JPH05291340A - Bonding device - Google Patents

Abstract

PURPOSE:To provide a bonding device which can cope with change in frame types to be handled rapidly and easily, speeds up bonding operation, and is simple in structure. CONSTITUTION:A frame L/F can be changed rapidly and easily by providing a magazine M and then replacing it by a new one. Also, a magazine transport means 31 and magazine transport means 41, 42, and 43 for supplying and collecting the magazine M for a loader/unloader 15 are provided for forming a line and speeding up operation. Furthermore, the magazine transport means 31 and a magazine transfer means are laid out so that they do not cross a bonding stage 9 etc. and the structure is simplified.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention receives a large number of lead frames each having an IC chip, that is, a semiconductor component mounted thereon, and wires the pads (electrodes) of the IC chips and the leads provided on the lead frames. The present invention relates to a bonding apparatus for bonding by using.

[0002]

2. Description of the Related Art A conventional example of such a bonding apparatus is shown in FIG.
3 shows. This bonding apparatus is installed as a line along with a die bonder apparatus and a curing apparatus (not shown). In the die bonder device, a large number of IC chips obtained by cutting a wafer are sequentially mounted at predetermined positions on a lead frame L \ F by using, for example, a thermosetting adhesive, and a curing device at a subsequent stage is mounted. It is something to send to. In addition, the curing device receives the lead frame sent from the die bonder device,
After heating to solidify the adhesive, the adhesive is sent to the bonding device arranged in the subsequent stage, and
The bonding apparatus receives the lead frame and bonds the leads formed on the lead frame and the pads on the IC chip mounted on the lead frame with a wire made of gold, aluminum or the like. To do.

The bonding apparatus is disclosed in Japanese Patent Laid-Open No. Hei 3
Since it is disclosed in Japanese Laid-Open Patent Publication No. 155140, a detailed description of each mechanism included therein will be omitted.

In FIG. 13, a bonding head 202 is provided on a main body 201 (illustrated by a chain double-dashed line) of this bonding apparatus. Bonding head 202
Includes a camera having a camera head, a lens, and an illuminating lamp, and is mounted on a moving table that is equipped with an XY table driving mechanism (not shown) and can be moved two-dimensionally.

A bonding stage (not shown: a stage for carrying a portion of the entire length of the lead frame L \ F on which an IC chip to be bonded and a plurality of IC chips before and after the bonding are mounted are carried by the bonding head 202. The lead frame L \ F and the IC chip, which are the parts to be bonded, are imaged, and the leads of the lead frame and the pads on the IC chip are bonded. This lead frame L \ F
Is adjusted and adjusted to the optimum spacing position by the first guide rail 203a and the second guide rail 203b.
A third transport mechanism 204 is provided in parallel with the first and second guide rails 203a and 203b. The third transport mechanism 204 is composed of a plurality of pulleys and a belt wound around the pulleys, and is driven by a motor 204g. And, in the vicinity of the third transport mechanism 204,
Sensor 205 for detecting arrival of lead frame L \ F
Are arranged.

Next, the conveying means on the lead frame receiving side will be described.

The transfer means is composed of first and second transfer mechanisms 20.
6, 207. The first and second transport mechanisms 206 and 207 are driven by one motor 208.

First and second transport mechanisms 206 and 207
Are provided in parallel on the loader unit 209 in a direction parallel to the longitudinal direction of the first and second guide rails 203a and 203b. The end of the loader unit 209 is connected to the tip of the rod of the front-rear slide cylinder 210, and the first and second guide rails 203a,
The main body 20 in the direction J orthogonal to the longitudinal direction of 203b.
The upper surface of 1 is movable. The timing of moving the cylinder (switching means) 210 back and forth is controlled by a control circuit such as a microprocessor (not shown), and the operating position of the rod of the cylinder is the center of the first and second transfer mechanisms 206 and 207. Control is performed so that the centers of the first and second guide rails 203a and 203b and the center of the third transport mechanism 204 (shown by a chain line) coincide with each other. The first and second transport mechanisms 206, 2
Reference numeral 07 has substantially the same configuration as the above-described third transport mechanism 204, and includes a plurality of pulleys and a belt wound around the pulleys. In addition, the first and second transport mechanisms 206, 20
7 includes first and second guide rails 203a, 203
Lead frame detection sensors 211 and 212 are arranged near the lead frame supply side to b.

Next, the fourth and fifth transport mechanisms 213, 2
Reference numeral 14 has the same configuration as the first and second transport mechanisms 206 and 207 described above, and is provided on the lead frame delivery side. The third and fourth transport mechanisms 213 and 21
4 is also 1 like the first and second transport mechanisms 206 and 207.
It is driven by one motor 215. Further, lead frame detection sensors 216 and 217 are provided.

Fourth and fifth transport mechanisms 213 and 214
Are provided in parallel on the unloader unit 218 in a direction parallel to the longitudinal direction of the first and second guide rails 203a and 203b. This unloader unit 21
The end of 8 is connected to the tip of the rod of the front-back slide cylinder 219, and the first and second guide rails 2
The upper surface of the main body 201 is movable in a direction J orthogonal to the longitudinal direction of 03a and 203b.

In the vicinity of the second transport mechanism 207,
A lead frame pusher cylinder 220 for pushing the lead frame L \ F on the second transport mechanism 207 onto the guide rails 203a and 203b is arranged.

Next, the operation of the bonding apparatus having the above structure will be described.

First, from the state shown in FIG. 13, the rod of the cylinder 210 on the lead frame receiving side is projected and the loader unit 209 moves forward, so that the second transport mechanism 207 is moved.
Are aligned with the third transport mechanism 204 and the fifth transport mechanism 214. In this state, each transport mechanism 2
04, 206, 207, 213, 214 are driven, and at the same time, the lead frame L \ F that has passed through the curing device in the previous stage is supplied in the direction of the arrow and brought onto the second transport mechanism 207. This lead frame L \ F detects the sensor 21
When 2 is detected, each transport mechanism is stopped. After that, the cylinder 210 is operated in the absorbing direction, and the loader unit 209 is returned to the position shown in FIG.

Next, the lead frame pusher cylinder 220 is operated, and the lead frame L \ F on the second transport mechanism 207 is moved to the first and second guide rails 20.
3a, 203b is extruded. This guide rail 2
The lead frames L \ F sent to the parts 03a and 203b are clamped by a carrying means (not shown) and are intermittently fed one pitch at a time, and then heated to a predetermined temperature and bonded on the bonding stage. Next, the lead frame L \ bonded on the bonding stage
F is carried out onto the fourth transport mechanism 213, detected by the lead frame detection sensor 216, and the rotation of the motor is stopped. Then, the cylinder 219 is operated in the projecting direction and the unloader unit 218 moves forward. Then, each of the above-mentioned transport mechanisms is operated, and the lead frame L \ F to which the bonding is performed is sent out to the subsequent stage.

As described above, the conventional bonding apparatus has a structure in which the lead frames L \ F supplied one by one from the die bonder apparatus at the preceding stage through the curing apparatus are sequentially received and bonded.

[0016]

However, in such a conventional bonding apparatus, when considering that the type of the lead frame to be bonded is changed, each of the transfer mechanisms for transferring the lead frame is It is necessary to perform work for replacement or adjustment so as to correspond to a newly handled lead frame, and there is a disadvantage that a great deal of labor and time must be spent.

Further, in the above-mentioned conventional bonding apparatus, although the efficiency of the bonding work has been improved to some extent, there is a tendency that further speeding up is desired recently.

The present invention has been made in view of the above-mentioned drawbacks of the prior art. It is possible to deal with various lead frames quickly and easily, and at the same time, the bonding work can be speeded up. An object is to provide a bonding device having a simple structure.

[0019]

A bonding apparatus according to the present invention comprises a bonding stage, a movable table movable in at least two-dimensional directions, a bonding means having a bonding arm mounted on the movable table, and a semiconductor component, respectively. Bonding apparatus having a loader and an unloader for sequentially taking out the frames from a magazine capable of accommodating a plurality of frames mounted thereon and sending the frames onto the bonding stage and receiving the bonded frames and accommodating them in the magazine A magazine transporting means for carrying the magazine and transporting the magazine between the loader / unloader and the magazine transporting means and in a direction intersecting with a magazine transporting direction by the magazine transporting means. And a transfer means, the magazine conveyor means is that configured to be disposed substantially same height position as and the bonding stage so as to face the moving table.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a wire bonding apparatus as an embodiment of the present invention will be described with reference to the accompanying drawings.
In addition, although wire bonding is described as an example in the present embodiment, the present invention is of course applicable to tape bonding and the like.

As shown in FIG. 1, for example, four wire bonding apparatuses 1 according to the present invention are installed side by side in a line as a line.

As shown in FIG. 2, on the main body 2 of the wire bonding apparatus 1 and at the rear, a movable table 3 which is two-dimensionally movable and a driving means (not shown) for driving the movable table 3 are provided. ), An XY drive mechanism 5 and a bonding head 7 mounted on the moving table 3.
Bonding stage 9 (This bonding stage refers to an IC chip to be bonded and a plurality of ICs before and after bonding, in the entire length of a lead frame described later.
The stage portion that carries the portion on which the chip is mounted).

Although not described in detail because it is well known, the bonding head 7 has a capillary (not shown) at its tip.
A bonding arm 11 mounted directly above the bonding stage 9 and the bonding arm 1
A contact / separation means (not shown) for supporting and supporting the lead frame 1 on the bonding stage 9 with respect to the lead frame (described later).
And a camera (not shown) for picking up an image of the IC chip on the lead frame, and the like.

A loader / unloader 15 is provided on the side of the bonding stage 9. The loader / unloader 15 carries a magazine (described later), sequentially takes out the lead frames arrayed and housed in the magazine and sends them to the bonding stage 9, and at the same time, the lead frames bonded on the bonding stage 9 are removed. It is to be stored again in the magazine and has the following structure.

As shown, the loader / unloader 1
5 is formed to have a substantially L-shaped cross section.
It has an elevating member 17 that can carry one magazine, and a guide member (not shown) that guides the elevating member 17 in the vertical direction (the arrow Z direction and the opposite direction). The magazine is attachable to and detachable from the elevating member 17, and is fixed to the elevating member 17 by a lock means (not shown) mounted on the elevating member 17. Behind the elevating member 17, a long worm 19 is rotatably provided so as to extend in the vertical direction in which the elevating member 17 should move. A ball screw may be used instead of this worm 19. Also,
The same applies to worms used in other mechanical parts described later.

A belt wheel 20 is fitted on the upper end of the worm 19. A motor 21 is disposed near the belt wheel 20, and a belt 23 is wound around the belt wheel 22 and the belt wheel 22 fixed to the output shaft of the motor.

On the other hand, a nut (not shown) is fixed to the rear surface of the elevating member 17, and the nut is attached to the worm 1.
It is screwed to 9.

The lifting member 17 and the worm 19 described above.
, Belt wheels 20, 22, a motor 21, and a belt 23
And the above-mentioned nut screwed into the worm 19 are collectively referred to as magazine positioning means. That is, the magazine positioning means appropriately moves and positions the carried magazine in the lead frame arranging direction of the magazine by controlling the operation of the motor 21.

Further, the loader / unloader 15 carries out bonding on the bonding stage 9 with a frame take-out means 26 for sequentially taking out the lead frames one by one from the magazine positioned by the magazine positioning means and sending them to the bonding stage 9. And a frame storing means (not shown) for storing the formed lead frame in the magazine again. As shown in the figure, the frame take-out means 26 comprises a pusher 27 for abutting each lead frame in the magazine so as to project the lead frame out of the magazine, and an air cylinder 28 for reciprocating the pusher 27. Also, the frame storing means,
It is constructed similarly to the frame take-out means.

As described above, the loader / unloader 15
Not only takes out the lead frame from the magazine, but also stores the bonded lead frame again in the original magazine. Therefore, the structure is simple as compared with the configuration in which the loader that only takes out the lead frame from the magazine and the unloader that only stores the lead frame are separately provided.

On the other hand, as shown in the figure, on the main body 2 and in the front part, a magazine carrying means 31 for carrying a magazine and carrying it is provided. More specifically, the magazine conveying means 31 is arranged so as to sandwich the bonding stage 9 so as to face the moving table 3 and to be at substantially the same height as the bonding stage 9.

As shown in the figure, the magazine conveying means 31 is
For example, twelve relatively long belt wheels 33 and 34 extending in parallel to each other (for convenience of explanation, only two of these twelve wheels are designated by reference numeral 34),
Two endless belts 35, which are wound around the belt wheels 33 and 34 in parallel and carry a magazine for carrying the magazines, and belt wheels 33, 3 for driving the belts 35.
4 and a torque applying means (not shown) such as a motor for applying a torque to any one of the four. It should be noted that both belts 35 do not carry the magazine by themselves, but a carrying member (not shown) attached below the upper side of each belt.
Receives the load of the magazine.

Further, as is clear from the figure, the magazine conveying means 31 is set so that its entire length is equal to or slightly larger than the width dimension of the main body 2. As a result, as shown in FIG. 1, a plurality of wire bonding apparatuses 1 are provided in each of the magazine conveying means 31 provided with the wire bonding apparatus 1.
It is possible to arrange each of the wire bonding apparatuses 1 in a line so that the transfer paths of the above are continuous so as to be continuous with each other. That is, when a plurality of wire bonding apparatuses 1 are arranged in a line as a line in this way, the magazine conveying means 31 included in each wire bonding apparatus 1 receives the magazine supplied from the former stage and performs the bypass conveyance toward the latter stage. Since it is possible to do so, it is not necessary to individually mount or collect magazines for each of these wire bonding apparatuses 1, and if a plurality of magazines are supplied from the wire bonding apparatus 1 arranged in the first stage, these magazines can be bypass-transported. Then, the lead frames in the respective magazines can be bonded by being distributed to the respective wire bonding devices in the subsequent stage, and the magazines can be collected through the wire bonding devices arranged in the final stage.

Next, the magazine transfer means for transferring the magazine between the above-mentioned magazine transfer means 31 and the above-mentioned loader / unloader 15 will be described. The magazine transfer means is a front-back direction (arrow X direction and the opposite direction) perpendicular to the left-right direction (arrow Y direction and the opposite direction) which is the lead frame feeding direction on the bonding stage 9. Transfer at.

In FIG. 2, the magazine transfer means is
A detaching means 41 for slightly lifting the magazine on the magazine transporting means 31 upward to remove it from the magazine transporting means 31, and delivering the magazine on the detaching means 41 onto the elevating member 17 provided in the loader / unloader 15. It has a first delivery means 42 and, conversely, a second delivery means 43 which delivers the magazine on the elevating member 17 onto the detaching means 41. When the magazines are delivered by the first and second delivery means 42, 43, the loader / unloader 1
Two guide members 45 for supporting and supporting the magazine are provided between the magazine 5 and the magazine conveying means 31, and
It is fixed to the main body 2.

First, the structure of the separating means 41 will be described in detail below.

As shown in the figure, the detaching means 41 is formed in a generally U-shape as a whole and is arranged so as to extend in the up-down direction (the arrow Z direction and the opposite direction), and has an upper end portion 1 Movable base 49 capable of carrying one magazine
A guide member (not shown) for movably guiding the movable base 49 in the vertical direction, and a long worm which is provided in parallel with the guide member and is coupled at the upper end to the lower end of the movable base 49. It has 51 and a drive means 52 for moving the worm 51 up and down. Although not shown, the drive means 52 is composed of a nut screwed into the worm 51, a motor for rotating the nut to drive the worm 51, and the like. Further, as is particularly clear from FIG. 3, an elongated receiving plate 49a for receiving the magazine is provided at the upper end of the movable base 49. As shown in FIG. 3, when the movable base 49 is at the lowest position, the receiving plate 49a is located below the magazine carrying surface of the magazine conveying means 31. That is, as shown in the figure, both belts 35 included in the magazine conveying means 31 are formed into a shape in which a part thereof is bent into a substantially V shape by the two belt wheels 34, and the receiving plate 49a is provided in this V-shaped bent portion. It is inserted freely. Further, as illustrated, the movable base 49 is inserted between the belts 35.

On the other hand, the first delivery means 42 comprises an air cylinder 54 and a pressing plate 55 attached to a rod 54a of the air cylinder 54.

Regarding the second delivery means 43, an arm 59 which is formed in a substantially U shape and extends in the front-rear direction (the direction of arrow X and the opposite direction), and the arm 59.
A guide member (not shown) that movably guides the vehicle in the front-rear direction, a worm 61 that is provided in parallel with the guide member and that is connected at one end to the rear end of the arm 59, and the worm 61 reciprocates And a drive means 62 for urging.
Although not shown, the driving means 62 is composed of a nut screwed into the worm 61, a motor for rotationally driving the worm 61 to drive the worm 61, and the like. A pressing plate 59a for pressing the magazine on the magazine conveying means 31 is provided at the front end of the arm 59.

As is clear from the above description, the magazine transporting means 31 is arranged facing the moving table 3 across the bonding stage 9 and at the same height as the bonding stage 9, while The magazine transfer means for transferring the magazine between the magazine transfer means 31 and the loader / unloader 15 is configured to transfer the magazine in a direction intersecting the frame feed direction on the bonding stage 9. That is, the arrangement positions of the magazine transfer means 31 and the magazine transfer means are set so that they do not confuse with the moving table 3 and the bonding stage 9. Therefore,
It is possible to avoid complication of the structure of the magazine conveying means 31, the magazine transferring means, the moving table 3, the bonding stage 9 and the like.

Next, the operation of the wire bonding apparatus 1 having the above structure will be described with reference to FIGS. 4 to 12. The following operations are controlled by a control means such as a microcomputer (not shown).

When the operation button or the like for starting the work is operated, the belt 35 of the magazine conveying means 31 provided in each of the four wire bonding apparatuses 1 shown in FIG. 1 is actuated, and the respective belts 35 are operated accordingly. Magazines are sequentially supplied from a supply device (not shown) arranged in the preceding stage of the wire bonding device 1, and each of the wire bonding devices 1 is supplied as shown in FIG.
One magazine M is brought onto the magazine transport means 31 of FIG. As shown in the figure, in the magazine M, a plurality of lead frames L \ F each having an IC chip as a semiconductor component mounted therein are arranged and housed. The magazine M is formed in a substantially rectangular parallelepiped shape, and its front and rear ends are open.

As shown in FIG. 4, when the conveyed magazine M reaches just above the detaching means 41, this is detected by a sensor (not shown), and the magazine conveying means 31 is stopped based on the detection signal. Then, as shown in FIG. 5, the releasing means 41 is actuated, and the movable base 49 included in the releasing means 41 is slightly raised from the lowest position together with the worm 51 integrated with the movable base 49. As a result, the magazine M on the magazine conveying means 31 is lifted by the movable base 49 and separated from the magazine conveying means 31.

Then, as shown in FIGS. 6 and 7, the first
The projecting operation of the air cylinder 54 included in the delivery means 42 is performed, the pressing plate 55 provided at the tip of the rod of the air cylinder 54 pushes the magazine M on the separating means 41, and the magazine M passes through the guide member 45 and the loader.・ Unloader 15
It is delivered onto the lifting member 17 of the. 6 and 7, the first delivery means 42 is drawn in a state of being separated from the magazine M, but this is for the purpose of avoiding complication of the drawing. is doing. Further, as shown in FIGS. 6 and 7, at the same time as the magazine M is transferred to the loader / unloader 15, the movable base 49 of the detaching means 41 carrying the magazine M is lowered to the lowest position again. Be punished.

When the magazine M is placed on the elevating member 17 of the loader / unloader 15 as described above, this is detected by a sensor (not shown) and a detection signal is issued. Then, as shown in FIG. 8, the pusher 27 of the frame take-out means 26 is actuated, and of the lead frames L \ F arranged in the magazine M, for example, the uppermost lead frame is placed on the bonding stage 9. Taken out. As shown in the figure, the air cylinder 54 of the first delivery means 42 is retracted and returns to its original state. The lead frame L \ F taken out onto the bonding stage 9 is clamped by a carrying mechanism (not shown) and is intermittently fed by the arrangement pitch of the IC chips carried by the lead frame L \ F. Heated to temperature. At the same time, the bonding head 7 and the XY drive mechanism 5 are operated, and the pads (electrodes) on the IC chip and the leads formed on the lead frame L \ F are bonded by wires.

When the lead frame L \ F is bonded as described above, the lead frame is accommodated by a frame accommodating means (not shown) (this frame accommodating means has substantially the same structure as the frame extracting means 26). It is stored in the original magazine M. After this, loader
The unloader 15 operates and the lifting base 17 provided therein
However, the pitch is increased by one pitch of the lead frame arrangement pitch in the magazine M. As a result, the lower lead frame of the housed lead frame L \ F is positioned corresponding to the bonding stage 9. Then, the same operation as that for the first lead frame is performed on the second lead frame, bonding is performed, and the lead frame is housed in the magazine M. Thereafter, for all lead frames in the magazine. Then, the series of operations described above is repeated to perform bonding.

In the above operation, the magazine M
Among the lead frames L \ F in the above, the uppermost one is sequentially taken out and bonded.
During the bonding operation, the magazine M is once raised to a large extent, and the lead frame L \ F at the bottom of the magazine M is raised.
You may take out in order and bond.

Thus, when bonding is completed for all lead frames L \ F in the magazine M, as shown in FIG.
As shown in FIG.
Is lowered, and the magazine M is placed on the guide member 45. Then, as shown in FIG. 10, the movable base 49 of the detaching means 41 rises and enters the standby state. And FIG.
As also shown, the second delivery means 43 is activated and its arm 59 moves forward together with the worm 61, pushing the magazine M forward. Therefore, as shown in FIG. 12, the magazine M is delivered onto the movable base 49 of the detaching means 41. After that, the detaching means 41 is operated, the movable base 49 carrying the magazine M is lowered to the lowest position, and the magazine M is placed on the magazine conveying means 31.

Thereafter, the belt 35 of the magazine conveying means 31
Is driven, and the magazine M is carried out toward the subsequent stage and collected.

After that, the above series of operations are repeated,
Bonding is continuously performed on the lead frames housed in the magazines sequentially supplied from the preceding stage.

The movable table 3 and the bonding stage 9 are arranged so as to intersect at right angles to the magazine transport direction by the magazine transport means 31 by appropriately changing and using the magazine transport means disclosed in this embodiment. It is also possible that the magazine transport direction and the lead frame feed direction are orthogonal to each other.

[0052]

As described above, since the bonding apparatus according to the present invention is equipped with the magazine, it suffices to substantially replace the magazine when changing the type of the frame, and one frame can be used for various types of frames. There is an effect that it can be handled and that various frames can be dealt with quickly and easily. Further, the bonding apparatus according to the present invention has a magazine transfer means for transferring a magazine, and a magazine transfer means for transferring the magazine between the loader / unloader and the magazine transfer means.
Due to such a constitution, a plurality of bonding apparatuses can be installed in parallel as a line so that the transportation paths of the magazine transportation means provided in each of them are continuous with each other, and can be continuously operated. There is an effect that a high speed is achieved. Further, in the bonding apparatus according to the present invention, the loader / unloader provided therein not only takes out the frame from the magazine, but also stores the bonded frame again in the original magazine. Therefore, there is an effect that the structure is simple as compared with a configuration in which a loader that only takes out the frame from the magazine and an unloader that only stores the frame are separately provided. Further, in the bonding apparatus according to the present invention, the magazine carrying means is arranged facing the moving table and at the same height as the bonding stage, while the magazine carrying means carries the magazine carrying means by the magazine carrying means. The magazine is configured to be transported in a direction intersecting the direction. That is, the arrangement positions of the above-mentioned magazine transport means and magazine transfer means are set so that they do not confuse with the moving table and the bonding stage. Therefore, the structure of the magazine conveying means, the magazine transferring means, the moving table, the bonding stage, etc. is avoided, and the structure of the bonding apparatus as a whole is combined with the simplification of the structure based on the configuration of the loader / unloader described above. This has the effect of making it extremely simple and easy to repair and adjust.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which a plurality of wire bonding apparatuses according to the present invention are arranged in a line.

FIG. 2 is a perspective view of a wire bonding apparatus according to the present invention.

FIG. 3 is an enlarged view of a part of the wire bonding apparatus shown in FIG.

4 is an operation explanatory view of the wire bonding apparatus shown in FIG.

5 is an operation explanatory view of the wire bonding apparatus shown in FIG.

6 is an operation explanatory view of the wire bonding apparatus shown in FIG.

FIG. 7 is an operation explanatory view of the wire bonding apparatus shown in FIG.

FIG. 8 is an operation explanatory view of the wire bonding apparatus shown in FIG.

9 is an operation explanatory view of the wire bonding apparatus shown in FIG.

10 is an operation explanatory view of the wire bonding apparatus shown in FIG.

11 is an operation explanatory view of the wire bonding apparatus shown in FIG.

FIG. 12 is an operation explanatory view of the wire bonding apparatus shown in FIG.

FIG. 13 is a perspective view of a conventional bonding apparatus.

[Explanation of sign]

 1 Wire Bonding Device 3 Moving Table 5 XY Driving Mechanism 9 Bonding Stage 11 Bonding Arm 15 Loader / Unloader 26 Frame Extracting Means 31 Magazine Conveying Means 41 Detaching Means 42 First Delivery Means 43 Second Delivery Means 45 Guide Members

Claims (3)

[Claims] 1. A bonding stage and at least two
Bonding means having a movable table movable in the dimension and a bonding arm mounted on the movable table, and the frames are sequentially taken out from a magazine capable of accommodating a plurality of frames each having semiconductor components mounted thereon, While sending it out on the taing stage,
A bonding apparatus having a loader / unloader for accommodating the bonded frame in a magazine, comprising: a magazine carrying means for carrying and carrying the magazine; and a loader / unloader and the magazine carrying means, and A magazine transfer means for transferring the magazine in a direction intersecting with a magazine transfer direction by the magazine transfer means, the magazine transfer means facing the moving table and arranged at substantially the same height position as the bonding stage. Bonding device characterized by being installed. 2. The bonding apparatus according to claim 1, wherein the magazine transporting unit can receive the magazine supplied from the front stage and perform bypass transport toward the rear stage. 3. The magazine transferring means, a detaching means for detaching the magazine from the magazine transporting means, a first delivering means for delivering the magazine on the detaching means to the loader / unloader, and the loader / unloader. The bonding apparatus according to claim 1 or 2, further comprising: second delivery means for delivering the upper magazine onto the detaching means.