JPH05291338A - Bonding device - Google Patents

Abstract

PURPOSE:To provide a bonding device in a simple structure which can cope with modification of types of a frame to be handled rapidly and easily and at the same time speed up bonding operation. CONSTITUTION:A frame L/F can be changed rapidly and easily by equipping a magazine M and then replacing it with a new one. Also, a magazine transport means 41 and magazine transfer means 51, 52, 53, 72, and 73 for supplying and collecting the magazine M for a loader 15 and an unloader 16 for forming a line and for speeding up operation. Furthermore, the magazine transport means 41 and the magazine transfer means are laid out so that they do not cross a bonding stage 9 etc. and are simple in structure. And, the magazine M which is empty after frames were unloaded is utilized effectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention receives a large number of lead frames each having an IC chip, that is, a semiconductor component mounted thereon, and wires the pads (electrodes) of the IC chips and the leads provided on the lead frames. The present invention relates to a bonding apparatus for bonding by using.

[0002]

2. Description of the Related Art A conventional example of such a bonding apparatus is shown in FIG.
2 shows. This bonding apparatus is installed as a line along with a die bonder apparatus and a curing apparatus (not shown). In the die bonder device, a large number of IC chips obtained by cutting a wafer are sequentially mounted at predetermined positions on a lead frame L \ F by using, for example, a thermosetting adhesive, and a curing device at a subsequent stage is mounted. It is something to send to. In addition, the curing device receives the lead frame sent from the die bonder device,
After heating to solidify the adhesive, it is sent out toward the bonding device arranged in the subsequent stage, and
The bonding apparatus receives the lead frame and bonds the leads formed on the lead frame and the pads on the IC chip mounted on the lead frame with a wire made of gold, aluminum or the like. To do.

The bonding apparatus is disclosed in Japanese Patent Laid-Open No. Hei 3
Since it is disclosed in Japanese Laid-Open Patent Publication No. 155140, a detailed description of each mechanism included therein will be omitted.

In FIG. 12, a bonding head 202 is provided on a main body 201 (illustrated by a chain double-dashed line) of this bonding apparatus. Bonding head 202
Includes a camera having a camera head, a lens, and an illuminating lamp, and is mounted on a moving table that is equipped with an XY table driving mechanism (not shown) and can be moved two-dimensionally.

A bonding stage (not shown: a stage for carrying a portion of the entire length of the lead frame L \ F on which an IC chip to be bonded and a plurality of IC chips before and after the bonding are mounted are carried by the bonding head 202. The lead frame L \ F and the IC chip, which are the parts to be bonded, are imaged, and the leads of the lead frame and the pads on the IC chip are bonded. This lead frame L \ F
Is adjusted and adjusted to the optimum spacing position by the first guide rail 203a and the second guide rail 203b.
A third transport mechanism 204 is provided in parallel with the first and second guide rails 203a and 203b. The third transport mechanism 204 is composed of a plurality of pulleys and a belt wound around the pulleys, and is driven by a motor 204g. And, in the vicinity of the third transport mechanism 204,
Sensor 205 for detecting arrival of lead frame L \ F
Are arranged.

Next, the conveying means on the lead frame receiving side will be described.

The transfer means is composed of first and second transfer mechanisms 20.
6, 207. The first and second transport mechanisms 206 and 207 are driven by one motor 208.

First and second transport mechanisms 206 and 207
Are provided in parallel on the loader unit 209 in a direction parallel to the longitudinal direction of the first and second guide rails 203a and 203b. The end of the loader unit 209 is connected to the tip of the rod of the front-rear slide cylinder 210, and the first and second guide rails 203a,
The main body 20 in the direction J orthogonal to the longitudinal direction of 203b.
The upper surface of 1 is movable. The timing of moving the cylinder (switching means) 210 back and forth is controlled by a control circuit such as a microprocessor (not shown), and the operating position of the rod of the cylinder is the center of the first and second transfer mechanisms 206 and 207. Control is performed so that the centers of the first and second guide rails 203a and 203b and the center of the third transport mechanism 204 (shown by a chain line) coincide with each other. The first and second transport mechanisms 206, 2
Reference numeral 07 has substantially the same configuration as the above-described third transport mechanism 204, and includes a plurality of pulleys and a belt wound around the pulleys. In addition, the first and second transport mechanisms 206, 20
7 includes first and second guide rails 203a, 203
Lead frame detection sensors 211 and 212 are arranged near the lead frame supply side to b.

Next, the fourth and fifth transport mechanisms 213, 2
Reference numeral 14 has the same configuration as the first and second transport mechanisms 206 and 207 described above, and is provided on the lead frame delivery side. The third and fourth transport mechanisms 213 and 21
4 is also 1 like the first and second transport mechanisms 206 and 207.
It is driven by one motor 215. Further, lead frame detection sensors 216 and 217 are provided.

Fourth and fifth transport mechanisms 213 and 214
Are provided in parallel on the unloader unit 218 in a direction parallel to the longitudinal direction of the first and second guide rails 203a and 203b. This unloader unit 21
The end of 8 is connected to the tip of the rod of the front-back slide cylinder 219, and the first and second guide rails 2
The upper surface of the main body 201 is movable in a direction J orthogonal to the longitudinal direction of 03a and 203b.

In the vicinity of the second transport mechanism 207,
A lead frame pusher cylinder 220 for pushing the lead frame L \ F on the second transport mechanism 207 onto the guide rails 203a and 203b is arranged.

Next, the operation of the bonding apparatus having the above structure will be described.

First, from the state shown in FIG. 12, the rod of the cylinder 210 on the lead frame receiving side is projected and the loader unit 209 is moved forward to move the second transfer mechanism 207.
Are aligned with the third transport mechanism 204 and the fifth transport mechanism 214. In this state, each transport mechanism 2
04, 206, 207, 213, 214 are driven, and at the same time, the lead frame L \ F that has passed through the curing device in the previous stage is supplied in the direction of the arrow and brought onto the second transport mechanism 207. This lead frame L \ F detects the sensor 21
When 2 is detected, each transport mechanism is stopped. After that, the cylinder 210 is operated in the absorbing direction, and the loader unit 209 is returned to the position shown in FIG.

Next, the lead frame pusher cylinder 220 is operated, and the lead frame L \ F on the second transport mechanism 207 is moved to the first and second guide rails 20.
3a, 203b is extruded. This guide rail 2
The lead frames L \ F sent to the parts 03a and 203b are clamped by a carrying means (not shown) and are intermittently fed one pitch at a time, and then heated to a predetermined temperature and bonded on the bonding stage. Next, the lead frame L \ bonded on the bonding stage
F is carried out onto the fourth transport mechanism 213, detected by the lead frame detection sensor 216, and the rotation of the motor is stopped. Then, the cylinder 219 is operated in the projecting direction and the unloader unit 218 moves forward. Then, each of the above-mentioned transport mechanisms is operated, and the lead frame L \ F to which the bonding is performed is sent out to the subsequent stage.

As described above, the conventional bonding apparatus has a structure in which the lead frames L \ F supplied one by one from the die bonder apparatus at the preceding stage through the curing apparatus are sequentially received and bonded.

[0016]

However, in such a conventional bonding apparatus, when considering that the type of the lead frame to be bonded is changed, each of the transfer mechanisms for transferring the lead frame is It is necessary to perform work for replacement or adjustment so as to correspond to a newly handled lead frame, and there is a disadvantage that a great deal of labor and time must be spent.

Further, in the above-mentioned conventional bonding apparatus, although the efficiency of the bonding work has been improved to some extent, there is a tendency that further speeding up is desired recently.

The present invention has been made in view of the above-mentioned drawbacks of the prior art. It is possible to deal with various lead frames quickly and easily, and at the same time, the bonding work can be speeded up. An object is to provide a bonding device having a simple structure.

[0019]

A bonding apparatus according to the present invention comprises a bonding stage, a movable table movable in at least two-dimensional directions, a bonding means having a bonding arm mounted on the movable table, and a semiconductor component, respectively. A bonding apparatus having a loader for sequentially taking out the frames from a magazine capable of accommodating a plurality of mounted frames and sending the frames onto the bonding stage, and an unloader for accommodating the bonded frames in the magazine. ,
A magazine carrying means for carrying and carrying the magazine,
A magazine transfer means for transferring the magazine between the loader and the unloader and the magazine transfer means and in a direction intersecting with a magazine transfer direction by the magazine transfer means, wherein the magazine transfer means is on the moving table. The bonding stage is arranged so as to face each other and at substantially the same height as the bonding stage.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a wire bonding apparatus as an embodiment of the present invention will be described with reference to the accompanying drawings.
In addition, although wire bonding is described as an example in the present embodiment, the present invention is of course applicable to tape bonding and the like.

As shown in FIG. 1, for example, four wire bonding apparatuses 1 according to the present invention are installed side by side in a line as a line.

As shown in FIG. 2, on the main body 2 of the wire bonding apparatus 1 and at the rear, a movable table 3 which is two-dimensionally movable and a driving means (not shown) for driving the movable table 3 are provided. ), An XY drive mechanism 5 and a bonding head 7 mounted on the moving table 3.
Bonding stage 9 (This bonding stage refers to an IC chip to be bonded and a plurality of ICs before and after bonding, in the entire length of a lead frame described later.
The stage portion that carries the portion on which the chip is mounted).

Although not described in detail because it is well known, the bonding head 7 has a capillary (not shown) at its tip.
A bonding arm 11 mounted directly above the bonding stage 9 and the bonding arm 1
A contact / separation means (not shown) for supporting and supporting the lead frame 1 on the bonding stage 9 with respect to the lead frame (described later).
And a camera (not shown) for picking up an image of the IC chip on the lead frame, and the like.

A loader 15 and an unloader 16 are provided so as to sandwich the bonding stage 9 from the left and right. The loader 15 carries a magazine (described later), sequentially takes out the lead frames arranged and housed in the magazine, and sends the lead frames to the bonding stage 9. Further, the unloader 16 uses the bonding stage 9
The lead frame bonded above is stored in a magazine. These loader 15 and unloader 16 are configured as follows.

As shown in the figure, the loader 15 has an elevating member 17 formed to have a substantially L-shaped cross section and capable of carrying one magazine, and the elevating member 17 in the vertical direction (direction of arrow Z and And a guide member (not shown) for guiding in the opposite direction). The magazine is detachable from the elevating member 17.
It is fixed to the elevating member 17 by a locking means (not shown) mounted on the device 7. Behind the elevating member 17, a long worm 19 is rotatably provided so as to extend in the vertical direction in which the elevating member 17 should move. A ball screw may be used instead of this worm 19. The same applies to worms used in other mechanical parts described later.

A belt wheel 20 is fitted on the upper end of the worm 19. A motor 21 is disposed near the belt wheel 20, and a belt 23 is wound around the belt wheel 22 and the belt wheel 22 fixed to the output shaft of the motor.

On the other hand, a nut (not shown) is fixed to the rear surface of the elevating member 17, and the nut is attached to the worm 1.
It is screwed to 9.

The lifting member 17 and the worm 19 described above.
, Belt wheels 20, 22, a motor 21, and a belt 23
And the above-mentioned nut screwed into the worm 19 are collectively referred to as magazine positioning means. That is, the magazine positioning means appropriately moves and positions the carried magazine in the lead frame arranging direction of the magazine by controlling the operation of the motor 21.

The loader 15 also has a frame take-out means 24 for taking out the lead frames one by one from the magazine positioned by the magazine positioning means and sending the lead frames onto the bonding stage 9. As shown in the figure, the frame take-out means 24 comprises a pusher 25 for abutting each lead frame in the magazine so as to project the lead frame out of the magazine, and an air cylinder 26 for reciprocating the pusher 25.

On the other hand, the unloader 16 has substantially the same structure as the loader 15 described above. That is, the unloader 16 has an elevating member 27 that is formed to have a substantially L-shaped cross section and can carry one magazine.
And a guide member (not shown) for guiding the elevating member 27 in the up-down direction (the arrow Z direction and the opposite direction). The magazine is attachable to and detachable from the elevating member 27, and is fixed to the elevating member 27 by a locking means (not shown) mounted on the elevating member 27. Behind the elevating member 27, a long worm 29 is provided so as to extend in the vertical direction in which the elevating member 27 should move.
Is rotatably provided. A belt wheel 30 is fitted on the upper end of the worm 29, and a motor 31 is arranged near the belt wheel 30 and a belt wheel 32 and a belt wheel 30 fixed to the output shaft of the motor. The belt 33 is wound around.

On the other hand, a nut (not shown) is fixed to the rear surface of the lifting member 27, and the nut is attached to the worm 2.
It is screwed to 9.

The lifting member 27 and the worm 29 described above.
, Belt wheels 30, 32, motor 31, and belt 33
And the above nut that is screwed into the worm 29 are collectively referred to as magazine positioning means. That is, the magazine positioning means appropriately moves the carried magazine in the lead frame arranging direction of the magazine by the operation control of the motor 31 and positions the magazine.

Further, the unloader 16 has a frame accommodating means (not shown) for accommodating the lead frame bonded on the bonding stage 9 into the magazine carried on the elevating member 27. ing. In addition, this frame storing means is the loader 1 described above.
5 has the same structure as the frame extracting means 24.

On the other hand, as shown in the figure, on the main body 2 and in the front part, a magazine carrying means 4 for carrying a magazine and carrying it from the vicinity of the loader 15 to the vicinity of the unloader 16.
1 is provided. More specifically, the magazine transporting unit 41 is arranged so as to face the moving table 3 with the bonding stage 9 interposed therebetween, and at the substantially same height position as the bonding stage 9.

As shown in the figure, the magazine conveying means 41 is
For example, 18 relatively long belt wheels 43 and 44 extending in parallel with each other (for convenience of explanation, only 4 of these 18 are denoted by reference numeral 44),
An endless belt 45 that is wound around each of the belt wheels 43 and 44 to carry a magazine and carries the magazine, and a torque is applied to either of the belt wheels 43 and 44 to drive the belt 45. And a torque applying means (not shown) such as a motor. The belt 45 does not carry the magazine by itself, but a carrying member (not shown) attached below the upper side of the belt receives the load of the magazine.

As is apparent from the figure, the magazine transporting means 41 is set so that its entire length is equal to or slightly larger than the width dimension of the main body 2. As a result, as shown in FIG. 1, a plurality of wire bonding apparatuses 1 are provided in each of the magazine conveying means 41.
It is possible to arrange each of the wire bonding apparatuses 1 in a line so that the transfer paths of the above are continuous so as to be continuous with each other. That is, when a plurality of wire bonding apparatuses 1 are lined up in a line as described above, the magazine conveying means 41 included in each wire bonding apparatus 1 receives the magazine supplied from the former stage and performs the bypass conveyance toward the latter stage. Since it is possible to do so, it is not necessary to individually mount or collect a magazine for each of the wire bonding apparatuses 1, and if a plurality of magazines are supplied from the wire bonding apparatus 1 arranged in the preceding stage, they can be bypass-transported. Then, the lead frames in the respective magazines can be bonded by being distributed to the respective wire bonding devices in the subsequent stage, and the magazines can be collected through the wire bonding devices arranged in the final stage.

Next, the first magazine transfer means for transferring a magazine between the magazine transfer means 41 and the loader 15 and the second magazine transfer means for transferring a magazine between the magazine transfer means 41 and the unloader 16 will be described. To do. It should be noted that both of the magazine transfer means move the magazines in the front-rear direction (the arrow X direction and the opposite direction) perpendicular to the left-right direction (arrow Y direction and the opposite direction) which is the lead frame feeding direction on the bonding stage 9. ).

First, as shown in FIG. 2, the first magazine transferring means lifts the magazine on the magazine conveying means 41 slightly upward to separate it from the magazine conveying means 41, and the separating means 51. It has a delivery means 52 for delivering the upper magazine onto the elevating member 17 of the loader 15 and, conversely, another delivery means 53 for delivering the magazine on the elevating member 17 onto the detaching means 51. .. When the magazines are transferred by the transfer means 52, 53, the loader 15 and the magazine transfer means 4 are used.
Two guide members 55 that guide the magazine while supporting the magazine are provided to the main body 1 and are fixed to the main body 2.

First, the structure of the separating means 51 will be described in detail below.

As shown in the figure, the detaching means 51 guides the movable base 59 capable of carrying one magazine at the upper end and the movable base 59 in the vertical direction (the arrow Z direction and the opposite direction). Guide member (not shown)
And an air cylinder 6 for moving the movable base 59 up and down.
2 and. As is clear from FIG. 3, the movable base 59 includes a rectangular plate-shaped base portion 59a and the base portion 59a.
Four columns 59b provided at the four corners of the
Two elongated backing plates 5 mounted on b to receive magazines
9c and. Then, the rod 6 of the air cylinder 62
2a is connected to the base portion 59a.

As shown in FIG. 2, the receiving plate 59a of the movable base 59 is positioned below the magazine carrying surface of the magazine transporting means 41 when the movable base 59 is at the lowest position. There is. That is, as shown in the figure, the belt 45 included in the magazine conveying means 41 is provided.
Has a shape in which a portion thereof is bent into a substantially V shape by the four belt wheels 44, and the receiving plate 59c is loosely inserted in the V-shaped bent portion. Further, as shown in the drawing, the support columns 59 b of the movable base 59 are arranged so as to sandwich the belt 45.

On the other hand, the delivery means 52 is the air cylinder 6
4 and a pressing plate 65 attached to the rod 64a of the air cylinder 64.

Regarding the other delivery means 53,
An arm 69 formed in a substantially U-shape and extending in the front-rear direction (the arrow X direction and the opposite direction), and the arm 6
It has a guide member (not shown) for movably guiding 9 in the front-rear direction, and an air cylinder 70 for driving the arm 69. A pressing plate 69a for pressing the magazine on the magazine conveying means 41 is provided at the front end of the arm 69.

Next, the second magazine transfer means for transferring the magazine between the magazine transfer means 41 and the unloader 16 will be described.

The second magazine transfer means is constructed in substantially the same manner as the first magazine transfer means described above, and the magazine on the magazine transfer means 41 is slightly lifted upward to be separated from the magazine transfer means 41. Means 71
And a delivery means 72 for delivering the magazine on the detaching means 71 onto the elevating member 27 of the unloader 16, and conversely another delivery means 73 for delivering the magazine on the elevating member 27 onto the detaching means 71. And have. When the magazines are delivered by the delivery means 72, 73, two guide members 75 for supporting and guiding the magazine are provided between the unloader 16 and the magazine transport means 41, and with respect to the main body 2. It is fixed.

The detaching means 71 has a movable base 79 capable of carrying one magazine at its upper end, and a guide member for movably guiding the movable base 79 in the up-down direction (the arrow Z direction and the opposite direction). (Not shown) and an air cylinder 82 for vertically moving the movable base 79. The movable base 79 is formed in the same manner as the movable base 59 included in the detaching means 51 which is a component of the first magazine transfer means described above, and has two elongated receiving plates 79c for receiving the magazine. ing.

As shown in the figure, the receiving plate 79c is located below the magazine carrying surface of the magazine conveying means 41 when the movable base 79 is at the lowest position. That is, as shown in the figure, the belt 45 provided in the magazine transporting means 41 is formed such that a part thereof is bent into a substantially V shape by the belt wheel 44, and the receiving plate 79 is provided.
c is loosely inserted in this V-shaped bent portion.

On the other hand, the delivery means 72 is the air cylinder 8
4 and a pressing plate 85 attached to the rod 84a of the air cylinder 84.

Regarding the other delivery means 73,
An arm 89 formed in a substantially U shape and extending in the front-rear direction (the arrow X direction and the opposite direction), and the arm 8
It has a guide member (not shown) for movably guiding 9 in the front-rear direction, and an air cylinder 90 for driving the arm 89. A pressing plate 89a for pressing the magazine on the magazine conveying means 41 is provided at the front end of the arm 89.

As is clear from the above description, the magazine transporting means 41 is arranged opposite to the moving table 3 across the bonding stage 9 and at the same height as the bonding stage 9, while the loader is used. With respect to the first and second magazine transfer means for transferring the magazine between the magazine transfer means 41 and the unloader 16, the magazine is transferred in a direction intersecting the frame feed direction on the bonding stage 9. It is configured. That is, the arrangement positions of the magazine transporting means 41 and the first and second magazine transporting means are set so that they do not confuse with the moving table 3 and the bonding stage 9. Therefore, complication of the structures of the magazine conveying means 41, the first and second magazine transferring means, the moving table 3, the bonding stage 9 and the like is avoided.

Next, the operation of the wire bonding apparatus 1 having the above structure will be described with reference to FIGS. 4 to 11. The following operations are controlled by a control means such as a microcomputer (not shown).

When the operation button or the like for starting the work is operated, the belt 45 of the magazine conveying means 41 provided in each of the four wire bonding apparatuses 1 shown in FIG. 1 is operated, and the respective belts 45 are operated accordingly. Magazines are sequentially supplied from a supply device (not shown) arranged in the preceding stage of the wire bonding apparatus 1, and as shown in FIGS. 4 and 5, on the magazine conveying means 41 of each wire bonding apparatus 1 and the separating means 5.
A total of two magazines M are brought over, one above 1 and 71. As shown in the figure, in the magazine M positioned directly above the detaching means 51, I as a semiconductor component is placed.
Multiple lead frames L \ with C chips attached respectively
F is arranged and housed. Further, the lead frame is not accommodated in the magazine M positioned directly above the detaching means 71 and is empty. Note that these magazines M are formed in a substantially rectangular parallelepiped shape, and both front and rear ends are open.

As shown in FIG. 5, when the two magazines M that have been conveyed reach directly above the detaching means 51 and 71, respectively, this is detected by a sensor (not shown), and the magazine conveying means 41 is detected based on the detection signal. Is stopped. Then, as shown in FIG. 6, the releasing means 51 and 71 are operated, and the movable bases 59 and 79 respectively provided in the releasing means 51 and 71 are slightly raised from the lowest position. As a result, the two magazines M on the magazine conveying means 41 are lifted by the movable bases 59 and 79 and separated from the magazine conveying means 41.

Then, as shown in FIG. 7, the delivery means 5
The air cylinders 64 and 84 included in the air cylinders 2 and 72 are projected, and the pressing plates 65 and 85 provided at the rod tips of the air cylinders 64 and 84 are removed by the separating means 51 and 7.
Press both magazines M on 1 and each magazine M is a guide member 5
After passing through 5, 75, the loader 15 and the unloader 16 are transferred onto the lifting members 17, 27 respectively. Note that FIG.
In FIG. 3, the transfer means 52 and 72 are drawn in a state of being separated from the magazine M, but this is for the purpose of avoiding complication of the drawing, and in reality, both are positioned close to each other. Further, as shown in FIG. 7, each magazine M has a loader 1
5 and the unloader 16, at the same time, the movable bases 59, 79 of the detaching means 51, 71 carrying the magazines M are lowered to the lowest position again.

When the magazine M is placed on the elevating members 17 and 27 of the loader 15 and the unloader 16 as described above, this is detected by a sensor (not shown) and a detection signal is emitted. Then, as shown in FIG. 8, the pusher 25 of the frame take-out means 24 is operated, and the loader 15
Of the plurality of lead frames L \ F arranged in the upper magazine M, for example, the uppermost lead frame is taken out onto the bonding stage 9. As shown in FIGS. 7 and 8, the air cylinders 64 and 84 of the delivery means 52 and 72 are retracted and returned to their original state.
The lead frame L \ F taken out onto the bonding stage 9 is clamped by a carrying mechanism (not shown) and is intermittently fed by the arrangement pitch of the IC chips carried by the lead frame L \ F. Heated to temperature. And at the same time, the bonding head 7
The XY drive mechanism 5 is operated, and the pads (electrodes) on the IC chip and the leads formed in the lead frame L \ F are bonded by wires.

When the lead frame L \ F is bonded as described above, the lead frame is provided with a frame accommodating means (not shown) provided in the unloader 16 (this frame accommodating means is substantially the same as the frame extracting means 26 described above). It is stored in an empty magazine M on the unloader 16. After that, the loader 15 and the unloader 16 are operated, and the elevating bases 17 and 27 respectively provided therein are raised by one pitch of the lead frame array pitch in the magazine M. As a result, on the loader 15, the lead frame located at the lower stage of the above-mentioned bonded lead frame L \ F is positioned corresponding to the bonding stage 9. Then, the same operation as that for the first lead frame is performed on the second lead frame, bonding is performed, and the lead frame is stored in the magazine M on the unloader 16. After that, the series of operations described above is repeated for all the lead frames in the magazine on the loader 15 to perform bonding.

In the above operation, the magazine M
Among the lead frames L \ F in the above, the uppermost one is sequentially taken out and bonded.
During the bonding operation, the magazine M is once raised to a large extent, and the lead frame L \ F at the bottom of the magazine M is raised.
You may take out in order and bond.

Thus, when the bonding is completed for all the lead frames L \ F in the magazine M, as shown in FIG.
As shown in FIG. 5, the elevating members 17 and 27 of the loader 15 and the unloader 16 are lowered, and the two magazines M are placed on the guide members 55 and 75. Then, as shown in the figure, the movable bases 59 and 79 of the separating means 51 and 71 are lifted to enter the standby state. Then, as also shown in FIG. 10, the transfer means 53 and 73 are activated to operate the respective arms 6
9, 89 move forward and push both magazines M forward. Therefore, as shown in FIG. 10, each magazine M is delivered onto each movable base 59, 79 of the detaching means 51, 71. After that, as shown in FIG. 11, the detaching means 51 and 71 are actuated, the movable bases 59 and 79 carrying both magazines M are lowered to the lowest position, and each magazine M is placed on the magazine conveying means 41. Placed.

Thereafter, the belt 45 of the magazine conveying means 41
Is driven, both magazines M are carried out toward the subsequent stage, and the magazine M containing the lead frame L \ F after bonding is collected. Further, the emptied magazine M is sent back to a supply device (not shown) arranged in front of each wire bonding device 1 and reused.

After that, the above series of operations is repeated,
Bonding is continuously performed on the lead frames housed in the magazines sequentially supplied from the preceding stage.

The movable table 3 and the bonding stage 9 are arranged so as to intersect at right angles to the magazine transport direction by the magazine transport means 41 by appropriately changing and using the magazine transport means disclosed in this embodiment. It is also possible that the magazine transport direction and the lead frame feed direction are orthogonal to each other.

[0062]

As described above, since the bonding apparatus according to the present invention is equipped with the magazine, it suffices to substantially replace the magazine when changing the type of the frame, and one frame can be used for various types of frames. There is an effect that it can be handled and that various frames can be dealt with quickly and easily. Further, the bonding apparatus according to the present invention has a magazine transfer means for transferring a magazine, and a magazine transfer means for transferring the magazine between the loader and unloader and the magazine transfer means. Due to such a constitution, a plurality of bonding apparatuses can be arranged in a line as a line so that the conveying paths of the magazine conveying means provided in each of them are continuous with each other, and can be continuously operated. There is an effect that a further speedup is achieved. Further, in the bonding apparatus according to the present invention, the magazine carrying means is arranged facing the moving table and at the same height as the bonding stage, while the magazine carrying means carries the magazine carrying means by the magazine carrying means. The magazine is configured to be transported in a direction intersecting the direction. That is, the arrangement positions of the above-mentioned magazine transport means and magazine transfer means are set so that they do not confuse with the moving table and the bonding stage. Therefore, the structure of the magazine conveying means, the magazine transferring means, the moving table, the bonding stage and the like is prevented from being complicated, the structure of the bonding apparatus as a whole is extremely simple, and the repair and adjustment are easy. Further, in the bonding apparatus according to the present invention, it is possible to effectively use the magazine whose frame has been discharged and which has become empty, so that the number of magazines to be prepared can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which a plurality of wire bonding apparatuses according to the present invention are arranged in a line.

FIG. 2 is a perspective view of a wire bonding apparatus according to the present invention.

FIG. 3 is an enlarged view of a part of the wire bonding apparatus shown in FIG.

4 is an operation explanatory view of the wire bonding apparatus shown in FIG.

5 is an operation explanatory view of the wire bonding apparatus shown in FIG.

6 is an operation explanatory view of the wire bonding apparatus shown in FIG.

FIG. 7 is an operation explanatory view of the wire bonding apparatus shown in FIG.

FIG. 8 is an operation explanatory view of the wire bonding apparatus shown in FIG.

9 is an operation explanatory view of the wire bonding apparatus shown in FIG.

10 is an operation explanatory view of the wire bonding apparatus shown in FIG.

11 is an operation explanatory view of the wire bonding apparatus shown in FIG.

FIG. 12 is a perspective view of a conventional bonding apparatus.

[Explanation of sign]

 1 Wire Bonding Device 3 Moving Table 5 XY Driving Mechanism 9 Bonding Stage 11 Bonding Arm 15 Loader 16 Unloader 24 Frame Extracting Means 41 Magazine Conveying Means 51, 71 Detaching Means 52, 53, 72, 73 Delivery Means 55, 75 Guiding Member

Claims (3)

[Claims] 1. A bonding stage and at least two
Bonding means having a movable table movable in the dimensional direction and a bonding arm mounted on the movable table, and the frames are sequentially taken out from a magazine capable of accommodating a plurality of frames on which semiconductor components are mounted, respectively, and the bonding is performed. A loader that sends it on stage,
A bonding apparatus having an unloader for accommodating the bonded frame in a magazine, comprising a magazine carrying means for carrying and carrying the magazine, and between the loader and the unloader and the magazine carrying means, and A magazine transfer means for transferring the magazine in a direction intersecting with a magazine transfer direction by the magazine transfer means, the magazine transfer means being arranged at a position substantially opposite to the movable table and substantially at the same height position as the bonding stage. A bonding device characterized by being installed. 2. The bonding apparatus according to claim 1, wherein the magazine transporting unit can receive the magazine supplied from the front stage and perform bypass transport toward the rear stage. 3. The magazine transfer means includes a detaching means for detaching the magazine from the magazine transporting means, a delivering means for delivering the magazine on the detaching means to the loader and the unloader, and on the loader and the unloader. The bonding apparatus according to claim 1 or 2, further comprising another delivery means for delivering the magazine onto the detaching means.