 31 is activated to move the carrier in the direction of the jet solder bath 5, the pair of roller claws 33 and 34 on the jet solder bath 5 waits at the starting point of the slide rail 39 (left side in FIG. 1). The carrier pushed by the pusher 31 travels on the rollers 36 of the roller claws 33 and 34. A carrier detection sensor (not shown) is also installed in the jet solder bath 5. When it is detected that the carrier is positioned between the roller claws 33 and 34, the roller claws hanging members 37 and 38 move on the slide rail 39. However, the printed circuit board is brought into contact with the rough wave jetting from the primary jet nozzle 40 and the gentle molten solder jetted from the secondary jet nozzle 41 to adhere the molten solder to the soldering portion of the printed board. When the carrier further moves and reaches the pusher 42, the pusher 42 pushes the carrier toward the cooler 6.

  When the pusher 42 pushes the carrier toward the cooler 6, the exit roller rail 46 of the cooler 6 is lowered downward so as not to obstruct the entry of the carrier. A carrier detection sensor (not shown) is also installed in the cooler 6. When the sensor detects that the carrier has reached the cooler 6, the plurality of cooling fans 48 are rotated to cool the printed circuit board. Again, the cooling time is input to the control device according to the conditions of the printed circuit board, and cooling is performed for a predetermined time. When the printed circuit board is cooled for a predetermined time, the carrier is pushed by the pusher 47 and moves to the direction changing portion 49. At this time, the entrance roller rail 44 of the cooler 6 and the exit roller rail 53 of the direction changing portion 49 that hinder the movement of the carrier are lowered downward.

  When the carrier reaches the direction changing portion 49, the exit roller rail 53 is immediately raised to the position of the carrier by a carrier detection sensor (not shown), and the entrance roller rail 51 is lowered and the pusher 54 is operated to move the carrier from the direction changing portion 49. Move to work area 2. In the work area 2, the roller chains 7 and 8 are rotating, and the bar 9 a of the stopper 9 protrudes above the roller chain 8. Therefore, the carrier placed on the roller chains 7 and 8 moves to the bar 9a of the stopper 9 and stops traveling here. The worker stands by in the work area 2 and carries the carrier out of the roller chains 7 and 8. Then, the operator carries the carrier to another work table and takes out the printed circuit board soldered from the carrier. Thereafter, the operator holds a new printed circuit board on the carrier, places the carrier on the roller chains 7 and 8 in the work area 2, and performs soldering again by each processing apparatus.

  Thus, according to the automatic soldering apparatus 1 according to the present embodiment, the carrier holds the printed circuit board, the roller chains 7, 8, 13, and 14, the roller rails 18, 19, 20, 21, 27, 28, 29, 30, 43, 44, 45, 46, 50, 51, 52, 53 and a roller claw 33, 34 convey the carrier in a predetermined direction, and the fluxer 3, preheater 4, jet solder bath 5 and a solder processing unit composed of a cooler 6 and the like are soldered to a printed circuit board that is transported by the transport unit and held by the carrier. The transport unit is composed of a plurality of rollers 23 and 26 for transporting the carrier.

  As a result, the rollers 23 and 36 rotate to assist the movement of the carrier placed on the rollers 23 and 36. As a result, there are no factors that cause the carrier to vibrate, such as rubbing or unevenness, and it is possible to prevent the vibration of the transport unit from being transmitted to the printed circuit board. As a result, it is possible to prevent the solder formed on the printed circuit board from cracking or peeling.

  In addition, although the conveyance part provided with the roller demonstrated in this Embodiment demonstrated the round type automatic soldering apparatus, you may apply to an in-line type automatic soldering apparatus. As a result, even in the in-line type automatic soldering apparatus, it is possible to prevent the vibration of the conveying portion from being transmitted to the printed circuit board, and it is possible to prevent the solder formed on the printed circuit board from being cracked or peeled off.

  In the present embodiment, the roller chain is provided on the fluxer, the roller rail is provided on the preheater, the roller claw is provided on the jet solder bath, and the roller rail is provided on the cooler. However, the present invention is not limited to this. A roller rail or roller claw is provided on the fluxer, a roller chain or roller claw is provided on the preheater, a roller chain or roller rail is provided on the jet solder bath, and a roller chain or roller is provided on the cooler. Nail may be provided.

  In this embodiment, the automatic soldering apparatus that holds and transports the printed circuit board with the carrier has been described. However, the printed circuit board may be directly transported without using the carrier.

  The printed circuit board for industrial equipment was soldered by the automatic soldering apparatus according to the present invention. The printed circuit board has a maximum size of 410 × 360 × 2 (mm) and is equipped with a large number of discrete components, heat dissipating components, connectors, etc. with long leads. Fixed with tools. Therefore, the total weight of the printed circuit board, jig, and carrier is as heavy as 18 kg. Incidentally, the weight of the printed circuit board for the television apparatus is about 8 kg even if the weight of the carrier is added.

  The carrier holding the printed circuit board was placed on the roller chain in the work area, the work area stopper was removed, and the carrier was moved to the fluxer. In the fluxer, the carrier was stopped by the stopper for a maximum of 80 seconds, and during that time, the flux was applied to the lower surface of the printed circuit board by the spray nozzle.

  After applying the flux with the fluxer, the carrier was moved to the preheater through the first direction changing portion. The preheater was preheated for 90 seconds at maximum with a halogen lamp. A thermocouple was attached to the bottom surface of the printed circuit board at five locations, and the temperature at each location was measured. The temperature at each location was 100 ° C. ± 10 ° C.

  After preheating with the preheater, the carrier is gripped by a pair of roller claws of the roller claw conveyance part of the jet solder bath, and moved from the primary jet nozzle to the lower surface of the printed circuit board while moving on the jet solder bath by the slide rail. The solder was attached to the lower surface in contact with the rough wave jetting and the gentle molten solder jetting from the secondary jet nozzle. Lead-free solder of Sn-4Ag-0.9Cu (solidus temperature: 217 ° C, liquidus temperature: 229 ° C) is put into the jet solder bath, and the temperature of the molten solder is kept at 255 ° C. It was. After the solder was attached to the printed circuit board with a jet solder bath, the carrier was moved to the cooler with a pusher.

  In the cooler, cooling air was applied to the printed circuit board with a large number of cooling fans to perform cooling for a maximum of 90 seconds. Thereafter, the carrier was moved to the work area through the second direction changing portion. When the printed board was removed from the carrier returned to the work area and the soldered portion was observed, the soldered portion of the printed board was free from cracks and peeling.

  The automatic soldering apparatus of the present invention is suitable for soldering a large printed circuit board or a heavy printed circuit board, but also special soldering, for example, fixing a large number of electronic components to a jig. It can also be applied when holding it with a carrier and applying solder plating to the lead of the electronic component, or soldering to a printed circuit board on which an electronic component with a very large heat capacity is locally mounted It is.

DESCRIPTION OF SYMBOLS 1 Automatic soldering apparatus 2 Work area 3 Fluxer 4 Pre-heater 5 Jet solder tank 6 Cooling machine 7, 8, 13, 14 Double pitch large roller chain 17 1st direction change part 18, 19, 27, 28, 43, 44, 50, 51 Entering roller rail 20, 21, 29, 30, 45, 46, 52, 53 Exiting roller rail 24, 31, 42, 47, 54, 57 Pusher 49 Second turning portion

Claims (9)

It is a round type automatic soldering device with a rectangular conveying path,
A transport unit for transporting the printed circuit board in a predetermined direction;
The printed circuit board transported by the transport unit includes a solder processing unit that performs a soldering process,
The transport unit is
It has a roller rail in which a plurality of roller members for conveying the printed circuit board are arranged in parallel ,
The transport unit is provided with direction changing means and delivery means,
The direction changing means includes
It is composed of a pair of roller rails that are orthogonal to each other, one is fixed to the outside of the transport path, and the other is movable in the vertical direction inside the transport path.
The delivery means is
A shaft provided parallel to the direction in which the printed circuit board travels;
A movable body movable along the shaft,
The direction changing means includes
When the printed circuit board enters, the roller rail parallel to the transport direction of the printed circuit board is moved to a raised position, and the roller rail perpendicular to the transport direction is moved to a lowered position to enter the printed circuit board. Then, move the roller rail perpendicular to the transport direction of the printed circuit board to a raised position, and move the roller rail parallel to the transport direction to a lowered position,
In the delivery means,
The automatic soldering apparatus, wherein the moving body moves along the shaft and conveys the printed circuit board in a direction orthogonal to a conveyance direction at the time of entering . A round type automatic soldering device in which a carrier carrying path for holding a printed circuit board is rectangular,
A transport unit for transporting the carrier in a predetermined direction;
A solder processing section for performing a soldering process on the printed circuit board transported by the transport section and held by the carrier;
The transport unit is
Having a roller rail in which a plurality of roller members for conveying the carrier are arranged side by side ;
The transport unit is provided with direction changing means and delivery means,
The direction changing means includes
It is composed of a pair of roller rails that are orthogonal to each other, one is fixed to the outside of the transport path, and the other is movable in the vertical direction inside the transport path.
The delivery means is
A shaft provided parallel to the direction in which the carrier travels;
A movable body movable along the shaft,
The direction changing means includes
When the carrier enters, the roller rail parallel to the transport direction of the carrier is moved to a raised position, and the roller rail perpendicular to the transport direction is moved to a lowered position. Moving the roller rail perpendicular to the carrier transport direction to a raised position, and moving the roller rail parallel to the carrier direction to a lowered position;
In the delivery means,
The automatic soldering apparatus, wherein the moving body moves along the shaft and conveys the carrier in a direction orthogonal to a conveying direction at the time of entering . The transport unit is
A roller claw provided with a plurality of roller members on a pair of connected plates;
A moving means for moving the roller claw,
After the printed circuit board or the carrier is brought onto the plurality of roller members of the roller claw, the printed circuit board or the carrier is transported in a state of being placed on the plurality of roller members by the moving means. The automatic soldering apparatus according to claim 1 or 2, wherein The transport unit is
A roller chain formed by connecting endlessly a plurality of chain members formed by sandwiching a rotatable roller member having a diameter larger than the width of the connecting plate on a connecting plate having a predetermined width;
The roller chain is
3. The automatic soldering apparatus according to claim 1, wherein the printed circuit board or the carrier is conveyed on the roller member in a state of being placed on the roller member. 4. Stop means is provided in the vicinity of the transport unit,
The stopping means is
Abutting on the printed circuit board or the carrier conveyed by the conveying unit, the conveyance of the printed circuit board or the carrier is stopped, and after the stop, the printed circuit board or the carrier is separated from the printed circuit board or the carrier. 3. The automatic soldering apparatus according to claim 1, wherein the stop of the carrier conveyance is released. The solder processing part is provided with a fluxer,
On the fluxer, at least a roller rail in which a plurality of roller members for conveying the printed circuit board or the carrier are arranged side by side, a roller claw in which a plurality of roller members are provided on a pair of connected plates , and a predetermined Any one of the roller chains formed by connecting a plurality of chain members endlessly with a rotatable roller member having a diameter larger than the width of the connecting plate to the connecting plate having a width of
The fluxer is
The automatic soldering apparatus according to claim 1 or 2 , wherein a flux is applied to the printed circuit board conveyed by the roller rail, the roller chain, or the roller claw. The solder processing part is provided with a preheater,
On the pre-heater, at least a roller rail in which a plurality of roller members for conveying the printed circuit board or the carrier are arranged side by side, a roller claw in which a plurality of roller members are provided on a pair of connected plates , and a predetermined Any one of the roller chains formed by connecting a plurality of chain members endlessly with a rotatable roller member having a diameter larger than the width of the connecting plate to the connecting plate having a width of
The preheater is
The Kororeru, automatic soldering apparatus according to claim 1 or 2, characterized in that heating said printed circuit board conveyed by the roller chain or the roller pawl. The solder processing section is provided with a jet solder bath,
On the jet solder bath, at least a roller rail in which a plurality of roller members for conveying the printed circuit board or the carrier are arranged in parallel, a roller claw in which the roller members are provided on a pair of connected plates , and One of roller chains in which a plurality of chain members formed by sandwiching a rotatable roller member having a diameter larger than the width of the connecting plate is endlessly connected to a connecting plate having a predetermined width is provided. And
The jet solder bath is
The Kororeru, automatic soldering apparatus according to claim 1 or 2, characterized in that to form the solder on the printed circuit boards that are conveyed by the roller chain or the roller pawl. The solder processing unit is provided with a cooler,
Wherein on cooling machine, at least, the printed circuit board or a plurality of roller members were arranged Kororeru, connecting a plurality of the roller pawl roller member is provided on the pair of plates were used for transporting the carrier and, One of the roller chains formed by endlessly connecting a plurality of chain members each having a rotatable roller member having a diameter larger than the width of the connecting plate to a connecting plate having a predetermined width is provided. ,
The cooler is
The Kororeru, automatic soldering apparatus according to claim 1 or 2, characterized in that cooling the printed circuit board and the carrier that has been conveyed by the roller chain or the roller pawl.

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