CN101885096A - Soldering apparatus - Google Patents
Soldering apparatus Download PDFInfo
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- CN101885096A CN101885096A CN2010101741690A CN201010174169A CN101885096A CN 101885096 A CN101885096 A CN 101885096A CN 2010101741690 A CN2010101741690 A CN 2010101741690A CN 201010174169 A CN201010174169 A CN 201010174169A CN 101885096 A CN101885096 A CN 101885096A
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- jet solder
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- mechanical arm
- solder vessel
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Abstract
The invention provides a kind of soldering apparatus.This soldering apparatus can prevent reliably that conveying mechanical arm and user from bumping.Conveying mechanical arm moves within the limits prescribed, carries this printed circuit board (PCB) to the jet solder vessel that printed circuit board (PCB) is carried out the soldering processing.The protection gate be arranged on jet solder vessel near, the protection gate is used to make in prescribed limit the conveying mechanical arm that moves with the jet solder vessel partition and remove this partition.Thus; in making jet solder vessel, for example jet solder vessel stops and when by the user this solder bath being carried out upkeep operation etc.; even if conveying mechanical arm carries out carrying moving of printed circuit board (PCB) to this jet solder vessel; conveying mechanical arm also with the gate butt; the mobile of conveying mechanical arm is prevented from; therefore, can protect the user not to be subjected to the injury of conveying mechanical arm.Thus, can prevent reliably that conveying mechanical arm and user from bumping.
Description
Technical field
The present invention relates near a kind of soldering apparatus that jet solder vessel, is provided with protection gate (shutter).
Background technology
Soldering apparatus is the device that electronic device that is installed on printed circuit board (PCB) etc. is carried out soldering.In soldering apparatus,, two jet solder vessels are set sometimes and alternately carry out soldering or in two jet solder vessels, use leaded scolding tin and Pb-free solder respectively in order to improve the production efficiency of soldering.
In such soldering apparatus, a jet solder vessel is stopped and this jet solder vessel that stops to be carried out upkeep operation, changes and produce to adjust operation.That is,,, can make the soldering apparatus running by in a remaining solder bath, continuing production though the action of a jet solder vessel is stopped with not stopping.
The soldering apparatus that makes a plurality of jet solder vessel disposed adjacent is disclosed in patent documentation 1.Adopt this soldering apparatus, on moving body, be adjacent to dispose a plurality of jet solder vessels.Be provided with the delivery section of conveying substrate on the jet solder vessel in a plurality of jet solder vessels.Utilize this delivery section that substrate is transported to a jet solder vessel and carry out the soldering processing.Another jet solder vessel can carry out upkeep operation, change to produce and adjust operation.
Patent documentation 1: TOHKEMY 2005-7401 communique (the 1st figure)
But, adopt patent documentation 1, do not stop soldering apparatus and just can carry out upkeep operation, change to produce and adjust operation, therefore, improved production efficiency.But owing to carry out jet solder vessel that soldering handles and carry out upkeep operation, change that to produce the jet solder vessel of adjusting operation adjacent, therefore, the user who carries out operation might contact with the scolding tin of high temperature or contact with the delivery section of conveying substrate.
Summary of the invention
Therefore, the invention solves above-mentioned problem, its purpose is to provide a kind of can prevent the soldering apparatus that delivery section contacts with the user reliably.
In order to solve above-mentioned problem, soldering apparatus of the present invention is characterised in that, comprising: a plurality of jet solder vessels, and it is used for that substrate is carried out soldering and handles; Delivery section, it moves and within the limits prescribed to a plurality of jet solder vessel conveying substrates; And shut-off member, its be set at jet solder vessel near, it is used to make in prescribed limit the delivery section that moves with the jet solder vessel partition and remove this partition.
Adopt soldering apparatus of the present invention, a plurality of jet solder vessels carry out soldering to substrate to be handled.Delivery section moves within the limits prescribed, to a plurality of jet solder vessel conveying substrates.Shut-off member be arranged on jet solder vessel near, it is used to make in prescribed limit the delivery section that moves with the jet solder vessel partition and remove this partition.
Thus; stopping more than one and user when this solder bath is carried out upkeep operation etc. in making a plurality of jet solder vessels; even if delivery section is carried out moving to this jet solder vessel conveying substrate; delivery section also with the shut-off member butt; the mobile of delivery section is prevented from; therefore, can protect the user not to be subjected to the injury of delivery section.
Adopt soldering apparatus of the present invention, even if delivery section is carried out the moving of jet solder vessel conveying substrate in upkeep operation etc., delivery section also with the shut-off member butt; the mobile of delivery section is prevented from; can protect the user, therefore, can prevent reliably that delivery section from contacting with the user.
Description of drawings
Fig. 1 is the vertical view of the structure example of expression soldering apparatus 1 of the present invention.
Fig. 2 is the block diagram of the structure example of expression soldering apparatus 1.
Fig. 3 be the expression soldering apparatus 1 the action example (one of) vertical view.
Fig. 4 is the vertical view of the action example (two) of expression soldering apparatus 1.
Fig. 5 is the stereogram of the structure example of expression protection gate 13,14.
Fig. 6 is the vertical view of the major part structure example of expression protection gate 13.
Fig. 7 is the vertical view of the major part structure example of expression protection gate 14.
Fig. 8 be expression protection gate 13 the action example (one of) stereogram.
Fig. 9 be expression protection gate 13 the action example (one of) amplification plan view.
Figure 10 is the stereogram of the action example (two) of expression protection gate 13.
Figure 11 is the amplification plan view of the action example (two) of expression protection gate 13.
Figure 12 is the stereogram of the action example (three) of expression protection gate 13.
Figure 13 is the amplification plan view of the action example (three) of expression protection gate 13.
Figure 14 be expression protection gate 14 the action example (one of) stereogram.
Figure 15 is the stereogram of the action example (two) of expression protection gate 14.
The specific embodiment
Below, with reference to accompanying drawing, as an example explanation soldering apparatus of embodiments of the present invention.
The structure example of soldering apparatus 1
As shown in Figure 1, soldering apparatus 1 is by the 1st jet solder vessel (below be called jet solder vessel 5), the 2nd jet solder vessel (below be called jet solder vessel 6), as the conveying mechanical arm 8 of an example of delivery section, constitute as the 1st protection gate of an example of shut-off member (below be called gate 11), the 2nd protection gate (below be called gate 12), the 3rd protection gate (below be called gate 13) and the 4th protection gate (below be called gate 14).Soldering apparatus 1 also comprises delivery track portion 2, flux coating portion 3, preheats portion 4, cooling end 7 and control part 9.
It is adjacent with flux coating portion 3 to preheat portion 4.Preheat portion 4 and make and utilize flux coating portion 3 to be coated on the solder flux drying of printed circuit board (PCB), and make printed circuit board (PCB) rise to the temperature of regulation equably by the heating printed circuit board (PCB).When heating printed circuit board (PCB) like this, scolding tin is easy to the regulation position attached to printed circuit board (PCB).Preheat portion 4 and for example can adopt halogen heater.Halogen heater can be heated to printed circuit board (PCB) the temperature of setting rapidly.
Near jet solder vessel 5, be provided with gate 11.When using jet solder vessel 5, gate 11 is in the state of opening, and jet solder vessel 5 is being carried out upkeep operation, changing and produce when adjusting operation, and gate 11 is in closing state.Be provided with the 1st action bars (below be called operating operation bar 15) on the gate 11.Action bars 15 can open or close gate 11.In Fig. 1, open the sluices 11 by the moving action bars 15 of the layback that makes progress, come closed shutter 11 by the moving action bars 15 of downward thruster.
Near end of gate 11 and jet solder vessel 5, be provided with gate 12.When using jet solder vessel 5, gate 12 is in the state of opening, and jet solder vessel 5 is being carried out upkeep operation, changing and produce when adjusting operation, and gate 12 is in closing state.
Be provided with handle 12d at end of gate 12 and the side that is positioned at the outside of device 1.This handle 12d can open or close gate 12.In Fig. 1, open the sluices 12 by pull handle 12d to the left, promote handle 12d to the right by the state of opening certainly and come closed shutter 12.
The user jet solder vessel 5 is carried out upkeep operation, changes when produce adjusting operation etc., even if conveying mechanical arm 8 maloperations and carry out printed circuit board (PCB) is transported to the operation of jet solder vessel 5, as long as gate 11 and/or gate 12 are closed, conveying mechanical arm 8 also just with these gate 11,12 butts, the mobile of conveying mechanical arm 8 is prevented from.Thus, can protect the user not to be subjected to conveying mechanical arm 8 injuries.And, at upkeep operation, change and produce to adjust after the end of job, when jet solder vessel 5 is carried out condition enactment, do not unload this jet solder vessel 5 from soldering apparatus 1, therefore, can with upkeep operation, change to produce under the state identical before adjusting operation and carry out soldering.As a result, improved the condition repeatability of jet solder vessel 5.
Be provided with jet solder vessel 6 apart from jet solder vessel 5 with separating predetermined distance.Jet solder vessel 6 forms scolding tin at the regulation position of the printed circuit board (PCB) that is transported by conveying mechanical arm 8.Jet solder vessel 6 similarly sprays the fusion scolding tin that utilizes the 6a of pump portion pressurized delivered to printed circuit board (PCB) with above-mentioned jet solder vessel 5.
The gate 13, action bars 16, gate 14, handle 14d and the solder bath door 18 that are arranged near the jet solder vessel 6 are corresponding with gate 11, action bars 15, gate 12, handle 12d and the solder bath door 17 of jet solder vessel 5 respectively, therefore, omission explains.
With flux coating portion 3 and preheat portion 4 and be provided with cooling end 7 side by side.Cooling end 7 has the 1st cooling fan (below be called cooling fan 7a), the 2nd cooling fan (below be called cooling fan 7b) and the 3rd cooling fan (below be called cooling fan 7c).Cooling end 7 utilizes cooling fan 7a, 7b, 7c to being cooled off by the printed circuit board (PCB) after the soldering processing in jet solder vessel 5,6.
In Fig. 1, be provided with control part 9 at the upside of jet solder vessel 5,6.As shown in Figure 2, on control part 9, be connected with respectively delivery track portion 2, flux coating portion 3, preheat portion 4, jet solder vessel 5,6, cooling end 7, conveying mechanical arm 8, gate 11,12,13,14 and operating portion 10.By the user operating portion 10 is operated, the temperature of the fusion scolding tin of the opportunity of the transporting velocity of delivery track 2a, the 2b of 9 pairs of delivery track portions 2 of control part, conveying printed circuit board (PCB), the temperature of the solder flux that flux coating portion 3 had, the coating amount of solder flux, the temperature that preheats portion 4, jet solder vessel 5,6, the jet velocity of scolding tin, cooling fan 7a, the 7b that cooling end 7 had, the ON/OFF of 7c, the action of conveying mechanical arm 8 etc. are controlled.
In addition, in the present example, cooling fan 7a, 7b, 7c control with ON/OFF, control but also can set chilling temperature as required respectively.In this case, can be with the Temperature Distribution cooling printed circuit board (PCB) of expectation.
In addition, opened because of carelessness under the situation of at least one gate in the gate 11,12,13,14 the user, control part 9 makes conveying mechanical arm 8 stop action, therefore, can avoid conveying mechanical arm 8 and user's mode to collide such danger.In addition, when gate 11,12,13,14 was opened, control part 9 also can not only make conveying mechanical arm 8 stop action, also made delivery track portion 2, flux coating portion 3, preheated portion 4, jet solder vessel 5,6, cooling end 7 stop action.Thus, can further improve security.
On conveying mechanical arm 8, also be provided with not shown feeler.When conveying mechanical arm 8 contacted with gate 11,12,13,14, feeler detected this contact, and this testing result is outputed to control part 9.Control part 9 receives this testing result and to conveying mechanical arm 8 output stop signals, makes conveying mechanical arm 8 stop.Thus; even if conveying mechanical arm 8 maloperations and contacting with at least one gate in the gate 11,12,13,14, feeler also can detect this contact, and control part 9 makes conveying mechanical arm 8 stop to move; therefore, can protect the user not to be subjected to the injury of conveying mechanical arm 8 reliably.
The action example of soldering apparatus 1
The action example of soldering apparatus 1 then, is described.Its prerequisite is that the user utilizes operating portion 10 to carry out various settings, utilizes control part 9 to make each action.
At first, open and can use the situation of jet solder vessel 5,6 to describe to gate 11,12,13,14.As shown in Figure 3, printed circuit board (PCB) P1 is moved on the delivery track 2a of delivery track portion 2.Printed circuit board (PCB) P1 is transferred track 2a and is transported to flux coating portion 3.In flux coating portion 3, for example be under the situation at position of each self-separation at the electronic component that is installed on printed circuit board (PCB), utilize the position coating solder flux of fluxer 3a, utilize fluxer 3b the coating of the position except that regulation position solder flux to regulation.Like this, change respectively by fluxer 3a, 3b the coating solder flux the position time, can apply solder flux efficiently, thereby can shorten the activity duration.
The printed circuit board (PCB) P1 that is coated with solder flux by flux coating portion 3 is transferred track 2a and is transported to the portion of preheating 4.In preheating portion 4, make the solder flux drying that is coated on printed circuit board (PCB) P1, printed circuit board (PCB) P1 is heated to the temperature of regulation.Be transferred manipulator 8 and be transported to jet solder vessel 5 and/or jet solder vessel 6 by preheating printed circuit board (PCB) P1 that portion 4 is heated to set point of temperature.
The soldering processing of being undertaken by jet solder vessel 5,6 for example utilizes jet solder vessel 5 to form scolding tin at the regulation position of printed circuit board (PCB) P1, utilize conveying mechanical arm 8 that this printed circuit board (PCB) P1 is transported to jet solder vessel 6, utilize jet solder vessel 6 that the position except that the regulation position of printed circuit board (PCB) P1 is formed scolding tin, utilize conveying mechanical arm 8 that this printed circuit board (PCB) P1 is transported on the delivery track 2b.In addition, soldering is handled and also can be utilized jet solder vessel 5 to form scolding tin at the regulation position of printed circuit board (PCB) P1, utilizes conveying mechanical arm 8 that this printed circuit board (PCB) P1 is transported on the delivery track 2b.
Printed circuit board (PCB) P1 after soldering is handled in jet solder vessel 5,6 is transferred track 2b and is transported to cooling end 7.In cooling end 7, be cooled fan 7a, 7b, 7c of printed circuit board (PCB) P1 is cooled to the temperature of regulation.
Then, gate 11,12 is closed and jet solder vessel 5 is carried out upkeep operation, changes that produce to adjust operation, gate 13,14 open and only can use the situation of jet solder vessel 6 to describe.
As shown in Figure 4, printed circuit board (PCB) P2 is moved on the delivery track 2a of delivery track portion 2.Printed circuit board (PCB) P2 is transferred track 2a and is transported to flux coating portion 3.
The printed circuit board (PCB) P2 that is coated with solder flux by flux coating portion 3 is transferred track 2a and is transported to the portion of preheating 4.In preheating portion 4, make the solder flux drying that is coated on printed circuit board (PCB) P2, printed circuit board (PCB) P2 is heated to the temperature of regulation.
Be transferred manipulator 8 and be transported to jet solder vessel 6 by preheating printed circuit board (PCB) P2 that portion 4 is heated to set point of temperature.Jet solder vessel 6 is in the state that gate 13,14 is opened.In order to carry out upkeep operation, jet solder vessel 5 becomes solder bath door 17 opened state and gate 11,12 closing state.Because gate 11,12 closes, therefore, even if conveying mechanical arm 8 maloperations and carry out printed circuit board (PCB) P2 is transported to the action of jet solder vessel 5, conveying mechanical arm 8 also with gate 11,12 butts, the mobile of conveying mechanical arm 8 is prevented from.In addition, when having unusual the contact in conveying mechanical arm 8, the feeler of conveying mechanical arm 8 detects this contact, and control part 9 stops this conveying mechanical arm 8.Thus, can prevent conveying mechanical arm 8 and user's butt reliably.
Printed circuit board (PCB) P2 after scolding tin is handled in jet solder vessel 6 is transferred track 2b and is transported to cooling end 7.In cooling end 7, utilize cooling fan 7a, 7b, 7c printed circuit board (PCB) P2 to be cooled to the temperature of regulation.By this cooling, can prevent that the scolding tin that is formed at printed circuit board (PCB) P2 from producing the crack.
The structure example of gate 13,14
The structure example of gate 13,14 then, is described.Fig. 5 represents gate 13,14 closing state.As shown in Figure 5, gate 13,14 and solder bath door 18 are arranged on the top of side plate 21.Gate 13 is connected in action bars 16, and it utilizes action bars 16 to open or close action freely.Action bars 16 can be contained in control part 9 ground settings thereon.Gate 14 comprises handle 14d.It utilizes this handle 14d to open or closes action freely.Solder bath door 18 comprises not shown handle, and it utilizes this handle opening or closes action freely.
Window 13a has frame 13h and plate 13i.Window 13b has frame 13j and plate 13k.Window 13c has frame 13l and plate 13m.Frame 13h, 13j, 13l are made of metals such as aluminium, synthetic resin etc.Plate 13i, 13k, 13m are made of transparent synthetic resin etc.If plate 13i, 13k, 13m are transparent, then can confirm the action of each one in the soldering apparatus 1, therefore, produce in each one and can tackle at top speed when bad.
On the frame 13h of window 13a, be connected with action bars 16.On frame 13h, also be provided with open-close detection sensor 13d.Open-close detection sensor 13d is used to detect opening and closing of gate 13, and this testing result is outputed to control part 9.The 1st track that orbit portion 20 is had (below be called track 20a) is laid on the side plate 21, is provided with window 13a on this track 20a.Window 13a is guided to prescribed direction (the last side direction among Fig. 6) by track 20a.
On the frame 13j of window 13b, be provided with stop part 13e.The end of stop part 13e and a part of butt of frame 13h.The 2nd track that orbit portion 20 is had (below be called track 20b) is laid on the side plate 21, is provided with window 13b on this track 20b.Window 13b is guided to prescribed direction (the last side direction among Fig. 6) by track 20b.
On the frame 13l of window 13c, be provided with stop part 13f.The end of stop part 13f and a part of butt of frame 13j.The 3rd track that orbit portion 20 is had (below be called track 20c) is laid on the side plate 21, is provided with window 13c on this track 20c.Window 13c is fixed by track 20c.
As shown in Figure 7, gate 14 comprises gate main part 14a, the 14b of post portion, hinge part 14c and handle 14d.Gate main part 14a and the adjacent setting of the 14b of post portion, 14c is connected by hinge part.On gate main part 14a, be provided with handle 14d.During pull handle 14d, gate 14 is opened, and when promoting handle 14d, gate 14 is closed.Under 14 the state of opening the sluices, the 14b of post portion is supported on side plate 21, and gate main part 14a is by hinge part 14c freedom of movement.
The action example of gate 13,14
Then, illustrate that gate 13 becomes the action of opened state from closing state.As shown in Figure 5 and Figure 6, be prerequisite with gate 13 closing state.As shown in Figure 8, by user's pull joystick 16 time, pull out the window 13a that this action bars 16 is connected.The open-close detection sensor 13d that is arranged at window 13a detects the opening of gate 13, to control part 9 output testing results.For example, be provided with not shown lamp in control part 9, when gate 13 was opened, lamp was lighted.Thus, the user can discern the situation that gate 13 has been opened.As shown in Figure 9, during to prescribed direction (the last side direction among Fig. 9) pull joystick 16, window 13a moves along delivery track 2a the user.The stop part 13e butt that frame 13h that this window 13a is had and window 13b are had, mobile the mobile of window 13a stops.
As shown in figure 10, by the further pull joystick 16 of user the time, frame 13h shown in Figure 9 and stop part 13e butt, therefore, window 13b and window 13a together are drawn out.Window 13a, the 13b of gate 13,13c overlap and gate 13 openings.As shown in figure 11, the user to the regulation direction (the last side direction among Figure 11) pull joystick 16 time, window 13b and window 13a together move along track 20a, 20b.The stop part 13f butt that frame 13j that this window 13b is had and window 13c are had, mobile the mobile of window 13a, 13b stops.Utilize such action, gate 13 becomes opened state from closing state.
Then, illustrate that gate 13 becomes the action of closing state from opened state.As shown in Figure 10 and Figure 11, be prerequisite with gate 13 opened state.As shown in figure 12, when promoting action bars 16, release window 13a by the user.As shown in figure 13, when prescribed direction (lower side among Figure 13 to) promoted action bars 16, window 13a moved along delivery track 2a the user.The stop part 13e butt that frame 13h that the window 13a that moves is had and window 13b are had.
When further promoting action bars 16 by the user, frame 13h and stop part 13e butt, therefore, as shown in Figure 6, window 13b and window 13a together are pushed out.When window 13a, 13b were released fully, the open-close detection sensor 13d that is arranged at window 13a detected closing of gate 13, to control part 9 output testing results.For example, when gate 13 was closed, lamp knocked out.Thus, the user can discern the situation that gate 13 has been closed.Utilize such action, gate 13 becomes closing state from opened state.
Then, illustrate that gate 14 becomes the action of opened state from closing state.As shown in figure 10, be prerequisite with gate 13 opened state.As shown in figure 14, by user's pull handle 14d the time, pull out gate 14.The not shown open-close detection sensor that is arranged at gate 14 detects the opening of gate 14, to control part 9 output testing results.For example, when gate 14 was opened, the not shown lamp that is connected in control part 9 was lighted.
As shown in Figure 7, gate 14 is provided with hinge part 14c between gate main part 14a and the 14b of post portion, and therefore, this gate main part 14a serves as that axle rotates freely with the 14b of post portion.Therefore, as shown in figure 15, the gate 14 that utilizes handle 14d to pull out overlaps with solder bath door 18.Gate 14 is the action opposite with above-mentioned action from the action that opened state becomes closing state.
Like this, adopt the soldering apparatus 1 of present embodiment, gate 11,12,13,14 be arranged at jet solder vessel 5,6 near, gate 11,12,13,14 is used to make jet solder vessel 5,6 and the conveying mechanical arm 8 that moves in prescribed limit cuts off, and removes this partition.
Thus; for example jet solder vessel 6 in making jet solder vessel 5,6 stops and user when this jet solder vessel 6 is carried out upkeep operation etc.; even if conveying mechanical arm 8 carries out carrying moving of printed circuit board (PCB) to this jet solder vessel 6; conveying mechanical arm 8 and gate 13,14 butts; the mobile of conveying mechanical arm 8 is prevented from; therefore, also can protect the user not to be subjected to the injury of conveying mechanical arm 8.As a result, can prevent reliably that conveying mechanical arm 8 and user from bumping.
In addition, in the present embodiment, the gate 13,14 that is arranged on jet solder vessel 6 sides has been described, but the gate 11,12 that is arranged on jet solder vessel 5 sides also is same structure, action.In addition, in the present embodiment, utilize action bars 15,16 to open or close gate 11,13, utilize handle 12d, 14d to open or close gate 12,14, but also can in gate 11,12,13,14, driver part be set, utilize this driver part to open or close gate 11,12,13,14.Driver part for example is made of motor etc.In addition, in the present embodiment, open-close detection sensor 13d is arranged at frame 13h, as long as but can detect opening or closing of gate 13, then can be arranged on any position.
Claims (4)
1. a soldering apparatus is characterized in that,
This soldering apparatus comprises:
A plurality of jet solder vessels, it is used for that substrate is carried out soldering and handles;
Delivery section, it moves within the limits prescribed, carries aforesaid substrate to above-mentioned a plurality of jet solder vessels;
Shut-off member, its be set at above-mentioned jet solder vessel near, it is used to make above-mentioned jet solder vessel and the above-mentioned delivery section that moves in the afore mentioned rules scope to cut off and removes this partition.
2. soldering apparatus according to claim 1 is characterized in that,
All be provided with above-mentioned shut-off member in above-mentioned a plurality of jet solder vessels each;
Stopping more than one in above-mentioned a plurality of jet solder vessel, and remove when cutting off with the corresponding above-mentioned shut-off member of this jet solder vessel that stops, above-mentioned delivery section stops.
3. soldering apparatus according to claim 1 is characterized in that,
On above-mentioned delivery section, be provided with feeler;
When above-mentioned feeler contacted with above-mentioned shut-off member, above-mentioned delivery section stopped.
4. soldering apparatus according to claim 1 is characterized in that,
On above-mentioned shut-off member, be provided with the partition detecting sensor;
Above-mentioned partition detecting sensor detects the situation of utilizing above-mentioned shut-off member above-mentioned delivery section and above-mentioned jet solder vessel being cut off and remove this partition.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009117667A JP5279606B2 (en) | 2009-05-14 | 2009-05-14 | Soldering equipment |
| JP2009-117667 | 2009-05-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101885096A true CN101885096A (en) | 2010-11-17 |
| CN101885096B CN101885096B (en) | 2014-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010174169.0A Active CN101885096B (en) | 2009-05-14 | 2010-05-13 | Soldering device |
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| Country | Link |
|---|---|
| JP (1) | JP5279606B2 (en) |
| CN (1) | CN101885096B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106825823A (en) * | 2015-09-28 | 2017-06-13 | 千住金属工业株式会社 | Soldering system |
| CN108941826A (en) * | 2018-09-21 | 2018-12-07 | 锐驰机器人（深圳）有限公司 | Ring type vibrator automatic solder robot and its control method |
| CN111659968A (en) * | 2019-03-06 | 2020-09-15 | 发那科株式会社 | Robot device for soldering |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104668707B (en) * | 2015-01-23 | 2016-08-17 | 宁夏康诚机电产品设计有限公司 | One is welded with automatic wicking angle shear |
| CN113231735B (en) * | 2021-04-15 | 2023-06-23 | 大族激光科技产业集团股份有限公司 | Cutting head obstacle avoidance method, device, computer equipment and medium |
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| US6716290B1 (en) * | 2002-12-04 | 2004-04-06 | The United States Of America As Represented By The Secretary Of The Navy | Method for removing soldering flux residue from a substrate |
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| CN1636663A (en) * | 2003-12-22 | 2005-07-13 | 株式会社田村制作所 | Jet type welding apparatus |
| CN101176393A (en) * | 2005-04-06 | 2008-05-07 | 千住金属工业株式会社 | Wave soldering bath |
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| CN101293297A (en) * | 2008-06-17 | 2008-10-29 | 杨国金 | Reaction jet welding device and uses thereof |
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| CN106825823A (en) * | 2015-09-28 | 2017-06-13 | 千住金属工业株式会社 | Soldering system |
| CN108941826A (en) * | 2018-09-21 | 2018-12-07 | 锐驰机器人（深圳）有限公司 | Ring type vibrator automatic solder robot and its control method |
| CN111659968A (en) * | 2019-03-06 | 2020-09-15 | 发那科株式会社 | Robot device for soldering |
| CN111659968B (en) * | 2019-03-06 | 2022-08-09 | 发那科株式会社 | Robot device for soldering |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5279606B2 (en) | 2013-09-04 |
| CN101885096B (en) | 2014-08-06 |
| JP2010267786A (en) | 2010-11-25 |
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