JP2008060501A - Flow soldering apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To ensure stable soldering mounting of a printed wiring board with high quality by imparting a stable flow direction and speed to a jet flow wave by adjusting and controlling a flow of a molten solder forming the jet flow wave. <P>SOLUTION: The flow soldering apparatus performs soldering by supplying a molten solder to a portion of the printed wiring board to be soldered by means of a jet flow wave of the molten solder formed jetted from a jet hole 2c provided in a blow outlet part. In the apparatus, on the side of the jet flow hole 2c there is provided an overflow control plate 3 formed with many protruded parts 3a at an end thereof, by which the molten solder jetted from the jet hole is temporarily stored and overflowed to form the jet flow wave. It is possible to adjust a flow direction and speed of the molten solder by adjusting the position of the overflow control plate vertically and horizontally. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a flow solder for soldering and mounting a soldered work such as a printed wiring board on which an electronic component is mounted by contacting a jet wave of molten solder to the printed wiring board. The present invention relates to an attaching device.

  Flow soldering equipment is required to ensure that molten solder is supplied to the soldered part of the printed wiring board to ensure sufficient wetting, and that molten solder is reliably wetted up to the through holes. A large number of fillet shapes of the soldered portions are required. And it is calculated | required that the soldering quality which uses these as a parameter distributes uniformly in each part of a printed wiring board.

  An example of a conventional flow soldering apparatus will be described with reference to FIGS. FIG. 4 is a perspective view for explaining an outline of a conventional flow soldering apparatus. FIG. 5 is a diagram showing a cross section in the direction along the conveyance direction A of the printed wiring board of the flow soldering apparatus of FIG. 4, (a) is a diagram showing a vertical cross section of the whole, (b) is It is the figure which showed only the vicinity part of a blower opening part and a jet wave.

  The solder bath 10 shown in FIG. 4 contains molten solder, and this molten solder 11 is predetermined by a heater and a temperature sensor (not shown) and a temperature control device connected to these to control the temperature of the solder. It is maintained at a predetermined temperature. Then, the molten solder 11 is fed to the blowing body 1 by solder feeding means such as the electromagnetic pump 20 shown in FIG. 5A, and the jet holes of the jet plate 2 provided on the blowing body 1. In this configuration, the jet wave 6 is formed by jetting from 2c.

  The electromagnetic pump 20 illustrated in FIG. 5A is an ALIP type electromagnetic pump, and supplies a multiphase alternating current to a drive coil 21 wound around an outer core to generate a moving magnetic field between the inner core 22 and the electromagnetic pump 20. This is a mechanism for applying a thrust to the molten solder, and a thrust generation flow path 24 is formed between the outer core and the inner core. There are many devices using propeller type pumps. The rectifying plate 7 provided in the blower body 1 is a means for adjusting the flow of the molten solder that is sucked and fed from the suction port 23 of the electromagnetic pump 20, and is stably fed to the jet plate 2. It is provided to supply molten solder under pressure.

  The electromagnetic pump 20 and the blower body 1 and the like are fixed to the upper edge of the solder bath 10 with a hanging tool 12 by screws 14 and the like, and can be easily pulled up from the molten solder 11 for maintenance. ing. The handle 13 is a gripping means for the pulling up.

  The jet wave 6 is formed by jetting from a row of jet holes 2 c provided in the jet plate 2, that is, through-hole rows, and thereafter flows down the guide portion 2 a of the jet plate 2 and returns to the solder bath 10. 4 and 5, the jet holes 2c are arranged in three rows, and the positional relationship between the jet holes is a staggered arrangement. There are one or two rows of jet holes 2c, that is, through-hole rows, but usually 2 to 5 rows are used. Further, as shown in FIG. 5, the molten solder jetted from each jet hole merges to form one jet wave 6.

  Then, the jetted wave 6 is brought into contact with the lower surface of the printed wiring board 15 conveyed by the conveyer 16 (in the direction of arrow A), that is, the soldered surface, and the soldered portion or through hole of the printed wiring board 15 is contacted. Molten solder is supplied to and soldered. 4 and 5 schematically show the conveyor 16. FIG. 5B illustrates a case where the printed wiring board 15 is conveyed at an elevation angle θ.

  In addition, the jet wave may be formed by jetting molten solder directly from the blower body having a square opening without forming the jet plate 2 in the blower body 1. Is generally used as a shaped jet wave for the purpose of adjusting the fillet shape of the part to be soldered. For example, the jet solder wave 6 shown in FIGS. 4 and 5 is used as a primary jet wave, and then the previous shaped jet wave is used as a secondary jet wave to supply molten solder to the printed wiring board in two stages. This is a soldering method.

  When performing such flow soldering, the molten solder is surely supplied to the soldered portion of the printed wiring board to ensure sufficient wetting, and the molten solder is reliably wetted up to the through hole, It is necessary to shape the fillet shape of the soldered portion into a good shape. And since many to-be-soldered parts exist in a printed wiring board, in these many to-be-soldered parts, a uniform soldering state, ie, uniform quality, is calculated | required.

In the technique of Patent Document 1, a guide groove is provided between rows of jet holes, and the flow is controlled so that the molten solder flows along the guide groove. It supplies so that it may supply to a part.
Japanese Utility Model Publication No. 4-47862

  In the conventional flow soldering apparatus shown in FIG. 4, the molten solder that has formed the jet wave 6 flows down the guide portion 2 a and returns to the solder bath 10. In this case, the molten solder forming the jet wave 6 and the molten solder flowing down the guide portion 2a are connected to each other and have a strip shape. The same applies to the technique of Patent Document 1.

  That is, one jet wave is formed by the molten solder jetted on the jet plate 2 shown in FIG. 4 and the molten solder flowing down the guide portion 2a, and the flow direction and speed of the molten solder flowing on the jet plate 2 Fluctuates under the influence of the adjacent flow direction and flow velocity, and similarly the flow direction and speed of the molten solder flowing down the guide portion 2a also fluctuate under the influence of the adjacent flow direction and flow velocity. Further, the flow direction and speed of the molten solder flowing on the jet plate 2 vary under the influence of the flow direction and flow speed of the molten solder flowing down the guide portion 2a.

  Therefore, in the technique of FIG. 4 and Patent Document 1, if a change in flow direction or speed occurs in a part of the flow of molten solder formed in a single band, the change affects the flow of the surrounding molten solder. This effect is gradually spread, and the flow direction and velocity of the jet wave repeat to fluctuate in each part of the jet wave. This is because the flowing direction and speed of the molten solder forming the jet wave are not controlled. Even the technique of Patent Document 1 is affected by the fluctuation of the flow when the molten solder that forms the jet wave returns to the solder bath, the flow direction and speed of the jet wave repeatedly fluctuate.

  Therefore, the fluctuation of this jet wave appears as a problem that the soldering quality is unevenly distributed in each part of a large number of parts to be soldered on the printed wiring board, and this soldering quality fluctuates with time. Yes.

  The object of the present invention is to adjust and control the flow of molten solder that forms a jet wave, thereby forming a jet wave suitable for the mounting state of a printed wiring board and jetting a stable flow state, that is, a stable flow direction and velocity. High-quality and stable printed wiring board soldering is possible by supplying molten solder stably regardless of the position of the soldered part on the printed wiring board and the time of soldering. There is to do.

  The present invention is characterized in that a stable jet wave can be formed by controlling the flow direction and velocity of the molten solder forming the jet wave, that is, the flow vector.

(1) In a flow soldering apparatus that performs soldering by supplying molten solder to a soldered portion of a printed wiring board by a jet wave of molten solder formed by jetting from a jet hole, on the side of the jet hole, An overflow formed by arranging a plurality of convex portions at the end where the molten solder overflows, and temporarily forming the molten solder jetted from the jet holes and overflowing the molten solder to form a jet wave The flow soldering apparatus is configured to provide the control plate.

  As a result, the molten solder that forms the jet wave flows more toward the concave portion formed between the convex portions and the direction of the molten solder that forms the jet wave is determined. Will be able to give. Therefore, a jet wave with a controlled flow can be formed. In addition, by determining the flow direction, fluctuations in the flow direction that have occurred in each part and interference due to the spread thereof are drastically reduced. Furthermore, fluctuations in the flow rate of the molten solder are drastically reduced, and interference due to the spread is drastically reduced. Therefore, a stable flow jet wave can be formed.

(2) Solder by supplying molten solder to the soldered part of the printed wiring board by a jet wave formed by jetting molten solder from a row of through holes formed by arranging the through holes through which molten solder flows. In the flow soldering apparatus, the molten solder jetted from the through hole row is temporarily provided to the side of the through holes through which the molten solder jets, and the molten solder overflows to form jet waves. And an overflow control plate in which a large number of convex portions are arranged at intervals of an integral multiple or a fraction of an integer in the row direction of the through holes at the end where the molten solder overflows. The attachment device is configured.

  As a result, the molten solder jetted from each through hole in the same manner as in the above (1) flows more toward the concave portion formed between the convex portion and the molten solder jetted from each through hole. It becomes possible to give a fixed direction to the flow of solder. Therefore, a jet wave with a controlled flow can be formed.

  Further, since the flow direction of the molten solder jetted from each through hole is determined, the interference between the flows of molten solder jetted from each through hole is also greatly reduced. That is, fluctuations in the flow direction that have occurred in each part are extremely reduced, and interference due to the spread is drastically reduced. Furthermore, the fluctuations in the speed generated in each part are extremely reduced, and the interference due to the spread is drastically reduced. Therefore, a stable flow jet wave can be formed.

(3) In the configurations of (1) and (2), the molten solder that overflows from the overflow control plate is divided into strip-shaped flows from the recesses formed between the protrusions and overflows. This is a flow soldering apparatus configured to include an overflow control plate having a convex portion in size.

  In this configuration, the molten solder in which the jet wave is formed flows down from each recess of the overflow control plate into a strip-like flow and returns to the solder bath. Therefore, it is possible to give the strongest directivity to the flow of molten solder forming the jet wave, the flow direction and velocity of the molten solder forming the jet wave are the most stable, and the most stable jet wave is formed. be able to.

(4) In the configurations of (1), (2), and (3), the overflow control plate is provided so that the position of the overflow control plate can be adjusted at least in either the height direction of the jet wave and the lateral direction orthogonal to this direction. It is the flow soldering apparatus comprised in this.

  This makes it possible to adjust the flow direction and thus the speed of the molten solder forming the jet wave, so that the flow direction when supplying the molten solder to the printed wiring board can be adjusted, and the shape of the jet wave can be adjusted. And moreover, they can be kept stable.

  According to the present invention, it becomes possible to control the flow direction and the speed of the molten solder forming the jet wave, and thus the shape of the jet wave can be adjusted. In other words, since the flow after the molten solder is jetted can be controlled, the fluctuation caused by the spontaneous occurrence and the interference due to the spread of the fluctuation are drastically reduced, and an extremely stable jet wave can be formed. become able to.

  As a result, it is possible to stably supply molten solder regardless of the position of the part to be soldered on the printed wiring board and the time of soldering, and to perform high-quality and stable soldering mounting of the printed wiring board. become able to.

  The structural example of the flow soldering apparatus in this invention is demonstrated using drawing. The basic components of the flow soldering apparatus of the present invention are the same as those of the flow soldering apparatus shown in FIGS. 4 and 5, and the structure around the blowing body forming the jet wave is different.

  FIG. 1 is a diagram for explaining the configuration of a jet plate and an overflow control plate used in the present invention, and FIGS. 2 and 3 are diagrams for explaining the operation of the overflow control plate used in the present invention.

  First, the overflow control plate used in the present invention will be described. FIG. 1 (a) shows an overflow control plate in which the recesses formed by a large number of projections are shallow and their shapes are formed in a sine shape. An example of the configuration is shown, and FIG. 1B shows an example of the configuration of the overflow control plate in which the depth of the concave portion formed by a large number of convex portions is deep and the shape of the convex portion is formed in a triangle. In addition, the shape of a convex part or a recessed part is not limited to this. Any shape that forms a gentle flow, that is, a shape constituted by a combination of curves and straight lines may be used. The overflow control plate is attached to the jet plate, and the jet plate to which the overflow control plate is attached is fixed to the blowing body with the screw 2e through the screw hole 2d. 5 is used for the flow soldering apparatus.

  1A and 1B, the overflow control plate 3 is provided so that its position can be adjusted in the direction of the arrow B in the height direction of the jet wave and in the direction of the arrow A in the transverse direction perpendicular thereto. That is, the overflow control plate 3 is provided with an adjustment hole 3c having a size that gives a position adjustment amount in the direction of the arrow A and the direction of the arrow B, and the overflow control plate 3 is made larger than the adjustment hole 3c. It is the structure which tightens and fixes with. This tightening is performed by screwing a screw 4a passing through the holding plate 4 and passing through the adjustment hole 3c into the guide portion 2a of the jet plate 2, thereby moving the overflow control plate 3 to a target position and fixing it. can do.

  The jet plate 2 is provided with three rows of through-hole rows in the longitudinal direction, that is, the direction orthogonal to the transport direction A of the printed wiring board 15 transported in FIG. It is provided so that adjacent jet holes 2c are arranged in a staggered manner.

  Further, the interval between the adjacent convex portions 3a of the overflow control plate 3 is configured to be equal to the interval between the adjacent jet holes 2c in the row of jet holes 2c (three rows in the longitudinal direction). As a result, the flow direction of the molten solder jetted from the jet hole 2c can be regularly controlled.

  Therefore, in the example of FIG. 1A, the molten solder jetted from each jet hole 2 c stays on the jet plate 2 to form a pool portion 2 b, and then mainly passes through the recess 3 b of the overflow control plate 3. Reflux into the tank. If the flow rate of the molten solder from the jet hole 2c, that is, the flow rate of molten solder supplied from the pump per unit time is adjusted to be small, the molten solder in the pool portion 2b passes only through the recess 3b of the overflow control plate 3. It flows and recirculates in the solder tank, and forms a strip-like flow (5 in FIGS. 2A and 2B) and recirculates in the solder tank.

  On the other hand, in the example of FIG. 1B, since the recess of the overflow control plate 3 is deep, the time for the molten solder jetted from each jet hole 2c to form a pool on the jet plate 2 is short, and immediately the overflow control plate 3 It becomes a strip-like flow passing through each of the recesses 3b and flows back into the solder bath. In the example of FIG. 1 (b), since the convex portion 3a is formed in a triangle, the flow of the overflow control plate 3 is returned from the concave portion by adjusting the arrow B direction, that is, its height position (see FIG. 1B). The flow rate of 2 (a) (b) 5) can also be adjusted.

  FIG. 2 shows how the flow of molten solder jetted from the jet holes, that is, the flow of molten solder constituting the jet wave, is adjusted by adjusting the position of the overflow control plate 3 in the lateral direction, that is, the direction of arrow A in FIG. FIG. 2A and FIG. 2B are diagrams for explaining whether they are controlled, and the positions of the overflow control plate 3 are different from each other, and the convex portions 3a are shown in black and the concave portions 3b are shown in white.

  When the lateral position of the overflow control plate 3 is adjusted as shown in FIG. 2 (a), the molten solder jetted from the jet holes 2c flows in a row in an oblique direction as shown by arrows in the figure, and jet waves , And forms a strip-like flow 5 from the recess 3b to be refluxed into the solder bath. Thus, a fixed directionality is given to the flow of the molten solder forming the jet wave, and a jet wave having a stable flow direction is formed. Accordingly, the flow of the molten solder is less likely to interfere with each other, and the speed at which the molten solder flows is stabilized.

  Further, when the lateral position of the overflow control plate 3 is adjusted as shown in FIG. 2 (b), the molten solder jetted from each jet hole flows in a row in the front-rear direction as shown by the arrows in FIG. A wave is formed and becomes a strip-like flow 5 from the recess 3b and flows back into the solder bath. Also in the case of this adjustment example, although the direction in which the molten solder flows is different from that in FIG. 2A, the flow direction of the molten solder that forms the jet wave is given, and the flow direction is stabilized. A jet wave is formed. Accordingly, the flow of the molten solder is less likely to interfere with each other, and the speed at which the molten solder flows is stabilized. Since the overflow control plate controls the flow state of the molten solder in this way, it can also be called a flow control plate.

  In this way, the flow direction and speed of the molten solder constituting the jet wave are stabilized and the flow direction can be controlled, so that the printed wiring board mounting state (mainly the type of electronic component and the disposition of it) (Distribution state of the soldered portion defined by the above), an optimum jet wave, that is, a jet wave that provides the best wetting and through-hole wetting can be formed by supplying the molten solder best.

  FIG. 3 shows the flow of molten solder jetted from the jet hole 2c, that is, the jet wave 6 by adjusting the position of the overflow control plate in FIG. 1A in the vertical direction, that is, in the direction of arrow B in FIG. FIG. 3A is a diagram for explaining how the flow of the molten solder constituting is controlled, FIG. 3A shows an example in which the position of the overflow control plate 3 is adjusted high, and FIG. 3B is an overflow control. The example which adjusted the position of the board 3 low is shown.

  When the position of the overflow control plate 3 is increased as shown in FIG. 3A, the amount of molten solder jetted from the jet hole 2c is increased on the jet plate 2, and the wave height of the jet wave 6 is increased at the same time. The ripple generated in the shape is reduced. On the other hand, when the height of the overflow control plate 3 is lowered as shown in FIG. 3B, the amount of molten solder jetted from the jet hole 2c is reduced on the jet plate 2, and the wave height of the jet wave 6 is reduced. At the same time, the ripple generated in the jet wave shape increases. When the supply flow rate per unit time of the molten solder supplied from the pump in the state of FIG. 3B is increased, the supply amount of the molten solder forming the jet wave 6 increases as shown by the broken line, and the wave height of the jet wave 6 is increased. However, the overflow flow rate increases from the recess 3b, and the flow direction of the molten solder forming the jet wave 6 is large. There is no change.

  In this way, the flow direction and speed of the molten solder are stabilized by giving a certain direction to the flow of the molten solder that has been jetted from the jet holes to form a jet wave. By soldering and mounting, the soldering quality does not change depending on the position in one printed wiring board or change for each printed wiring board, and soldering and mounting can be performed with stable quality. It becomes like this. In addition, the flow direction of the molten solder is adjusted and controlled according to the mounting state of the printed wiring board, and the jet wave shape is adjusted and controlled so that the highest soldering quality can be obtained. Become.

  In addition, the space | interval between the adjacent convex parts 3a of the overflow control board 3 may differ from the space | interval of the adjacent jet hole 2c in the row | line | column (three rows of a longitudinal direction) of the jet hole 2c. Preferably, it may be an integer multiple or 1 / integer, but the controllability is slightly inferior, but it does not necessarily have to match.

  In the example shown in FIGS. 1 to 3, an example in which a large number of through holes, that is, molten solder jet holes are provided in the jet plate has been described. However, a flat portion above the jet plate, that is, a large number of jet holes is provided. One large rectangular jet hole may be provided in the provided portion. In this case, although not shown, a jet wave having a planar shape can be obtained. And since the molten solder which formed the jet wave mainly flows out from the recessed part of an overflow control board and recirculate | refluxs in a solder tank, the flow direction and speed were controlled as demonstrated in FIGS. 1-3, and the stable jet Waves can be formed. Of course, it may be configured such that the molten solder in which the jet wave is formed flows out from the respective concave portions to form a strip-like flow and is returned to the solder bath.

  The flow soldering apparatus according to the present invention is used for solder mounting of a printed wiring board on which electronic components are mounted. And it becomes possible to control the jet wave which is easily changed in a stable state, and it is possible to perform soldering mounting with higher quality than before and contribute to the electronic industry.

The perspective view explaining the structure of the principal part of this invention The figure for demonstrating the effect | action of the overflow control board used for this invention The figure for demonstrating the effect | action of the overflow control board used for this invention The perspective view explaining the outline of the conventional flow soldering device Sectional drawing explaining the main part of the conventional flow soldering equipment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Blow body 2 Jet plate 2a Guide part 2b Reservoir part 2c Jet hole 2d Screw hole 3 Overflow control plate 3a Convex part 3c Concave hole 3c Control hole 4 Retaining plate 4a Screw 5 Strip-like flow 6 Jet wave 7 Rectifier plate 10 Solder tank DESCRIPTION OF SYMBOLS 11 Molten solder 12 Hanging tool 13 Handle 14 Screw 15 Printed wiring board 16 Conveyor 20 Electromagnetic pump 21 External core and drive coil 22 Internal core 23 Suction port 24 Thrust generating flow path

Claims (4)

In a flow soldering apparatus that performs soldering by supplying molten solder to a soldered portion of a printed wiring board by a jet wave of molten solder formed by jetting from a jet hole,
The molten solder jetted from the jet hole is temporarily accumulated on the side of the jet hole, and the molten solder is overflowed to form a jet wave, and a large number of ends of the molten solder overflow Providing an overflow control plate with juxtaposed projections,
Flow soldering device characterized by Flow for performing soldering by supplying molten solder to a soldered part of a printed wiring board by a jet wave formed by jetting molten solder from a row of through holes formed by arranging the through holes through which molten solder flows. In soldering equipment,
The molten solder jetted from the through-hole row is temporarily accumulated on the side of the through-hole through which the molten solder jets, and a jet wave is formed by overflowing the molten solder, and the molten solder overflows Provided with an overflow control plate formed by arranging a large number of convex portions at an end portion to be arranged at an integer multiple of an interval in the row direction of the through-holes or at an interval of an integer.
Flow soldering device characterized by The overflow control plate was formed in a size that the molten solder overflowing from the overflow control plate was divided into strip-shaped flows from the recesses formed between the projections and formed into a size to overflow. ,
The flow soldering apparatus according to claim 1 or 2, characterized by the above-mentioned. The overflow control plate is provided so that the position of the overflow control plate can be adjusted at least in either the height direction of the jet wave and the transverse direction perpendicular to the direction;
The flow soldering apparatus according to any one of claims 1 to 3, wherein

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