JP5279606B2 - Soldering equipment - Google Patents

Abstract

The invention provides a soldering device. The soldering device can reliably prevent the generation of collision between the conveying manipulator and the user. The conveying manipulator moves in a prescribed scope, to convey the printed-circuit board to the jet current soldering tin slot for performing tin soldering processing to the printed-circuit board. A protection gate is provided at the vicinity of the jet current soldering tin slot, the protection gate is used to partition the jet current soldering tin slot and the conveying manipulator moving in a specified scope and release the partition. Therefore, when maintenance operation and the like is performed to the soldering tin slot by the user due to the jet current soldering tin slot is stopped in the jet current soldering tin slot, even if the conveying manipulator performs the movement to convey the printed-circuit board to the jet current soldering tin slot, the conveying manipulator is also abutted to the gate, the movement of the conveying manipulator is stopped, so that the user can be protected from being damaged by the conveying manipulator. Therefore, the generation of collision between the conveying manipulator and the user can be reliably prevented.

Description

  The present invention relates to a soldering apparatus provided with a protective shutter in the vicinity of a jet solder bath.

  The soldering apparatus is an apparatus that performs soldering on an electronic device or the like mounted on a printed circuit board. In the soldering equipment, two jet solder baths are provided to improve the soldering production efficiency, and soldering is performed alternately, or lead-containing solder and lead-free solder are used separately in the two jet solder baths. Sometimes.

  In such a soldering apparatus, it is possible to stop one of the jet solder baths and perform maintenance work or changeover work for the stopped jet solder bath. That is, the operation of one jet solder bath is stopped, but the soldering apparatus can be operated without stopping by continuing production with the remaining solder bath.

  Patent Document 1 discloses a soldering apparatus in which a plurality of jet solder baths are arranged adjacent to each other. According to this soldering apparatus, a plurality of jet solder baths are arranged adjacent to each other on the moving body. A transport unit that transports the substrate is provided on one of the plurality of jet solder baths. A board | substrate is conveyed by this jet part solder solder bath, and a soldering process is carried out. The other jet solder bath is designed to allow maintenance work and setup change work.

Japanese Patent Laying-Open No. 2005-7401 (FIG. 1)

  By the way, according to Patent Document 1, since the maintenance work and the setup change work can be performed without stopping the soldering apparatus, the production efficiency is improved. However, since the jet solder bath for soldering and the jet solder bath for maintenance work and setup change work are adjacent to each other, the work user can touch the hot solder or transport the board. There is a risk of touching.

  Then, this invention solves the above-mentioned subject, Comprising: It aims at providing the soldering apparatus which can prevent reliably a conveyance part contacting a user.

  In order to solve the above-described problems, a soldering apparatus according to the present invention includes a plurality of jet solder baths that perform soldering processing on a substrate and a substrate that moves within a predetermined range and transports the substrate to the plurality of jet solder baths. And a shielding member which is provided in the vicinity of the jet solder bath and shields the jet solder bath from the transport portion moving within a predetermined range and releases the shielding.

  According to the soldering apparatus according to the present invention, the plurality of jet solder baths perform the soldering process of the substrate. A conveyance part moves within the predetermined range, and conveys a board | substrate to several jet solder tanks. The shielding member is provided in the vicinity of the jet solder bath, shields the jet solder bath from the transport unit moving within a predetermined range, and releases the shielding.

  As a result, when one or more of the plurality of jet solder baths are stopped and the user performs a maintenance operation or the like of the solder bath, the transport unit should move to transport the substrate to the jet solder bath. However, since the transport unit comes into contact with the shielding member and is prevented from moving, the user can be protected from the transport unit.

  According to the soldering apparatus according to the present invention, even if the transport unit moves the substrate to the jet solder bath performing maintenance work or the like, the transport unit abuts against the shielding member and the movement is prevented. Since the user can be protected, it is possible to reliably prevent the transport unit from coming into contact with the user.

It is a top view which shows the structural example of the soldering apparatus 1 which concerns on this invention. 1 is a block diagram illustrating a configuration example of a soldering apparatus 1. FIG. It is a top view which shows the operation example (the 1) of the soldering apparatus. It is a top view which shows the operation example (the 2) of the soldering apparatus. It is a perspective view which shows the structural example of the protective shutters 13 and 14. FIG. FIG. 3 is a plan view illustrating an exemplary configuration of a main part of a protective shutter 13. 3 is a plan view illustrating an exemplary configuration of a main part of a protective shutter 14. FIG. FIG. 6 is a perspective view showing an operation example (No. 1) of the protective shutter 13; 6 is an enlarged plan view showing an operation example (part 1) of the protective shutter 13. FIG. FIG. 9 is a perspective view showing an operation example (No. 2) of the protective shutter 13; FIG. 6 is an enlarged plan view showing an operation example (No. 2) of the protective shutter 13; FIG. 9 is a perspective view showing an operation example (No. 3) of the protective shutter 13; FIG. 9 is an enlarged plan view showing an operation example (No. 3) of the protective shutter 13; FIG. 6 is a perspective view showing an operation example (No. 1) of the protective shutter. FIG. 9 is a perspective view showing an operation example (No. 2) of the protective shutter.

  A soldering apparatus will be described below as an example of an embodiment according to the present invention with reference to the drawings.

[Configuration example of soldering apparatus 1]
As shown in FIG. 1, the soldering apparatus 1 is an example of a first jet solder bath (hereinafter referred to as a jet solder bath 5), a second jet solder bath (hereinafter referred to as a jet solder bath 6), and an example of a transport unit. An example of a transfer robot 8, a first protective shutter (hereinafter referred to as shutter 11), a second protective shutter (hereinafter referred to as shutter 12), a third protective shutter (hereinafter referred to as shutter 13), which are examples of a shielding member, and It is composed of a fourth protective shutter (hereinafter referred to as shutter 14). The soldering apparatus 1 further includes a transport rail unit 2, a fluxer unit 3, a preheater unit 4, a cooling unit 7, and a control unit 9.

  The conveyance rail unit 2 conveys a printed board on which various electronic components are mounted. The transport rail unit 2 is, for example, a so-called tact type in which a plurality of pushers (not shown) are provided at regular intervals and a transport tray on which a printed circuit board is attached is pressed against the transport direction by the pushers. In addition, for example, the transport rail unit 2 may transport a plurality of transport claws (not shown) adjacent to each other at a constant interval and sandwich the end of the printed circuit board with the transport claws.

  The transport rail unit 2 includes a first transport rail (hereinafter referred to as a transport rail 2a) and a second transport rail (hereinafter referred to as a transport rail 2b). The transport rail 2a and the transport rail 2b are provided in parallel to each other. The conveyance rail 2 a carries the printed circuit board into the soldering apparatus 1 and conveys it to the fluxer unit 3 and the preheater unit 4. The transport rail 2 b transports the printed circuit board to the cooling unit 7 and unloads it from the soldering apparatus 1.

  The fluxer unit 3 applies flux to the printed circuit board conveyed by the conveyance rail 2a. An organic solvent is used for the flux. For example, IPA (isopropyl alcohol) or the like is used. The fluxer unit 3 includes a first fluxer (hereinafter referred to as a fluxer 3a) and a second fluxer (hereinafter referred to as a fluxer 3b). By providing two fluxers like the fluxers 3a and 3b, the fluxers can be used separately for lead-containing solder and lead-free solder, or can be used properly depending on the type of printed circuit board and the type of flux.

  A preheater section 4 is adjacent to the fluxer section 3. The pre-heater unit 4 heats the printed circuit board, thereby drying the flux applied to the printed circuit board by the fluxer unit 3 and raising the printed circuit board uniformly to a predetermined temperature. When the printed board is heated in this way, the solder is likely to adhere to a predetermined portion of the printed board. For example, a halogen heater is used as the preheater unit 4. The halogen heater can rapidly heat the printed circuit board to a set temperature.

  A transfer robot 8 is installed in the vicinity of the preheater unit 4. The transfer robot 8 moves within a predetermined range. The transfer robot 8 transfers the printed circuit board heated by the preheater unit 4 to the jet solder bath 5 and / or the jet solder bath 6. Further, the transfer robot 8 transfers the printed circuit board on which the solder is formed in the jet solder tanks 5 and 6 to the transfer rail 2b.

  The jet solder bath 5 forms solder at a predetermined location on the printed circuit board that is transported by the transport robot 8. The jet solder tank 5 jets the molten solder pumped by the pump unit 5a onto the printed circuit board.

  A shutter 11 is provided in the vicinity of the jet solder bath 5. When the jet solder bath 5 is used, the shutter 11 is opened, and when the maintenance work or setup change operation of the jet solder bath 5 is performed, the shutter 11 is closed. The shutter 11 is provided with a first lever (hereinafter referred to as lever 15). The lever 15 can open and close the shutter 11. In FIG. 1, the shutter 11 is opened by pulling the lever 15 upward, and the shutter 11 is closed by pushing the lever 15 downward.

  A shutter 12 is provided at one end of the shutter 11 and in the vicinity of the jet solder bath 5. When the jet solder bath 5 is used, the shutter 12 is opened, and when the maintenance work or setup change operation of the jet solder bath 5 is performed, the shutter 12 is closed.

  A handle 12 d is provided on one end of the shutter 12 and on the side located outside the apparatus 1. The handle 12d can open and close the shutter 12. In FIG. 1, the shutter 12 is opened by pulling the handle 12d on the left side, and the shutter 12 is closed by pushing the handle 12d on the right side from the opened state.

  The shutters 11 and 12 block the jet solder bath 5 from the transfer robot 8 moving within a predetermined range or release the block. When performing maintenance work or setup change work, the first solder bath door (hereinafter referred to as solder bath door 17) is opened with the shutter 11 closed. Thereby, even if it does not pull out the jet solder tank 5, the maintenance operation | work of the jet solder tank 5, a setup change operation, etc. can be performed. As a result, the space for the soldering apparatus 1 can be saved.

  When the user performs maintenance work or setup change work on the jet solder bath 5, even if the transport robot 8 malfunctions and moves the transport board to the jet solder bath 5, the shutter 11 and / or the shutter If 12 is closed, the transfer robot 8 comes into contact with the shutters 11 and 12 to prevent the movement. Thereby, the user can be protected from the transfer robot 8. Furthermore, since the jet solder tank 5 is not removed from the soldering apparatus 1 when setting the conditions of the jet solder tank 5 after the maintenance work or the setup change work, the solder is kept in the same state as before the maintenance work or the setup change work. Can be attached. As a result, the condition reproducibility of the jet solder bath 5 is improved.

  A jet solder bath 6 is provided in the jet solder bath 5 at a predetermined distance. The jet solder tank 6 forms solder at a predetermined location on the printed circuit board that is transported by the transport robot 8. The jet solder tank 6 jets the molten solder fed by the pump unit 6 a onto the printed circuit board in the same manner as the jet solder tank 5.

  The shutter 13, lever 16, shutter 14, handle 14 d and solder bath door 17 provided in the vicinity of the jet solder bath 6 are connected to the shutter 11, shutter 12, lever 15, handle 12 d and solder bath door 18 of the jet solder bath 5. Since they correspond to each other, detailed description is omitted.

  A cooling unit 7 is provided in parallel to the fluxer unit 3 and the preheater unit 4. The cooling unit 7 includes a first cooling fan (hereinafter referred to as a cooling fan 7a), a second cooling fan (hereinafter referred to as a cooling fan 7b), and a third cooling fan (hereinafter referred to as a cooling fan 7c). The cooling unit 7 cools the printed circuit board soldered in the jet solder baths 5 and 6 by the cooling fans 7a, 7b, and 7c.

  In FIG. 1, a control unit 9 is provided above the jet solder baths 5 and 6. As shown in FIG. 2, the control unit 9 includes a transport rail unit 2, a fluxer unit 3, a preheater unit 4, jet solder baths 5 and 6, a cooling unit 7, a transport robot 8, shutters 11, 12, 13, and 14. The operation units 10 are connected to each other. When the user operates the operation unit 10, the control unit 9 causes the conveyance speed of the conveyance rails 2 a and 2 b of the conveyance rail unit 2, the timing of conveying the printed circuit board, the temperature of the flux that the fluxer unit 3 has, and the amount of flux applied The temperature of the preheater unit 4, the temperature of the molten solder in the jet solder baths 5 and 6, the jet velocity of the solder, the ON / OFF of the cooling fans 7a, 7b, 7c of the cooling unit 7, the operation of the transfer robot 8 and the like are controlled. .

  In this example, the cooling fans 7a, 7b, and 7c are controlled only for ON / OFF, but may be controlled by setting the cooling temperatures as necessary. In that case, the printed circuit board can be cooled with a desired temperature profile.

  Further, when the user carelessly opens at least one of the shutters 11, 12, 13, and 14, the control unit 9 stops the operation of the transfer robot 8, so that the transfer robot 8 collides with the user. The danger of doing can be avoided. The control unit 9 not only stops the operation of the transfer robot 8 when the shutters 11, 12, 13, and 14 are opened, but also the transfer rail unit 2, the fluxer unit 3, the preheater unit 4, and the jet solder bath. 5, 6 and the operation of the cooling unit 7 may be stopped. Thereby, safety can be further improved.

  The transport robot 8 is provided with a contact sensor (not shown). When the transport robot 8 contacts the shutters 11, 12, 13, and 14, the contact sensor detects the contact and outputs the detection result to the control unit 9. The control unit 9 receives the detection result and outputs a stop signal to the transfer robot 8 so as to stop the transfer robot 8. As a result, even if the transport robot 8 malfunctions and contacts at least one of the shutters 11, 12, 13, and 14, the contact sensor detects the contact, and the control unit 9 detects the transport robot. Therefore, the user can be surely protected from the transfer robot 8.

[Example of operation of soldering apparatus 1]
Next, an operation example of the soldering apparatus 1 will be described. It is assumed that the user performs various settings using the operation unit 10 and that each unit is operated by the control unit 9.

  First, the case where the shutters 11, 12, 13, and 14 are opened and the jet solder baths 5 and 6 can be used will be described. As shown in FIG. 3, the printed circuit board P <b> 1 is carried into the conveyance rail 2 a of the conveyance rail unit 2. The printed circuit board P1 is conveyed to the fluxer unit 3 by the conveyance rail 2a. In the fluxer unit 3, for example, when the electronic components mounted on the printed circuit board are located at different locations, flux is applied to a predetermined location by the fluxer 3a, and flux is applied to locations other than the predetermined location by the fluxer 3b. The In this way, if the flux application portions are changed by the fluxers 3a and 3b, the flux can be applied efficiently and the working time can be shortened.

  The printed circuit board P1 to which the flux is applied by the fluxer unit 3 is conveyed to the preheater unit 4 by the conveyance rail 2a. In the preheater unit 4, the flux applied to the printed circuit board P1 is dried, and the printed circuit board P1 is heated to a predetermined temperature. The printed circuit board P <b> 1 heated to a predetermined temperature by the preheater unit 4 is transported to the jet solder bath 5 and / or jet solder bath 6 by the transport robot 8.

  The soldering process by the jet solder baths 5 and 6 is performed by, for example, forming solder at a predetermined position of the printed circuit board P1 by the jet solder bath 5, and transporting the printed circuit board P1 to the jet solder bath 6 by the transport robot 8 Solder is formed in a place other than a predetermined place of the printed circuit board P1 by the solder tank 6, and the printed circuit board P1 is transported to the transport rail 2b by the transport robot 8. In the soldering process, solder may be formed on a predetermined portion of the printed circuit board P1 by the jet solder bath 5, and the printed circuit board P1 may be transported to the transport rail 2b by the transport robot 8.

  The printed circuit board P1 soldered in the jet solder baths 5 and 6 is transported to the cooling unit 7 by the transport rail 2b. In the cooling unit 7, the printed circuit board P1 is cooled to a predetermined temperature by the cooling fans 7a, 7b, and 7c.

  Next, a case will be described in which the shutters 11 and 12 are closed to perform maintenance work or setup change work of the jet solder bath 5 and the shutters 13 and 14 are opened and only the jet solder bath 6 can be used.

  As shown in FIG. 4, the printed circuit board P <b> 2 is carried into the conveyance rail 2 a of the conveyance rail unit 2. The printed circuit board P2 is transported to the fluxer unit 3 by the transport rail 2a.

  The printed circuit board P2 to which the flux is applied by the fluxer unit 3 is conveyed to the preheater unit 4 by the conveyance rail 2a. In the preheater unit 4, the flux applied to the printed circuit board P2 is dried, and the printed circuit board P2 is heated to a predetermined temperature.

  The printed circuit board P <b> 2 heated to a predetermined temperature by the preheater unit 4 is transported to the jet solder bath 6 by the transport robot 8. In the jet solder bath 6, the shutters 13 and 14 are open. The jet solder bath 5 is in a state in which the solder bath door 17 is opened and the shutters 11 and 12 are closed in order to perform maintenance work. Since the shutters 11 and 12 are closed, even if the transfer robot 8 malfunctions and the printed board P2 is transferred to the jet solder bath 5, the transfer robot 8 contacts the shutters 11 and 12. To prevent the movement. If there is an abnormal contact with the transfer robot 8, the contact sensor of the transfer robot 8 detects the contact, and the control unit 9 stops the transfer robot 8. Thereby, it can prevent reliably that the conveyance robot 8 contact | abuts to a user.

  The printed circuit board P2 soldered in the jet solder bath 6 is transported to the cooling unit 7 by the transport rail 2b. In the cooling unit 7, the printed circuit board P2 is cooled to a predetermined temperature by the cooling fans 7a, 7b, and 7c. This cooling can prevent cracks in the solder formed on the printed circuit board P2.

[Configuration Example of Shutters 13 and 14]
Next, a configuration example of the shutters 13 and 14 will be described. FIG. 5 shows a state in which the shutters 13 and 14 are closed. As shown in FIG. 5, the shutters 13 and 14 and the solder bath door 18 are provided on the upper portion of the side plate 21. The shutter 13 is connected to a lever 16 and operates to be opened and closed by the lever 16. The lever 16 is provided so as to be housed in the control unit 9. The shutter 14 includes a handle 14d, and the shutter 14 is opened and closed by the handle 14d. The solder bath door 18 is provided with a handle (not shown), and can be opened and closed by this handle.

  The shutter 13 includes a first window (hereinafter referred to as window 13a), a second window (hereinafter referred to as window 13b), and a third window (hereinafter referred to as window 13c). Further, as shown in FIG. 6, the shutter 13 is a rail portion 20, a first stopper (hereinafter referred to as a stopper 13 e), a second stopper (hereinafter referred to as a stopper 13 f), and an open / close detection sensor. A detection sensor 13d is provided.

  The window 13a has a frame 13h and a plate 13i. The window 13b has a frame 13j and a plate 13k. The window 13c has a frame 13l and a plate 13m. The frames 13h, 13j, and 13l are made of metal such as aluminum, synthetic resin, or the like. The plates 13i, 13k, 13m are made of a transparent synthetic resin or the like. If the plates 13i, 13k, and 13m are transparent, the operation of each part in the soldering apparatus 1 can be confirmed, so that when a problem occurs in each part, it is possible to respond quickly.

  A lever 16 is connected to the frame 13h of the window 13a. The frame 13h is provided with an open / close detection sensor 13d. The open / close detection sensor 13 d detects the opening and closing of the shutter 13 and outputs the detection result to the control unit 9. A first rail (hereinafter referred to as rail 20a) of the rail portion 20 is laid on the side plate 21, and a window 13a is provided on the rail 20a. The window 13a is guided in a predetermined direction (upward direction in FIG. 6) by the rail 20a.

  A stopper 13e is provided on the frame 13j of the window 13b. One end of the stopper 13e contacts a part of the frame 13h. A second rail (hereinafter referred to as rail 20b) of the rail portion 20 is laid on the side plate 21, and a window 13b is provided on the rail 20b. The window 13b is guided in a predetermined direction (upward direction in FIG. 6) by the rail 20b.

  A stopper 13f is provided on the frame 13l of the window 13c. One end of the stopper 13f contacts a part of the frame 13j. A third rail (hereinafter referred to as rail 20c) of the rail portion 20 is laid on the side plate 21, and a window 13c is provided on the rail 20c. The window 13c is fixed by the rail 20c.

  As shown in FIG. 7, the shutter 14 includes a shutter main body portion 14a, a column portion 14b, a hinge portion 14c, and a handle 14d. The shutter main body portion 14a and the column portion 14b are provided adjacent to each other, and are connected via a hinge portion 14c. A handle 14d is provided on the shutter body 14a. When the handle 14d is pulled, the shutter 14 is opened, and when the handle 14d is pressed, the shutter 14 is closed. In the state where the shutter 14 is opened, the column portion 14b is supported by the side plate 21, and the shutter main body portion 14a is movable via the hinge portion 14c.

[Operation example of shutters 13 and 14]
Next, an operation of changing the shutter 13 from the closed state to the opened state will be described. As shown in FIGS. 5 and 6, it is assumed that the shutter 13 is closed. As shown in FIG. 8, when the lever 16 is pulled by the user, the window 13a connected to the lever 16 is pulled out. An open / close detection sensor 13d provided in the window 13a detects the opening of the shutter 13, and outputs a detection result to the control unit 9. For example, the control unit 9 is provided with a lamp (not shown), and the lamp is turned on when the shutter 13 is opened. Thereby, the user can recognize that the shutter 13 is opened. As shown in FIG. 9, when the user pulls the lever 16 in a predetermined direction (upward direction in FIG. 9), the window 13a moves along the rail 20a. The moving window 13a comes into contact with the stopper 13e of the window 13b on the frame 13h of the window 13a and stops moving.

  As shown in FIG. 10, when the lever 16 is further pulled by the user, the frame 13h and the stopper 13e shown in FIG. 9 are in contact with each other, so that the window 13b is pulled out together with the window 13a. The shutter 13 is opened so that the windows 13a, 13b, and 13c overlap. As shown in FIG. 11, when the user pulls the lever 16 in a predetermined direction (upward in FIG. 11), the window 13b moves along with the rails 20a and 20b together with the window 13a. The moving windows 13a and 13b stop moving when the stopper 13f of the window 13c comes into contact with the frame 13j of the window 13b. By such an operation, the shutter 13 is changed from the closed state to the opened state.

  Next, an operation of changing the shutter 13 from the opened state to the closed state will be described. As shown in FIGS. 10 and 11, it is assumed that the shutter 13 is open. As shown in FIG. 12, when the lever 16 is pushed by the user, the window 13a is pushed out. As shown in FIG. 13, when the user pushes the lever 16 in a predetermined direction (downward in FIG. 13), the window 13a moves along the rail 20a. The moving window 13a abuts a stopper 13e of the window 13b on a frame 13h of the window 13a.

  When the lever 16 is further pushed by the user, the frame 13h and the stopper 3e are in contact with each other, so that the window 13b is pushed out together with the window 13a as shown in FIG. When the windows 13a and 13b are completely pushed out, an open / close detection sensor 13d provided in the window 13a detects the closing of the shutter 13 and outputs a detection result to the control unit 9. For example, when the shutter 13 is closed, the lamp is turned off. Thereby, the user can recognize that the shutter 13 is closed. By such an operation, the shutter 13 is changed from the opened state to the closed state.

  Next, an operation of changing the shutter 14 from the closed state to the opened state will be described. As shown in FIG. 10, it is assumed that the shutter 13 is open. As shown in FIG. 14, when the handle 14d is pulled by the user, the shutter 14 is pulled out. An open / close detection sensor (not shown) provided in the shutter 14 detects the opening of the shutter 14 and outputs a detection result to the control unit 9. For example, when the shutter 14 is opened, a lamp (not shown) connected to the control unit 9 is turned on.

  As shown in FIG. 7, since the shutter 14 is provided with a hinge portion 14c between the shutter main body portion 14a and the column portion 14b, the shutter main body portion 14a is rotatable about the column portion 14b. become. Therefore, the shutter 14 pulled out by the handle 14d overlaps the solder bath door 18 as shown in FIG. The operation of changing the shutter 14 from the opened state to the closed state is the reverse of the above-described operation.

  Thus, according to the soldering apparatus 1 according to the present embodiment, the shutters 11, 12, 13, and 14 are provided in the vicinity of the jet solder baths 5 and 6, and the transfer robot 8 that moves within a predetermined range. Then, the jet solder baths 5 and 6 are blocked and the shielding is released.

  Thus, for example, when the user performs a maintenance operation of the solder bath 6 by stopping the jet solder bath 6 among the jet solder baths 5 and 6, the transfer robot 8 prints to the jet solder bath 6. Even when the substrate is moved, the transfer robot 8 comes into contact with the shutters 13 and 14 and is prevented from moving, so that the user can be protected from the transfer robot 8. As a result, it is possible to reliably prevent the transfer robot 8 from colliding with the user.

  In the present embodiment, the shutters 13 and 14 installed on the jet solder bath 6 side have been described, but the shutters 11 and 12 installed on the jet solder bath 5 side also have the same configuration and operation. In the present embodiment, the shutters 11 and 13 are opened and closed by the levers 15 and 16, and the shutters 12 and 14 are opened and closed by the handles 12d and 14d. However, the shutters 11, 12, 13, and 14 are provided with driving means. The shutters 11, 12, 13, and 14 may be opened and closed by the driving means. The drive means is composed of, for example, a motor. In the present embodiment, the open / close detection sensor 13d is provided on the frame 13h. However, it may be provided anywhere as long as the opening / closing of the shutter 13 can be detected.

DESCRIPTION OF SYMBOLS 1 Soldering apparatus 2 Conveying rail part 3 Fluxer part 4 Preheater part 5 1st jet solder tank 6 2nd jet solder tank 7 Cooling part 8 Conveying robot 9 Control part 11 1st protective shutter 12 2nd protective shutter 13 Third protective shutter 14 Fourth protective shutter 15 First lever 16 Second lever 17 First solder bath door 18 Second solder bath door

Claims (4)

A plurality of jet solder baths for soldering the substrate;
A transport unit that moves within a predetermined range and transports the substrate to the plurality of jet solder baths;
A soldering apparatus, comprising: a shielding member that is provided in the vicinity of the jet solder bath and shields the jet solder bath from the transport unit that moves within the predetermined range and releases the shield. The shielding member is provided for each of the plurality of jet solder baths,
The conveyance unit stops when one or more of the plurality of jet solder baths stop and the shielding member corresponding to the stopped jet solder bath releases the shielding. The soldering apparatus described. The transport unit is provided with a contact sensor,
The soldering apparatus according to claim 1, wherein when the contact sensor comes into contact with the shielding member, the conveyance unit stops. The shielding member is provided with a shielding detection sensor,
2. The soldering apparatus according to claim 1, wherein the shielding detection sensor detects that the jet solder tank is shielded by the shielding member from the transport unit and that the shielding is released.

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