JP3244018B2 - Die bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a die bonding apparatus for bonding a chip to a substrate such as a lead frame.

[0002]

2. Description of the Related Art As a method of mounting a chip on a substrate such as a printed circuit board or a lead frame, a method of bonding a chip using a chip bonding paste is known. In a die bonding apparatus that performs chip bonding, a substrate is transported by sliding it on a transport rail, paste is applied to the substrate on the transport rail, and then the chip is bonded.

There are many types of substrates,
Usually, the same bonding apparatus is often used for a plurality of types of substrates. In such a case, boards having different width dimensions must be transported on the same transport rail, so that the interval between the transport rails is changed according to the type of product. Conventional methods for changing the distance between the transfer rails include a movable transfer rail on one side of the transfer rail that is movable in the width direction of the board, a manual method in which the operator adjusts the transfer rail gap every time the board type is changed, or a movable method. There has been a digital system in which the conveying rail is moved by a feed mechanism using a combination of a motor and a feed screw to automatically change the interval.

[0004]

However, in the manual system, there is a problem that complicated adjustment work requiring time is required every time the type of the board is changed, and the digital system requires control by numerical data. Thus, both the control device and the mechanism become complicated, requiring time and effort for maintenance, and causing a problem of increased cost.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a die bonding apparatus capable of quickly switching the interval between transfer rails with a simple mechanism.

[0006]

According to the present invention, there is provided a die bonding apparatus comprising a bonding means for bonding a chip to a substrate, and a chip supply unit for supplying the chip to the bonding means. Transport means for transporting the substrate to the means, two parallel transport rails for transporting the substrate, a moving means for moving at least one transport rail in the width direction of the substrate, and a distance between the transport rails to the width of the substrate. A backup plate, which also serves as an interval member, and supports the substrate from below when bonding the chips, and a holder, which is provided between the two transport rails and which detachably mounts the backup plate, is provided.

[0007]

According to the present invention, at least one side of the board transfer rail is a movable transfer rail which is movable in the width direction, and a backup plate mounted between the two transfer rails is provided. When the board type is changed, the backup plate is replaced with a board corresponding to the new type board, and the transfer rail is pressed against the backup plate by the moving means. Only by this, it is possible to easily and quickly switch the interval between the conveying rails.

Next, an embodiment of the present invention will be described with reference to the drawings. 1 is a perspective view of a substrate transfer device according to an embodiment of the present invention, FIG. 2 is a partial perspective view of the substrate transfer device, and FIGS. 3A, 3B, 3C, and 3D. FIG. 3 is a partial plan view of the substrate transfer device.

First, the overall structure of a substrate transfer device will be described with reference to FIG. In FIG. 1, reference numeral 1 denotes a base plate, and two guide rails 2 are provided on the base plate 1.
Are arranged. A slide guide 3 is slidably fitted to each of the two guide rails 2. A plate 4 is provided to connect the two slide guides 3.

At both ends of the plate 4, brackets 5 are erected. The upper ends of the two brackets 5 are connected by a movable transfer rail 6a. A fixed transfer rail 6b is provided in parallel with the movable transfer rail 6a. The fixed transport rail 6b is fixed by a bracket 7. Movable transport rail 6a and fixed transport rail 6b
Between them, backup plates 8 are mounted at two places. This backup plate 8 will be described later.

A rod 11 of a cylinder 10 is connected to the center of the plate 4. Rod 1 of cylinder 10
When 1 protrudes and retracts, the plate 4 moves back and forth, and the size of the interval between the movable transport rail 6a and the fixed transport rail 6b is adjusted. That is, the cylinder 10 is a moving unit that moves the movable transport rail 6a with respect to the fixed transport rail 6b in order to change the distance B between the movable rail 6a and the fixed rail 6b.

In FIG. 1, reference numeral 12 denotes a substrate, which is mounted on a movable transport rail 6a and a fixed transport rail 6b (hereinafter, referred to as a "transport path"). The substrate 12 is transported
Is transported downstream (to the right) on the transport path. The transport unit 14 includes a chuck 13 having an openable / closable claw, and the chuck 13 holds an end of the substrate 12.

Above the downstream side of the transport path, a paste applying means 20 is provided. The paste applying means 20 includes:
Syringe 2 containing paste for bonding chips inside
2, and a nozzle 23 for applying paste is attached to the lower end of the syringe 22. The syringe 22 is connected to a Z table (not shown) by a bracket 21 and can move up and down. When the substrate 12 is transported to the position of the paste applying means 20 on the transport path, the syringe 22 performs a lowering / elevating operation, and the nozzle 23
2 is coated with a paste 24. At this time, the backup plate 8 supports the substrate 12 from below.

A chip bonding means 30 is provided on the transport path downstream of the paste applying means 20. The bonding means 30 includes a bonding head 32 mounted on a Y table 31. A collet 34 is mounted on the lower end of the bonding head 32. Below the Y table 31 on the side of the transport path, a chip supply unit 35 composed of a wafer for supplying chips 36 is provided.

The bonding head 32 is a Y table 3
1 is moved to a position directly above the chip supply unit 35 by driving the collet 34, and the collet 34 moves up and down to pick up the chip 36. Then, it is again moved on the transport path by the Y table 31 and stands by. When the substrate 12 is transported to the position of the bonding means 30 on the transport path, the collet 3
4 performs the lowering and raising operations to bond the chip 36 onto the paste 24 applied to the substrate 12. At this time, the backup plate 8 supports the substrate 12 from below.

Next, the arrangement of the backup plate 8 will be described with reference to FIG. As described above, the backup plate 8 is used to support the substrate 12 from below at the time of applying the paste and bonding the chip 36, and a plate having a different size depending on the type of the substrate 12 is used. As shown in FIG. 2, the backup plate 8 is manufactured with a width B corresponding to the size of the substrate 12, and two grooves 16 are provided on the lower surface of the backup plate 8 in the width direction. .

One end of two rod-shaped holders 9 is connected to the movable transfer rail 6a in a horizontal posture.
The other end side is a through hole 1 provided in the fixed conveyance rail 6b.
7 is inserted. Therefore, the movable transfer rail 6a can be moved in the width direction of the substrate 12 with respect to the fixed transfer rail 6b while the holder 9 is fixed to the movable transfer rail 6a. The backup plate 8 is detachably mounted between the movable transport rail 6a and the fixed transport rail 6b by fitting the groove G on the lower surface to the holder 9.

A heater 14 is embedded on the upper surface of the backup plate 8. The heater 14 heats the backup plate 8 to heat the substrate 12 on the backup plate 8. Heater 14 has power cord 1
5 is connected to the power supply.

When the backup plate 8 is mounted on the holder 9, the cylinder 10 is driven to move the movable transfer rail 6.
By moving a toward the backup plate 8 and pressing the side end surface thereof, the interval B between the movable transport rail 6a and the fixed transport rail 6b is set to match the interval B between the substrates 12. That is, the backup plate 8 also serves as a spacing member for adjusting the distance between the movable transfer rail 6a and the fixed transfer rail 6b to the width of the substrate 12.

This substrate transfer device has the above-described configuration, and its operation will be described below with reference to the drawings. FIG.
In, the substrate 12 is transported downstream on the transport path. The paste 24 is applied to the substrate 12 by the paste applying means 20. The substrate 12 to which the paste has been applied is bonded to
, Where the chip 36 is bonded onto the paste 24 of the substrate 12. Then, the substrate 12 on which bonding has been completed is transported to the next step.

Next, the operation associated with the change of the type of the substrate 12 will be described with reference to FIG. FIG. 3A shows a state in which the transfer is performed for a type of one substrate 12. Backup plate 8 used in this case
Is B1 in the width direction. Hereinafter, the movable transfer rail 6
5 shows a procedure for switching the interval between a and the fixed transport rail 6b.
First, as shown in FIG. 3B, the rod 11 of the cylinder 10 is protruded, and the movable transfer rail 6a is moved in the direction of arrow a. Thereby, the pressing of the movable transfer rail 6a against the backup plate 8 is released, and the backup plate 8 is removed from between the movable transfer rail 6a and the fixed transfer rail 6b.

Next, as shown in FIG. 3C, a backup plate 8 '(width B2) corresponding to the width of the board 12 of the new type is placed on the holder 9. Next, the rod 11 of the cylinder 10 is immersed,
is moved in the direction of arrow b, and the backup plate 8 '
And push it against its side end face. Thereby, the distance between the movable transfer rail 6a and the fixed transfer rail 6b is set to the dimension B2 corresponding to the width of the board 12 of the new type.
Is set to

The present invention is not limited to the above embodiment. For example, in the above embodiment, one of the transport rails is fixed and the other is movable. Alternatively, both transport rails may be moved by moving means.

[0024]

According to the present invention, one side of the substrate transfer rail is a movable transfer rail movable in the width direction, and the backup plate of the substrate mounted between the fixed transfer rail and the movable transfer rail is movable. Because it also serves as a spacing member that matches the spacing between the rail and the fixed transport rail,
When the width of the board changes due to the change of the board type, the backup plate is replaced with one corresponding to the board type, and the movable transfer rail is advanced toward the backup plate by the moving means to press the side end surface thereof. If the processing accuracy of the backup plate is ensured, accurate spacing adjustment can be performed by a simple method. Therefore, the transport rail interval switching mechanism and the control method can be simplified, the apparatus cost and the maintenance cost can be reduced, and the operation at the time of switching the type can be performed extremely simply and quickly.

[Brief description of the drawings]

FIG. 1 is a perspective view of a substrate transfer apparatus according to an embodiment of the present invention.

FIG. 2 is a partial perspective view of the substrate transfer apparatus according to the embodiment of the present invention;

3A is a partial plan view of a substrate transfer apparatus according to one embodiment of the present invention; FIG. 3B is a partial plan view of a substrate transfer apparatus according to one embodiment of the present invention; (D) Partial plan view of a substrate transfer apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 base plate 2 guide rail 6a movable transfer rail 6b fixed transfer rail 8 backup plate 9 holder 10 cylinder 12 substrate 13 transfer unit 20 paste coating unit 24 paste 30 bonding unit 35 chip supply unit 36 chip

Claims (1)

(57) [Claims] 1. A die bonding apparatus comprising: a bonding means for bonding a chip to a substrate; and a chip supply unit for supplying a chip to the bonding means. Two parallel transport rails for transporting, moving means for moving at least one of the transport rails in the width direction of the substrate,
A backup plate that also serves as a spacing member for adjusting the distance between the transfer rails to the width of the substrate and supports the substrate from below during chip bonding; and a holder between the two transfer rails for detachably mounting the backup plate. A die bonding apparatus characterized by the above-mentioned.