JP5975165B1 - Lid opening / closing mechanism and soldering device - Google Patents

Abstract

A lid opening / closing mechanism and a soldering device are provided that realize cooling efficiency and space saving. A lid opening / closing mechanism 5A for a cooling unit 9 that cools a printed circuit board 3 is supported by an elevating unit 51A that supports the printed circuit board 3 so that the printed circuit board 3 can be moved up and down, and a rotary shaft 54. A rotating arm portion 55 extending upward from the shaft 54, an openable / closable lid portion 51a attached to the rotating arm portion 55, and a cooler provided below the lid portion 51a. The lid part 51 a closes the upper part of the printed circuit board 3. [Selection] Figure 2

Description

  The present invention relates to a lid opening / closing mechanism and a soldering apparatus in a soldering apparatus for soldering to a printed circuit board.

  A soldering apparatus is used when an electronic component is soldered to a printed circuit board. According to the soldering apparatus, a flux application part such as a fluxer, a preheating part, a soldering part, a cooling part and the like are arranged at predetermined positions. When soldering electronic components to a printed circuit board with a soldering device, the flux is applied to the soldering area of the printed circuit board at the flux application unit, and then the pre-heated part is preheated and the printed circuit board is connected to the printed circuit board at the soldering unit. The soldering process is completed by soldering the electronic components and cooling the printed circuit board in the cooling section.

  In relation to this type of soldering apparatus, for example, a device including a flux application unit, a preheating unit, a soldering unit, a cooling unit, and a transfer robot is known. A soldering apparatus including a cooling unit that cools a printed circuit board soldered in a jet solder bath by three cooling fans is disclosed.

Japanese Patent No. 5279606

  As described above, since a plurality of processing parts are required for the soldering process, the soldering apparatus incorporating each part requires a large space. For this reason, it has been difficult to secure the location of the soldering device in the factory and the location of the operator. Patent Document 1 described above requires a plurality of cooling units to cool the printed circuit board, and has not taken any considerations regarding the efficiency of cooling the printed circuit board and the space saving of the soldering apparatus.

  SUMMARY OF THE INVENTION The present invention solves such problems, and an object of the present invention is to provide a lid opening / closing mechanism and a soldering apparatus that achieves cooling efficiency and space saving.

The technical means of the present invention taken in order to solve the above-mentioned problems are as follows.
(1) A lid opening / closing mechanism for a cooling unit that cools the printed circuit board, a lifting unit that supports the printed circuit board so that the printed circuit board can be moved up and down, a rotating arm unit supported by the rotating shaft and extending upward from the rotating shaft, An openable / closable lid attached to the arm, a cooler provided below the lid, a guide rail arranged along the lower surface of the lid, and a lower surface of the lid A lid opening / closing mechanism comprising: a support member configured to support the distal end portion of the rotating arm portion so as to be movable forward and backward , and configured to close an upper portion of the printed circuit board by the lid portion.

( 2 ) An auxiliary rail provided horizontally with respect to the printed circuit board surface, a moving member that moves along the auxiliary rail, and a moving drive unit that moves and drives the moving member are provided above one of the rotating shafts. The auxiliary rail and the moving member are arranged closer to the rotation axis with respect to the guide rail, and as the moving member moves, the rotation arm rotates about the rotation axis and the in-plane parallel to the printed circuit board is covered. The lid opening / closing mechanism according to ( 1 ), wherein the lid opens and closes.

( 3 ) The lid opening / closing mechanism according to ( 1 ), further including a rotation driving unit that rotationally drives the rotation shaft.

( 4 ) The lid portion has a horizontal surface with respect to the printed circuit board surface, and the curved portion curved downward with respect to the surface direction of the lid portion is provided on the opposing ends of the pair of lid portions (1 ) The lid opening / closing mechanism according to any one of ( 3 ) to ( 3 ).

( 5 ) A soldering apparatus comprising a soldering chamber and a housing having an opening, and having a carry-out chamber for carrying out the printed board from the soldering chamber , wherein the soldering chamber has a flux on the printed board. A flux application part to be applied, a preheating part for heating the printed circuit board coated with the flux, and a soldering part for soldering to the heated printed circuit board, and the carry-out chamber is a soldered printed circuit board The soldering apparatus provided with the cooling part which cools, and a cooling part is provided with the lid | cover opening / closing mechanism in any one of said (1)-( 4 ).

( 6 ) The soldering apparatus according to ( 5 ), wherein the cooler sends a gas from a lower part between the rotating shaft and the elevating part to an upper part of the cooling part.

  According to the lid opening / closing mechanism of the present invention, the printed circuit board can be efficiently cooled even in a space-saving manner. According to the soldering apparatus according to the present invention, a soldering apparatus including a flux application part, a preheating part, a soldering part, and a cooling part can be realized in a space-saving manner.

It is a schematic plan view which shows the structural example of the soldering apparatus 1 which concerns on this invention. It is AA sectional drawing of FIG. 1 which shows the structural example of 5 A of lid | cover opening / closing mechanisms which concern on this invention. It is a top view which shows the structural example of 5 A of lid | cover opening / closing mechanisms. It is expanded sectional drawing which shows the structural example of 5 A of lid | cover opening / closing mechanisms. It is a block diagram which shows the structural example of the control system of the soldering apparatus. It is sectional drawing which shows the operation example of 5 A of lid | cover opening / closing mechanisms. It is sectional drawing which shows the operation example of 5 A of lid | cover opening / closing mechanisms. It is sectional drawing which shows the operation example of 5 A of lid | cover opening / closing mechanisms.

  Hereinafter, a soldering apparatus 1 according to an embodiment of the present invention will be described with reference to the drawings.

[Configuration example of soldering apparatus 1]
As shown in FIG. 1, the soldering apparatus 1 is an apparatus for performing a soldering process on a printed circuit board 3 and includes a soldering chamber 10. The soldering chamber 10 is a housing having an opening for loading and unloading the printed circuit board 3 on its side. On the side of the soldering chamber 10, a carry-in chamber 4 for conveying the printed circuit board 3 and a carry-out chamber 5 for carrying out the printed circuit board 3 are provided side by side. The soldering chamber 10 includes a flux applying unit 6 that applies a flux to the printed circuit board 3, a preheater unit 7 that heats the flux-coated printed circuit board 3, and solder that is soldered to the heated printed circuit board 3. And an attaching portion 8. The carry-out chamber 5 includes a cooling unit 9 that cools the soldered printed circuit board 3.

  A transfer robot 21 is installed in the center of the soldering chamber 10. For example, a vertical articulated robot or the like is used as the transfer robot 21. The transport robot 21 has a grip unit (not shown) that grips the printed circuit board 3. This gripping part receives the printed circuit board 3 that has entered the solder chamber 10 by the carry-in rail 41 of the carry-in chamber 4. The transport robot 21 sends the printed circuit board 3 in the order of the flux application unit 6, the preheating unit 7, and the soldering unit 8 while holding the printed circuit board 3. The transfer robot 21 further sends out the printed circuit board 3 to the carry-out rail 51 of the carry-out chamber 5.

  The flux application unit 6, the preheating unit 7, and the soldering unit 8 are disposed within a movable range of the transfer robot 21 centering on the transfer robot 21. The flux application unit 6 is installed in the vicinity of the carry-in rail 41. The flux application unit 6 applies the flux to the printed circuit board 3 transported by the transport robot 21. An organic solvent is used for the flux. For example, IPA (isopropyl alcohol) or the like is used. The flux application part 6 may be provided with a plurality of application parts. In that case, it is possible to use properly for lead-containing solder and for lead-free solder, properly use depending on the type of the printed circuit board 3, and depending on the type of flux.

  The preheating unit 7 is adjacent to the flux application unit 6 and the soldering unit 8 and is provided in a region between the carry-in rail 41 and the carry-out rail 51. The preheating unit 7 heats the printed circuit board 3 to dry the flux applied to the printed circuit board 3 by the flux application unit 6 and raises the printed circuit board 3 uniformly to a predetermined temperature. When the printed circuit board 3 is heated in this way, the solder is likely to adhere to a predetermined portion of the printed circuit board 3. For the preheating unit 7, for example, a halogen heater is used. The halogen heater can rapidly heat the printed circuit board 3 to a set temperature.

  The soldering part 8 is installed in the vicinity of the carry-out rail 51. For example, a jet soldering apparatus is used as the soldering unit 8. The soldering portion 8 forms solder at a predetermined location on the printed circuit board 3. The soldering unit 8 jets molten solder fed by a pump (not shown) to the printed circuit board 3.

  As an example of the present invention, when the soldering part 8 is constituted by a jet soldering apparatus, an inert gas such as nitrogen gas (N2) is supplied to the solder tank for accommodating the molten solder in order to suppress oxidation of the molten solder. can do.

  This inert gas is supplied to a space serving as a reservoir for an ineffective gas constituted by a solder liquid surface and an inert gas cover (not shown) that covers the solder bath. The jet soldering apparatus can be configured to exhaust the inert gas from the opening of the inert gas cover provided around the nozzle for jetting molten solder toward the printed circuit board 3.

  In such a configuration, the exhausted inert gas becomes a high temperature of about 240 ° C. in this example due to the molten solder, so that there is an effect of heating the soldered portion of the printed circuit board 3 and its periphery. For this reason, when soldering a predetermined portion of the printed circuit board 3, heat can be applied to the soldered portion of the printed circuit board 3 and its surroundings by the high-temperature inert gas exhausted from the periphery of the nozzle.

  The soldering location heated by the preheating unit 7 is likely to decrease in temperature before being transported to the soldering unit 8 and being soldered. In particular, when there are many soldering locations on the printed circuit board 3, the time difference between the time when the preheating is completed and the soldering is increased, and a temperature difference is likely to occur at the soldering locations, resulting in poor soldering quality. It becomes stable.

  The high temperature inert gas exhausted from the periphery of the nozzle can apply heat to the soldered portion of the printed circuit board 3 and the periphery thereof, so that the temperature drop can be compensated. Since the temperature drop can be compensated, instability of the soldering quality accompanying the temperature drop can be prevented, and the soldering quality can be kept constant.

  The inert gas may be supplied to the solder bath at a high temperature by a known means, or a pipe for supplying the inert gas may be supplied into the solder bath so as to pass through the molten solder. It may be arranged.

  In the present embodiment, the flux application unit 6, the preheating unit 7, and the soldering unit 8 are arranged in this order in the clockwise direction around the transfer robot 21, but these devices are not limited to the above-described arrangement. . For example, the flux application part 6, the preheating part 7, and the soldering part 8 may be arrange | positioned counterclockwise in this order, and may be arrange | positioned at 1 row or several rows.

  The carry-in chamber 4 is a housing having an opening 41a on the upper surface. In the carry-in chamber 4, there are a pair of carry-in rails 41 for conveying the printed circuit board extending from the carry-in chamber 4 into the soldering chamber 10, a pusher 42 for pushing out the printed circuit board 3 disposed between the carry-in rails 41, A plunger (not shown) for driving 42 is provided.

  The pair of carry-in rails 41 carries the printed circuit board 3 from the carry-in chamber 4 into the soldering chamber 10. The carry-in rail 41 has a support portion having an L-shaped cross section, and this support portion supports the lower surface and the side surface of the printed circuit board 3. The pair of carry-in rails 41 are provided in parallel and advance and retreat with respect to the soldering chamber 10. The pair of carry-in rails 41 are screwed together with the screw shaft 41A, and the width of the carry-in rail 41 can be adjusted corresponding to the width of the printed circuit board 3 according to the rotation of the screw shaft 41A. The screw shaft 41A is formed with a forward (right) screw and a reverse (left) screw corresponding to the pair of carry-in rails 41, and the width between the pair of carry-in rails 41 is increased according to the rotation of the screw shaft 41A. It can be made narrower or wider. A screw adjustment portion 41B for rotating the screw shaft 41A is provided on the side wall outside the carry-in chamber 4, and the screw adjustment portion 41B is attached to one end portion of the screw shaft 41A.

  When the operator rotates the screw adjustment portion 41B, the screw shaft 41A rotates, and the positions of the pair of carry-in rails 41 change accordingly. As a result, the width of the carry-in rail 41 is adjusted.

  The pusher 42 protrudes upward from the bottom in the carry-in chamber 4 to the height of the carry-in rail 41. The initial position of the pusher 42 is located between the pair of carry-in rails 41 and in the vicinity of the position farthest from the soldering chamber 10 in one end of the carry-in rail 41. When a plunger (not shown) drives the pusher 42, the pusher 42 moves into the soldering chamber 10 as indicated by a one-dot chain line in the drawing.

  The carry-out chamber 5 is provided on the side of the soldering chamber 10 in parallel with the carry-in chamber 4. In the unloading chamber 5, a pair of unloading rails 51 for conveying the printed circuit board extending from the unloading chamber 5 into the soldering chamber 10, a pusher 52 for pushing out the printed circuit board 3 placed on the unloading rail 51, and a pusher 52 are provided. A plunger 52a to be driven (see FIG. 2) and a cooling unit 9 for cooling the printed circuit board 3 soldered by the soldering unit 8 are provided. The configuration will be described in detail later.

  In the present embodiment, since the printed circuit board 3 is transported in the order of the flux application unit 6, the preheating unit 7, the soldering unit 8, and the cooling unit 9, the arrangement of the present embodiment enables the movable robot 21 to move. The printed circuit board 3 can be conveyed by the shortest path within the area. Therefore, the soldering apparatus 1 including the flux application part 6, the preheating part 7, the soldering part 8, and the cooling part 9 can be realized in a small space, and the efficiency of the soldering work can be improved.

[Configuration example of lid opening / closing mechanism 5A]
As shown in FIG. 2, the carry-out chamber 5 has an opening 5b that is opened larger than the width of the pair of carry-out rails 51 at the center of the upper surface 5a. It is the housing | casing accommodated under the upper surface 5a. The carry-out chamber 5 is vertically partitioned by a mounting plate 5c provided at the center. In this example, the case where the lid 51a is composed of a pair of left and right will be described below as an example, but a single lid may be used.

  The pair of carry-out rails 51 are provided in parallel on the mounting plate 5 c and advance and retreat with respect to the soldering chamber 10. The carry-out rail 51 has an elevating part 51A having an L-shaped cross section that supports the lower surface and the side surface of the printed circuit board 3 so as to be elevable. The elevating part 51A is composed of an existing cylinder or the like.

  The pair of carry-out rails 51 are provided in parallel with the pair of carry-in rails 41 shown in FIG. The pair of carry-out rails 51 are screwed together with the screw shaft 41A, and the width of the carry-out rail 51 can be adjusted corresponding to the width of the printed circuit board 3 according to the rotation of the screw shaft 41A. The screw shaft 41A is formed with a pair of forward (right) screws and reverse (left) screws (not shown) corresponding to the pair of carry-out rails 51, and between the pair of carry-out rails 51 according to the rotation of the screw shaft 41A. The width of can be made narrower or wider. The method for adjusting the width of the carry-out rail 51 is the same as that for adjusting the width of the carry-in rail 41 shown in FIG. 1. When the operator rotates the screw adjustment portion 41B, the screw shaft 41A rotates, and a pair of carry-outs are carried out accordingly. Both the positions of the rails 51 change. Thereby, the width of the carry-out rail 51 is adjusted.

  That is, although not shown, the screw shaft 41 </ b> A is provided with a pair of forward (right) screws and a reverse (left) screw corresponding to the pair of carry-out rails 51, and a pair corresponding to the pair of carry-out rails 51. Since the forward (right) screw and the reverse (left) screw are provided, when the operator rotates the screw adjustment portion 41B, the screw shaft 41A rotates, and the widths of the carry-in rail 41 and the carry-out rail 51 simultaneously. It changes by the same amount. Thereby, the width of the carry-in rail 41 and the carry-out rail 51 is simultaneously controlled and adjusted according to the width of the printed board 3 to be conveyed.

  As shown in FIG. 2, the pusher 52 projects upward from the bottom in the soldering chamber 10 to the height of the carry-out rail 51 at the initial position. As shown in FIG. 1, the initial position of the pusher 52 is located between the pair of carry-out rails 51 and in the vicinity of one end of the carry-out rail 51, on the soldering part 8 side. When the plunger 52 a shown in FIG. 2 drives the pusher 52, the pusher 52 moves into the carry-out chamber 5 as indicated by the one-dot chain line in FIG. 1.

  As shown in FIG. 2, the mounting plate 5 c is provided with openings 5 d and 5 e for sending gas into the carry-out chamber 5 so as to sandwich a portion where the pair of carry-out rails 51 are arranged. . In the present embodiment, as indicated by a two-dot chain line in the figure, the cooling region of the cooling unit 9 is between the openings 5d and 5e in the carry-out chamber 5, and further above the attachment plate 5c and the lid. It is a space region formed by the lower part of the part 51a.

  In the carry-out chamber 5, a lid opening / closing mechanism 5 </ b> A having a lid portion 51 a is provided to close the top of the cooling unit 9. In the present embodiment, a configuration is adopted in which the pair of lid portions 51a open and close in the left-right direction. The lid opening / closing mechanism 5A includes an elevating unit 51A that supports the printed circuit board 3 so as to be elevable, a rotating shaft 54 provided on the left and right bottoms of the elevating unit 51A, and a pair of rotating arm units 55 supported by the rotating shaft 54. A pair of left and right lid portions 51a that opens and closes in association with the rotation of the rotating arm portion 55, and a cooling fan 91 as a pair of coolers disposed in a housing below the mounting plate 5c to which the rotating shaft 54 is attached. With.

  As shown in FIG. 4, the rotating shaft 54 is rotatably supported by a support portion 54a attached on the attachment plate 5c.

  The rotating arm portion 55 is provided to give the opening / closing force to the pair of lid portions 51a that open and close the upper surface of the cooling portion 9, and the mounting plate 5c side serves as a rotation fulcrum. The rotating arm portion 55 extends upward from the rotating shaft 54. A columnar columnar convex portion 55 a is provided at the distal end portion of the rotating arm portion 55 so as to be orthogonal to the longitudinal direction of the rotating arm portion 55. The columnar convex portion 55a protrudes from the rotating arm portion 55 in the front side of the drawing sheet. The rotary arm portion 55 is further provided with a columnar columnar convex portion 55b closer to the rotation shaft 54 than the columnar convex portion 55a. This columnar protrusion 55b also protrudes perpendicularly to the rotating arm 55 in the same direction as the columnar protrusion 55a in order to achieve the functions described below.

  The pair of lid portions 51 a is provided on the upper surface side of the rotating shaft 54 and is attached so as to be movable along with the movement of the rotating arm portion 55. The lid 51a has a rectangular surface 51b that is horizontal to the surface of the printed circuit board 3. The lid part 51a moves to open and close in a plane parallel to the printed circuit board 3. As shown in FIG. 2, the pair of left and right lid portions 51 a are provided with curved portions 51 c and 51 d that are both curved downward on the end side that moves back and forth in the traveling direction with respect to the surface direction of the lid portion 51 a. The curved portions 51c are arranged so as to face each other, and the curved portions 51d are arranged so as to face the left and right side walls 5f, 5g of the carry-out chamber 5, respectively.

  As shown in FIG. 3, the inner wall 5h of the unloading chamber 5 on the soldering chamber 10 side and the inner wall 5i on the opposite side are provided along the lower surface of the lid 51a in order to guide the opening and closing of the pair of lids 51a. Arranged guide rails 53 are provided. The guide rail 53 is provided from the side wall 5f to the side wall 5g of the carry-out chamber 5, and supports the lid 51a so as to open and close.

  In order to open and close the pair of lid portions 51 a along the guide rail 53, a pair of roller members 53 a and a pair of roller members 53 b are provided on the lower surface of the lid portion 51 a in a direction orthogonal to the opening and closing direction of the lid portion 51 a. . The roller members 53 a and 53 b have the same shape as each other, and have a roller on the side surface facing the guide rail 53. The number of rollers for one roller member 53a, 53b is arbitrarily selected. The roller member 53a is provided near both ends of the curved portion 51c, and the roller member 53b is provided near both ends of the curved portion 51d.

  One roller member 53a, 53b is slidably supported on the guide rail 53 on the inner wall 5h side, and the other roller member 53a, 53b is slidably supported on the guide rail 53 on the inner wall 5i side. Since the roller members 53 a and 53 b are supported by the guide rail 53, the lid portion 51 a is supported by the guide rail 53. When the lid 51a is opened and closed, the pair of roller members 53a and 53b move along the pair of guide rails 53, so that the lid 51a is smoothly opened and closed.

  A support member 56 is attached to the lower surface of the lid 51a near the guide rail 53 on the inner wall 5i side. As shown in FIG. 4, the support member 56 has a recess 56a that opens downward. As the rotary arm portion 55 moves, the support member 56 supports the columnar convex portion 55a at the tip of the rotary arm portion 55 so as to be movable back and forth in the concave portion 56a.

  As shown in FIG. 2, a drive unit 57 that rotates the rotating arm unit 55 is provided above the left and right rotating shafts 54 in the carry-out chamber 5 and closer to the rotating shaft 54 with respect to the guide rail 53. The drive part 57 also serves to support and reinforce the rotating arm part 55 that rotates. The driving unit 57 includes a pair of auxiliary rails 57A provided horizontally with respect to the surface of the printed circuit board 3, a moving member 57B that moves along the auxiliary rails 57A, and a moving driving unit 57C that moves and drives the moving member 57B. Is provided.

  The auxiliary rail 57A is supported by a leg extending upward from the mounting plate 5c. The moving member 57B is disposed closer to the rotation shaft 54 with respect to the guide rail 53. When the auxiliary rail 57A is inserted into the moving member 57B, the moving member 57B can move along the auxiliary rail 57A horizontally with respect to the surface of the printed circuit board 3. A rodless cylinder is adopted as an example of the movement drive unit 57C of the present embodiment. The movement driving unit 57C moves the pair of moving members 57B in an interlocking manner and moves the auxiliary moving member 57B in a direction toward and away from each other along the auxiliary rail 57A.

  The moving member 57B has a concave portion 57a that opens upward with respect to the auxiliary rail 57A at its upper end. When the columnar convex portion 55b of the rotating arm portion 55 enters the concave portion 57a, the moving member 57B supports the columnar convex portion 55b to move up and down the rotating arm portion 55 as the rotating arm portion 55 moves.

  The carry-out chamber 5 is provided with a cooling fan 91 as an example of a cold air fan in the inside thereof, and cools the printed circuit board 3. The cooling fan 91 is provided between the left and right rotating shafts 54 and the elevating part 51A and below the mounting plate 5c. The cooling fan 91 sends a gas, and the gas is sent out from below the carry-out chamber 5 through the openings 5d and 5e of the mounting plate 5c and above the cooling unit 9.

  The soldering chamber 10 is provided with a control unit 20 shown in FIG. The controller 20 is connected to the lid opening / closing mechanism 5A, the pushers 42 and 52, the flux applying unit 6, the preheating unit 7, the soldering unit 8, the cooling unit 9, the transport robot 21, and the operation unit 40. When the operator operates the operation unit 40, the control unit 20 opens and closes the lid 51a of the lid opening and closing mechanism 5A, raises and lowers the lifting unit 51A, the timing of pressing the printed circuit board 3 with the pushers 42 and 52, and the transfer robot 21, the speed at which the printed circuit board 3 is conveyed, the flux temperature of the flux coating unit 6, the flux application amount, the temperature of the preheating unit 7, the temperature of the molten solder in the soldering unit 8, the solder jet velocity, and the cooling unit 9 It controls ON / OFF of the cooling fan and the operation of the transfer robot 21.

  In this example, the cooling fan controls whether or not the normal temperature gas is circulated, that is, only controls turning on or off the rotation driving of the cooling fan. If the gas is cooled, the cooling temperature can be set and controlled individually. In that case, the printed circuit board 3 can be cooled at a desired temperature. The gas may be air or an inert gas such as nitrogen gas.

[Operation example of lid opening / closing mechanism 5A]
Next, an operation example of the lid opening / closing mechanism 5A will be described. It is assumed that the operator performs various settings using the operation unit 40 and the control unit 20 operates each unit.

  As shown in FIG. 1, the operator carries the printed circuit board 3 into the carry-in rail 41 from the opening 41 a of the carry-in chamber 4. When the operator rotates the screw adjustment portion 41B so that the width of the carry-in rail 41 matches the size of the printed circuit board 3, the screw shaft 41A rotates, and the widths of the carry-in rail 41 and the carry-out rail 51 simultaneously change by the same amount. With this configuration, the width of the carry-in rail 41 and the carry-out rail 51 can be collectively adjusted according to the width of the printed circuit board 3. An operator adjusts the width of the grip portion of the transport robot 21 according to the width of the printed circuit board 3, and places the printed circuit board 3 on the carry-in rail 41 after the adjustment.

  At this time, the lid opening / closing mechanism 5A is in an initial state. In this initial state, as shown in FIG. 6, the lid 51a is in a closed state. At this time, the raising / lowering part 51A is in the lowered state, and the pusher 52 is in the state on the soldering part 8 side.

  Subsequently, as shown in FIG. 1, the pusher 42 pushes out the printed circuit board 3, and the printed circuit board 3 is carried into the soldering chamber 10 as indicated by a one-dot chain line in the drawing. The transfer robot 21 approaches the carry-in rail 41. The pusher 42 further pushes the printed circuit board 3 and passes the printed circuit board 3 to the gripping portion of the transport robot 21. The transport robot 21 transports the printed circuit board 3 onto the flux application unit 6. In the flux application unit 6, the flux is applied to a predetermined portion of the printed circuit board 3.

  The transport robot 21 transports the printed circuit board 3 coated with flux to the preheating unit 7. The preheating unit 7 dries the flux applied to the printed circuit board 3 and heats the printed circuit board 3 to a predetermined temperature. The transport robot 21 transports the printed circuit board 3 heated to a predetermined temperature by the preheating unit 7 to the soldering unit 8.

  The soldering unit 8 performs soldering on a predetermined portion of the printed circuit board 3. The transfer robot 21 delivers the soldered printed circuit board 3 to the carry-out rail 51. At this time, the lid opening / closing mechanism is in the above-described initial state. The pusher 52 pushes the printed circuit board 3 to carry out on the carry-out rail 51 from the soldering chamber 10 to the cooling region of the cooling unit 9 in the carry-out chamber 5.

  As shown in FIG. 7, when the printed circuit board 3 stops in the cooling region of the cooling unit 9 in the carry-out chamber 5, the cooling fan 91 of the cooling unit 9 is driven to rotate, so that the soldered printed circuit board 3 is removed. Cooling. At this time, the pair of lid portions 51a closes the upper portion of the printed circuit board 3 in parallel. More specifically, the gas sent upward from the cooling fan 91 is bent vertically from the up and down direction at the curved portion 51d as shown by the one-dot chain line in the figure, and is in the horizontal direction to the lid portion 51a and the direction in which the gases approach each other. Be guided to. The gas guided in the horizontal direction collides with the curved portion 51 c and bends further vertically, and is guided from the lid portion 51 a toward the mounting plate 5 c below the carry-out chamber 5. When the gas that has come down hits the mounting plate 5c, the gas is guided in a direction away from each other.

  That is, the gas sent through the opening 5d from the left cooling fan 91 in the figure circulates clockwise in the cooling unit 9, and the gas sent from the right cooling fan 91 through the opening 5e is The printed circuit board 3 is effectively cooled by circulating counterclockwise in the cooling unit 9. Since the lid part 51a has the curved part 51d, the rising gas can be prevented from diffusing out of the cooling part 9. That is, since the lid portion 51a has the curved portion 51d, the cooling unit 9 can be reduced in space. Since the lid part 51a has the curved part 51c, it is possible to prevent the left and right gases guided in the horizontal direction by the curved part 51d from mixing with each other and becoming a turbulent flow. That is, the printed circuit board 3 can be uniformly cooled because the lid 51a has the curved portion 51c.

  In this example, the cooling unit 9 cools the printed circuit board 3 for a predetermined time. The cooling time can be arbitrarily set by the operator according to the product. Moreover, you may manage by temperature so that the printed circuit board 3 may be cooled until it becomes predetermined | prescribed temperature. Also in this case, the operator can arbitrarily set the cooling temperature.

  After the printed circuit board 3 is cooled for a predetermined time, the rotational driving of the cooling fan 91 is stopped and the lid 51a is opened. As shown in FIG. 7 and FIG. 8, each operation for opening the lid 51 a is performed by moving the lid 51 a closed so as to cover the upper part of the elevating part 51 A horizontally with respect to the surface direction. It opens so that the upper part of 51 A of raising / lowering parts may be released. More specifically, the movement driving unit 57C moves the pair of moving members 57B in a direction away from each other along the auxiliary rail 57A. As the moving member 57B moves, the rotating arm portion 55 rotates about the rotating shaft. In the drawing, the left rotating arm portion 55 rotates counterclockwise, and the right rotating arm portion 55 rotates clockwise.

  As indicated by the dotted line arrows in FIG. 7, the columnar convex portions 55 a and 55 b of the rotating arm portion 55 also rotate while drawing an arc around the rotating shaft 54. Since the moving member 57B moves horizontally with respect to the surface direction of the lid portion 51a, and the columnar convex portion 55b rotates around the rotation shaft 54, the columnar convex portion 55b moves relative to the moving member 57B within the concave portion 57a. Move up and down. When the columnar convex portion 55b is positioned directly above the rotation shaft 54, the columnar convex portion 55b is positioned at the uppermost position in the vertical movement within the concave portion 57a.

  As the columnar convex portion 55 a rotates, the support member 56 and the roller member 53 b move along the guide rail 53. Therefore, the lid 51a and the roller member 53a also move along the guide rail 53, and the lid 51a opens. Since the support member 56 moves horizontally with respect to the surface direction of the lid portion 51a, and the columnar convex portion 55a rotates about the rotation shaft 54, the columnar convex portion 55a moves relative to the support member 56 within the concave portion 56a. Move up and down. When the columnar convex portion 55a is positioned directly above the rotation shaft 54, the columnar convex portion 55a is positioned at the uppermost position in the vertical movement within the concave portion 56a.

  As shown in FIG. 8, when the lid 51a is opened, the lid 51a is accommodated under the upper surface 5a of the carry-out chamber 5, and the elevating part 51A is raised. When the operator removes the soldered printed circuit board 3 from the lifting / lowering part 51A and the operator presses a button (not shown), the lifting / lowering part 51A moves down, the pusher 52 moves to the soldering part 8 side, and the lid opening / closing mechanism The lid is closed and the soldering process by the soldering apparatus 1 is completed. At this time, the lid opening / closing mechanism 5A returns to the initial state shown in FIG.

  To return to the initial state of FIG. 6 from the state shown in FIG. 8, when the operator removes the soldered printed circuit board 3 from the lifting part 51A and presses a button (not shown) in the state of FIG. 51A descends, the pusher 52 moves to the soldering part 8 side, and as shown in FIG. 6, the lid part 51a moves horizontally with respect to the surface direction and closes so as to cover the upper part of the lifting part 51A. . This is done by operating each member in the direction opposite to the operation of opening the lid portion 51a described above. More specifically, the movement driving unit 57C moves the pair of moving members 57B in conjunction with each other and horizontally moves them along the auxiliary rail 57A in a direction approaching each other. As the moving member 57B moves, the rotating arm portion 55 rotates about the rotating shaft. In the drawing, the left rotating arm portion 55 rotates clockwise, and the right rotating arm portion 55 rotates counterclockwise.

  As indicated by the dotted line arrows in the figure, the columnar convex portions 55 a and 55 b of the rotating arm portion 55 also rotate while drawing an arc around the rotating shaft 54. Since the moving member 57B moves horizontally with respect to the surface direction of the lid portion 51a, and the columnar convex portion 55b rotates around the rotation shaft 54, the columnar convex portion 55b moves relative to the moving member 57B within the concave portion 57a. Move up and down. When the columnar convex portion 55b is positioned directly above the rotation shaft 54, the columnar convex portion 55b is positioned at the uppermost position in the vertical movement within the concave portion 57a.

  As the columnar convex portion 55 a rotates, the support member 56 and the roller member 53 b move along the guide rail 53. Therefore, the lid 51a and the roller member 53a also move along the guide rail 53, and the lid 51a is closed. Since the support member 56 moves horizontally with respect to the surface direction of the lid portion 51a, and the columnar convex portion 55a rotates about the rotation shaft 54, the columnar convex portion 55a moves relative to the support member 56 within the concave portion 56a. Move up and down. When the columnar convex portion 55a is positioned directly above the rotation shaft 54, the columnar convex portion 55a is positioned at the uppermost position in the vertical movement within the concave portion 56a.

  After the above operation, as shown in FIG. 6, the elevating part 51A is lowered, the pusher 52 is moved to the soldering part 8 side, the lid is closed, and the lid opening / closing mechanism 5A returns to the initial state.

  In the present embodiment, since the lid opening / closing mechanism 5A includes the lid portion 51a, the rotation shaft 54, and the rotation arm portion 55, the printed circuit board 3 can be efficiently cooled even in a space-saving manner. Since the soldering apparatus 1 includes the lid opening / closing mechanism 5A, the flux application unit 6, the preheating unit 7, the soldering unit 8, and the cooling unit 9 can be incorporated in a space-saving manner. Moreover, the energy required for cooling can be suppressed to the minimum by having made the range of the cooling unit 9 into a part in the carry-out chamber 5 as described above.

  The moving member 57B supports the rotating arm portion 55 closer to the rotating shaft 54 than the supporting member 56, and the moving driving portion 57C horizontally moves the moving member 57B along the auxiliary rail 57A, so that the lid portion 51a is moved to the moving member 57B. The horizontal movement can be larger than the horizontal movement. Therefore, the drive part 57 can move the cover part 51a largely with a small driving force and a small space for moving the moving member 57B.

  The lid opening / closing mechanism 5A is not limited to the configuration described above. For example, the lid opening / closing mechanism 5 </ b> A may be provided with a motor as a rotation driving unit that rotationally drives the pair of rotation shafts 54. In this case, the auxiliary rail 57A and the moving member 57B may be omitted by using a mechanism that opens and closes the lid 51a by rotational driving. When the length of the rotating arm portion 55 is set to be long, a plurality of auxiliary rails and moving members may be provided for one rotating arm portion 55.

  In the present embodiment, the lid opening / closing mechanism 5A includes a pair of lid portions 51a. For example, the lid opening / closing mechanism 5A includes one lid portion 51a that can be opened and closed, and the guide rail 53 and the auxiliary rail 57A. The support member 56 and the moving member 57B may be provided one by one.

  In the present embodiment, the lid 51a has the curved portions 51c and 51d in order to cool the printed circuit board 3 by more efficiently circulating the gas in the cooling unit 9, but this is not restrictive. . Even if the bending portions 51c and 51d are omitted, the printed circuit board 3 can be sufficiently cooled.

In the present embodiment, the carry-in chamber 4 and the carry-out chamber 5 have different configurations and are provided on the same side of the soldering chamber 10 so that the carry-in rail 41 and the carry-out rail 51 are parallel to each other. It is not limited to this. For example, the carry-in chamber 4 and the carry-out chamber 5 may be provided on different side surfaces of the soldering chamber 10, or the carry-in chamber 4 and the carry-out chamber 5 may be integrated.

  In the present embodiment, the pair of carry-in rails 41 and the pair of carry-out rails 51 are configured such that the widths thereof are simultaneously controlled and changed, but the present invention is not limited thereto. The carry-in rail 41 and the carry-out rail 51 may be screwed into different screw shafts and controlled separately. Moreover, even if a pair of carrying-in rail 41 does not change a position together, it is good also as a structure in which one of a pair of carrying-in rail 41 is being fixed, and the other changes a position with rotation of the screw shaft 41A. The pair of carry-out rails 51 may also be configured such that one of the pair of carry-out rails 51 is fixed and the other is changed in position with the rotation of the screw shaft 41A without changing the position of both.

  In the present embodiment, the operator adjusts the widths of the carry-in rail 41 and the carry-out rail 51 by manually rotating the screw shaft 41A using the screw adjustment unit 41B, but the present invention is not limited thereto. For example, the operator may automatically adjust the width of the carry-in rail 41 and the carry-out rail 51 corresponding to the width of the printed circuit board 3 when the operator inputs the width of the printed circuit board 3 through the operation unit 40.

  The present invention is extremely suitable when applied to a lid opening / closing mechanism and a soldering apparatus in a soldering apparatus for soldering to a printed circuit board.

DESCRIPTION OF SYMBOLS 1 Soldering apparatus 4 Carry-in chamber 5 Carry-out chamber 5A Lid opening / closing mechanism 6 Flux application part 7 Preheating part 8 Soldering part 9 Cooling part 10 Soldering room 41 Carry-in rail 42, 52 Pusher 51 Carry-out rail 51a Lid part 51A Lifting part 53 Guide Rail 54 Rotating shaft 55 Rotating arm portion 57 Drive portion 57A Auxiliary rail 57B Moving member 57C Moving drive portion

Claims (6)

A lid opening / closing mechanism of a cooling unit for cooling the printed circuit board,
An elevating part for supporting the printed circuit board so as to elevate;
A rotating arm supported by the rotating shaft and extending upward from the rotating shaft;
An openable / closable lid that is movably attached to the rotating arm;
A cooler provided below the lid;
A guide rail disposed along the lower surface of the lid,
Provided on the lower surface of the lid, and a bearing member which supports retractably the leading end of the rotation arm portion,
A lid opening / closing mechanism configured to close an upper portion of the printed circuit board by the lid; Auxiliary rails provided horizontally above the surface of the printed circuit board above the rotating shaft,
A moving member that moves along the auxiliary rail;
A moving drive unit for moving and driving the moving member;
The auxiliary rail and the moving member are arranged closer to the rotation axis with respect to the guide rail,
2. The lid opening / closing mechanism according to claim 1, wherein the rotating arm rotates about the rotation axis as the moving member moves, and the lid opens and closes in a plane parallel to the printed circuit board.   The lid opening / closing mechanism according to claim 1, further comprising a rotation driving unit that rotationally drives the rotation shaft. The lid is
A plane parallel to the printed circuit board surface;
The lid opening / closing mechanism according to any one of claims 1 to 3, wherein a curved portion that is curved downward with respect to a surface direction of the lid portion is provided at an opposite end portion of the lid portion. A soldering chamber;
A soldering device comprising a housing having an opening, and comprising a carry-out chamber for carrying out a printed circuit board from the soldering chamber;
The soldering chamber is
In the room, a flux application part that applies flux to the printed circuit board,
A preheating part for heating the printed circuit board coated with flux;
A soldering part for soldering to the heated printed circuit board,
The unloading chamber is
In the room, provided with a cooling unit for cooling the soldered printed circuit board,
A soldering apparatus, wherein the cooling unit includes the lid opening / closing mechanism according to claim 1.   The soldering apparatus according to claim 5, wherein the cooler sends gas from below between the rotating shaft and the elevating unit to above the cooling unit.

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