JP2010158687A - Soldering device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering device in which flux fume is hardly deposited on a lid body and a suppression plate, the lid body is lightweight, and a maintenance work such as a cleaning work is facilitated. <P>SOLUTION: The soldering device has a chamber body 30 arranged so as to cover a conveying means for conveying a workpiece W to be soldered. A plurality of suppression plates 36, 46 are juxtaposed in the chamber body 30 along the workpiece conveying direction, and the soldering is executed while feeding inert gas directing a soldering part 1. An opening part 34 is opened in an upper part of the chamber body 30. A transparent lid body 35 is attachably/detachably fitted to the opening part 34. A labyrinth unit 36 with the suppression plate 46 being unitized thereto is attachably/detachably fitted in the chamber body 30 itself corresponding to the opening part 34. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an apparatus for soldering electronic components or the like in a low oxygen concentration inert gas atmosphere formed in a chamber.

  When this type of soldering is performed, oxidation in the soldered parts such as the lead terminals of electronic components and soldering lands of printed wiring boards is suppressed in an inert gas atmosphere of low oxygen concentration, and excellent solder wettability is achieved. can get. Note that nitrogen gas is usually used as the inert gas. Accordingly, since a small amount of flux is applied in advance to the soldered portion in flow soldering, almost no flux residue remains on the printed wiring board after soldering. Similarly, in reflow soldering, the amount of flux in cream solder can be reduced.

  Therefore, it is not necessary to clean the printed wiring board after soldering. Such cleaning is performed in order to eliminate the influence of corrosion or the like due to flux residues in solder mounting of a highly reliable printed wiring board.

  Here, Patent Document 1 discloses a flow soldering apparatus in which a printed wiring board transfer conveyor is provided in a tunnel-shaped chamber, and a solder bath for forming a preheater and a jet of molten solder is provided in the transfer order. . The tunnel-shaped chamber body has a region for conveying the printed wiring board at an elevation angle and a region for conveying the depression angle, and constitutes a “h” -shaped chamber body as viewed in a longitudinal section along the conveyance direction of the conveyance conveyor. A solder bath for forming a preheater and a jet of molten solder is provided in the elevation conveyance area, and the printed wiring board as a work to be soldered is cooled in the depression conveyance area.

  Further, in order to position the jet wave of the molten solder in the chamber body, the chamber body is provided with an opening opened so as to face the solder tank, and this opening is provided with a skirt extending to the solder tank side, The skirt is immersed in the molten solder in the solder bath to realize perfect sealing of the opening.

  A nozzle for supplying an inert gas such as nitrogen gas is provided on the rear side of the solder bath as viewed from the direction of conveyance of the printed wiring board, and nitrogen gas is directed toward the area where the printed wiring board and the jet wave are in contact with each other. The directivity of nitrogen supply is determined to supply. Thus, an inert gas atmosphere having a low oxygen concentration is formed in the chamber. In addition, by supplying nitrogen gas into the chamber body, the chamber body atmosphere is released from the carry-in port and the carry-out port. In this case, the suppression plate provided in the chamber body is a member that suppresses unnecessary atmospheric flow in the chamber body, thereby forming a labyrinth seal structure.

  FIG. 5 is a diagram for explaining a configuration example of a conventional chamber body, and FIG. 5 (a) shows the structure near the entrance of the chamber body as seen in the longitudinal section along the transport direction of the transport conveyor. FIG. 5B is a perspective view illustrating the entire cover body provided in the chamber body. In FIG. 5A, the conveyer is shown in a simplified manner with a one-dot chain line for easy understanding of the drawing.

  That is, a tunnel-like chamber body 200 is provided along the transport direction of the transport conveyor 201, and a printed wiring board (work W) on which electronic components are mounted is carried from the carry-in port 202 and is transported through the chamber body 200. Soldering is performed. In the chamber body 200, a plurality of restraining plates 203 are arranged in parallel above and below the transport conveyor 201 so that the transport direction of the transport conveyor 201 and the plate surface thereof are orthogonal to each other, thereby forming a labyrinth seal structure. In addition, an opening 204 is formed above the chamber body 200, and a lid 206 is provided in the opening 204 via a seal member 205 so as to be opened and closed, so that maintenance work in the chamber body 200 can be easily performed. is doing. The lid 206 is provided with a restraining plate 203 so as to form a labyrinth seal structure in the chamber body 200. Further, the lid 206 may be provided with a window 208 provided with a glass plate 207. A handle 209 is a holding member for opening and closing work.

  As disclosed in Patent Document 1, the solder tank is provided with a temperature sensor and a temperature control device in addition to a heater (not shown). And it is comprised so that the temperature of the molten solder in a solder tank may be maintained at the predetermined temperature determined beforehand. Incidentally, the temperature of the molten solder is usually set to about 250 to 260 ° C.

  In addition, the preheater is provided with means for heating hot wires such as infrared rays, means for heating hot air, and means for using both hot wires and hot air, and the surface temperature and hot air temperature of the infrared heater become a predetermined temperature. Thus, it is controlled by the sensor and the temperature control device. Incidentally, the temperature of the printed wiring board heated by the preheater is usually set to be about 90 to 150 ° C.

  In such a soldering apparatus, flow soldering of a printed wiring board is performed as follows. That is, when a printed wiring board on which flux has been applied in advance is carried in from the carry-in port of the chamber body, the printed wiring board is heated by a preheater, and drying and pre-activation of the pre-applied flux are performed. This heating is called preheating, and this process is called a preheating process. This preheating process also has a role to alleviate heat shock when the printed wiring board contacts the jet wave of the molten solder.

  When the preheating of the printed wiring board is completed, the molten solder is subsequently supplied to the soldered portion in contact with the jet wave on the solder bath, and soldering is performed. This process is referred to as a soldering process, and then the printed wiring board is cooled (cooling process) and unloaded from the outlet of the chamber body to complete a series of flow soldering.

JP 2001-230538 A

  When the printed wiring board on which the flux has been applied in advance is transported into the chamber and soldered, flux fumes are generated in the preheating process and the soldering process. And when this flux fume becomes below about 70 ° C., condensation occurs rapidly and condensation occurs.

  On the other hand, a silicone rubber-based seal member is used as the seal member 205 shown in FIG. 5, but this seal member 205 also acts as a heat insulating material. For this reason, the lid 206 and further the restraining plate 203 provided on the lid 206 are cooled by the ambient air and the temperature is lowered, and a large amount of flux fume is condensed and adhered to the surfaces of the restraining plate 203 and the lid 206.

Then, such an adhering substance will drop over time, and if it is left as it is, it will drop onto the printed wiring board transported by the transporting conveyor 201, causing the problem of contamination of the workpiece W.
In addition, since the lid body 206 is generally composed of a metal (stainless steel) plate, the weight of the lid body 206 is increased, and the opening / closing operation and the maintenance work in the chamber body 200 are further performed. The actual situation is that the work of cleaning the deterring plate 203 is inevitably complicated.

  In view of such circumstances, an object of the present invention is to realize a soldering apparatus in which flux fume is hardly attached to the lid body and the suppression plate, the lid body is also lightweight, and maintenance work such as cleaning work is easy.

  First, the soldering apparatus of the present invention has a chamber body disposed so as to cover a conveying means for conveying a workpiece to be soldered, and a plurality of restraining plates are arranged in parallel along the workpiece conveying direction in the chamber body. In addition, the soldering apparatus is configured to perform soldering while supplying an inert gas, and an opening is formed in the upper portion of the chamber body, and a transparent lid is detachably attached to the opening. The labyrinth unit formed by unitizing the restraining plate corresponding to the opening is detachably mounted on the chamber body itself.

  Next, in the soldering apparatus according to the present invention, the lid body is formed in a plate shape with a glass material or a synthetic resin material, and has a frame around the periphery, and is a seal laid along the peripheral edge portion of the opening. It is characterized by being in elastic contact with the member.

  Further, in the soldering apparatus according to the present invention, the labyrinth unit mounting structure including a mounting table provided at an opening edge of the opening of the chamber body and a latching portion protruding from a side of the labyrinth unit. Means, and a bulleting means configured to bring the lid into elastic contact with the seal member.

  Further, in the soldering apparatus of the present invention, the plate surfaces of the deterring plate that is located above the conveying unit and that constitutes the labyrinth unit and the deterring plate that is located under the conveying unit are aligned with each other. It arrange | positions so that it may carry out.

  As the main function of the present invention, the lid that covers the opening at the top of the chamber body is formed of a material having a low thermal conductivity, typically glass or synthetic resin. In this case, the lid is configured separately from or separated from the restraining plate arranged in parallel in the chamber body. By configuring in this way, the lowering of the surface temperature of the lid inside the chamber is suppressed, the labyrinth unit constituting the labyrinth seal becomes substantially the same temperature as the chamber body, preventing condensation due to cooling of the flux fume, Flux fume becomes difficult to adhere.

  Further, the entire surface of the opening provided in the upper part of the chamber body is typically covered with a glass plate, whereby the visibility inside the chamber body becomes extremely good and the operability of the soldering apparatus is improved. In that case, specifically, since the glass plate is provided with a frame to form a lid, it is lightweight and can be easily opened and closed and attached / detached.

  Moreover, labyrinth sealing can be performed satisfactorily by arranging a plurality of rows of deterrence plates in the chamber.

  According to the present invention, the inside of the chamber can be widely looked through through the opening that the lid covers, and the flux fume is difficult to adhere to the restraining plate made of the lid or plate-like member, and the lid is also lightweight. Therefore, it is possible to realize a soldering apparatus that facilitates maintenance work such as cleaning work. Further, since the thermal conductivity of the lid is remarkably small, the loss generated in the soldering device, that is, the energy released into the atmosphere through the chamber body and thus the lid is reduced, and an energy-saving soldering device can be realized. As a result, it is possible to comfortably perform the soldering / mounting operation of the printed wiring board, and it is possible to realize a soldering / mounting environment excellent in operability and energy saving.

DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a soldering apparatus according to the present invention will be described with reference to the drawings.
In this embodiment, as a part to be soldered to be soldered, for example, a printed wiring board (hereinafter referred to as a work W) on which an electronic component is mounted, and melted by molten solder jetted to a soldered part of the work W Solder shall be supplied for soldering.

FIG. 1 shows the overall configuration of the soldering apparatus of the present invention. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is an exploded perspective view for explaining the configuration of the opening of the chamber body, the labyrinth unit, the lid, and the like.
In the main configuration of the apparatus of the present invention, the soldering part 1 for soldering the work W, the transport part 2 for transporting the work W along a predetermined transport path, and the transport part 2 so as to cover it. A disposed chamber body 3 is included.

  First, the overall configuration of the apparatus according to the present embodiment will be schematically described. A soldering jet wave forming device 10 is arranged in the soldering part 1. After the pretreatment process including flux application, the workpiece W is sequentially transported and positioned at a predetermined position above the soldering jet wave forming device 10 as shown in FIG. It has become. In FIG. 1, the workpiece W is conveyed in the direction of arrow B. Further, the transport unit 2 includes a carry-in port 2A into which the work W is input and a carry-out port 2B from which the work W is carried out.

  A solder 12 (molten solder) in a molten state is accommodated in a solder tank 11 that is typically rectangular in plan view of the soldering jet wave forming device 10. The solder tank 11 has, for example, a substantially rectangular parallelepiped shape whose upper portion is open, and a plurality of heaters (not shown) are attached to the outer wall including the side surface and the bottom surface. The temperature of the molten solder 12 in the solder tank 11 is detected by a temperature sensor (not shown), and the detection signal is sent to the control unit. The control unit that has received the temperature detection signal controls the electric power to be supplied to the heater, so that the heater holds the molten solder 12 in the solder bath 11 in a molten state at a predetermined temperature. is there.

  A pump 13 for discharging the molten solder 12 is immersed in the solder bath 11. The pump 13 (the molten solder discharge port) is connected to the blower body 14 having the blower opening 14a at the upper portion thereof via the molten solder feeding means. When the pump 13 is driven, the molten solder 12 is discharged from the discharge port. Then, the molten solder 12 discharged from the pump 13 is fed to the blowing body 14 and flows out from the blowing hole 14a as a jet wave (arrow C in FIG. 1). By this jet wave, the work W transported above the blowing port 14a of the blowing body 14 is soldered.

  Further, the molten solder 12 having formed the jet wave flows down along the guide plate 14 b of the blower body 14 and returns to the solder tank 11. The molten solder 12 is then sucked again from the suction port of the pump 13 and circulated.

  Next, the conveyance conveyor 20 which holds the workpiece | work W in the conveyance part 2 and passes right above the soldering jet wave formation apparatus 10 is constructed. In this example, there is a transport conveyor 20A (first transport conveyor) that transports the workpiece W at an elevation angle and a transport conveyor 20B that transports the depression W, both of which are viewed as a longitudinal section along the work transport direction, and as a whole transport conveyor 20 Connect to form a “he”. Corresponding to the conveyor 20A, a preheater 4 and a soldering part 1 for preheating the workpiece W are disposed, and a preheating step (or region) and a soldering step (or region) are set by these. Further, a cooling process (or region) for cooling the workpiece W is set corresponding to the transport conveyor 20B.

As shown in FIG. 2, the specific configuration of the conveyor 20 includes conveyors 21 and 21 that travel in pairs along both sides of the workpiece W. Each conveyor 21 is provided with a support piece 22 that sandwiches and supports the side edge portion of the work W, and the work W is conveyed through each support piece 22 while balancing. In addition, a plurality of electronic components w ₁ is the work W, w _2,. . Is installed.

  Next, in the chamber body portion 3, the chamber body 30 is disposed so as to cover the transport conveyor 20. Corresponding to the transfer conveyor 20A and the transfer conveyor 20B, it has a chamber body 30A and a chamber body 30B, both of which are formed in a “h” shape as a whole chamber body 30 when viewed in a longitudinal section along the workpiece transfer direction. Connect to

  Here, in the chamber body 30 (30 </ b> A), an opening 31 is provided in the corresponding portion of the soldering jet wave forming device 10 for communicating the chamber inner space with the soldering jet wave forming device 10. A skirt 32 is suspended from the opening 31 so as to surround the blower body 14 and the jet wave located on the molten solder liquid surface of the solder bath 11. The skirt 32 is immersed in the molten solder 12 in the solder bath 11 to realize perfect sealing of the opening 31.

  Further, a nozzle 5 for supplying an inert gas such as nitrogen gas is provided on the rear side of the solder tank 11 when viewed in the direction in which the workpiece W is conveyed. The directivity of the inert gas supply is determined such that the inert gas is supplied toward the region where the work W conveyed by the conveyor 20A contacts the jet wave. Thereby, an inert gas atmosphere having a low oxygen concentration is formed in the chamber body 30. On the other hand, a suppression plate 33, which is a plate-like member, is provided in a direction perpendicular to the workpiece conveyance direction at the lower part and the side part of the chamber body 30. In this case, as illustrated in FIG. 2, the lower suppression plate portion 33 a and the side suppression plate portion 33 b may be provided integrally. In addition, the side suppression board part 33b does not necessarily need to be provided, and can be provided according to the grade of the sealing performance requested | required. By arranging a plurality of the suppression plates 33 in parallel, a labyrinth seal structure is formed in the tunnel-shaped chamber body 30 to suppress unnecessary flow of the atmosphere in the chamber body 30.

Now, in the present invention, an opening 34 is particularly formed in the upper portion of the chamber body 30, and a transparent lid 35 is detachably attached to the opening 34. Further, as will be described later, a labyrinth unit 36 formed by unitizing a restraining plate that is a plate-like member is detachably mounted by the chamber body 30 corresponding to the opening 34. That is, the labyrinth unit 36 is independent of the lid 35 and is not supported via the lid 35 as in the prior art, but is supported on the chamber body 30 side as will be described later. The lid 35 is formed in a plate shape from a glass material or a synthetic resin material, and elastically contacts a seal member 37 laid along the peripheral edge of the opening 34.
In FIG. 1, the opening 34 or the lid 35 is connected over the entire length of the chamber body 30 so as to be adjacent to each other. However, since these are substantially the same, the reference numerals and the like are appropriately simplified. Has been.

  In a specific configuration, as shown in FIG. 2 and FIG. 3, a rectangular opening 34 is typically provided in the upper portion of the chamber body 30, and a seal member is provided on the upper surface of the chamber body 30 so as to surround the opening 34. 37 is provided. The width of the opening 34 (the direction orthogonal to the workpiece conveyance direction) is set so as to approach the width of the chamber body 30 (upper part thereof), although it is limited in order to secure an arrangement space for the seal member 37. The As the seal member 37, for example, a silicone rubber heat insulating seal member or the like is used. In the present embodiment, the lid 35 includes a transparent and rectangular glass plate 38 and a frame 39 having a groove 39 a that engages so as to sandwich the peripheral edge of the glass plate 38.

  In this case, the glass plate 38 that comes into contact with the sealing member 37 provided so as to surround the opening 34 of the chamber body 30 as described above is set such that the inner portion of the frame body 39 is larger than the planar shape of the sealing member 37. The Therefore, as shown in FIG. 2, when the glass plate 38 comes into contact with the seal member 37 surrounding the opening 34 of the chamber body 30, the opening 34 can be completely sealed.

  An ammunition means for elastically contacting the glass plate 38 with the seal member 37 is provided. In this example, two fulcrum bars 40 are provided on one end side of the frame body 39 (left or right side as viewed in the workpiece conveyance direction), and one fulcrum bar 40 corresponds to each fulcrum bar 40. A stop 41 is provided which can be engaged therewith. In addition, two hanging tools 42 are provided on the other end side of the frame 39 (right or left when viewed in the workpiece transfer direction), and the other outer surface of the chamber body 30 corresponds to each hanging tool 42. A tension lock 43 is provided that can be engaged. A handle 44 is attached to the other end side of the frame 39.

  When the lid 35 is attached to the opening 34 of the chamber body 30, first, the fulcrum bar 40 and the stopper 41 are engaged (FIG. 2, arrow D), and then the tension stopper is attached to the hook 42 of the frame 39. In a state where the hook bar 43 is engaged, the lever is operated to pull downward as shown by an arrow E in FIG. As a result, the glass plate 38 is elastically brought into contact with the sealing member 37 and held in that state, that is, the lid 35 is fixed at a predetermined position of the chamber body 30. Note that the glass plate 38 can be brought into elastic contact with the sealing member 38 by using means other than the bulleting means.

  Furthermore, a mounting table portion 45, that is, an engaging portion for mounting and holding a labyrinth unit 36 described later is provided at the opening edge of the chamber body 30. In this example, a pair of mounting table portions 45 are disposed along two opposite sides of the opening 34 when viewed in the workpiece conveyance direction. Here, as shown in FIG. 3, the labyrinth unit 36 is configured integrally with a holding plate 47 by arranging a plurality of suppression plates 46 side by side. Each suppression plate 46 is disposed in a direction orthogonal to the workpiece conveyance direction.

  The holding plate 47 is provided with a pair of hooking portions 47a that project in a bowl shape to the side of the labyrinth unit 36 (direction orthogonal to the workpiece conveyance direction). As shown in FIG. 2, when the labyrinth unit 36 is fitted into the opening 34 of the chamber body 30, the latching portion 47 a of the holding plate 47 is attached to the mounting table 45 provided in the opening 34 of the chamber body 30. It is placed and engaged, and is thereby held at a predetermined position of the chamber body 30. In this way, the labyrinth unit 36 is detachably mounted on the chamber body 30 itself by the mounting means configured by the mounting table 45 and the holding plate 47 (the latching portion 47a).

  Further, the labyrinth unit 36 forms an upper restraint plate portion in the chamber body 30, and aligns, that is, aligns, the aforementioned restraint plates 33 (lower restraint plate portion 33a and side restraint plate portion 33b) with their plate surfaces. It is arranged as follows. In the drawing, the labyrinth unit 36 shown in FIG. 3 shows five deterrence plates 46, whereas the labyrinth unit 36 shown in FIG. 1 shows only three deterrence plates 46. Both are the same.

  In the above configuration, first, the glass plate 38 and the frame body 39 constitute a lid body 35, and the lid body 35 is detachably provided to the chamber body 30. And since the whole surface of the opening part 34 of the chamber body 30 is covered with the glass plate 38, the inside of the chamber body 30 can be visually recognized extensively. In addition, as shown in FIG. 2, the glass plate 38 side end of the deterrent plate 46 constituting the labyrinth unit 36 and the surface (inner side surface) of the glass plate 38 on the labyrinth unit 36 side have a slight gap. Configure to avoid contact.

  Further, as shown in FIG. 1, the chamber body 30 is provided with openings 34 side by side along the transport direction of the transport conveyor 20, and a frame body 39 of the lid body 35 is provided adjacently along the work transport direction. Is done. Therefore, it is possible to visually recognize the interior of the chamber body 30 to every corner, and it is possible to visually recognize the state of conveyance of the printed wiring board of the workpiece W, that is, a series of processes in which soldering is performed without any obstacles.

  The thermal conductivity of the glass of the glass plate 38 is about 0.7 [W / m · K], about 84 [W / m · K] for iron, and about 17 [W / m · K] for stainless steel (SUS304, SUS316). It is. In other words, the thermal conductivity of glass is about 1/100 that of iron, and about 1/24 of commonly used stainless steel, and the thermal conductivity is extremely small. The thermal conductivity of silicone rubber used as the sealing member is about 0.15 [W / m · K]. Therefore, the glass plate 38 provided as a lid of the opening 34 of the chamber body 30 is extremely excellent in heat insulation as compared with a lid made of iron or stainless steel. Accordingly, the surface temperature of the glass plate 38 inside the chamber body 30 is higher than that of the lid made of iron or stainless steel, and flux fumes generated in the chamber body 30 due to the soldering mounting of the printed wiring board of the workpiece W are generated by the glass plate 38. It becomes difficult to adhere to.

  It is also possible to form the lid 35 using a transparent and plate-like synthetic resin material. That is, a plastic material (for example, acrylic glass, PVC (vinyl chloride), or the like) having a thermal conductivity equivalent to or lower than glass can exhibit the same function as the lid 35 described above.

Further, since the labyrinth unit 36 is held in contact with the mounting table 45 of the chamber body 30, the labyrinth unit 36 is heated to a temperature substantially equal to the temperature of the chamber body 30 through the heat conduction of the contact portion. Accordingly, it is difficult for flux fume to adhere to the labyrinth unit 36.
Furthermore, since the labyrinth unit 36 and the glass plate 38 that is the lid 35 are configured to be detachable from the chamber body 30, cleaning and cleaning operations can be facilitated in maintenance associated with long-term use. it can.

In the above-described embodiment, the so-called flow soldering apparatus (FIGS. 1 to 3) is exemplified, but the same configuration can be adopted for the furnace body constituting the chamber body in the reflow soldering apparatus.
FIG. 4 shows an example of a reflow soldering apparatus. The reflow soldering apparatus will be schematically described. In addition, the same code | symbol shall be used for the member which is substantially the same as the said embodiment or respond | corresponds. An electronic component is mounted on the paste-like solder printed on the printed wiring board in the work W, and the solder is heated while being transported by the transport conveyor 20 after being introduced from the transport entrance 2A of the transport unit 2. Melting and soldering are performed. Thereafter, the workpiece W is unloaded from the unloading port 2B.

  In FIG. 4, in the furnace 101 of the reflow soldering apparatus 100, a preheating process, a reflow process, and a cooling process are set along the workpiece conveyance direction. Heating means 102 and 103 are arranged in the preheating process, heating means 104 is arranged in the reflow process, and cooling means 105 is arranged in the cooling process. The nitrogen gas supply device 106 is connected to the inside of the furnace 101 so that nitrogen gas is supplied from a nitrogen gas supply port 107. In addition, as a heating means, the hot-wire heating means using a infrared ray etc., a hot-air heating means, etc. can be used, for example.

In this example, labyrinth portions 108 and 109 configured substantially the same as those in the above-described embodiment are disposed before and after the furnace 101. That is, in each of the labyrinth portions 108 and 109, the lid body 35 constituted by the glass plate 38 and the frame body 39 is provided detachably with respect to the opening 34 of the chamber body 30. Further, the labyrinth unit 36 is detachably mounted by the mounting means corresponding to the opening 34.
In FIG. 4, the labyrinth portion 109 on the carry-out port 2 </ b> B side is substantially the same as the labyrinth portion 108 on the carry-in port 2 </ b> A side, and thus description thereof is omitted.

  In this example, in the reflow soldering apparatus 100, a labyrinth seal is provided only on the carry-in port 2A side or the carry-out port 2B side, but the inside of the chamber body 30 is overlooked widely through the lid 35 as in the above embodiment. In addition, it is difficult for flux fumes to adhere to these members, and maintenance work and the like can be facilitated. That is, it is possible to comfortably perform the soldering / mounting operation of the printed wiring board, and it is possible to realize a soldering / mounting environment excellent in operability and energy saving.

  Even in the case of the flow soldering apparatus described in the above-described embodiment, a labyrinth seal may be provided only at the carry-in port 2A or the carry-out port 2B, and even in this case, the configuration of the present invention can be applied.

As mentioned above, although this invention was demonstrated with embodiment, this invention is not limited only to these embodiment, A change etc. are possible within the scope of the present invention.
For example, in the above-described embodiment, the lid body 35 and the like have been described as being connected to each other over the entire length of the chamber body 30 (FIG. 1), but intermittently without being connected as necessary. It is also possible to arrange.

It is a figure which shows the example of whole structure in embodiment of the soldering apparatus of this invention. It is sectional drawing which follows the AA line of FIG. It is a disassembled perspective view explaining the structure of the opening part of a chamber body, a labyrinth unit, a cover body, etc. in embodiment of the soldering apparatus of this invention. It is a figure which shows the example of whole structure of the reflow soldering apparatus as another example of application of this invention. The structural example of the conventional chamber body is shown, (a) is a figure which shows the structure of the entrance vicinity of the chamber body seen in the longitudinal cross section along the conveyance direction of a conveyance conveyor, (b) is the lid | cover provided in a chamber body It is a figure which shows a body.

DESCRIPTION OF SYMBOLS 1 Soldering part 2 Conveying part 3 Chamber body part 10 Soldering jet wave formation apparatus 11 Solder tank 12 Molten solder 13 Pump 14 Blow-off body 20 Conveyor 21 Conveyor 22 Support piece 30 Chamber body 31 Opening part 32 Skirt 33 Suppression plate 34 Opening 35 Lid 36 Labyrinth unit 37 Sealing member 38 Glass plate 39 Frame 40 Support bar 41 Stopping tool 42 Hanging tool 43 Tensile locking tool 45 Mounting base part 46 Suppression plate 47 Holding plate W Workpiece

Claims (4)

The chamber body is disposed so as to cover the conveying means for conveying the workpiece to be soldered, and a plurality of deterring plates are arranged in parallel along the workpiece conveying direction in the chamber body, while supplying an inert gas. A soldering apparatus adapted to perform soldering,
An opening is formed in the upper part of the chamber body, and a transparent lid is detachably attached to the opening, and a labyrinth unit formed by uniting the restraining plate corresponding to the opening is formed as the chamber body itself. A soldering device characterized by being detachably mounted.   The lid body is formed in a plate shape with a glass material or a synthetic resin material, and has a frame body around it, and elastically contacts a seal member laid along the peripheral edge of the opening. The soldering apparatus according to claim 1. A mounting means for the labyrinth unit comprising a mounting table provided at an opening edge of the opening of the chamber body and a latching portion protruding from a side of the labyrinth unit;
The soldering apparatus according to claim 2, further comprising a bulleting means configured to bring the lid into elastic contact with the seal member.   The restraining plate that is located above the transport means and constitutes the labyrinth unit, and the restraining plate that is located below the transport means are arranged so that their plate surfaces are aligned. The soldering apparatus of any one of Claims 1-3.

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