JP2006181624A - Wave soldering device - Google Patents

Wave soldering device Download PDF

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JP2006181624A
JP2006181624A JP2004380720A JP2004380720A JP2006181624A JP 2006181624 A JP2006181624 A JP 2006181624A JP 2004380720 A JP2004380720 A JP 2004380720A JP 2004380720 A JP2004380720 A JP 2004380720A JP 2006181624 A JP2006181624 A JP 2006181624A
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electromagnetic induction
induction pump
solder
jet
molten solder
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JP4546236B2 (en
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Shikio Hasegawa
式男 長谷川
Masaki Iijima
正貴 飯島
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Tamura Corp
Tamura FA System Corp
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Tamura Corp
Tamura FA System Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a wave soldering device capable of enhancing the soldering performance by controlling an electromagnetic induction pump in a nozzle to feed molten solder in a turbulent flow manner to a work through a plurality of ejection holes. <P>SOLUTION: A primary side electromagnetic induction pump 14a and a secondary side electromagnetic induction pump 14b to pressurize molten solder 11 in a solder tank 12 are provided respectively in the solder tank 12 storing the molten solder 11. The molten solder 11 pressurized by the primary side electromagnetic induction pump 14a is waved to a workpiece W through a plurality of ejection holes 25a formed in an upper face of the primary side nozzle 22. A controller 27 periodically controls ON/OFF of the frequency output to be inputted in the primary side electromagnetic induction pump 14a. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、電磁誘導ポンプを用いた噴流式はんだ付け装置に関する。   The present invention relates to a jet soldering apparatus using an electromagnetic induction pump.

はんだ槽のワーク搬入側の縦板部に沿って１次電磁誘導ポンプを設け、ワーク搬出側の縦板部に沿って２次電磁誘導ポンプを設け、１次電磁誘導ポンプの上側に複数の噴出孔を有する１次ノズルを設け、２次電磁誘導ポンプの上側に広口噴出口を有する２次ノズルを設け、１次電磁誘導ポンプにより加圧された溶融はんだを１次ノズルの複数の噴出孔より突起状に噴出させて、上下方向に変動する乱流状の１次噴流波を形成するとともに、２次電磁誘導ポンプにより加圧された溶融はんだを２次ノズルの広口噴出口より鏡面状に噴出させ、整形用の２次噴流波を形成する噴流式はんだ付け装置が知られている（例えば、特許文献１参照）。   A primary electromagnetic induction pump is provided along the vertical plate portion on the work carry-in side of the solder tank, a secondary electromagnetic induction pump is provided along the vertical plate portion on the work carry-out side, and a plurality of jets are ejected above the primary electromagnetic induction pump. A primary nozzle having a hole is provided, a secondary nozzle having a wide-mouth nozzle is provided on the upper side of the secondary electromagnetic induction pump, and molten solder pressurized by the primary electromagnetic induction pump is supplied from a plurality of ejection holes of the primary nozzle. A turbulent primary jet wave that fluctuates in a vertical direction is formed by ejecting it into a projection, and molten solder pressurized by a secondary electromagnetic induction pump is ejected in a mirror-like shape from the wide-mouth nozzle of the secondary nozzle There is known a jet soldering apparatus that forms a secondary jet wave for shaping (see, for example, Patent Document 1).

１次電磁誘導ポンプまたは２次電磁誘導ポンプは、１次ノズルまたは２次ノズルの上方にワークが位置する間は、コントローラより連続的に入力される所定周波数の周波数出力により駆動される。
ＷＯ９７／４７４２２号公報（第７−１１頁、図１） The primary electromagnetic induction pump or the secondary electromagnetic induction pump is driven by a frequency output of a predetermined frequency continuously input from the controller while the workpiece is positioned above the primary nozzle or the secondary nozzle.
WO 97/47422 (page 7-11, FIG. 1)

１次ノズルより噴出される乱流状の１次噴流波は、上下方向変動幅が大きいほど、ワーク下面からのフラックスガス追出し効果が大きく、フラックスガスによる不濡れを防止する効果も大きいが、これまでは、１次噴流波の上下方向変動幅が十分でなく、不濡れなどのはんだ付け不良の問題も改善の余地があった。   The turbulent primary jet wave ejected from the primary nozzle has a greater effect of ejecting the flux gas from the lower surface of the work and the greater the effect of preventing non-wetting by the flux gas as the vertical fluctuation width increases. Until then, the fluctuation width of the primary jet wave in the vertical direction was not sufficient, and there was room for improvement in the problem of poor soldering such as non-wetting.

本発明は、このような点に鑑みなされたもので、複数の噴出孔を通してワークに溶融はんだを乱流状に供給するノズルにおいて、電磁誘導ポンプを制御することによって、はんだ付け性能を向上させることができる噴流式はんだ付け装置を提供することを目的とするものである。   This invention is made in view of such a point, and improves soldering performance by controlling an electromagnetic induction pump in a nozzle that supplies molten solder to a workpiece in a turbulent flow through a plurality of ejection holes. It is an object of the present invention to provide a jet-type soldering apparatus capable of performing the above.

請求項１記載の発明は、溶融はんだを収容したはんだ槽と、このはんだ槽内の溶融はんだを加圧する電磁誘導ポンプと、この電磁誘導ポンプにより加圧された溶融はんだを上面に設けられた複数の噴出孔を通してワークに対して噴流させるノズルと、前記電磁誘導ポンプに対して入力される周波数出力を周期的に変化させることで磁界の強さを周期的に変化させる制御手段とを具備した噴流式はんだ付け装置であり、そして、制御手段が、電磁誘導ポンプに対して入力される周波数出力を周期的に変化させて、電磁誘導ポンプにおける磁界の強さを周期的に変化させると、複数の噴出孔を通してワークに溶融はんだを乱流状に供給するノズルにおいて、従来のものより噴流の強さに顕著な強弱を付けることが可能となり、不濡れの原因となるガスが停滞し難いため、はんだ付け性能が向上する。   The invention described in claim 1 is a solder bath containing molten solder, an electromagnetic induction pump that pressurizes the molten solder in the solder bath, and a plurality of molten solders pressurized by the electromagnetic induction pump. A jet comprising a nozzle for jetting a work through a jet hole and a control means for periodically changing the strength of a magnetic field by periodically changing a frequency output input to the electromagnetic induction pump And when the control means periodically changes the frequency output input to the electromagnetic induction pump to periodically change the magnetic field strength in the electromagnetic induction pump, a plurality of In nozzles that supply molten solder in a turbulent flow to the workpiece through the ejection holes, it is possible to add a remarkable strength to the strength of the jet flow compared to conventional nozzles, causing non-wetting. Since the scan is difficult to stagnation, to improve the soldering performance.

請求項２記載の発明は、請求項１記載の噴流式はんだ付け装置における制御手段が、電磁誘導ポンプに対して入力される周波数出力をパルス波形で変化させるものであり、そして、制御手段が、電磁誘導ポンプに対して入力される周波数出力をパルス波形で周期的にオン／オフさせることで、噴流の強さに、より顕著な強弱を付けることが可能となる。   In the invention according to claim 2, the control means in the jet soldering apparatus according to claim 1 changes the frequency output input to the electromagnetic induction pump in a pulse waveform, and the control means comprises: By periodically turning on / off the frequency output input to the electromagnetic induction pump with a pulse waveform, it becomes possible to add more remarkable strength to the strength of the jet.

請求項１記載の発明によれば、制御手段が、電磁誘導ポンプに対して入力される周波数出力を周期的に変化させ、電磁誘導ポンプにおける磁界の強さを周期的に変化させると、複数の噴出孔を通してワークに溶融はんだを乱流状に供給するノズルにおいて、従来のものより噴流の勢いに顕著な強弱を付けることが可能となり、不濡れの原因となるガスが停滞し難いため、はんだ付け性能を向上できる。   According to the first aspect of the present invention, when the control means periodically changes the frequency output input to the electromagnetic induction pump and periodically changes the strength of the magnetic field in the electromagnetic induction pump, the control means In a nozzle that supplies molten solder in a turbulent flow to the workpiece through the ejection hole, it is possible to apply a remarkable strength to the jet force compared to conventional nozzles, and the gas that causes non-wetting is less likely to stagnate. Performance can be improved.

請求項２記載の発明によれば、制御手段が、電磁誘導ポンプに対して入力される周波数出力をパルス波形で周期的にオン／オフさせることで、噴流の強さに、より顕著な強弱を付けることが可能となる。   According to the second aspect of the present invention, the control means periodically turns on / off the frequency output input to the electromagnetic induction pump with a pulse waveform, thereby making the strength of the jet more remarkable. It becomes possible to attach.

以下、本発明を、図面に示された実施の形態を参照しながら説明する。   The present invention will be described below with reference to the embodiments shown in the drawings.

図１は、噴流式はんだ付け装置を示し、ワークＷにはんだ付けされる溶融はんだ11を収容したはんだ槽12のはんだ槽本体12aには、溶融はんだ11を溶解させるヒータ13が設けられているとともに、このヒータ13にて溶解されたはんだ槽12内の溶融はんだ11を加圧する１次側の電磁誘導ポンプ14aおよび２次側の電磁誘導ポンプ14bが、はんだ槽12のワーク搬送方向の一側および他側にそれぞれ設けられている。   FIG. 1 shows a jet-type soldering apparatus. A solder bath body 12a of a solder bath 12 containing molten solder 11 to be soldered to a workpiece W is provided with a heater 13 for melting the molten solder 11. The primary-side electromagnetic induction pump 14a and the secondary-side electromagnetic induction pump 14b that pressurize the molten solder 11 in the solder bath 12 melted by the heater 13 are connected to one side of the solder bath 12 in the workpiece transfer direction. It is provided on the other side.

これらの電磁誘導ポンプ14a，14bは、はんだ槽本体12aの外部に、誘導コイル15を巻線した１次鉄心が配置され、はんだ槽本体12aの内部に、はんだ上昇通路16を介して２次鉄心17が上下方向に配置されている。さらに、はんだ上昇通路16の下端部には、吸込口18が、上端部には吐出口19がそれぞれ開口されている。   These electromagnetic induction pumps 14a and 14b have a primary iron core wound with an induction coil 15 arranged outside the solder bath main body 12a, and a secondary iron core inside the solder bath main body 12a via a solder rising passage 16. 17 is arranged in the vertical direction. Furthermore, a suction port 18 is opened at the lower end of the solder rising passage 16, and a discharge port 19 is opened at the upper end.

そして、各電磁誘導ポンプ14a，14bは、誘導コイル15に３相交流などの位相のずれた電流を供給することにより、はんだ上昇通路16内に移動磁界を生じさせ、はんだ上昇通路16内にある導電性の溶融はんだ11に電磁誘導による起電力を生じさせ、この起電力による電流が移動磁界の磁束中で流れることにより、はんだ上昇通路16内の溶融はんだ11に上方への推力を発生させ、吐出口19より溶融はんだ11を吐出させる。これらの電磁誘導ポンプ14a，14bは、誘導コイル15に供給される電流を、制御手段としてのコントローラ27により制御することで吐出圧力を調整可能である。   Each electromagnetic induction pump 14a, 14b generates a moving magnetic field in the solder rising passage 16 by supplying a current out of phase such as a three-phase alternating current to the induction coil 15, and is in the solder rising passage 16. An electromotive force due to electromagnetic induction is generated in the conductive molten solder 11, and a current due to this electromotive force flows in the magnetic flux of the moving magnetic field, thereby generating an upward thrust on the molten solder 11 in the solder rising passage 16, The molten solder 11 is discharged from the discharge port 19. These electromagnetic induction pumps 14a and 14b can adjust the discharge pressure by controlling the current supplied to the induction coil 15 by a controller 27 as a control means.

各電磁誘導ポンプ14a，14bのはんだ上昇通路16の上端部には、ノズル嵌着座部21がそれぞれ設けられ、これらのノズル嵌着座部21にノズルとしての１次噴流波ノズル22および２次噴流波ノズル23がそれぞれ嵌着されている。   Nozzle seats 21 are provided at the upper ends of the solder ascending passages 16 of the electromagnetic induction pumps 14a and 14b, and the primary jet wave nozzle 22 and the secondary jet wave as nozzles are provided on these nozzle seats 21, respectively. Nozzles 23 are respectively fitted.

これらの１次噴流波ノズル22および２次噴流波ノズル23の上側には、ワークＷを１対のチェンで搬送するコンベヤ24が傾斜状に配設されている。   On the upper side of the primary jet wave nozzle 22 and the secondary jet wave nozzle 23, a conveyor 24 that conveys the workpiece W in a pair of chains is disposed in an inclined manner.

各電磁誘導ポンプ14a，14bのポンプ作用により加圧されてはんだ上昇通路16内を上昇した溶融はんだ11は、１次噴流波ノズル22および２次噴流波ノズル23により上方に案内され、これらノズル22，23の上端に開口された噴流口25，26からそれぞれ噴流されて、上側で移動するワークＷに供給される。すなわち、はんだ槽本体12a内のはんだ上昇通路16などと各ノズル22，23内とにより、ヒータ13で溶解された溶融はんだ11が循環するポンプ流路28が形成されている。   The molten solder 11 pressurized by the pumping action of the electromagnetic induction pumps 14a and 14b and rising in the solder rising passage 16 is guided upward by the primary jet wave nozzle 22 and the secondary jet wave nozzle 23, and these nozzles 22 , 23 are respectively jetted from the jet ports 25, 26 opened at the upper ends of the workpieces 23 and supplied to the workpiece W moving on the upper side. That is, the pump flow path 28 through which the molten solder 11 melted by the heater 13 circulates is formed by the solder rising passage 16 and the like in the solder bath main body 12a and the nozzles 22 and 23.

１次噴流波ノズル22の噴流口25の上面には、複数の噴出孔25aを有するパンチング板が設けられ、これらの複数の噴出孔25aを通して噴流された乱流状の１次噴流波22aにより、溶融はんだ11をワークＷの基板搭載部品の隅々まで供給するものである。   A punching plate having a plurality of jet holes 25a is provided on the upper surface of the jet port 25 of the primary jet wave nozzle 22, and a turbulent primary jet wave 22a jetted through the plurality of jet holes 25a The molten solder 11 is supplied to every corner of the workpiece mounted board.

２次噴流波ノズル23は、噴流口26から噴流された静的な平面状の２次噴流波23aにより、ワークＷのはんだ付け部を整形するものである。   The secondary jet wave nozzle 23 shapes the soldering portion of the workpiece W by a static planar secondary jet wave 23a jetted from the jet port 26.

また、コントローラ27は、電磁誘導ポンプ14a，14bを制御するインバータ27aと、このインバータ27aに制御指令を与えるシーケンサ27bとを備え、１次側および２次側の各電磁誘導ポンプ14a，14bの誘導コイル15に供給される周波数、電流値、周波数出力の断続時間などを制御するが、特に、１次側の電磁誘導ポンプ14aの誘導コイル15に対して入力される周波数出力を周期的に断続変化させることで、すなわち、１次側の電磁誘導ポンプ14aを制御するインバータ27aの周波数出力を断続させることで、磁界の強さを周期的に断続変化させるものであり、具体的には、１次側の電磁誘導ポンプ14aに入力される任意周波数の周波数出力を、図２（ｂ）に示されるようなパルス間隔でオン／オフ制御する。   The controller 27 includes an inverter 27a for controlling the electromagnetic induction pumps 14a and 14b, and a sequencer 27b for giving a control command to the inverter 27a, and the induction of each of the primary and secondary electromagnetic induction pumps 14a and 14b. Controls the frequency, current value, frequency output intermittent time, etc. supplied to the coil 15, but in particular, the frequency output input to the induction coil 15 of the primary electromagnetic induction pump 14a is periodically intermittently changed. In other words, the frequency output of the inverter 27a that controls the primary electromagnetic induction pump 14a is intermittently changed to periodically change the strength of the magnetic field. The frequency output of an arbitrary frequency input to the side electromagnetic induction pump 14a is controlled to be turned on / off at a pulse interval as shown in FIG.

次に、図１に示された実施の形態の作用を、図２および図３を参照しながら詳細に説明する。   Next, the operation of the embodiment shown in FIG. 1 will be described in detail with reference to FIGS.

従来は、図２（ａ）に示されるようにワークＷがノズル22上に位置する間は、任意周波数の周波数出力を１次側の電磁誘導ポンプ14aの誘導コイル15に対して連続的に入力している。このとき、図３（ａ）に示されるように従来の１次噴流波22aoは、各噴出孔25a上で、変動幅Ａだけ不規則に上下動する。   Conventionally, as shown in FIG. 2A, while the workpiece W is positioned on the nozzle 22, a frequency output of an arbitrary frequency is continuously input to the induction coil 15 of the primary electromagnetic induction pump 14a. is doing. At this time, as shown in FIG. 3A, the conventional primary jet wave 22ao moves up and down irregularly by the fluctuation width A on each ejection hole 25a.

一方、本発明に係るコントローラ27は、図２（ｂ）に示されるように任意周波数の周波数出力を時間ｔ１の間、１次側の電磁誘導ポンプ14aの誘導コイル15に対してオンにするとともに、時間ｔ２の間、オフにするパルス動作を繰返す。例えば、４０〜９０Ｈｚ程度の周波数出力を、時間ｔ１＝０．２秒程度オンにし、時間ｔ２＝０．０５〜０．１秒程度オフにする。 On the other hand, the controller 27 according to the present invention turns on for any frequency between the frequency output time t 1, the induction coil 15 of the primary side of the electromagnetic induction pump 14a as shown in FIG. 2 (b) with, during the time t 2, repeated pulse operation of turning off. For example, a frequency output of about 40 to 90 Hz is turned on for a time t 1 = 0.2 seconds and turned off for a time t 2 = 0.05 to 0.1 seconds.

このように、１次側の電磁誘導ポンプ14aの誘導コイル15に対して入力される周波数出力を周期的にオン／オフ変化させ、電磁誘導ポンプ14aにおける磁界の強さを周期的にオン／オフ変化させると、図３（ｂ）に示されるようにパンチング板25pの各噴出孔25a上でのはんだ噴流の変化を顕著にすることができ、各噴出孔25a上の１次噴流波22aが、従来の変動幅Ａよりも大きい変動幅Ｂで上下動する。   Thus, the frequency output input to the induction coil 15 of the primary electromagnetic induction pump 14a is periodically turned on / off, and the magnetic field strength in the electromagnetic induction pump 14a is periodically turned on / off. When changed, as shown in FIG. 3 (b), the change of the solder jet on each ejection hole 25a of the punching plate 25p can be made remarkable, and the primary jet wave 22a on each ejection hole 25a becomes It moves up and down with a fluctuation range B larger than the conventional fluctuation range A.

このとき、電磁誘導ポンプ14aに対して入力される周波数出力は、例えば正弦波形で強弱変化させても良いが、パルス波形で周期的にオン／オフ変化させた方が、正弦波形の強弱変化より、噴流の強さに顕著な強弱を付けることができる。   At this time, the frequency output input to the electromagnetic induction pump 14a may be changed in strength with a sine waveform, for example, but when the pulse waveform is periodically turned on / off, the change in strength of the sine waveform is stronger. Can add a remarkable strength to the strength of the jet.

このようにして、ワークＷに溶融はんだを乱流状に供給する１次噴流波ノズル22で、従来のものより噴流の強さに顕著な強弱を付けると、図３（ｃ）に実線で示されるように、噴出孔25aのない場所に形成される１次噴流波22aの谷22bが、従来の点線で示された谷22boより深くなる。   In this way, when the primary jet wave nozzle 22 for supplying molten solder to the workpiece W in a turbulent state is given a remarkable strength to the strength of the jet flow compared to the conventional one, it is shown by a solid line in FIG. As can be seen, the valley 22b of the primary jet wave 22a formed in a place without the ejection hole 25a is deeper than the valley 22bo indicated by the conventional dotted line.

ここで、ワークＷを構成する基板Ｐの下面では、この下面に予め塗布されたフラックスが、高温のはんだ噴流に接触してガス化し、フラックスガスが発生し、このフラックスガスが基板Ｐの下面に停滞すると、不濡れのはんだ付け不良が発生するが、従来のものより噴流の勢いに顕著な強弱を付け、１次噴流波22aの谷22bを従来の谷22boより深くすることにより、不濡れの原因となるフラックスガスが、基板Ｐの下面と、１次噴流波22aの谷22bとの隙間（図３（ｃ）に斜線で示された部分）から外部へ排出されやすくなり、基板Ｐの下面に停滞し難いため、はんだ付け性能を向上できる。   Here, on the lower surface of the substrate P constituting the workpiece W, the flux previously applied to the lower surface is gasified in contact with a high-temperature solder jet, and flux gas is generated. This flux gas is applied to the lower surface of the substrate P. When the stagnation occurs, non-wetting soldering failure occurs. However, the strength of the jet flow is significantly stronger than the conventional one, and the valley 22b of the primary jet wave 22a is made deeper than the conventional valley 22bo. The causative flux gas is likely to be discharged to the outside through the gap between the lower surface of the substrate P and the valley 22b of the primary jet wave 22a (the portion indicated by hatching in FIG. 3C). Therefore, soldering performance can be improved.

すなわち、基板Ｐは、強弱のあるはんだ噴流を受けるため、はんだ付けが不完全な未はんだ状態、すなわち不濡れを起こしにくくなり、ガスの停滞に起因する不具合を未然に防止できる。この効果は、周波数出力をパルス波形で周期的にオン／オフ変化させることで、特に顕著となる。   That is, since the board P receives a strong and weak solder jet, it is difficult to cause an incomplete soldering state, that is, non-wetting, and it is possible to prevent problems caused by gas stagnation. This effect is particularly remarkable when the frequency output is periodically turned on / off with a pulse waveform.

本発明に係る噴流式はんだ付け装置の一実施の形態を示す断面図である。It is sectional drawing which shows one Embodiment of the jet type soldering apparatus which concerns on this invention. （ａ）は従来の周波数出力を示す波形図、（ｂ）は本発明に係る周波数出力を示す波形図である。(A) is a wave form diagram which shows the conventional frequency output, (b) is a wave form diagram which shows the frequency output which concerns on this invention. （ａ）は従来の噴流波形の変動幅を示す波形図、（ｂ）は本発明に係る噴流波形の変動幅を示す波形図、（ｃ）は従来の噴流波形と本発明に係る噴流波形とを比較した波形図である。(A) is a waveform diagram showing the fluctuation range of the conventional jet waveform, (b) is a waveform diagram showing the fluctuation range of the jet waveform according to the present invention, and (c) is a conventional jet waveform and the jet waveform according to the present invention. FIG.

符号の説明Explanation of symbols

11 溶融はんだ
12 はんだ槽
14a 電磁誘導ポンプ
22 ノズル
25a 噴出孔
27 制御手段としてのコントローラ
Ｗ ワーク 11 Molten solder
12 Solder bath
14a Electromagnetic induction pump
22 nozzles
25a outlet
27 Controller as control means W Work

Claims (2)

溶融はんだを収容したはんだ槽と、
このはんだ槽内の溶融はんだを加圧する電磁誘導ポンプと、
この電磁誘導ポンプにより加圧された溶融はんだを上面に設けられた複数の噴出孔を通してワークに対して噴流させるノズルと、
前記電磁誘導ポンプに対して入力される周波数出力を周期的に変化させることで磁界の強さを周期的に変化させる制御手段と
を具備したことを特徴とする噴流式はんだ付け装置。 A solder bath containing molten solder;
An electromagnetic induction pump that pressurizes the molten solder in the solder bath;
A nozzle for jetting molten solder pressurized by the electromagnetic induction pump to the workpiece through a plurality of ejection holes provided on the upper surface;
A jet soldering apparatus, comprising: a control unit that periodically changes the strength of a magnetic field by periodically changing a frequency output input to the electromagnetic induction pump. 制御手段は、電磁誘導ポンプに対して入力される周波数出力をパルス波形で変化させる
ことを特徴とする請求項１記載の噴流式はんだ付け装置。 The jet soldering apparatus according to claim 1, wherein the control means changes a frequency output input to the electromagnetic induction pump in a pulse waveform.
JP2004380720A 2004-12-28 2004-12-28 Jet soldering equipment Active JP4546236B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101140155B1 (en) 2008-09-23 2012-05-02 주식회사 티에스 Solder bath with liquid induction pump

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH035069A (en) * 1989-05-31 1991-01-10 Yokota Kikai Kk Automatic soldering device
JPH10156527A (en) * 1996-11-22 1998-06-16 Tamura Seisakusho Co Ltd Brazing device
JP2003332724A (en) * 2002-05-13 2003-11-21 Nihon Dennetsu Keiki Co Ltd Solder wave forming apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH035069A (en) * 1989-05-31 1991-01-10 Yokota Kikai Kk Automatic soldering device
JPH10156527A (en) * 1996-11-22 1998-06-16 Tamura Seisakusho Co Ltd Brazing device
JP2003332724A (en) * 2002-05-13 2003-11-21 Nihon Dennetsu Keiki Co Ltd Solder wave forming apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101140155B1 (en) 2008-09-23 2012-05-02 주식회사 티에스 Solder bath with liquid induction pump

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