JPH0215872A - Soldering device - Google Patents

Abstract

PURPOSE:To realize space saving of a soldering device by constituting the soldering device of electronic parts on a substrate, of a substrate pre-heating part going toward the upper part in the vertical direction, a solder melting part in the horizontal direction and a cooling part going toward the lower part in the vertical direction. CONSTITUTION:In a device for soldering electronic parts onto a substrate, plural substrates 7 are brought to horizontal movement A successively by a conveyor 3, placed on a vertical carrying device 10 for moving in the upper C direction, and the substrates 7 are pre-heated by pre-heating heaters 8, 8', while carrying them in the upper C direction. The substrate 7 which has come to the uppermost stage of the vertical carrying device 10 is pushed in the horizontal direction B by a pusher 9 and transferred into a melting part 16 provided with heaters 12, 12', and by melting solder, electronic parts ar soldered onto the substrate. Subsequently, the soldered substrate 7 is placed onto a vertical carrying device 10' for moving in the lower D direction, cooled by a cooling fan 14, while carrying it downward, and thereafter, drawn out in the horizontal direction F by a horizontal conveyor 5. In such a way, soldering of many substrates can be performed with high productivity by a narrow equipment space.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a soldering device for melting solder on a board to solder electronic components on the board.

BACKGROUND OF THE INVENTION In recent years, there has been a demand for improved reliability and efficiency in devices that automatically mount electronic components onto circuit boards and simultaneously solder them.

Conventionally, in a soldering apparatus, a conveyance device for conveying a board conveys the substrate in one direction at a constant speed as shown in FIG. 3, and a temperature prosthesis as shown in FIG. 4 has been realized.

That is, in FIG. 3, 21 conveys the sheet board 7 by a conveyor, preheats it with a preheating heater 8 in a preheating section, heats it with a heating heater 12 in a heating section to melt the solder, and transfers it to a cooling fan 14 in a cooling section. It was supposed to be cooled down.

Problems to be Solved by the Invention However, in order to solder within a certain time using the temperature process shown in Figure 4, it is necessary to transport the board at a constant speed. However, when the substrate is long, the number of mounted parts is small, and the takt time is short, the furnace length is too long. In order to handle a wide variety of boards, the soldering device itself must be long.
Although it saves space, it requires a sufficient space especially when installing this device in a clean room, which poses a problem in terms of cost.

In view of this, the present invention is designed to place the transport means vertically, thereby saving space and providing a good temperature profile for the substrate.

Means for Solving the Problems In order to solve the above problems, the present invention provides a preheating section that preheats a board, a heating section that further heats the board and melts the solder to perform soldering, and a soldering section. and a cooling section for cooling the substrate, a vertical conveying means for holding the substrate horizontally in the preheating section and the cooling section, and pitch-feeding the substrate vertically in the vertical direction, and a preheating heater is provided on the ascending conveyance means, The descending conveyance means is provided with a cooling means, and the heating section is provided with a horizontal conveyance section and a heating heater.

Function: A plurality of substrates carried in are stocked in the vertical direction by the above-mentioned vertical conveyance means, and a plurality of substrates are also stacked in the cooling section by the above-mentioned means, pitch-fed, and then transported by the upward conveyance means. It is preheated and heated in the horizontal conveyance part of the soldering equipment.
It is cooled by the descending vertical conveyance means to realize smooth temperature prosthesis.

Embodiments Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 shows a front view of the entire embodiment, and FIG. 2 shows a side view. Reference numeral 1 designates the entire soldering apparatus, in which a front conveyor 3 driven by a drive motor 4 and a rear conveyor 5 driven by a drive motor 6 are provided on the left and right sides on a frame 2. A heater 12 for heating the substrate is provided at the upper center.

A fin 15 is provided vertically at the rear of the front conveyor 3, parallel to the flow of the substrates 7, and holds both ends. A vertical conveying device 10 is provided to feed the material, and when the material is pitch-feeded in the C direction, it is preheated by preheating heaters 8 provided on both sides. The pusher 9 provided at the top moves the substrate 7 at the upper end of the vertical conveyance device 1o.
guide 1 that supports both ends of the substrate 7 toward the melting section 16 in direction B.
1 is pushed along. The solder is melted and soldered here by the heater 12 described above.

On the substrate 7 delivery side of the melting section 16, a vertical conveyance device 10' similar to the above is provided so as to move downward in pitch in the D direction. A cooling fan 14 provided on the side of this vertical transfer device 1σ and an exhaust port 13 provided at the top are provided to cool the heated substrate 7. The above-mentioned post conveyor 6 is provided at the lower part of the vertical transport device rib 0', and carries out the substrate 7 in the F direction.

Next, the operation of the above configuration will be described.

First, the substrate 7 is carried in the input direction by the front conveyor 3, and the substrate 7 is carried in the C direction by the fin 15 of the vertical conveyor 1o.
is sent in an upward pitch.

At this time, the substrate is gradually heated by the preheating heater 8 as described above. When the substrate 7 reaches the upper end of the vertical transfer device 10, it is pushed by the pusher 9.

The substrate 7 is conveyed along the guide 12 to the melting section 1e, and heated by the upper and lower heaters 12 to melt the solder portions on the substrate 1 and perform soldering. When the soldering is completed, the pusher 9 pushes the next substrate 7 to the upper end of the vertical conveyance device 10', and the soldering completed substrate 7 is carried out from the melting section 16.

Then, when the substrate 7 is pitch-fed in the D direction and lowered, the substrate 7 is cooled by the cooling fan 14.

In this way, as shown in Figure 4, the temperature of the substrate 7 rises linearly in the preheating section, and in the melting section 16 it is melted at a constant temperature and cooled linearly, realizing a good temperature process. be done. Then, it is transferred to conveyor 5 and carried out downward.

Effects of the Invention As described above, according to the present invention, it is possible to lay out the preheating section, melting section, and cooling section, each of which has the same length as the substrate.
It eliminates the need for a long soldering device as in the past, saves space, allows smooth preheating, heating, and cooling, and enables the desired temperature process to be performed at will.

[Brief explanation of the drawing]

FIG. 1 is a front view of a soldering device showing an embodiment of the present invention;
FIG. 2 is a side view of the same, FIG. 3 is a front view of a conventional soldering device, and FIG. 4 is a temperature characteristic diagram of a soldering device according to an embodiment of the present invention. 1... Soldering device, 3... Front conveyor, 5... Back conveyor, 7... Board, 8... Preheating heater 9 ...butsusha-112...additional phi-p-114...
cooling fan. Name of agent: Patent attorney Shigetaka Awano and one other person Funeral diagram Preheating section Molten M section Cooling section

Claims (1)

[Claims] The preheating section includes a preheating section that preheats a board on which electronic components are mounted, a melting section that heats the board and melts the solder on the board, and a cooling section that cools the board. The melting section includes a rising conveyance means for holding the substrate horizontally and rising vertically and a preheating heater, the melting section includes a horizontal conveyance means for horizontally moving the substrate and a heating heater, and the cooling section raises the substrate horizontally. A soldering device comprising a descending conveying means that holds and descends vertically, and a cooling means.