JP2001119134A - Soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably form an atmosphere of an inert gas with low oxygen concen tration adjacent to an area where a printed wiring board is in contact with a jet stream, in a soldering device for soldering a printed wiring board by bringing a jet stream of a solder into contact with the printed wiring board. SOLUTION: A lower edge of a guide plate 6 for guiding a jet stream 7 of a melted solder 2 is put in the melted solder 2, and a chamber 9 is composed of the guide plate 6, a jet port 4 for forming a jet stream 7, a melted solder level 2a, and a side plate 8. An inert gas is supplied to the chamber 9 and it is heated, and the heated inert gas is discharged from a gas-discharging pipe 10 to an adjacent area where a printed wiring board 11 is contact with the jet stream 7, thereby forming an atmosphere of inert gas.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention provides a printed wiring board mounted with work to be soldered for example a number of electronic components in contact with the jet flow of molten solder in a nitrogen gas (N ₂ gas) atmosphere, thereby to be the The present invention relates to a soldering apparatus that supplies molten solder to a soldering section and performs soldering.

[0002]

2. Description of the Related Art By performing soldering in an inert gas atmosphere having a low oxygen concentration (for example, an N ₂ gas atmosphere), oxidation of a soldered portion of a printed wiring board and molten solder is suppressed, and the soldering is performed. The part can be soldered with good solder wettability.

In addition, the surface tension of the molten solder is reduced, the fluidity of the molten solder is increased, and micro soldering that can obtain good solder wettability even on a fine soldered portion can be performed. Therefore, the amount of flux that needs to be applied before soldering can be reduced, and there is an advantage that cleaning after soldering becomes unnecessary.

In a so-called flow soldering apparatus for performing soldering by bringing a jet wave of molten solder into contact with a surface to be soldered of a printed wiring board, means for forming an inert gas atmosphere having a low oxygen concentration as described above. A soldering apparatus that covers the entire soldering apparatus with a chamber body and supplies an inert gas such as N ₂ gas into the chamber body to form an inert gas atmosphere with a low oxygen concentration in the chamber body; There is a soldering apparatus that forms an inert gas atmosphere having a low oxygen concentration only in a region where a wave contacts a printed wiring board.

Since the N ₂ gas supply flow rate required to maintain the target oxygen concentration is added as running cost, it is preferable that the N ₂ gas supply flow rate, which is the N ₂ gas consumption amount, is small.

[0006] The latter soldering apparatus is often used in the soldering of printed wiring boards used in consumer electronic devices, because it has a simple structure and can obtain satisfactory effects in practical use. I have.

USP is an example of the latter soldering apparatus.
No. 5,240,169. The technique of this soldering apparatus covers a region where a jet wave of molten solder flows back into the molten solder in a solder bath with a shroud,
Gas diffuser (gas d) inside the shroud
and a gas diffuser from the gas diffuser.
_This is a technique for forming a low-oxygen-concentration N ₂ gas atmosphere around a jet wave by discharging _two gases.

Another example is disclosed in Japanese Patent Application Laid-Open No. 4-33956.
There is No. 3 publication.

This soldering apparatus will be described with reference to FIG.

[0010] In FIG. 9, a molten solder 40 stored in a solder bath (not shown) is mounted as a jet wave 43 from an outlet 42 of an outlet body 41, with electronic components mounted thereon and conveyed in the direction of arrow A. The printed wiring board 48 is soldered, flows down the guide plate 44, and returns to the solder bath.

Then, a needle pipe 47 is provided toward a peel back point 49 for soldering, and an inert gas such as N ₂ gas is discharged and blown from a gas supply pipe 46. Reference numeral 45 denotes a side plate for guiding the jet wave 43 together with the opposite side plate (not shown) so as not to leak from the side.

The technique of this soldering apparatus focuses on the fact that the oxygen concentration near the peel back point at which the printed wiring board separates from the jet wave affects the soldering quality.
This is a technique in which a needle pipe is extended to the vicinity of the peel back point to discharge N ₂ gas to the peel back point.

[0013]

SUMMARY OF THE INVENTION USP 5,240,1
In the technology of No. 69, the N released from the gas diffuser
_{(2) The} gas diffuses when flowing through the shroud to the wave front region of the jet wave, that is, the region where the printed wiring board and the jet wave come into contact, and sufficiently reduces the oxygen concentration in the wave front region which affects the soldering quality. There is a problem that cannot be done. There is also a problem that a large amount of N ₂ gas needs to be supplied.

[0014] In JP-A-4-339563 discloses a technique, because it is necessary to supply N ₂ gas from the needle pipe, a N ₂ gas from the needle pipe to supply sufficient N ₂ gas amount at high speed Injection is required, and the flow of N ₂ gas at the peel back point becomes extremely high. Therefore, the high-speed flow causes high-speed turbulence in the atmosphere near the peel-back point, and when the soldered portion of the printed wiring board separates from the jet wave, a fillet formed at the soldered portion, that is, a peel-back point. In this case, there is a problem that the fillet formation becomes unstable and the fillet shape which is important as soldering quality becomes unstable. Further, since the needle pipe is thin, when the molten solder forming the jet wave scatters, there is a problem that the molten solder adheres to the needle pipe to cause clogging of holes.

An object of the present invention is to supply an inert gas such as N ₂ gas to the vicinity of an area where a printed wiring board and a jet wave come into contact with each other, and to prevent solder clogging in a path of gas supply means by molten solder. By realizing a soldering device that can supply a stable N ₂ gas without causing any troubles, the N ₂ gas consumption is small when soldering a work to be soldered such as a printed wiring board. And to enable stable and high quality soldering.

[0016]

SUMMARY OF THE INVENTION A soldering apparatus according to the present invention comprises a guide plate, a side plate, a blower for forming a jet wave, and a molten solder level in a solder bath. A gas discharge pipe is formed having a large diameter penetrating above the jet wave from this chamber, that is, a gas discharge pipe which does not cause clogging even when molten solder adheres,
It is characterized in that the inert gas supplied to the chamber is discharged and discharged above the jet wave by a gas discharge pipe.

(1) In a solder bath containing molten solder in a heated and molten state, a blowing body for forming a blowing port on the surface of the molten solder and the molten solder are supplied to the blowing port to generate a jet wave. And a guide plate for circulating the molten solder, which forms a jet wave by jetting from the blowing port, into the solder bath, wherein the molten solder is brought into contact with a work to be soldered and solder is formed. In a soldering apparatus for performing soldering, a lower edge of the guide plate is provided so as to be immersed in the molten solder in the solder bath, and a chamber is provided between the guide plate and a molten solder liquid level in the solder bath. Form. A gas supply pipe for supplying an inert gas is provided in the chamber, and the inert gas supplied into the chamber is communicated with the jet wave through the guide plate and discharged onto the jet wave. It is configured to provide a gas discharge pipe.

Thus, the inert gas supplied to the chamber by the gas supply pipe can be discharged from the gas discharge pipe onto a jet wave and discharged. Therefore, an inert gas atmosphere having a low oxygen concentration can be formed very near the region where the printed wiring board, which is the work to be soldered, and the jet wave of the molten solder come into contact with each other.

Further, since the gas discharge pipe is provided at a position where the gas discharge pipe does not become an obstacle to the transfer of the work to be soldered, the gas discharge pipe has a large diameter which does not clog even if molten solder adheres. Can be used. Therefore, even if the molten solder forming the jet wave scatters and tries to adhere to the gas discharge pipe, it can flow down the gas discharge pipe and return to the molten solder liquid level in the chamber, that is, the solder bath. Therefore,
The gas discharge pipe is not clogged with solder.

Further, since the gas discharge pipe can be made thicker, the discharge flow rate of the inert gas can be reduced even if the discharge flow rate of the inert gas is increased. The active gas does not affect the shape of the fillet formed on the soldered portion of the printed wiring board at the peel back point, and a stable fillet can be formed.

Further, since the chamber is surrounded by the molten solder, the inert gas is heated when passing through the chamber, and the temperature of the inert gas discharged / discharged above the jet wave by the gas discharge pipe is set to the melting temperature. The temperature is equal to the temperature of the solder, and a good soldering atmosphere can be formed without cooling the work to be soldered or the jet wave of the molten solder.

(2) In the soldering apparatus of the above (1), the jet wave is configured to be covered with a hood body except for a region in contact with the work to be soldered.

This makes it possible to reduce the oxygen concentration in a region where the molten solder having formed the jet wave recirculates and flows down into the molten solder in the solder bath in addition to the effect of the above (1). Thus, the amount of oxygen involved in the molten solder in the solder bath can be reduced. Therefore, the oxidation of the molten solder generated by the entrapment can be extremely reduced.

(3) In the soldering apparatus of (1) or (2), the chamber has a sub-chamber provided with an open end having one end opened and immersed in molten solder. Is provided with a gas supply pipe for supplying an inert gas.

Thus, in addition to the functions (1) and (2), the inert gas supplied to the sub-chamber by the gas supply pipe passes through the molten solder in a bubble state from the open end of the sub-chamber. Supplied into the chamber. Therefore, the inert gas in the bubble state is directly heated from the molten solder, and even when the inert gas supply flow rate is desired to be increased, the inert gas can be sufficiently heated.

(4) In the soldering apparatus according to any one of (1) to (3), the gas discharge pipe is configured such that the inner diameter of the short axis portion is 6 mm or more.

There are various shapes of the gas discharge pipe, such as a circle and a square. However, by setting the inner diameter of the smallest part of the opposed parts to 6 mm or more, the gas discharge pipe can be melted. Even if the solder flows, it is possible to flow the molten solder as it is into the chamber below. Therefore, if the inner diameter of the gas discharge pipe is set to be equal to or larger than this dimension, the gas discharge pipe will not be clogged with solder. Therefore, an inert gas atmosphere having a stable low oxygen concentration can always be formed.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The soldering apparatus of the present invention can be implemented in the following embodiments.

(1) First Embodiment A first embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a view for explaining Embodiment 1 of the present invention, and is a sectional side view of a soldering apparatus. FIG. 2 is a perspective view for explaining the entirety of the blow-off body shown in FIG.

That is, the molten solder 2 heated and melted by a heater (not shown) is accommodated in the solder bath 1, and the molten solder 2 is supplied to the blowing port 5 of the blowing body 4 by the pump 3. A jet wave 7 is formed by jetting the molten solder 2 and guiding the molten solder 2 to flow down on the guide plate 6.

The guide plate 6 is provided in an arc shape so as to be immersed in the liquid of the molten solder 2 in the solder bath 1 from the outlet edge 4a of the outlet body 4, and depends on the shape and angle of the guide plate 6. Various jet waves 7 can be formed. In addition, blowout 5
Are provided on both sides thereof so that the molten solder 2 jetted from the blowing port 5 flows in the direction of the guide plate 6, and this side plate 8 is immersed in the liquid of the molten solder 2 in the solder bath 1. The guide plate 6 is provided with the molten solder liquid level 2a as one end.
Together, they form a chamber 9.

A gas discharge pipe 10 communicating with the chamber 9 is provided so that the gas discharge pipe 10 penetrates the guide plate 6 and its upper end is located above the jet wave 7 of the molten solder 2.
The printed wiring board 11, which is the work to be soldered, is transported by the transport conveyor 12 in the direction of arrow A and comes into contact with the jet wave 7, and the upper end of the gas discharge pipe 10 is transported. At a height such that it does not contact the printed wiring board 11. The inner diameter of the gas discharge pipe 10 is 8 mm.

On the other hand, a gas supply pipe 13 for supplying N ₂ gas as an atmospheric gas is connected to the chamber 9.

[0035] Thus, N ₂ gas is supplied from the gas supply pipe 13 into the chamber 9, the upper region of the N ₂ gas jet flow 7 which has been heated to the same extent as the temperature of the molten solder 2 in the chamber 9 i.e. Printed wiring board 11 and jet wave 7
Is discharged and discharged by the gas discharge pipe 10 to a very close region where the gas comes into contact.

Therefore, it is possible to supply N ₂ gas to a very close region where the printed wiring board 11 and the jet wave 7 are in contact with each other, and to form an inert gas atmosphere having an extremely low oxygen concentration in this region. And high quality soldering can be performed. In addition, this can be achieved with a smaller N ₂ gas supply flow rate than in the prior art.

When the printed wiring board 11 conveyed in the direction of arrow A by the conveyor 12 is in contact with the jet wave 7, the printed wiring board 11 itself becomes a lid-shaped shielding plate, and An atmosphere having an extremely low oxygen concentration can be formed in a region where the jet wave 7 is in contact with the jet wave 11.

At this time, since the inner diameter of the gas discharge pipe 10 is large, the flow rate of the N ₂ gas discharged from the gas discharge pipe 10 is low, and the flow rate of the discharge gas is low. A fillet having a stable shape can be formed in the portion to be soldered of the printed wiring board 11 without hindering the formation of the fillet at the back point 14.

Further, a chamber 9 is formed between the molten solder liquid level 2a in the solder bath 1 by the guide plate 6, and the inner diameter of the gas discharge pipe 10 is set to φ8 mm.
Even if the molten solder 2 forming the jet wave 7 scatters or covers the gas discharge pipe 10, the molten solder 2 flows down the gas discharge pipe 10 as it is and returns to the solder bath 1. No solder clogging occurs. Therefore, it is possible to always form a stable low-oxygen-concentration inert gas atmosphere, and it is possible to perform high-quality and stable soldering.

Incidentally, it is more effective if the inner diameter of the gas discharge pipe 10 is at least φ6 mm or more. Below this, if the molten solder 2 scatters or covers the gas discharge pipe 10, the molten solder 2 stays in the gas discharge pipe 10 and causes clogging. Further, there are various shapes of the gas discharge pipe 10, but in the case of a shape such as an elliptical diameter or a streamline type, even if the major axis is large, it is more effective to set the minor axis to at least φ6 mm or more. That is, the minimum inner diameter is preferably at least 6 mm or more.

(2) Second Embodiment A second embodiment of the present invention will be described with reference to FIGS.

FIG. 3 is a view for explaining Embodiment 2 of the present invention, and is a sectional side view of a soldering apparatus. FIG. 4 is a perspective view for explaining the entirety of the blow-off body shown in FIG.

The difference between the soldering apparatus of the embodiment 2 and the soldering apparatus of the embodiment 1 is that the blower 4 of the soldering apparatus has a tray-shaped guide plate for forming the jet waves 7. 17 is provided on the peel back point 14 side where the printed wiring board 11 conveyed by the conveyor 12 is separated from the molten solder 2.

That is, the molten solder 2 jetted from the outlet 5 of the outlet body 4 is supplied to the entrance 12 of the printed wiring board 11.
On the side a, the arc-shaped guide plate 6 flows down toward the molten solder 2 in the solder bath 1, and the discharge port 1 of the printed wiring board 11 is removed.
On the side 2b, that is, on the side of the peel back point 14, the gently flowing tray-like guide plate 17 forms a smooth jet wave 7, and then overflows the weir plate 15 toward the molten solder 2 in the solder bath 1. Run down. Therefore, it is often used as a finishing soldering apparatus.

In addition, the screw 16 adjusts the height of the weir plate 15 by an arrow C.
It is a screw for fixing the weir plate for adjusting the direction.

In the second embodiment, as in the first embodiment, the carry-in port 12a is placed on the molten solder liquid level 2a.
The chamber 9 is formed by the side guide plate 6, the side plate 8 and the blowing body 4.
And the chamber 9 is formed using the tray-like guide plate 17 and the side plate 8 also on the carry-out port 12b side. The gas discharge pipe 1 communicating with the chamber 9
0 is provided through both guide plates 6 and 17, respectively. The chamber 9 is provided with a gas supply pipe 13 for supplying N ₂ gas. The method of providing the gas discharge pipe 10 is the same as that of the first embodiment.

However, in the present embodiment-2, the cross-sectional shape of the gas discharge pipe 10 provided on the tray-shaped guide plate 17 is an elliptical streamline type as shown in FIG. Care is taken not to affect the smooth jet waves 7 flowing gently on the plate 17. The length of the minor axis of the streamlined gas discharge pipe 10 is 8 mm.

The operation of the soldering apparatus is the same as that of the first embodiment.

(3) Third Embodiment A third embodiment of the present invention will be described with reference to FIGS.

FIG. 5 is a view for explaining Embodiment 3 of the present invention, and is a sectional side view of a soldering apparatus. FIG. 6 is a perspective view for explaining the entirety of the outlet body of FIG.

The soldering apparatus of the embodiment-3 is
The nozzle body 20 of the first embodiment is a nozzle body 20, and a rectifying block 21 at the tip of the nozzle body 20 is provided with a swing nozzle 22 that reciprocates in the direction of arrow B. Is provided with a spout 24 in which spout holes 23 formed of long holes are arranged in a staggered manner. still,
A mechanism for reciprocating the swing nozzle 22 in the direction of arrow B, such as a crank mechanism, is omitted and not shown.

With this configuration, after the molten solder 2 supplied from the pump 3 is rectified by the rectifying holes 21 a of the rectifying block 21, the molten solder 2 reciprocates in the arrow B direction while jetting from the blowing holes 23 of the swing nozzle 22. This makes it possible to reliably supply the molten solder 2 to the fine soldered portion of the printed wiring board 11 on which chip components and the like are mounted, and to perform soldering.

For this reason, the molten solder 2 jetted from the blow-out hole 23 while reciprocating moves to the molten solder 2 in the solder bath 1.
The guide plate 6 for guiding the inside is provided so as to be in sliding contact with the swing nozzle 22, and forms a chamber 9 between the solder plate 1 and the molten solder liquid level 2 a of the solder bath 1. And this chamber 9
A gas discharge pipe 10 communicating with the guide plates 6 is provided on each of the guide plates 6. The chamber 9 is provided with a gas supply pipe 13 for supplying N ₂ gas. The method of providing the gas discharge pipe 10 is the same as that of the first embodiment.

In the soldering apparatus according to the third embodiment, there is a gap in the portion where the guide plate 6 is in sliding contact with the swing nozzle 22, but the molten solder 2 is jetted from the outlet hole 23 to form a jet wave 7. Then, as shown in FIG.
This gap is closed by the N ₂ gas supplied to the chamber 9.
The gas is discharged and discharged only from the gas discharge pipe 10.

Other operations are the same as those of the first embodiment.

(4) Fourth Embodiment A fourth embodiment of the present invention will be described with reference to FIG.

FIG. 7 is a diagram for explaining Embodiment 4 of the present invention, and is a side sectional view of a soldering apparatus.

That is, the soldering apparatus according to the fourth embodiment is different from the soldering apparatus according to the third embodiment in that the jet wave 7
Is a soldering device provided so as to cover the hood body 25 except for the wave crest region. In other words, the crest region of the jet wave 7 corresponds to the printed wiring board 11 conveyed by the conveyor 12.
And the jet wave 7 are in contact with each other.

This makes it possible to form an N ₂ gas atmosphere having a low oxygen concentration also in a region where the molten solder 2 having formed the jet wave 7 flows back into the molten solder 2 in the solder bath 1 and falls down. The molten solder 2 generated by entraining the surrounding atmosphere (particularly oxygen) into the molten solder 2 at the time of the reflux / fall
Oxidation can be greatly suppressed.

The technique of the hood 25 used in the soldering apparatus of the embodiment-4 can be applied to the soldering apparatus of the embodiment-1 and the soldering apparatus of the embodiment-2. it can.

(5) Embodiment-5 Embodiment 5 of the present invention will be described with reference to FIG.

FIG. 8 is a diagram for explaining Embodiment 5 of the present invention, and is a sectional side view of a soldering apparatus.

That is, in the soldering apparatus according to the fifth embodiment, the molten solder 2 is formed in the chamber 9 of the third embodiment, with the open end having the lower end opened shallower than the guide plate 6. This is a soldering apparatus configured to provide a sub-chamber 27 immersed in a sub-chamber and to provide a gas supply pipe 13 for supplying N ₂ gas to the sub-chamber 27.

Thus, the N ₂ gas supplied to the sub-chamber 27 by the gas supply pipe 13 is supplied from the open end of the sub-chamber 27 into the chamber 9 through the molten solder 2 in a bubble state. Therefore, the bubbled N ₂ gas is directly heated from the molten solder 2,
Becomes also to the N ₂ gas can be sufficiently heated in the case of increasing the N ₂ gas supply flow rate.

Accordingly, the soldered portion of the printed wiring board 11 and the jet wave 7 of the molten solder 2 are cooled by the N ₂ gas to cause a temperature drop, and no trouble such as a decrease in solder wettability is caused. Even if the supply flow rate of the N ₂ gas is increased, it is possible to perform high-quality and stable soldering.

The technique of the sub-chamber 27 used in the soldering apparatus of the fifth embodiment can be applied to the soldering apparatus of the first embodiment and the soldering apparatus of the second embodiment. it can. Further, the present invention can be applied in combination with the technique of the soldering apparatus of the third embodiment.

[0067]

According to the soldering apparatus of technology of the present invention as described above, according to the present invention, inert N ₂ gas or the like in close proximity of contact with the printed circuit board and jet flow of molten solder which is to be soldered workpiece By supplying a gas, an inert gas atmosphere having a very low oxygen concentration can be formed. Also, the inert gas supply flow rate can be reduced. As a result, it is possible to perform higher quality soldering while keeping running costs low.

Further, since the inert gas is supplied through a chamber surrounded by the jet flow of the molten solder and the liquid level of the molten solder in the solder bath, the temperature of the inert gas atmosphere formed is controlled. Can be set to the same level as the temperature of the molten solder, and there is no possibility that the temperature of the portion to be soldered of the printed wiring board will be lowered to cause a decrease in solder wettability.

Further, no solder clogging occurs in the gas discharge pipe for supplying the inert gas to the region where the printed wiring board and the jet wave of the molten solder come into contact. It is possible to always perform stable high-quality soldering.

In addition to these effects, in the soldering apparatus according to the second aspect of the present invention, by providing the hood body, the entrainment of oxygen generated when the molten solder which has formed the jet flow is returned to the molten solder in the solder bath and flows down. And the oxidation of the molten solder generated by this entrainment can be greatly reduced.

Further, in addition to these effects, the soldering apparatus according to claim 3 can sufficiently heat the inert gas even when the flow rate of the inert gas is increased, and the inert gas can be heated. , That is, without lowering the temperature of the soldering atmosphere.

Further, in addition to these effects, in the soldering apparatus of claim 4, the gas discharge pipe for supplying the inert gas to the region where the printed wiring board and the jet wave of the molten solder come into contact with each other is clogged by the molten solder. And stable high-quality soldering can always be performed.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a first embodiment of a soldering apparatus of the present invention.

FIG. 2 is a perspective view for explaining the entirety of the blow-off body shown in FIG. 1;

FIG. 3 is a diagram for explaining Embodiment 2 of the soldering apparatus of the present invention.

FIG. 4 is a perspective view for explaining the entire configuration of the outlet body of FIG. 3;

FIG. 5 is a view for explaining a third embodiment of the soldering apparatus of the present invention.

FIG. 6 is a perspective view for explaining the entire configuration of the outlet body of FIG. 5;

FIG. 7 is a view for explaining Embodiment 4 of the soldering apparatus of the present invention.

FIG. 8 is a view for explaining Embodiment 5 of the soldering apparatus of the present invention.

FIG. 9 is a view for explaining a conventional soldering apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder tank 2 Molten solder 3 Pump 4 Spout body 4a Spout edge 5 Spout 6 Guide plate 7 Jet wave 8 Side plate 9 Chamber 10 Gas discharge pipe 11 Printed wiring board 12 Conveyor 12a Carry-in port 12b Carry-out port 13 Gas supply pipe Reference Signs List 14 peel back point 15 dam plate 16 screw 17 tray-shaped guide plate 20 nozzle body 21 rectifying block 21a rectifying hole 22 swing nozzle 23 blow hole 24 blow port 25 hood body 27 sub chamber

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // B23K 101: 42 B23K 101: 42

Claims (4)

[Claims] 1. A blowing body for forming a blow port on a surface of a molten solder in a solder bath containing molten solder in a heated and molten state, and supplying the molten solder to the blow port to form a jet wave. And a guide plate for circulating the molten solder, which forms a jet wave by jetting from the blowing port, into the solder bath, and contacts the molten solder to a work to be soldered to perform soldering. A lower edge of the guide plate is provided so as to be immersed in the molten solder in the solder bath to form a chamber between the guide plate and a molten solder liquid level in the solder bath. And providing a gas supply pipe for supplying an inert gas into the chamber and communicating with the jet wave through the guide plate to discharge the inert gas supplied into the chamber onto the jet wave. Soldering apparatus characterized in that a gas discharge pipe. 2. The soldering apparatus according to claim 1, wherein the jet wave is covered with a hood body except for an area that comes into contact with the work to be soldered. 3. The method according to claim 1, wherein the chamber includes a sub-chamber provided with an open end having an open end, which is submerged in molten solder, and a gas supply pipe for supplying an inert gas to the sub-chamber. The soldering device according to claim 1 or 2, wherein 4. The soldering apparatus according to claim 1, wherein the gas discharge pipe has an inner diameter of a short-axis portion of 6 mm or more.