JP2000190072A - Soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To restrain an unnecessary atmosphere flow in a space between transferring conveyors for stabilizing an atmosphere in a chamber, and also stably perform high quality soldering by bendably installing a labyrinth plate crossing in a transferring direction of the conveyor between two parallel transferring conveyors. SOLUTION: Slots 6 are installed at an interval d on stand bases 5 which can be detachably mounted to a conveyor frame 2, and one pair of the stand bases 5 are mounted to the conveyor frame 2 of a transferring conveyor 1. The interval d of the slots 6 is set at a degree of 10-30 mm, and an interval of labyrinth plates 7 is arbitrarily adjusted and set according to the slots selected. The labyrinth plates 7 have hinges 8 and 9 at a center position and both end positions, and are bendably constituted. Insertion piece parts 10 are inserted/fitted in the slots 6 with pressure, where width of the slot 6 and thickness of the insertion piece part 10 are set to be values suitable for pressure insertion. Thereby, the labyrinth plates 7 are detachable against the stand base 5, and a labyrinth passage can be formed at a given interval.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus for soldering a plate-like work to be soldered, such as a printed wiring board, in a soldering step provided in a chamber. The present invention relates to a soldering device provided with a labyrinth device for suppressing unnecessary atmosphere flow.

[0002]

2. Description of the Related Art Apparatuses for soldering a plate-shaped work to be soldered, for example, a printed wiring board on which a large number of electronic components are mounted, are roughly classified into a flow soldering apparatus and a reflow soldering apparatus.

[0003] The soldering apparatus includes a soldering apparatus that performs soldering in an air atmosphere and a soldering apparatus that supplies an inert gas such as N ₂ gas (nitrogen gas) in an atmosphere having a low oxygen concentration. And a soldering device for performing the above.

In a soldering apparatus for performing soldering in a low oxygen concentration atmosphere, an inert gas is supplied into a chamber, thereby forming a low oxygen concentration atmosphere in the chamber and performing soldering in the chamber. Soldering equipment configured to perform is common. In a low oxygen concentration atmosphere, the oxidation of the soldered part and the solder is suppressed, the surface tension of the molten solder is reduced, and a good flow state is obtained, so that the fine soldered part is soldered well. There are advantages such as being able to.

[0005] Even in a reflow soldering apparatus that performs reflow soldering in an air atmosphere, a reflow soldering apparatus that reflow-solds a large number of parts to be soldered at once using a hot wire such as infrared rays or hot air. In general, the attachment device includes a chamber as a heating furnace for maintaining a high-temperature atmosphere.

On the other hand, a soldering apparatus generally used for mass production presupposes that a printed wiring board is held and transferred by a transfer conveyor, and the printed wiring board is provided in a soldering process section provided in the transfer path. It is configured so that it can be soldered continuously. Therefore, in a soldering apparatus having a chamber, a carry-in port and a carry-out port for a printed wiring board are provided in the chamber.

In such a soldering apparatus having a chamber and performing soldering in a low oxygen concentration atmosphere or a soldering apparatus maintaining a high temperature atmosphere, it is important to suppress unnecessary flow of the atmosphere in the chamber. It is. That is, in a soldering apparatus that performs soldering in a low oxygen concentration atmosphere, the oxygen concentration is an important parameter that affects the soldering quality, and in a soldering apparatus that maintains a high temperature atmosphere, the ambient temperature is This is because it is an important parameter that affects the attaching quality.

FIG. 9 is a side sectional view showing an example of a conventional flow soldering apparatus. In FIG. 9, the supply system of the N ₂ gas is depicted by a symbol diagram. FIG.
9A and 9B are diagrams illustrating a general mechanism example of a transport conveyor used in the soldering apparatus of FIG. 9, wherein FIG. 9A is a view of the chamber removed from above and viewed from above, and FIG. It is a cross-sectional view which shows the holding mechanism of a board.

In FIG. 9 and FIG. 10, two parallel conveyors 1 are provided in a tunnel-shaped chamber 101, and a preheating step 104 of a printed wiring board 4 is carried out along the transportation path of the conveyor 1. , A preheater 105 is provided, and a solder bath 107 is provided in the soldering process section 106.

The preheater 105 is provided in the chamber 101, and the solder bath 107 is provided below the opening 108 which desires the solder bath below the chamber. 11
The opening 108 of the chamber 101 is sealed by providing a skirt 109 immersed in the skirt 109.

The transport conveyor 1 has a configuration in which a transport chain 113 is laid over chain sprockets 112 provided at both ends of a conveyor frame 2, and a holding claw 3 is provided on the transport chain 113. The printed wiring board 4 is conveyed in the direction of arrow A from the carry-in port 122 to the carry-out port 123 while holding both end portions. That is, the chain sprocket 112 is rotated by a motor (not shown), and the transport chain 113 travels along the rail 115 of the conveyor frame 2 to transport the printed wiring board 4 held by the holding claws 3.

Further, by adjusting the distance W between the two parallel conveyors 1 according to the width of the printed wiring board 4 to be transferred, the printed wiring boards 4 of various widths can be held and transferred. . Incidentally, in FIG. 10 (a), the holding width W can be adjusted by moving the upper conveyor frame 2, that is, the upper conveyor frame 2 in the direction of arrow B in the figure.

Incidentally, such a mechanism for adjusting the width W is well known. FIG. 10B shows an example in which the lead component 116 and the chip component 117 are mixedly mounted on the printed wiring board 4, and the lower surface 4a of the printed wiring board 4 is the surface to be soldered. I have.

As shown in FIG. 9, the solder bath 107 is heated by a heater (not shown) and is in a molten state.
10 is supplied to the blowing port 119 by the pump 118 so that the jet wave 1
20 is formed. That is, the conveyor 1
The surface to be soldered of the printed wiring board 4 conveyed by the above is brought into contact with the jet wave 120, so that the molten solder 110 is supplied to the portion to be soldered and soldering is performed.

The labyrinth plates 121 provided above and below the chamber 101 are plate-like members provided so as to be orthogonal to the direction in which the printed wiring board 4 is conveyed. Are formed to form a labyrinth flow path, so that the atmosphere in the chamber does not flow unnecessarily.

On the other hand, as shown in the symbol diagram, an N ₂ gas is
A nozzle 127 for supplying gas into the chamber 101 is provided, thereby forming an inert gas atmosphere having a low oxygen concentration in the chamber 101. The reason why the nozzle 127 for supplying the N ₂ gas is provided in the soldering process unit 106 is as follows.
This is because the oxygen concentration at 06 most affects the soldering quality. Although not shown, an oxygen concentration meter is usually provided in the soldering process section 106, and based on the measurement result, the N ₂ concentration is adjusted so that the oxygen concentration becomes a target value.
The gas supply flow rate is adjusted and managed.

[0017] N _2, such as a supply is N ₂ gas cylinder of N ₂ gas
It is supplied from a gas supply device 128. N ₂ gas is supplied to each nozzle 127 through an opening / closing valve 129, a flow control valve 130, and a flow meter 131, and can be adjusted to a desired supply flow rate. Then, each nozzle 127, that is, two N ₂ gas supply systems, are integrated into one, and N ₂ gas is supplied through an on-off valve 132, a flow control valve 133, and a flow meter 134 to adjust the total supply flow rate to a desired value. It is configured to be able to.

N supplied from the N ₂ gas supply device 128
_{The two} gases are opened / closed by an opening / closing valve 135, unnecessary substances are removed by a filter 136, and are supplied after being controlled to a target pressure by a pressure control valve 137. The pressure gauge 138 is for pressure monitoring.

[0019]

By the way, Japanese Patent Application Laid-Open No.
Japanese Patent Application Publication No. 2008862 discloses a technique of providing a retractable shutter means near a carry-in port and a carry-out port of a reflow soldering apparatus. However, this is a technique for sealing the entrance and exit of the reflow soldering apparatus, and this technique cannot prevent unnecessary flow of the atmosphere in the heating chamber (chamber).

As described above, in a soldering apparatus that performs soldering in a low oxygen concentration atmosphere, the oxygen concentration affects the soldering quality. Therefore, in order to obtain good soldering quality, it is necessary to stably maintain the oxygen concentration. Also, in consideration of running costs, it is preferable that the flow rate of the supplied N ₂ gas for obtaining the target oxygen concentration is small.

For such a reason, the labyrinth plate 121 for suppressing unnecessary flow of the atmosphere in the chamber is provided in the chamber 101.

On the other hand, in such a soldering apparatus, most of the causes of the unnecessary flow of the atmosphere generated in the chamber are caused by the heat convection, the traveling of the conveyor 1 and the printed wiring board 4 transported by the traveling. The atmosphere in the chamber is taken out of the chamber.

The unnecessary flow of the atmosphere generated in the chamber can be considerably suppressed by the many labyrinth plates 121 provided in the chamber 101.

However, the space of the conveyor 1 on which the printed wiring board 4 is conveyed, that is, the portion between the two parallel conveyors 1, more specifically, the space between the two parallel conveyor frames 2 is a tunnel. It has become.
This is because the holding width W is adjusted by moving the upper conveyor frame 2 in the direction of arrow B as shown in FIG.

Therefore, an atmospheric flow occurs in the tunnel-shaped space (tunnel effect), and this unnecessary flow causes the oxygen concentration in the chamber 101 to be unstable. In addition, the traveling of the transport conveyor 1, that is, the traveling of the holding claws 3 and the transport of the printed wiring board 4, cause the atmosphere in the chamber 101 to be taken out from this portion, which further reduces the flow rate of the N ₂ gas supply. It is an obstacle to things. In particular, when the transport conveyor 1 is provided with an elevation angle in the transport direction (see FIG. 4), the atmosphere flows due to the chimney effect, and the atmosphere in the chamber tends to be taken out.

An object of the present invention is to stabilize the atmosphere (eg, oxygen concentration) in the chamber by suppressing unnecessary atmosphere flow in the space between the two parallel conveyors, and to stabilize high-quality soldering. And maintain it. Another object of the present invention is to reduce the consumption of the inert gas and reduce the running cost in a soldering apparatus for supplying an inert gas into the chamber.

Furthermore, a labyrinth flow path is formed at an arbitrary position on the conveyor, and a labyrinth device capable of freely changing a labyrinth plate interval, a labyrinth plate width, and the like is realized. An object of the present invention is to make it possible to form an optimal labyrinth flow path corresponding to a type of a mounting device or a type of a work to be soldered.

[0028]

The present invention is characterized in that a labyrinth flow path is provided between two parallel conveying conveyors, and the apparatus of the labyrinth flow path is also characterized. .

(1) That is, two parallel conveyors are provided in a chamber, and the conveyor conveys the inside of the chamber while holding both side ends of a plate-like work to be soldered. A soldering apparatus for soldering the plate-like work to be soldered by a soldering process unit provided in a labyrinth plate intersecting the transport direction of the transport conveyor between the two parallel transport conveyors. Is configured to be provided to be bendable.

This makes it possible to suppress unnecessary flow of the atmosphere generated in the two parallel conveyor sections, stabilize the atmosphere in the chamber, and improve the quality of soldering conditions (for example, oxygen concentration). It can be maintained stable. In the case where an inert gas is supplied into the chamber, the supply flow rate of the inert gas can be further suppressed. further,
Since the labyrinth plate is bent, the holding width of the conveyor can be adjusted, and unnecessary atmosphere flow can be attenuated in the bending direction.

(2) In addition, two parallel conveyors are provided, and the both sides of the plate-like work to be soldered are held and conveyed by the conveyor, and are provided on the conveying path of the conveyor. What is claimed is: 1. A soldering apparatus for soldering said plate-shaped work to be soldered by a soldering process unit, comprising: a plurality of engaging portions provided so as to be detachably attachable to said two parallel conveyors; A pair of pedestals, and a plurality of labyrinth plates that are detachably locked to the locking portions of the pedestals. The hinge provided at the end is provided with a labyrinth device provided with a locking portion of a labyrinth plate which is locked to the engaging portion of the pedestal.

This makes it possible to form a labyrinth flow path between the conveyers at an arbitrary position of the soldering apparatus. Further, if a plurality of labyrinth devices are used, a labyrinth flow path can be formed in an arbitrary range.

Further, even when the distance between the two parallel conveyors, that is, the holding width is changed, the labyrinth plate is bent by the hinge, and the labyrinth flow path is maintained between the conveying conveyors for an arbitrary holding width. Can be.

Further, the labyrinth plate can be arbitrarily adjusted by selectively arranging the labyrinth plate at the engaging portion of an arbitrary pedestal, so that the size of the soldering apparatus and the size of the chamber can be adjusted. The labyrinth plate can be arranged at an optimum interval corresponding to the interval between two parallel conveyors, the transport speed, and the like.

Also, if a group of labyrinth plates is prepared and prepared for each of several widths and heights, various shapes of the work to be soldered correspond to the shape of the work to be soldered, especially the height. Thus, the labyrinth plate can be formed by approaching the labyrinth plate to a position very close to the surface of the work to be soldered, and an optimum labyrinth flow path can be formed for each work to be soldered.

[0036]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention can be implemented in the following embodiments. In the present invention,
First, the labyrinth device will be described for easy understanding.

(1) Labyrinth Apparatus FIG. 1 is a perspective view showing a labyrinth apparatus used in the present invention and its mounting mode. FIG. 1 (a) is an assembling view, and FIG. 1 (b) is an example of a high labyrinth plate. FIG. 3C is a diagram illustrating an example in which a detachable hinge is used as a locking portion. FIG. 2 is a perspective view showing a state in which the labyrinth device of FIG. 1 is mounted and installed.

FIG. 1 shows a labyrinth device 11, and FIG.
Of the reference numerals used in FIG. 9A, reference numerals used in FIGS. 9 and 10 indicate the same function.

In FIGS. 1 and 2, a pedestal 5 having a U-shaped cross section, which can be detachably attached to the conveyor frame 2, is a slot having a U-shaped cross section (an engagement portion of the pedestal). 6
Are provided at an interval d, and a pair of the pedestals 5 is attached to the conveyor frame 2 of the conveyor 1.

The pedestal 5 need not necessarily have a U-shaped cross section, and may have any shape as long as it can be detachably attached. Moreover, the structure which latches on the conveyor frame 2 with a thumb screw etc. may be sufficient. In this case, screw holes are provided in the conveyor frame 2 in advance. The pedestal 5 can be easily attached to and detached from the conveyor frame 2 by using the thumb screw. In short, any other configuration may be used as long as it is easily removable.

The distance d between the slots 6 is 10 mm to 30 mm.
The intervals are set at about the same intervals, and the interval of the labyrinth plate 7 described later can be arbitrarily adjusted and set by selecting a slot.

The labyrinth plate 7 is provided with hinges 8 and 9 at its center position and both end portions, and is configured to bend freely. The hinges 9 at both ends are provided with insertion pieces to be inserted into the slots 6 provided in the pedestal 5 to form insertion piece portions (locking portions of the labyrinth plate) 10.

The insert piece 10 is inserted into the slot 6 by press-fitting and locked, and the width of the slot 6 and the thickness of the insert piece 10 are designed to values suitable for press-fitting. Thus, the labyrinth plate 7 can be detachably attached to the pedestal 5, and the labyrinth plate 7 can be inserted into an arbitrary slot 6 to form a labyrinth flow path at an arbitrary interval.

The structure for locking the slot 6 and the insertion piece 10 is not necessarily limited to the structure by press-fitting.
As shown in (c), a detachable hinge using a hinge pipe 6a provided on the pedestal 5 and a hinge pin 10a provided on the labyrinth plate 7b may be used. In short, any structure that can be easily attached and detached may be used.

FIG. 1B shows an example of a labyrinth plate 7a having a high height (H), and the components mounted on the printed wiring board 4 held and conveyed by the holding claws 3 of the conveyor 1 (see FIG. 1B). (Not shown) is used when the height is low. That is, by increasing the height (H) of the labyrinth plate 7 and making it closer to the printed wiring board 4, the effect of the labyrinth flow path can be further enhanced.

(2) Example of Soldering Apparatus-1 FIG. 3 is a side sectional view showing an example of a soldering apparatus equipped with the labyrinth apparatus shown in FIGS. 1 and 2. That is, in this example, a labyrinth device is provided in the conventional soldering device of FIG. 9, and two labyrinth devices shown in FIG. 1 and FIG. This is an example in which the information is provided. The labyrinth plate is actually bent as shown in FIG. 2, but in FIG. 3, the labyrinth plate is shown by a straight plate for easy understanding.

Of the reference numerals used in FIG.
And the reference numerals used in FIG. 10 indicate the same functions.

The soldering process section 106 at the position of the solder bath 107 is a high-temperature portion in which molten solder 110 at a temperature of about 250 ° C. is normally stored in the solder bath 107.
Therefore, heat convection easily occurs in this portion, and this heat convection causes unnecessary flow of the chamber atmosphere.

The soldering process section 106 of the solder bath 107 includes a soldering step in which the printed wiring board (plate-like work to be soldered) 4 conveyed by the conveyor 1 and the jet wave 120 of the molten solder 110 come into contact with each other. It is the most important process section in the above, and it is essential to maintain a stable oxygen concentration by suppressing unnecessary atmosphere flow in this process section in order to perform stable soldering with good quality.

Therefore, by providing the labyrinth device 11 between the conveyors 1 above the solder tank 107, unnecessary atmosphere flow can be further suppressed and a stable oxygen concentration can be maintained, and a more stable high oxygen concentration can be maintained. It is possible to perform quality soldering.

In addition, a labyrinth device 11 may be provided above the preheater 105 in the preheating step 104, and if the labyrinth apparatus 11 is provided, the preheating step 10
4, the unnecessary atmosphere flow can be further suppressed.

(3) Example 2 of Soldering Apparatus FIG. 4 is a view showing an example of a soldering apparatus in which a solder bath portion is covered with an N ₂ gas diffusion chamber. Only the solder bath portion is an N ₂ gas diffusion chamber. Cross-sectional view showing an example of a soldering apparatus configured to cover with and supply N ₂ gas thereto,
FIG. 5 is a sectional view taken along line II of the N ₂ gas diffusion chamber of FIG. In FIG. 4, only the soldering process section is shown.
The preheating step 104 in FIG. 3 is not shown in the drawing. Further, the N ₂ gas supply system shown by the symbol diagram in FIG. 3 is omitted and not shown.

This soldering device is a soldering device in which only the most important soldering process section 106 is covered with the N ₂ gas diffusion chamber 12. N ₂ gas diffusion chamber 12
As shown in FIG. 5, when viewed from above, a diffused blow-off port in which a meandering gas passage is formed by upper and lower flow path forming plates 13a and 13b in a radial mouth casing surrounded by eight side walls 18 as shown in FIG. 14 are arranged in a cross shape, whereby the jet wave 12 in the chamber of the soldering process section 106 is formed.
0 is a soldering device configured to supply N ₂ gas from above. The glass plate 15 is an observation window.

In this soldering device, the labyrinth plate 121 as shown in FIG. Alternatively, filled with N ₂ gas diffusion chamber 12 with N ₂ gas supplied as extruded while spreading at a flow rate of a slow diffusion mouthpiece 14 to the closest position of the jet flow 120, N ₂ gas diffusion This is a soldering device configured to form a low oxygen concentration atmosphere in the chamber 12.

Further, the printed wiring board 4 is transported at the transport elevation angle θ and comes into contact with the jet wave 120 to perform soldering. That is, the soldering is performed by utilizing the pulling-down force of the molten solder at the peel back point.

However, due to the flow of the atmosphere in the N ₂ gas diffusion chamber 12 due to thermal convection, the N ₂ gas diffusion chamber 12
Oxygen concentration in the inside is apt to fluctuate unstable, and soldering quality is apt to change subtly. Further, since the printed wiring board 4 is transported at an elevation angle, the chimney effect of the N ₂ gas diffusion chamber 12 tends to be large.

Therefore, by providing two labyrinth devices 11 shown in FIGS. 1 and 2 in tandem between the conveyors 1, a labyrinth flow path is formed between the conveyors 1 and N.
₍₂ ) Unnecessary flow of the atmosphere in the gas diffusion chamber 12 is largely suppressed, and a stable oxygen concentration can be maintained. In particular, the effect is large in the soldering apparatus of the small-volume N ₂ gas diffusion chamber 12 provided so as to be in close contact with the transport conveyor 1 as described above.

In such a soldering apparatus, it is usual to provide a curtain as a shutter means at the carry-in port 122 and the carry-out port 123, but in the soldering apparatus having the labyrinth device 11 of the present embodiment, this is not the case. The same stable oxygen concentration could be obtained even after removing the goodwill.

[0059] (4) embodiments 6 to the size of the printed wiring board of the labyrinth device is a diagram showing an embodiment of a labyrinth device at the time of varying the holding width of the conveyor, (a) shows the printed wiring width W ₁ FIG. 7B is a diagram illustrating a case where the board is held, and FIG. 7B is a diagram illustrating a case where a printed wiring board having a width W ₂ is held. Note that W ₁ <W
_2, is a view seen from above together conveyor (a) (b).

That is, as shown in FIGS. 6 (a) and 6 (b), when the holding width of the conveyor 1 for conveying the printed wiring board 4 in the direction of arrow A is changed in the direction of arrow B and adjusted, the labyrinth device The degree to which the eleven labyrinth plates 7 are bent in the shape of a "ku" changes, and it is possible to freely respond to a change in the holding width of the conveyor 1. The length of the labyrinth plate 7 is designed to match the maximum holding width of the conveyor.

(5) Mode for Setting the Interval of Labyrinth Board in Labyrinth Apparatus FIG. 7 is a view showing an aspect in which the interval of the labyrinth board is adjusted and selected in the labyrinth apparatus, and is a view of the conveyor as viewed from above. .

That is, in the example of FIG. 7, the insertion piece 10 of the labyrinth plate 7 is press-fitted and inserted into the slot 6 so as to have an interval of every other 2d with respect to the interval d of the slot 6. is there.

The example of FIG. 7 is a case where the interval between the slots 6 is originally large.
By setting it to about 2/3, it is possible to make more detailed settings.

The adjustment of the distance between the labyrinth plates 7 is as follows.
This is performed so that the amount of attenuation of the atmosphere flow in the labyrinth flow path is maximized. Specifically, when the height of the labyrinth plate 7 is high (see FIG. 1B), the interval between the labyrinth plates 7 is also increased. When the labyrinth plate 7 is low and the labyrinth plate 7 is low, the wider the labyrinth plate 7 is, the larger the attenuation is. In addition, even when the transport speed of the transport conveyor 1 is extremely high, the amount of attenuation increases as the labyrinth plates are slightly widened. In addition, the optimum interval between the labyrinth plates 7 varies depending on the magnitude of the transport elevation angle θ of the transport conveyor 1 (see FIG. 4).

(6) Selection of the direction of bending of the labyrinth plate FIG. 8 is a diagram showing a mode in which the direction of bending of the labyrinth plate is adjusted and selected in the labyrinth device, and is a diagram in which the conveyor is viewed from above.

That is, in the example of FIG. 8, the labyrinth plate 7 on the side entering the labyrinth device 11 is bent in a convex shape toward the entry side, and the labyrinth plate 7 on the side exiting the labyrinth device 11 is formed in a convex shape on the exit side. This is an example in which it is bent.

The selection of such a bending direction is determined from the viewpoint of favorably suppressing the unnecessary flow of the atmosphere in the chamber 101 between the conveyors 1. For example, conveyor 1
Of the printed wiring board 4 by the transport conveyor 1
Flows in the transport direction A of the transport conveyor 1. Further, in the example of the soldering apparatus in FIG. 4, the atmosphere between the transport conveyors 1 similarly easily flows in the transport direction A of the transport conveyor 1 due to the chimney effect.

On the other hand, in the bent labyrinth plate 7, the atmosphere also flows in the direction in which the plate surface is bent, and a flow loss occurs in this direction, thereby suppressing unnecessary flow of the atmosphere.

For example, in the example of FIG. 8, the atmosphere flows to both sides of the conveyor 1 on the entry side and to the center side of the conveyor 1 on the exit side as shown by the dotted arrows, causing flow loss. Although the flow of the printed wiring board 4 and the flow of the atmosphere due to the chimney effect are suppressed, the atmosphere that tries to enter the chamber 101 between the conveyors 1 of the labyrinth device 11 from the entrance side is attenuated so as to be eliminated to both sides. Chamber 101 between conveyors 1 of labyrinth device 11
The N ₂ gas (inert gas) that is going out of the chamber 101 from the inside can be attenuated so as to stay at the central position of the chamber 101.

That is, the labyrinth device 1
The oxygen concentration in one chamber 101 can be stably maintained, and a low oxygen concentration can be maintained even if the supply flow rate of the N ₂ gas is small. By the way, the selection example as shown in FIG. 8 is particularly effective in the soldering apparatus of elevation conveyance as shown in FIG.

(7) Labyrinth Apparatus Provided in Reflow Soldering Apparatus In the reflow soldering apparatus, too, if an unnecessary atmosphere flow occurs, the oxygen concentration becomes unstable and the soldering quality is not stable. Further, even in a reflow soldering apparatus that does not use an inert gas, for example, when performing infrared heating, it is possible to further suppress unnecessary flow of the atmosphere of the soldering process unit 106 and stabilize the atmosphere temperature. And stable reflow soldering can be performed.

That is, by installing the labyrinth device 11 as shown in FIGS. 1 and 2 in the reflow soldering device, it becomes possible to perform soldering in a more stable atmosphere and to improve the soldering quality. Will be able to maintain.

[0073]

According to the soldering apparatus of the present invention, two parallel conveyors are provided in the chamber, and the conveyor conveys the inside of the chamber while holding both ends of the plate-like work to be soldered. A soldering apparatus for soldering the plate-shaped work to be soldered by a soldering process unit provided in the chamber, wherein the transport direction of the transport conveyor is between the two parallel transport conveyors. The labyrinth plate that intersects with the bendable is provided so that the flow of the atmosphere in the region between the two parallel conveyors, that is, the region between the two parallel conveyors, can be significantly suppressed, and Unnecessary flow of the atmosphere can be more favorably suppressed.

As a result, stable quality soldering can be performed. Further, in a soldering apparatus for supplying a gas such as an inert gas into the chamber, the consumption of the inert gas can be reduced and the running cost can be reduced.

Further, the soldering apparatus of the present invention is provided with two parallel conveying conveyors, and holds and conveys both side ends of the plate-like work to be soldered by the conveying conveyor, and conveys the conveying conveyor. A soldering device for soldering the plate-like work to be soldered by a soldering process unit provided in a path, the soldering device being provided so as to be detachably attachable to the two parallel conveyors, and A pair of pedestals having a plurality of locking portions, and a plurality of labyrinth plates detachably locked to the locking portions of the pedestals, wherein the labyrinth plates have hinges at a central portion and both side ends. In addition to the above, the hinges provided at the both side end portions are provided with a labyrinth device provided with a locking portion of a labyrinth plate which is locked to the engaging portion of the pedestal. It is possible to facilities Nsu equipment.

Further, the height of the labyrinth plate can be selected according to the shape of the printed wiring board, and the interval and bending direction of the labyrinth plate can be arbitrarily selected. It is possible to select such that the attenuation of the atmosphere flow is maximized.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a labyrinth device used in the present invention and a mounting mode thereof.

FIG. 2 is a perspective view showing a state where the labyrinth device of FIG. 1 is mounted and installed.

FIG. 3 is a side sectional view showing an example of a soldering device equipped with the labyrinth device shown in FIGS. 1 and 2.

FIG. 4 is a diagram illustrating an example of a soldering apparatus in which a portion of a solder bath is covered with an N ₂ gas diffusion chamber.

5 is a diagram showing a II cross section of the N ₂ gas diffusion chamber of FIG. 4;

FIG. 6 is a diagram showing an embodiment of the labyrinth device when the holding width of the conveyor is varied.

FIG. 7 is a diagram showing a mode of adjusting and selecting the interval of the labyrinth plate in the labyrinth device.

FIG. 8 is a diagram showing a mode of adjusting and selecting a bending direction of a labyrinth plate in the labyrinth device.

FIG. 9 is a side sectional view showing an example of a conventional soldering apparatus.

FIG. 10 is a view showing a transfer mechanism of a transfer conveyor used in the soldering apparatus of FIG. 9;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Conveyor 2 Conveyor frame 3 Holding claw 4 Printed wiring board (plate-shaped work to be soldered) 4a Lower surface 5 Pedestal 6 Pedestal locking part (slot or hinge pipe) 7, 7a, 7b Labyrinth plate 8 Hinge (center) 9) Hinge (both ends) 10 Locking part of labyrinth plate (insertion piece or hinge pin) 11 Labyrinth device 12 N ₂ gas diffusion chamber 13 Flow path forming plate 14 Diffusion blow port 15 Glass plate 16 N ₂ gas injection port 18 Side wall

Claims (2)

[Claims] 1. Two parallel conveyors are provided in a chamber, and the conveyor conveys the inside of the chamber while holding both side ends of a plate-like work to be soldered.
A soldering apparatus for performing soldering of the plate-shaped work to be soldered by a soldering process unit provided in the chamber, wherein the two parallel conveying conveyors intersect in a conveying direction of the conveying conveyor. A labyrinth plate that can be bent. 2. A soldering step provided on a transport path of the transport conveyor, wherein two parallel transport conveyors are provided, and the transport conveyor holds and transports both side ends of the plate-like work to be soldered. A soldering device for soldering the plate-like work to be soldered by means of a portion, the soldering device being provided so as to be detachably attachable to the two parallel conveyors and having a plurality of locking portions. A pair of pedestals, and a plurality of labyrinth plates detachably locked to the locking portions of the pedestals, wherein the labyrinth plates are provided with hinges at a central portion and both end portions, and at the both end portions. A soldering device, comprising: a labyrinth device provided with a locking portion of a labyrinth plate locked to the locking portion of the pedestal on the provided hinge.