JPH09237967A - Conveying method and equipment of board in reflow automatic soldering equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent warping of a board and improve soldering quality, by linking one end of a carrier with an endless roll suspension transmission member, arranging guide members on the other end, making a guide rail guide the members, and making the carrier ascend and descend horizontally and run in parallel circulation. SOLUTION: A part of a carrier 4 is linked with an endless roll suspension transmission member 3 (chain conveyer 13L), and a part of the other end of the carrier 4 is linked with an endless roll suspension transmission member 3 (chain conveyer 13R). Guide members (rollers 69) are arranged in other parts of the carrier 4. In accordance with the running of the transmission member 3, the carrier 4 is subjected to parallel circulation running. The carrier 4 is made to ascend from below a carried-in board, which is mounted on the carrier 4 and conveyed in a heating chamber. After soldering, the carrier 4 is made to descend, and the board is separated from the carrier 4. Only the carrier 4 is sent back to a carrying-in station 27 from a sensing-back route and subjected to circulation running.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for transferring a board (a "printed wiring board" is simply referred to as a "board" in this specification) in an automatic reflow soldering apparatus, and more particularly to a carrier for mounting the board. One end of is connected to an endless winding transmission member that circulates, and a guide member is arranged at the other end, and the guide member is guided by a guide rail as the endless winding transmission member travels so that the carrier is leveled. It is possible to raise and lower in a state, and to make it possible for multiple carriers to run in parallel circulation by a device much simpler than the elevator device, and to mount the substrates one after another on the warp prevention support arranged on the carriers. Reflow automatic soldering, which is transported to a heating chamber to prevent warpage of the board to a minimum and to obtain good soldering performance, resulting in a significant cost reduction. Only about transport method and device for the substrate in the apparatus.

[0002]

2. Description of the Related Art A reflow automatic soldering apparatus mounts electronic parts on a board, applies paste cream solder to a pad, which is a soldering point, and supplies the paste. A device that preheats and gradually raises the temperature, and in the final stage heats up to the soldering temperature with a soldering heater in a short time to melt the cream solder and solder electronic components to pads (printed circuit terminals) on the board. Is.

In a conventional automatic reflow soldering apparatus, both end portions of a board are carried on a chain conveyor or the like, and therefore, the central portion of the board which is not supported is the weight of the board and the mounted electronic equipment. There is a tendency to warp downward due to the weight of the parts, and this warpage is particularly noticeable in thin plates and large-sized boards, and the soldering is completed with the leads of the electronic parts not soldered or the board is warped. The remaining part is soldered while the leads of the mounted electronic parts are being subjected to an unreasonable force, which is one of the factors that deteriorate the reliability of soldering.

Therefore, as disclosed in Japanese Patent Laid-Open No. 55732/1993, a substrate is mounted on a carrier having a warp prevention pin mounted thereon in order to prevent the warp, and the lower surface of the substrate is supported by the warp prevention pin. However, the one in which all the steps of soldering are conveyed and soldered is proposed by the applicant of the present application and put to practical use.

That is, a plurality of carriers having a plurality of warp prevention pins mounted thereon are prepared, a substrate is placed on the warp prevention pins of the carrier, and the substrate is warped by translational circulation by a transfer device. The carrier device stacks and solders the substrate, and the carrier that has moved to the carry-out station is carried out from the carry-out port and then separated from the board by the carrier lowering device. The board is transported downward, loaded on the return conveyor, and further raised from the bottom of the board waiting at a predetermined position by the carrier lifting device, loaded on the warpage prevention pin and transported again to the heating chamber for soldering. It was like this.

However, in order to lower and raise the carrier by the transfer device, a dedicated carrier lowering device and carrier raising device, a so-called elevator device, are required, which causes a problem that the manufacturing cost is considerably high.

Further, since the carrier lowering device and the carrier raising device are complicated and the number of parts is large, the possibility of failure of each part is great, the necessity of regular maintenance is not only great, but also the substrate in the reflow automatic soldering device is large. However, there was a problem that the transport device of the above became large.

[0008]

SUMMARY OF THE INVENTION The present invention has been made to eliminate the above-mentioned problems of the prior art. The object of the present invention is to circulate the respective parts on the left and right sides of the carrier in the traveling direction. And a pair of endless winding transmission members that are respectively connected to each other, and guide members arranged in other portions of the carrier can run along the guide rails, and at the same time, the endless winding transmission members that rise and run at the carry-in station. By disposing the ascending guide rail in parallel with the end guide and the descending guide rail in parallel with the endless winding transmission member that descends and travels at the unloading station, the carrier is guided along with the travel of the endless winding transmission member. Run along the ascending guide rail and descending guide rail, and use a simple mechanism without using a dedicated carrier elevating device and carrier descending device. So can be raised and lowered, it is to achieve a substantial simplification of the structure of the reflow automatic soldering apparatus.

Another object of the present invention is to make it possible for the carrier to be translated and circulated by a simple mechanism without the need for a carrier transfer device between the respective carrier devices by the above-mentioned structure, and to prevent a failure. It is an object of the present invention to provide a substrate transfer device in a reflow automatic soldering device with a very small amount at a very low cost as compared with a conventional product.

Still another object is to connect the respective parts on the left and right sides in the traveling direction of the carrier having a plurality of warp prevention supports mounted on the upper surface thereof to a pair of endless winding transmission members, respectively, and dispose them on the other parts. The guide member is configured to run along the guide rail, and each part of the carrier is supported by a pair of endless winding transmission members that are lifted, and the other part is supported and lifted by a lift guide rail. This makes it possible to raise the carrier in a horizontal state, and by this, the warp prevention support is brought into contact with the lower surface of the substrate waiting at a predetermined position, and the substrate is placed on the warp prevention support. It is to be loaded and transported to a heating chamber so that it can be soldered. This also makes it possible to minimize the warpage of the board due to heating, gravity, blowing hot air, etc. It is when.

Still another object is to allow a guide member to pass through at a desired position of a connecting portion of each guide rail so as to allow the guide member to pass therethrough, and to constitute a part of the guide rail when traveling in another direction. By providing the swing guide, the gap between the guide rails is connected by the swing guide so that the carrier can be smoothly circulated along the swing guide.

[0012]

In summary, according to the method of the present invention (claim 1), the substrate in an automatic reflow soldering apparatus for melting and soldering the cream solder by heating while carrying the substrate on which the electronic component is mounted is used. In the transfer method, a part of the carrier is connected to one of the pair of endless winding transmission members that travels while circulating in the heating chamber and the return path of the carrier and the traveling direction of the carrier. A guide that connects the other part on the left and right opposite sides to the other endless winding transmission member and travels along a pair of guide rails arranged on the left and right sides in the travel direction of the carrier in the other part of the carrier. Members are respectively arranged, the carriers are caused to travel in a translational circulation with the traveling of the endless winding transmission member, and the carriers are carried from below the substrate loaded at the loading station. The substrate is mounted on the carrier by raising the carrier, the carrier is conveyed into the heating chamber together with the substrate for soldering, and then the carrier is lowered at the carry-out station to separate the carrier from the substrate. Then, only the carrier is returned from the return path to the carry-in station, circulates, and the substrates are successively mounted on the carrier and conveyed. The method of the present invention (Claim 2) is a method of carrying a board in a reflow automatic soldering device, which heats a board on which an electronic component is mounted while heating the board to melt and solder the cream solder. The endless winding transmission member is connected to an endless winding transmission member that circulates through the chamber and the return path of the carrier, and a guide member that runs along a guide rail is disposed at the other end of the carrier. As the carrier travels, the carrier is circulated and circulated, and the carrier is lifted from below the substrate loaded in the loading station to mount the substrate on the carrier, and the carrier is placed in the heating chamber together with the substrate. And soldering, and then lowering the carrier at the carry-out station to separate the carrier from the substrate, Yaria only is characterized in that the conveying and mounting the substrate on a circular travel is allowed sequentially the carrier and back to the receiving station from said return path.

Further, the method of the present invention (claim 3) is a method of carrying a substrate in a reflow automatic soldering apparatus, wherein a substrate on which an electronic component is mounted is heated while being heated to melt and solder the cream solder. , A heating chamber, a lowering device for the carrier, and one end of the carrier is connected to an endless winding transmission member that circulates in a return path of the carrier, and an ascending guide rail, a conveying guide rail, a descending guide rail, and a returning guide. A guide member that sequentially travels along a rail is disposed at the other end of the carrier, the carrier is translated and circulated while the endless winding transmission member travels, and the lower surface of the substrate is supported. A plurality of warp prevention supports for preventing the warp of the substrate are attached to the carrier and run together with the carrier, so that the carrier is placed at the carry-in station. The carrier is lifted from below the carried-in board to mount the board on the warp prevention support, the carrier is carried into the heating chamber together with the board and soldered, and then the carrier is carried out at the carry-out station. The carrier and the substrate are separated by lowering, and only the carrier is returned to the carry-in station from the return path and circulated.
The board is mounted on the warp prevention support of the carrier one after another, and is conveyed and soldered while preventing the board from warping.

The device of the present invention (claim 4) is a driving device for a substrate carrying device in a reflow automatic soldering device for heating a substrate on which an electronic component is mounted while heating to melt and solder the cream solder. A pair of endless winding transmission members that are driven by the vehicle and circulate through the heating chamber and the return path, and a part of the endless winding transmission members is connected to one of the pair of endless winding transmission members. The other part on the left and right sides in the traveling direction is connected to the other endless winding transmission member, and the guide member disposed on the other part is provided along the pair of guide rails disposed on the left and right sides in the traveling direction. A plurality of carriers each of which travels and carries the substrate and travels together with the endless winding transmission member; and an endless winding transmission member that is disposed at a loading station of the substrate to move up while traveling. A carrier lifting device, which is arranged parallel to the traveling direction of the winding transmission member and includes a lifting guide rail that guides the guide member and lifts the carrier in a horizontal state, and the endless device that is arranged at the substrate unloading station. A carrier lowering device including a lowering guide rail for lowering and moving the winding transmission member and arranged parallel to the traveling direction of the endless winding transmission member for guiding the guide member to lower the carrier in a horizontal state. And carrying the substrate on the carrier rising from the carrier lifting device and carrying it to the heating chamber for soldering, and then lowering only the carrier and returning it to the carry-in station by the returning path. It is characterized by being configured in. The device of the present invention (claim 5)
Is a substrate transfer device in a reflow automatic soldering device that heats and melts and solders a cream solder while carrying a substrate on which electronic components are mounted, and is driven by a drive device to circulate in a heating chamber and a return path. An endless winding transmission member that travels and a guide member that has one end connected to the endless winding transmission member and that is disposed at the other end travels along a guide rail and mounts the substrate. A plurality of carriers that run together with the carrier, and the endless winding transmission member that is disposed at the substrate loading station is moved obliquely upward to travel, and the guides that are arranged parallel to the traveling direction of the endless winding transmission member. A carrier raising device including a raising guide rail that guides a member to raise the carrier in a horizontal state, and a carrier raising device that is disposed in the substrate unloading station. From a descending guide rail for moving the endless winding transmission member diagonally downward and for traveling, and for guiding the guide member to lower the carrier in a horizontal state by being arranged in parallel with the traveling direction of the endless winding transmission member. A carrier lowering device, the substrate is mounted on the carrier rising from the carrier lifting device, conveyed to the heating chamber and soldered, and then only the carrier is lowered to the carry-in station by the return path. It is characterized in that it is configured to be returned to.

Further, the device of the present invention (claim 6) is a driving device for a substrate carrying device in a reflow automatic soldering device for heating a substrate on which an electronic component is mounted while heating to melt and solder the cream solder. Driven by the endless winding transmission member that circulates through the heating chamber and the return path, and a guide member that is connected to the endless winding transmission member and that is disposed at the other end travels along the guide rail. A plurality of carriers mounted with the substrate and traveling together with the endless winding transmission member, and an endless winding transmission member disposed at a loading station for the substrate to move the endless winding transmission member upwardly and diagonally. A carrier lifting device that is arranged parallel to the traveling direction of the member and that lifts the carrier in a horizontal state by guiding the guide member. The endless winding transmission member is disposed at the substrate unloading station and is moved obliquely downward to travel, and is disposed parallel to the traveling direction of the endless winding transmission member to guide the guide member to move the carrier. A carrier lowering device that includes a lowering guide rail that lowers in a horizontal state, and a plurality of warp prevention supports that support the lower surface of the substrate mounted on the carrier and prevent the substrate from warping, The substrates are sequentially mounted on the warp prevention support of the carrier that is circulated and transported, and the substrates are transported to the heating chamber and soldered.

Further, the device of the present invention (claim 7) is a driving device for a substrate carrying device in a reflow automatic soldering device for heating a substrate on which an electronic component is mounted while heating to melt and solder the cream solder. Driven by the endless winding transmission member that circulates through the heating chamber and the return path, and a guide member that is connected to the endless winding transmission member and that is disposed at the other end travels along the guide rail. A plurality of carriers mounted with the substrate and traveling together with the endless winding transmission member, and an endless winding transmission member disposed at a loading station for the substrate to move the endless winding transmission member upwardly and diagonally. An ascending guide rail arranged parallel to the traveling direction of the member to guide the guide member and ascend the carrier in a horizontal state, and a lower end of the ascending guide rail. A carrier lifting device including a swing guide that is disposed so as to be rotatable only in one direction, allows the guide member to pass in one direction, and acts as a part of a lifting guide rail when traveling in the other direction. And an endless winding transmission member that is disposed in the substrate unloading station and is moved obliquely downward to travel, and is disposed in parallel with the traveling direction of the endless winding transmission member to guide the guide member. A carrier lowering device including a lowering guide rail that lowers the carrier in a horizontal state, and a plurality of warp prevention supports that support the lower surface of the substrate mounted on the carrier and prevent the substrate from warping. It is configured such that the substrates that are carried in are circulated and carried one after another on the warp prevention support of the carrier, and are carried into the heating chamber and soldered. And it is characterized in and.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on an embodiment shown in the drawings. First, a first embodiment of the present invention shown in FIGS. 1 to 15 will be described. The substrate transfer device 2 in the reflow automatic soldering device 1 according to the present invention is shown in FIG.
5 to FIG. 5, the endless winding transmission member 3 and the carrier 4
1, a carrier raising device 5, a carrier lowering device 6, and a warp prevention support 8.

1 to 5, the endless winding transmission member 3 is specifically constituted by a pair of chain conveyors 13, and a part of the transfer device 2 is provided together with the substrate loading device 9 and the substrate unloading device 10. A pair of chain conveyors 13 are provided to convey a carrier 4 on which a board 12 having electronic components 11 is mounted, and a pair of chain conveyors 13 are provided on a plurality of sprockets 14 (14A, 14B, 14C) and a drive sprocket 16, respectively. As shown in FIG. 5, a chain 22 is wound around the sprocket 19 fixed to the rotary shaft 18 to which the drive sprocket 16 is fixed and the sprocket 21 fixed to the intermediate shaft 20. , The sprocket 23 fixed to the intermediate shaft 20 and the motor 15
A chain 25 is wound around the sprocket 24 and the drive sprocket 16 is rotated by rotating the motor 15 to move the pair of chain conveyors 13 to the heating chamber 18, the carrier lowering device 6, and the return path 37.
And the carrier raising device 5 is sequentially circulated.

In FIG. 4, the chain conveyor 13 of the carrier elevating device 5 which rises from the return path 37 and ascends diagonally upward has a sprocket 14 at the upper and lower ends.
The chain conveyor 13 is wound around A and 14B and travels obliquely upward. Particularly, at the lower end, an idler 17 is arranged above the sprocket 14B.
Is bent in a direction opposite to the winding direction of the sprocket 14B, and is temporarily wound back in the direction of the return path 37.

A transport guide rail 72 and a return guide rail 81 are disposed in the heating chamber 18 and in the return path 37 in parallel with the chain conveyor 13, and guide the rollers 69 of the carrier 4 which will be described later to guide the carrier 4 therein. Is designed to run smoothly in a horizontal state.

The substrate carry-in device 9 includes a carry-in station 27.
And is used to carry in the substrate 12 carried into the carry-in port 26a formed in the main body cover 26 of the automatic reflow soldering apparatus 1 and to deliver it to the carrier 4. In FIG. 8, it is composed of a substrate carry-in conveyor 28 and a substrate pressing device 29.

The substrate carry-in conveyor 28 is a rope conveyor 31 wound around a plurality of guide rollers 30 and a drive pulley 33. The substrate carry-in conveyor 28 is driven by a motor 32 to travel in the direction of arrow A and is loaded on the rope conveyor 31. The substrate 12 is conveyed in the direction of arrow B.

The substrate pressing device 29 includes a rope conveyor 31.
The substrate 12 conveyed by is pressed in the direction of the arrow C to be positioned on the L-shaped substrate holding plate 85 arranged above the carrier lifting device 5, and is movable in the air cylinder 34. The movable table 40 is attracted by the magnetic force of a magnet piston (not shown) incorporated in the magnetic disk, and moves with the movement of the magnetic piston.

A push lever 42 is provided on the movable table 40 so as to be swingable about a piston 41, and a tension spring 43 is provided between the push lever 42 and the movable table 40 so that the push lever 42 is movable. 42 is always biased in the direction of arrow E.

The movable base 40 has an adjustable stopper screw 44
Are screwed together, and the stop position of the pressing lever 42 is set to the substrate 12
It can be adjusted so that it is in the optimum position for pressing.

In addition, the reflow automatic soldering device 1 includes
When the pin 45 is fixed and the movable table 40 is in the standby position, the pin 45 presses the pressing lever 42 to cause the spring 4 to move.
The pressing lever 42 is rotated to the position shown by the solid line in FIG.
When 2 is inserted, interference between the substrate 12 and the pressing lever 42 is prevented so as not to hinder the carrying-in.

The substrate unloading device 10 includes an unloading station 4
6, which is disposed on the substrate 6 and is separated from the carrier 4.
To carry out from the carry-out port 26b formed in the main body cover 26 of the automatic reflow soldering device 1, and in FIG. 7, FIG. 11 and FIG. It consists of

Like the substrate carry-in conveyor 28, the substrate carry-out conveyor 48 is a rope conveyor 52 which is wound around a plurality of guide rollers 50 and a drive pulley 51.
The substrate 12 stacked on the substrate 2 is conveyed in the direction of the arrow H and carried out from the carry-out port 26b.

The board pushing-out device 49 has completed the soldering, and has carried the board 12 above the carrier lowering device 6.
7 for pressing and delivering to the substrate unloading conveyor 48. In FIG. 7, the moving base 55 is attracted by the magnetic force of a magnet piston (not shown) movably incorporated in the air cylinder 54. The magnet piston moves along with the movement of the magnet piston.

A push lever 58 is provided on the movable base 55 so as to be swingable about the pin 56, and a tension spring 59 is provided between the push lever 58 and the movable base 55 to constantly push the push lever 58. It is urged to lower the tip of the.

An air cylinder 61, in which a pressing pin 60 can be retracted by supplying compressed air, is fixed to the moving base 55, and the substrate 12 is moved below the pressing lever 58 as the chain conveyor 13 travels. Compressed air is supplied to the air cylinder 61 only during the passage so that the pressing pin 60 is projected, and the pressing lever 58 is rotated clockwise from the position indicated by the solid line to the position indicated by the broken line to permit passage of the substrate 12. , Is not an obstacle.

The width of the pair of rope conveyors 31 and 52 can be adjusted by rotating a motor (not shown) according to the width of the substrate 12 to be conveyed.

The heating chamber 18 is shown in FIG. 1 and FIG.
Pre-heating chamber PH1, PH2, reflow soldering chamber RF,
It is divided into a slow cooling chamber CL and each preheating chamber PH.
1, PH2, the reflow soldering chamber RF, and the slow cooling chamber CL have substantially the same structure with different internal temperatures, and the interior of each chamber is filled with an inert gas such as nitrogen gas.

In the preheating chambers PH1 and PH2, the reflow soldering chamber RF, and the slow cooling chamber CL, a heating device 61 having a large number of holes 61a is provided above and below the chain conveyor 13, and further heating is performed. A blower 62 such as a sirocco fan is provided above and below the device 61, respectively, and the nitrogen gas filled in the heating chamber 18 is heated by the heating device 61 by being rotated by the motor 63 and sprayed onto the substrate 12. Substrate 12
The electronic component 11 is soldered to the.

2 and 3, the carrier 4 is for carrying and carrying the substrate 12 on which the electronic component 11 is mounted, and the substantially rectangular frame 64 is resistant to rust such as stainless steel. Made of material, the frame 64
A mesh plate 65 (for example, made of a stainless steel plate) having a large number of child holes for mounting the warp prevention support 8 is fixed inside thereof.

One end 64a at the front of the frame 64 in the carrying direction
, A shaft 66 is extended in a direction perpendicular to the conveying direction, and a flat portion 66a is formed at both ends of the shaft 66 by being processed into an oval shape, and a U-shaped member 68 made of a sheet metal extends the flat portion 66a. It is assembled so as to be sandwiched, and is integrally screwed by a bolt 67.

A support hole 68 is provided on the side surface of the U-shaped member 68.
a is formed, and the chain conveyor 1 is provided in the support hole 68a.
3, a support pin 13a protruding from the carrier 3 is rotatably fitted, and one end 4a of the carrier 4 is inserted between the pair of chain conveyors 13.
Are connected, and a plurality of carriers 4 are rotatably movable around the support pin 13a at regular intervals.
It is mounted on the No. 3 and is configured to travel in parallel and in circulation as the chain conveyor 13 travels.

The other end 4 at the rear of the carrier 4 in the conveying direction
Rollers 69 as guide members are rotatably mounted on both sides of b so as to roll on guide rails, which will be described later, so that the chain conveyor 13 travels smoothly.

4 and 8, the carrier lifting device 5 is for lifting the carrier 4 returned to the carry-in station 27 side through the return path 37, and is rotatable at the upper and lower ends. A pair of chain conveyors 13 that are wound around the two sprockets 14A, 14B and the idler 17 that are arranged and that rise diagonally upward,
A pair of ascending guide rails 70 arranged in parallel with the chain conveyor 13, a first swing guide 71 arranged at the lower end of the ascending guide rail 70, and a sprocket 14A.
And a second swing guide 86 disposed on the side of the ascending guide rail 70.

The pair of chain conveyors 13 are wound around the sprocket 14B in a shape such that the chain conveyor 13 is pressed by the idler 17 and the travel thereof once returns to the return path 37 side, and travels diagonally upward (direction of arrow S). And the ascending guide rail 70 is used to move the ascending chain conveyor 1.
3 is separated from the carrier 3 by the same distance as the length of the carrier 4 and is bent horizontally at the upper end so that the heating chamber 18
Is arranged on an extension line of the conveyance guide rail 72 arranged at the one end, the one end 4a of the carrier 4 is supported by the chain conveyor 13, and the other end 4b is raised by the roller 69 by the guide rail 7.
The carrier 4 is configured to be lifted in the horizontal state by traveling along 0.

The first swing guide 71 is free to rotate in the direction of arrow J, but is restricted from rotating in the direction of arrow K. Normally, the guide surface 71a is biased by a spring (not shown). The rising guide rail 70 is arranged in parallel with the rising guide rail 70 and constitutes a part of the rising guide rail 70.
When the one end 4a of the carrier 4 conveyed in the seven directions reaches the position of the sprocket 14B, the roller 69 arranged at the other end 4b comes into contact with the first swing guide 71 to move the first swing guide 71. The roller 69 is allowed to pass by swinging in the direction of arrow J.

After that, the carrier 4 is moved to the sprocket 14B.
The roller 69 returns to its original position by the action of the spring by traveling in the direction slightly returning to the return path 37 side along the outer diameter of the first guide rail 70, which is parallel to the rising guide rail 70.
The rocking guide 71 is guided along the guide surface 71a to ascend, and thereafter, the carrier 4 ascends in the direction of the arrow L in a horizontal state.

The second swing guide 86 is free to rotate in the direction of arrow Y, but is restricted from rotating in the direction of arrow Z. Usually, the guide surface 8 of the second swing guide 86 is restricted by the action of a spring (not shown).
6a is urged to be horizontal, and the chain conveyor 1
When the U-shaped member 68 reaches the sprocket 14A as the vehicle travels in the direction of arrow U in FIG. 3, the U-shaped member 68 presses the second swing guide 86 to rotate in the Y direction. The passage of the V-shaped member 68 is allowed.

The carrier lowering device 6 is shown in FIGS.
In order to separate the carrier 4 from the substrate 12 that has been soldered in the heating chamber 18 and lower it to the return path 37 disposed below the heating chamber 18, the sprocket 14C and the drive sprocket 16 are A pair of chain conveyors 13 that are wound around and run diagonally downward
And a circular arc-shaped cam surface 82a having the same diameter as the outer diameter of the descending guide rail 80 and the drive sprocket 16 arranged parallel to the carrier 4 and separated by the same distance as the length of the carrier 4, and swings around the pin 88. Flexible guide cam plate 8
And 2.

Then, one end 4a of the carrier 4 is supported by the pair of chain conveyors 13, and the roller 69 disposed at the other end 4b is caused to run along the descending guide rail 80, whereby the carrier 4 is in a horizontal state. As it is, the roller 69 is lowered to the return path 37. At the lower end of the carrier lowering device 6, the roller 69 is lowered by the lower guide rail 80.
Is transferred to the cam surface 82a of the guide cam plate 82, and is more smoothly transferred to the return guide rail 81.

When the lowered carrier 4 is conveyed in the direction of arrow Q and the U-shaped member 68 reaches the guide cam plate 82,
The U-shaped member 68 presses the guide cam plate 82, as shown in FIG.
1 is rotated counterclockwise to rotate the U-shaped member 68.
Is allowed to pass through.

2 and 3, the warp prevention support 8 prevents the warp of the board 12 due to the soldering by soldering while supporting the lower surface 12a of the board 12 during the whole soldering process. The main body 8a
The support 8b is formed in a protruding shape from the main body 8a
Is attached to a small hole of the mesh plate 65 of the carrier 4.

The outer diameter of the support 8b is such that the lower surface 12 of the substrate 12 does not come into contact with the electronic components 11 mounted on the substrate 12 and a pattern (not shown) arranged on the substrate 12.
It is formed thin enough to support a.

The warp prevention support 8 may be fixed to the sub-hole of the mesh plate 65, and the outer diameter of the support 8c protruding downward from the main body 8a may be slightly smaller than the size of the sub-hole of the mesh plate 65. The mesh plate 6 may be inserted into any of the sub-holes of the mesh plate 65 so that the mesh plate 6 can be mounted by mounting a permanent magnet (not shown) on the main body 8a.
5, the warp prevention support 8 may be changed in position and mounted at an optimum position for supporting the substrate 12 to be conveyed.

Next, the second embodiment of the present invention shown in FIGS.
Explaining an embodiment, the board conveying device 2 of the reflow automatic soldering device 1 according to the present invention is similar to the first embodiment in that the pair of endless winding transmission members 3 is composed of a pair of chain conveyors 13. However, on the left and right sides of the pair of chain conveyors 13 in the traveling direction of the carrier 4, the positions are shifted back and forth, and the left side in the traveling direction is the chain conveyor 13L.
Are arranged on the front side, and those on the right side in the traveling direction are arranged on the rear side as the chain conveyor 13R so that they travel in the same direction at the same speed.

Each chain conveyor 13 is wound in the order of sprockets 16, 14B, 14A and 14C, and the drive sprocket 16 is connected to each chain conveyor 13L, 13L.
A chain 25 is wound around a sprocket 24 fixed to the rotary shaft of the motor 15, and the chain is wound around a sprocket 23 fixed to the intermediate shaft 20 and is attached to the intermediate shaft 20. A chain 22 is wound around the fixed sprocket 21, and the chain is wound around a sprocket 27 that is integral with the drive sprocket 16 on the right side in the traveling direction, and the rotation of the motor 15 is caused by the rotation of each of these sprockets 24, 23, 21 and 27. And the chain conveyors 13L and 13R via the intermediate shaft 20.
Is to be driven.

Next, the chain conveyor 13 of the carrier 4 provided with the mesh plate 65 and the plurality of warp prevention supports 8
In the first embodiment, one end 4a of the carrier 4 is connected to the left and right sides of the carrier 4 in the traveling direction, and the guide rollers 69 are disposed on both sides of the other end 4b in the traveling direction. However, this second embodiment is different in that the attachment to the chain conveyor 13 and the attachment of the guide rollers 69 are arranged in a diagonal line connecting the four corners of the carrier 4, respectively.

At one end 4a of the carrier 4, a part of the carrier 4, that is, a part on the left side in the traveling direction is rotatably connected to the left chain conveyor 13L via a U-shaped member 68 and a bolt 67, and the carrier 4 A guide roller 69 is disposed on the other portion, that is, on the right side in the traveling direction. At the other end 4b of the carrier 4, a part of the carrier 4, that is, a part on the right side in the traveling direction is rotatably connected to the chain conveyor 13R on the right side through a U-shaped member 68 and a bolt 67. A guide roller 69 is disposed on the other portion, that is, on the left side in the traveling direction.

The guide roller 6 on the left side of the carrier 4
9 is a conveyance guide rail 72L and a return guide rail 8
The guide roller 69 on the right side is configured to roll on 1L and roll on the transport guide rail 72R and the return guide rail 81R.

With this structure, the carrier 4 can be translated and circulated by the pair of chain conveyors 13. For that purpose, the pair of chain conveyors 13L and 13R are moved forward and backward by a predetermined distance as shown in the figure. This predetermined distance, that is, the amount of front and rear displacement, may be equal to the distance between the coupling position of the carrier 4 to the chain conveyor 13L and the guide roller 69 on the same side in the traveling direction.

Further, as in the first embodiment, the ascending guide rail (not shown) and the descending guide rail (not shown) for rolling when the roller moves up and down are conveyed in accordance with the movement locus of the roller. The guide rails 72L, 72R and the return guide rails 81L, 81R are appropriately arranged between the guide rails so as to be connected to each other. Other configurations are the first
Since it is the same as the embodiment, part of the configuration is omitted, and the same parts are denoted by the same reference numerals in the drawings and their description is omitted.

In the method of the present invention (claim 1) (including the first and second embodiments), the board 12 having the electronic component 11 mounted thereon is heated while being melted to melt and solder the cream solder. In the method of transporting the substrate 12 in the automatic reflow soldering apparatus 1, a pair of endless winding transmission members 3 (a pair of chain conveyors) that travels by circulating a part of the carrier 4 through the heating chamber 18 and the return path 37 of the carrier 4. One of the endless winding transmission members 3 (13, 13L, 13R) is connected to the endless winding transmission member 3 (chain conveyor 13L), and the other part of the carrier 4 on the left and right in the traveling direction is connected to the other endless winding transmission member 3 ( Connected to the chain conveyor 13R),
A pair of guide rails (transport guide rails 7) disposed on the other side of the carrier 4 on the left and right sides of the carrier 4 in the traveling direction.
2, 72L, 72R, return guide rails 81, 81L,
81R), each guide member (roller 69) is provided, and the carrier 4 is translated and circulated along with the traveling of the endless winding transmission member 3, and below the substrate 12 loaded at the loading station 27. The carrier 4 is lifted from above to mount the substrate 12 on the carrier 4,
Is carried into the heating chamber 18 together with the board 12 and soldered, and then the carrier 4 is lowered at the carry-out station 46 to separate the carrier 4 from the board 12,
Only the carrier 4 from the return route 37 to the carry-in station 2
This is a method in which the substrate 12 is returned to the substrate 7 and is circulated for traveling, and the substrates 12 are successively mounted on the carrier 4 and conveyed.

The method of the present invention (claim 2) is a method of transporting the substrate 12 in the reflow automatic soldering apparatus 1 in which the substrate 12 on which the electronic component 11 is mounted is transported and heated to melt and solder the cream solder. In the above, one end 4 a of the carrier 4 is connected to an endless winding transmission member (a pair of chain conveyors 13) that circulates in the heating chamber 18 and the return path 37 of the carrier 4, and the other end 4 of the carrier 4 is connected.
A guide member 69 that travels along the guide rails 70, 72, 80, 81 is provided in b, and the carrier 4 is translated and circulated as the endless winding transmission member 13 travels, and is carried in at the carry-in station 27. The carrier 4 is lifted from the lower side of the substrate 12, the substrate 12 is mounted on the carrier 4, the carrier 4 is conveyed into the heating chamber 18 together with the substrate 12 and soldered, and then the carrier 4 is removed at the carry-out station 46. The carrier 4 and the substrate 12 are separated by lowering them, and only the carrier 4 is returned from the return path 37 to the carry-in station 27 to circulate and carry the substrates 12 on the carrier 4 one after another. is there.

Further, the method of the present invention (claim 3) is a method of transporting the substrate 12 in the reflow automatic soldering apparatus 1 in which the substrate 12 having the electronic parts 11 mounted thereon is transported and heated to melt and solder the cream solder. At the carrier 4, the raising device 5 for the carrier 4, the heating chamber 18, and the lowering device 6 for the carrier 4
Also, the carrier 4 is attached to the endless winding transmission member (a pair of chain conveyors 13) that circulates in the return path 37 of the carrier 4.
One end 4a of the carrier 4 is connected, and a guide member 69 that sequentially travels along the ascending guide rail 70, the conveyance guide rail 72, the descending guide rail 80, and the return guide rail 81 is disposed at the other end 4b of the carrier 4 and endlessly wound. The carrier 4 is translated and circulated along with the traveling of the hanging transmission member, and the substrate 1
A plurality of warp prevention supports 8 that support the lower surface 12a of the second substrate 12 to prevent the warp of the substrate 12 are mounted on the carrier 4 and run with the carrier 4, and the carrier 4 is loaded from below the substrate 12 loaded in the loading station 27. Are mounted to mount the substrate 12 on the warp prevention support 8, the carrier 4 is conveyed into the heating chamber 18 together with the substrate 12 and soldered, and then the carrier 4 is lowered at the carry-out station 46 to remove the carrier 4 from the carrier 4. The substrate 12 is separated, only the carrier 4 is returned from the return path 37 to the carry-in station 27 and circulated, and the substrate 12 is mounted on the warp prevention support 8 of the carrier 4 one after another.
This is a method of transporting and soldering while preventing warpage of the solder.

The present invention is configured as described above,
Hereinafter, the operation will be described. First, the operation of the board transfer device 2 of the automatic reflow soldering device according to the first embodiment of the present invention will be described. In FIGS. 8, 9 and 12, the board 12 is manually or automatically operated from the carry-in port 26a.
When the substrate is loaded, the substrate 12 is driven by the motor 32, is stacked on the rope conveyor 31 traveling in the arrow A direction, and is transported in the arrow B direction.

At this time, the pressing lever 42 of the substrate pressing device 29 contacts the pin 45 and is rotated to the standby position shown by the solid line in FIG. 8 against the force of the tension spring 43. It does not interfere with the pressing lever 42.

When the rear end of the substrate 12 is conveyed forward of the pressing lever 42 by a predetermined distance, compressed air is supplied to the air cylinder 34 from a compressed air supply device (not shown),
When the magnet piston moves in the direction of arrow C, the moving base 40 is attracted by the magnetic force and moves in the same direction, and is released from the pin 45 that the pressing lever 42 is pressing, and is rotated in the direction of arrow E by the force of the tension spring 43. It moves and the tip of the pressing lever 42 descends to a position where it can contact the substrate 12.

When the moving table 40 further moves in the direction of arrow C, the pressing lever 42 presses the rear end of the substrate 12 and conveys it in the direction of arrow C in FIG. The substrate holding plate 85 is accurately positioned at a predetermined position, that is, at the stroke end of the air cylinder 34.

On the other hand, in the empty carrier 4 on which the substrate 12 is not loaded, the rotation of the motor 15 in the arrow I direction causes the intermediate shaft 20 to rotate in the arrow a direction via the sprocket 24, the chain 25 and the sprocket 23. Further, as the pair of chain conveyors 13 that are transmitted to and driven by the drive sprocket 16 via the sprocket 21, the chain 22, and the sprocket 19, the return path 37 is sequentially returned in the direction of arrow Q, and in FIG. Carrier 4
When the roller reaches the lower portion of the carrier lifting device 5, the roller 69 contacts the first swing guide 71 (FIG. 13A),
The swing guide 71 is swung in the direction of arrow J, and the roller 69 passes through the first swing guide 71 (FIG. 13B).

When the roller 69 passes through the first swing guide 71, the first swing guide 71 is rotated in the direction of arrow K by the action of a spring (not shown), and the guide surface 71a is moved to the rising guide rail 70. The lift guide rails 70 are parallel to each other and constitute a part of the ascending guide rails 70. On the other hand, one end 4a of the carrier 4 connected to the pair of chain conveyors 13 is brought to the outer diameter of the sprocket 14B by the rotation of the sprocket 14B in the arrow R direction. The first swing guide 71 moves along the arc along the circular arc so as to return to the direction of the return path 37, and the roller 69 also moves in the same direction.
Since it has returned to the position forming part of 0, the roller 69
Moves in the direction of arrow T along the guide surface 71a (see FIG. 1).
3 (c)).

In FIG. 14, one end 4a of the carrier 4 is connected to the chain conveyor 13 as the pair of chain conveyors 13 travel in the direction of arrow S.
Is supported by and rises in the direction of arrow S, and the other end 4
The roller b rolls up on the ascending guide rail 70 to move up in the arrow T direction, so that the carrier 4 moves up in the arrow L direction in the horizontal state (FIG. 14A), and the U-shaped member 68 When reaching the sprocket 14A, the U-shaped member 68 presses the second swing guide 86 to rotate in the direction of the arrow Y to pass (FIG. 14 (b)), and the substrate holding plate above the carrier lifting device 5. The warp prevention support 8 abuts and supports the lower surface 12a of the substrate 12 which is positioned at a predetermined position of 85 and stands by, and the substrate 12 is loaded on the carrier 4 (FIG. 14C).

One end 4a of the carrier 4 loaded with the substrates 12 is supported by the chain conveyor 13 as the chain conveyor 13 travels, and the other end 4b of the carrier 4 rolls on the conveyance guide rail 72. It is supported horizontally and conveyed to the heating chamber 18 in the direction of arrow O.

In FIG. 1, the substrates 12 loaded on the carrier 4 are transferred to the preheating chamber P by the chain conveyor 13.
The nitrogen gas heated by the heating device 61 while being conveyed to H1 and PH2 one after another is blown by the blower 62 to about 3 m / s.
The substrate 12 is uniformly heated by being circulated and sprayed at a flow rate of about ec.

The heating state of the substrate 12 will be described in detail. When the blower 62 rotates, the nitrogen gas in the heating chamber 18 is heated by the heating device 61 by passing through the hole 61a and conveyed by the chain conveyor 13. The substrate 12 and the electronic component 11 are heated by coming into contact with the substrate 12.

The nitrogen gas that has heated the substrate 12 and the electronic component 11 is again sucked by the blower 62 and circulates in the heating chamber 18, but the temperature of the nitrogen gas is detected by a temperature sensor (not shown) and the temperature is predetermined. The electric power supplied to the heating device 61 is adjusted so that the temperature of the nitrogen gas is obtained.

Since the temperatures in the preheating chambers PH1 and PH2 are independently set to predetermined temperatures, the substrate 12 is gradually heated to prevent the heat shock from affecting the substrate 12 and the electronic component 11. Finally, the substrate 12 is 150
Preheat is completed by heating to about °.

Next, the substrate 12 loaded on the carrier 4
Is conveyed to the reflow soldering chamber RF and heated there by contacting with nitrogen gas heated to approximately 230 ° in the same manner as in the preheating chambers PH1 and PH2, so that the cream solder melts and the electronic component 11 Are soldered to predetermined positions on the substrate 12.

The preheating chambers PH1 and PH2 and the reflow soldering chamber RF are filled with an inert nitrogen gas, and the oxygen concentration in the heating chamber 18 is about 100 to 1000 ppm. The lead wire of the component 11 is not oxidized, and ideal soldering is performed.

Substrate 1 that is still hot after being soldered
2 is further transported to the slow cooling chamber CL and slowly cooled, and then the substrate unloading conveyor 48 from the chain conveyor 13
Passed to.

As described above, in the entire soldering process from preheating to cooling, a plurality of warp prevention supports 8 are mounted on the substrate 12.
Since the lower surface 12a of the substrate is supported, the substrate 12
Warpage is suppressed to a minimum.

The substrate 12 after soldering is conveyed in the direction of the arrow O together with the carrier 4, and when it reaches the carrier lowering device 6 in FIG. 12, one end 4a of the carrier 4 is wound around the sprocket 14C and moved downward. Along with the moving chain conveyor 13, it descends in the direction of arrow P, and at the same time, the other end 4b of the carrier 4 is descended by the roller 69 traveling along the descending guide rail 80.

That is, one end 4a of the carrier 4 is supported by the chain conveyor 13 and the other end 4b thereof is supported by the descending guide rail 80, so that the carrier 4 descends horizontally in the direction of arrow P.

Both ends of the substrate 12 are supported by the L-shaped substrate holding plate (not shown) arranged above the carrier lowering device 6 as the carrier 4 descends, and stop above the carrier lowering device 6. Only the carrier 4 further descends in the direction of arrow P as the chain conveyor 13 travels.

In FIG. 15, when the carrier 4 reaches the lower end of the carrier lowering device 6, the one end 4a of the carrier 4 changes its moving direction from the lowering direction to the horizontal direction along with the rotation of the drive sprocket 16 in the direction of the arrow V, and at the same time. At the other end 4b of the carrier 4, the roller 69 is transferred from the descending guide rail 80 to the cam surface 82a of the guide cam plate 82, and moves from the arrow W direction to the arrow X direction along the arcuate cam surface 82a. A smooth transition from downward movement to horizontal movement.

After that, the roller 69 moves the return guide rail 8
15 is guided along the return path 37 in the direction of the arrow Q, but when the one end 4a of the carrier 4 reaches the guide cam plate 82, the guide cam plate 82 is pressed by the U-shaped member 68, and in FIG. It rotates counterclockwise to allow passage of the U-shaped member 68, the carrier 4 is further conveyed in the direction of the arrow Q and returned to the carry-in station 27 to reach the carrier raising device 5, and thereafter, the same operation is sequentially performed. It is repeated.

On the other hand, in the completed soldering substrate 12 stopped above the carrier lowering device 6, compressed air is supplied to the air cylinder 54 from a compressed air supply device (not shown) in FIG. The moving table 55 is attracted by the magnetic force and moves in the same direction by the magnetic force, whereby the pressing lever 58 presses the rear end of the substrate 12 to convey the substrate 12 in the arrow H direction, and the substrate unloading conveyor 48. It is delivered to the rope conveyor 52 of.

The rope conveyor 52 is driven by the motor 53 to run, and carries the substrates 12 stacked on the rope conveyor 52 in the direction of arrow H and carries them out from the carry-out port 26b.

As described above, the carrier 4 includes the chain conveyor 13, the return guide rail 81, the ascending guide rail 70, the conveying guide rail 72 and the descending guide rail 80.
Supported by the chain conveyor 13 and sequentially translated and circulated along with the traveling of the chain conveyor 13, and the substrates 12 successively loaded from the substrate loading device 9 are loaded on the warp prevention support 8 of the carrier 4 and transported to the heating chamber 18. The soldered and soldered substrate 12 is separated from the carrier 4 by the carrier lowering device 6 and carried out from the carry-out port 26b by the substrate carrying-out device 10, and the carrier 4 is circulated and repeatedly used.

Next, the operation of the board transfer device 2 of the reflow automatic soldering device 1 according to the second embodiment of the present invention shown in FIGS. 16 to 18 will be described. When the motor 5 rotates in the direction of arrow I, the sprocket 24 rotates, and the chain 25 rotates the sprocket 23, the drive sprocket 16, the intermediate shaft 20, the sprocket 21, the chain 22, and the sprocket 27 in the same direction. The sprocket 16 causes the pair of chain conveyors 3, that is, the chain conveyor 13L on the left side in the traveling direction and the chain conveyor 13R on the right side in the traveling direction to start traveling in the arrow P direction.

As a result, in the carrier 4, the chain conveyor 13L on the left side in the traveling direction pulls the left side connecting portion of its one end 4a, and the chain conveyor 13R.
The connection portion on the right side in the traveling direction is pulled by the pair of rollers 69, and the pair of rollers 69 arranged diagonally on the carrier 4 conveys the guide rails 72L, 72R and the return guide rails 81L, 8L.
Since each rolls on the 1R, the horizontal and vertical arrows O,
It is possible to perform translational circulation traveling like P, Q, and T.

Then, in the same manner as in the first embodiment, the substrate 12
(Illustrated in the first embodiment) can be transported and reflow soldering can be performed. Since the vertical movement of the carrier 4 and the lifting operation of the substrate 12 by the warp prevention support 8 are the same as those in the first embodiment, their description will be omitted.

[0087]

As described above, according to the present invention, a part of each of the left and right sides of the carrier in the traveling direction is connected to a pair of endless winding transmission members that circulate and is arranged on the other part of the carrier. The guide member is made to be able to travel along the guide rail, and the rising guide rail is parallel to the endless winding transmission member that rises and runs at the carry-in station, and the endless winding transmission member that descends and runs at the carry-out station. Since the descending guide rails are arranged in parallel, the guide member travels along the ascending guide rail and the descending guide rail as the endless winding transmission member travels,
It is possible to raise and lower with a simple mechanism without using a dedicated carrier raising device and carrier lowering device, and there is an effect that the structure of the automatic reflow soldering device can be greatly simplified.

Another object of the present invention is that with the above-mentioned structure, the carrier can be translated and circulated by a simple mechanism without the need for a carrier transfer device between the respective carrier devices, and as a result, reflow automatic soldering with very few failures is possible. As a result, the substrate transfer device in the attachment device can be provided at an extremely low cost as compared with the conventional product.

Furthermore, a part of each of the left and right sides in the traveling direction of the carrier having a plurality of warp prevention supports mounted on the upper surface is connected to a pair of endless winding transmission members, and a guide member disposed on the other part is guided. Since the carrier is configured to run along the rails, a part of the carrier is supported by the endless winding transmission member that is lifted, and the other part is supported by the lift guide rails to be lifted. It can be raised in a horizontal state, and as a result, a warp prevention support is brought into contact with the lower surface of the board that stands by at a predetermined position, the board is loaded on the warp prevention support, transported to the heating chamber, and soldered. Therefore, there is an effect that the warp of the substrate due to heating, gravity, blowing of hot air, etc. can be suppressed to a minimum.

Further, a swinging guide forming a part of the guide rail is arranged at a desired position of the connecting portion of each guide rail so as to be rotatable in one direction to allow passage of the guide member and to travel in the other direction. Since the guide rails are provided, the gaps between the guide rails are connected by the swing guides so that the carrier can smoothly run in circulation along the swing guides.

[Brief description of drawings]

1 to 15 relate to a first embodiment of the present invention,
FIG. 1 is a vertical sectional view of an automatic reflow soldering device.

FIG. 2 is a perspective view of a carrier.

FIG. 3 is a partially cutaway front view of the carrier.

FIG. 4 is a perspective view of a main part of a carrier lifting device.

FIG. 5 is a perspective view of a drive mechanism of a chain conveyor.

FIG. 6 is a side view of the substrate pressing device.

FIG. 7 is a side view of the substrate extrusion device.

FIG. 8 is a side view of essential parts of a reflow automatic soldering device including a board loading device.

FIG. 9 is a partial vertical cross-sectional view showing a state in which a substrate is loaded by being loaded on a rope conveyor.

FIG. 10 is a partial vertical cross-sectional view showing a state where a substrate is lifted by a warp prevention support attached to a carrier and is conveyed to a preheating chamber.

FIG. 11 is a side view of the carrier lowering device.

FIG. 12 is an overall side view showing a carrying state of a substrate by a carrier in an automatic reflow soldering device.

FIG. 13 is a partial schematic side view showing a state where the carrier is transferred from the return path to the carrier lifting device.

FIG. 14 is a partial schematic side view showing a state where substrates are stacked on a carrier by a carrier lifting device.

FIG. 15 is a partial schematic side view showing a state where the carrier is transferred from the carrier lowering device to the return path.

16 to 18 relate to a second embodiment of the present invention, and FIG. 16 is a schematic perspective view of a substrate transfer device.

FIG. 17 is a perspective view of a carrier.

FIG. 18 is a partial plan view of a substrate transfer device.

[Explanation of symbols]

 1 Reflow Automatic Soldering Device 2 Board Transfer Device 4 Carrier 4a One End 4b Other One End 5 Carrier Lifting Device 6 Carrier Lowering Device 8 Warp Prevention Support 11 Electronic Components 12 Board 12a Lower Surface 13 Chain Conveyor as an Example of Endless Winding Transmission Member 15 A motor as an example of a driving device 18 A heating chamber 27 A carry-in station 37 A return path 46 A carry-out station 69 A roller as an example of a guide member 70 A rising guide rail 71 A first swing guide 72 A transfer guide rail 80 A descending guide rail 81 A return guide rail 86 A second Swing guide

Claims (7)

[Claims] 1. A method of transporting a substrate in a reflow automatic soldering device, wherein a substrate on which an electronic component is mounted is heated while being heated to melt and solder the cream solder,
A part of the carrier is connected to the one endless winding transmission member of the pair of endless winding transmission members that circulates in the heating chamber and the return path of the carrier and is on the left and right opposite sides in the traveling direction of the carrier. Another part is connected to the other endless winding transmission member, and a guide member that travels along a pair of guide rails disposed on the left and right sides in the traveling direction of the carrier is provided to the other part of the carrier. Installed, the carrier is translated and circulated along with the traveling of the endless winding transmission member, and the carrier is lifted from below the substrate carried in at the carry-in station to mount the substrate on the carrier, After carrying the carrier with the substrate into the heating chamber and soldering, the carrier and the substrate are separated by lowering the carrier at the carry-out station. Method of transporting the substrate in the reflow automatic soldering apparatus, characterized in that only carry the carrier to the substrate is mounted on the input station to return to the one after another the carrier is circulated travel from the return path. 2. A substrate carrying method in a reflow automatic soldering device, wherein a substrate on which an electronic component is mounted is heated while being heated to melt and solder the cream solder.
One end of the carrier is connected to an endless winding transmission member that circulates in the heating chamber and the return path of the carrier, and a guide member that travels along a guide rail is arranged at the other end of the carrier. The carrier is translated and circulated as the winding transmission member travels, and the carrier is lifted from below the substrate loaded in the loading station to mount the substrate on the carrier, and the carrier is loaded onto the substrate. Along with carrying and soldering into the heating chamber, the carrier is lowered in the carry-out station to separate the carrier from the substrate, and only the carrier is returned from the return path to the carry-in station for circulation. In a reflow automatic soldering device, characterized in that the substrate is mounted on the carrier and conveyed one after another. Transfer method of the plate. 3. A method of carrying a substrate in a reflow automatic soldering device, which heats a substrate on which an electronic component is mounted while heating to melt and solder the cream solder,
One end of the carrier is connected to an endless winding transmission member that circulates in the carrier raising device, the heating chamber, the carrier lowering device, and the carrier return path, and an ascending guide rail, a conveying guide rail, a descending guide rail, and A guide member that sequentially travels along a return guide rail is arranged at the other end of the carrier, and the carrier is translated and circulated as the endless winding transmission member travels, and the lower surface of the substrate is supported. Then, a plurality of warp prevention supports for preventing the warp of the board are mounted on the carrier and run together with the carrier, and the carrier is lifted from below the board carried in at the carry-in station to be mounted on the warp prevention support. After mounting the board and carrying the carrier together with the board into the heating chamber for soldering, the carrier is carried out to the carry-out station. Then, the carrier and the substrate are separated by lowering the carrier, only the carrier is returned from the return path to the carry-in station and circulated, and the substrate is successively placed on the warp prevention support of the carrier. A method of transporting a substrate in a reflow automatic soldering device, characterized in that the substrate is mounted and transported while soldering while preventing the substrate from warping. 4. A substrate transfer device in a reflow automatic soldering device for heating a substrate on which an electronic component is mounted while heating to melt and solder the cream solder,
A pair of endless winding transmission members that are driven by a drive device and circulate through the heating chamber and the return path, and a part of the endless winding transmission members is connected to one of the pair of endless winding transmission members. In addition, the other part on the left and right sides in the traveling direction is connected to the other endless winding transmission member, and the guide member disposed on the other part is mounted on the pair of guide rails disposed on the left and right sides in the traveling direction. A plurality of carriers each of which runs along with the substrate and travels together with the endless winding transmission member; and an endless winding transmission member disposed at a loading station for the substrate, which is moved up and travels endlessly. A carrier lifting device including a lifting guide rail that is arranged parallel to the traveling direction of the hanging transmission member and that guides the guide member and lifts the carrier in a horizontal state, and is provided in the substrate unloading station. And a guide rail for lowering and moving the endless winding transmission member, the guide rail being arranged in parallel with the traveling direction of the endless winding transmission member, and lowering the carrier in a horizontal state. A carrier lowering device, the substrate is mounted on the carrier rising from the carrier raising device, conveyed to the heating chamber and soldered, and then only the carrier is lowered to the carry-in station by the return path. A substrate transfer device in a reflow automatic soldering device, which is configured to be returned. 5. A substrate transfer device in a reflow automatic soldering device for heating a substrate on which an electronic component is mounted while heating to melt and solder the cream solder,
An endless winding transmission member that is driven by a drive device and circulates in the heating chamber and the return path to travel, and a guide member having one end connected to the endless winding transmission member and arranged at the other end along the guide rail. A plurality of carriers that travel and mount the substrate and travel together with the endless winding transmission member; and an endless winding transmission member that is disposed at a loading station for the substrate and is moved obliquely upward to travel. A carrier lifting device including a lifting guide rail that is arranged parallel to the traveling direction of the hanging transmission member and that guides the guide member to lift the carrier in a horizontal state, and the endless winding device that is arranged at the unloading station of the substrate. The carrier is arranged so as to move the hanging transmission member obliquely downward to travel and is arranged in parallel with the traveling direction of the endless winding transmission member, and guides the guide member to carry the carrier. A carrier lowering device including a lowering guide rail for lowering in a horizontal state, the substrate is mounted on the carrier rising from the carrier raising device, conveyed to the heating chamber and soldered, and then only the carrier The substrate transfer device in the reflow automatic soldering device, characterized in that the substrate is lowered and returned to the carry-in station through the return path. 6. A substrate transfer device in a reflow automatic soldering device for heating a substrate on which an electronic component is mounted while heating to melt and solder the cream solder,
An endless winding transmission member that is driven by a drive device and circulates through the heating chamber and the return path, and a guide member having one end connected to the endless winding transmission member and disposed at the other end along a guide rail. A plurality of carriers that travel and mount the substrate and travel together with the endless winding transmission member; and an endless winding transmission member that is disposed at a loading station for the substrate and is moved obliquely upward to travel. A carrier lifting device including a lifting guide rail that is arranged parallel to the traveling direction of the hanging transmission member and that guides the guide member to lift the carrier in a horizontal state, and the endless winding device that is arranged at the unloading station of the substrate. The carrier member is moved obliquely downward to travel, and is arranged parallel to the traveling direction of the endless winding member to guide the guide member to carry the carrier. A carrier lowering device including a lowering guide rail that lowers the substrate horizontally, and a plurality of warp prevention supports that support the lower surface of the substrate mounted on the carrier and prevent the substrate from warping, A reflow automatic soldering device characterized in that it is configured such that the substrates carried in are circulated and carried on the warp prevention support of the carriers one after another, and are carried into the heating chamber for soldering. Substrate transfer device. 7. A substrate transfer device in a reflow automatic soldering device for heating a substrate on which an electronic component is mounted while heating to melt and solder the cream solder,
An endless winding transmission member that is driven by a drive device and circulates through the heating chamber and the return path, and a guide member having one end connected to the endless winding transmission member and disposed at the other end along a guide rail. A plurality of carriers that travel and mount the substrate and travel together with the endless winding transmission member; and an endless winding transmission member that is disposed at a loading station for the substrate and is moved obliquely upward to travel. An ascending guide rail that is arranged parallel to the traveling direction of the hanging transmission member and that guides the guide member to ascend the carrier in a horizontal state, and is provided at the lower end of the ascending guide rail and is rotatable only in one direction. A carrier lifting device including a swing guide that allows the guide member to pass in one direction and acts as a part of a lifting guide rail when traveling in the other direction; The endless winding transmission member is disposed at a plate unloading station to move downward by obliquely moving the endless winding transmission member, and is arranged parallel to the traveling direction of the endless winding transmission member to guide the guide member to horizontally move the carrier. A carrier lowering device including a lowering guide rail for lowering the substrate in a state, and a plurality of warp prevention supports that support the lower surface of the substrate mounted on the carrier and prevent the substrate from warping, and are carried in. A substrate in a reflow automatic soldering device, characterized in that the substrate is mounted one after another on the warp prevention support of the carrier that is circulated and transported, and is transported to the heating chamber for soldering. Transport device.