JP2618277B2 - Semiconductor manufacturing equipment - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a bonding apparatus, and more particularly to a bonding apparatus in which a lead frame manufactured by heating and curing by a die bonder apparatus and a heating apparatus is heated when the lead frame is transported to the bonding apparatus. The present invention relates to a semiconductor manufacturing apparatus provided with a lead frame cooling mechanism for cooling a lead frame.

[Background Art] Conventionally, a lead frame formed by die bonding with a die bonder device is formed by being heated and cured by a heating device such as an electric furnace. The heat-cured lead frame waits for the temperature to drop by natural cooling in the heating device, and then is sent to the bonding device for bonding.

[Problems to be Solved by the Invention] However, the conventional device has a drawback that it cannot be immediately sent to the bonding device because it waits until the temperature of the lead frame decreases. In addition, in the conventional apparatus, if the lead frame is sent onto the transfer mechanism on the bonding apparatus side before the temperature of the lead frame is lowered, the transfer mechanism is made of a resin belt or the like, and the belt or the like is damaged by heat. There is a disadvantage. This is usually performed in consideration of the balance of the processing capabilities of the die bonder apparatus side and the bonding apparatus side, and therefore, it is highly likely that the apparatus will be sent without being completely cooled, which is not preferable in view of the safety of the apparatus.

The present invention has been made in view of the above-mentioned disadvantages of the prior art,
When transporting the lead frame manufactured by heating and curing by the die bonder device and the heating device to the bonding device, the heated and cured lead frame is securely pressed onto the lead frame transport path surface by the lead frame pressing means,
Moreover, it is an object of the present invention to provide a semiconductor manufacturing apparatus provided with a lead frame cooling mechanism that can be cooled by a cooling means when the lead frame passes over the transfer path surface and transferred to the bonding apparatus side.

Means for Solving the Problems The present invention provides a die bonder device for performing die bonding from a semiconductor wafer to a lead frame, a heating device for heating and curing a lead frame die-bonded by the die bonder device, and a heating device for heating and curing the lead frame. A transport unit that transports the lead frame, a bonding device that performs bonding to the lead frame transported by the transport unit, and a cooling mechanism provided between the heating device and the bonding device. Transport means for transporting the heated lead frame; cooling means provided opposite the lead frame transport path surface of the transport means; support means for supporting the cooling means; and transport means provided on the support means. Direction separating from the lead frame transport path surface between the means and the cooling means Swingable lead frame pressing means, wherein the lead frame is pressed onto the conveying path surface by the lead frame pressing means and cooled by the cooling means when the lead frame passes over the conveying path surface. It is configured to be transported to a bonding device.

Example Next, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a view schematically showing a configuration of a lead frame transport mechanism of a bonding apparatus.

In FIG. 1, a bonding head 2 mounted on a main body of a bonding apparatus (shown by a two-dot chain line) 1
Includes a camera having a camera head, a lens, and an illumination lamp, and includes a bonding stage (this bonding stage is mounted on a bonding stage 2) mounted on an XY staple driving mechanism (not shown) movable in the X and Y directions. A plurality of chips before and after the bonding work section for performing bonding connection.) An IC chip (island), which is a part to be bonded, is imaged and the leads of the lead frame and the electrodes on the chip are imaged. Is bonded. A lead frame on which a chip to be imaged by the bonding head 2 is provided includes a first guide rail 3a and a second guide rail 3b.
The position is adjusted to the optimal interval position. These first
In this embodiment, the distance between the second guide rails 3a and 3b and both ends of the lead frame is set to about 0.1 mm. A third transport mechanism 4 is provided in parallel with the first and second guide rails 3a and 3b. The third transport mechanism 4 includes a pair of rollers 4a and 4b supported by one shaft, and two belts 4 extending between the rollers 4a and 4b.
c, 4d, the roller 4b is formed by a double roller, and the roller 4b and the other
4f, the roller shaft and the shaft of the drive motor 4g are connected and driven. 4g of this drive motor
Belts 4c and 4d of the third transport mechanism 4 by the rotational driving force of
Is configured to be rotatable forward and backward. These two belts 4c
A detection sensor 5 for detecting the arrival of the lead frame is disposed in the vicinity of the unloader side (lead frame transport direction) at the center between the positions 4d and 4d. The detection sensor 5 is constituted by a reflection type optical sensor or the like.

 Next, the transfer means on the loader side will be described.

The transfer means on the loader side (lead frame supply side) is the first
And second transport mechanisms 6 and 7. The first and second transport mechanisms 6 and 7 are driven by one motor 8.

First, the first and second transport mechanisms 6 and 7 are provided on the loader unit 9 in parallel in a direction parallel to the longitudinal direction of the first and second guide rails 3a and 3b. The end of the loader unit 9 is a cylinder 10 for sliding back and forth.
Of the bonding apparatus 1 in a direction orthogonal to the longitudinal direction of the first and second guide rails 3a and 3b. The timing control of the forward and backward movement of the cylinder (switching means) 10 is controlled by a control circuit comprising a microprocessor or the like (not shown), and the forward and backward positions of the cylinder are controlled by the first and second transport mechanisms 6 and 7. The center is controlled so that the center of the first and second guide rails 3a and 3b coincides with the center of the third transport mechanism 4 (a portion indicated by a chain line). This control of the center position is, of course, adjustable. The first and second transport mechanisms 6 and 7
Has substantially the same configuration as the third transport mechanism 4 described above,
A pair of rollers 6a and 6b supported by two shafts are provided, and two belts 6 are stretched between the rollers 6a and 6b.
c and 6d are arranged in parallel, and the first and second transfer mechanisms 6 and 6 are driven by the other roller shaft 6b.
And 7 are connected, one of the rollers 6b of the first transport mechanism 6 is formed of a double roller, and the roller 6b and another roller 6e other than the above are wound around a belt 6f. The shaft of the roller 6e and the shaft of the drive motor 8 are connected so that the first and second transport mechanisms 6 and 7 are coaxially driven to rotate. Also, the first and second transport mechanisms 6 and 7 have a lead frame detection sensor 11 near the lead frame supply side to the first and second guide rails 3a and 3b,
12 are arranged.

Next, the fourth and fifth transport mechanisms 13 and 14 are connected to the first transport mechanism described above.
And the second transport mechanisms 6 and 7 are provided on the unloader side. The third and fourth transport mechanisms 13 and 14 are also driven by one motor similarly to the first and second transport mechanisms 6 and 7, but drive the fourth and fifth transport mechanisms 13 and 14. Alternatively, it may be driven by a drive motor that drives the motor. Also, lead frame detection sensor 15,1
Numeral 6 is disposed on the lead frame discharge side, that is, in the vicinity of the tip of the belt in FIG.

Next, FIGS. 2 and 3 are cross-sectional views showing the detailed configuration of the loader unit on which the first and second transport mechanisms of FIG. 1 are mounted, as viewed from a direction orthogonal to the lead frame transport direction. is there.

In FIG. 2, the first base 17 is fixed on the main body of the bonding apparatus 1. A cam 18 is provided on the first base 17. A continuous inclined surface is formed at the center of the cam surface of the cam 18 so that the cam 18 can be moved linearly. On the left side of the first base 17, a support frame 20 for supporting the front-rear slide cylinder 10 (16) is provided vertically. A second base 21 having a substantially U-shaped cross section is connected to the tip of the shaft of the cylinder 10. In this second base 21, a coupling 23 for receiving a connecting shaft 22 connecting the first and second transport mechanisms 6 and 7 is provided.
The other end of the connecting shaft 22 is connected to a motor shaft of the belt driving motor 8 fixed to the second base 21 via a coupling 23. First transport mechanism 6
As described with reference to FIG. 1, the support bases 24a and 24b for supporting the roller shaft on which the two belts are stretched are formed vertically on the second base 21. Similarly to the first transport mechanism 6, the second transport mechanism 7 also has support stands 25a and 25b for supporting a roller shaft formed vertically on the second base 21. A holding base 26 having a substantially U-shaped cross section is provided on both sides of the support bases 25a and 25b of the second transport mechanism 7, and a vertical guide 27 is provided on a side surface of the holding base 26. The vertical guide 27 is configured to fit in a groove formed in the bearing 23 and to be slidable up and down. Lower surface 26a of holding table 26
Is provided with a support 28, and a ball bearing 29 is rotatably provided at the tip of the support 28. The tip of the ball bearing 29 is in contact with the cam surface of the cam 18 through a hole 30 formed in the second base 21. Further, guide rails 31a and 31b having a substantially L-shaped cross section are provided at the upper end of the holding base 26. This guide rail 31
a and 31b are configured to be adjustable depending on the width of the lead frame. The height of the guide surfaces of the guide rails 31a and 31b is set so as to be at least equal to or substantially equal to the height of the transfer surface of the lead frame of the first and second guide rails 3a and 3b. .

The above configuration has the same configuration on the loader side and the unloader side.

The vertical operation including the loader unit 9 will be described below with reference to FIGS. 2 and 3.

FIG. 2 shows a state in which the shaft 10a of the cylinder 10 is being sucked, and the position of the second base 21 connected to the end of the shaft is controlled while being pulled. At this time, the first
The second transport mechanisms 6 and 7 are in a state where the first and second guide races 3a and 3b and the transport path of the third transport mechanism 4 are aligned, that is, the state shown in FIG. At this time, the bearing 29 provided on the lower surface of the holding base 26 is located at the uppermost portion of the cam surface.
Located at 18H. Therefore, when the lead frame is located on the lowermost portion 18L of the cam surface shown in FIG. 3, the lead frame placed on the belts 7c and 7d of the second transport mechanism 7 is changed to the holding table 26 by the suction action of the cylinder. Guide rails 31
The both ends of the lead frame are held and raised by a and 31b, and the lead frame is gently separated from the belts 7c and 7d. This is because the cam 18 allows for continuous movement. In the state shown in FIG. 2, the lead frame is also transferred onto the belt of the first transfer mechanism 6 from an external device (not shown). Therefore, in this state, the lead frame can be continuously transported on the transport path of the third transport mechanism 4.

Next, the lead frame placed on the guide surfaces of the guide rails 31a and 31b of the second transport mechanism 7 is moved by the lead frame pusher cylinder 19 to the first and second guide rails.
When extruded onto the conveying paths 3a and 3b, the shaft 10a of the forward / backward slide cylinder 10 projects and shifts to the state shown in FIG. That is, the second base 21 is moved from 18H to 18L along the cam surface. At this time, guide rail 3
Since the guide surfaces 1a and 31b are lowered to a position lower than the position of the upper surface of the belt (see FIG. 3), a new lead frame is transported from an external device (not shown). At this time, since the first transport mechanism 6 is located at a position deviated from the transport path, no lead frame is placed on the belt.

The above is the operation of the loader unit 9, and the same operation is performed on the unloader side.

Next, the path through which the lead frame is transported using the present apparatus will be described in detail with reference to FIGS.

First, the shaft 10a of the forward / backward slide cylinder 10 on the loader side protrudes from the state of FIG. 1 to move the loader unit 9 to the state of FIG. A lead frame (L / F) is supplied on the transport path of the second transport mechanism 7 in the direction of the arrow. When the detection sensor 12 detects the lead frame, the rotation of the transport drive motor 8 driving the belt is stopped by a command from the control circuit. Thereafter, the front and rear cylinders 10 operate in the suction direction, and the loader unit 9 is moved.
Is moved to the state shown in FIG. At this time, the transport paths of the first and second transport mechanisms 6 and 7 are stopped in accordance with the transport paths of the first and second guide rails 3a and 3b having the bonding stage and the transport path of the third transport mechanism 4. I do. Guide rails 31a and 31b of the second transport mechanism 7 shown in FIG.
The lead frame mounted on the first and second guide rails 3a is moved by the lead frame pusher cylinder 19.
And the lead frame is pushed out to the guide surface on 3b.
The lead frames sent onto the guide rails 3a and 3b are intermittently fed one pitch at a time while being clamped by a transport mechanism (not shown), and then heated to a predetermined temperature on a bonding stage for bonding. During this time, the transport path of the first transport mechanism 6 coincides with the transport path of the third transport mechanism 4, so that the fifth transport mechanism 14
The lead frame can be supplied via the.

Next, the lead frame bonded and connected on the bonding stage is discharged onto the transport path of the fourth transport mechanism 13 provided on the unloader side, and is detected by the lead frame detection sensor 15 and rotation of the motor is stopped. The front and rear cylinders 16 on the unloader side act in the protruding direction to move the unloader unit to the state shown in FIG.
Then, the lead frame for which the bonding connection has been completed is transported to the next device.

The above is a series of operations for bonding the lead frame using the transport mechanism of the present apparatus.

FIG. 7 shows the bonding devices C ₁ , C ₂ , and C _{3 on} which the above-described lead frame transfer mechanism is mounted, and the lead of the lead frame formed by the die bonder device A and the heating device B and the electrode on the chip. FIG. 4 is a diagram showing a system configuration of a semiconductor manufacturing apparatus from the time when wire bonding is performed using the bonding apparatus and the lead frame connected by bonding is housed in a magazine stocker apparatus D. In this embodiment, three bonding devices are shown, but more can be connected.

8 is a view showing one embodiment of the present invention, and is a front view showing a schematic configuration of a lead frame cooling mechanism, FIG. 9 is a plan view of FIG. 8, and FIG. 10 is a side view of FIG. It is. This lead frame cooling mechanism is indicated by reference numeral E in FIG.

The structure of the cooling mechanism of this lead frame is shown in FIGS.
This will be described with reference to FIG.

In the figure, an end 50a of a first base member 50 is fixed to a bonding device mounting portion Ca by bolts. A hook-shaped second base member 51 is fixed to the other end 50b of the first base member 50 with a bolt. A transport mechanism base 52 is fixed to the second base member 51, and a transport mechanism 55 is mounted on the transport mechanism base 52. A driving mechanism 60 for driving the transport mechanism 55 is provided on the first base member 50.
Is installed.

In the transport mechanism 55, roller frames 55a and 55a 'formed substantially in an L shape on the transport mechanism base 52 are arranged to face each other, and rollers 55b and 55b' are rotatably provided on the roller frame. ing. A substantially T-shaped belt support plate 55c is fixed to the center of the transport mechanism 55. A belt 55 made of resin or the like is provided between the rollers 55b and 55b '.
d has been passed over. The end of the roller 55b 'is a drive mechanism 60.
The belt 60c is stretched between the roller 60a and the end of the roller 60a. The roller 60a is rotatably supported by a convex roller frame 60e fixed to the first base member 50, and is configured to be driven by being connected to a driving roller 60b and a belt 60d. Drive roller 60b
Is driven by a motor (not shown).

Next, a frame pressing roller 61 is rotatably supported so as to face the transport surface of the belt 55d of the transport mechanism 55. The frame holding roller 61 is a frame holding roller swinging member.
The other end of the swing member 62 is fixed to a bearing press 63 as shown in FIG. 10, and the roller shaft of the bearing press 63 is attached to both ends of the transport mechanism base 52. It is rotatably supported by a fixed air blowing device support member 64. Therefore, the frame holding roller 61
Is swingable in a direction away from the belt 55d.

Further, air blowing pipes 66 and 67 as cooling means as shown in FIG. 9 are arranged in parallel with the air blowing device supporting member 64 as supporting means. The air underside of the blow pipe 66 and 67, that is, the belt 55d side has a plurality of air outlet 66A～66a _n and 67A～67a _n are formed. This air outlet has an air outlet pipe 66 and
Air is sent in and blown out by an air compression device (not shown) including a compressor and the like connected to an air suction device connection member 68 connected to the end of 67. In this embodiment, the air is blown out. However, a method of cooling with a refrigerant gas or the like using another device may be used.

Next, the operation of the lead frame cooling mechanism having the above configuration will be described.

First, after the semiconductor wafer is die-bonded to a lead frame by a die bonder device A as shown in FIG. 7, the die-bonded lead frame is heated to a predetermined temperature while being intermittently fed by a heating device B to be thermoset. Is done. Normally, the die-bonded lead frame is stocked in the heating device B in consideration of the processing capacity of the bonding device, but as shown in FIG. 7, in the device of this embodiment, a plurality of bonding devices are connected. Therefore, the sheet is conveyed onto the conveying path without being sufficiently cooled in the heating device B.

Therefore, when the heated lead frame is fed onto the belt 55d of the transport mechanism 55 shown in FIG. 8, the leading end of the lead frame is sandwiched between the frame pressing roller 61 and the belt 55d and is drawn in the transport direction. This frame holding roller
Since 61 is configured to be swingable, the lead frame can be easily clamped, and the frame can be pressed down onto the belt 55d side so that the frame can be transported while being securely brought into close contact with the belt. When the lead frame is sent in the transport direction, the air is constantly blown out from the air outlets 66a and 66b, so that the heated lead frame is transported while being reliably cooled. Therefore, there is no effect on the transport mechanism 55 due to the heating of the lead frame.

The lead frame that has passed through the transport mechanism 55 as described above is transported via the transport mechanism described with reference to FIGS.

Although the first and second transport mechanisms 6 and 7 and the like in this embodiment are described with two rails, more may be provided, and a cylinder is used as the switching means. It is of course possible to combine them appropriately using

In this embodiment, wire bonding is described as an example, but the present invention is also suitable for use in tape bonding or the like.

[Effects of the Invention] As described above, according to the present invention, a lead frame passing on a transport path surface is cooled by cooling means provided opposite to a transport path surface on which a heated lead frame is transported. As a result, the lead frame can be immediately sent to the bonding apparatus without waiting until the temperature of the heated lead frame decreases, and the time efficiency can be improved.

Further, according to the present invention, even if the heated lead frame is directly sent to the transfer mechanism on the bonding device side, there is an effect that the resin belt or the like is not damaged.

Further, the cooling mechanism of the present invention is a conveying means for conveying the heated lead frame, a cooling means provided to face the lead frame conveying path surface of the conveying means, a supporting means for supporting the cooling means, Since the supporting means is provided with a lead frame pressing means capable of swinging in a direction away from the conveying path surface between the conveying means and the cooling means, the heated lead frame tip slightly increases. If the lead frame is placed on the transport path of the transport mechanism, the lead frame is pressed by the surface of the transport path by the frame pressing means, so that the lead frame can be transported reliably.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a view schematically showing a configuration of a lead frame transport mechanism according to the present invention. FIG. 2 is a schematic sectional view of a loader unit shown in FIG. FIG. 3 is a sectional view showing a state where the loader unit of FIG. 2 has moved,
FIGS. 4, 5, and 6 are explanatory views for explaining a lead frame transport path using the lead frame transport mechanism according to the present invention, and FIG. 7 is a diagram of an apparatus in which the present invention is used. FIG. 8 is a diagram showing an embodiment of the present invention. FIG. 8 is a front view showing a schematic structure of a lead frame cooling mechanism. FIG. 9 is a plan view of FIG. Ten
The figure is a side view of FIG. 1 ... bonding apparatus, 2 ... bonding head,
3a 1st guide rail, 3b 2nd guide rail, 4 3rd conveyance mechanism, 6 ... 1st conveyance mechanism, 7
... Second transport mechanism, 9... Loader unit, 10.
Cylinder for forward / backward slide, 13 Fourth transport mechanism, 14
... Fifth transport mechanism, 17 First base, 18 Cam, 19 Lead frame pusher cylinder, 21
... second base, 23 ... coupling, 26 ... holding stand,
27 ... Vertical guide, 29 ... Ball bearing, 31a, 31
b Guide rail, 55 Transport mechanism, 55a, 55a 'Roller frame, 55b, 55b' Roller, 55c Belt support plate, 55d Belt, 60 Drive mechanism, 60a Roller, 60b Drive roller, 60c Belt, 61 Frame press roller, 62 Frame press roller swinging member, 63
…… Bearing retainer, 64 …… Air blower support member,
66, 67 …… Air blow-off pipe, 68 …… Air suction device connection member.

Claims (1)

(57) [Claims] 1. A die bonder device for performing die bonding from a semiconductor wafer to a lead frame, a heating device for heating and curing the lead frame die-bonded by the die bonder device, and a transport means for transporting the heat cured lead frame. A bonding device for performing bonding to the lead frame transported by the transporting means; and a cooling mechanism provided between the heating device and the bonding device, wherein the cooling mechanism transports the heated lead frame. Transfer means, cooling means provided opposite to the lead frame transfer path surface of the transfer means, support means for supporting the cooling means, and between the transfer means and the cooling means provided on the support means. A lead frame that can swing in a direction away from the lead frame conveyance path surface. And holding the lead frame on the conveyance path surface by the lead frame holding means. When the lead frame passes over the conveyance path surface, the lead frame is cooled by the cooling means and transferred to the bonding apparatus. A semiconductor manufacturing apparatus characterized in that: