JPH10145097A - Apparatus for assembling board and method for assembling board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce required time for transferring board by providing a transfer table having a pair of chutes reciprocally movable in the carrying direction by guide rails for transferring the boards for works. SOLUTION: A transfer table 33 has a base plate 37 movable in a direction X along a linear guide 38 and nut plate 39 fixed to the lower surface of the base plate 38, and the nut plate 39 contains a nut coupled with a ball screw shaft 40 driven by a motor 41 to move the base plate 37 and hence the table 33. A substrate is gripped with chutes 36 of the table 33 to mount a heat sink. If the transfer table locates at any position after ending works of the board, it can be changed on the guide rail. This reduces required time for transferring the board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board assembling apparatus for performing a predetermined operation on a board.

[0002]

2. Description of the Related Art Japanese Unexamined Patent Publication No. Hei.
One described in Japanese Patent No. 24797 is known. According to this conventional technique, when performing an operation of mounting an electronic component on a printed board, the printed board is transported by a supply conveyor and a discharge conveyor that form a pair of guide rails. The chute for supporting the substrate on the mounting table on which the substrate is moved is separated from the conveyor, and in order to transfer the substrate from the supply conveyor onto the chute, the chute is moved by the guide rail of the conveyor. The mounting table had to be moved to a position located on the extension of the vehicle and further raised. In addition, the mounting table has to be moved in this way in order to transfer the substrate from the mounting table to the discharge conveyor.

[0003]

However, in the prior art, the mounting table must be moved between the completion of the mounting operation on the substrate and the transfer of the substrate. There was a problem that it took time for loading.
The time required for the transfer is not negligible when the number of components mounted on the board is small and the work time required for one board is short, since the transfer operation must be performed frequently. Was.

Accordingly, an object of the present invention is to reduce the time required for transferring a substrate.

[0005]

SUMMARY OF THE INVENTION Accordingly, the present invention provides a substrate assembling apparatus for performing a predetermined operation on a substrate, comprising: a pair of guide rails for guiding the transport of the substrate; And a mounting table having a pair of chutes that can reciprocate and mount the substrate for the work.

With this configuration, the substrate can be replaced on the guide rails regardless of the position of the mounting table after the work is completed.

Further, according to the present invention, in the substrate assembling apparatus according to the first aspect, a transfer table for holding and transferring the substrate to the chute so as to move on a path different from the transport path by the guide rail. In preparation for.

With this configuration, the substrate on the guide rail does not interfere with the substrate on the mounting table.

According to the present invention, in the substrate assembling apparatus according to the first or second aspect, the pair of chutes are engaged with the pair of guide rails so as not to move in the direction of changing the distance between the rails, and the substrate is assembled. An intervening member for guiding the relative movement of the two in the transport direction is provided between the movable rail and the chute for changing the interval.

[0010] With this configuration, the distance between the guide rails can be adjusted by adjusting the distance between the guide rails according to the width of the substrate.

According to the present invention, in the substrate assembling apparatus according to any one of claims 1, 2 and 3, a work head for performing the work on the substrate, and the head is orthogonal to a transport direction of the substrate in a horizontal plane. Moving means for moving in the direction.

Further, according to the present invention, in the substrate assembling apparatus according to any one of claims 1 to 4, the predetermined operation is such that the mounting table moves the mounting table in the same direction as the transport direction of the substrate by the guide rails. While doing so.

In this way, when a predetermined operation is completed, the sheet can be immediately guided by the guide rail to be discharged and conveyed, and the time for conveying to the downstream device can be reduced.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to the drawings.

[0015] As shown in FIG.
Is composed of a heat sink supply device 2, a bonding device 3, and a mounting device 4 as a substrate assembly device. The heat sink supply device 2 is a so-called parts feeder, and sends the heat sinks to be bonded to the bonding device 3 by applying vibrations to the alignment path in a state where the heat sinks to be bonded are aligned in a line. Bonding device 3
Is to bond semiconductor pellets supplied from the outside to the heat sink supplied from the heat sink supply device 2 via solder. The heat sink to which the semiconductor pellet is bonded is sent to the mounting device 4. The mounting device 4 mounts a heat sink to which a semiconductor pellet is bonded on a substrate.

The supply of the heat sink from the supply device 2 to the bonding device 3 is performed by providing a linear feeder 6 which is inclined and descends so as to descend in the direction from the heat sink supply device 2 to the bonding device 3. In the bonding apparatus 3, a transfer path 8 is formed in the cabinet 5 substantially horizontally from the feeder 6.
The linear feeder 6 conveys the aligned heat sinks by applying vibrations in the alignment direction. However, since the mounting slide surface is inclined so as to descend in the traveling direction, the linear feeder 6 is surely bonded. Can be moved in the direction of. Die bonders 9 and 1 for mounting pellets at two places in the middle of the conveyance path 6 as described later.
0 is provided. The heat sinks are intermittently fed in units of two and supplied to the respective die bonders 9 and 10.

The heat sink to which the pellets are bonded by the die bonders 9 and 10 is transported on the transport path 8 and transported to the mounting device 4 by the linear feeder 7. The linear feeder 7 also vibrates similarly to the linear feeder 6, and is provided to be inclined so as to descend in the traveling direction.

Next, the mounting device 4 will be described in detail.

As shown in FIG. 2, the heat sink to which the pellets are bonded by the bonding apparatus 3 is transported by the linear feeder 7 to a position where the mounting head 22 can take out the heat sink. The mounting head 22 is mounted on the beam 23 so as to be able to move horizontally only in the same direction as the transport direction of the transport path 8, and below the beam 23, as shown in FIGS. A transport device 26 that extends in a direction orthogonal to and transports the printed circuit board 25 is provided. The direction of the beam 23 is set to the Y direction,
Is referred to as the X direction.

The transport device 26 includes a pair of guide rails 28,
29 is disposed in the X direction orthogonal to the beam 23, and pulleys 30 and a transport belt 31 stretched over the pulleys are mounted on opposing side surfaces of the rails 28 and 29.
The printed board 25 is conveyed to the right side in FIG. 1 by being guided and guided by the guide rails 28 and 29 on the belt 31 by the rotation of the conveyor belt 31. Guide rails 28, 29
Are each extended in the X direction without being divided on the way.

On the base 32 of the transfer device 26, there are provided not only the guide rails 28 and 29 but also a mounting table 33 which can reciprocate in the X direction, ie, a direction parallel to the substrate transfer direction. Chutes 35 and 36 for holding and fixing the substrate 25 along guide rails 28 and 29 are provided on both sides of the mounting table 33.

The base plate 37 of the mounting table 33 is movable in the X direction along a linear guide 38, and a ball screw shaft 40 is screwed on a nut built in a nut plate 39 fixed to the lower surface of the base plate 38. And the screw shaft 4
When the motor 41 rotates, the base plate 37, that is, the mounting table 33 moves.

A backup base 43 is provided on the base plate 37 so as to be vertically movable while being guided by a guide portion 44, and a cylinder 45 is provided on the base plate 37.
The rod 46 of the cylinder 45 is a backup base 43
Is pushed up, the base 43 is raised. A backup pin 47 inserted into an insertion hole (not shown) is provided upright on the backup base 43, and the backup pin 47 rises to support the printed circuit board 25 conveyed thereon.

The chutes 35 and 36 grip the printed circuit board 25, which is supported by the rise of the backup pin 47 and raised to a position higher than the position supported by the belt 31, from the lateral direction and positions the printed circuit board 25 as shown in FIG. As shown in FIG. 5, a chute 35 is mounted on a side plate 48 erected on a base plate 37, and the guide rail 28
Means that the placement table 33 does not come into contact with the guide rail 28 even when the placement table 33 moves. However, the side surface of the chute 35 contacting the substrate 25 is located substantially in the same plane as the side surface of the guide rail 28.

The chute 36 is fixed on a side plate 50 movably in the Y direction on a linear guide rail 49 fixed to the base plate 37 and extending in the Y direction. Lower surface of chute 36 and guide rail 29
The chute 36 also has a predetermined gap with the upper surface of the chute 36 so that the chute 36 does not come into contact when it moves in the X direction. And is fitted in a groove 53 extending in the X direction formed between the groove forming member 52 and the groove forming member 52 fixed to the guide rail 29. The diameter of the roller 51 is made slightly smaller than the width (dimension in the Y direction) of the groove, and can be rotatably fitted, so that the chute 36 can move in the X direction along the guide rail 29. Become. Moreover, since the roller 51 is fitted in the groove 53, the side surface of the chute 36 abutting on the substrate 25 is guided by the guide rail 2.
9 is regulated so as to be able to move while maintaining substantially the same plane as the substrate guide surface.

The guide rail 29 is arranged in the Y direction along the guide rod 55 and the screw shafts 56 and 57 in the Y direction.
Can be changed so that the distance between the chute 3 and the chute 3 can be increased via the roller 51 as an intervening member.
6 also moves while maintaining the positional relationship with the guide rail 29.

To move the guide rail 29, the screw shaft 56 is rotated by turning the handle 59, and the handle 5
The screw shaft 57 is rotated by the belt 9 via the belt 58. That is, the side plate on which the guide rail 29 containing the nut screwed to the screw shafts 56 and 57 is attached moves along the guide rod 55 and the screw shafts 56 and 57.

The chute 36 is provided with a plurality of substrate pressing cylinders 60 as shown in FIGS. 6 and 7 at a plurality of locations in the longitudinal direction thereof. Substrate 2 raised to
5 is pressed and fixed.

A suction nozzle 61 is provided to penetrate the mounting head 22 so as to be vertically movable. The nozzle 61 is vertically movable and non-rotatably attached to a rotor of a motor built in the head 22. Thus, the rotation of the motor is enabled around the vertical axis.

As shown in FIG. 1, the substrate 25 conveyed to the conveyor belt 31 which is rotated by a motor (not shown) along the guide rail is stopped by being engaged with the stoppers 63 and 64. ing.

The stopper 63 swings around a support shaft 66,
The stopper 64 swings around the support shaft 67 to engage with and release from the substrate 25, respectively.

The operation will be described below.

When the heat sink supply device 2 supplies the heat sink to the bonding device 3 via the linear feeder 6, the heat sink is transferred to the transport path 8 and is intermittently transported by a feed claw (not shown). When the heat sink is sent to a predetermined position, the die bonder 9 bonds the semiconductor pellet to the heat sink during the intermittent feeding stop period, and is further moved intermittently on the transport path 8 to the left in FIG. You. The heat sinks are intermittently fed two by two, and among the two heat sinks that are not bonded by the die bonder 9, the pellets are bonded by the die bonder 10. The solder is supplied on the heat sink in advance on the transport path 8, and the solder is melted because the transport path 8 heats the heat sink, and the pellet is placed on the molten solder to perform bonding by soldering. Done.

The heat sink on which the pellets have been bonded (mounted) in this manner is placed by the linear feeder 7 at a position where the mounting head 22 of the mounting device 4 can be taken out.

Next, the mounting head 22 vacuum-adsorbs the heat sink by lowering the suction nozzle 61, and lifts and holds the heat sink by rising.

Next, while holding the heat sink, the mounting head 22 moves in the Y direction along the beam 23 and stops at a position specified in advance by data or the like.

During this movement, the suction nozzle 61 is rotated around its shaft by the rotation of the motor built in the head 22, and the heat sink is angularly positioned in the direction specified by data or the like.

In parallel with this operation, the mounting table 33 on which the printed circuit board 25 is mounted moves in the X direction and stops at the position specified by data or the like.

Next, the suction nozzle 61 descends to mount the heat sink at the specified position on the printed circuit board 25 at the specified position.

The mounting head rises after the mounting is completed, returns to the suction position in order to suck the next heat sink, and sucks the next heat sink to mount it on the substrate.

This operation is repeated in the following steps.
When all the heat sinks to be attached to 5 are attached,
The printed circuit board 25 is transferred from the mounting table 33 onto the belt 31, and is guided and guided by guide rails 28 and 29 by the rotation of the belt 31 to be conveyed.

Next, the operation of transferring the printed circuit board 25 and transferring it to the mounting table 33 will be described.

The printed circuit board 25 is supplied from an upstream device (not shown), is transferred onto a transport belt 31 stretched over guide rails 28 and 29, and is transported by the rotation of the belt 31. At this time, since the stopper 63 is swung to the position where it is locked to the substrate 25, the substrate 25 is stopped by being locked by the stopper 63. Even if the belt 31 rotates thereafter, the substrate 25 can stop while the belt 31 and the back surface of the substrate 25 slide, but the rotation of the belt 31 stops thereafter.

Next, when it is time to move the substrate 25 forward, the stopper 63 swings to release the locking of the substrate 25, and the substrate 25 is transported by the rotation of the belt 31. At this time, the stopper 64 swings to a position where it can be locked, the substrate 25 is stopped by being restricted by the stopper 64, and the rotation of the belt 31 also stops.

Next, the mounting table 33 is stopped at a position where the substrate 25 can be mounted (the mounting table 33 has to be always moved to the same position because it is locked by the stopper 64). The cylinder 45 in the state of FIG. 4 raises the backup base 43 and backs up the printed circuit board 25 on the belt 31 at the position indicated by the solid line in FIG. 6 to the position indicated by the two-dot chain line in FIG. It is supported by the pins 47 and lifted.

Next, the cylinder 60 is actuated to move the rod 70 forward as shown in FIG. 7, and the substrate 25 is gripped and fixed at its end face between the rod 70 and the side surface of the chute 35 from the horizontal direction. . At this time, the backup pin 47 rises and continues to support the substrate 25 (see FIG. 5, but FIG.
FIG. 8 is a diagram showing a case where the shooting interval is changed. ).

Next, the stopper 64 swings to release the engagement of the printed board 25 (because the board 25 is locked to the stopper 64 even if it rises to the position of the chute 35), and the motor is driven. The screw shaft 40 rotates by the rotation of 41,
The base plate 38 moves and the mounting table 33 is moved to the transfer device 2.
The movement is started to the right in FIG. Therefore, the substrate 25 fixed to the chutes 35 and 36 and supported by the backup pins 47 also starts moving without coming into contact with the belt 31.

At this time, as shown in FIG.
2 is waiting at a position slightly away from the direction of movement of the substrate 25, so that the substrate 25 is moved to the right side in FIG. 1 and the heat sink is mounted from the right side position in FIG. Program the data of the order and C
If the PU is controlled, the mounting of the heat sink is performed as the mounting table 33 advances sequentially, and
Has passed the position of the mounting head 22, the mounting has been completed. During the movement of the mounting table 33, the roller 51 rotates and moves in the groove 53.

When the mounting of the printed circuit board 25 has been completed and the position has not yet been interfered by the swing of the stopper 64,
The movement of the mounting table 33 is stopped, the gripping of the substrate 25 by the cylinder 60 is released, and the backup pin 47 is moved down by the operation of the cylinder 45 to move the substrate 25 to the belt 3.
1 on top.

Next, the substrate 25 is conveyed by the start of the rotation of the belt 31. At this time, the next substrate 25 is already conveyed.
Is stopped by the stopper 63, and the stopper 25 is released at the same time, and the substrate 25 is
Is conveyed to the position where is locked. On the other hand, the mounting table 33 located on the right side of FIG. 1 with respect to the stopper 64 moves in parallel with the transport of the mounted substrate 25 to a position where the substrate 25 locked by the stopper 64 can be mounted. . However, at this time, the backup pin 47 moves while maintaining the lowered state.

Next, the substrate 25 is gripped by the chutes 35 and 36 of the mounting table 33 in the same manner as described above, and the mounting operation of the heat sink is performed.

The next substrate 25 is not locked by the stopper 63 until the mounting of the heat sink on the substrate 25 is completed. The belt 31 may be moved by following the rotation. In this way, when the mounting operation on the substrate 25 is completed, the substrate 25 can be transferred without waiting for the arrival of the substrate 25 by the belt 31 even if the mounting table 33 returns quickly.

When the next substrate 25 is made to stand by by the stopper 63, the heat sink can be mounted on the substrate 25 without returning while always proceeding in the X direction. The heat sink can be mounted at the position of the substrate 25. Even when the substrate 25 finally interferes with the stopper 64 at the position where the mounting is completed, the substrate 25 can be transferred onto the belt 31 at that position, and the stopper 63 can be released. The transfer of the next substrate 25 and the transfer of the mounted substrate 25 may be performed simultaneously. Then, only the next substrate 25 may be stopped by swinging the stopper 64 with good timing. Alternatively, even in this case, the mounted substrate 25 may be moved to a position where the stopper 64 does not interfere with the mounting table, and then transferred onto the belt.

In this way, optimal conveyance can be performed while appropriately overlapping the belt conveyance and the movement on the mounting table according to the state.

Since the predetermined work by moving the mounting table can be performed while overlapping, it is possible to prevent the time required for the work operation from being shortened due to the time required for carrying.

Further, since the mounting table 33 moves only in the X direction, the space necessary for the substrate to move for work such as mounting components on the substrate 25 is only required to be the width dimension of the substrate transport. The relative movement of the mounting head 22 and the substrate 25 in the Y direction is realized by moving only the head 22. As a result, the driving mechanism for moving the suspended head 22 is moved in the XY directions. It is possible to make the apparatus smaller and lighter than in the case where it is performed, and to make the apparatus for performing predetermined work such as component mounting by moving the substrate 25 and the head relatively in the XY directions as a whole.

The components may be sequentially sent to the suction position of the mounting head 22 by a conveyor or the like, or a plurality of component supply devices for supplying various components to a table reciprocating in the X direction or the like are provided in the moving direction. Alternatively, a desired component may be sucked.

Further, the belt 31 has a guide rail 28,
Instead of a configuration in which each one is driven by one motor over 29, one that can be individually rotated at a plurality of locations on one guide rail 28, 29 may be provided. In this case, it is possible to rotate only the belt that discharges the substrate 25 without moving the belt on which the substrate 25 is waiting at the stopper 63.

Next, a description will be given of a change in the interval between the guide rails 28 and 29 when the size of the board 25 in the width direction is changed.

The operator adjusts the handle 5 according to the substrate 25.
By turning the dial 9, for example, the width of the guide rails 28 and 29 that have been expanded as shown in FIG. 4 can be reduced as shown in FIG. That is, by turning the handle 59,
The screw shafts 56 and 57 rotate, and are guided by these and the guide rod 55, so that the guide rail 29 moves in a direction to reduce the interval. Along with this, the chute 36 is pushed via the roller 51 which is an intervening member, and the side plate 50 moves along the guide rail 49. In addition, the end face of the chute 36 and the side face of the guide rail 29 move while being kept substantially in the same plane.

As described above, the movement of the guide rail 29 and the chute 36 can be performed collectively without adjusting the positional relationship only by rotating the handle 59.

Next, the substrate 25 at the interval between the guide rails 28 and 29 is transported and transported in the same manner as described above.
After being transferred to the mounting table 33, the heat sink is mounted.

The board 25 of the present embodiment may be a so-called printed wiring board, but may be a jig board called a mother board on which a plurality of boards are mounted. Also,
What is mounted may be not only a heat sink but also a normal chip-shaped electronic component.

[0064]

As described above, according to the present invention, it is possible to shorten the time required to replace a board on a guide rail after performing a predetermined operation on the board, and to improve the assembling efficiency of the board.

[Brief description of the drawings]

FIG. 1 is a side view of a mounting device.

FIG. 2 is a side view of the electronic component mounting apparatus.

FIG. 3 is a plan view of the mounting device.

FIG. 4 is a side view of the mounting table viewed from a substrate transport direction.

FIG. 5 is a side view of the mounting table as viewed from a substrate transport direction.

FIG. 6 is a side view showing a mechanism for fixing a printed circuit board.

FIG. 7 is a side view showing a mechanism for fixing a printed circuit board.

[Explanation of symbols]

 4 Mounting Device 22 Mounting Head (Working Head) 23 Beam (Moving Means) 25 Printed Circuit Board (Board) 28 Guide Rail 29 Guide Rail 33 Mounting Table 35 Chute 36 Chute 43 Backup Base (Transferring Means) 45 Cylinder (Transferring Means) ) 47 Backup pin (transfer means) 51 Roller (intervening member)

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Sachi Nishio 2-5-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Yoshio Ichikawa 2-chome, Keihanhondori, Moriguchi-shi, Osaka No. 5 Sanyo Electric Co., Ltd.

Claims (5)

[Claims] 1. A substrate assembling apparatus for performing a predetermined operation on a substrate, comprising: a pair of guide rails for guiding the transfer of the substrate; and a reciprocable reciprocator in a direction parallel to the transfer direction by the guide rail. And a mounting table having a pair of chutes for mounting. 2. The mounting table according to claim 1, further comprising a transfer unit configured to transfer the substrate to the chute so as to be held on the chute so as to move on a path different from a transfer path by the guide rail. The substrate assembling apparatus according to item 1. 3. An intervening member that engages the pair of chutes with the pair of guide rails so as not to move in the direction of changing the distance between the rails and guides the relative movement of the two in the substrate transport direction. The substrate assembling apparatus according to claim 1, wherein the board assembling apparatus is provided between the rail and the chute that are movable to change an interval. 4. A work head for performing the work on a substrate, and a moving means for moving the head in a horizontal plane in a direction orthogonal to a direction in which the substrate is transported. 4. The substrate assembling apparatus according to any one of 3. 5. The substrate assembling apparatus according to claim 1, wherein the predetermined operation is performed while the substrate is moved in a direction in which a mounting table is transferred by the guide rail by the guide rail. A substrate assembling method.