WO2018047336A1

WO2018047336A1 - Jet flow device

Info

Publication number: WO2018047336A1
Application number: PCT/JP2016/076795
Authority: WO
Inventors: 広己鈴木; 康博手島
Original assignee: 富士機械製造株式会社
Priority date: 2016-09-12
Filing date: 2016-09-12
Publication date: 2018-03-15
Also published as: JP6838073B2; JPWO2018047336A1

Abstract

This jet flow device 100 is equipped with a jet flow nozzle that emits a flow of molten solder, and a mounting unit to which the jet flow nozzle is mounted in a detachable manner. The jet flow nozzle mounted on the mounting unit can be exchanged with a jet flow nozzle having a different nozzle diameter. Before soldering is performed an image of the jet flow nozzle mounted on the mounting unit is captured, and the nozzle diameter of the jet flow nozzle is obtained by a controller 152 on the basis of the image data. The controller stores the nozzle diameter of a jet flow nozzle scheduled for mounting, and compares the stored nozzle diameter and the nozzle diameter obtained on the basis of the image data. When the obtained nozzle diameter and the stored nozzle diameter differ a worker is notified to that effect. Thus, it is possible to ensure that the jet flow nozzle scheduled for mounting is mounted on the mounting unit.

Description

Jet device

The present invention relates to a jet device for jetting a liquid upward.

As a jet device for jetting liquid upward, for example, a device for spraying molten solder upward, applying solder to a predetermined object, and jetting a cleaning liquid upward to wash the predetermined object There is a device to do. Such a jet device includes a device constituted by a jet nozzle for jetting a liquid and a mounting portion to which the jet nozzle is detachably mounted, depending on the shape, dimension, etc. of the jet target. The jet nozzle mounted on the mounting portion is replaced by the operator. In the following patent document, in a device for jetting molten solder, it is described that jet nozzles having different nozzle diameters can be attached to and detached from the mounting portion, and the jet nozzles are replaced according to the shape of the jet target. .

JP 2001-347366 A

According to the technique described in the above-mentioned patent document, it is possible to appropriately jet a liquid to a jet target object by exchanging the jet nozzle. However, since replacement of the jet nozzle is performed by an operator, there is a case where the operator forgets to replace the jet nozzle when a different type of jet nozzle is installed in the mounting portion. In such a case, the liquid is jetted onto the jet target in a state where the jet nozzle of a different type from the jet nozzle corresponding to the jet target is mounted on the mounting portion, so that the liquid is appropriately applied to the jet target. There is a possibility that it cannot be jetted. This invention is made | formed in view of such a situation, and the subject of this invention is ensuring the mounting | wearing to the mounting part of the jet nozzle scheduled to be mounted.

In order to solve the above problems, a jet apparatus according to the present invention is a jet apparatus that jets a liquid upward, and the jet apparatus includes a jet nozzle that jets a liquid, and the jet nozzle is detachable. An acquisition unit that acquires identification information that can identify the type of the jet nozzle that is mounted on the mounting unit, and an acquisition unit that acquires the identification information that can identify the type of the jet nozzle that is mounted on the mounting unit. And a determination unit that determines whether or not the identification information set is the same as the identification information set in advance.

In the jet device according to the present invention, identification information that can identify the type of the jet nozzle mounted in the mounting portion is acquired, and whether the acquired identification information is the same as the preset identification information. It is determined whether or not. Accordingly, it is possible to confirm whether or not the jet nozzle scheduled to be mounted is mounted on the mounting portion, and it is possible to ensure the mounting of the jet nozzle scheduled to be mounted on the mounting portion.

It is a perspective view which shows a component mounting machine. It is a perspective view which shows a component mounting apparatus. It is a perspective view which shows a soldering apparatus. It is sectional drawing which shows a solder jet part. It is a perspective view which shows a solder jet part. It is a block diagram which shows a control apparatus. It is the schematic which shows the state in which the molten solder is jetted toward the lead | read | reed. It is the schematic which shows the state in which the molten solder is jetted toward a lead | read | reed by the jet nozzle with a small nozzle diameter. It is a perspective view which shows the solder jet part of the state with which the jet nozzle with a big lead diameter was mounted | worn. It is the schematic which shows the state in which the molten solder is jetted toward a lead | read | reed by the jet nozzle with a large nozzle diameter.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Configuration of component mounter>
FIG. 1 shows a component mounter 10. The component mounter 10 is a device for performing a component mounting operation on the circuit substrate 12. The component mounting machine 10 includes an apparatus main body 20, a substrate conveyance holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a component supply device 30, a loose component supply device 32, a display device 34, a soldering device (FIG. 3) 36 and a control device (see FIG. 6) 38. The circuit substrate 12 includes a circuit board, a three-dimensional structure substrate, and the like, and the circuit board includes a printed wiring board and a printed circuit board.

The apparatus main body 20 includes a frame portion 40 and a beam portion 42 that is overlaid on the frame portion 40. The substrate conveyance holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction, and includes a conveyance device 50 and a clamp device 52. The conveyance device 50 is a device that conveys the circuit substrate 12, and the clamp device 52 is a device that holds the circuit substrate 12. Thereby, the base material transport and holding device 22 transports the circuit base material 12 and holds the circuit base material 12 fixedly at a predetermined position. In the following description, the conveyance direction of the circuit substrate 12 is referred to as an X direction, a horizontal direction perpendicular to the direction is referred to as a Y direction, and a vertical direction is referred to as a Z direction. That is, the width direction of the component mounting machine 10 is the X direction, and the front-rear direction is the Y direction.

The component mounting device 24 is disposed in the beam portion 42 and includes two

work heads

60 and 62 and a work head moving device 64. As shown in FIG. 2, a suction nozzle 66 is provided at the lower end surface of each

work head

60, 62, and the suction nozzle 66 holds and holds the components. The work head moving device 64 includes an X direction moving device 68, a Y direction moving device 70, and a Z direction moving device 72. Then, the two

working heads

60 and 62 are integrally moved to arbitrary positions on the frame portion 40 by the X-direction moving device 68 and the Y-direction moving device 70. The

work heads

60 and 62 are detachably attached to the

sliders

74 and 76, and the Z-direction moving device 72 individually moves the

sliders

74 and 76 in the vertical direction. That is, the

work heads

60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.

The mark camera 26 is attached to the slider 74 so as to face downward, and is moved together with the work head 60 in the X direction, the Y direction, and the Z direction. As a result, the mark camera 26 images an arbitrary position on the frame unit 40. As shown in FIG. 1, the parts camera 28 is disposed between the base material conveyance holding device 22 and the component supply device 30 on the frame portion 40 so as to face upward. Thereby, the parts camera 28 images the parts gripped by the suction nozzles 66 of the

work heads

60 and 62.

The component supply device 30 is disposed at one end of the frame portion 40 in the front-rear direction. The component supply device 30 includes a tray-type component supply device 78 and a feeder-type component supply device (see FIG. 6) 80. The tray-type component supply device 78 is a device that supplies components placed on the tray. The feeder-type component supply device 80 is a device that supplies components by a tape feeder or a stick feeder (not shown).

The bulk component supply device 32 is disposed at the other end portion of the frame portion 40 in the front-rear direction. The separated component supply device 32 is a device for aligning a plurality of components scattered in a separated state and supplying the components in an aligned state. That is, it is an apparatus that aligns a plurality of components in an arbitrary posture into a predetermined posture and supplies the components in a predetermined posture. A display device 34 is disposed at the end of the bulk component supply device 32. The display device 34 displays information related to component mounting work by the component mounter 10.

In addition, examples of components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components and power module components. Electronic circuit components include components having leads and components not having leads.

The soldering device 36 is disposed below the conveying device 50, and includes a jet device 100 and a jet device moving device 102 as shown in FIG. The jet device 100 includes a solder reservoir 106 and a solder jet 108. The solder reservoir 106 has a generally rectangular parallelepiped shape, and molten solder is stored therein. The solder jet portion 108 is disposed on the upper surface of the solder reservoir portion 106, and includes a cover 110, a partition tube 112, and a jet tube 114 as shown in FIGS.

The cover 110 is generally cylindrical, and the upper end of the cover 110 is tapered so that the diameter decreases toward the top. In addition, the outer diameter of the partition cylinder 112 is smaller than the inner diameter of the cover 110 and is erected inside the cover 110. Note that the upper end of the partition tube 112 is positioned below the upper end of the cover 110. Further, the outer diameter of the jet cylinder 114 is smaller than the inner diameter of the partition cylinder 112, and stands upright inside the partition cylinder 112. The upper end of the jet cylinder 114 is located above the upper end of the cover 110 and is exposed from the upper end of the cover 110.

With such a structure, in the jet device 100, the molten solder is pumped upward from the upper end portion of the jet cylinder 114 by pumping up the molten solder from the solder reservoir 106 by the operation of the pump (see FIG. 6) 116. Jet. Then, the molten solder jetted from the upper end portion of the jet cylinder 114 passes between the outer peripheral surface of the jet cylinder 114 and the inner peripheral surface of the partition cylinder 112 and returns to the inside of the solder reservoir 106.

Further, the jet device 100 includes a gas supply device (see FIG. 6) 118, and nitrogen is supplied between the inner peripheral surface of the cover 110 and the outer peripheral surface of the partition tube 112 by the gas supply device 118. The As a result, nitrogen is ejected from between the upper end of the cover 110 and the upper end of the partition cylinder 112 toward the molten solder jetting from the upper end of the jet cylinder 114, thereby preventing oxidation of the molten solder jetting. .

The jet cylinder 114 includes a support cylinder 120 and a jet nozzle 122, and the jet nozzle 122 is detachably attached to the support cylinder 120. Specifically, the support cylinder 120 is erected inside the partition cylinder 112, and a female screw is formed on the inner peripheral surface of the upper end portion of the support cylinder 120. On the other hand, a male screw is formed on the outer peripheral surface of the lower end portion of the jet nozzle 122. Then, the operator engages the male screw of the jet nozzle 122 with the female screw of the support cylinder 120, so that the jet nozzle 122 is attached to the support cylinder 120. Further, the screw nozzle 122 is removed from the support cylinder 120 by the operator releasing the screwing of the male screw of the jet nozzle 122 to the female thread of the support cylinder 120. In the jet device 100, a plurality of jet nozzles 122 having different nozzle diameters are prepared, and any of the plurality of jet nozzles 122 having different nozzle diameters can be mounted on the support cylinder 120. It is possible.

As shown in FIG. 3, the jet device moving device 102 includes a slider 130, an X direction moving device 132, a Y direction moving device 134, and a Z direction moving device 136. The slider 130 is generally plate-shaped, and the jet device 100 is disposed on the upper surface of the slider 130. The X-direction moving device 132 moves the slider 130 in the conveying direction of the circuit substrate 12 by the conveying device 50, that is, the X direction, and the Y-direction moving device 134 moves the slider 130 in the Y direction. Further, the Z direction moving device 136 moves the slider 130 in the Z direction, that is, in the up and down direction. Accordingly, the jet device 100 moves to an arbitrary position below the transport device 50 by the operation of the jet device moving device 102.

The control device 38 includes a controller 152, a plurality of drive circuits 154, an image processing device 156, and a control circuit 158 as shown in FIG. The plurality of drive circuits 154 include the transport device 50, the clamp device 52, the work heads 60 and 62, the work head moving device 64, the tray-type component supply device 78, the feeder-type component supply device 80, the bulk component supply device 32, and the pump 116. The gas supply device 118 and the jet device moving device 102 are connected. The controller 152 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 154. As a result, the operations of the substrate conveyance holding device 22 and the component mounting device 24 are controlled by the controller 152. The controller 152 is also connected to the image processing device 156. The image processing device 156 processes image data obtained by the mark camera 26 and the part camera 28, and the controller 152 acquires various types of information from the image data. Further, the controller 152 is connected to the display device 34 via the control circuit 158, and a predetermined image is displayed on the display device 34 by the controller 152.

<Operation of component mounter>
In the component mounter 10, the component mounting operation is performed on the circuit substrate 12 held by the substrate conveyance holding device 22 with the above-described configuration. In the component mounting machine 10, various components can be mounted on the circuit substrate 12, but a component having a lead (hereinafter, may be abbreviated as “lead component”) is used as the circuit substrate 12. The case of mounting will be described below.

Specifically, the circuit substrate 12 is transported to the working position, and is fixedly held by the clamp device 52 at that position. Next, the mark camera 26 moves above the circuit substrate 12 and images the circuit substrate 12. Thereby, the information regarding the holding position etc. of the circuit base material 12 is obtained. Further, the component supply device 30 or the bulk component supply device 32 supplies lead components at a predetermined supply position. Then, one of the work heads 60 and 62 moves above the component supply position, and holds the component by the suction nozzle 66. As shown in FIG. 7, the lead component 140 includes a component main body 142 and two leads 144 extending from the bottom surface of the component main body 142. The lead component 140 is sucked and held by the suction nozzle 66 on the surface of the component main body 142 opposite to the surface on which the lead 144 extends.

Subsequently, the work heads 60 and 62 holding the lead component 140 move above the parts camera 28, and the lead component 140 held by the suction nozzle 66 is imaged by the parts camera 28. As a result, information on the holding position of the component can be obtained. Subsequently, the work heads 60 and 62 holding the lead component 140 move above the circuit substrate 12 to correct an error in the holding position of the circuit substrate 12, an error in the holding position of the component, and the like. Then, the lead 144 of the lead component 140 sucked and held by the suction nozzle 66 is inserted into the through hole 148 formed in the circuit substrate 12. At this time, the jet device 100 is moved below the through hole 148. Then, molten solder is jetted from the jet nozzle 122 of the jet device 100 toward the lead 144 inserted into the through hole 148. As a result, the lead component 140 with the lead 144 inserted into the through hole 148 is soldered to the circuit substrate 12.

<Replacing the jet nozzle>
As described above, in the component mounting machine 10, the molten solder is jetted from the jet nozzle 122 toward the lead 144, whereby the lead component 140 is soldered to the circuit substrate 12. At this time, as shown in FIG. 7, it is preferable to solder a pair of leads 144 of the lead component 140 simultaneously. However, as shown in FIG. 8, the lead component 140 includes a lead component 140 in which the distance between the pair of leads 144 is relatively long. When soldering to such a lead component 140, in the jet nozzle 122 having a small nozzle diameter, if the distance between the pair of leads 144 is longer than the nozzle diameter, the pair of leads 144 are soldered simultaneously. I can't do it. For this reason, soldering is performed on one lead 144 of the pair of leads 144 (solid line), and then, the other lead of the pair of leads 144 is moved by moving the jet device 100. Soldering is performed on 144 (dotted line). However, if soldering is performed for each lead 144 as described above, the efficiency is low.

Therefore, when soldering is performed on the lead component 140 having a relatively long distance between the pair of leads 144, it is preferable to use the jet nozzle 122 having a large nozzle diameter. Therefore, as shown in FIG. 9, a jet nozzle 122 having a large nozzle diameter is attached to the support cylinder 120 instead of the jet nozzle 122 having a small nozzle diameter. Thus, by performing soldering with the jet nozzle 122 having a large nozzle diameter, even if the lead component 140 has a relatively long distance between the pair of leads 144 as shown in FIG. The leads 144 can be soldered simultaneously. On the other hand, when a plurality of components are mounted in a relatively narrow region of the circuit substrate 12, using the jet nozzle 122 having a large nozzle diameter, solder is applied to a place where soldering is unnecessary, or the jet nozzle There is a possibility that problems such as interference of 122 with some member may occur.

In view of the above, for each circuit base 12 to be produced, the distance between the pair of leads 144 of the lead component 140 attached to the circuit base 12 and the plan to be attached to the circuit base 12 The optimum nozzle diameter is calculated in advance in consideration of the component arrangement, and the type of jet nozzle 122 having the nozzle diameter is set in advance. Then, the worker attaches the preset type of jet nozzle (hereinafter, may be referred to as “setting nozzle”) to the support cylinder 120, and the component mounting machine 10 supplies the component to the circuit substrate 12. The mounting work is executed. As a result, it is possible to efficiently perform soldering without causing problems such as application of solder to places where soldering is unnecessary and interference with any member of the jet nozzle 122.

However, since the operator attaches the jet nozzle 122 to the support cylinder 120, when the jet nozzle 122 different from the setting nozzle is attached to the support cylinder 120, the operator may forget to replace the jet nozzle 122. . In other words, due to a human error, the mounting operation to the circuit substrate 12 may be performed in a state where the jet nozzle 122 of a different type from the set nozzle is mounted on the support cylinder 120. In such a case, soldering is performed by the jet nozzle 122 having a nozzle diameter different from the planned nozzle diameter, so that solder is applied to a portion where soldering is not necessary, and any member of the jet nozzle 122 is applied. There is a possibility that problems such as interference may occur. Not only such a problem, solder cannot be jetted to an appropriate location, and there may be a problem in soldering.

In view of such a situation, in the component mounting machine 10, whether or not the mounting nozzle is appropriate is determined by imaging a jet nozzle (hereinafter sometimes referred to as “mounting nozzle”) mounted on the support cylinder 120. . Specifically, the mark camera 26 moves above the jet device 100 and images the jet nozzle 122 mounted on the support cylinder 120 in a state where the circuit base material 12 is not conveyed. Then, the controller 152 recognizes the outer edge of the jet nozzle 122 based on the imaged image data, that is, the image data of the jet nozzle 122 from the viewpoint from above, and the outer diameter of the jet nozzle 122, that is, the mounting nozzle. The outer diameter is calculated. On the other hand, the controller 152 stores a nozzle diameter in consideration of an error in the outer diameter of the set nozzle (hereinafter sometimes referred to as “set nozzle diameter”).

Then, the controller 152 determines whether or not the calculated outer diameter of the mounted nozzle is within the set nozzle diameter. At this time, if the calculated outer diameter of the mounting nozzle is within the range of the set nozzle diameter, a screen indicating that the mounting nozzle is the setting nozzle is displayed on the display device 34, and the circuit base is set according to the above-described procedure. A mounting operation to the material 12 is performed. On the other hand, when the calculated outer diameter of the mounting nozzle is not within the range of the set nozzle diameter, the mounting work on the circuit substrate 12 is not executed, indicating that the mounting nozzle is not the setting nozzle and setting the mounting nozzle. A screen that prompts the user to replace the nozzle is displayed on the display device 34. Note that an OK button (not shown) is displayed on the screen, and the operator operates the OK button after replacing the jet nozzle 122. When the OK button is operated, the suitability of the mounting nozzle is determined again by imaging the jet nozzle mounted on the support cylinder 120, and the calculated outer diameter of the mounting nozzle is within the set nozzle diameter range. In such a case, the mounting operation to the circuit substrate 12 is executed. As a result, it is possible to prevent the occurrence of a human error such as a mounting error of the jet nozzle 122 and to ensure proper soldering. The determination of the suitability of the mounting nozzle described above is performed every time the type of the circuit substrate 12 to be mounted is changed, and every time the mounting operation to the predetermined number of circuit substrates 12 is executed. It is executed at various timings such as every hour and every time production in a factory is started.

Further, in the component mounter 10, the mounting nozzle is imaged by the mark camera 26, and the outer diameter of the mounting nozzle is calculated based on the imaging data. As a result, it is possible to determine the suitability of the mounting nozzle using existing equipment, and it is possible to suppress new equipment investment and the like.

In addition, when the jet nozzle 122 mounted on the support cylinder 120 is imaged from a viewpoint from above, the side surface of the jet nozzle 122 and the like cannot be recognized based on the imaging data, and the upper end surface of the jet nozzle 122 That is, only the nozzle opening can be recognized. The surface area of the upper end surface of the jet nozzle 122 is usually small, and it is difficult to write an identification symbol for identifying the type of the jet nozzle 122 on the upper end surface. In addition, investment is required. Even when the identification symbol is written on the upper end surface of the jet nozzle 122, it is difficult to recognize the identification symbol because the identification symbol is stained by the jetted molten solder. In view of the above, in the component mounting machine 10, the nozzle diameter is calculated based on the imaging data of the mounting nozzle, and the suitability of the mounting nozzle is determined using the calculated nozzle diameter. Accordingly, it is not necessary to force an identification symbol on the upper end surface of the small jet nozzle 122, and the existing jet nozzle 122 can be used, and new investment can be suppressed. Even if the nozzle opening of the jet nozzle 122 is dirty, it is possible to determine whether the mounting nozzle is appropriate or not by checking the nozzle diameter of the mounting nozzle.

In addition, the controller 152 of the control apparatus 38 has the acquisition part 160 and the determination part 162, as shown in FIG. The acquisition unit 160 is a functional unit for acquiring the nozzle diameter of the mounting nozzle based on the imaging data. The determination unit 162 is a functional unit for determining the suitability of the mounting nozzle based on the nozzle diameter of the mounting nozzle and the set nozzle diameter.

Incidentally, the control device 38 is an example of a control device. The jet device 100 is an example of a jet device. The support cylinder 120 is an example of a mounting portion. The jet nozzle 122 is an example of a jet nozzle. The acquisition unit 160 is an example of an acquisition unit. The determination unit 162 is an example of a determination unit. The nozzle diameter of the jet nozzle 122 is an example of identification information.

In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the present invention is applied to the jet device 100 that jets molten solder, but the present invention can be applied to jet devices that jet various liquids. Specifically, for example, the present invention is applied to various devices such as a cleaning device for jetting a cleaning liquid, a device for jetting molten resin and forming an insulating layer, and a device for jetting flux and applying flux. It is possible to apply.

In the above embodiment, the outer diameter of the jet nozzle 122 is adopted as identification information that can identify the type of the jet nozzle 122, but the inner diameter of the jet nozzle 122 may be adopted. Moreover, it is not restricted to the nozzle diameter of the jet nozzle 122, You may employ | adopt identification symbols, such as 2D code | cord | chord.

In the above embodiment, identification information such as the nozzle diameter of the jet nozzle 122 is acquired based on the imaging data, but the identification information may be acquired by various methods. For example, a storage medium that stores identification information may be provided in the jet nozzle 122, and the identification information may be acquired from the storage medium. Specifically, for example, when the jet nozzle 122 is mounted on the support cylinder 120, the support cylinder 120 and the jet nozzle 122 are electrically connected, and identification information is acquired from the storage medium. Also good. Further, the identification information may be acquired from the storage medium by a sensor or the like. Further, identification information may be acquired from the storage medium by short-range wireless communication using RFID (abbreviation of Radio Frequency IDentification) or the like.

In the above embodiment, the set nozzle diameter is stored in the controller 152, but the nozzle diameter corresponding to the set nozzle diameter is set to the lead pitch of the lead component 140, the lead diameter, and the component to be mounted on the circuit substrate 12. You may calculate based on arrangement | positioning etc. Then, by comparing and determining using the calculated nozzle diameter and the recognized nozzle diameter, it is possible to achieve an effect equivalent to the above effect.

38: Control device 100: Jet device 120: Support cylinder (mounting part) 122: Jet nozzle 160: Acquisition unit 162: Determination unit

Claims

A jet device for jetting liquid upward,
The jet device is
A jet nozzle for jetting liquid;
A mounting portion on which the jet nozzle is detachably mounted;
A control device, and
The control device is
An acquisition unit for acquiring identification information capable of identifying the type of the jet nozzle mounted on the mounting unit;
A jet device comprising: a determination unit that determines whether or not the identification information acquired by the acquisition unit is the same as preset identification information.
The acquisition unit
The jet apparatus according to claim 1, wherein identification information is acquired based on imaging data obtained by imaging the jet nozzle mounted on the mounting unit.
The identification information is
The jet apparatus according to claim 1, wherein the jet diameter is a nozzle diameter of the jet nozzle.