JP2004106028A - Soldering device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering device for enhancing the soldering efficiency. <P>SOLUTION: A pre-heating unit 27 to preheat a work W to be carried by an index table 22 and a wave soldering tank 28 to feed molten solder to the work W are installed on a lower side of the index table 22 to be turned while the work W is stopped at a predetermined angle. The wave solder tank 28 is located on the downstream side of the pre-heating unit 27 and between a stop position P<SB>1</SB>and a stop position P<SB>2</SB>of the index table 22. A pulse-controllable motor 25 to drive the index table 22 at a variable speed is controlled by a controller 26 at a variable speed. The controller 26 has a speed control pattern having a high-speed carrying area to drive the index table 22 in a non-soldering mode at a relatively high speed, and a soldering speed area to drive the index table 22 in a soldering mode at a soldering speed set according to the work W. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a soldering device having a pivot type index table.
[0002]
[Prior art]
A conventional soldering apparatus, for example, a local soldering apparatus for soldering only a part of a work, includes a pair of conveyors 11 and 12 and a pair of substrate transfer mechanisms 13 and 14 as shown in FIG. Thus, a board circulation system for endlessly transporting a mounting board (hereinafter, simply referred to as a “board”) on which an electronic component as a work is mounted is adopted.
[0003]
That is, in this board circulation system, two conveyors 11 and 12 are opposed to each other, and the boards are transferred to the opposed conveyors by board transfer mechanisms 13 and 14 installed between both ends of each of the conveyors 11 and 12. This allows the board after soldering to return to the position where the worker A puts the board.
[0004]
The conveyors 11 and 12 are provided with a pair of endless transfer chains 16 along a pair of rails 15 and driven at a constant speed by an induction motor.
[0005]
A spray type fluxer 17 for applying a flux to the lower surface of the substrate is provided below one conveyor 11, and a preheater 18 for preheating the substrate, A jet-type solder bath 19 for jetting solder and soldering to a substrate is provided.
[0006]
The substrate transfer speed, that is, the operation speed in the flux application step by the spray type fluxer 17, the preheating step by the pre-heater 18, and the soldering step by the jet type solder bath 19 is the conveyor transfer speed driven by the induction motor, and is always It is set constant. The board transfer speed between the steps is also limited to the board transfer speed in the soldering step, that is, the soldering speed.
[0007]
In such a local soldering apparatus, a masking jig 20 having a soldering hole opened only in a portion corresponding to a region to be soldered on a substrate is used. Although determined according to the length, the substrate transport path that requires the substrate transfer mechanisms 13 and 14 has a longer overall length, and thus requires a larger number of masking jigs 20.
[0008]
Further, since the two conveyors 11 and 12 are opposed to each other and the substrate transfer mechanisms 13 and 14 are installed between both ends of each of the conveyors 11 and 12, respectively, the size of the soldering apparatus is increased and the installation area is increased.
[0009]
In addition, in each of the conveyors 11 and 12, the board transfer speed is set to be constant by the induction motor, and the board transfer speed in the soldering process, that is, the soldering speed cannot be freely changed. Since the setting is made, the substrate transfer speed between the respective steps is also limited by the soldering speed, so that the transfer at a high speed cannot be performed, and the cycle time required between the respective steps becomes longer.
[0010]
On the other hand, the holders are radially provided on the turntable, and jigs for mounting the objects to be soldered are attached to these holders, and the objects to be soldered mounted on these jigs are a fluxing device, a preheating device and There is a soldering apparatus that intermittently rotates a turntable in a horizontal plane so as to stop on a solder bath, and moves the solder bath up and down while the turntable is stopped. 1).
[0011]
This turntable type soldering apparatus can solve the problems of the substrate transfer mechanisms 13 and 14.
[0012]
[Patent Document 1]
Japanese Patent Publication No. Hei 2-24625 (Page 2-3, Figure 1-2)
[0013]
[Problems to be solved by the invention]
However, this conventional turntable type soldering apparatus intermittently moves the turntable at a constant speed and moves the solder bath up and down while the turntable is stopped to solder the work. The time required for the operation reduces the soldering efficiency.
[0014]
The present invention has been made in view of such a point, and an object of the present invention is to provide a soldering apparatus that can improve soldering efficiency.
[0015]
[Means for Solving the Problems]
The invention described in claim 1 includes an index table that conveys the work to be soldered in a swirl shape while stopping the work at a fixed angle, a preheating unit that preheats the work conveyed by the index table, and a preheating unit. On the other hand, a soldering device including a soldering unit that is disposed downstream of the index table rotation direction and between the stop position of the index table and supplies molten solder to the work, the stop position of the index table. Since the soldering portion is arranged between the position and the stop position, the work being moved by the index table can be soldered by the soldering portion, and the soldering efficiency can be improved.
[0016]
The invention described in claim 2 includes an index table that conveys the work to be soldered in a swivel shape while stopping the work at a fixed angle, a preheating unit that preheats the work conveyed by the index table, and a preheating unit. On the other hand, on the downstream side in the direction of rotation of the index table and between the stop position of the index table and the stop position, which supplies molten solder to the work, and on the surface to be soldered of the work facing the soldering portion. It is a soldering device provided with a masking jig provided with a soldering hole in a portion corresponding to a soldered area of the work, the work being moved by the index table can be soldered by the soldering part, Improves the efficiency of soldering and uses a masking jig to locally solder the work Becomes possible, also, by the swirling-type index table, since the shorter work transfer path by eliminating the work transfer mechanism, can be reduced quantity required masking jig.
[0017]
The invention described in claim 3 includes an index table that conveys the work to be soldered in a swivel shape while stopping the work at a predetermined angle, a preheating unit that preheats the work conveyed by the index table, and a preheating unit. On the other hand, a soldering section that is disposed downstream of the index table rotation direction and between the stop position of the index table and supplies molten solder to the work, and is provided so as to be capable of adjusting the angle with respect to the index table. It is a soldering device equipped with a receiving jig that variably adjusts the mounting angle and positioning means that fixes the angle of the receiving jig with respect to the index table, so that the work being moved by the index table can be soldered by the soldering part. , Improving the soldering efficiency and index table The mounting angle of the work is variably adjusted by a jig provided so that the angle can be adjusted, and the angle is fixed by the positioning means. In addition to being able to adjust the solder detachment angle so that no solder is generated, it is possible to adjust the heating time due to the difference in the heat capacity of the mounted components depending on the mounting angle of the work, thereby improving the soldering quality.
[0018]
According to a fourth aspect of the present invention, in the soldering apparatus according to any one of the first to third aspects, a pulse controllable motor for driving the index table at a variable speed and control means for controlling the motor at a variable speed are provided. The rotation speed of the index table, that is, the transfer speed of the work, can be controlled to an optimum speed according to the work by a motor that is variable speed controlled by the control means, and particularly, the transfer speed during soldering, that is, By controlling the soldering speed to a variable speed according to the work, good soldering quality can be obtained. Further, since the index table is driven by a pulse-controllable motor, even if there is no sensor for detecting the rotation angle of the index table, the control means determines the current position of the work from the control signal to the pulse-controllable motor. Can be accurately grasped.
[0019]
According to a fifth aspect of the present invention, in the soldering apparatus according to the fourth aspect, the control means includes a high-speed conveyance region for driving the index table at the time of non-soldering at a relatively high speed, and an index table at the time of soldering. A speed control pattern having a soldering speed region driven at a soldering speed set in accordance with the workpiece, and the index table is one of the speed control patterns provided by the control means. The cycle time between moving from one stop position to the next stop position can be shortened, and the optimum soldering speed according to the workpiece can be obtained at the same time by the soldering speed region.
[0020]
According to a sixth aspect of the present invention, in the soldering apparatus according to any one of the first to fifth aspects, the preheating portion is set at one of a starting end of the preheating portion and an upstream of the starting end in the index table rotation direction. A work input station provided at a stop position of the index table for inputting a work onto the index table, and a work provided at a stop position of the index table adjacent to the work input station downstream of the soldering portion in the direction of rotation of the index table. And a work collection station for collecting the work. The work input to the work input station is returned to the work collection station adjacent to the work input station by the revolving index table, so that the work is returned. Transfer mechanism for Not required, it is possible to provide a soldering apparatus having a simple structure at low cost. Further, since the work input station and the work collection station are adjacent to each other, a single operator can easily input and collect the work.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail with reference to one embodiment shown in FIGS.
[0022]
FIG. 1 shows a soldering device suitable for local soldering, in which a work W such as a mounting board on which electronic components to be soldered are mounted is conveyed in a swivel shape while stopping at regular angles on a device body 21. A variable-speed controllable index table 22 is provided.
[0023]
The index table 22 is a rotating body formed in a disk shape, and is covered by a flat cylindrical cover 23. Further, an index table drive unit 24 that drives the index table 22 at a variable speed in the turning direction is provided below the rotation center of the index table 22.
[0024]
The index table drive unit 24 uses a pulse-controllable motor 25 such as a pulse motor or a servo motor as a variable speed motor as a drive source. The pulse-controllable motor 25 is used as a control means attached to the apparatus main body 21. Is controlled by a control signal from the controller 26, that is, a pulse signal.
[0025]
An arc-shaped preheating section 27 for preheating the work W conveyed by the index table 22 is provided below the index table 22. The preheating section 27 is located downstream of the preheating section 27 in the direction of rotation of the turntable. Stop position P ₁ And stop position P ₂ And a jet-type solder bath 28 as a radial soldering portion that supplies molten solder to the work W.
[0026]
The preheater 27 is provided with a preheater for heating the work W from below, and the jet-type solder bath 28 is provided with a nozzle 28a. The molten solder jetted from the nozzle 28a is applied to the lower surface of the work W. Supply.
[0027]
At the stop position of the index table 22 set at the start end of the preheating unit 27, a work input station S for inputting the work W onto the turntable is set. ₁ The work input station S is located downstream of the jet-type solder bath 28 in the turntable rotation direction. ₁ Is located at a stop position of the index table 22 adjacent to the work collection station S for collecting the work W. ₂ Is provided.
[0028]
The starting end of the preheating unit 27 is located at the work input station S. ₁ If it is located further downstream in the rotation direction of the turntable, the work input station S ₁ The flux applying means 29 such as a spray type fluxer may be arranged at the position of (1).
[0029]
In the index table 22, a plurality of receiving jigs 31 are arranged at a constant pitch corresponding to the indexing operation as shown in FIG. Masking jigs 32 for soldering are respectively attached.
[0030]
That is, as shown in FIGS. 2 and 3, the index table 22 is provided with a plurality of circular holes 33 as the plurality of holes formed at regular intervals at the same diameter portion. A step portion 34 is formed on the inner peripheral edge of the disk-shaped jig 31. The outer peripheral edge of a disc-shaped receiving jig 31 that variably adjusts the mounting angle of the work W is engaged with the step portion 34 so that the angle can be adjusted.
[0031]
Further, as shown in FIG. 2, toggle mechanisms 35 as positioning means for fixing the angle of the receiving jig 31 with respect to the index table 22 are provided at three places facing the circular holes 33 of the index table 22, respectively.
[0032]
As shown in FIG. 3, the toggle mechanism 35 has a lower portion of a movable plate 38 rotatably connected to an upper portion of a mounting plate 36 on the index table 22 by a shaft 37, and a lower shaft 39 of the mounting plate 36. A pair of links 44 and 45 connected by an operation unit 42 and a shaft 43 are provided between the operation unit 42 and the shaft 41 on the upper part of the movable plate 38, and the link 44 is pushed by pushing the operation unit 42 downward. , 45, the movable plate 38 is rotated in a counterclockwise direction, the screw bar 46 attached to the movable plate 38 is pushed down, and the pressing portion 47 provided at the lower end of the screw bar 46 is received. The outer peripheral edge of the receiving jig 31 is pressed against the upper surface of the outer peripheral edge of the fixture 31 by the pressing portion 47 and the step 34 of the index table 22.
[0033]
On the other hand, by pulling up the operation unit 42, the clamping force by the toggle mechanism 35 is released. The toggle mechanism 35 can fix the jig 31 to the index table 22 steplessly and easily, and can release the fixation.
[0034]
As a positioning means for fixing the angle of the receiving jig 31 with respect to the index table 22, a positioning pin (not shown) may be used. For this purpose, as shown in FIG. 2, positioning holes 48 for inserting positioning pins are formed in the step portion 34 of the circular hole 33 of the index table 22 and the outer peripheral edge of the receiving jig 31 at a constant pitch. Is established.
[0035]
Further, a rectangular box-shaped masking jig 32 is integrally attached so as to protrude downward from the center of the receiving jig 31 as shown in FIG.
[0036]
The masking jig 32 includes a fitting recess 49 for fitting the work W to the bottom of the rectangular box, and a surface to be soldered (lower surface) of the work W facing the jet-type solder bath 28 in the fitting recess 49. And a soldering hole 51 opened in a portion of the mask portion 50 corresponding to the local region of the work W to be soldered.
[0037]
The controller 26 includes a central processing unit, a so-called CPU, a memory, and the like. The memory includes, as shown in FIG. A speed control pattern having a soldering speed region for driving the index table 22 at the time of mounting at a soldering speed set according to the work W is provided.
[0038]
Next, the operation of this embodiment will be described.
[0039]
The clamping force by the toggle mechanism 35 is released, and the jig is received with respect to the index table 22 so that the row of the component leads L of the work W forms an angle with respect to the radial direction of the index table 22 as shown in FIG. The angle of 31 is adjusted, and the jig 31 is fixed again by the toggle mechanism 35.
[0040]
The receiving jig 31 whose angle has been adjusted in this manner is moved to the work input station S. ₁ When the operation is stopped, the worker throws the work W into the fitting recess 49 of the masking jig 32 and fits it.
[0041]
The workpiece W is preheated by the preheater when moving on the preheating unit 27, and further, the stop position P ₁ To stop position P ₂ At the stage of moving to, soldering is performed by the molten solder jetted from the nozzle 28a of the jet type solder bath 28 and supplied to the lower surface of the work W.
[0042]
At this time, the component leads L projecting from the lower surface of the work W are locally soldered through the soldering holes 51 opened in the mask portion 50 of the masking jig 32.
[0043]
At this time, as shown in FIG. 5, each component lead L of the work W is sequentially separated from the molten solder supplied from the nozzle 28a of the jet-type solder bath 28, so that each component lead L is short-circuited. Less likely to cause solder bridges.
[0044]
On the other hand, as shown in FIG. 6, when all the component leads L of the work W are simultaneously separated from the molten solder supplied from the nozzle 28a of the jet-type solder bath 28, the distance between the component leads L The solder bridge B is likely to be generated.
[0045]
Also in the following cases, the mounting angle of the masking jig 32 and the work W is variably adjusted by adjusting the angle of the receiving jig 31 with respect to the index table 22.
[0046]
That is, since the peripheral speed of each point of the index table 22 is proportional to the radial distance from the rotation center of the index table 22, the nozzles of the jet-type solder bath 28 arranged at equal widths in the radial direction of the index table 22. The solder immersion time of the work W immersed in the molten solder jetted from 28a is longer at the portion closer to the center of the index table 22 than the outer peripheral edge.
[0047]
For this reason, a mounting component having a small heat capacity on the substrate is positioned on the outer peripheral edge side of the index table 22 where the solder immersion time is short, and the center of the index table 22 where the solder immersion time is long is positioned on the substrate. The mounting angle of the workpiece W is adjusted so that the mounted component having a large heat capacity is located.
[0048]
In addition, since the rotation of the index table 22 is driven by the pulse-controllable motor 25, the controller 26 detects the rotation angle of the index table 22 from a control signal to the pulse-controllable motor 25, that is, a pulse signal. Is positioned above the nozzle 28a of the jet-type solder bath 28, the pump output of the jet-type solder bath 28 is increased to increase the height of the molten solder jet, and the work W is moved to the nozzle 28a of the jet-type solder bath 28. When it passes above, by lowering the pump output of the jet type solder bath 28, the molten solder jet height is automatically controlled to be lowered.
[0049]
In this way, the work W that has been soldered is transferred to the work collection station S ₂ After being transported, the worker A takes out the soldered work W from the masking jig 32, and the masking jig 32 ₁ , A new work W is loaded.
[0050]
Next, the effects of this embodiment will be described.
[0051]
Since the preheating section 27 and the jet-type solder bath 28 can be installed within the installation range of the index table 22, a soldering apparatus having a small installation area can be provided. Also, the stop position P of the index table 22 ₁ And stop position P ₂ The work W being moved by the index table 22 can be soldered by the jet-type solder tank 28, and the soldering efficiency can be improved.
[0052]
At this time, the rotation speed of the index table 22, that is, the transfer speed of the work W is set to a high speed during the simple work transfer without soldering by the pulse controllable motor 25 controlled by the controller 26 at a variable speed. In addition, at the time of soldering, by controlling the work transfer speed, that is, the soldering speed, to an optimum speed corresponding to the work W, good soldering quality can be obtained.
[0053]
That is, in the speed control pattern shown in FIG. 4 provided in the controller 26, the index table 22 is set to 1 by the high-speed transport area set while the index table 22 moves from one stop position to the next stop position. The cycle time during the movement from one stop position to the next stop position can be shortened, and the optimum soldering speed according to the work W can be obtained at the same time by the soldering speed region.
[0054]
Further, the work input station S is provided by the revolving type index table 22. ₁ The work W input to the work input station S ₁ Collection station S adjacent to ₂ Therefore, a soldering apparatus having a simple structure can be provided at low cost without requiring a transfer mechanism for returning a substrate as in the related art. Also, the work input station S ₁ And work collection station S ₂ Are adjacent to each other, so that a single worker A can easily input and collect the work W.
[0055]
Furthermore, since the work W can be locally soldered by the masking jig 32 and the conventional substrate transfer mechanism is eliminated by the revolving type index table 22, the substrate transfer path is shortened. Can be reduced.
[0056]
As shown in FIG. 5, a receiving jig 31 provided to be able to adjust the angle with respect to the index table 22 variably adjusts the mounting angle of the masking jig 32 and the work W, and positioning means such as a toggle mechanism 35. Therefore, the angle of attachment of the work W can be adjusted to an optimum solder detachment angle that does not cause soldering failure such as a solder bridge, and the soldering quality can be improved.
[0057]
Further, the mounting angle of the masking jig 32 and the work W can be adjusted by the receiving jig 31 with respect to the index table 22, and the solder immersion time differs depending on the mounting angle of the work W. The heating time can be adjusted by the difference in the heat capacity of the board mounted components, and the board mounting of various components and the optimum board position adjustment according to the deviation of the heat capacity on the board due to the board pattern can be performed, and the soldering quality can be improved.
[0058]
Further, since the rotation of the index table 22 is driven by the pulse-controllable motor 25, the controller 26 can control the control signal to the pulse-controllable motor 25 even if there is no sensor for detecting the rotation angle of the index table 22. That is, the current position of the work W can be accurately grasped from the pulse signal, and the jet height of the molten solder jetted from the nozzle 28a of the jet type solder bath 28 can be easily controlled according to the transfer position of the work W.
[0059]
【The invention's effect】
According to the first aspect of the present invention, since the soldering portion is disposed between the stop position of the index table and the stop position, the work being moved by the index table can be soldered by the soldering portion. The soldering efficiency can be improved.
[0060]
According to the invention described in claim 2, the work being moved by the index table can be soldered by the soldering portion, and the soldering efficiency can be improved, and the local soldering of the work can be performed by the masking jig. The pivotable index table eliminates the work transfer mechanism and shortens the work transfer path, so that the required number of masking jigs can be reduced.
[0061]
According to the third aspect of the present invention, the work being moved by the index table can be soldered by the soldering portion, the soldering efficiency can be improved, and the jig provided so as to be adjustable in angle with respect to the index table. , The work mounting angle is variably adjusted and the angle is fixed by the positioning means, so the work mounting angle is adjusted to the optimum solder release angle so that soldering defects such as solder bridges do not occur In addition, the heating time can be adjusted by the difference in the heat capacity of the mounted components depending on the mounting angle of the work, and the soldering quality can be improved.
[0062]
According to the fourth aspect of the present invention, the rotation speed of the index table, that is, the transfer speed of the work can be controlled to an optimum speed according to the work by the motor controlled at a variable speed by the control means. By controlling the transfer speed, that is, the soldering speed, to a speed corresponding to the work, a good soldering quality can be obtained. Further, since the index table is driven by a pulse-controllable motor, even if there is no sensor for detecting the rotation angle of the index table, the control means determines the current position of the work from the control signal to the pulse-controllable motor. Can be accurately grasped.
[0063]
According to the fifth aspect of the present invention, the cycle time during which the index table moves from one stop position to the next stop position can be reduced by the high-speed transport area in the speed control pattern provided in the control means. In addition, the optimum soldering speed according to the work can be obtained at the same time by the soldering speed region.
[0064]
According to the sixth aspect of the present invention, since the work input to the work input station returns to the work collection station adjacent to the work input station by the revolving index table, the transfer for returning the work is performed. A simple structure soldering device can be provided at a low cost without requiring a mechanism. Further, since the work input station and the work collection station are adjacent to each other, a single operator can easily input and collect the work.
[Brief description of the drawings]
FIG. 1 is a plan view showing an embodiment of a soldering apparatus according to the present invention.
FIG. 2 is a plan view of a receiving jig and a masking jig in the same soldering apparatus.
FIG. 3 is a sectional view of a receiving jig and a masking jig in the same soldering apparatus.
FIG. 4 is a graph showing a speed control pattern in the soldering apparatus.
FIG. 5 is an explanatory diagram showing an example of a work soldering angle in the soldering apparatus.
FIG. 6 is an explanatory diagram showing a comparative example of a work soldering angle according to the first embodiment;
FIG. 7 is a plan view showing a conventional soldering apparatus.
[Explanation of symbols]
22 Index Table
25 Motor with Pulse Control
26 Controller as control means
27 Preheating part
28 Jet type solder bath as soldering part
31 Jig
32 Masking jig
35 Toggle mechanism as positioning means
51 Soldering hole
W Work
S ₁ Work input station
S ₂ Work collection station

Claims (6)

An index table that conveys the work to be soldered in a swivel shape while stopping at fixed angles,
A pre-heating section for pre-heating the work conveyed by the index table,
A soldering unit disposed downstream of the preheating unit in the direction of rotation of the index table and between the stop position of the index table and supplying molten solder to the work. . An index table that conveys the work to be soldered in a swivel shape while stopping at fixed angles,
A pre-heating section for pre-heating the work conveyed by the index table,
A soldering unit that is arranged downstream of the index table rotation direction with respect to the preheating unit and is located between the stop position and the stop position of the index table and supplies molten solder to the work,
A soldering device comprising: a masking jig provided on a surface to be soldered of a work facing a soldering portion and having a soldering hole opened in a portion corresponding to a region to be soldered on the work. An index table that conveys the work to be soldered in a swivel shape while stopping at fixed angles,
A pre-heating section for pre-heating the work conveyed by the index table,
A soldering unit that is arranged downstream of the index table rotation direction with respect to the preheating unit and is located between the stop position and the stop position of the index table and supplies molten solder to the work,
A receiving jig which is provided so as to be capable of adjusting the angle with respect to the index table and variably adjusts a mounting angle of the work;
And a positioning means for fixing an angle of the receiving jig with respect to the index table. A pulse controllable motor that drives the index table at a variable speed;
4. A soldering apparatus according to claim 1, further comprising control means for controlling the speed of the motor. The control means is
A speed control pattern having a high-speed transfer area that drives the index table at the time of non-soldering at a relatively high speed and a soldering speed area that drives the index table at the time of soldering according to the workpiece at the time of soldering. The soldering apparatus according to claim 4, further comprising: A work input station that is provided at a start position of the preheating section and at a stop position of the index table that is set at any one of the upstream ends in the index table rotation direction from the start position and that inputs a work onto the index table;
6. A work collection station provided at a stop position of the index table, which is located downstream of the soldering portion in the direction of rotation of the index table and adjacent to the work input station, and collects the work. The soldering device according to any of the above.

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