JP4985685B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate onto which a paste adhesive for electronic component bonding is transferred.

  Paste adhesives used to mount electronic components on a substrate are supplied to the substrate by a method such as drawing using a syringe or transfer using pins, but drawing to discharge the paste adhesive from a hole Since there is a limit to dealing with a small amount, supply of paste adhesive by transfer is frequently used in mounting of micro parts.

As an electronic component mounting apparatus that performs transfer, a paste supply unit and a component supply unit are arranged on both sides of the substrate, the transfer head moves between the paste supply unit and the substrate, and the paste adhesive is transferred to the substrate. A device that moves between a component supply unit and a substrate to mount an electronic component on a substrate onto which a paste adhesive has been transferred is known (see Patent Document 1). Substrate transport mechanisms that carry in and out the substrate include those that are placed on a belt conveyor and those that slide by hooking the tip of an arm. In many cases, an arm is used (see Patent Document 2).
JP 2002-28568 A Japanese Patent Laid-Open No. 11-40599

  In order to increase the transfer efficiency in the electronic component mounting apparatus disclosed in Patent Document 1, it is desirable to shorten the moving distance of the transfer head that moves repeatedly between the paste supply unit and the substrate. It is necessary to arrange the part and the substrate as close as possible. However, in the substrate transport mechanism disclosed in Patent Document 2, it is necessary to secure the arm movement space above the substrate. The arrangement will be very limited to avoid interference with the arm. If the paste supply unit is above the arm movement path, interference with the arm can be avoided, but the difference in height from the substrate increases, so that the movement time of the transfer head becomes longer and the transfer efficiency decreases. .

  An object of the present invention is to provide an electronic component mounting apparatus that does not reduce transfer efficiency while avoiding interference between a substrate carrying arm and a paste supply unit.

  An electronic component mounting apparatus according to the present invention includes a mounting head for mounting an electronic component taken out from an electronic component supply unit on a substrate, a substrate holding unit for holding a substrate at a side of the electronic component supply unit, and the substrate holding unit. A substrate conveyance mechanism that is provided on the opposite side of the electronic component supply unit and that conveys the substrate by moving an arm that is in contact with the substrate from above, a transfer head that transfers the paste adhesive to the substrate, and the substrate holding unit A paste supply unit that is provided on the opposite side of the electronic component supply unit with the paste interposed therebetween and supplies a paste adhesive to the transfer head; and the paste supply unit approaches the substrate during paste transfer, and the arm moves during substrate transfer And a paste supply unit lifting / lowering mechanism that retracts to a height that does not interfere with the head.

According to the present invention, when the substrate is transported, the paste supply unit can be raised to form a moving space of the arm between the substrate, and during paste transfer, the paste supply unit can be lowered to reduce the height difference from the substrate. Thus, the interference between the arm and the paste supply unit can be avoided without lowering the transfer efficiency of the electronic component mounting apparatus.

  Embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a paste supply unit moving mechanism according to the embodiment of the present invention, and FIG. 3 is an electronic component mounting according to the embodiment of the present invention. FIG. 4 is a perspective view of the electronic component mounting apparatus in the embodiment of the present invention, FIG. 5 is a side view showing the positional relationship between the paste supply table and the substrate transport mechanism in the embodiment of the present invention, and FIG. FIG. 7 is a plan view of the substrate transport mechanism in the embodiment of the present invention, and FIG. 7 is a side view showing the positional relationship between the paste supply table and the substrate in the embodiment of the present invention.

  As shown in FIG. 1, the electronic component mounting apparatus 1 includes three working heads, a pickup head 2, a bonding head 3, and a transfer head 5, a component supply table 6, a component relay table 7, a mounting table 8, and a paste supply table 9. The four work tables and the four cameras 10, 11, 12, and 13 are the main parts. The work table is arranged in the order of the component supply table 6, the component relay table 7, the mounting table 8, and the paste supply table 9 from the front side in the depth direction of the electronic component mounting apparatus 1.

  The pickup head 2 can be moved by the pickup head moving device 14 in the vertical direction and the depth direction of the electronic component mounting apparatus 1 (arrow a: a direction orthogonal to the conveyance direction (arrow b) of the substrate 24). Moving between the adjacent component supply table 6 and the component relay table 7, the chip 16 attached to the wafer sheet 15 is picked up and placed on the component relay table 7. The position and orientation of the chip 16 affixed to the wafer sheet 15 is confirmed before picking up by analyzing the captured image by the camera 10 arranged vertically above, and if a positional deviation is confirmed, the component supply table 6 is checked. The position of the chip 16 is corrected by moving, and the angle of the pickup nozzle 17 is corrected according to the direction of the chip 16.

  The component relay table 7 is disposed on the upper part of the moving table 18. The moving table 18 can be moved in the substrate transfer direction (arrow b) by the linear motion device 19. In addition to the component relay table 7, a nozzle stocker 20 and a camera 13 are arranged on the moving table 18. A cleaning head 21 is arranged on the moving path of the moving table 18. When the moving table 18 passes below the cleaning head 21, the upper surface (chip mounting surface) of the component relay table 7 is cleaned and unnecessary chips are eliminated. I do.

  The bonding head 3 is movable in the vertical direction and the depth direction (arrow a) of the electronic component mounting apparatus 1 by the bonding head moving devices 22 and 23, and moves between the adjacent component relay table 7 and the mounting table 8, The chip 16 placed on the component relay table 7 is picked up and mounted on the substrate 24. The substrate 24 is carried into the electronic component mounting apparatus 1 by a substrate transport device (not shown) and fixed to the upper part of the mounting table 8. The bonding head 3 not only picks up the chip 16 from the component relay table 7 but also moves to the component supply table 6 to pick up directly from the wafer sheet 15 or receives it from the pickup head 2 that is turned upside down at the tip of the arm 25. It is also possible. In this case, flip chip mounting is performed in which the chip 16 that is turned upside down as the pickup head 2 is inverted is mounted on the substrate 24.

The position and orientation of the chip 16 placed on the component relay table 7 is confirmed before picking up by analyzing the captured image by the camera 11 arranged vertically above, and if a positional deviation is confirmed, the bonding head 3 is confirmed. The positional relationship between the bonding nozzle 26 and the chip 16 is corrected by the movement (arrow a) and the movement of the component relay table 7 (arrow b), and the angle of the bonding nozzle 26 is corrected according to the direction of the chip 16. The position and orientation of the chip 16 picked up by the bonding head 3 is picked up from below by the camera 13 disposed on the moving table 18 and is confirmed and corrected before being mounted on the substrate 24.

  The transfer head 5 can be moved in the vertical direction and the depth direction (arrow a) of the electronic component mounting apparatus 1 by transfer head moving devices 27 and 28. The paste supply table 9 is a paste supply unit that supplies a paste adhesive to the transfer head 5. A paste adhesive 32 is stored in the paste supply table 9. The transfer head 5 immerses the transfer pin 33 at the lower end in the paste adhesive 32, and then presses the transfer pin 33 against the substrate 24, thereby imitating a small amount of paste adhesive attached to the transfer pin 33 on the transfer surface. Transfer to the substrate 24 in the shape 34. The transfer amount of the paste adhesive is adjusted by adjusting the thickness of the paste adhesive at the portion where the transfer pin 33 is immersed by the film thickness adjusting plate 35 or by adjusting the depth at which the transfer pin 33 is immersed in the paste adhesive. Do.

  The shape 34 of the paste adhesive material transferred to the substrate 24 is confirmed by analyzing the captured image by the camera 12 arranged vertically upward. The camera 12 is also used to confirm the position and orientation of the chip 16 mounted on the transferred paste adhesive.

  The paste supply table 9 can be moved in the horizontal direction by the paste supply unit moving mechanism 40 shown in FIGS. The paste supply unit moving mechanism 40 includes a horizontal rail 41 extending in the horizontal direction, a rodless cylinder 42, and a slider 43 slidably mounted on the horizontal rail 41. The paste supply table 9 is attached to the slider 43. It has been. The rodless cylinder 42 has a built-in magnet (not shown) that moves horizontally by externally supplied air pressure, and a slider 43 having magnetism moves horizontally by being guided by the movement of the magnet. ing.

  The paste supply table 9 is stored in the L-shaped plate 44, a circular storage tank 45 arranged in a horizontal portion of the L-shaped plate 44, a motor 46 that rotates the storage tank 45 around the central axis, and the storage tank 45. And a film thickness adjusting plate 35 for adjusting the film thickness of the paste adhesive 32. When the storage tank 45 is rotated, most of the stored paste adhesive 32 is blocked by the film thickness adjusting plate 35, and a film-like paste having a thickness corresponding to the gap between the bottom surface of the storage tank 45 is obtained. It appears on the downstream side of the film thickness adjusting plate 35. The transfer head 5 immerses the transfer pin 33 in this film-like portion. The film thickness of the paste can be precisely adjusted by changing the height of the film thickness adjusting plate 35 by the adjusting mechanism 47 using a micrometer head or the like.

  A vertical rail 48 extending in the vertical direction is attached to the slider 43, and a vertical portion of the L-shaped plate 44 is attached to the vertical rail 48 via a slider 49. A U-shaped member 51 that is movable in the vertical direction by the cylinder mechanism 50 is disposed on one end side of the horizontal rail 41. A protruding member 52 that engages with the U-shaped member 51 is formed on the L-shaped plate 44, and the protruding member 52 and the U-shaped member 51 are moved when the paste supply table 9 is moved to one end side of the horizontal rail 41. Are to be engaged. When the cylinder mechanism 50 is driven in a state where the protruding member 52 and the U-shaped member 51 are engaged, the paste supply table 9 moves in the vertical direction.

The paste supply table 9 can be moved in the depth direction (arrow a) of the electronic component mounting apparatus 1 by the paste supply unit moving mechanism 40. The position of the paste supply table 9 is determined by the operation status of the electronic component mounting apparatus 1, and at the time of mounting, the paste supply table 9 is positioned at a position (mounting position) opposite to the component supply table 6 with the mounting table 8 interposed therebetween as shown in FIG. At the time of maintenance, as shown in FIG. 4, the position on the component supply table 6 side beyond the mounting table 8 (maintenance position)
Located in. Since this maintenance position is closer to the front side of the apparatus where the operator is present, the operator can easily perform maintenance operations on the paste supply table 9 such as replenishment and cleaning of the paste adhesive.

  Since the paste supply table 9 moves above the mounting table 8 and the component relay table 7, each head retracts from the movement path when the paste supply table 9 moves. For example, the transfer head 5 is retracted above the movement path, and the bonding head 3 is retracted to the front side of the apparatus so as not to contact the moving paste supply table 9.

  As shown in FIG. 3, the transfer pin 33 attaches the paste in the storage tank 45 at the paste receiving position P1 or P2, moves above the substrate 24, and transfers the paste. The storage tank 45 is concentrically divided into two regions, each of which stores another type of paste. The pickup nozzle 17, the component relay table 7 and the bonding nozzle 26 are arranged on the same straight line as the transfer pin 33.

  In the electronic component mounting apparatus 1, a board transport mechanism 60 that transports the board 24 is disposed below the paste supply unit moving mechanism 40 as shown in FIGS. 3 and 5. The substrate transport mechanism 60 has a configuration in which an arm 63 is attached to a nut 62 that is screwed into a feed screw 61 that extends in the transport direction (b direction) of the substrate 24, and the transport is attached downward to the tip of the arm 63. The nail | claw 64 is hooked on the rear end of the board | substrate 24, and the board | substrate 24 is conveyed. As shown in FIG. 6, the arm 63 on the transport destination side transports the substrate 24 at the standby position 65 to the mounting table 8, and the arm 63 on the transport source side includes the electronic component mounting apparatus 1. The substrate 24 that has been carried in is transported to the standby position 65.

  The arm 63 needs to return to the transfer start position in preparation for the transfer of the substrate 24 to be transferred next after transferring the substrate 24, and at that time, the transfer claw 64 needs to rise to a height at which it does not contact the substrate 24. Therefore, the paste supply table 9 is raised to a height at which the paste supply table 9 does not come into contact with the arm (shown by a broken line in FIG. 5), and avoids interference with the arm 63. The paste supply table 9 is lowered as shown in FIG. 7 when transferring the paste adhesive to the substrate 24, and the height difference between the storage tank 45 and the substrate 24 is reduced. Thereby, the moving distance in the vertical direction of the transfer head 5 is shortened, and the time required for transfer can be shortened.

  According to the present invention, it is possible to raise the paste supply unit during substrate transportation to form a moving space of the arm between the substrate and lower the paste supply unit during paste transfer to reduce the height difference from the substrate. There is an advantage that interference between the arm and the paste supply unit can be avoided without lowering the transfer efficiency of the electronic component mounting apparatus, which is useful in the field of mounting electronic components by transferring paste to a substrate.

The perspective view of the electronic component mounting apparatus in embodiment of this invention The perspective view of the paste supply part moving mechanism in embodiment of this invention The top view of the electronic component mounting apparatus in embodiment of this invention The perspective view of the electronic component mounting apparatus in embodiment of this invention The side view which shows the positional relationship of the paste supply table and board | substrate conveyance mechanism in embodiment of this invention The top view of the board | substrate conveyance mechanism in embodiment of this invention The side view which shows the positional relationship of the paste supply table and board | substrate in embodiment of this invention

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Pickup head 3 Bonding head 5 Transfer head 6 Component supply table 7 Component relay table 8 Mounting table 9 Paste supply table 24 Substrate 50 Cylinder mechanism (paste supply part raising / lowering mechanism)
60 Substrate transport mechanism 63 Arm

Claims (1)

A mounting head for mounting the electronic component taken out from the electronic component supply unit on the substrate;
A substrate holding unit for holding a substrate at a side of the electronic component supply unit;
A substrate transfer mechanism provided on the opposite side of the electronic component supply unit across the substrate holding unit, and configured to transfer a substrate by moving an arm in contact with the substrate from above;
A transfer head for transferring the paste adhesive to the substrate;
A paste supply unit provided on the opposite side of the electronic component supply unit across the substrate holding unit, and supplying a paste adhesive to the transfer head;
A paste supply unit elevating mechanism that moves the paste supply unit closer to the substrate during paste transfer and retracts to a height that does not interfere with the movement of the arm during substrate transfer;
An electronic component mounting apparatus comprising:

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