JP2004358498A - Soldering apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering apparatus which is a single apparatus, and nonetheless can be selected to be used for wave soldering or local soldering by simple switching operation. <P>SOLUTION: A conveyor 11 for a pre-soldering step to convey a work W in the pre-soldering step, and a soldering conveyor 12 capable of maintaining either the inclined attitude or the horizontal attitude when soldering the work W are continuously provided on the soldering apparatus. The soldering conveyor 12 is provided in an angle-changeable manner between the inclined attitude and the horizontal attitude by a conveyor angle changing mechanism 21. A soldering tank 31 permitting selection of a wave soldering nozzle 41 to perform wave soldering to the work W in the inclined attitude or a local soldering nozzle to perform local soldering to the work in the horizontal attitude is disposed under the soldering conveyor 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a soldering apparatus capable of switching between jet wave soldering and local soldering.
[0002]
[Prior art]
A jet, which has a fluxer that applies flux to the work, a preheater that preheats the work, and a solder tank that solders the work with jet wave solder that is jetted from a nozzle, along a conveyor that conveys the work in an inclined shape. A wave soldering device is known (for example, see Patent Document 1).
[0003]
In addition, along a conveyor for conveying the work horizontally, a fluxer for applying a flux to the work, a preheater for preheating the work, and a solder bath for soldering the work with local solder supplied from a nozzle are sequentially arranged. 2. Description of the Related Art A local soldering apparatus is known (for example, see Patent Document 2).
[0004]
[Patent Document 1]
JP-A-5-192766 (page 1, FIG. 1)
[0005]
[Patent Document 2]
JP 2001-347366 A (page 1, FIG. 1)
[0006]
[Problems to be solved by the invention]
Conventionally, when performing the jet wave soldering, the jet wave soldering device is prepared, and when performing the local soldering, the local soldering device is prepared, respectively. Therefore, it is wasteful to use separate soldering devices.
[0007]
However, the jet-wave soldering apparatus and the local soldering apparatus have been considered to be difficult to be used interchangeably because of different forms such as a conveyor and a solder bath.
[0008]
SUMMARY OF THE INVENTION The present invention has been made in view of such a point, and an object of the present invention is to make it possible to select between jet wave soldering and local soldering by a simple switching operation even with one soldering apparatus.
[0009]
[Means for Solving the Problems]
The invention described in claim 1 provides a soldering conveyor capable of maintaining one of an inclined shape and a horizontal shape when soldering a work, and forming the soldering conveyor into an inclined shape and a horizontal shape. A conveyor angle changing mechanism for changing an angle between the jetting wave soldering nozzle and a jetting wave soldering nozzle which is arranged below the conveyor for soldering and performs jetting wave soldering on an inclined work; A soldering tank having a local soldering nozzle for performing soldering and a solder bath capable of selecting a soldering nozzle. When performing jet wave soldering, the soldering device is provided with a jet wave soldering nozzle, and a soldering conveyor is provided. Is set by the conveyor angle changing mechanism so that the work is in a slanted posture, and when performing local soldering, a local soldering nozzle is provided. Most of one soldering machine can be used for jet wave soldering by a simple switching operation that simply sets the angle of the soldering conveyor to a horizontal work transfer posture by the conveyor angle changing mechanism as a solder tank. Can be used for both local soldering.
[0010]
According to a second aspect of the present invention, there is provided the soldering apparatus according to the first aspect, further comprising a pre-process conveyor which is provided continuously before the soldering conveyor and transports the work in the pre-soldering process. Yes, the workpiece that has been subjected to the pre-soldering process while being transported by the pre-process conveyor is transferred to the soldering conveyor that is provided continuously with the pre-process conveyor, and from the pre-soldering process to the soldering process. A series of processes can be performed efficiently.
[0011]
According to a third aspect of the present invention, there is provided the soldering device according to the first or second aspect, further comprising an elevating mechanism for elevating and lowering the soldering conveyor. Is set horizontally by the conveyor angle changing mechanism and lowered by the elevating mechanism, so that the work located on this soldering conveyor approaches the local soldering nozzle horizontally and performs uniform local soldering. be able to.
[0012]
According to a fourth aspect of the present invention, in the soldering apparatus according to any one of the first to third aspects, the solder bath includes a solder bath main body containing molten solder to be soldered to a work, and a solder bath main body. Provided with an electromagnetic induction pump capable of discharging and supplying molten solder into the jet wave soldering nozzle and the local soldering nozzle and adjusting the discharge pressure. When the soldering nozzle is installed, the discharge pressure can be appropriately changed and adjusted by the electromagnetic induction pump, and an appropriate amount of molten solder is supplied to the work from the jet wave soldering nozzle and the local soldering nozzle, respectively. Suitable for soldering.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the embodiment shown in FIGS.
[0014]
As shown in FIG. 1A and FIG. 2A, a pre-process conveyor 11 for transporting a work W in a pre-soldering process, and an inclined or horizontal shape when the work W is soldered. A soldering conveyor 12 capable of maintaining one of the postures is provided continuously at the front and rear stages.
[0015]
These conveyors 11 and 12 transport the work W via a carrier (not shown) holding the work W. The work W is a component mounting board on which electronic components and the like are mounted.
[0016]
A fluxer 13 for applying a flux to the lower surface of the work W and a preheater 14 for preheating the work W are arranged below the pre-process conveyor 11.
[0017]
The fluxer 13 is a spray-type fluxer that applies a flux by spraying a flux from a spray nozzle 13a that is repeatedly reciprocated in a direction perpendicular to the paper surface, that is, a work width direction, toward the work W being conveyed, or A foaming type fluxer for applying a foaming state flux supplied from a foaming nozzle (not shown) elongated in the width direction to the work W is used.
[0018]
As shown in FIGS. 1 (b) and 2 (b), the soldering conveyor 12 is provided in parallel with each other on two sets of sprockets 16 supported at one end and the other end of the conveyor frame 15. By winding the pair of transport chains 17 arranged endlessly and rotating the sprocket 16 forward or backward by a motor (not shown), the transport chain 17 is driven to rotate in one direction or the other direction, The work W is transported in one direction or the other direction via the carrier.
[0019]
A transport end sensor 18 for detecting the carrier is disposed above the one-way transport end of the soldering conveyor 12.
[0020]
The pre-process conveyor 11 also includes a conveyor frame and a transfer chain similar to the soldering conveyor 12, and conveys the work W in one direction or another direction via a carrier. That is, both the pre-process conveyor 11 and the soldering conveyor 12 can reversely transport the work W not only in one direction but also in the opposite direction.
[0021]
For such a soldering conveyor 12, a conveyor angle changing mechanism 21 for changing the angle of the soldering conveyor 12 between an inclined shape and a horizontal shape, and an elevating mechanism 22 for raising and lowering the soldering conveyor 12 are provided. Is provided.
[0022]
The elevating mechanism 22 is configured such that an elevating frame 24 is slidably fitted in an elevating guide body 23 fixed in the up and down direction, and the elevating frame 24 is an endless end disposed along the elevating guide body 23. It is raised or lowered by a transfer mechanism (not shown) such as a chain, a hydraulic cylinder, or a feed screw.
[0023]
In the conveyor angle changing mechanism 21, a support member 25 is provided on a tip end of a lifting frame 24, and one end of the soldering conveyor 12 is rotatable at an upper end of the support member 25 by a shaft member 26. A tilting cylinder 27 such as an air cylinder is mounted on the base end of the lifting frame 24 and is supported by a shaft. A long hole 28 is provided at a distal end of a piston rod 27 r protruding upward from the tilting cylinder 27. A shaft member 29 provided at the transport end of the soldering conveyor 12 is rotatably and slidably fitted in the elongated hole 28.
[0024]
The conveyor angle changing mechanism 21 pushes out the piston rod 27r of the tilting cylinder 27 and raises the other end of the soldering conveyor 12 upward from one side end via the shaft member 29. As shown by a two-dot chain line in FIG. 2B, the soldering conveyor 12 is set at an inclined angle, the piston rod 27r of the tilting cylinder 27 is pulled down, and the soldering is performed via the shaft member 29. By lowering the other end of the conveyor 12 to the same level as the one end, the soldering conveyor 12 is angled horizontally as shown by a solid line in FIG. 2B.
[0025]
The elevating mechanism 22 moves the elevating frame 24 up and down along the elevating guide 23 to move the soldering conveyor 12 that is horizontally angled as shown in FIG. It descends as shown by the lower two-dot chain line, and rises and returns as shown by the solid line.
[0026]
As shown in FIGS. 1 (b) and 2 (b), a solder tank 31 which is vertically movable by a vertical movement mechanism (not shown) is provided below the soldering conveyor 12. Is arranged.
[0027]
The solder bath 31 is provided with a solder melting heater 34 in a solder bath main body 33 containing a molten solder 32 to be soldered to the work W, and electromagnetic induction is applied to one side and the other side of the solder bath main body 33 in the work transfer direction. Pumps 35 are provided respectively.
[0028]
In each of the electromagnetic induction pumps 35, an induction coil 36 wound around a primary iron core is installed vertically in the outside of the solder bath main body 33, while, inside the solder bath main body 33, through a solder rising passage 37. A secondary iron core 38 is installed in the vertical direction, and a suction port (not shown) is opened at a lower end of the solder rising passage 37 and a discharge port 39 is opened at an upper end.
[0029]
Then, these electromagnetic induction pumps 35 generate a moving magnetic field in the solder ascending passage 37 by supplying a current having a phase shift such as three-phase alternating current to the induction coil 36, and are present in the solder ascending passage 37. An electromotive force is generated in the conductive molten solder by electromagnetic induction, and a current generated by the electromotive force flows in the magnetic flux of the moving magnetic field, thereby generating an upward thrust in the molten solder in the solder ascending passage 37, and the discharge port is formed. Molten solder is discharged from 39. The electromagnetic induction pump 35 can adjust the discharge pressure by controlling the current supplied to the induction coil 36.
[0030]
In such a solder bath 31, the discharge ports 39 of the electromagnetic induction pumps 35 on one side and the other side in the work transfer direction are provided with the jet wave solder for the inclined work W as shown in FIG. In addition to being able to mount a jet wave soldering nozzle 41 for mounting, a local soldering nozzle 42 for performing local soldering on a horizontal work W can be mounted as shown in FIG. By selecting either one, the molten solder 32 is discharged and supplied from the discharge port 39 of each electromagnetic induction pump 35 into the jet wave soldering nozzle 41 or the local soldering nozzle 42.
[0031]
The jet wave soldering nozzle 41 has a primary jet wave nozzle 41a connected to the discharge port 39 of the electromagnetic induction pump 35 on one side and a secondary jet wave nozzle connected to the discharge port 39 of the electromagnetic induction pump 35 on the other side. The primary jet wave nozzle 41a is composed of a nozzle 41b, and supplies the molten solder 32 to every corner of the component mounted on the substrate of the work W by the turbulent primary jet wave 32a jetted from the multi-hole jet port. The jet wave nozzle 41b shapes the soldering portion of the work W with the static planar secondary jet wave 32b.
[0032]
On the other hand, the local soldering nozzle 42 has a nozzle opening 43 of a necessary size corresponding to the size of the soldering target portion of the work W, and supplies the molten solder 32 to the nozzle opening 43 so as to rise, By immersing the component leads and the like of the work W in the molten solder in the nozzle openings 43, local soldering is performed on a limited range of soldering surfaces.
[0033]
Next, the operation of this embodiment will be described.
[0034]
In the pre-soldering process, the flux is applied to the work W by the fluxer 13 while the work W mounted on the carrier is also conveyed in the ascending shape by transferring the carrier in the ascending shape by the pre-process conveyor 11. At the same time, the work W is preheated by the preheater 14.
[0035]
Further, the carrier holding the workpiece W is automatically transferred from the pre-process conveyor 11 to the soldering conveyor 12, and the soldering process is started. In the soldering process, the molten metal supplied from the solder bath 31 is supplied. With the solder 32, jet wave soldering or local soldering is performed.
[0036]
After the soldering, the pre-process conveyor 11 and the soldering conveyor 12 are reversed to convey the carrier of the work W in reverse, and returned from the soldering conveyor 12 to the pre-process conveyor 11, and further, the pre-process conveyor Discharged from 11 to the outside.
[0037]
As shown in FIG. 1, when performing the jet wave soldering, the primary jet wave nozzle 41a and the secondary jet wave nozzle 41b of the jet wave soldering nozzle 41 are attached to the solder bath 31, and the conveyor angle is changed. By raising the tilting cylinder 27 of the mechanism 21 to the raising end, the angle of the soldering conveyor 12 is set so as to be equal to that of the pre-process conveyor 11 so that the workpiece is conveyed in an inclined manner.
[0038]
At the same time, the lifting frame 22 is moved up to the rising end by the lifting mechanism 22, and the solder bath 31 is moved up to the rising end for jet wave soldering by the vertical movement mechanism (not shown) to complete the setting.
[0039]
Then, the work W transferred from the pre-process conveyor 11 to the soldering conveyor 12 is transported in a rising and inclined shape by the soldering conveyor 12, and the turbulent flow jetted from the primary jet wave nozzle 41a. The primary soldering process is performed by the primary jetting wave 32a, and the secondary soldering process is subsequently performed by the planar secondary jetting wave 32b statically jetted from the secondary jetting wave nozzle 41b.
[0040]
When the carrier holding the workpiece W moves to the transport end sensor 18, the transport end sensor 18 detects the carrier and sends a detection signal to a control unit (not shown), and the control unit stops or stops the electromagnetic induction pump 35. The function is reduced, the jets from the primary jet wave nozzle 41a and the secondary jet wave nozzle 41b are stopped, and then, the conveyor 12 for soldering and the conveyor 11 for pre-process are reversed, and the carrier is moved to the conveyor 11 for pre-process. To the outside and discharge to the outside.
[0041]
On the other hand, as shown in FIG. 2, when performing local soldering, a local soldering nozzle 42 is attached to the solder bath 31, and the tilting cylinder 27 of the conveyor angle changing mechanism 21 is raised to the rising end. Thereby, the angle of the soldering conveyor 12 is set so as to assume an inclined work transfer posture as shown by a two-dot chain line.
[0042]
At the same time, the elevating frame 22 is moved up to the rising end by the elevating mechanism 22, and the solder bath 31 is moved up to the rising end for local soldering by the up / down moving mechanism (not shown) to complete the setting.
[0043]
Then, the carrier on which the work W is mounted is automatically transferred from the pre-process conveyor 11 of the pre-soldering process to the soldering conveyor 12 while being inclined, and enters a soldering process.
[0044]
When the carrier holding the work W moves to the transport end sensor 18, the transport end sensor 18 detects the carrier and sends a detection signal to control means (not shown), and the control means transfers the solder conveyor 12. The operation is stopped, and the carrier is stopped at a predetermined position.
[0045]
Further, the control means lowers the tilting cylinder 27 so as to change the angle of the soldering conveyor 12 from the inclined shape to the horizontal shape.
[0046]
Further, by moving the elevating frame 24 down to the lower end by the elevating mechanism 22 while keeping the conveyor horizontal, the molten solder supplied to the nozzle opening 43 in the local soldering nozzle 42 has the lower surface of the substrate of the workpiece W. Immerse the component leads, etc. protruding in the, and perform local soldering.
[0047]
After the local soldering, the elevating mechanism 22 moves the elevating frame 24 to the ascending end, thereby pulling up the component leads of the work W from the molten solder in the local soldering nozzle 42.
[0048]
After the lifting frame 24 moves to the rising end, the tilting cylinder 27 is raised to the rising end to return the soldering conveyor 12 from the horizontal state to the inclined state.
[0049]
After the soldering conveyor 12 returns to the predetermined inclined position, the carrier is conveyed back to the pretreatment conveyor 11 and discharged.
[0050]
Next, the effects of this embodiment will be described.
[0051]
When performing the jet wave soldering, the solder bath 31 is provided with the jet wave soldering nozzle 41, and the angle of the soldering conveyor 12 is set by the conveyor angle changing mechanism 21 so that the work conveying posture is inclined. In addition, when performing local soldering, the solder bath 31 having the local soldering nozzle 42 is used, and the angle of the soldering conveyor 12 is set by the conveyor angle changing mechanism 21 so as to be in a horizontal work transfer posture. With a simple switching operation, most of one soldering machine can be used for both jet wave soldering and local soldering.
[0052]
The work W subjected to the pre-soldering process while being conveyed by the pre-process conveyor 11 is transferred to a soldering conveyor 12 provided continuously with the pre-process conveyor 11, and soldering is performed from the pre-soldering process. Up to a series of processes can be performed efficiently.
[0053]
When performing local soldering, the work W located on the soldering conveyor 12 is locally soldered by setting the horizontal angle of the soldering conveyor 12 by the conveyor angle changing mechanism 21 and lowering the angle by the elevating mechanism 22. By approaching horizontally to the mounting nozzle 42, uniform local soldering can be performed.
[0054]
The discharge pressure of the jet wave soldering nozzle 41 and the local soldering nozzle 42 can be appropriately changed and adjusted by the electromagnetic induction pump 35 between the time when the jet wave soldering nozzle 41 is mounted and the time when the local soldering nozzle 42 is mounted. An appropriate amount of the molten solder 32 is supplied to the work W from 42, and the respective soldering can be appropriately performed.
[0055]
In the above embodiment, only the jet wave soldering nozzle 41 and the local soldering nozzle 42 can be replaced by using the solder bath body 33 as a common member at the time of jet wave soldering and at the time of local soldering. The solder bath 31 having the jet bath soldering nozzle 41 mounted on the solder bath main body 33 and the solder bath 31 having the local soldering nozzle 42 mounted on the solder bath main body 33 may be totally replaced.
[0056]
As described above, not only when the jet wave soldering nozzle 41 and the local soldering nozzle 42 are replaced, but also when the entire solder bath 31 is replaced, the jet flow centering on the pre-process conveyor 11 and the soldering conveyor 12 is not limited. Most of the wave soldering device and the local soldering device can be shared by one soldering device.
[0057]
In addition, the soldering conveyor 12 located above the solder bath 31 is divided from the pre-soldering conveyor 11 in the pre-soldering process so that both the inclined shape and the horizontal shape can be set. Although the soldering conveyor 12 is moved up and down by the lifting mechanism 22, the vertical movement mechanism is added to the carrier on which the work W is set, or the vertical movement mechanism of the solder bath 31 is used for local soldering. You may make it correspond to a raising / lowering operation | movement.
[0058]
Further, as the fluxer 13, a foaming type fluxer and a spraying type fluxer may be selected. The foaming type fluxer can share other fluxing parts by exchanging only the foaming nozzle between the jet wave soldering and the local soldering, and the spraying type fluxer can move the spray nozzle 13a in a plane direction. If an XY moving mechanism is installed, it can be used for jet wave soldering and local soldering as it is.
[0059]
【The invention's effect】
According to the first aspect of the present invention, when performing the jet wave soldering, a solder bath having a jet wave soldering nozzle is used, and the soldering conveyor is inclined by a conveyor angle changing mechanism so as to have an inclined work transfer posture. When performing local soldering, use a solder tank with a local soldering nozzle, and set the soldering conveyor to a horizontal work transfer posture by the conveyor angle changing mechanism. With a simple switching operation only by setting the angle, most of one soldering apparatus can be used for both the jet wave soldering and the local soldering.
[0060]
According to the second aspect of the present invention, the work that has been subjected to the pre-soldering process while being transferred by the pre-process conveyor is transferred to the soldering conveyor provided continuously with the pre-process conveyor, and soldering is performed. A series of processes from the pre-attachment process to the soldering can be performed efficiently.
[0061]
According to the third aspect of the present invention, when performing local soldering, the angle of the soldering conveyor is set horizontally by a conveyor angle changing mechanism, and the soldering conveyor is lowered by an elevating mechanism. The work to be performed is made to approach horizontally to the local soldering nozzle, and uniform local soldering can be performed.
[0062]
According to the fourth aspect of the present invention, the discharge pressure can be appropriately changed and adjusted by the electromagnetic induction pump between the time when the jet wave soldering nozzle is mounted and the time when the local soldering nozzle is mounted. An appropriate amount of molten solder is supplied to the work from the local soldering nozzle, and each soldering can be appropriately performed.
[Brief description of the drawings]
FIG. 1 (a) is a schematic view of a soldering apparatus according to an embodiment of the present invention at the time of jet wave soldering, and FIG. 1 (b) shows a solder bath and its peripheral portion at the time of the jet wave soldering. It is sectional drawing.
FIG. 2A is a schematic view of the same soldering apparatus at the time of local soldering, and FIG. 2B is a cross-sectional view showing a solder bath and its peripheral part at the time of local soldering.
[Explanation of symbols]
W Work 11 Conveyor for pre-process 12 Conveyor for soldering 21 Conveyor angle changing mechanism 22 Elevating mechanism 31 Solder tank 32 Solder tank 33 Solder tank body 35 Electromagnetic induction pump 41 Jet wave soldering nozzle 42 Local soldering nozzle

Claims (4)

When soldering a work, a soldering conveyor capable of maintaining one of an inclined shape and a horizontal shape,
A conveyor angle changing mechanism for changing the angle of the soldering conveyor between an inclined shape and a horizontal shape,
Selectable between a jet wave soldering nozzle which is arranged below the above-mentioned soldering conveyor and performs a jet wave soldering on an inclined work and a local soldering nozzle which performs a local soldering on a horizontal work A soldering machine comprising a solder bath. 2. The soldering apparatus according to claim 1, further comprising a pre-process conveyor which is provided continuously before the soldering conveyor and conveys the work in the pre-soldering process. 3. The soldering apparatus according to claim 1, further comprising an elevating mechanism for elevating and lowering the soldering conveyor. The solder bath is
A solder tank body for containing the molten solder to be soldered to the work,
2. An electromagnetic induction pump provided in the solder bath body and capable of discharging and supplying molten solder into the jet wave soldering nozzle and the local soldering nozzle and capable of adjusting a discharge pressure. 3. The soldering apparatus according to any one of items 1 to 3.

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