WO2006118138A1

WO2006118138A1 - Multifunction soldering apparatus for printed board and soldering method

Info

Publication number: WO2006118138A1
Application number: PCT/JP2006/308715
Authority: WO
Inventors: Akira Takaguchi
Original assignee: Senju System Technology Co., Ltd.
Priority date: 2005-04-27
Filing date: 2006-04-26
Publication date: 2006-11-09
Also published as: JPWO2006118138A1

Abstract

In the conventional soldering by a cell method, jet solder baths are required to be replaced and transfer conditions are required to be changed each time when the types of a printed board and an electronic component are changed. It is extremely dangerous when a molten solder spills out at the time of replacing the jet solder baths. In a multifunction soldering apparatus, a jet nozzle suitable for each soldering method is arranged on the jet solder bath which has jet ports at two parts, and the transfer conditions can be changed as needed.

Description

Specification

Multifunctional soldering apparatus and soldering method for printed circuit board

[0001] The present invention relates to a multi-function soldering apparatus capable of soldering various types of printed circuit boards with a single apparatus and a method for soldering various types of printed circuit boards with a multi-function type soldering apparatus.

Background art

[0002] A printed circuit board is incorporated in an electronic device, and there are various types of printed circuit boards depending on the electronic device. The types of printed circuit boards include single-sided wiring boards, double-sided wiring boards, and multilayer boards. Single-sided boards are used in household appliances such as televisions and stereos. Double-sided wiring boards are used in video cameras, facsimiles, etc. Used in personal computers, NC equipment, communication devices, etc. The electronic components mounted on these printed boards are made conductive by joining the leads of the electronic parts to the lands of the printed board with solder.

[0003] Generally, discrete components having a short linear lead are used in home appliances. In order to solder the discrete components to a printed circuit board, a plurality of primary jet nozzles and secondary jet nozzles are used. Soldering is performed with an automatic soldering device (hereinafter referred to as “double jet soldering device!”) Equipped with a jet solder bath (hereinafter referred to as “double jet solder bath”) having a jet nozzle. In this double jet soldering apparatus, processing devices such as a fluxer, a pre-heater, a double jet solder bath, and a cooler are installed, and a conveying device is installed on these processing devices. Soldering of printed circuit boards with a double jet soldering device is performed by flux application with a fluxer while carrying the printed circuit board with a transport device, preheating with a preheater, adhesion of solder with a double jet solder bath, and cooling with a cooler. Done by doing. (Patent Literature 1)

In the double jet solder bath installed in the double jet soldering device, a primary jet nozzle and a secondary jet nozzle are arranged, and molten solder is jetted from the primary jet nozzle in a rough state, and the secondary jet Molten solder is jetted from the nozzle in a gentle state. One On the printed circuit board, molten solder does not easily penetrate into the corners of through-holes and surface-mounted components, so the molten solder does not easily penetrate with the rough molten solder jetted from the primary jet nozzle. Invade. When soldering is performed with the molten solder in a rough state while applying pressure, a looser is formed at the tip of the lead of the discrete part, or a bridge is formed in which the solder straddles between adjacent soldered parts. It will be. Therefore, these llaras and bridges are corrected with a molten solder in a gentle state in which the secondary jet nozzle force also jets.

[0004] In the double jet soldering apparatus, the printed circuit board is soldered by bringing the primary jet nozzle and the secondary jet nozzle into contact with the molten solder that is also jetted in sequence, and if the printed board is transported horizontally at this time The amount of solder adhering to the soldering part becomes too large and a bridge is formed. If the printed circuit board is tilted with respect to the direction of travel of the printed circuit board, that is, inclined so that the secondary jet nozzle side is higher than the primary jet nozzle side, the amount of solder attached decreases, and 3 ~ Appropriate amount of adhesion with 5 degree inclination.

[0005] The height of the jet from the primary jet nozzle and the secondary jet nozzle is about 10 mm, and this height is the distance between the printed circuit board and the upper part of the jet nozzle. Therefore, if the lead length of a discrete component mounted on the printed circuit board is 10 mm or more, the lead hits the upper part of the jet nozzle, but generally the lead of the discrete component mounted on the printed circuit board of the home appliance is 10 mm or less. Yes, the lead does not hit the jet nozzle.

However, in special electronic equipment such as broadcasting equipment and system equipment, dedicated discrete parts that are not used for general electronic equipment are used. This dedicated discrete component has long leads so that it can be mounted on any printed circuit board. Therefore, when a printed circuit board on which this long lead discrete component is mounted is soldered with a double jet soldering device, the lead hits the jet nozzle and the lead is bent, or when the lead lifts up, the discrete component becomes the surface of the printed circuit board. The power also falls off. Therefore, for printed circuit boards with discrete components with long leads, soldering is performed using a soldering device (hereinafter referred to as surface flow soldering device! /, U) equipped with a surface flow solder bath.

[0007] The surface flow solder bath installed in the surface flow soldering device is printed in the solder bath. A surface flow nozzle having an area larger than that of the substrate is arranged, and from the surface flow nozzle, the molten solder is swelled flat and overflows from the periphery of the surface flow nozzle. Since the surface flow nozzle has a deep bottom, the above double jet solder prevents the lead from hitting the bottom of the surface flow nozzle even if the printed circuit board with discrete components with long leads is in contact with the molten solder in the surface flow nozzle. It does not cause problems as in the attaching device. Surface flow soldering equipment is also equipped with processing equipment such as fluxers, pre-heaters, surface flow solder baths, cooling machines, etc., as well as the above-mentioned double jet soldering equipment, and a conveyor is installed on these processing equipment. ing. (Patent Document 2) As with the double jet soldering device, soldering of the printed circuit board with the surface flow soldering device applies flux with a fluxer, preheats with a preheater, adheres solder with a surface flow solder bath, cooler This is done by performing cooling. Soldering in a surface flow solder bath is different from soldering in a double jet solder bath in a double jet soldering machine. In other words, in the double-jet solder bath, the solder is adhered by sequentially contacting the molten solder jetted from the primary jet nozzle and the secondary jet nozzle while running the printed circuit board with the transfer device. The board is moved to the surface flow solder bath by the transfer device, and then the movement is stopped. Then, the printed board is lowered to the molten solder liquid surface of the surface flow nozzle and brought into contact with the molten solder. After that, when the printed circuit board is melted, the first end of the printed circuit board is tilted upward to release the molten solder force, and then the other end of the printed circuit board is released with the molten solder force. In this way, if the printed circuit board is tilted and the molten solder force is withdrawn, defects such as llara and bridge do not occur. Some printed circuit boards cannot be soldered with a double jet soldering device or a surface flow soldering device. For example, printed circuit boards with components such as connectors and LEDs. When a printed circuit board on which these components are mounted is soldered with a double jet soldering device or a surface flow soldering device, the molten solder comes into contact with the entire back surface of the printed circuit board. The function as a connector will be impaired, and in heat-sensitive LEDs, molten solder will adhere to the body and cause thermal damage. Therefore, molten solder should not adhere to the entire surface of the printed circuit board. For soldering of the printed circuit board, a partial soldering device that selectively solders only the soldered part is used. Is called.

[0009] The partial soldering device is composed of a processing device such as a fluxer having a hole nozzle at a position coincident with a soldering portion of a printed circuit board, a preheater, a partial jet solder bath, a cooler, and the like. In addition, a transfer device is installed on these processing devices. (Patent Document 3) The partial jet solder bath installed in the partial soldering equipment is the same as the soldering part of the printed circuit board.

A partial jet nozzle with a narrow area protruding on the roller is installed.

[0010] Soldering of a printed circuit board with a partial soldering apparatus is carried by holding the printed circuit board with a conveying apparatus. Then, the printed circuit board is stopped on the fluxer, the force fluxer is raised, and the fluxer hole comes into contact with the soldered portion of the printed circuit board to apply the mist flux. The printed circuit board then stops on the preheater, where the preheater also rises and preheats the soldered area. Furthermore, the printed circuit board is moved onto the partial solder bath, stopped here, and the board holding part of the transfer device descends to the partial solder bath to bring the soldering part into contact with the partial jet nozzle, and then from the partial jet nozzle. The molten solder is jetted to attach the solder only to the soldering part. The printed circuit board is then moved onto the cooler for cooling.

[0011] By the way, soldering of surface mount components with leads installed on the side of the main body, such as QFP and SOP, is performed by a reflow method using solder paste. In the reflow method, solder paste is applied to the soldering part of the printed circuit board, the lead of the surface mount component is placed on the application part, and then heated in a reflow oven to melt the solder paste. Is to do. However, if a surface-mounted component and a discrete component are mounted together on a single-sided wiring board, the surface-mounted component is also soldered by the flow method in the case of a so-called “mixed board”. In a mixed substrate, discrete components are inserted with leads into the holes on the surface of the printed circuit board, and surface mount components are bonded to the main body with an adhesive so that the leads are in contact with the lands on the back surface of the printed circuit board. Thereafter, the printed circuit board is soldered by a double jet nozzle soldering apparatus.

[0012] With a force, when mounting a surface mount component with leads installed on the four sides of the main body parallel to the direction of travel of the printed circuit board, such as QFP, and soldering, The lead in the parallel position can be soldered without problems, but the lead on the back side in the direction of travel of the printed circuit board is perpendicular to the direction of travel of the printed circuit board. The molten solder that does not come into contact with the rear leads may become unsoldered.

[0013] As a means to prevent the occurrence of unsolder in QFP, soldering is performed by tilting the printed circuit board with respect to the direction of travel, for example, tilting approximately 45 degrees with respect to the direction of travel. There is a method: Patent Document 4). In this inclined conveying soldering method, all QFP leads come into contact with the jet nozzle at an angle of 45 degrees, so there is no shadowed part of the main body, and as a result, no solder is generated.

[0014] Recently, in the manufacturing industry of each field, the cell method has been adopted instead of the conveyor production method. In this cell method, one worker is responsible for multi-process production, and productivity and reliability may be improved as compared to the conveyor production method as the worker becomes more proficient. Therefore, the cell method is also being adopted in the electronic equipment industry. In the cell method in the soldering process at an electronic equipment manufacturer, for example, the surface mount component was reflow soldered to the printed circuit board in the previous process, and the next process worker was able to perform soldering with a lead-free electronic component. There is a force S that can be soldered by the flow method. In other words, the work steps here are a step of inserting electronic component leads into the printed circuit board after reflow, and a step of soldering the printed circuit board. First, the operator inserts an electronic component into the printed circuit board, applies flux to the soldered portion of the printed circuit board, and then performs soldering with a soldering apparatus. At this time, printed circuit boards are often in a wide variety and electronic parts are also in a wide variety. Electronic components can be ordinary short lead discrete components, long lead discrete components longer than 10mm, surface mount components, and even components such as connectors and LEDs.

[0015] Conventionally, when soldering a printed circuit board using the cell method, a dedicated soldering device suitable for soldering the printed circuit board and electronic components is used, and soldering is performed each time the printed circuit board and electronic components change. The device was also changed. For example, when soldering a printed circuit board with discrete components with ordinary short leads, double jet When soldering with a soldering device and then soldering a printed circuit board with discrete components with long leads, move the double-jet soldering device used previously to the cell-type field force. Replace with surface flow soldering equipment. When soldering a printed circuit board with a connector or LED, move the surface-floor soldering device and replace it with a partial soldering device. Furthermore, when soldering a printed circuit board on which surface-mounted components are mixedly mounted, it is replaced with an inclined conveyance soldering device.

Patent Document 1: Japanese Patent Laid-Open No. 57-139993

Patent Document 2: JP-A-53-102245

Patent Document 3: Japanese Patent Laid-Open No. 2003-188517

Patent Document 4: Japanese Patent Application Laid-Open No. 55-45567

Disclosure of the invention

Problems to be solved by the invention

As described above, in the conventional cell-type soldering, every time the type of printed circuit board or electronic component changes, the soldering equipment must be replaced at the cell-type site. For this purpose, various soldering devices were placed near the cell system! However, the molten solder is contained in the jet soldering bath of the soldering device, and if you try to replace the soldering device during work, the molten solder in the jet soldering bath will wave due to shaking during the movement of the soldering device. The jet solder bath force will spill out. Since the molten solder in the jet solder bath is at a high temperature of 200 ° C or higher, if the jet solder bath force spills out, it will cause severe burns if it hits the operator by burning the floor of the workplace and the soldering device wiring. It will be a very dangerous situation to carry. Therefore, when the soldering device is moved, the molten solder in the jet solder bath should be completely solidified and moved by force, but a large amount of molten solder is put in the jet solder bath, and it takes a lot of time to solidify. Since time is spent, there is a problem that work stops during that time. Therefore, the cell method in the conventional soldering process requires a place for preparing a plurality of soldering apparatuses. In addition, when replacing these soldering devices, there is a problem that productivity will deteriorate if an attempt is made to avoid the danger caused by force if danger is involved. Arise. An object of the present invention is to provide a multifunctional soldering apparatus capable of soldering various printed circuit boards and electronic components with a single soldering apparatus, and a soldering method therefor.

Means for solving the problem

[0017] The inventor of the present invention uses a solder bath for jetting molten solder in any of the double jet soldering device, the surface flow soldering device, and the partial soldering device. The present invention pays attention to the fact that it can be applied to substrates and electronic components, and the force is heavy if the conveying state is matched to the soldering method, so that it is unnecessary to move a soldering device that is dangerous when moving. Was completed.

[0018] The present invention includes at least one molten solder jet port, and various jet nozzles can be installed in the jet port.

A printed circuit board transfer device provided on the solder bath; and

Printed circuit board holding device supported by the transfer device

The printed circuit board holding device includes: a sliding portion installed on the transport device so as to be slidable in the transport direction of the printed circuit board; a suspension portion suspended on the sliding portion so as to be movable up and down; A rotating part attached to the mounting part with a variable angle with respect to the direction of travel of the printed circuit board; a holding part of the printed circuit board attached to the rotating part with a variable angle with respect to the horizontal direction; A multifunctional soldering apparatus comprising a set of attached printed circuit board holding pieces.

[0019] In a preferred aspect of the present invention, the transfer device is bridged on the solder bath, and one end is rotatably attached, and the other end is attached to be movable up and down. The driving means force of the sliding part attached to the rail and the sliding rail is configured.

[0020] Further, the present invention provides various jet nozzles suitable for soldering a printed circuit board at the jet port of the jet solder bath, and changes the state of conveyance of the printed circuit board according to the soldering method of each printed circuit board. This is a method for soldering a printed circuit board.

Brief Description of Drawings FIG. 1 is a partial cross-sectional front view of a multifunctional soldering apparatus according to the present invention.

2 is a cross-sectional view taken along line XX in FIG.

FIG. 3 is a plan view of a multifunctional soldering apparatus according to the present invention.

FIG. 4 is a front sectional view of a double jet solder bath according to the present invention used for double jet soldering.

FIG. 5 is a front cross-sectional view of a surface flow solder bath that is used for surface flow soldering and that is effective in the present invention.

FIG. 6 is a front sectional view of a partial jet solder bath according to the present invention used for partial jet soldering.

FIG. 7 is a plan view for explaining inclined conveyance soldering according to the present invention for soldering a mixed substrate.

BEST MODE FOR CARRYING OUT THE INVENTION

[0022] When the multifunctional soldering device of the present invention is used as a double jet soldering device, a primary jet nozzle that performs a rough jet is attached to one of the two jet ports of the jet solder bath, and the other Attach a secondary jet nozzle that produces a gentle jet at the jet port.

[0023] When the multifunctional soldering device of the present invention is used as a surface flow soldering device, a surface flow nozzle is attached to one jet port of the jet solder bath, and nothing is attached to the other jet port. Absent. When soldering with this surface flow soldering device, drive only the motor of the jet nozzle with the surface flow nozzle attached, and install the other, and do not drive the motor of the jet port .

[0024] Furthermore, when the multifunctional soldering device of the present invention is used as a partial soldering device, a partial jet nozzle is attached to one jet port as in the surface flow soldering device, and the other jet flow is used. Do not attach anything to the mouth as with surface flow soldering equipment

[0025] In the soldering method of the present invention, a jet nozzle suitable for various soldering methods is attached to the jet port, and the conveyance state of the printed circuit board is changed in accordance with the soldering method. For example, when soldering a printed circuit board on which discrete components are mounted, a primary jet nozzle and a secondary jet nozzle are installed at two jet openings of the jet solder bath. Installed into a double jet solder bath, the jet of the primary jet nozzle is slightly lower than the jet of the secondary jet nozzle with respect to the direction of travel of the printed circuit board, and the printed circuit board is connected to the primary jet nozzle and the secondary jet nozzle. The transport device is tilted with respect to the direction of travel of the printed circuit board so that it can contact the jet.

[0026] Also, when soldering a printed circuit board with discrete components with long leads, a surface flow nozzle is attached to the jet port of the jet solder bath to form a surface flow solder bath, and the transfer device is placed in a horizontal state. Transport. In the surface flow soldering equipment, the transport is stopped on the surface flow solder bath, the printed circuit board is lowered vertically, and immersed in molten solder with a wide surface flow nozzle. Then, raise one side of the printed circuit board and then raise the other side, and the surface flow solder bath is also withdrawn.

[0027] Furthermore, when soldering a mixed substrate on which surface mount components and discrete components are mounted, a primary jet nozzle and a secondary jet nozzle are attached to the jet solder bath in the same manner as the multi-nozzle soldering. Make a tank. The conveying device is inclined by conveying the printed circuit board at an angle of about 45 degrees with respect to the horizontal direction, with an inclination such that the primary jet nozzle side is low and the secondary jet nozzle side is high.

[0028] And, when soldering a printed circuit board on which components are mounted, solder must not be attached like connectors and LEDs, and a partial jet nozzle is attached to the jet nozzle of the jet nozzle. A jet solder bath is used, and the transport is stopped with the soldering part of the printed circuit board and the partial nozzle aligned on the partial jet solder bath, and the printed circuit board is lowered.

[0029] Hereinafter, the multifunctional soldering apparatus of the present invention will be described with reference to the drawings. Fig. 1 is a partial cross-sectional front view of the multifunctional soldering apparatus, Fig. 2 is a cross-sectional view taken along the line XX of Fig. 1, and Fig. 3 is a plan view thereof.

As shown in FIGS. 1 to 3, the multifunctional soldering apparatus shown in the embodiment is composed of a main body preheater 2, a solder bath 3, a cooler 4, a transfer device 5, and a substrate holding device 6. All of these devices installed in the body are computer controlled. “Solder bath 3” is also referred to as “jet solder bath” in the following because it contains molten solder and is used by jetting molten solder when used. [0030] Computer control means that, for example, a pre-heater can be heated appropriately for the size and thickness of a printed circuit board. In a jet solder bath, the temperature of the molten solder jetted from a jet nozzle is of course not only controlled. The cooler can manage the wind speed, the transport device can control the transport speed, stop position, stop time, and transport angle, and the substrate holding device can control the print substrate lowering position and the horizontal tilt angle. It has become possible to control.

[0031] The main body 1 has a frame structure. If the pre-heater 2, the solder bath 3, the cooler 4, the transfer device 5 and the substrate holding device 6 described above can be arranged at predetermined positions, the entire body 1 is covered with a cover if necessary. Let's be able to adjust the atmosphere in the device.

[0032] As can be seen from FIG. 1, a pair of support columns 7 and 7 are erected on one side of the main body 1, and a beam 8 is bridged between the support columns. The support pieces 9, 9 are fixed. A vertical movement device 10 is installed on the other side of the main body. The vertical movement device 10 is composed of a gear storage 11, a vertical movement gear 12, a drive gear 13, a motor 14, and a ball screw 15. A vertically moving gear 12 is immovably stored in the gear storing portion 11 so as not to move. The vertically moving gear 1 is interlocked with a drive gear 13 attached to a motor 14. A female screw 16 is screwed at the center of the vertical movement gear 12, and a ball screw 15 is screwed into the female screw. Therefore, when the motor 14 is driven, the vertical movement gear 12 linked with the drive gear 13 rotates, and the ball screw 15 screwed into the vertical movement gear 1 moves up and down as indicated by arrow A. /! A vertical moving table 17 is fixed to the upper part of the ball screw 15, and a pair of support pieces 18, 18 are fixed to the vertical moving table. Further, the support pieces 18 and 18 are provided with a horizontally long slot 19, which is supported by the support piece 18 by the vertical movement of the vertical movement table 17, and the lateral movement of the rotation piece described later is performed. To make it smooth.

In the main body 1, a preheater 2 is installed adjacent to the vertical movement device 10. In the preheater 2, a number of halogen heaters 20 are arranged in parallel. Halogen heaters emit near-infrared rays, and near-infrared rays can quickly heat non-heated materials, so that when a printed substrate is preheated, it can be done in a short time and productivity is improved.

Further, in the main body 1, a jet solder bath 3 is installed adjacent to the preheater 2, and molten solder 21 is placed inside. The jet solder bath installed in the multifunctional soldering apparatus of the present invention has two jet openings (not shown in FIGS. 1 to 3). is there. Various nozzles can be attached to the jet port. The jet soldering tank shown in Figs. 1 to 3 is a double-jet solder tank for soldering printed circuit boards and mixed boards on which short lead discrete components are mounted. A primary jet nozzle 22 for attaching a jet is attached, and a secondary jet nozzle 23 for attaching a gentle jet is attached to an outlet far from the pre-heater 2. Also, motors 24 and 25 are attached to the upper part of the jet soldering bath 3, and these motors cause two solder jets to flow out the molten solder by rotating a pump (not shown)! / ヽThe

[0035] A cooler 4 is installed between the pair of support columns 7 and 7 below the passage position of the printed circuit board conveyed by the conveyance device 5 described later. The cooler 4 has a sirocco fan with a large number of blades housed in a cylindrical body. The upper part of the cylindrical body is an opening, and the open loca also blows cold air upward.

[0036] The transport device 5 is composed of a pair of slide rails 26, 26 and a belt 27 as drive means. Rotating pieces 28 and 29 are fixed to both ends of the slide rail 26. One rotating piece 28 is rotatably attached to a bearing piece 9 fixed to the beam 8 by a shaft 30 and is attached to a shaft 30. It is attached so that it can pivot in the vertical direction around the center. The other rotary piece 29 is rotatably attached to a support piece 18 fixed to the vertical movement base 17 of the vertical movement mechanism 10 by a shaft 30. As described above, the shaft 30 of the support piece 18 can move in the slot 19 of the support piece. Both ends of the belt 27 are fixed to the upper side of the sliding portion 34 of the substrate holding device 6 and are stretched by pulleys 31 and 32 attached to the beam 8 and the vertical movement table 17. One pulley 31 is associated with a motor 33. When the motor is driven, the pulley 31 rotates and moves the belt 27 as shown by an arrow B. Even if the belt 27 is a wire or a chain, it can be displaced as long as it has a drive function.

[0037] The substrate holding device 6 includes a sliding portion 34, a suspending portion 35, a rotating portion 36, a holding portion 37, a pair of holding pieces 38, and 38 forces.

The pair of sliding rails 26 and 26 are slidably inserted in the sliding portion 34 laterally, and both ends of the belt 27 are fixed to the upper portion. Therefore, as the belt 27 moves, the sliding portion 34 moves as indicated by arrow B! /. The sliding part 34 has a pair of hanging rods 39 and 39 are slidably inserted vertically, and a suspension plate 40 is fixed to the upper end of the suspension rod. A motor 41 is disposed at the upper center of the suspension plate 40, and a ball screw 42 is attached to the motor shaft. The ball screw 41 is a female screw vertically installed at the center of the sliding portion. Screwed into screw 43. A hanging portion 35 is fixed to the lower ends of the pair of hanging rods 39 and 39. A rotating part 36 is attached to the rear surface of the hanging part 35 via a disc 44 so as to be rotatable in the horizontal direction. A motor 45 is installed on one upper side of the rotating portion 36 so as to be movable up and down, and a ball screw 46 is attached to the shaft of the motor. The ball screw 46 is screwed into a female screw 47 formed in the motor mounting portion, and the tip thereof is in contact with one end of the holding portion 37. The holding part 37 is attached to the rotating part 36 and the rotating part at a position slightly in the middle of the end opposite to the side in contact with the ball screw 46, and is located outside the attaching part. There is a compression panel 48. Therefore, when the motor 45 installed in the rotating part 36 is driven to move the ball screw 46 up and down in the female screw 47, the holding part 37 moves up and down as indicated by the arrow against the compression panel 48. The tilt angle is variable with respect to the rotating part 36. The holding portion 37 has flanges 49 and 49 formed at both ends. A sliding bar 50 is installed between the flanges 49 and 49, and a pair of holding pieces 38 and 38 are attached to the sliding bar. ing. The printed circuit board 51 is held between the holding pieces 38 and 38. One holding piece is slidable on the sliding bar 50, and moves as shown by the arrow D, so that it is securely held in accordance with the size of the printed circuit board. Also, one end of the sliding bar 50 is slightly longer below the holding piece 38 and a squeegee 52 is attached!

[0038] A substrate insertion base 53 is attached to one side of the main body 1, that is, the beam 8 side, and a pair of substrate transfer plates 54 and 55 are provided upright on the substrate insertion base 53. The printed circuit board is held between the board transfer plates 54 and 55, and is transferred between the holding pieces 38 and 38 of the transport device 6 by a pusher (not shown). One board transfer board 54 has a variable width as indicated by an arrow E along the groove 56 in accordance with the size of the printed board.

[0039] Next, a method for soldering various printed circuit boards in the multifunctional soldering apparatus having the above-described structure will be described. Figures 4 to 5 are front sectional views of various jet solder baths suitable for various printed circuit board soldering methods. Fig. 4 is a double jet solder bath and Fig. 5 is a surface flow. One solder bath, Fig. 6 shows a partial jet solder bath. FIG. 7 is a plan view of FIG. 4 for explaining the inclined conveyance for soldering the mixed substrate. In the illustrated example, the jet solder bath 3 is provided with jet ports 57 and 58 at two locations. Depending on the nozzle shape attached to this, the number of jets may be one or two or more. In the present specification, the present invention will be described by taking as an example a case where two jet ports are provided.

[0040] The jet ports 57, 58 and the jet nozzles 22, 23, 59, 61 are attached by overlapping the jet port flange and the jet nozzle flange and sealing them. The mounting state is as follows. Insert holes inserted into the flanges on both sides of the jet nozzle into bolts (not shown) standing on the flanges on both sides of the jet port, and insert nuts (not shown) into the bolts. Screwed in and tightened.

[0041] The specific embodiment will be described by taking the case of FIGS. 4 to 6 as an example. When replacing the jet nozzle with another jet nozzle, the motors 24 and 25 shown in FIG. Stop moving. At this time, the mounting portion of the jet port and the jet nozzle, that is, the nut that fastens the flange of the jet port and the flange of the nozzle is located below the liquid level of the molten solder. Therefore, the box wrench that can be engaged with the nut is also put in the molten solder with the upward force, the box wrench is engaged with the nut, the box wrench is used to loosen the nut and remove it from the bolt. Then, lift the nozzle upward to remove the nozzle from the bolt, and then install another nozzle at the spout. This installation is done by inserting the holes drilled in the nozzle flange into bolts standing upright at the jet port, overlapping each flange, and inserting the nut into the bolt and tightening as described above.

Here, a method of soldering a printed circuit board on which a short discrete component is mounted in a double jet solder bath will be described with reference to FIG. In this soldering, the printed circuit board is tilted with respect to the horizontal, and soldering is performed by sequentially contacting the rough molten solder jetted from the primary jet nozzle 22 and the gentle molten solder jetted from the secondary jet nozzle 23. This is a double jet soldering method. A primary jet nozzle 22 that allows rough jets is attached to one jet port 57 of the jet solder bath 3, and a secondary jet nozzle 23 that allows gentle jets to be attached to the other jet port 58. The operator can contact the molten solder jetted from the secondary jet nozzle 22 and the secondary jet nozzle 23 with the printed circuit board held by the holding pieces 38, 38. Determine the transport angle of the transport device 5 and store it in the computer. At this time, the holding device 6 is in a horizontal state and stands by near the board insertion base 53.

[0043] The worker is not shown in the vicinity of the worker! The flux is applied to the entire back surface of the printed board with a fluxer, and the printed board on which the flux is applied is transferred to a pair of boards on the board insertion table 53. Place on boards 54 and 55. Then, the printed circuit board is pushed by a pusher (not shown) and transferred between the pair of holding pieces 38, 38 of the holding device 6. After that, the transport device 5 is moved to the top of the pre-heater 2 in a horizontal state, and the vertical movement device 10 is driven so that one end of the transport device 5 is lowered to the transport angle stored in the computer in advance. Then, the motor 41 of the holding device 6 is driven to bring the printed circuit board held by the holding pieces 38, 38 closer to the preheater 2. After heating the printed circuit board with the pre-heater 2 for a certain period of time, the motor 33 linked to the pulley 31 of the belt 27 is driven to move the belt 27, whereby the holding part 6 to which the belt is fixed is double-jetted. Soldering is performed by moving the solder substrate 3 in the three directions and sequentially bringing the printed circuit board 51 into contact with the molten solder jetted from the primary jet nozzle 22 and the secondary jet nozzle 23. The printed circuit board that has exited from the secondary jet nozzle 23 passes through the cooler 4 to be cooled, and the operator receives the cooled printed circuit board, and the soldering operation in the cell method is completed.

[0044] Next, a method for soldering a printed circuit board on which discrete components are mounted in a surface flow solder bath will be described with reference to FIG. In this soldering method, the printed circuit board is lowered to a surface flow nozzle that overflows over a large area and is soldered while being kept in a horizontal state. One jet port 58 of the jet solder bath 3 is provided with a surface flow nozzle 59 that performs a gently rising jet in a large area, and nothing is installed in the other jet port 57. Then, only the motor 25 for jetting is driven. As with the double jet soldering, the transfer device 5 is kept waiting near the substrate insertion table 53, and the stop position of the transfer device 5 and the lowered position of the holding device 6 are stored in a computer.

After applying the flux to the printed board with a fluxer (not shown), the operator transfers the printed board from the board insertion base 53 to the holding pieces 38 and 38 of the holding device 6. After that, the holding device 6 is moved to the top of the pre-heater 2 while being kept in a horizontal state, where it is lowered to the vicinity of the pre-heater 2 and preheating is performed. Pre-heat the printed circuit board and hold the holding device 6 The low solder bath is also moved to a slightly displaced position, and the squeegee 52 of the holding device is slightly immersed in the molten solder, and the holding device 6 is moved to move the soldering iron floating on the surface flow nozzle 59. Scatter things. Thereafter, the holding device is lowered in a horizontal state, and the printed circuit board overflows from the surface flow nozzle 59 and is brought into contact with the molten solder. When leaving the molten solder, the motor 45 installed in the rotating part 36 is driven to raise one end of the holding part 37 to release the molten solder force on one side of the printed circuit board. By driving the upper motor 41, the other side of the printed circuit board is separated from the molten solder and the motor 45 is driven to level the holding portion 37. Then, the cooling device 4 performs cooling while returning the holding device 6 toward the substrate insertion table 53 by the transfer device 5.

[0046] Next, a method of soldering a printed circuit board mounted with components such as connectors and LEDs that do not like solder adhesion in a partial jet solder bath will be described with reference to FIG. The soldering method here is to solder only the soldered part of the printed circuit board in contact with the molten solder jetted from the partial jet nozzle. One jet port 5 8 of the jet solder bath 3 is fitted with a partial jet nozzle 61 in which a small-area jet nozzle 60 · ”is installed at a position coincident with the soldering portion of the printed circuit board. Double jet soldering Similarly, the holding device 6 is made to stand by near the board insertion base 53, and the stop position of the transfer device 5 and the lowered position of the holding device 6 are stored in the computer.

[0047] After applying the flux on the printed circuit board with a fluxer (not shown), the operator transfers the printed circuit board from the board insertion base 53 to the holding pieces 38, 38 of the holding device 6. After that, the holding device 6 is moved to the top of the preheater 2 while being kept in a horizontal state, where it is lowered to the vicinity of the preheater and preheating is performed. The printed circuit board is preheated, and the holding device 6 is moved onto the partial jet solder bath by means of the conveying device 5. The position of the holding device 6 at this time is a position where the soldering portion of the printed board and the jet nozzle 60 having a small area match. At this position, the holding device 6 is lowered and brought into contact with the molten solder jetted from each partial jet nozzle 60. Thereafter, the holding device 6 is lifted and cooled by the cooler 4 while being moved toward the substrate insertion table 53 by the transfer device 5.

[0048] A method of soldering the mixed substrate on which the surface mount component and the discrete component are mounted together in a double jet bath will be described with reference to FIG. The soldering here is In the double jet soldering method, the printed circuit board 51 is tilted with respect to the horizontal and soldered in contact with the rough molten solder jetted from the primary jet nozzle and the gentle molten solder jetted from the secondary jet nozzle. In addition, the printed circuit board is held at an angle of about 45 degrees with respect to the direction of travel of the printed circuit board. As in the case of soldering with the short and discrete components described above, the primary jet nozzle 22 for performing a rough jet is attached to one jet 57 of the jet solder bath 3, and a gentle jet is provided to the other jet 58. Install the secondary jet nozzle 23 to be used. In addition, the transfer state of the transfer device, flux application, and preheating are performed in the same way. The difference from double jet soldering is the angle of inclination of the printed circuit board with respect to the direction of travel of the printed circuit board. Here, the rotating part of the holding device is rotated and transported as shown by arrow B in a state where it is inclined about 45 degrees with respect to the traveling direction of the printed circuit board as shown in FIG.

Industrial applicability

The multifunctional soldering device according to the present invention is suitable for mass production that can be done with a cell-type soldering force if a fluxer is installed in the main body and a conveyor that can be automatically transferred before and after the transfer device is installed. It can also be used as a conveyor type automatic soldering device. In the embodiment of the present invention, the main body, preheater, jet solder bath, cooler, transport device, and substrate holding device are shown as the multifunctional soldering device. However, in the cell method, preheating and cooling are performed. You may carry out with the apparatus installed separately.

Claims

The scope of the claims

[1] A solder bath having at least one molten solder jet port, and various jet nozzles can be installed in the jet port;

A printed circuit board transfer device provided on the solder bath; and

Printed circuit board holding device supported by the transfer device

The printed circuit board holding device includes: a sliding portion installed on the transport device so as to be slidable in the transport direction of the printed circuit board; a suspension portion suspended on the sliding portion so as to be movable up and down; A rotating part attached to the mounting part with a variable angle with respect to the direction of travel of the printed circuit board; a holding part of the printed circuit board attached to the rotating part with a variable angle with respect to the horizontal direction; A multifunctional soldering apparatus comprising a set of printed circuit board holding pieces attached thereto.

[2] The transfer device is bridged on the solder bath and has one end rotatably attached and the other end attached to be movable up and down. The multifunctional soldering apparatus according to claim 1, wherein the driving means force of the sliding portion attached to a tool is configured.

[3] The various jet nozzles include a primary jet nozzle that jets molten solder in a rough state and a secondary jet nozzle that jets molten solder in a gentle state, or a wide range of molten solder! 2. A surface flow nozzle that jets in a flat state with a surface area, or a partial jet nozzle in which a large number of nozzles of a small area are installed in a place that matches a soldered portion of a printed circuit board. Multifunctional soldering equipment.

[4] The soldering apparatus according to claim 1 is used, and various jet nozzles suitable for soldering the printed circuit board are installed at the jet openings provided in the solder bath, and the state of conveyance of the printed circuit board is determined for each print. A method of soldering a printed circuit board, wherein the method is changed according to the soldering method of the circuit board.

[5] In the soldering method, a primary jet nozzle that performs rough jets and a secondary jet nozzle that performs gentle jets are installed at two jet ports of the solder bath, respectively. The secondary jet nozzle also increases the jet flow, and the carriage also transports the printed circuit board. The transport device is inclined so that the primary jet nozzle side is low and the secondary jet nozzle side is high. 5. The method for soldering a printed circuit board according to claim 4, wherein the printed circuit board is soldered by being conveyed.

[6] In the soldering method, a surface flow nozzle is installed at the jet port of the solder tank, the conveying device is stopped on the surface flow nozzle and then lowered, and the molten solder solution overflows the surface flow nozzle force. 5. The method for soldering a printed circuit board according to claim 4, wherein the printed circuit board is soldered by bringing the entire back surface into contact with the surface.

[7] In the soldering method, a partial jet nozzle in which a large number of nozzles with a small area project at the jet port of the solder bath coincides with a necessary part of the printed circuit board, and the conveying device is placed on the partial jet nozzle. 5. The method for soldering a printed circuit board according to claim 4, wherein the printed circuit board is soldered by bringing the required part of the printed circuit board into contact with the molten solder that is jetted, by lowering the position and then lowering it.

[8] In the soldering method, a primary jet nozzle that performs rough jets and a secondary jet nozzle that performs gentle jets are installed at two jet ports in the jet solder bath. In addition, the jet flow of the secondary jet nozzle is increased, and the printed circuit board is inclined so that the primary jet nozzle side is lower and the secondary jet nozzle side is higher, and the printed circuit board is further inclined with respect to the traveling direction. 5. The method for soldering a printed circuit board according to claim 4, wherein the printed circuit board is soldered.