JP2001347366A - Local soldering apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently solder even a work having a plurality of local points to be soldered where the soldering range is different each other, by a plurality of local nozzles. SOLUTION: The plurality of local nozzles 3 and 3a capable of relatively changing the height of a tip are provided in a solder tank 2 containing a molten solder 1. A plurality of pumps 4 and 4a for force-feeding the molten solder 1 are individually connected to the local nozzles 3 and 3a. Even the work W having the plurality of local points W1 and W2 to be soldered where the soldering range is different each other can be efficiently soldered by raising only the nozzle 3 suitable for the size of the predetermined local point W1 to be soldered higher than the other nozzle 3a installed close thereto while avoiding the interference of the work W2 with the other nozzle 3a not in use.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a local soldering apparatus having a local nozzle.

[0002]

2. Description of the Related Art As shown in Japanese Patent Application Laid-Open No. 9-199844, when a single substrate has a plurality of regions requiring partial soldering, the layout is the same as the layout of the soldered portions of the substrate. Such a solder bath having a plurality of integrated nozzles dedicated to the substrate is prepared, and all the soldering locations are simultaneously immersed and soldered in the molten solder raised in all the nozzles.

On the other hand, in this publication, only one nozzle having an opening smaller than the area to be locally soldered is prepared in a solder bath, and the substrate is moved by a robot, so that the surface of the nozzle is brought into a state of surface tension. A technique is shown in which, while contacting a soldered portion on a substrate having an area equal to or greater than the nozzle opening with the molten solder supplied to the substrate, the substrate is moved to a range to be soldered and soldered. I have.

[0004]

In the case of the plural integrated nozzles dedicated to the substrate, when the area or position of the portion to be soldered is different due to a difference in the parts to be soldered or a change in the design of the substrate, the nozzle is adjusted to the substrate layout each time. It is necessary to prepare a plurality of integrated nozzles, and it takes time to manufacture. In particular, when the purpose is small-volume production, the production of the nozzle becomes a heavy burden.

[0005] Further, since all the soldering locations on the substrate are simultaneously soldered by a plurality of integrated nozzles, it is not possible to set optimum soldering conditions for each soldering portion. Further, since only soldering can be performed with the substrate kept horizontal, defects are likely to occur depending on the soldered portion.

On the other hand, when only one nozzle having an opening smaller than the area to be locally soldered is installed and the board is moved by a robot to perform soldering, the above problem can be solved. It takes time to solder an extremely large area. In particular, in the case of a substrate having a plurality of soldering localities having extremely different soldering ranges, a problem often occurs.

Further, in order to improve productivity, even if a plurality of nozzles having different nozzle opening sizes in accordance with the soldering range are to be installed in one solder bath, the nozzles of each nozzle are required to prevent interference with the substrate. Since it is necessary to install the nozzles at a sufficient interval, it is not practical to install two or more nozzles.

Furthermore, since the number of nozzles mounted on the solder bath is limited to one, when soldering with nozzles having different opening sizes, the nozzles need to be replaced, which is troublesome. There is.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to enable a work having a plurality of soldering localities to be efficiently soldered by a plurality of local nozzles.

[0010]

According to a first aspect of the present invention, there is provided a solder bath containing molten solder and a plurality of local nozzles provided in the solder bath and capable of changing the height of a tip relatively. And a pump for supplying molten solder to the work via the local nozzle, and the local nozzle facing the soldering area of the work is raised relatively to other local nozzles. By bringing molten solder supplied to the tip of the nozzle into contact with the soldering portion of the work, local soldering can be completed efficiently and in a short time while avoiding interference between the unused nozzle and the work.

According to a second aspect of the present invention, the plurality of local nozzles according to the first aspect have openings of different sizes from each other and a plurality of soldering localities having different sizes of soldering areas. Even with a workpiece that has, by raising only the optimal nozzle that is suitable for the local size of the soldering of that workpiece more than other nozzles that are installed close to it, the nozzle that is not used can be Solder efficiently while avoiding interference.

According to a third aspect of the present invention, there is provided a local soldering apparatus in which the plurality of local nozzles according to the first or second aspect are individually connected to a plurality of pumps. An appropriate molten solder flow rate according to the size is supplied from a corresponding pump.

According to a fourth aspect of the present invention, the local nozzle according to any one of the first to third aspects includes a nozzle base member, and a nozzle tip member detachably provided at a tip end portion of the nozzle base member. , And removes only the nozzle tip member to perform replacement or maintenance with another nozzle tip member.

According to a fifth aspect of the present invention, in a local soldering apparatus according to any one of the first to fourth aspects,
A transfer means for moving the work in at least a two-dimensional direction intersecting the local nozzle, and moving the work by the transfer means to transfer a soldering area of the work onto the corresponding local nozzle and lift Local soldering with local nozzle. Alternatively, the work is transferred by the transfer means in a state where the soldering area of the work and the molten solder supplied from the local nozzle are in contact with each other, so that the solder is soldered to a relatively wide local area.

According to a sixth aspect of the present invention, the transfer means according to the fifth aspect holds the workpiece and holds the workpiece at an arbitrary inclination angle.
A local soldering device equipped with a robot that moves in a three-dimensional direction, and the robot contacts a molten solder supplied from a local nozzle at a predetermined optimum inclination angle with a soldering area of the work, and Is moved along the optimal movement path, and local soldering is efficiently performed.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1 and 2, and another embodiment will be described with reference to FIGS. The configuration will be described with reference to FIGS.

FIG. 1 and FIG. 2 show an embodiment of a local soldering apparatus, in which a plurality of local soldering heads 2 in which molten solder 1 is accommodated can change the height of the tip relatively. Nozzles 3, 3a are provided, and a plurality of pumps 4, 4a for supplying the molten solder 1 under pressure are individually connected to these local nozzles 3, 3a. Molten solder is supplied from these pumps 4 and 4a to a work W (this work W is a substrate on which chip components and the like are mounted) via local nozzles 3 and 3a, and is locally soldered.

As shown in FIG. 2, the plurality of local nozzles 3, 3a have openings 5, 5a of different sizes or shapes.
At the upper end, and the molten solder individually supplied from each of the pumps 4 and 4a is kept in a surface tension state or jetted at these openings 5 and 5a.

Each of the local nozzles 3 and 3a has a nozzle tip member 7 slidably and detachably fitted to a tip end of a nozzle base member 6 fixed to the pump side. Only 7 is moved up and down.

Since the nozzle tip member 7 is detachable from the nozzle base member 6, only the nozzle tip member 7 is removed and replaced with another nozzle tip member having a different size or shape of the opening 5. Is also possible.

The workpiece W may be moved by at least two-dimensional directions, ie, the X direction and the Y direction in FIG. As the transfer means, it is preferable to move the work W at an arbitrary inclination angle in an arbitrary three-dimensional direction.

At the opening of the solder bath 2, as shown in FIG. 2, together with the local nozzles 3 and 3a, an electromagnetic solder surface detection sensor 8 for controlling the level of the molten solder surface is provided. Have been.

Next, the operation of the embodiment shown in FIGS. 1 and 2 will be described.

The work W is moved in the X direction and the Y direction by a robot (not shown) to
Is controlled on the local nozzle 3 having a size or shape suitable for the size or shape, and only the local nozzle 3 having a shape suitable for the area of the soldering local w1 is positioned relative to the other local nozzles 3a. The molten solder supplied from the pump 4 to the opening 5 of the local nozzle 3 and raised by the surface tension or jetted from the opening 5 is brought into contact with the soldering local w1 of the workpiece W. By doing so, only the specific soldering local w1 is soldered.

Thus, the soldering local w1 of the work W
By raising only the local nozzles 3 suitable for the shape of the nozzle W above the other nozzles 3a installed close to it, it is possible to avoid interference between the other nozzles 3a not used and the other local w2 of the work W. Can be soldered.

At this time, the size or shape of the opening 5 of the local nozzle 3 and an appropriate flow rate of the molten solder are supplied from the corresponding pump 4 to the local nozzle 3 used for the local soldering. . Unused local nozzle 3a
Is not supplied with molten solder.

Similarly, a soldering area w2 of the work W is aligned on the local nozzle 3a by a robot (not shown), and an opening 5a of a size or shape corresponding to the local area w2 is formed.
By raising the local nozzle 3a having the above, there is no possibility of interference between the other local nozzles 3 and the other local w1, and local soldering is performed.

When a plurality of soldering portions having the same shape are to be soldered, the same local nozzle 3 or 3a is used.
It is preferable that the soldering is performed while changing the position of the work W by a robot (not shown) using

In this way, by combining the positioning control of the work W and the selective raising control of the plurality of nozzles 3 and 3a, local soldering is efficiently performed while preventing interference between the work and the nozzle. . In particular, when the size or shape of a plurality of soldering locations of the work W is extremely different, the local nozzle 3 having the opening 5 of the size or shape corresponding to each location is selectively used, and the local nozzle is used. 3
By supplying an appropriate molten solder flow rate from the pump 4 corresponding to the above, local soldering is efficiently completed in a short time.

FIGS. 3 to 5 show an embodiment of a fully automated local soldering apparatus.

As shown in FIGS. 3 and 4, inside the chamber 11, a whole heating means 12 for entirely preheating the work W at a temperature lower than the solder melting point, and a plurality of preheated works W are provided. Local soldering means 13 for locally supplying molten solder and partially soldering; and local heating means 14 for locally heating the work W at a temperature lower than the solder melting point.
And cooling means 15 for cooling the whole of the soldered work W, and transfer means 16 for transferring the work W to the entire heating means 12, the local soldering means 13, the local heating means 14 and the cooling means 15 are provided. Have been.

As shown in FIG. 3, the chamber 11 includes an inert gas supply unit 17 for supplying an inert gas such as a nitrogen gas for preventing oxidation of the molten solder into the chamber 11, and an A controller 18 for controlling the operation according to the set conditions.

The overall heating means 12 is arranged inside the inlet 21 of the chamber 11 as shown in FIG. 3, and a preheater 22 such as an infrared heater is arranged below the transfer means 16 as shown in FIG. A reflector 23 is disposed on the upper side, and the lower surface of the work W (this work W is a substrate on which chip components and the like are mounted) is directly heated by the heat rays radiated from the preheater 22 and the upper surface of the work W is reflected. The heating is performed by the heat rays reflected by the plate 23.

As shown in FIG. 5, the local soldering means 13 is provided in a solder tank 25 containing a molten solder 24, and is movable vertically in the solder tank 25 via a bellows-like cylindrical body 26. A plurality of local nozzles 27 for partially jetting the molten solder 24, an electromagnetic induction pump 28 as a pump for supplying the molten solder 24 to these local nozzles 27, and a nozzle up and down moving each of the plurality of local nozzles 27 up and down And a fluid pressure cylinder 29 as a means.

The solder bath 25 has a pump bath 31 formed relatively elongated at the bottom and a jet bath 32 formed relatively wide at the top. A heater 33 for melting is built in, and the bellows-like cylindrical body 26 is installed on a partition 34 between the pump tank 31 and the jet tank 32.

The local nozzle 27 is a tubular member removably attached to the upper end opening edge of the bellows-like cylindrical body 26, and has a sectional shape corresponding to the local shape of the work W to be soldered. ing.

The solder bath 25, the bellows-like cylindrical body 26 and the local nozzle 27 are made of a nonmagnetic material such as stainless steel having corrosion resistance and heat resistance.

The electromagnetic induction pump 28 is provided on each of a plurality of side surfaces of the solder bath 25, and is provided on an outer surface of the pump bath unit 31.
A coil unit 35 composed of a primary iron core and a coil is installed, and a secondary iron core, that is, a back iron 36 is installed inside the pump bath 31 through a molten solder rising passage 37. A solder suction port 38 is provided at a lower end of the molten solder rising passage 37, and a solder discharge port 39 opened in the bellows-like cylindrical body 26 is provided at an upper end of the molten solder rising passage 37.

When a three-phase alternating current is supplied to the coil unit 35, a moving magnetic field is generated along the molten solder rising passage 37, and the moving magnetic field is directed upward to the molten solder in the molten solder rising passage 37, similarly to the linear motor. Thrust is generated, and the molten solder 24 in the pump bath 31 is sucked into the molten solder rising passage 37 from the solder suction port 38, rises in the passage 37, and rises in the bellows-like cylindrical body 26 from the solder discharge port 39. The molten solder 24a jetted from the local nozzle 27 and jetted from the local nozzle 27 is supplied to the soldering area of the work W located above the nozzle, and the remaining molten solder is
It falls into the jet tank section 32, and is further returned into the pump tank section 31 by the return port 40 opened in the partition plate.

The fluid pressure cylinder 29 has a cylinder body 41 attached to the jet tank 32, and a tip of a piston rod 42 protruding from the cylinder body 41 is attached to a nozzle vertical moving plate 43 attached to the local nozzle 27. Are linked.

The local soldering means 13 drives the fluid pressure cylinder 29 by air pressure or hydraulic pressure,
Only the local nozzle 27 corresponding to the local part of the work to be locally soldered is raised, and the electromagnetic induction pump 28
Then, the molten solder 24 is supplied to the raised local nozzle 27 and soldered to the local portion of the work. Molten solder 24
May be a tin-lead solder, but a lead-free solder such as a tin-silver solder or a tin-zinc solder is preferable in consideration of environmental issues.

Returning to FIGS. 3 and 4, the local heating means 14 is provided with a hot air generating section 51 for generating hot air heated to a temperature higher than the preheating temperature of the whole heating means 12 and lower than the solder melting point. And a hot-air nozzle 52 that partially heats the local portion of the work W by blowing the hot air to the local portion of the work W. The hot-air generating section 51 or the hot-air nozzle 52 is moved up and down by a vertical movement mechanism (not shown), and the hot-air nozzle 52 is raised only when a local area is partially heated. The hot air may be air, but it is desirable that the hot air be produced by heating an inert gas such as a nitrogen gas in order to keep the inert atmosphere in the chamber 11 at a low oxygen concentration.

The cooling means 15 is arranged inside the outlet 53 of the chamber 11 as shown in FIG. 3, and is provided with a cooling fan 54 which is arranged upward under the transfer means 16 as shown in FIG. It has.

The transfer means 16 includes a work feed mechanism 55 for loading and unloading the work, which is disposed through the inlet 21 and the outlet 53 of the chamber 11, a work feeding mechanism 55 for holding the work W and at least the local nozzle 27. A work transfer robot 56 as a robot having a robot hand movable in two-dimensional directions intersecting with each other is provided.

The work transfer robot 56 grasps and picks up the work W on the work feeding mechanism 55, transfers the work W to the local soldering means 13 and the local heating means 14, and also transfers the work W on the work feeding mechanism 55. Return to

In the work feed mechanism 55, a movable rail 58 is provided so as to be adjustable in accordance with the work width with respect to a fixed side rail 57 for work feed guide. Are provided from the work supply position A to the work pickup position C via the work preheating position B, and from the work cooling position D to the work removal position E. Send tact.

Next, the operation of the embodiment shown in FIGS. 3 to 5 will be described.

Work W supplied to work supply position A
Is supplied to the work preheating position B by the tact feed of the fluid pressure cylinder, and is preheated by the overall heating means 12 at the work preheating position B.

The work W whose temperature has been raised at the work preheat position B is tact-fed to the work pickup position C by the fluid pressure cylinder, and is picked up by the robot hand of the work transfer robot 56 at the work pickup position C, and is locally soldered. Transported on means 13,
A local portion of the work W to be soldered is positioned on the local nozzle 27, and local soldering is performed.

At this time, as shown in FIG.
Only the local nozzle 27 suitable for the local shape of the soldering,
By raising it higher than other nozzles installed close to it, local soldering is performed while avoiding interference between the other nozzles that are not used and the work W.

That is, each time the local shape of the solder is different, only the local nozzle 27 suitable for the shape is raised, and the work W is moved by the work transfer robot 56 of the transfer means 16 so that the local area of the work W is soldered. Are positioned on a local nozzle 27 having an opening of a corresponding size or shape, and a required molten solder flow rate is supplied to the local nozzle 27 from a corresponding electromagnetic induction pump 28 to perform local soldering. .

In particular, when the size or shape of a plurality of soldering portions of the work W is extremely different, the local nozzle 27 having an opening of a size or shape corresponding to each portion is selectively used, and By supplying an appropriate flow rate of the molten solder from the electromagnetic induction pump 28 corresponding to the local nozzle 27, the local soldering is efficiently completed in a short time.

The other part of the work W whose temperature has dropped during the local soldering is heated by the local heating means 14 arranged beside the local soldering means 13 to increase its temperature.
Or the temperature drop is prevented.

The function of the local heating means 14 will be described.
The preheating is performed by the entire heating means 12, and thereafter, a hot air having a temperature equal to or higher than the preheating temperature and lower than the solder melting point is blown to the local area where the temperature has dropped due to the time difference until the local soldering, and the preheating temperature is further increased. In this way, a uniform preheating effect can be obtained in all the local areas when local soldering is performed. By blowing and heating hot air having a temperature lower than the melting point, by suppressing the drop in the temperature of the work after soldering, the next cooling means 15 cools the work W uniformly at all locations. The effect is obtained.

The work W for which the local soldering has been completed is transferred by the work transfer robot 56 to the work cooling position D of the work feeding mechanism 55 and cooled by the cooling means 15 installed at the work cooling position D. The work W cooled to the predetermined temperature is discharged from the work cooling position D to the work removal position E by the tact feed of the fluid pressure cylinder.

Next, FIGS. 6 to 8 show another embodiment of a fully automated local soldering apparatus.

As shown in FIGS. 6 and 7, inside the chamber 11, a whole heating means 12 for entirely preheating the work W at a temperature lower than the solder melting point, and a plurality of preheated works W are provided. Local soldering means 13 for locally supplying molten solder from a local nozzle 27 and partially soldering,
Cooling means for entirely cooling the soldered work W
A transfer means 16 for transferring the work W to at least the entire heating means 12, the local soldering means 13 and the cooling means 15 is provided.

The transfer means 16 is provided with a work feed mechanism 55 provided via the inlet 21 and the outlet 53 of the chamber 11, respectively.
And a work transfer robot 56 as a robot having a robot hand that can move at least three-dimensionally from above the work feed mechanism 55 over the local soldering means 13.

The work feed mechanism 55 includes a fixed rail 57.
On the other hand, a movable rail 58 is provided so as to be adjustable in accordance with the width of the work, and a hydraulic cylinder (not shown) for feeding the work is provided along the rails 57, 58. The work W is moved from the work supply position A to the work pickup position C via the work preheat position B.
The workpiece is tact-feeded from the work cooling position D to the work removal position E.

The workpiece transfer robot 56 is provided with the chamber 11
Between the beam member feed mechanism 61 provided on one side and the beam member guide rail 62 provided on the other side, the beam member feed mechanism 61 is moved in the Y direction by, for example, rotation of a ball screw. Beam member 63 is movably straddled, and the beam member 63
For example, a slider 64 that is moved in the X direction by the rotation of a ball screw is slidably provided, and a robot hand 66 shown in FIG. And it is attached so that it can incline with respect to the horizontal plane.

In short, the work transfer robot 56
It has a function of gripping and moving the work W in a three-dimensional direction at an arbitrary inclination angle.

In the robot hand 66 of the work transfer robot 56, a plurality of work locking claws 68 for holding the work W are mounted on a frame 67 so as to be able to open and close.

In FIG. 6, the work supply position A
Is supplied to the work preheating position B by the tact feeding of the fluid pressure cylinder, and is preheated by the preheater of the overall heating means 12 at the work preheating position B.

The work W whose temperature has been raised at the work preheat position B is tact-fed to the work pick-up position C by the fluid pressure cylinder, and is picked up by the robot hand 66 of the work transfer robot 56 at the work pick-up position C, where local soldering is performed. The workpiece W is transferred onto the attaching means 13, the local area of the work W to be soldered is positioned on the local nozzle 27, and the local soldering is performed.

At this time, each time the local shape of the soldering is different, only the local nozzle 27 suitable for the shape is raised, and the work W is moved by the work transfer robot 56 of the transfer means 16 in the XY direction. The soldering area of the work W is aligned on a local nozzle 27 having an opening of a corresponding size or shape, and a necessary molten solder flow rate is supplied from the corresponding pump to the local nozzle 27,
Local soldering.

The work transfer robot 56 moves the work W in a predetermined three-dimensional direction, an inclination angle, and a movement in a state where the soldering area of the work W is brought into contact with the molten solder supplied from the local nozzle 27. By moving at a distance and a moving speed, soldering may be performed in a predetermined area.

The work transfer robot 56 can bring the soldering area of the work W into contact with the molten solder supplied from the local nozzle 27 at an optimum tilt angle set in advance and move the work W optimally. By moving along the route, local soldering can be performed efficiently.

The work W on which the local soldering has been completed is transferred by the work transfer robot 56 to the work cooling position D of the work feeding mechanism 55 and cooled by the cooling means 15 installed at the work cooling position D. The work W cooled to the predetermined temperature is discharged from the work cooling position D to the work removal position E by the tact feed of the fluid pressure cylinder.

[0069]

According to the first aspect of the present invention, only the local nozzle facing the soldering area of the work is raised relatively to the other local nozzles, and the molten solder supplied to the nozzle tip is used for the work. By bringing the nozzle into contact with the local portion of soldering, local soldering can be efficiently completed in a short time while avoiding interference between the nozzle and the other nozzles that are not used.

According to the second aspect of the present invention, since the plurality of local nozzles have openings of different sizes from each other,
Even for a work with multiple soldering areas with different soldering area sizes, only the optimal nozzle suitable for the size of the soldering area of the work is raised higher than other nozzles installed closer to it By doing so, soldering can be performed efficiently while avoiding interference between the nozzles and other nozzles that are not used.

According to the third aspect of the present invention, since the plurality of local nozzles are individually connected to the plurality of pumps, an appropriate molten solder flow rate corresponding to the size of the opening of the local nozzle can be adjusted. Can be supplied from a pump.

According to the fourth aspect of the present invention, since the nozzle tip member is detachably provided at the tip of the nozzle base member, only the nozzle tip member is removed, and replacement with another nozzle tip member and maintenance are performed. Easy.

According to the fifth aspect of the present invention, the work is moved in at least a two-dimensional direction intersecting the local nozzle by the transfer means, so that the soldering area of the work is transferred onto the corresponding local nozzle and raised. Localized soldering can be performed by the local nozzle, and the work is transferred by the transfer means while the soldering part of the work and the molten solder supplied from the local nozzle are in contact with each other, so that the comparison can be made larger than the nozzle opening It can also be soldered to a local area over a wide area.

According to the sixth aspect of the present invention, a robot that grips a workpiece and moves the workpiece in a three-dimensional direction at an arbitrary tilt angle allows a soldering area of the workpiece to be moved from a local nozzle at a preset optimal tilt angle. The workpiece can be brought into contact with the supplied molten solder, and the work can be moved along an optimal movement path, so that local soldering can be performed efficiently.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a local soldering apparatus according to the present invention.

FIG. 2 is a perspective view of the same soldering apparatus.

FIG. 3 is a plan view showing another embodiment of the local soldering apparatus according to the present invention.

FIG. 4 is a front view of the same soldering apparatus.

FIG. 5 is a sectional view of a solder bath of the soldering apparatus.

FIG. 6 is a plan view showing still another embodiment of the local soldering apparatus according to the present invention.

FIG. 7 is a front view of the same soldering apparatus.

FIG. 8 is a perspective view showing a robot hand of the soldering apparatus.

[Description of Signs] W Work 1,24 Molten solder 2,25 Solder bath 3,3a, 27 Local nozzle 4,4a, 28 Pump 5 Opening 6 Nozzle base member 7 Nozzle tip member 16 Transfer means 56 Work transfer as robot robot

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuhiko Takahashi 1-19-143 Higashi-Oizumi, Nerima-ku, Tokyo Inside the Tamura Corporation (72) Inventor Dai Shirai 1-19-43 Higashi-Oizumi, Nerima-ku, Tokyo F-term in Tamura Corporation (reference) 4E080 AA01 AB03 BA04 CA03 CA11 CB02 DA04 DA10 DC03 EA02 5E319 CC24 CD27 CD35 GG15

Claims (6)

[Claims] 1. A solder tank containing molten solder, a plurality of local nozzles provided in the solder tank, the height of the tip of which can be relatively changed, and a pump for supplying molten solder to the work via the local nozzle A local soldering apparatus comprising: 2. The local soldering apparatus according to claim 1, wherein the plurality of local nozzles have openings having different sizes from each other. 3. The local soldering apparatus according to claim 1, wherein the plurality of local nozzles are individually connected to the plurality of pumps. 4. The local nozzle according to claim 1, wherein the local nozzle includes a nozzle base member, and a nozzle tip member detachably provided at a tip end portion of the nozzle base member. Local soldering equipment. 5. The local soldering apparatus according to claim 1, further comprising a transfer unit that moves the workpiece in at least a two-dimensional direction crossing the local nozzle. 6. The local soldering apparatus according to claim 5, wherein the transfer means includes a robot that grasps the workpiece and moves the workpiece in a three-dimensional direction at an arbitrary inclination angle.