JPH02137666A - Reflow soldering device and heating method - Google Patents
Reflow soldering device and heating methodInfo
- Publication number
- JPH02137666A JPH02137666A JP29115188A JP29115188A JPH02137666A JP H02137666 A JPH02137666 A JP H02137666A JP 29115188 A JP29115188 A JP 29115188A JP 29115188 A JP29115188 A JP 29115188A JP H02137666 A JPH02137666 A JP H02137666A
- Authority
- JP
- Japan
- Prior art keywords
- section
- preheating
- substrates
- board
- reflow soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims description 12
- 238000010438 heat treatment Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000007664 blowing Methods 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000032258 transport Effects 0.000 claims 2
- 239000006071 cream Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、プリント回路基板（以後基板と略す）を加熱
することにより、電子部品を基板へ半田付けするだめの
リフロー半田付装置及び加熱方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a reflow soldering apparatus and heating method for soldering electronic components to a printed circuit board (hereinafter referred to as the board) by heating the board. It is.
従来の技術
従来のこの種のリフロー半田付装置の全図を第６図に、
基板搬入口の搬送部の概略図を第６図にリフロー半田付
工程のフローチャートを第７図に示す。第６図及び第６
図に示すように、この種のリフロー半田付装置では、基
板は無端チェーン１によって、矢印方向に水平搬送され
、遠赤外線ノ（３−・
ネルヒータ２ａ及び２ｂ、熱風吹出ノズル３を具備した
第１プリヒート部において基板をある一定温度まで昇温
させるため加熱され、さらに熱風ノズル４を具備した第
２プリヒート部において基板をある一定温度で保持する
様子備加熱され、さらに遠赤外線パネルヒータ６ａ及び
５ｂ、熱風吹出ノズ／Ｌ／６を具備したりフロ一部にお
いて半田が溶融された後、冷却装置７によシはんだを固
着させるという方式がとられている。このとき基板の搬
送方式の詳細を以下に示す。第６図イ及び口に示すよう
に、チェーン１は平行かつ同一高さに配設されたガイド
レール８ａ及び８ｂによって直線摺動性を有し、駆動源
９の回転軸に取り付けられたスプロケッ） １０ ａ及
び１０ｂによって回転移動している。なお第６図ハに示
すようにチェーンの片側には、基板１１の端部を保持す
るだめのピン１２が突出しておシ、チェーンの移動に伴
うこれら複数のビンの移動によシその上部に接触して置
かれた基板１１が搬送されるようになっている。Prior Art A complete diagram of this type of conventional reflow soldering equipment is shown in Figure 6.
FIG. 6 is a schematic diagram of the transport section of the substrate loading port, and FIG. 7 is a flowchart of the reflow soldering process. Figures 6 and 6
As shown in the figure, in this type of reflow soldering apparatus, the board is transported horizontally in the direction of the arrow by an endless chain 1, and a first In the preheat section, the substrate is heated to raise the temperature to a certain constant temperature, and in a second preheat section equipped with a hot air nozzle 4, the substrate is heated to maintain the substrate at a certain constant temperature, and further, far infrared panel heaters 6a and 5b, A method is adopted in which a hot air blowing nozzle/L/6 is provided, and after the solder is melted in a part of the flow, the solder is fixed in the cooling device 7.The details of the board conveyance method at this time are as follows. As shown in FIG. It is rotated by sprockets 10a and 10b. As shown in FIG. 6C, there is a protruding pin 12 on one side of the chain that holds the end of the board 11, and when the plurality of bottles are moved as the chain moves, the pin 12 is attached to the top of the pin. The substrates 11 placed in contact with each other are conveyed.
発明が解決しようとする課題
しかし、この種の機構をもつリフロー半田付装置は、基
板の予備加熱のための領域として、遠赤外線パネルヒー
タ２ａ及び２ｂ、熱風吹出ノズル３を有し、ある一定温
度まで昇温させる役目をもつ第１プリヒート部と、熱風
吹出ノズル３を有し、その一定温度を保持させる役目を
もつ第２プリヒート部の２つの領域があり、これらは基
板サイズが大きくなるとその領域を長くとる必要があシ
、従って装置全体としても長くしなければならない。Problems to be Solved by the Invention However, the reflow soldering apparatus with this type of mechanism has far-infrared panel heaters 2a and 2b and a hot air blowing nozzle 3 as an area for preheating the board, and has a temperature of a certain level. There are two regions: a first preheating section that has the role of raising the temperature to a certain temperature, and a second preheating section that has a hot air blowing nozzle 3 and has the role of maintaining a constant temperature. It is necessary to make it long, and therefore the device as a whole must also be made long.
装置の全長が長くなることは、生産ラインにおける設置
上好ましくない。また基板の搬送速度はチェーン１の速
度に依存してお沙、第１プリヒート部、第２プリヒート
部、リフロー部及び冷却部の各々において変えることが
できないため、基板の種類及び部品の実装密度等に対す
るリフロー半田付の条件設定の対応が困難なことがある
。An increase in the overall length of the device is undesirable for installation in a production line. Also, since the board conveyance speed depends on the speed of the chain 1 and cannot be changed in each of the sand, first preheat section, second preheat section, reflow section, and cooling section, the board type, component mounting density, etc. It is sometimes difficult to set conditions for reflow soldering.
課題を解決するための手段
そして上記問題点を解決する本発明の技術的手段は、基
板を予備加熱する第１プリヒート部及び第２プリヒート
部を垂直搬送部を有する１つの領５１＼−７
域とし、基板を垂直方向に移動させる際に予備加熱し、
垂直搬送部の最上部に基板が位置した時水平搬送されリ
フロー部において半田付される様な機構にすることであ
る。さらに、半田付後の冷却部においても、プリヒート
部と同一の機構にすることができる。Means for solving the problem and the technical means of the present invention for solving the above-mentioned problems are such that the first preheating section and the second preheating section for preheating the substrate are integrated into one region 51\-7 having a vertical conveyance section. The substrate is preheated when it is moved vertically,
The purpose is to create a mechanism in which when the board is located at the top of the vertical transport section, it is horizontally transported and soldered in the reflow section. Furthermore, the cooling section after soldering can have the same mechanism as the preheating section.
またプリヒート部の垂直搬送部において、基板が上昇し
ていく際、基板面に対して熱風を基板両端部よシ交互に
吹き付ける様にする。Further, in the vertical conveyance section of the preheating section, when the substrate is raised, hot air is blown onto the substrate surface alternately from both ends of the substrate.
作 用 この技術的手段による作用は、次のようになる。For production The effect of this technical means is as follows.
すなわち、第１プリヒート部と第２プリヒート部を垂直
搬送部を有する１つの領域にすることによシ装置の長さ
を短くすることができ、冷却部もプリヒート部と同様な
機構にすることによシ、さらに装置の長さを短くするこ
とができる。そして、プリヒート部の垂直搬送部、リフ
ロー部の水平搬送部及び冷却部の垂直搬送部が各々独立
であるため、その搬送速度をかえることにより、各領域
におけるリフロー半田付条件の設定を任意に変える６
′＼−／
ことができる。That is, the length of the apparatus can be shortened by making the first preheating section and the second preheating section into one area having a vertical conveying section, and the cooling section can also have the same mechanism as the preheating section. Additionally, the length of the device can be further reduced. Since the vertical conveyance section of the preheating section, the horizontal conveyance section of the reflow section, and the vertical conveyance section of the cooling section are each independent, by changing the conveyance speed, the settings of reflow soldering conditions in each area can be arbitrarily changed. 6
′\−／ It is possible.
また、プリヒート部の垂直搬送部において、基板面に対
して熱風を交互に吹きつけることにより、基板内の温度
ばらつきを低減させることができる。Further, by alternately blowing hot air onto the substrate surface in the vertical conveyance section of the preheating section, temperature variations within the substrate can be reduced.
実施例
以下、本発明の実施例を図にもとづいて説明する。第１
図は全体図、第２図は第１図を矢視Ａよりみたプリヒー
ト部の垂直搬送部の側面図、第３図はリフロー半田付工
程のフローチャートである。Embodiments Hereinafter, embodiments of the present invention will be explained based on the drawings. 1st
The figure is an overall view, FIG. 2 is a side view of the vertical conveyance section of the preheat section as viewed from arrow A in FIG. 1, and FIG. 3 is a flow chart of the reflow soldering process.
第１図及び第２図に示すように矢印方向よシ搬入された
基板１３は、チェーン１４ａ及び１５ａに取り付けられ
た基板受け１６ａ及び対称位置に取シ付けられた基板受
け１６ｂに基板端部を支えられ、上昇移動していく。な
おチェーン１４及び１５の駆動は、駆動源１７ａ及び１
７ｂよりベルト１８ａ及び１８ｂを介して与えられてい
る。基板１３は、上昇移動していく際に熱風装置１９ａ
及び１９ｂにより予備加熱され最上部に位置した後、ガ
イドレール２ｏに沿って摺動するフッシャ２１によって
、遠赤外線パネルヒータ２２及び２３、熱風吹出ノズル
２４を具備したりフロ一部において半田付けされる。な
おプッシャー２１は、スプロケッ）２５ａ及び２６ｂの
間にかけられたチェーン２６に固定され、駆動はスプロ
ケット２５ａが取り付けられている駆動源２７より与え
られる。As shown in FIGS. 1 and 2, the board 13 is carried in in the direction of the arrow, and the ends of the board are placed in the board holders 16a attached to the chains 14a and 15a and the board holders 16b attached at symmetrical positions. It is supported and moves upward. The chains 14 and 15 are driven by drive sources 17a and 1.
7b via belts 18a and 18b. When the substrate 13 moves upward, the hot air device 19a
After being preheated and positioned at the top by 19b and 19b, far-infrared panel heaters 22 and 23 and hot air blowing nozzles 24 are installed and soldered in a part of the flow by means of a hooker 21 that slides along the guide rail 2o. . The pusher 21 is fixed to a chain 26 that is placed between sprockets 25a and 26b, and is driven by a drive source 27 to which the sprocket 25a is attached.
基板は半田付けされた後、プリヒート部と同様の構造を
もつ垂直搬送方式の冷却部において、冷却装置２８によ
シ冷却される。そして、基板が垂直搬送部の最下部にき
たとき、エアシリンダー２９の先端に取シ付けられたプ
ッシャー３０によシ搬出される。After the board is soldered, it is cooled by a cooling device 28 in a vertical conveyance type cooling section having the same structure as the preheating section. When the substrate reaches the bottom of the vertical transport section, it is carried out by a pusher 30 attached to the tip of the air cylinder 29.
次にプリヒート部における熱風吹付けによる加熱方法に
ついて記す。第４図に示すように垂直搬送部において、
熱風装置１９ａ及び１９ｂを３つの部分に分け、熱風装
置１９ａにおいては下部より給気、排気、給気とし、熱
風装置１９ｂにおいては下部よシ排気、給気、排気とす
る。この方式によシ基板は上昇移動しながら基板両端部
よシ交互に熱風を吹きつけられることになる。Next, a heating method using hot air blowing in the preheating section will be described. As shown in Fig. 4, in the vertical conveyance section,
The hot-air devices 19a and 19b are divided into three parts; in the hot-air device 19a, air is supplied, exhausted, and supplied from the bottom, and in the hot-air device 19b, air is exhausted, supplied, and exhausted from the bottom. In this method, hot air is alternately blown onto both ends of the substrate as it moves upward.
発明の効果
以上、本発明は、基板を予備加熱するためのプリヒート
部または冷却部を垂直搬送方式とすることによシ装置の
長さを短くすることができ、また同時に、プリヒート部
、リフロー部、冷却部が独立した搬送系であるため、リ
フロー半田付条件の設定を任意に変えることができ、よ
シ品質の高い半田付けを行うことが可能となる。In addition to the effects of the invention, the present invention makes it possible to shorten the length of the apparatus by using a vertical conveyance system for the preheating section or cooling section for preheating the substrate, and at the same time, the length of the preheating section or reflow section Since the cooling section is an independent conveyance system, the settings of reflow soldering conditions can be changed arbitrarily, making it possible to perform high-quality soldering.
また、プリヒート部においては、基板両端部よシ交互に
熱風を吹きつけることによシ予備加熱における基板内の
温度ばらつきを低減させることができる。In addition, in the preheating section, temperature variations within the substrate during preheating can be reduced by blowing hot air alternately from both ends of the substrate.
第１図は本発明の一実施例におけるリフロー半田付装置
の正面図、第２図は第１図において矢視Ａより見たプリ
ヒート部垂直搬送部の側面図、第３図はリフロー半田付
工程のフローチャート図、第４図はプリヒート部の正面
図、第５図は従来のリフロー半田付装置の正面図、第６
図イは同搬送部の正面図、第６図口は同側面図、第６図
ハは同士９ ＼−７
面図、第７図はリフロー半田付工程のフローチャート図
である。
１．１４，１６．２６・・・・・・チェーン、２，５゜
２２．２３・・・・・・遠赤外線パネルヒータ、３，４
゜６．２４・・・・・・熱風吹出ノズル、７，２８・・
・・・・冷却装置、８，２ｏ・・・・・・ガイドレール
、９ 、１７ 、２７・・・・・・駆動源、１０．２５
・・・・・・スプロケット、１１゜１３・・・・・・基
板、１２・・・・・・ビン、１６・・・・・・基板受け
、１８・・・・・・ベルト、１９・・・・・・熱風装置
、２１．３０・・・・・・プッシャー、２９・・・・・
・エアシリンター代理人の氏名 弁理士 粟 野 重
孝 ほか１名トーチＩ
′！ルーｒＬ
勧５Ｘ
ｊｈ、１０ｂ−ｍ−２７’０力沫
■
第
図Fig. 1 is a front view of a reflow soldering apparatus according to an embodiment of the present invention, Fig. 2 is a side view of the preheat section vertical conveyance section seen from arrow A in Fig. 1, and Fig. 3 is a reflow soldering process. Fig. 4 is a front view of the preheating section, Fig. 5 is a front view of a conventional reflow soldering device, and Fig. 6 is a front view of a conventional reflow soldering device.
Figure A is a front view of the conveyance section, Figure 6 is a side view of the same, Figure 6C is a 9\-7 side view, and Figure 7 is a flow chart of the reflow soldering process. 1.14, 16.26... Chain, 2.5° 22.23... Far infrared panel heater, 3,4
゜6.24...Hot air blowing nozzle, 7,28...
...Cooling device, 8,2o...Guide rail, 9, 17, 27...Drive source, 10.25
...Sprocket, 11゜13 ... Board, 12 ... Bin, 16 ... Board holder, 18 ... Belt, 19 ... ... Hot air device, 21.30 ... Pusher, 29 ...
・Name of Air Cylinder agent: Patent attorney Shige Awano
Takashi and 1 other person Torch I'! Rou rL 5X jh, 10b-m-27'0 力沫■ Fig.
Claims (5)
搬送し、この基板をリフローする装置であって、基板を
複数有し、予備加熱するプリヒート部と、予備加熱され
た基板を前記基台に対して水平方向に移動させる水平搬
送部と、前記基板のはんだ付けを行うリフロー部とから
成り、プリヒート部は、基板を垂直方向に複数設け、か
つこの基板を垂直方向に搬送可能な垂直搬送部を有した
ことを特徴とするリフローはんだ付装置。(1) An apparatus that transports a board on which electronic components are mounted on cream solder and reflows this board, which has a plurality of boards, a preheating section for preheating, and a base for transferring the preheated board to the base. The preheating section consists of a horizontal transport section that moves the board in the horizontal direction, and a reflow section that solders the boards. A reflow soldering device characterized by having a part.
記水平搬送部において行われる特許請求の範囲第１項記
載のリフローはんだ付装置。(2) The reflow soldering apparatus according to claim 1, wherein cooling of the board after being carried out of the reflow section is performed in the horizontal transfer section.
直搬送部を有する特許請求の範囲第２項記載のリフロー
はんだ付装置。(3) The reflow soldering apparatus according to claim 2, wherein the cooling section for the board after being carried out of the reflow section has a vertical conveyance section.
間隔が一定ピッチの整数倍である搬送方式を有する特許
請求の範囲第１項記載のリフローはんだ付装置。(4) The reflow soldering apparatus according to claim 1, wherein the vertical transfer section of the preheating section has a transfer method in which the substrate transfer interval is an integral multiple of a constant pitch.
垂直方向に並べ該基板を熱風を用いて加熱する際、基板
面の両端部より交互に熱風を吹きつけることを特徴とす
る加熱方法。(5) Heating characterized by blowing hot air alternately from both ends of the substrate surface when one or more substrates on which electronic components are mounted are arranged vertically and heated using hot air. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63291151A JP2682085B2 (en) | 1988-11-17 | 1988-11-17 | Reflow soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63291151A JP2682085B2 (en) | 1988-11-17 | 1988-11-17 | Reflow soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02137666A true JPH02137666A (en) | 1990-05-25 |
| JP2682085B2 JP2682085B2 (en) | 1997-11-26 |
Family
ID=17765105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63291151A Expired - Lifetime JP2682085B2 (en) | 1988-11-17 | 1988-11-17 | Reflow soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2682085B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010067881A (en) * | 2008-09-12 | 2010-03-25 | Jatco Ltd | Reflow equipment |
| CN102689071A (en) * | 2012-06-18 | 2012-09-26 | 日东电子科技(深圳)有限公司 | Reflow soldering equipment |
| CN108380999A (en) * | 2018-05-18 | 2018-08-10 | 深圳市宏佳鑫自动化设备有限公司 | A kind of bonding machine and welding method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63278668A (en) * | 1987-05-11 | 1988-11-16 | Eiteitsuku Tekutoron Kk | Reflow soldering device |
| JPS63278667A (en) * | 1987-05-11 | 1988-11-16 | Matsushita Electric Ind Co Ltd | Base plate heating device |
| JPH0215872A (en) * | 1988-06-30 | 1990-01-19 | Matsushita Electric Ind Co Ltd | Soldering device |
-
1988
- 1988-11-17 JP JP63291151A patent/JP2682085B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63278668A (en) * | 1987-05-11 | 1988-11-16 | Eiteitsuku Tekutoron Kk | Reflow soldering device |
| JPS63278667A (en) * | 1987-05-11 | 1988-11-16 | Matsushita Electric Ind Co Ltd | Base plate heating device |
| JPH0215872A (en) * | 1988-06-30 | 1990-01-19 | Matsushita Electric Ind Co Ltd | Soldering device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010067881A (en) * | 2008-09-12 | 2010-03-25 | Jatco Ltd | Reflow equipment |
| CN102689071A (en) * | 2012-06-18 | 2012-09-26 | 日东电子科技(深圳)有限公司 | Reflow soldering equipment |
| CN108380999A (en) * | 2018-05-18 | 2018-08-10 | 深圳市宏佳鑫自动化设备有限公司 | A kind of bonding machine and welding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2682085B2 (en) | 1997-11-26 |
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