JP2003332724A - Solder wave forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that a large amount of fine particles of an solder oxide is apt to be produced to contaminate a printed wiring board and that a soldering failure occurs when eddies are created at the suction opening of a pump to cause a variation in the wave height of solder waves in a solder wave forming device which is used for forming solder waves by spouting out tin-rich lead-free solder from a nozzle to form the solder waves so as to carry out a flow soldering operation. <P>SOLUTION: A blowing opening 32 is provided to one end 11 of a solder tank 1, and an opening straightener 10, which is provided with a large number of through-holes 19 bored in its surface and means arranged inside to stop eddies, is provided to the other end 12 of the solder tank 1 through the intermediary of the pumps 3. Therefore, without producing a large high-speed eddy inside the solder tank 1, the solder oxide 28 are easily made to float on the level 8 of the liquid solder, and the solder waves 26 become stable in wave height. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for soldering by melting molten solder in contact with a work to be soldered such as a printed wiring board in a fluid state and including fine and particulate oxide solder. The present invention relates to a solder wave forming device capable of forming a stable and stable solder flow.

On the surface of the solder liquid flowing in an oxidizing atmosphere,
A fine and granular oxide solder is constantly being formed. When this oxidized solder is caught in flowing solder,
The solder oxide adheres to the printed wiring board during soldering, producing a contaminated printed wiring board. Further, when the wave height of the solder wave changes, the soldering quality of the printed wiring board also changes and becomes unstable. The solder wave forming device of the present invention, without causing such contamination,
The wave height of the solder wave is also a device for stable soldering.

[0003]

2. Description of the Related Art FIG. 8 is a perspective view showing the whole of an example of a conventional solder wave forming apparatus. 9 is a diagram showing a vertical cross section of the solder wave forming apparatus of FIG. Note that, in FIG. 8, the solder wave 81 is drawn by a broken line in order to explain the configuration of the blower body 9 in an easily understandable manner. Further, FIG. 10 is a diagram for explaining the appearance of the vortex flow seen from the suction port side of the pump.

That is, the solder bath 1 contains the molten solder 7 which is heated by a heater (not shown). Similarly, the temperature of the solder 7 is instructed in advance by a temperature sensor (not shown) that measures the temperature of the solder 7 and a temperature control device that adjusts the electric power supplied to the heater by referring to the temperature measurement result of the temperature sensor. It is configured to be held at temperature.

The blower opening 9 forming the solder wave 81 is provided with the blowout opening 32 positioned above the solder liquid surface 8, and is connected to the discharge opening 5 of the pump 3 through the chamber body 29 which is a connecting means. Are combined. And this chamber body 2
9 is fixed to the upper edge portion 2 of the solder bath 1 by means of screws 35 by suspending portions 38 and 39, and the blower body 9 is positioned at its head on the solder liquid surface 8 via the sleeve portion 33. It is detachably connected to the chamber body 29 by the screw 34.

The pump 3 using the rotary blades 6 is generally widely used, and the rotary blades 6 are used as the motor 3.
7 is rotatably driven via the shaft 36, sucks the solder 7 from the suction port 4 and discharges it from the discharge port 5
To send. The motor 37 is fixed to a pedestal 42 fixed to the solder bath 1 with screws 41. In addition, an induction type electromagnetic pump has come to be used for the purpose of forming the solder wave 81 more stable than before.

As described above, in the solder wave forming apparatus, the solder 7 in the solder bath 1 is fed to the blower member 9 by the pump 3 and jetted from the blower member 32 so that the guide plate 43 flows down. It is configured to form the wave 81, and is configured to form the solder wave 81 while circulating the solder 7 in the solder bath 1. The perforated plate 31 provided in the blower body 9 and the guide plate 30 provided in the chamber body 29 are members for adjusting the flow of the solder 7 to make the flow direction and flow velocity uniform.

Although not shown, the solder wave 81 thus formed is brought into contact with the printed wiring board to supply the solder 7 to the soldered portion of the printed wiring board, so-called flow soldering. Is done.

On the other hand, the dross 25 floating on the solder liquid surface 8 and having a lump shape is formed by gathering the oxidized solder 7, and generally has a sherbet shape including bubbles. . Naturally, the dross 25 does not contribute to soldering of the printed wiring board.

The oxidized solder 7 is generated because the liquid surface 8 of the solder is exposed to an oxidizing atmosphere such as the atmosphere, and the process in which the solder 7 jets from the nozzle 32 of the nozzle 9 and flows. That is, it may occur in the process of forming the solder wave 81. The portion or process in which the oxidized solder 7 is produced in the largest amount is the latter, that is, the process in which the solder 7 jets and flows to form the solder wave 81. In this process, the fine and particulate oxidized solder 7 is formed. (Oxidized solder) is formed.

The sherbet-shaped dross 25 including the above-mentioned bubbles is formed by gathering the fine and particulate oxide solder on the liquid surface.

Incidentally, FIG. 10 will be described later.

[0013]

Lead-free solder has been used for soldering printed wiring boards used in electronic devices. This is to prevent lead from flowing out of the discarded electronic devices and causing environmental damage and harm to the human body. As a leading candidate for lead-free solder,
There are tin-silver-copper solders, tin-copper solders, tin-copper-nickel solders, tin-zinc solders and the like. Each of the lead-free solders is a tin-rich lead-free solder containing 90% or more of tin (at least 85% or more).

However, when such a tin-rich lead-free solder is jetted from the nozzle to form a solder wave, it is finer and more granular (about 50 to 300 μm diameter) than the conventional tin-37% lead solder. A large amount of oxidized solder) is generated. As a result, the chances of this fine and particulate solder oxide being sucked into the pump and mixing in the solder wave formed by the blower body increase dramatically, and a large amount adheres to the printed wiring board that comes into contact with this solder wave and contaminates it. Is a problem.

When the fine and particulate oxide solder adheres to the printed wiring board, for example, the circuit formed on the printed wiring board is short-circuited, or the printed wiring board vibrates while being mounted in an electronic device. This causes the electronic device to fall off, enter the mechanical parts and mechanisms that make up the electronic device, interfere with its operation, and cause a failure of the electronic device.

Since the dross floating on the solder liquid surface contains bubbles, even if the solder forming the solder wave is caught in the solder when flowing down the guide plate and flowing back into the solder bath, it takes only a few seconds. Ascend above the liquid surface. However, since the fine and particulate oxide solder generated when the solder wave is formed does not contain bubbles, it takes several tens of seconds (for example, tin-silver-copper-based lead-free solder) after the solder is refluxed into the solder bath. About 2 for solder
About 0 to 30 seconds, 15 to 25 seconds for tin-zinc based solder
It does not float on the surface of the solder liquid until about a second has passed.

On the other hand, as shown in FIG. 10, a swirl flow 82 (see also FIG. 9) of solder is generated at the suction port 4 of the pump 3 as the solder 7 is sucked. That is, it is known that the vortex 82 is generated due to the rotation of the earth, but it is further promoted by the rotation of the rotary blades 6 that form the pump 3.

The vortex 82 causes a huge rotary flow having a high flow velocity around the suction port 4 of the pump 3, just as a strong wind blows around the central core of the typhoon, and the pump 3
The solder 7 around the
³ / min] and the opening area S [m ² ] of the suction port 4
Flow velocity V ₀ determined by = Q / S [m / min], which is sucked into the suction port 4 while rotating in the circumferential direction at a speed V _s much higher than that of the chamber body 29 from the discharge port 5.
To discharge.

For this reason, when the solder jetted from the blower opening to form the solder wave flows down into the solder bath and flows back, it is immediately entrained in the enormous rotational flow, that is, the vortex, and joins. Therefore, the fine and particulate oxide solder generated when the solder wave is formed is also caught in the vortex and is restrained, and it is difficult to float. That is, most of it is sucked into the pump as it is.

In this way, the fine and particulate oxide solder is contained in the solder forming the solder wave and adheres to the printed wiring board that comes into contact with the solder wave during soldering, thus contaminating the printed wiring board. It will be.

Further, when such a vortex flow is generated at the suction port of the pump, the flow of the solder at the suction port fluctuates in an unstable manner. The lift varies, and the wave height of the solder wave formed by the blower body changes.

When such a wave height variation of the solder wave occurs, when the printed wiring board comes into contact with the solder wave, the dynamic pressure applied from the solder wave to the printed wiring board changes, and the solder wave is temporarily, or temporarily, changed. When the printed wiring board is no longer in contact, the solder wettability of the part to be soldered on the printed wiring board changes or the solder supply amount changes, resulting in poor wetting, poor solder bridging, icicles, and fillet shapes. Instable fluctuations, unsoldered defects, and other defects occur, resulting in poor soldering quality and unstable quality.

Therefore, there is a demand for a solder wave forming apparatus, that is, a solder forming apparatus that prevents the oxidized solder from entering the solder wave and reduces the fluctuation of the pump head.

An object of the present invention is to prevent the solder wave from containing fine and particulate oxide solder, particularly when performing flow soldering using tin-rich lead-free solder,
In addition, by realizing a solder wave forming device that reduces fluctuations in the pump head, a solder wave forming device that realizes a stable solder wave and a solder wave with no contamination is realized, and printed wiring with high quality and reliability. It is to enable flow soldering of boards.

[0025]

According to the present invention, when the solder is sucked, a swirl is not generated, and a change in the pump head when the solder is sucked is extremely small. The feature is that it is configured.

(1) A nozzle body having a nozzle is located on the solder liquid surface at one end of the solder tank containing the molten solder, and at the same time, it flows out from the nozzle and flows back into the solder tank. A pump for sucking the solder from the suction port and feeding the solder to the blower body is provided in the solder on the side portion in the main flow direction of the solder.

A large number of through holes are formed on the outer surface of the other end of the solder bath sandwiching the pump when viewed from the blower body, and the total opening area of the through holes is equal to that of the suction port of the pump. An opening rectifying body provided with a partition wall in a direction larger than the area and in which the circumferential space whose axis is in the suction direction of the pump is cut in the circumferential direction is connected to the suction port of the pump. In addition, it is a solder wave forming apparatus in which the opening rectifying body is detachably provided from the solder liquid surface side of the solder bath.

With this structure, first, the total area of the openings of the through holes provided on the outer surface of the opening rectifying body becomes larger than the area of the suction port of the pump, so that the amount of the solder sucked into the opening rectifying body is increased. The flow velocity becomes slow and it becomes difficult for eddy currents to occur. In addition, since the opening rectifier has a large number of through holes, the flow of solder is regulated, and the magnitude and direction of the flow rate of the solder that is sucked in and the solder that has been sucked in can be made uniform. Like

Subsequently, since the partition wall is provided in such a direction that the circumferential space having the suction direction as the axis line is cut in the circumferential direction, the flow of the solder that is going to generate the vortex is cut, and the vortex is generated. Is completely blocked.

Therefore, when the solder is sucked into the through holes of the opening rectifying body, the flow of the solder is not accelerated by the eddy current, and the fine and particulate oxidized solder generated when the solder wave is formed is It is no longer involved in the enormous solder vortex that was occurring.

Therefore, after the solder wave is formed, the whole solder is slowly stirred toward the opening rectifying body without being stirred by the vortex, and the movement of the solder is prevented. In the meantime, the fine and particulate oxide solder generated when the solder wave is formed floats above the solder liquid surface. Moreover, since the opening rectifying body is provided on the other end side of the solder bath sandwiching the pump as viewed from the blower body, the solder after forming the solder wave can move the longest distance in the solder bath. Therefore, it is possible to reliably float the fine and particulate oxidized solder on the solder liquid surface. Furthermore, since the solder that has formed the solder wave moves in a direction orthogonal to the direction in which the solder flows back into the solder bath, it is not affected by the flow of the reflux.

Further, since the opening rectifying body is detachably provided from the solder liquid surface side of the solder bath, even if fine and particulate oxide solder is attached or deposited in the through hole, The open flow straightener can be easily removed to remove this deposit.

Therefore, it becomes possible to form a solder wave which does not contain fine and granular oxide solder, that is, a clear stream solder wave.

Further, by providing the opening rectifier,
Since it becomes possible to damp the flow of solder that fluctuates irregularly at the suction port of the pump, the flow rate of the solder sucked into the pump does not fluctuate over time, and this flow fluctuation is also taken into consideration. It is possible to form a clear-flow solder wave in which the fluctuation of the pump head as seen is reduced and the wave height of the solder wave, that is, the height above the blower opening and the flow rate are less changed.

(2) In the solder wave forming apparatus of (1), a lid body having a flat or concave outer surface shape is detachably provided on the solder liquid surface side of the opening rectifying body. It is a device.

As described in (1) above, after the solder forming the solder wave is refluxed into the solder bath, it slowly moves toward the opening rectifying body, and in the process of this movement, fine and particulate oxidation occurs. Solder floats above the liquid surface. Then, thereafter, the dross is formed above the aperture rectifying body.

Therefore, a lid body having a flat or concave outer surface shape is detachably provided on the solder liquid surface side of the opening rectifying body so that the lid body can be removed and lifted up. You can scoop up dross. Therefore, it is possible to realize a solder wave forming apparatus that can easily remove the generated oxidized solder and eventually the dross.

(3) In the solder wave forming apparatus according to (1), the pump is an inductive electromagnetic pump, and the solder wave is provided by covering the side peripheral surface of the inductive electromagnetic pump with the opening rectifying body. It is a forming device. The crown of the opening rectifier does not have to cover the entire side surface, and the total area of the through holes provided on the outer wall of the opening rectifier is larger than the area of the suction port of the induction electromagnetic pump. It should be configured in.

The outer shape of the induction type electromagnetic pump is ALIP.
Type (annual linear induction
pump), which is usually cylindrical and has a FLIP type (f
lat linear induction pump
In p), it usually has a cubic shape. In addition, the thrust generating passages are both linear, and are provided along the axis of a cylindrical shape in the ALIP type, and are similarly provided along the central axis of the cube or one side thereof in the FLIP type. There is.

The side peripheral surface of the induction type electromagnetic pump provided (immersed) in the solder is in the solder and is in contact with the solder in all directions.
That is, this side peripheral surface has a large area. Therefore, by providing the opening rectifying body on the side peripheral surface so as to be covered with the opening rectifying body, the opening rectifying body serves as a suction port of the induction type electromagnetic pump without providing a special space for providing the opening rectifying body in the solder bath. Can be connected. Therefore, a small solder wave forming device can be realized.

Further, since the solder flows along the side peripheral surface of the induction type electromagnetic pump, energy such as iron loss and copper loss generated in this induction type electromagnetic pump can be efficiently conducted to the solder. . Therefore, a solder wave forming device with good energy efficiency can be realized.

(4) A blower body having a blower outlet is provided on the solder liquid surface at one end side of a solder bath containing the molten solder, and the solder is provided on the side of the blower body. The straight-through type inductive electromagnetic pump is provided with its thrust generation flow path facing the solder liquid level and its discharge port facing the solder liquid level.

The discharge port of the straight-through type induction electromagnetic pump and the blow-out body are connected by a connecting unit that forms a flow directed toward the bottom of the tank, and the straight-through induction type of the connecting unit is connected. The solder wave forming apparatus is provided with an insertion hole having an opening that is larger than the opening of the discharge port above the discharge port of the electromagnetic pump, and an openable / closable lid body provided in the insertion hole.

With this configuration, the fluctuation of the head of the straight-through type induction electromagnetic pump, which is caused by the irregular fluctuation of the flow generated at the suction port of the straight-through type induction electromagnetic pump, is attenuated, It becomes possible to form a solder wave having an extremely stable wave height that draws out the characteristics of the induction type electromagnetic pump.

That is, the basic principle of the induction type electromagnetic pump is the same as that of the linear motor, and its main feature is that
The thrust applied to the solder by the moving magnetic field is extremely constant and stable. That is, in a pump with a rotary blade, the discharge pressure thereof temporally pulsates with the rotation of the rotary blade, but in an induction type electromagnetic pump, the thrust is constant with time.

On the other hand, in the induction type electromagnetic pump having such excellent characteristics, the fluctuation of the flow of the solder generated at the suction port causes the fluctuation of the lift when the fluctuation of the flow is taken into consideration. To do.

Therefore, in the structure of the present invention, the flow path in the induction type electromagnetic pump which generates thrust upward in the direction of the solder liquid surface, that is, in the vertical direction, and the tank bottom direction, that is, downward direction. The entire flow path is composed of the flow path in the connecting means for guiding the flow, and thereafter, the flow path in the blower body for guiding the flow upward toward the blower opening of the blower body. In the process of repeatedly moving the solder in the direction to repeatedly accumulate and release (ie, replace) the potential energy, the fluctuation of the lift is attenuated. As a result, the excellent characteristics of the induction type electromagnetic pump can be brought out, and a solder wave having an extremely stable wave height, that is, a clear solder wave can be formed.

[0048]

BEST MODE FOR CARRYING OUT THE INVENTION The solder wave forming apparatus of the present invention can be implemented in the following embodiments.

(1) Embodiment-1 FIG. 1 is a diagram showing a side cross-section of the configuration of Embodiment-1 of the solder wave forming apparatus of the present invention. Further, FIG. 2 is a perspective view for explaining the whole of the solder wave forming apparatus. Further, FIG. 3 is a perspective view showing the whole of the opening rectifying body.
Shows the case where the shape is a cubic shape, and (b) shows the case where the shape is a cylindrical shape. Note that, in FIG. 2, the solder wave 26 is drawn by a broken line in order to clearly show the structure of the blower body.

In this solder wave forming apparatus, a nozzle 9 is provided on one side (one end) 11 of the solder bath 1 and a shaft 36 is provided.
The opening rectifying body 10 is provided on the side portion side (the other end side) 12 opposite to the blower body 9 with the pump 3 having the rotary blades 6 rotated by the motor 37 interposed therebetween.
And a suction port 4 of the pump 3 are connected by a suction passage 13. The opening rectifying body 10 and the suction passage 13 are coupled by a coupling hole 14, and the opening rectifying body 10
The seating piece 16 is inserted into the suction passage 1 by pressing and engaging the convex piece 15a of the insertion portion 15 provided in the fitting hole 14 into the coupling hole 14.
3, the opening rectifying body 10 is detachably provided in the suction passage 13. Then, the handle 17 provided on the opening rectifying body 10 is an operation piece used in the attachment / detachment work.

Solder 7 discharged from the discharge port 5 of the pump 3
Is configured to pass through the chamber body 29, be rectified by the guide plate 30 and the perforated plate 31, and guided by the guide plate 43 from the blowout port 32 of the blowout body 9 to flow out to form the solder wave 26. Then, the blower body 9 is screwed through the sleeve 33 to the screw 34.
It is fixed to the chamber body 29. Further, the chamber body 29 and the suction passage 13 are respectively provided with the hanging portions 38,
39 is fixed to the upper edge portion 2 of the solder bath 1 with a screw 35 and attached to the solder bath 1. Also, the motor 3
7 is provided on a pedestal 42 attached to the upper edge portion 2 of the solder bath 1 by screws 41.

As shown in FIGS. 1 and 3, the opening rectifying body 10 has an outer surface (outer wall) 18, more specifically, a side peripheral surface having an opening ratio of about 30% to 50% and a hole diameter of 2 mm to 5 mm.
It is formed of a perforated plate having a large number of through-holes 19 of a certain degree, and inside thereof, a circumferential space is formed which has an axis in the suction direction of the solder 7, that is, the direction of the solder 7 flowing downward in the figure. A partition wall 20 for cutting in the direction is provided. Note that, in FIG. 3, a large number of through holes 19 provided on the outer surface 18 of the opening rectifying body 10 are shown by dotted lines.

That is, the partition wall 20 is a member for cutting the eddy current formed with the axis of the suction direction of the solder 7, that is, the direction of the solder 7 flowing toward the lower side in the drawing, and like the outer wall 18, the partition wall 20 is porous. It is made of plates.
However, the partition wall 20 may be a plate material having no through hole 19. The partition walls 20 are provided in a lattice pattern in FIG. 3A and in a radial pattern in FIG. 3B.

A lid 22 having a flat plate shape or a slightly concave outer surface shape is detachably provided above the opening rectifying body 10, that is, on the solder liquid surface 8 side by a biasing piece 23. The handle 24 provided on the lid 22 is
It is an operation piece used when attaching and detaching. Therefore, the handle 17 provided on the opening rectifying body 10 and the handle 24 provided on the lid 22 are provided so as to be operated from the solder liquid surface 8 as shown in FIGS. 1 and 2.

The sum of the areas of a large number of through holes 19 provided on the outer surface 18 of the opening rectifying body 10 is configured to be larger than the area of the suction port 4 of the pump 3, and its hole diameter (2 mm (About 5 mm) does not allow the dross 25 to pass therethrough, but has a hole diameter such that the fine and particulate oxide solder 28 generated when the solder wave 26 is formed can pass therethrough.

It is not against the object of the present invention to allow the fine and particulate oxide solder 28 to pass therethrough. That is, most of them can be floated on the solder liquid surface 8, and an extremely small amount of the oxidized solder 28
This is to prevent clogging from occurring in a short time (normal operating time of one day, that is, within 8 hours) even when is sucked. That is, the aperture rectifying body 10 is not a filter for removing the fine and particulate oxide solder 28.

Further, the aperture ratio of the aperture rectifier 10 is 30% to
The reason for setting it to about 60% is to suck in a wide range of solder 7 at a slow flow rate.
Although the aperture ratio may be 0% or less, the aperture rectifier 10
This is because the outer dimensions of the above are too large and the solder bath 1 that accommodates them becomes extremely large. On the other hand, when the opening ratio is 60% or more, the flow velocity cannot be sufficiently reduced when sucking the solder 7, and a swirl easily occurs outside the aperture rectifying body 10.

In the solder wave forming apparatus having the above-described structure, as shown in FIG. 1, the solder 7 which forms the solder wave 26 and is recirculated into the solder bath 1 is in a direction orthogonal to the recirculation direction (right in the figure). Direction), that is, when the fine and particulate oxide solder 28, that is, the solder wave 26, which moves slowly in the direction of the opening rectifying body 10 as a whole without being affected by the flow of reflux and is hard to float, that is, the solder wave 26 is formed. Oxidized solder 28
Can be floated above the solder liquid surface 8 in this process.

Then, the fine and particulate oxide solder 28 floating on the solder liquid surface 8 flows toward the position above the opening rectifying body 10 together with the entire flow, and is accumulated to form the dross 25. become.

That is, a large number of through holes 19 provided on the outer surface 18 of the opening rectifier 10 reduce the flow velocity of the solder 7 to a slow velocity, and the partition wall 20 inside thereof prevents the generation of vortex flow. , The fine and particulate oxide solder 28, which is hard to float on the solder liquid surface 8, is no longer restricted in the flow when sucking the solder 7, and most of the fine and particulate oxide solder 28 is solder liquid surface. 8 can be levitated above and can be prevented from being sucked into the pump 3.

Therefore, the fine and granular oxide solder 2
Even if a tin-rich lead-free solder that is easy to form 8 is used, it is possible to form a clear-flow solder wave that is not contaminated by the fine and particulate oxide solder 28. Further, when sucking the solder 7 into the pump 3, the flow of the solder 7 does not fluctuate unstablely, so that the clear wave solder wave having a stable wave height of the solder wave 26 can be formed. As a result, it becomes possible to improve the soldering quality and reliability of the printed wiring board manufactured by flow soldering.

Then, the oxidized solder 2 is accumulated on the solder liquid surface 8 above the opening rectifying body 10 to form the dross 25.
By lifting and removing the lid 22 provided on the opening rectifying body 10, 8 can be placed on the outer surface of the lid 22 and scooped up to be removed from the solder bath 1. Further, the opening rectifying body 10 can be easily removed for cleaning work. That is, the maintainability of the device is also excellent.

In the example 1 of the present embodiment, the outer surface 18 of the opening rectifying body 10 is configured to face the vertical direction, and the sucked solder 7 flows downward in the drawing, that is, in the vertical direction. However, the sucked solder 7 may flow in the left direction in FIG. 1, that is, in the horizontal direction where the suction port 4 of the pump 3 is located. In the case of this configuration example, although not shown, since the opening rectifying body 10 provided in the vertical direction in FIG. 1 is provided in the horizontal direction, the position of the lid body 22 in the opening rectifying body 10 is changed, The structure is provided on the solder liquid level 8 side.

(2) Embodiment Example-2 FIG. 4 is a diagram for explaining a configuration example of Embodiment-2 of the solder wave forming apparatus of the present invention, in which (a) is a view showing a side cross section thereof, (B) is the figure which looked at the cover plate from the upper part.

The solder wave forming apparatus of the second embodiment is
This is an example in which the induction type electromagnetic pump 44 is used as a means for feeding the solder 7 to the blower body 9, and moreover, the induction type electromagnetic pump 4
4 of the induction type electromagnetic pump 44 including the core 45 and the moving magnetic field generating coil 46 is immersed in the solder 7 in the solder bath 1 to form the induction type electromagnetic pump 44.
The solder wave forming apparatus is configured so that the energy loss (copper loss or iron loss) generated in 1) can be conducted to the solder 7 as heat energy and all the supplied energy can be supplied to the solder 7. Therefore, energy efficient operation is possible.

As the induction type electromagnetic pump 44, a straight through type induction type electromagnetic pump having a thrust generating flow path 47 formed in a straight line is used, and its discharge port 48 is directed toward the solder liquid surface 8 side. The suction port 49 is the solder bath 1
It is configured toward the tank bottom 50 side. The induction type electromagnetic pump 44 shown in FIG. 4 is an ALIP type, but the FLIP
Molds can also be used.

On the other hand, the blower body 9 for forming the solder wave 26
Is provided such that its blowout port 32 is located on the solder liquid surface 8, and the solder 7 is fed to this blowout port body 9 from the bath bottom 50 side of the solder bath 1 toward the blowout port 32, that is, upward. A chamber body 51 configured to connect the blower outlet 9 and the discharge outlet 48 of the induction type electromagnetic pump 44.
However, the solder 7 flows downward from the solder liquid level 8 side of the solder bath 1 toward the bath bottom 50 side of the solder bath 1. Further, the induction type electromagnetic pump 44 is provided so as to be located on the side portion side in the main flow direction when the solder 7 flows back into the solder bath 1 from the blowing port 32.

That is, the path through which the solder 7 in the solder bath 1 is supplied to the blowout port 32 is the ascending flow path portion in the thrust generating flow path 47 of the induction type electromagnetic pump 44, and then the chamber body 51.
In the first half of the above, the descending flow passage 52 is formed, and further in succession, the latter half of the chamber body 51 and the blow-out body 9 constitute the rising flow passage 53.

Further, the discharge port 48 of the induction type electromagnetic pump 44.
Of the chamber body 51 on the upper side, that is, on the side of the solder liquid surface 8 has an opening larger than the opening of the discharge port 48 of the ALIP type inductive electromagnetic pump 44, and its shape is also a portion behind the discharge port 48. A through hole 54 having a shape not having, for example, a similar shape is provided. And this insertion hole 5
4 is usually configured to be closed by a lid plate 55.

On the other hand, the ALIP type induction type electromagnetic pump 44
The internal core 56 is configured to be insertable into and removable from the thrust generating flow path 47, and a handle 57 for removing or attaching the internal core 56 and the cover plate 55 is provided in the internal core 56.
And the lid plate 55, and the grip 57 is located on the solder liquid surface 8. That is, these are configured so that they can be removed and attached in an integrated state.

Then, the locking piece 58 provided in the chamber body 51 is inserted into and removed from the tear eye hole 59 provided in the cover plate 55.
By inserting from a and rotating in the direction of arrow S, the locking piece 58 is locked in the tear hole 59, and the lid plate 55 does not float up and come off from the chamber body 51. Therefore, when the lid plate 55 is fixed, the inner core 56 of the induction type electromagnetic pump 44 is also moved by the thrust generating passage 47.
It is a structure that is inserted and fixed in the inside.

Therefore, when the lid plate 55 is rotated in the direction of the arrow O, the locking piece 58 is made to escape from the insertion / removal hole 59a of the tear eye hole 59 provided in the lid plate 55, and the lid plate 55 is chambered. The body 51 can be detached from the body 51, and the inner core 56 of the ALIP type inductive electromagnetic pump 44 is also pulled out.

The electric power for generating the moving magnetic field in the induction type electromagnetic pump 44 is supplied from a polyphase AC power supply device (for example, an inverter power supply device) not shown, and the output voltage and frequency of the polyphase AC power supply device are supplied. To adjust the thrust applied to the solder 7 to adjust the solder wave 26
It is configured to adjust the wave height, flow rate, etc.

Next, the operation of this solder wave forming apparatus will be described. The induction type electromagnetic pump 44 has a characteristic that the thrust is extremely small with time and can form the solder wave 26 more stably than the rotary vane type pump 3 described above. However, due to the unstable fluctuation of the flow of the solder 7 sucked into the suction port 49 of the induction type electromagnetic pump 44, the discharge pressure of the induction type electromagnetic pump 44, that is, the suction of the solder 7 is included. The lift you saw varies.

The fluctuation of the lift is due to the mouth 32 of the mouthpiece 9.
Although the wave height and the like of the solder wave 26 fluctuates when it is transmitted to the as-is, the ascending flow path parts (thrust generating flow paths) 47 and 53 and the descending flow path part 52 are alternated as in the second embodiment. The pressure fluctuation due to the fluctuation of the above-mentioned head can be attenuated and the stable thrust can be obtained by deriving the characteristic of the induction type electromagnetic pump 44 by arranging the same in the above position and repeating the replacement of the potential energy. Thus, it becomes possible to form a very stable solder wave 26, that is, a solder wave 26 having a stable flow rate and flow velocity of the solder 7 and a wave height.

Further, the chamber body 5 provided with the lid plate 55
1 through the insertion hole 54 to the inner core 5 of the induction type electromagnetic pump 44.
6, the lid plate 55 is removed, and if the inner core 56 of the induction type electromagnetic pump 44 is also pulled out from the thrust generation passage 47, the thrust of the induction type electromagnetic pump 44 is pulled through the insertion hole 54. Dirt adhering to the generation flow path 47 can be easily removed. It should be noted that since the gap of the thrust generation flow passage 47 of the induction type electromagnetic pump 44 is usually about several mm, dirt easily attaches. However, with the configuration of the second embodiment, it is easy to clean this dirt.

(3) Embodiment Example-3 FIG. 5 is a side sectional view showing the structure of Embodiment Example-3 of the solder wave forming apparatus of the present invention.

The third embodiment is an example in which the potential tank 61 is provided in the second embodiment shown in FIG.
That is, a potential tank 61 capable of accumulating the solder 7 is provided in the chamber body 51 facing the discharge port 48 of the induction type electromagnetic pump 44, and the liquid level of the solder 7 in the potential tank 61 also causes the above-described embodiment. -2
This is an example configured so as to be able to attenuate the fluctuation of the head described in (4).

An opening 6 is provided above the potential tank 61.
2 is provided, and a handle 57 connected to the inner core 56 of the ALIP induction electromagnetic pump 44 is located in the opening 62. Therefore, the constituents of the size and shape of the opening 62 provided in the potential tank 61 are the same as those of the insertion hole 54 provided in the chamber body 51 described in the second embodiment.

The diffusion plate 63 is used for the induction type electromagnetic pump 4
Solder 7 discharged from 4 directly goes to potential tank 6
It is a member for preventing the inflow of the water.

(4) Embodiment-4 FIG. 6 is a side sectional view showing the structure of Embodiment-4 of the solder wave forming apparatus of the present invention.

The fourth embodiment is an example in which the aperture rectifying body 10 shown in FIG. 1 is provided in the second embodiment shown in FIG. Therefore, the flow of the solder 7 in the suction port 49 of the induction type electromagnetic pump 44 is stabilized, and the fine and particulate oxide solder 28 is not sucked into the induction type electromagnetic pump 44. As a result, the wave height, the flow rate, the flow velocity, etc. of the solder wave 26 are extremely stable, and the solder wave 26 without contamination by the oxidized solder 28, that is, the solder wave 26 having an extremely high-level clear stream can be formed.

(5) Embodiment Example-5 FIG. 7 is a view for explaining the structure of Embodiment-5 of the solder wave forming apparatus of the present invention, in which (a) is a side sectional view thereof, b) is a view of the suction guide plate viewed from above, (c)
FIG. 4 is a view showing a vertical cross section of an aperture rectifying body.

In other words, this embodiment example-5 uses solder 7
This is an example in which the opening rectifying body 66 is capped on the side surface of the induction type electromagnetic pump 44 which is buried inside. In the example shown in FIG. 7, an ALIP type electromagnetic pump is shown, but a FLIP type electromagnetic pump can be used instead of this.

In the case of the fifth embodiment, the suction port 49 of the induction type electromagnetic pump 44 is directed toward the solder liquid surface 8 side. This is configured such that the inner core 56 of the induction type electromagnetic pump 44 can be inserted and removed from the solder liquid surface 8 side without providing an insertion hole in the chamber body 65, so that the thrust generation flow passage 47 is formed from the solder liquid surface 8 side.
This is because the consideration was given so that cleaning could be performed.

The induction type electromagnetic pump 44 is submerged in the solder 7, the side peripheral surface of which is much larger than the suction port 49, and in the solder 7 in all directions. In the example of No. 7, the solder 7 is contacted with respect to any direction of the horizontal plane. Therefore, in the fifth embodiment, the opening rectifying body 66 is provided along the side peripheral surface, that is, the opening rectifying body 66 is capped.

This aperture rectifier 66 is shown in FIG.
As shown in (c), a large number of through holes 67 are provided in the outer wall 69 of the outer surface thereof, and the total area of the through holes 67 is compared with the opening area of the suction port 49 of the inductive electromagnetic pump 44. It is designed to be much larger. That is,
Similar to the case of Embodiment 1 shown in FIG. 3, the outer wall 69 is formed of a perforated plate provided with a large number of through holes 67 having an opening ratio of about 30% to 50% and a hole diameter of about 2 mm to 5 mm. Immediately inside the outer wall 69, similar perforated plates are provided side by side to form two stages.

Inside the outer wall 69, four partition walls 70 are provided in a direction that spreads radially with the thrust generating passage 47 of the induction type electromagnetic pump 44 as an axis. That is, the partition wall 70 is provided so as to cut a circumferential space formed with the direction in which the solder 7 is sucked into the suction port 49 as an axis line in the circumferential direction. That is, the side peripheral surface of the induction type electromagnetic pump 44 is soldered toward the suction port 49.
Is a member for cutting off the vortex flow formed when is sucked, and is also formed of a perforated plate. However, the partition wall 70 may be a plate material having no through holes.

The opening rectifier 66 is formed integrally with a suction guide plate 68 which shields the suction port 49 of the induction type electromagnetic pump 44 from the solder liquid surface 8 and guides the flow of the solder 7. The suction flow velocity is reduced by 66, and the clean solder 7 from which the entrainment of the fine and particulate oxide solder 28 is removed is sucked into the suction port 49 of the induction type electromagnetic pump 44.

The opening rectifying body 66 and the suction guide plate 68, which are integrally formed, are also integrated with the inner core 56 of the induction type electromagnetic pump 44, and these are connected to the solder liquid surface 8.
A handle 57 is also provided so that it can be attached / detached / removed from above.
The means for locking and fixing these to the induction type electromagnetic pump 44 is the engagement between the locking piece 73 and the tear eye hole 71 as shown in FIG. 7 (b). It is the same.

The inner core 56 is inserted into the thrust generating passage 47, and the opening rectifier 66 is capped on the induction type electromagnetic pump 44.
Insertion / removal hole 7 of tear eye hole 71 provided in suction guide plate 68
When the locking piece 73 is inserted from 2 and the suction guide plate 68 is rotated in the direction of arrow S, these are moved to the induction type electromagnetic pump 4
It is fixed at 4. When removing, the suction guide plate 68 is rotated in the direction of arrow O in the reverse order of this procedure.

On the other hand, the discharge port 48 of the induction type electromagnetic pump 44.
And the blow-off body 9 are connected to each other by the chamber body 65, and the solder wave 26 is formed in the blow-off opening 32 by the solder 7 fed from the induction type electromagnetic pump 44.

With this structure, no eddy current is generated when the solder 7 is sucked into the opening rectifying body 66, and the suction flow velocity becomes extremely slow. Therefore, the fine and particulate oxide solder 28 generated when the solder wave 26 is formed is not caught and sucked.

Further, since the vortex flow of the solder 7 does not occur inside the opening rectifying body 66, the unstable fluctuation of the flow velocity of the solder 7 sucked into the suction port 49 of the induction type electromagnetic pump 44 is also eliminated. Therefore, the solder wave 26 having a stable wave height, flow velocity, and flow rate can be formed without including the fine and particulate oxide solder 28.

Furthermore, since the solder 7 flows along the side peripheral surface of the induction type electromagnetic pump 44, the induction type electromagnetic pump 4
The energy loss (iron loss or copper loss) generated in 4 is efficiently conducted to the solder 7 to promote the cooling of the induction type electromagnetic pump 44, and this energy loss can be used as the heating energy of the solder. A good solder wave forming device can be realized. Moreover, it is possible to realize a small solder wave forming apparatus without increasing the size or volume of the solder bath.

Since the inner core 56 of the induction type electromagnetic pump 44, the opening rectifying body 66, and the suction guide plate 68 can be easily removed or attached, the thrust generation passage 47 of the induction type electromagnetic pump 44 is cleaned. Also, maintenance work such as cleaning of the opening rectifying body 66 can be easily performed.

[0097]

As described above, according to the solder wave forming apparatus of the present invention, the vortex flow caused by the suction of the pump by the pump is not generated in the solder bath, and the flow velocity of the solder sucked into the opening rectifier is also reduced. It is much slower than before. Therefore, it becomes difficult for the fine and particulate oxide solder that is generated when the solder wave is formed to be sucked into the pump,
It will not be mixed in the solder wave. Further, the flow of the solder sucked into the pump becomes stable, and the solder wave having the stable wave height, flow rate, and flow velocity can be formed, and the clear stream solder wave can be formed.

Further, in the direction of the thrust generating passage of the induction type electromagnetic pump, the direction of the thrust and the connection with the blower,
It becomes possible to attenuate the fluctuation of the head by performing the replacement of the potential energy many times (three times) with respect to the sucked in solder, and in combination with the use of the induction type electromagnetic pump, an extremely stable clear-flow solder wave is obtained. Will be able to form.

As a result, fine and particulate oxide solder does not adhere to the printed wiring board which is the work to be soldered, and the contact state between the solder wave and the printed wiring board is stabilized and the printed wiring board It becomes possible to perform a clean soldering mounting and to produce a printed wiring board with stable soldering quality and good reliability.

[Brief description of drawings]

FIG. 1 is a diagram showing a side cross-section of a configuration of a first embodiment of a solder wave forming device of the present invention.

FIG. 2 is a diagram for explaining the whole of the solder wave forming apparatus.

FIG. 3 is a perspective view showing the whole of an opening rectifying body.

FIG. 4 is a diagram for explaining the configuration of Embodiment 2 of the solder wave forming apparatus of the present invention.

FIG. 5 is a diagram showing a side cross-section of the configuration of Embodiment 3 of the solder wave forming apparatus of the present invention.

FIG. 6 is a view showing a side cross-section of the configuration of Embodiment-4 of the solder wave forming apparatus of the present invention.

FIG. 7 is a view for explaining the configuration of Embodiment-5 of the solder wave forming device of the present invention.

FIG. 8 is a perspective view showing the whole of an example of a conventional solder wave forming apparatus.

9 is a diagram showing a vertical cross section of the solder wave forming apparatus of FIG.

FIG. 10 is a diagram for explaining a state of a vortex flow seen from a suction port side of a pump.

[Explanation of symbols]

1 solder bath 2 Upper edge 3 pumps 4 Suction port 5 outlets 6 rotating blades 7 Solder 8 Solder liquid level 9 Blowout 10 Aperture rectifier 11 One side side (one end side) 12 Opposite side (the other end) 13 Suction path 14 coupling holes 15 Insert 15a convex piece 16 sitting pieces 17 Handle 18 Outer surface (outer wall) 19 through holes 20 partition walls 22 Lid 23 Biasing piece 24 Handle 25 Dross 26 Solder wave 28 Oxidized solder 29 chamber body 30 information board 31 Perforated plate 32 mouth 33 Sleeve 34 screws 35 screws 36 axes 37 motor 38 Suspension section 39 Hanging part 41 screws 42 pedestal 43 Information board 44 Induction type electromagnetic pump 45 core 46 Moving field generating coil 47 Thrust generation flow path (rising flow path section) 48 outlets 49 Suction mouth 50 bottom 51 chamber body 52 Downflow section 53 Ascending flow path 54 insertion hole 55 Lid 56 inner core 57 handle 58 Locking piece 59 tear eyes 59a insertion hole 61 Potential tank 62 openings 63 Diffuser 65 chamber body 66 aperture rectifier 67 through hole 68 Suction guide plate 69 outer wall 70 partition wall 71 Tears 72 hole 73 Locking piece

Claims (4)

[Claims] 1. A solder nozzle containing a molten solder is provided at one end of a solder tank, and a nozzle is provided on the surface of the solder liquid, and the nozzle flows out from the nozzle and flows back into the solder tank. A pump that sucks the solder from the suction port into the solder on the side of the main flow direction of the solder and supplies the pump to the blower body is provided, and the solder bath sandwiching the pump when viewed from the blower body. On the other end side, a large number of through-holes are formed on the outer surface, and the total opening area of the through-holes is larger than the area of the suction port of the pump. An opening rectifier provided with a partition wall in a direction to be cut in the circumferential direction is provided so as to be connected to a suction port of the pump, and the opening rectifier is detachably provided from a solder liquid surface side of the solder bath. Solder wave forming apparatus characterized in that it. 2. The solder wave forming apparatus according to claim 1, wherein a lid having a flat or concave outer surface shape is detachably provided on the solder liquid surface side of the opening rectifying body. 3. The pump is an inductive electromagnetic pump,
The solder wave forming apparatus according to claim 1, wherein the opening rectifying body is provided so as to be capped on a side peripheral surface of the induction type electromagnetic pump. 4. A blower body having a blower outlet positioned on the solder liquid surface at one end side of a solder bath containing molten solder is provided in the solder on the side portion side of the blower body. A straight through type induction type electromagnetic pump is provided with its thrust generation flow path facing the solder liquid level direction and its discharge port facing the solder liquid level side, and the discharge port and the blow port of the straight through type induction type electromagnetic pump. The body is connected by a connecting means that forms a flow in the bottom direction of the solder tank, and the connecting means is located above the discharge opening of the straight-through type induction electromagnetic pump and has an opening larger than the opening of the discharge opening. A solder wave forming apparatus characterized in that an insertion hole having an opening is provided, and a lid that can be opened and closed is provided in the insertion hole.