WO2018116397A1

WO2018116397A1 - Working machine and soldering method

Info

Publication number: WO2018116397A1
Application number: PCT/JP2016/088058
Authority: WO
Inventors: 康博手島
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2016-12-21
Filing date: 2016-12-21
Publication date: 2018-06-28
Also published as: JP6714730B2; JPWO2018116397A1

Abstract

Disclosed is a substrate working system 10 wherein, in a first working machine 12, a lead is inserted into a through hole of a circuit board 44, and a lead component is mounted on the circuit board. Then, the circuit board is carried into a second working machine 14. Then, in the second working machine, soldering is performed by means of a soldering device 34 in a state wherein the lead component having been mounted in the first working machine is pressed by means of a suction nozzle 70. Consequently, in the second working machine, the lead component having been mounted outside of the machine can be suitably soldered in a state wherein component floating is eliminated.

Description

Working machine and soldering method

The present invention relates to a working machine capable of soldering to a lead inserted into a through hole of a circuit board.

There are working machines that perform soldering on the leads inserted into the through holes of the circuit board. The following patent document describes an example of such a working machine.

International Publication No. 2016/56045

In the working machine described in the above-mentioned patent document, the lead component is mounted on the substrate by the working machine, and soldering is performed on the lead of the mounted lead part. However, it is desired to be soldered to the lead of the lead component mounted in various manners. This invention is made | formed in view of such a situation, and makes it a subject to solder to the lead | lead | lead of the lead components with which it was mounted | worn with various aspects.

In order to solve the above-described problem, the present specification includes a pressing device that presses a lead component in a state in which a lead is inserted into a through-hole formed in a substrate toward the substrate, and the above-described insert inserted into the through-hole. A soldering device for soldering to a lead, and soldering by the soldering device in a state where the inserted component, which is the lead component in which the lead is inserted into the through hole outside the machine, is pressed by the pressing device. A working machine including a control device that controls the operation of the pressing device and the soldering device is disclosed.

In order to solve the above problems, the present specification includes a pressing device that presses a lead component in a state in which a lead is inserted into a through hole formed in the substrate toward the substrate, and is inserted into the through hole. And a soldering method for performing soldering work on the lead, wherein the lead is inserted into the through hole of the substrate outside the work machine. An insertion step for inserting the substrate, a loading step for loading the substrate into which the lead has been inserted in the insertion step, and a through hole of the substrate for the substrate loaded in the loading step. A soldering step of performing soldering by the soldering device in a state where the lead component into which the lead is inserted is pressed by the pressing device. It discloses a soldering method.

According to the present disclosure, it is possible to appropriately perform soldering in a state where the component floating is prevented with respect to the lead component mounted outside the work machine that performs the soldering operation.

It is a top view which shows a substrate working system It is a perspective view which shows a soldering apparatus. It is a block diagram which shows a control apparatus. It is the schematic which shows the lead | read | reed components with which the 1st working machine was mounted | worn. It is the schematic which shows the lead component soldered in a 2nd working machine.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

(A) Configuration of an on-board working system FIG. 1 shows an on-board working system 10 according to an embodiment of the present invention. The on-board working system 10 is a system for mounting electronic components on a circuit board. The substrate work system 10 includes a first work machine 12 and a second work machine 14, and the second work machine 14 is disposed on the downstream side of the first work machine 12. In the following description, the arrangement direction of the first work machine 12 and the second work machine 14 is referred to as the X direction, the horizontal direction perpendicular to the direction is referred to as the Y direction, and is perpendicular to the X direction and the Y direction. The direction is referred to as the Z direction.

The second work machine 14 includes a transport device 20, a mounting head moving device (hereinafter sometimes abbreviated as “moving device”) 22, a mounting head 24, a supply device 26, a parts camera 28, and a mark camera 30. And a nozzle station 32 and a soldering device 34.

The conveying device 20 includes a pair of conveyor belts 40 extending in the X direction and an electromagnetic motor (see FIG. 3) 42 that rotates the conveyor belt 40. The circuit board 44 is supported by the pair of conveyor belts 40 and is conveyed in the X direction by driving of the electromagnetic motor 42. Further, the transfer device 20 includes a substrate holding device (see FIG. 3) 46. The board holding device 46 holds the circuit board 44 supported by the conveyor belt 40 at a predetermined position (a position where the circuit board 44 in FIG. 1 is illustrated).

The moving device 22 includes an X-direction slide mechanism 50 and a Y-direction slide mechanism 52. The X direction slide mechanism 50 has an X slider 56 provided on the base 54 so as to be movable in the X direction. The X slider 56 is moved to an arbitrary position in the X direction by driving an electromagnetic motor 58 (see FIG. 3). The Y-direction slide mechanism 52 has a Y-slider 60 provided on the side surface of the X-slider 56 so as to be movable in the Y-direction. The Y slider 60 moves to an arbitrary position in the Y direction by driving an electromagnetic motor (see FIG. 3) 62. The mounting head 24 is attached to the Y slider 60. With such a structure, the mounting head 24 is moved to an arbitrary position on the base 54 by the moving device 22.

The mounting head 24 mounts electronic components on the circuit board. The mounting head 24 has a suction nozzle 70 provided on the lower end surface. The suction nozzle 70 communicates with a positive / negative pressure supply device (see FIG. 3) 76 through negative pressure air and positive pressure air passages. The suction nozzle 70 sucks and holds the electronic component with a negative pressure, and releases the held electronic component with a positive pressure. The mounting head 24 has a nozzle lifting / lowering device (see FIG. 3) 78 that lifts and lowers the suction nozzle 70. The mounting head 24 changes the vertical position of the electronic component to be held by the nozzle lifting device 78. The suction nozzle 70 can be attached to and detached from the mounting head 24.

The supply device 26 is a feeder type supply device, and has a plurality of tape feeders 82. The tape feeder 82 accommodates the taped component in a wound state. The taped component is a taped electronic component. Then, the tape feeder 82 feeds out the taped parts by a feeding device 86 (see FIG. 3). Thereby, the feeder type supply device 26 supplies the electronic component at the supply position by feeding the taped component.

The parts camera 28 is disposed between the transport device 20 and the supply device 26 so as to face upward. Thereby, the part camera 28 images the electronic component held by the suction nozzle 70 by moving the mounting head 24 above the part camera 28. Further, the mark camera 30 is fixed to the Y slider 60 of the moving device 22 so as to face downward, and is moved to an arbitrary position by the operation of the moving device 22. Thereby, the mark camera 30 images an arbitrary position on the base 54.

The nozzle station 32 is disposed next to the parts camera 28 between the transport device 20 and the supply device 26. The nozzle station 32 has a nozzle tray 90, and a plurality of storage portions 92 for storing the suction nozzles 70 are formed in the nozzle tray 90. In the nozzle station 32, the suction nozzle 70 mounted on the mounting head 24 and the suction nozzle 70 housed in the housing portion 92 of the nozzle tray 90 are exchanged. That is, any suction nozzle 70 among the plurality of suction nozzles 70 can be mounted on the mounting head 24.

The soldering device 34 is disposed below the conveying device 20 and includes a jet device 100 and a jet device moving device 102 as shown in FIG. The jet device 100 includes a soldering iron 106, a jet nozzle 108, and a nozzle cover 110. The solder rod 106 has a generally rectangular parallelepiped shape, and molten solder is stored therein. The jet nozzle 108 is erected on the upper surface of the soldering iron 106. Then, by the operation of the pump (see FIG. 3) 111, the molten solder is pumped up from the solder iron 106, and the molten solder is jetted upward from the upper end portion of the jet nozzle 108. The nozzle cover 110 is generally cylindrical and is disposed on the upper surface of the soldering iron 106 so as to surround the jet nozzle 108. Then, the molten solder jetted from the upper end portion of the jet nozzle 108 passes between the outer peripheral surface of the jet nozzle 108 and the inner peripheral surface of the nozzle cover 110 and returns to the inside of the solder rod 106.

The jet device moving device 102 includes a slider 112, an X direction moving device 114, a Y direction moving device 116, and a Z direction moving device 118. The slider 112 is generally plate-shaped, and the jet device 100 is disposed on the upper surface of the slider 112. The X-direction moving device 114 moves the slider 112 in the conveyance direction of the circuit board 44 by the conveying device 20, that is, the X direction, and the Y-direction moving device 116 moves the slider 112 in the Y direction. Further, the Z-direction moving device 118 moves the slider 112 in the Z direction, that is, the up-down direction. Accordingly, the jet device 100 moves to an arbitrary position below the transport device 20 by the operation of the jet device moving device 102.

Further, the first working machine 12 has the same structure as the second working machine 14 except that the first working machine 12 is not provided with the soldering device 34. That is, the first work machine 12 includes a transport device 120, a moving device 122, a mounting head 124, a supply device 126, a parts camera 128, a mark camera 130, and a nozzle station 132, The device 120, the moving device 122, the mounting head 124, the supply device 126, the parts camera 128, the mark camera 130, and the nozzle station 132 are the transport device 20, the moving device 22, the mounting head 24, the supply device 26, the second work machine 14. The parts camera 28, the mark camera 30, and the nozzle station 32 have the same structure. For this reason, description of the conveying device 120, the moving device 122, the mounting head 124, the supply device 126, the parts camera 128, the mark camera 130, and the nozzle station 132 is omitted.

Further, the substrate work system 10 includes a control device 140 as shown in FIG. The control device 140 includes a controller 142, a plurality of drive circuits 144, and an image processing device 146. The plurality of drive circuits 144 are connected to the

electromagnetic motors

42, 58, 62, the substrate holding device 46, the positive / negative pressure supply device 76, the nozzle lifting / lowering device 78, the feeding device 86, the jet flow device moving device 102, and the pump 111 of each working machine. Has been. The controller 142 includes a CPU, a ROM, a RAM, and the like, is mainly a computer, and is connected to a plurality of drive circuits 144. Thereby, the operation of the transfer device 20 and the moving device 22 of each work machine is controlled by the controller 142. The controller 142 is also connected to the image processing device 146. The image processing device 146 is a device for processing image data captured by the parts camera 128 and the mark camera 130 of each work machine. Thereby, the controller 142 acquires various types of information from the imaging data. The controller 142 has a storage area 148, and controls the operation of various devices based on information stored in the storage area 148.

(B) Operation of Board-to-Board Work System In the board-to-board work system 10, an electronic component is mounted on the circuit board 44 with the above-described configuration. In the on-board working system 10, various electronic components can be mounted on the circuit board 44, but a component having a lead (hereinafter may be abbreviated as “lead component”) is provided on the circuit substrate 44. The case of mounting will be described below.

Specifically, the circuit board 44 is carried into the first work machine 12 and is carried to the work position by the transfer device 120 of the first work machine 12. At that position, the substrate is held by the substrate holding device 46 of the transfer device 120. Next, the mark camera 130 moves above the circuit board 44 and images the circuit board 44. Thereby, information regarding the holding position of the circuit board 44 and the like is obtained. Further, the supply device 126 supplies lead components at a predetermined supply position. Then, the mounting head 124 moves above the component supply position and holds the component by the suction nozzle (see FIG. 4) 150 of the mounting head 124. As shown in FIG. 4, the lead component 160 is composed of a component main body 162 and two leads 164 extending from the bottom surface of the component main body 162. The lead component 160 is sucked and held by the suction nozzle 150 on the surface opposite to the bottom surface of the component main body 162.

Subsequently, the mounting head 124 holding the lead component 160 moves above the part camera 128, and the lead component 160 held by the suction nozzle 150 is imaged by the part camera 128. Thereby, the position coordinate in the XY direction of the tip of the lead 164 of the lead component 160 is calculated. Then, the operation of the moving device 122 is controlled so that the position coordinate in the XY direction of the through-hole (see FIG. 4) 168 formed in the circuit board 44 coincides with the position coordinate in the XY direction of the tip of the lead 164. The As a result, the suction nozzle 150 holding the lead component 160 moves above the through hole 168 of the circuit board 44, and the through hole 168 and the tip of the lead 164 coincide in the vertical direction. Note that the position coordinates of the through holes 168 in the XY directions are stored in the storage area 148 of the controller 142, and the stored position coordinates of the through holes 168 are corrected based on information on the holding position of the circuit board 44 and the like. Is done. Then, based on the corrected position coordinates of the through hole 168, the operation of the moving device 122 is controlled.

Subsequently, the operation of the nozzle lifting device 78 is controlled and the suction nozzle 150 is lowered, so that the lead 164 of the lead component 160 is inserted into the through hole 168 as shown in FIG. The suction nozzle 150 moves down and stops until the upper surface of the circuit board 44 comes into contact with the bottom surface of the component main body 162 of the lead component 160. As a result, the lead component 160 is mounted on the circuit board 44 with the lead 164 inserted into the through hole 168. When the mounting operation of the lead component 160 is completed, the transfer device 120 is operated, and the circuit board 44 on which the lead component 160 is mounted is unloaded from the first work machine 12.

At this time, the circuit board 44 carried out from the first work machine 12 is carried into the second work machine 14 and is carried to the work position by the transfer device 20 of the second work machine 14. At that position, a lead component (hereinafter referred to as “inserted component”) that is held by the substrate holding device 46 of the transfer device 20 and the lead 164 is inserted into the through hole 168 of the circuit board 44 by the first work machine 12. Soldering is performed at 160.

Specifically, the storage area 148 of the controller 142 stores information related to the soldering work for the inserted component 160 in the second work machine 14 (hereinafter, sometimes described as “soldering work information”). . In the soldering work information, information on the inserted component 160 (hereinafter may be described as “component information”), information on the suction nozzle corresponding to the inserted component 160 (hereinafter, “component compatible nozzle information”, and And information on soldering conditions at the time of soldering the inserted component 160 (hereinafter may be referred to as “condition information”).

The part information includes the mounting position of the inserted part 160 mounted by the first work machine 12, the size and shape of the inserted part 160, and the like. The component-corresponding nozzle information is information for specifying the suction nozzle 70 used during the soldering operation, and is set according to the size, shape, and the like of the inserted component 160. Specifically, for example, a suction nozzle 70 having a large nozzle diameter is set for the inserted component 160 having a large size, and a suction nozzle 70 having a small nozzle diameter is set for the inserted component 160 having a small size. Is set. The condition information includes the soldering time at the time of soldering, the approach / separation speed of the jet device 100 at the time of soldering, the height of the jet nozzle 108 of 108 at the time of soldering, and the like. Note that the soldering work information can be changed. By changing the soldering work information, the suction nozzle 70 used during the soldering work can be changed, the soldering conditions can be changed, and the like.

In the second working machine 14 into which the circuit board 44 with the inserted component 160 mounted is carried in, before the soldering operation for the inserted component 160 is executed, the suction nozzle 70 corresponding to the component corresponding nozzle information is The station 32 is mounted on the mounting head 24. When the circuit board 44 is held at the work position, the mark camera 30 moves above the circuit board 44 and images the circuit board 44. Thereby, information regarding the holding position of the circuit board 44 and the like is obtained. The mounting position of the inserted component 160 included in the component information is corrected based on information related to the holding position of the circuit board 44, and the suction nozzle 70 is located above the corrected mounting position of the inserted component 160. Moved.

When the suction nozzle 70 moves above the inserted part 160, it is lowered by the nozzle lifting device 78. Thereby, as shown in FIG. 5, the tip of the suction nozzle 70 comes into contact with the upper surface of the component main body 162 of the inserted component 160. At this time, the operation of the nozzle elevating device 78 is controlled so that the suction nozzle 70 presses the component main body 162 toward the circuit board 44 with a predetermined force.

Since the suction nozzle 70 corresponds to the component-corresponding nozzle information, if the inserted component 160 has a large size, the suction nozzle 70 is pressed by the suction nozzle 70 having a large nozzle diameter, and the inserted component has a small size. If it is 160, it is pressed by the suction nozzle 70 having a small nozzle diameter. That is, for each inserted component 160, a predetermined suction nozzle 70 among the plurality of suction nozzles 70 used in the second work machine 14 is associated according to the size and shape of the inserted component 160, and the association is made. The inserted part 160 is pressed down by the suction nozzle 70 that has been placed. As a result, the inserted component 160 can be suitably pressed down.

Also, below the circuit board 44, the operation of the jet device moving device 102 is controlled so that the jet device 100 moves below the lead 164 inserted into the through hole 168. Even when the jet flow device 100 is moved, the mounting position of the inserted component 160 included in the component information is corrected based on the information regarding the holding position of the circuit board 44, as in the movement of the mounting head 24. Based on the corrected mounting position of the inserted component 160, the operation of the jet device moving device 102 is controlled.

Next, when the jet device 100 moves below the lead 164 of the inserted part 160, the soldering operation is performed on the lead 164 of the inserted part 160 held by the suction nozzle 70. Specifically, in the soldering device 34, molten solder is jetted from the jet nozzle 108, and the jet device 100 is raised at the approach speed included in the condition information. As a result, the jet nozzle 108 approaches the lead 164 and the molten solder is jetted toward the lead 164. At this time, the jet device 100 is raised to a distance corresponding to the height of the jet nozzle 108 included in the condition information. Then, molten solder is jetted toward the lead 164 during the soldering time included in the condition information. That is, the state where the molten solder is jetted toward the lead 164, that is, the state where the jet device 100 is raised to a predetermined height is maintained for the soldering time included in the condition information. Subsequently, the jet device 100 is lowered at the separation speed included in the condition information. Thereby, the jet nozzle 108 is separated from the lead 164, and the soldering operation of the inserted component 160 to the circuit board 44 is completed. When the soldering operation is completed, the suction nozzle 70 is raised, and the pressing of the inserted component 160 is released.

As described above, in the soldering work in the second working machine 14, since the molten solder is jetted toward the lead 164, the component floating is likely to occur, but the inserted component 160 is pressed by the suction nozzle 70. , Parts floating is prevented. As a result, the inserted component 160 mounted on the first work machine 12 can be appropriately soldered to the circuit board 44 in the second work machine 14.

Further, the second work machine 14 may perform not only the soldering work on the inserted part 160 mounted on the first work machine 12 but also the soldering work on the lead part 160 mounted on the second work machine 14. Is possible. That is, it is possible to perform not only the soldering operation on the inserted component 160 mounted outside the machine but also the soldering operation on the lead component 160 mounted in the machine.

In addition, in the soldering operation for the lead component 160 mounted in the machine, the mounting work similar to the mounting work in the first work machine 12 is performed by the second work machine 14 and soldering is performed by the soldering device 34. This will be briefly described below. In the second work machine 14, the supply device 26 supplies the lead component 160 at a predetermined supply position. The lead component 160 is held by the suction nozzle 70 of the mounting head 24, and the lead component 160 is imaged by the parts camera 28. Thereby, the position coordinate in the XY direction of the tip of the lead 164 of the lead component 160 is calculated. Then, the operation of the moving device 22 is controlled so that the position coordinate in the XY direction of the through-hole 168 formed in the circuit board 44 matches the position coordinate in the XY direction of the tip of the lead 164.

Subsequently, the operation of the nozzle elevating device 78 is controlled, and the suction nozzle 70 is lowered, whereby the lead 164 of the lead component 160 is inserted into the through hole 168 as shown in FIG. The suction nozzle 70 is lowered until the upper surface of the circuit board 44 comes into contact with the bottom surface of the component main body 162 of the lead component 160, and the lead component 160 is pressed by the suction nozzle 70 with a predetermined force. At this time, below the circuit board 44, the jet device 100 is moved below the lead 164 inserted into the through hole 168. Then, molten solder is jetted from the tip of the jet nozzle 108 toward the lead 164. Even when the molten solder is jetted toward the lead 164, the lead component 160 is pressed by the suction nozzle 70. That is, a soldering operation is performed on the lead 164 of the lead component 160 that is pressed by the suction nozzle 70. As a result, the lead component 160 mounted in the machine is soldered in a state in which the component floating is prevented, similarly to the inserted component 160 mounted outside the machine.

As described above, in the second work machine 14, the soldering work for the inserted part 160 mounted outside the machine and the soldering work for the lead part 160 mounted in the machine are performed. Also, the inserted part 160 or the lead part 160 is pressed by the suction nozzle 70. As a result, it is possible to prevent component floating during solder jetting for all components to be soldered in the second working machine 14, and to ensure proper soldering work.

Moreover, the controller 142 has the insertion part 180, the carrying-in part 182 and the soldering part 184, as shown in FIG. The insertion part 180 is a functional part for inserting the lead 164 of the lead component 160 into the through hole 168 of the circuit board 44 in the first work machine 12. The carry-in unit 182 is a functional unit for carrying the circuit board 44 in which the leads 164 are inserted into the through holes 168 in the first work machine 12 into the second work machine 14. The soldering unit 184 is a functional unit for performing soldering on the inserted component 160 of the circuit board 44 carried in by the carry-in unit 182.

Incidentally, the second work machine 14 is an example of a work machine. The mounting head 24 is an example of a pressing device. The soldering device 34 is an example of a soldering device. The suction nozzle 70 is an example of a pressing tool. The control device 140 is an example of a control device. The storage area 148 is an example of a storage device. Moreover, the process performed by the insertion part 180 is an example of an insertion process. The process executed by the carry-in unit 182 is an example of a carry-in process. The process executed by the soldering unit 184 is an example of a soldering process. The method executed by the insertion unit 180, the carry-in unit 182 and the soldering unit 184 is an example of a soldering method.

In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the soldering operation is performed in the second working machine 14 with respect to the inserted part 160 mounted on the first working machine 12, but the operator manually performs the work. After the lead component 160 is mounted on the circuit board 44, the circuit board may be carried into the second working machine 14 and a soldering operation may be performed on the lead component 160 mounted by the operator.

In the above-described embodiment, the inserted component 160 is pressed by the suction nozzle 70, but the inserted component 160 may be pressed by various holders such as a chuck.

In the above embodiment, the second work machine 14 performs the soldering work on the inserted part 160 mounted outside the machine and the soldering work on the lead part 160 mounted inside the machine. Only the soldering operation for the inserted part 160 mounted outside may be performed. That is, the second work machine 14 may be specialized to a work machine that performs a soldering work without performing a mounting work. In such a case, as a pressing tool for pressing the inserted part 160, it is possible to adopt a tool specialized for the function of pressing the inserted part 160 without having a function of holding the parts such as the suction nozzle 70. is there.

14: Second work machine (work machine) 24: Mounting head (pressing device) 34: Soldering device 70: Suction nozzle (pressing tool) 140: Control device 148: Storage area (storage device)

Claims

A pressing device for pressing the lead component in a state in which the lead is inserted into the through hole formed in the substrate toward the substrate;
A soldering device for performing soldering on the lead inserted in the through hole;
The pressing device and the solder so that soldering is performed by the soldering device in a state where the inserted component, which is the lead component in which the lead is inserted into the through hole outside the machine, is pressed by the pressing device. A work machine comprising: a control device that controls the operation of the attachment device.
The working machine is
A storage device for storing component information relating to the inserted component;
The control device is
The work machine according to claim 1, wherein the operation of the pressing device and the soldering device is controlled based on the component information.
The pressing device is
A plurality of pressing tools for pressing the lead parts;
The control device is
A predetermined pressing tool among the plurality of pressing tools is associated with each inserted component, and the inserted component is pressed by the predetermined pressing tool associated with the inserted component. The work machine according to claim 1, wherein the operation of the pressing device is controlled.
A pressing device that presses a lead component in a state where a lead is inserted into a through-hole formed in the substrate toward the substrate, and a soldering device that solders the lead inserted into the through-hole. In a working machine, a soldering method for performing a soldering operation on the lead,
Outside the work machine, an insertion step of inserting the lead into the through hole of the substrate;
A carrying-in step of carrying in the substrate into which the lead is inserted in the working machine in the inserting step;
Solder that is soldered by the soldering device to the board carried in the carrying-in process in a state in which the lead component having the lead inserted into the through hole of the board is pressed by the pressing device. A soldering method including a soldering process.