JP2754112B2 - Bonder and automatic bonding device equipped with the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to, for example, an IC chip,
That is, the present invention relates to a bonder that receives a lead frame sequentially supplied while holding a semiconductor component and bonds pads (electrodes) of the IC chip to leads provided on the lead frame using wires. Also,
The present invention relates to an automatic bonding apparatus equipped with a plurality of bonders as a line, and an unloader that receives a number of lead frames subjected to bonding processing through the respective bonders one after another and arranges and accommodates them. . Furthermore, the invention relates to the leadframe itself.

[0002]

2. Description of the Related Art FIGS. 22 to 36 show a conventional example of such an automatic bonding apparatus. The automatic bonding apparatus is disclosed, for example, in Japanese Patent Application Laid-Open No. 3-155140.

As shown in FIG. 22, in the conventional apparatus, a die bonder device A ₂ , a curing device B ₂ , three bonders C _{5 to} C _7, and a magazine stocker device D
_Two are lined up in a row. Die Bonder device A ₂ is a wafer number of IC chips obtained by cutting (not shown) (not shown)
, For example by using a thermosetting adhesive or the like successively attached to a predetermined position on the lead frame (described later), but to feed toward the downstream of the curing apparatus B _2. In addition, curing device B
₂ accepts the lead frame fed from a die bonder device A _2, was heated to allowed to solidify the adhesive, in which sends toward downstream of bonder C ₅ -C _7.

[0004] Each bonder _C 5 -C ₇ is curing device _{B 2}
And then bonding the leads formed on the lead frame and the pads (electrodes) on the IC chip provided on the lead frame using a wire made of gold, aluminum, or the like. The configuration will be described in detail below. Each bonder _C 5 -C ₇ is thus configured respectively substantially the same manner, 1
It details the construction of a bonder C ₅ of the table th, a description of the two bonder C ₆ and C ₇ remaining omitted.

[0005] Figure 23 is a diagram schematically showing the configuration of a conveying mechanism for conveying the leadframe bonder C ₅ is provided. 23, the bonding head 2, which is placed on the main body 201 of the bonder C ₅ (shown by a two-dot chain line)
Reference numeral 02 includes a camera having a camera head, a lens, and an illumination lamp, and is mounted on an XY table driving mechanism (not shown) movable in the X and Y directions. The bonding head 202 is a component to be bonded on a bonding stage (the bonding stage refers to a bonding work section for performing a bonding connection and a stage portion on which a plurality of chips before and after the chip are placed and transported). The image of the IC chip is imaged, and the leads of the lead frame and the pads on the IC chip are connected by bonding. The lead frame on which the IC chip imaged by the bonding head 202 is provided is a first frame.
Guide rail 203a and second guide rail 203
The position is adjusted to the optimum interval position by b. The distance between the first and second guide rails 203a and 203b and both ends of the lead frame is set to about 0.1 mm. These first and second guide rails 203a and 203a
A third transport mechanism 204 is provided in parallel with 3b.
The third transport mechanism 204 is provided with a pair of rollers 204a and 204b that are supported by one shaft, and two belts 2 that are stretched between the rollers 204a and 204b.
04c, 204d, and the roller 204b is formed by a double roller, and the roller 204b and another roller 204e other than the above are wound around by a belt 204f.
The roller shaft and the shaft of the drive motor 204g are connected and driven. The belt 204 of the third transport mechanism 204 is driven by the rotational driving force of the driving motor 204g.
c and 204d are configured to be rotatable forward and backward. At the center between the two belts 204c and 204d, near the unloader side (lead frame sending direction side), a detection sensor 205 for detecting the arrival of the lead frame is arranged. The detection sensor 205 is constituted by a reflection type optical sensor or the like.

Next, the transfer means on the loader side (lead frame receiving side) will be described. The transfer means on the loader side includes first and second transfer mechanisms 206 and 207. The first and second transport mechanisms 206 and 207
Are driven by one motor 208.

First, the first and second transfer mechanisms 206 and 207 are provided on the loader unit 209 in parallel in a direction parallel to the longitudinal direction of the first and second guide rails 203a and 203b. This loader unit 20
9 is the shaft 210 of the cylinder 210 for sliding back and forth.
It is coupled to the distal end of a, and is configured to be movable upper surface of the first and second guide rails 203a bonder C ₅ in the direction perpendicular to the longitudinal direction of and 203b body 201. The timing control of the forward and backward movement of the cylinder (switching means) 210 is controlled by a control circuit including a microprocessor or the like (not shown), and the forward and backward positions of the cylinder are determined by the first and second transport mechanisms 206 and 20.
7 and the first and second guide rails 203a, 203
The control is performed so that the center of 3b and the center of the third transport mechanism 204 (portion indicated by a chain line) coincide. This control of the center position is, of course, adjustable. The first and second transport mechanisms 206 and 207
Has substantially the same configuration as the above-described third transport mechanism 204, and has a pair of rollers 206a, 206 supported by one shaft.
6b, and a transport mechanism composed of two belts 206c and 206d stretched between the rollers 206a and 206b is disposed in parallel. First and second transport mechanisms 206 and 207 are connected, and the roller 206b of the first transport mechanism 206 is formed by a double roller.
06b and another roller 206e other than the above
6f, the shaft of the roller 206e and the shaft of the drive motor 208 are connected, and the first and second transport mechanisms 2
06 and 207 are configured to be coaxially driven to rotate. Further, the first and second transport mechanisms 206 and 20
7 includes first and second guide rails 203a and 203
Lead frame detection sensors 211 and 212 are arranged near the lead frame supply side to b.

Next, the fourth and fifth transport mechanisms 213 and 214 are connected to the first and second transport mechanisms 206 and 20 described above.
7 and is provided on the unloader side. The third and fourth transport mechanisms 213 and 214 are also driven by one motor similarly to the first and second transport mechanisms 206 and 207, but drive the fourth and fifth transport mechanisms 213 and 214. Alternatively, it may be driven by a drive motor that drives the motor. In addition, the lead frame detection sensor 21
Reference numerals 5a and 215b are disposed on the lead frame discharge side, that is, near the belt end in FIG.

Next, FIGS. 24 and 25 are sectional views showing the detailed configuration of the loader unit on which the first and second transport mechanisms of FIG. 23 are mounted, as viewed from a direction perpendicular to the lead frame transport direction. is there.

[0010] In FIG. 24, the first base 217 is fixed on the main body 201 of the bonder _{C 5.} This first
A cam 218 is provided on the base 217 of the camera. A continuous inclined surface is formed at the center of the cam surface of the cam 218 so that linear movement is possible.
Further, on the left side of the first base 217, a support frame 22 for supporting the front and rear slide cylinder 210 (216) is provided.
0 is provided vertically. A second base 221 having a substantially U-shaped cross section is connected to the tip of the shaft of the cylinder 210. A connection shaft 222 for connecting the first and second transport mechanisms 206 and 207 is provided in the second base 221, and the other end of the connection shaft 222 is connected to the second base 2.
The motor shaft of the belt driving motor 208 fixed to the motor 21 is coupled via a coupling 223. The first transport mechanism 206 is, as already described with reference to FIG. 23, a support base 22 for supporting a roller shaft on which two belts are stretched.
4a and 224b are formed vertically on the second base 221. Further, the second transport mechanism 207 also has a support base 225a that supports the roller shaft, similarly to the first transport mechanism 206.
And 225b are formed vertically on the second base 221. A holding base 226 having a substantially U-shaped cross section is provided on both sides of the supporting bases 225a and 225b of the second transport mechanism 207, and a vertical guide 227a is provided on a side surface of the holding base 226. This vertical guide 227a
Is configured to fit in a groove formed in the bearing 227b and to be slidable up and down. Lower surface 226a of holding table 226
Is provided with a support 228, and a ball bearing 229 is rotatably provided at the tip of the support 228.
This support 228 is a hole 2 formed in the second base 221.
The tip of the ball bearing 229 is in contact with the cam surface of the cam 218 through 30. In addition, holding table 2
At the upper end of 26, guide rails 231a and 231b having a substantially L-shaped cross section are provided. This guide rail 231
a and 231b are configured to be adjustable according to the width of the lead frame. These guide rails 231a and 231
b is the height of the first and second guide rails 20.
The height is set to be at least equal to or substantially equal to the height of the transport surface of the lead frame of 3a and 203b.

The above configuration has the same configuration on the loader side and the unloader side.

The vertical operation including the loader unit 209 will be described below with reference to FIGS. 24 and 25.

FIG. 24 shows a state in which the shaft 210a of the cylinder 210 is being sucked, and the position of the second base 221 connected to the tip of the shaft is controlled while being pulled. At this time, the first and second transport mechanisms 206 and 207 move to the first and second guide rails 203a and 203a.
23b and the state shown in FIG. 23 with respect to the transport path of the third transport mechanism 204. At this time, the bearing 229 provided on the lower surface of the holding table 226 is located at the uppermost portion 218H of the cam surface. doing. Therefore, FIG.
5, when the lead frame is located at the lowermost part 218L of the cam surface, the lead frame is
07d, the guide rails 231a and 231 of the holding base 226 are moved by the suction action of the cylinder.
The both ends of the lead frame are held by 31b and lifted,
It is gently separated from the belts 207c and 207d. This is because the cam 218 allows continuous movement. In the state of FIG. 24, the first transport mechanism 206
The lead frame is also provided with a curing device B ₂ on the belt of FIG.
2). Therefore, in this state, the lead frame can be continuously transported on the transport path of the third transport mechanism 204.

Next, as described above, the second transport mechanism 2
When the lead frame placed on the guide surfaces of the guide rails 231a and 231b is pushed out onto the transport path of the first and second guide rails 203a and 203b by the lead frame pusher cylinder 219 (see FIG. 23), the slide is performed. The shaft 210a of the use cylinder 210 projects and shifts to the state of FIG. That is, the second base 221 is moved from 218H to 218L along the cam surface. At this time, the guide rail 231 of the holding table 226
the guide surface of a and 231b are lowered to a position lower than the position of the belt top surface (see FIG. 25), a new lead frame is transported from the curing device B ₂ shown in FIG. 22. At this time, since the first transport mechanism 206 is located at a position deviated from the transport path, no lead frame is placed on the belt.

The above is the operation of the loader unit 209, and the same operation is performed on the unloader side.

Next, the path through which the lead frame is transported using the present apparatus will be described in detail with reference to FIGS.

First, the shaft 210a of the forward / backward slide cylinder 210 on the loader side projects from the state shown in FIG. 23 to move the loader unit 209 to the state shown in FIG. Second
A lead frame (L＼) is provided on the transport path of the transport mechanism 207 of FIG.
F) is supplied from the direction of the arrow. When the detection sensor 212 detects the lead frame, the rotation of the drive motor 208 for driving the belt is stopped by a command from the control circuit. Thereafter, the front and rear cylinders 210 operate in the suction direction to move the loader unit 209 to the state shown in FIG. At this time, the transport paths of the first and second transport mechanisms 206 and 207 are the first and second guide rails 203a and 203b having a bonding stage.
And stops along with the transport path of the third transport mechanism 204. The lead frame placed on the guide rails 231a and 231b of the second transfer mechanism 207 shown in FIG.
9, the first and second guide rails 203a and 203a
It is pushed out to the guide surface on 3b. This guide rail 2
The lead frames sent onto the substrates 03a and 203b are intermittently fed one pitch at a time while being clamped by a transport mechanism (not shown), and then heated to a predetermined temperature on a bonding stage for bonding. During this time, since the transport path of the first conveyor mechanism 206 coincides with the conveying path of the third transport mechanism 204, the bonder C ₅ except other bonder C
₆ or C ₇ can be supplied with a lead frame via the fifth transport mechanism 214. Next, the lead frame bonded and connected on the bonding stage is discharged onto the transport path of the fourth transport mechanism 213 provided on the unloader side, and the lead frame detection sensor 215a
And the rotation of the motor is stopped, and the front and rear cylinders 216 on the unloader side act in the protruding direction to move the unloader unit to the state shown in FIG. And
The lead frame for which the bonding connection has been completed is transported to the magazine stocker device D ₂ (see FIG. 22) via the bypass transport path of the next bonder C ₆ , C ₇ (see FIG. 22).

The above is a series of operations for bonding the lead frame and the like.

[0019] Next, description will be given of a configuration of the magazine stocker device D ₂ as unloader shown in Figure 22.

[0020] FIG. 29 is a side view of the magazine automatic feeder magazine stocker device D ₂ is provided.

[0021] In FIG. 29, the magazine automatic feeder is mounted to a base 300 which is fixed to the body of the magazine stocker device D _2, the first magazine discharge side containing space 250 second magazine supply side containing space It comprises a magazine storage space in which 260 are arranged vertically, an elevator 270, a discharge mechanism 290, and the like.

The details of the above configuration will be described below.

The slide base 301 is slidably mounted on top base 300 which is fixed to the body of the magazine stocker device D ₂ as shown in FIG. 29. A nut 302 is provided at an end of the slide base 301, and a screw 303 is screwed to the nut 302. Further, the screw 303 is screwed and connected to a nut 302a fixed to the base 300, and the slide base 301 can be moved back and forth by turning an adjustment knob 304 provided at an end of the screw 303. It is configured as follows. This slide base 3
By moving 01, the center of the magazine can be adjusted to the center of the transport path of the transport mechanism. The center of the transfer path of the transfer mechanism is adjusted to be coincident with or parallel to the center of the bonding stage. The adjustment knob 304 is configured to be manually rotated, but may be configured to be driven by a pulse motor or the like.

Next, the structure of the elevator 270 will be described. An elevating shaft 271 having a screw formed on the slide base 301 is vertically supported by an elevating shaft support frame 272 parallel to the elevating shaft 271. A nut 273 is screwed to the lifting shaft 271, and the nut 273 is rotated by rotating the lifting shaft 271.
The elevator stage 279 attached to the elevator back plate 278 connected to the elevator stage 278 is configured to be able to move up and down. The lower part of the elevating shaft 271 is connected to a coupling 274, a timing pulley 275, and the like. The timing pulley 275 is connected to a pulley 276 attached to a shaft of a motor 277 via a belt. The elevating shaft 27 is driven by a driving force of a motor 277.
1 is rotated. The motor 277 has a base 300
It is fixed to a motor mounting plate 282 fixed to a cylinder mounting frame 281 supported vertically above. Above the cylinder mounting frame 281, a magazine mounting cylinder 283 and a magazine pushing cylinder 28 are provided.
4 are attached and fixed vertically. A mounting plate 283a is attached to a shaft end of the magazine mounting cylinder 283. When the cylinder is turned on, the mounting plate 283a protrudes forward to temporarily mount a magazine on the elevator stage 279. A pushing piece 284a is attached to the shaft end of the magazine pushing cylinder 284. When the cylinder is turned on, the pushing piece 284a is pushed forward and the magazine placed on the placing plate 283a is moved to the first position. Is pushed out onto the magazine discharge side storage space 250.

This first magazine discharge side storage space 2
Reference numeral 50 denotes a base plate 251 fixed to a support (not shown) attached to the slide base 301, and guide plates 2 for guiding the magazine at both ends of the base plate 251.
52 are provided at both ends. On the guide plate 252, a plurality of magazines arranged in a direction intersecting horizontally with the lead frame housing direction (longitudinal direction), that is, in a width direction of the lead frame can be continuously arranged.

This first magazine discharge side storage space 2
50, the second magazine supply side storage space 26
0 is provided. The second magazine supply-side storage space 260 is also provided with the first magazine discharge-side storage space 2.
A plurality of magazines can be arranged in the same direction as the direction 50 (lead frame width direction), and the magazines are provided with guide plates 261 at both ends. A transfer mechanism 262 for transferring the magazine is provided between the guide plates 261. This transfer mechanism 262 is shown in detail in FIG.

As shown in FIG. 30, the transfer mechanism 262
Is a belt 262e stretched between rollers 262b and 262c, a driving roller 262a connected to the roller 262c by a belt 262f, and a belt 262e.
And a belt support plate 262d for preventing dripping. The magazines arranged on the belt 262e are transferred to the elevator stage 279 by the rotational driving force of the driving roller 262a. The transported magazine is stored in a stocker guide 2 fixed to an elevator back plate 278.
It is configured to come into contact with and stop at 85. Also,
A chuck mechanism 280 for holding a magazine is provided on the elevator stage 279. The chuck mechanism 28
The configuration of 0 will be described later.

Next, the magazine transferred by the transfer mechanism 262 is regulated by the stocker guide 285 and stopped by a command from a control circuit including a microprocessor (not shown). In this state, the elevator stage 279 rises to separate only one magazine above the belt of the belt 262e of the transfer mechanism 262. The structure of this operating mechanism will be described with reference to FIGS. FIG. 31 is a sectional view seen from the side, and FIG. 32 is a front view thereof.

In FIG. 31, the operating mechanism is mounted on a slide base 301, and the operating mechanism is an operating member 287 having an operating piece 287a fixed at the upper end.
And a sliding member 288a attached to the side surface of the operating member 287 and slidably provided on the guide receiving member 288b in the direction of the arrow, and one end fixed to the operating member 287 and the other end fixed to the guide receiving member 288b. The operating member 28
And a tension coil spring 286 that constantly urges the coil 7 upward. A bearing 289 is provided on a side surface of the operating member 287.

Since the operating mechanism having the above structure is normally urged upward by the urging force of the tension spring 286, the operating piece 287 is located at the position shown by the one-dot chain line in FIG.
There is a. At this time, the height of the tip of the operation piece 287a is set to be higher than the height of the belt 262e of the transfer mechanism 262 shown in FIG.
It is configured such that the tip of a can be lifted by contacting the lower surface of the magazine. The biasing force of the tension spring 286 is configured to be adjustable.

The operating member 287 has an elevator stage 279 indicated by a two-dot chain line in FIG.
When the transfer mechanism 262 is pressed down by contacting the same 89, the transfer mechanism 262 escapes to a position lower than the surface of the belt 262e.

This will be further described with reference to FIG. 33. Two operating pieces 287a are arranged along the direction in which the lead frame is stored in the magazine. The operating piece 287 a is configured to be pushed down against the urging force of the extension coil spring 286 by the lower surface of the elevator stage 279 abutting the bearing 289.

Here, the elevator stage 2 described above is used.
The chuck mechanism 280 provided at 79 will be described in detail with reference to FIG.

As shown in FIG. 34, this chuck mechanism 2
At 80, the chuck 32 is attached to the tip of the movable member 320.
1 is fixed, and the lower end of the movable member 320 and the lower end of the elevator stage 279 fixed to the nut 273 via the elevator back plate 278 are connected to the spring 32.
2 and the movable member 320 is always urged to the right in the figure. An activation member 324 is provided below the elevator stage 320, and a sliding member 325 fixed to the movable member 320 is guided by the activation member 324 so as to be slidable. A roller 326 is provided at the other end of the movable member 320.
Numeral 26 is configured to roll along the cam surface of the cam 327. In such a configuration, the magazine placed on the elevator stage 279, that is, the roller 326 pushes the chuck 321 forward against the urging force of the spring 322 by the convex portion of the cam 327 when the magazine is supplied. An interval is provided between the chuck 321 and the chuck 321. When the roller 326 is positioned in the concave portion of the cam surface of the cam 327 by lowering the elevator stage 279, that is, when the magazine is fixed, the chuck 321 holds the magazine by the action of the spring 322. When it is further lowered, the chuck 321 projects forward again by the convex portion of the cam surface, releases the state of holding the magazine, and becomes in a state where it can be discharged.

Next, the operation of the magazine automatic supply device having the above configuration will be described below. FIG. 29 and FIG.
A plurality of magazines in which no lead frame is stored in the second magazine supply-side storage space 260 shown in FIG. These magazines are placed on the belt 262e of the transfer mechanism 262, and are sent to the elevator stage 279 side by a command from a control circuit. Elevator stage 2
At this time, 79 is lowered to the lowermost position and is on standby, and the operating member 287 (see FIGS. 31 and 32) is also pushed down by the lower surface of the elevator stage 279 abutting on the bearing 289. At this time, the chuck mechanism 280
34 are also spread by the action of a cam 327 arranged along the elevating shaft 271 as shown in FIG. The magazine transported in this state collides with the stocker guide 285 and is regulated. Thereafter, the control circuit stops the transfer mechanism, and moves the elevator stage 279 by an amount corresponding to the release of the spring force of the extension coil spring 286 of the operating member 287, that is, the height corresponding to the two-dot chain line in FIG. Then, the stocker guide 285 is operated by the operation piece 287a.
The magazine regulated by is lifted,
The control circuit issues a reverse rotation command to the transfer mechanism and causes a magazine other than the magazine being lifted to be moved to the elevator stage 27.
9 (the second magazine supply side storage space 260
Direction) and stop. Thereafter, when the elevator stage 279 is raised, the magazine lifted by the operating member 287 causes the chuck mechanism 280 to move.
Is reliably held by the action of. In this state, the elevator stage 279 accommodates the bonded lead frame while rising intermittently. The elevator stage 279 serves as the first magazine discharge side storage space 250.
Is detected by a sensor (not shown), the magazine mounting cylinder 283 is turned on by a control command to push out the mounting plate 283 a to the lower surface of the elevator stage 279. Thereafter, the elevator stage 279 descends to the lowermost portion, but the magazine is easily placed on the placing plate 283a because the chuck mechanism 280 is opened again. Then, the magazine extrusion cylinder 284 is turned on by the control command to extrude the extruded piece 284a and the magazine is moved to the first position.
To the magazine discharge side storage space 250 side.

The lead frames for which bonding has been completed by repeating the above steps are automatically and sequentially stored in the magazine.

Although the first and second transport mechanisms 206 and 207 are described as having two rails,
More than that may be provided, and a cylinder is used as the switching means, but it is of course possible to use other configurations and combine them appropriately.

In the above description, wire bonding is described as an example, but it may be used for tape bonding or the like.

[0039] Here, the configuration of the curing device B ₂ shown in FIG. 22, the relationship between a die bonder device A ₂ is an apparatus of the preceding stage will be described.

As described above, the curing device B ₂ receives the lead frame sent from the die bonder device A ₂ and fixes the lead frame and the IC chip attached to the lead frame with an adhesive or the like to each other. It is.

As shown in FIG. 35, the curing device B ₂
It has a furnace 340. In the furnace 340, the nozzle 3
High-temperature nitrogen gas is supplied through 41. A discharge pipe 342 for discharging the nitrogen gas is connected to the bottom of the furnace 340.

Then, as apparent from FIG.
A large number of heat blocks 342 are provided in a line in the inside of 0. As shown in FIG. 36, the lead frame (L＼F) is transported at a predetermined pitch while being placed on the upper surface of each of the heat blocks 342, and is heated.

Incidentally, as shown in FIG. 36, when the lead frame is hexa have from a die bonder device A ₂ to the curing device B _2, the lead frame is first parallel to the direction L of the flow of the line of the automated bonder Route 344
A path 345 that is continuous with the downstream end of the path 344 toward the back side of the automatic bonding apparatus, and a path 3 that is continuous with the downstream end of the path 345 and that is parallel to the line flowing direction L.
And 46, is conveyed to the rear side near the cure device B ₂ through successively. Thereafter, as described above, the heat block 34
2 is conveyed to the front side of the curing device B2 while being heated by the heating device ₂ , and subsequently, a path 347 parallel to the flowing direction L of the line.
It is supplied to the bonder _{C 5} to _{C 7} through.

[0044]

In the automatic bonding apparatus described above The present invention is to provide a lead frame carried by the curing device B ₂ is supplied to the bonding stage of each bonder C ₅ -C ₇ bonding machining is performed.
The number of lead frame after these bonding, so that the magazine stocker apparatus D ₂ as the unloader are sequentially accommodated in the magazine equipped. However, it is necessary to observe the tension of the wire of the lead frame connected by bonding, the state of the ball being crushed into the pad surface, and the like. This is because it is necessary to check whether a short circuit or the like is caused by the loop shape of the wire or whether the wire is securely connected to the electrode surface. Therefore, a step of extracting and inspecting the lead frame housed in the magazine is provided. However, in the conventional apparatus, one of the lead frame the bonding process is performed by each bonder C ₅ -C ₇ in the magazine are mixed, the bonding defects which bonder be found defective bonding of the lead frame It is not easy to confirm whether it has occurred in
There is a disadvantage that it takes considerable time until the repair adjusted by certain of the bonder C ₆ pedestal eyes have problems such as a failure.

Accordingly, the present invention has been made in view of the above-mentioned drawbacks of the prior art, and has as its object to speed up the determination of which bonder has been used to bond a lead frame.

[0046]

SUMMARY OF THE INVENTION The present invention is directed to a bonding station for holding a semiconductor component and sequentially supplying a frame.
On the frame and attach it to the frame.
In bonder subjected to bonding process by de, before
Between the bonding stage and the frame supply side
Identify subjecting an identification mark corresponding to the bonder are separately arranged in the frame and One the bonding head
A separate mark providing means, wherein the identification mark providing means
After attaching the identification mark to the frame,
This is a configuration in which the sliding process is performed. Further, the present invention provides a frame that is sequentially supplied while holding semiconductor components.
A plurality of bonder applying a bonding process by the bonding head relative to the frame to accept on the bonding stage, an automatic bonding apparatus and a unloader for receiving and containing the frame having passed through the bonder each, the bonder each having Said
On the frame supply side of the bonding stage and
An identification mark corresponding to each of the bonders , which is provided separately from the bonding head, is attached to the frame.
An identification mark providing means, wherein the identification mark providing means
After attaching the identification mark to the frame,
It is configured to perform a bending process.

[0047]

Next, an automatic bonding apparatus according to the present invention will be described with reference to the accompanying drawings. Since the automatic bonding apparatus is configured similarly to the conventional automatic bonding apparatus shown in FIGS. 22 to 36 except for the main parts described below, detailed description of the main parts other than the main parts is omitted. I do. In the following description, parts that are the same as or correspond to the constituent members of the conventional device are denoted by the same reference numerals.

As shown in FIG. 1, in the automatic bonding apparatus according to the present invention, three bonders C _{1 to} C ₃ are arranged in a line following the die bonder apparatus A ₂ and the cure apparatus B ₁ , behind the bonder, the unloader D _1, and a molding device E. In addition,
Daibonta device A ₂ is the same as that comprising the conventional automatic bonding apparatus shown in FIG. 22, the wafer number of IC chips obtained by cutting (not shown) (not shown), for example, they are sequentially mounted on a predetermined position on the lead frame (described later) by using a thermosetting adhesive or the like, is intended to feed toward the curing device B _1. Further, curing apparatus B ₁ represents, accept the lead frame fed from a die bonder device A _2, was heated to allowed to solidify the adhesive and the like, each bonder C ₁ -C
₃ is sent out. Each bonder _C 1 _{~C 3}
Accepts the lead frame through the cured device B _1, the IC chip on the lead and the lead frame are formed on the lead frame pad and an (electrode), gold,
The bonding is performed using a wire made of aluminum or the like. As shown in FIG. 1, each bonder C _1-
C ₃ has a push mechanism 1 for pushing the lead frames received in the bonding position by respectively provided.
Each of the bonders C _{1 to} C ₃ is configured in the same manner as each of the three bonders C _{5 to} C ₇ provided in the above-described conventional automatic bonding apparatus, except for the configuration of the identification mark providing means described later. ing. Therefore, explanations other than the structure of the identification mark providing means and its surroundings are omitted. Also,
As described hereinabove, in the description of the bonder C ₁ below, are denoted by the same reference numerals components identical or corresponding parts of the conventional bonder. In addition, since each of the bonders C _{1 to} C ₃ is configured in substantially the same manner,
Pedestal th details the structure of the bonder C ₁ of the description of two bonders C ₂ and C ₃ remaining omitted.

[0049] On the other hand, the unloader D ₁ shown in FIG. 1, the accommodating these accept the lead frame that has been subjected to bonding process by going through each bonder C ₁ -C ₃ above, respective lead frame Are sequentially sent out to the molding device E at the subsequent stage. Then, the molding device E receives each of the sent lead frames, and coats the IC chips on the lead frames with a synthetic resin.

[0050] Now, the following will be described in detail from the configuration of the bonder _{C 1.} As shown in FIG. 1, the bonder C ₁ is provided with a curing device B.
₁ is provided with a push mechanism 1 for pushing the lead frame received from the device ₁ toward the bonding position.
Here, the operation of the push mechanism 1 will be briefly described with reference to FIG. That is, the operation of the transport mechanism from the state of FIG. 26 to the state of FIG. 27 causes the lead frame (L＼F) from the curing device to move to the second transport mechanism 2.
07 is brought over. In this state, the push mechanism 1 operates, and the lead frame on the second transport mechanism 207 is positioned at the bonding position.
extruded onto a and 203b.

[0051] As shown in FIGS. 2 to 4, the push mechanism 1 includes a frame 5 attached via a fixed shaft 3 of the plurality with respect to the main body of the bonder C _1, the pusher 6a
And a push means 6 provided on the frame 5 and a lead frame pusher cylinder 7 for applying a driving force to the push means 6. As is clear from FIG. 3, in the push mechanism 1, the pusher 6
a operates in contact with the rear end of the lead frame (L＼F), and pushes the lead frame parallel to the line flowing direction L.

By the way, as shown in FIGS. 2 to 4, at a predetermined position of the frame 5 comprising a push mechanism 1 described above, an identification mark corresponding to the bonder C ₁ with the push mechanism 1 to the lead frame The identification mark attaching means 10 to be attached is attached. For details, see FIG. 5 and FIG.
As shown in FIG. 2, the identification mark providing means 10 has a bracket 11 as a base portion, and the bracket 11 is fastened to the frame 5 of the push mechanism 1 by bolts 11a. On this bracket 11, a support plate 12 is provided.
The flow direction L of the line, that is, the lead frame (L＼
F) It is mounted so that the position can be adjusted in the longitudinal direction. More specifically, as shown in FIG.
Are formed with two longitudinal insertion holes 11b extending along the flowing direction L of the line, and two bolts 13 inserted into the respective insertion holes 11b are screwed into the bracket 11. . That is, the position of the support plate 11 can be adjusted by loosening the bolts 13.

As shown in FIG. 5, a cylinder 15 using hydraulic pressure or pneumatic pressure is mounted on the support plate 12 so that the output shaft side faces downward. The cylinder 15 is mounted on the support plate 12.
Above, the position can be adjusted in a direction perpendicular to the line flowing direction L, in this case, in the width direction of the lead frame (L＼F). More specifically, as shown in FIGS. 5 and 6, the support plate 12 is formed with a single longitudinal insertion hole 12 a extending in the direction in which the cylinder 15 is to be adjusted in position. The two bolts 17 are inserted into the insertion holes 12a, and a nut 18 is screwed to each of the bolts 17 on the back side of the support plate 12, as shown in FIG. Therefore, the position of the cylinder 15 can be adjusted by loosening the bolt 17 and the nut 18.

As apparent from FIGS. 4 and 6, a punch 21 is mounted on the output shaft of the cylinder 15 via an intermediate block 20. More specifically, the intermediate block 20 is screwed into a male screw portion formed on the output shaft, the punch 21 is inserted into the lower end of the intermediate block 20 so that only its tip is exposed, and the set screw 2
2 fixed.

The punch 21 described above uses the lead frame L
A predetermined portion of F is marked as an identification mark, and is pressed against the lead frame by the cylinder 15. As shown in FIGS. 4 and 6, a receiving member 24 is provided for receiving the pressing force applied to the punch 21 by the cylinder 15 on the lower side of the lead frame.

The stamp 26 formed by the punch 21 described above is attached to a portion as shown in FIG. 7, and its shape is, for example, circular as shown. As shown in FIG. 1, in the automatic bonding apparatus, three bonders C _{1 to} C _{3 are used.}
In the other bonders C ₂ and C ₃ , as shown by the two-dot chain line in FIG. 7, the position where the mark 26 is attached is set to the first bonder so as to correspond to each of these bonders. it is carried out to change the position of the marking attached at C ₁ 26 (show by a solid line in FIG. 7).
As the form of the engraving 26, various things such as a double circle, a triangle, a quadrangle, and a pentagon as shown in FIG. 8 can be applied in addition to the simple circle shown in FIG. Further, as described above, in addition to changing the position of the mark applied to the lead frame for each bonder, the shape and the like of the mark applied to each bonder may be changed. Further, the present invention is not limited to the engraving. For example, a through hole having a predetermined shape may be formed in the lead frame, and the through hole may be used as an identification mark.

As described above, by attaching the identification marks corresponding to the bonders C _{1 to} C ₃ subjected to the bonding process to the lead frame, the following effects can be obtained.

That is, it is possible to reliably determine from which bonder the lead frame has been bonded by the identification mark attached to the lead frame. Based on the inspection results, the operator can immediately know the bonder to be repaired and adjusted and take appropriate measures.

By the way, as is apparent from FIG. 7, the part to be engraved as the identification mark is the lead frame L #.
Each IC chip 35 mounted on F, that is, outside the semiconductor component. Therefore, it is better to add an identification mark
The chip 35 is not damaged. In addition, if the identification mark is outside the IC chip 35, the IC chip 35
, For example, on a lead provided on a lead frame to be connected to a pad of the IC chip. In this case, ball bonding as an identification mark may be performed on the lead, not for bonding connection. So, in this case,
Bonding head 2 for bonding wires
02 (shown in FIG. 23) functions as an identification mark providing means. Further, the wire as the identification mark may be attached to a separated portion made of an IC chip instead of the lead.

[0060] Next, detailed structure of the unloader _{D 1} shown in FIG.

[0061] As shown in FIG. 1, the unloader D ₁ is the magazine stocker apparatus 4 serving as a frame accommodating portion for accommodating a large number of lead frame to complete the bonding process
0, a frame transport device 41 as a frame relay unit for sequentially relaying the lead frames passing through the bonders C _{1 to} C ₃ described above and transporting the lead frame into the magazine stocker device 40, and the bonders C _{1 to} C 3. ₃ between the frame transport path from the frame ₃ to the magazine stocker device 40 and a predetermined position deviating from the frame transport path.
And a frame moving means 43 for moving F. Above the frame moving means 43, a microscope 45 for frame inspection is provided.

Hereinafter, first, the magazine stocker device 40
Will be described in detail.

As shown in FIG. 9, the magazine stocker device 40 includes a lifting mechanism base 48 and an adjusting means 4 for moving and adjusting the lifting mechanism base 48 in the direction of arrow C in FIG.
9 and a lifting mechanism 50.

The elevating mechanism base 48 is provided with adjusting means 49
As shown in FIG. 10, this adjusting means 49 has a lifting mechanism base 48 which is movable in the direction of arrow C.
A nut 51 having a female thread is fixed to an end of the nut 51, and the nut 51 and a threaded rod 52 having a male thread are screwed together. The screw rod 52 is screwed and connected to a bearing 53 fixed to a bonder main body 54, and a knob 55 is attached to an end. By turning the knob 55, the lifting mechanism base 48 can be moved in the direction of arrow C in FIG. If a control motor composed of a pulse motor is used instead of the knob 55, the moving amount of the lifting mechanism base 48 can be automatically digitally controlled. The lifting mechanism base 48 is supported by a fixed guide 56 shown in FIG.
a, 56b, guide bearing 57, eccentric guide 58
Are slidable with both ends regulated. The elevating mechanism base 48 is moved by the guide bearings 57 and the eccentric guides 58 to the guide rails 203a and 203b.
23 (see FIG. 23) can be adjusted in the direction perpendicular to the longitudinal direction to correct the mounting error of the lifting mechanism 50 fixed on the lifting mechanism base 48.

Next, in this elevating mechanism 50, as shown in FIG. 10, a lower end of an elevating shaft 59 having a male thread is supported by a bearing 48a of an elevating mechanism base 48, and an upper end thereof is provided by a pulse motor. (May be indirectly driven by gears, pulleys, etc.). An elevating member 62 having an external thread is screwed and coupled to the elevating shaft 59. The elevating member 61 is configured to be able to move up and down by rotating the control motor 60 forward and reverse.

The elevating member 61 is guided by two guide shafts (not shown) parallel to the elevating shaft 59.
The amount of movement of the elevating member 61 is controlled by control means such as a microcomputer (not shown). An upper sensor 62 and a lower sensor 63 for detecting upper and lower limit positions of the elevating member 61 are attached to predetermined positions of the elevating mechanism 50. Optical sensors are used for these sensors 62 and 63. Lifting member 6
A magazine receiving portion 65 having a substantially L-shaped cross section and receiving the lower end of the magazine 64 is attached to 1. A chuck 66 for pressing and holding the end of the magazine 64 is slidably attached to a free end of the magazine receiving portion 65, and the other end of the chuck 66 is disposed along an elevating shaft 59. It is configured to be able to contact the cam surface of the cam 59a. The cam 59a is connected to the elevating shaft 5 as shown in FIG.
9 are formed at the upper and lower positions of the cam 59 when the magazine receiving portion 65 is raised to receive and hold the magazine 64 or when the magazine receiving portion 65 is lowered to discharge the magazine 64.
The projection is formed so as to be pushed forward by a projection formed on the cam surface of FIG.

The details of the configuration of the magazine receiving portion 65 are shown in FIG.
1, the chuck 66 is fixed to the tip of the fixing member 65a, and the lower end of the fixing member 65a and the lower end of the holding base 65e are connected by a spring 65b. Is biased to the side. An activation member 65c is provided below the holding table 65e,
A sliding member 65d fixed to the fixing member 65a is configured to be slidable by being guided by the activation member 65c. A roller 65f is provided at the other end of the fixing member 65a, and the roller 65f moves along the cam surface.

Now, as shown in FIG. 11, when the magazine 64 placed on the holding table 65e, that is, the magazine is supplied,
Since the roller 65f pushes the chuck 66 forward against the urging force of the spring 65b by the convex portion of the cam 59a, there is a gap between the magazine 64 and the chuck 66. When the elevating member 61 descends and is positioned in the concave portion of the cam surface of the cam 59a, that is, when the magazine is fixed, the spring 65b
The chuck 66 holds the magazine 64 by the action of.
When it is further lowered, the chuck 66 is again pressed by the convex portion of the cam surface.
Is released from the state of holding the magazine 64 by protruding forward so that the magazine 64 can be discharged.

The magazine 64 is held by a chuck 66. The lead frame bonded on the bonding stage is placed in the magazine 64.
The lifting member 6 of the lifting mechanism 50 by a pusher (not shown)
As the number 1 is lowered, they are sequentially stored. This pusher
It is arranged almost parallel to the bonding stage surface,
It is configured to be driven by an air cylinder (not shown).

On the other hand, the side surface of the magazine 64 is shown in FIGS.
The first guide plate 71a, 71b and the second guide plate 72a, 72b are movably fixed to the stocker guide 67 by a stocker guide 67 formed in a substantially L-shape as shown in FIG. ing. This first
And second guide plates 71a, 71b and 72a, 72b
Is fixed to the regulating surface of the stocker guide 67, the stocker guide 67 can be expanded by moving the stocker guide 67 in the directions of arrows E and E 'shown in FIG. 9, and the second guide plates 72a and 72b can be extended. Guide rail 2
By moving along the regulating surface of the stocker guide 67 in a direction perpendicular to 03a, 203b (see FIG. 23), it can also be moved in the directions of arrows D and D '. Thus, it is possible to cope with the exchange of magazines 64 having different sizes. A plurality of magazines 64 inserted between the first and second guide plates 71a, 71b and 72a, 72b from above as shown in FIG. Until the stocker guide 67 (first guide plates 71a, 71b) serving as a reference surface is locked by the magazine pusher 70. Therefore, with this configuration, the magazine 24 is reliably regulated by the regulation surfaces of the first guide plates 71a and 71b fixed to the stocker guide 67 as shown in FIG. The timing of turning on and off the magazine pusher 70 is controlled by a control unit (not shown), but is turned on until the elevating member 61 rises and holds the magazine 64 as shown in FIG. It is turned off when held by. Then, when the elevating member 61 is lowered and the magazine 64 is discharged, control is performed so as to turn on again to lock the next magazine 64 (portion indicated by a broken line in the drawing) and wait until the elevating member 61 is raised. Have been. The magazine pusher 70 is driven by an air cylinder (not shown).

The configuration of the magazine stocker device 40 has been described above.

[0072] Next, the structure of the frame transport apparatus 41 as a frame relay means comprising unloader D ₁ shown in FIG.

As shown in FIGS. 12 to 16, the frame transfer device 41 has a base portion 81 fixed on the unloader main body by bolts or the like (not shown). The base portion 81 includes an upper plate 82 that is vertically separated from each other.
And a bottom plate 83, and two intermediate plates 84 and 85 interposed between the upper plate 82 and the bottom plate 83, and the respective plates are fixed to each other using bolts or the like. The two intermediate plates 84 and 85 are connected to each other in a T shape.

As is clear from FIGS. 12 and 13, on the upper plate 82 of the base portion 81, the first direction in which the lead frame is to be transported,
A total of four belt wheels 87 and 88 are provided separately from each other. Of these four belt wheels, two belt wheels 87 arranged on the upstream side in the line flowing direction L
Is attached to the upper plate 82 as follows.

That is, a pair of brackets 90 are fixed on the upper plate 82, and a ball bearing (FIG. 1) is attached to the end of a shaft 91 attached to each bracket 90.
5 (not shown).

On the other hand, the other two belt wheels 88 disposed upstream of these belt wheels 87 are attached as follows.

FIGS. 12 and 13 and FIGS. 15 and 16
As shown in the figure, the upper plate 82 of the base portion 81 is provided with a slide plate 9 so that the position thereof can be adjusted along the line flowing direction L.
2 are provided. More specifically, as is apparent from FIG. 13, the slide plate 92 is formed with two longitudinal insertion holes 92a extending in the direction in which the position is to be adjusted, and bolts 93 inserted through these insertion holes 92a. Are screwed to the upper plate 82. That is, the position of the slide plate 92 can be adjusted by loosening the bolt 93. In addition, as shown in FIG.
The upper plate 82 has a screw hole 82a into which the bolt 93 is to be screwed.
However, a large number of them are arranged in a line in the direction in which the position adjustment is to be performed. As is apparent from FIG. 16, a pair of brackets 90 are fixed on the slide plate 92, and ball bearings 95 are attached to the two brackets.
A spindle 96 is rotatably mounted via the. The two belt wheels 88 are provided with the spindle 96.
It is stuck to. That is, by adjusting and changing the position of the slide plate 92, the two belt wheels 87 and 88 on the upstream side and the downstream side are configured to relatively approach and separate from each other.

As shown in FIGS. 13 and 16, another belt wheel 97 is fixed to the end of the spindle 96. A flat support plate 99 is fastened to the side of the slide plate 92 by bolts, and the motor 100 is attached to the support plate 99.
A belt wheel 101 is fixed to the output shaft of the motor 100, and an endless belt 102 is wound around the belt wheel 101 and the belt wheel 97. That is, the spindle 96 is rotated by the motor 100.

On the other hand, as shown in FIGS. 12 to 15, the outer main surface of the intermediate plate 84 constituting a part of the base portion 81 has
The guide rail 105 is fastened by bolts so as to extend in the direction L in which the lines flow, that is, in the direction intersecting the direction in which the lead frame is to be transported, in this case, in the vertical direction. A slider 106 is slidably mounted along the guide rail 105. A pair of brackets 107 are fixedly provided on both left and right sides of the slider 106, and ball bearings (shown in FIG. 14, but denoted by reference numerals are attached to ends of shafts 108 attached to the respective brackets 107). Not)
The belt wheel 109 is attached via the. An endless belt 110 is hung on the belt wheel 109 and the belt wheels 87 and 88 on the upper plate 82 described above.
The belt 110 is for abutting on the lead frame L # F to transport the lead frame. In addition,
As shown in FIGS. 12 and 13, pulleys 112 and 113 for abutting on the belt 110 to guide the belt 110 and to apply a required tension are provided on the base portion 81.
Is provided.

As shown in FIG. 12, FIG. 14 and FIG. 15, a positioning plate 115 is fastened to a side end of a slider 106 which can carry the above-mentioned belt wheel 109 and move up and down by bolts 116. As shown in FIG. 12, the positioning plate 115 includes a slider 106
A single longitudinal insertion hole 115a extending in the up and down direction in which the sliding member 115 slides is formed. A bolt 117 is inserted into the insertion hole 115a, and is screwed to a side end of the intermediate plate 84. That is, the position of the slider 106 can be adjusted by loosening the bolt 117. As shown in FIG. 12, a large number of screw holes 84a into which the bolts 117 are to be screwed are formed in the intermediate plate 84 in a direction in which the position is to be adjusted. As shown in FIGS. 12, 13 and 16, a slide plate 92 provided on the base 81 is slidably provided on the left and right sides of the lead frame L # F to guide the lead frame. A pair of guide members 120
Is provided.

The motor 100, the pulleys 97 and 101, and the belt 102 constitute torque applying means for applying torque to each of the pulleys 87, 88 and 109. Further, the belt 110 is formed by the torque applying means, the belt wheels 87, 88, and 109, the base portion 81, and peripheral members related thereto.
The driving means for driving is configured.

In the frame transporting device 41 having the above-described structure, the bolts 93 and 117 are loosened to adjust the positions of the slide plate 92 and the slider 106, so that the belt wheel 87, which is the fixed side, is movable as the movable The cars 89 and 109 move. That is, in the direction in which the lead frame L # F is to be transported, the belt 1
The length of 10 is variable. in this way,
Since the length of the belt 110 for transporting the lead frame is made variable in the lead frame transport direction, even if the type of the lead frame to be handled is changed and the length of the lead frame is changed, the length of the belt 110 may be changed. Can be dealt with quickly and easily.

In this embodiment, the frame transport device 41 as the frame relay means described above includes the magazine stocker device 40 as the frame accommodating portion of the unloader D ₁ (see FIG. 1) and the bonders C _{1 to} C ₃ . , But a loader (not shown) for accommodating a large number of lead frames that have not yet been subjected to bonding processing and sequentially supplying the lead frames to the bonders C _{1 to} C ₃ is provided. In this case, the loader and each bonder C ₁ to
The frame transport apparatus 41 may be provided between the C _3.

[0084] Next, the configuration of the frame moving means 43 comprising the unloader _{D 1} shown in FIG. As described above, the frame moving means 43 is provided with each of the bonders C ₁ to C ₁ .
And frame transport path to the magazine stocker unit 40 as a frame accommodating unit described above from C _3, those for moving the lead frame L\F between deviant lateral position from the frame transport path. As shown in FIG.
A microscope 45 is disposed above the frame moving means 43. The microscope 45 is provided for the IC chip 35 for a lead frame which has been deviated from the frame transport path and moved to the predetermined position, that is, the inspection position.
This is for performing various inspections on the connection state of the wires to the pads and leads (see FIG. 7) and the tension of the wires. After the inspection, if there is no problem, the frame moving means 43 is operated in the reverse direction to return the lead frame to the frame transport path again. Since the frame moving means 43 is provided, the inspection of the lead frame can be performed without stopping the line operation, and the efficiency of the bonding operation is improved, while each inspection can be easily performed.

The frame moving means 43 as described above
The positions to be installed, bonder C ₃ and the frame transport apparatus 41 as in the present embodiment (this position is see Figure 1) is not limited to between the, possible inspection of the lead frame L\F is It may be installed anywhere as long as it is located. In addition, the number of the frame moving units 43 to be installed is not limited to one, and a plurality of frame moving units 43 may be provided at appropriate positions.

The details of the frame moving means 43 are as follows.

As shown in FIGS. 17 to 19, the frame moving means 43 has a fixed base 131 fixed on the unloader main body. On this fixed base 131,
Two guide rails 132 are fixedly provided so as to extend perpendicular to the line flowing direction L and parallel to each other. As shown in FIGS. 18 and 19, two sliders 1 on each of these guide rails 132 are provided.
35 is slidably mounted. A flat movable table 136 is fastened to these sliders 135 by bolts (not denoted by reference numerals). Then, as shown in FIG. 17 and FIG.
A cylinder 138 which is operated by hydraulic pressure or compressed air pressure is fixedly provided at the rear of the cylinder 31, and an output shaft of the cylinder 138 is connected to the movable table 136.
That is, when the cylinder 138 is operated and its output shaft protrudes and retracts, the movable table 136 moves the guide rail 1.
It is configured to reciprocate along 32. These guide rails 132, sliders 135,
The movable table 136 and the cylinder 138 constitute driving means for synchronously moving the following pair of frame guide mechanisms in a direction crossing the frame transport path.

As is apparent from FIG. 17, a pair of frame guide mechanisms 141 and 142 are provided on the movable table 136 so as to be parallel to each other and to form a frame transport path. As shown in FIG. 18, one of the frame guide mechanisms 141 is made of a relatively thin steel plate or the like, and a pair of left and right guide members 141a and 141 for slidingly contacting the lead frame and guiding the lead frame.
b and is fixed to the movable table 136.

On the other hand, the other frame guide mechanism 142 is detachable from the movable table 136,
It is configured as follows.

That is, as shown in FIGS. 20 and 21, the frame guide mechanisms 142 are arranged in parallel with each other, and each have a frame guide surface 144a having an L-shaped cross section inside.
Are formed, and two connecting plates 145 for connecting the two guiding members 144 to each other near both ends of the respective guiding members. In addition, these coupling plates 145 are connected to both guide members 1.
44 is fastened by bolts 145a. Each of the guide members 144 has a tapered surface 144b for smoothly introducing the lead frame L＼F into a frame guide surface 144a provided therein. A knob 146 is attached to the upper surface of the coupling plate 145. More specifically, as shown in FIG. 21, the knob 146 is fastened to the coupling plate 145 by bolts 146a inserted through the lower surface of the coupling plate 145.

As described above, by making the frame guide mechanism 142 for guiding the lead frame L と す る F detachable from the movable table 136 that carries the same,
The following effects can be obtained.

That is, when the lead frame L # F is brought into the frame guide mechanism 142 through the previous frame transport path, the operator grips the knob 146 and holds the frame guide mechanism 142 with the lead. Frame L＼F
At the same time, the lead frame can be detached from the movable table 136 and transported to a work area where a higher-magnification microscope or an electrical continuity test can be performed. . In addition, as a result of these inspections, when it is confirmed that the lead frame is normal, if the frame guide mechanism 142 is mounted on the movable table 136 again, the lead frame is returned to the transport path as before. It is.

By the way, the above-mentioned frame moving means 43
Can be used to connect the lead frame L＼F to both frame guide mechanisms 1
Frame transport means for transporting along frame 41 and 142 is provided. Hereinafter, the frame transport means will be described.

First, the first frame transport means for transporting the lead frame along one frame guide mechanism 141 will be described. As shown in FIGS. 17 and 18, the first frame transporting means is
1 has a motor 151 arranged on the left end side. The motor 151 is fixed to the movable table 136. As shown in FIG. 18, two brackets 15 are provided on the lower surface side of the movable table 136 and near the motor 151.
2 are fixedly mounted, and a spindle 153 is supported by these brackets 152 via ball bearings 154. The spindle 153 is connected to an output shaft of the motor 151 by a coupler 151a. Also, as shown in FIG.
A belt wheel 156 is fixed to an end of the belt wheel 53.

On the other hand, as shown in FIG. 17, the movable table 1 is positioned so as to correspond to the position of the bracket 152 described above.
Two brackets 157 are also fixed on the upper surface side of 36. These brackets 157 allow the spindle 15 to move through ball bearings (not denoted by reference numerals).
8 is rotatably held. This spindle 158
A belt wheel 159 is fixed to the end of the belt wheel 157, and an endless belt 160 is wound around the belt wheel 159 and the belt wheel 156 located below the belt wheel 159. Two belt wheels 162 are fixed to the spindle 158 at positions sandwiched between two brackets 157 that support the spindle 158.

As shown in FIG. 17, two brackets 163 are fixedly provided on the right end side of the frame guide mechanism 141 and on the upper surface side of the movable table 136.
A shaft 164 is attached to these brackets 163, and a belt wheel 165 is rotatably attached to each of the shafts via a ball bearing or the like (not shown). Then, the frame guide mechanism 141
A belt 167 is wound around the belt wheel 162 provided on the left end side and the belt wheel 165 on the right end side so as to abut on and transport the lead frame L # F in an endless manner. That is, these belts 167 are driven by the rotation of the motor 151.

The first frame transport means for transporting the lead frame L # F along one frame guide mechanism 141 is configured as described above.

Next, the second frame transport means for transporting the lead frame L # F along the other frame guide mechanism 142 will be described. As shown in FIG. 17, the second frame conveying means is
2 has a motor 171 disposed at the right end thereof, and the motor is mounted on the movable table 136. FIG.
As shown in FIG. 9, a bracket 172 is fixed to the lower surface side of the movable table 136, and the spindle 173 connected to the output shaft of the motor 171 is rotatably supported by the bracket 172. A belt wheel 174 is fixed to an end of the spindle 173.

On the other hand, two brackets 176 are fixedly provided on the upper surface of the movable table 136 so as to correspond to the brackets 172 described above. The spindle 178 is rotatably held by these brackets 176 via ball bearings (not shown). A belt wheel 179 is fixed to an end of the spindle 178.
An endless belt 180 is wound around the belt wheel 179 and the belt wheel 174 located below the belt wheel 179. The spindle 178 has the spindle 17
8 between the two brackets 176 that support
Two belt wheels 183 are fixed.

As shown in FIG. 18, two brackets 181 are fixedly provided on the left end side of the frame guide mechanism 142 and on the upper surface side of the movable table 136. Each of the brackets 181 has a shaft 182 attached thereto.
3 is rotatably mounted via ball bearings (not labeled). The belt wheel 17 provided on the right end side of the frame guide mechanism 142
An endless belt 184 for contacting and transporting the lead frame L # F is wound around the belt wheel 9 and the left end belt wheel 183. That is, the motor 171
The belt 184 is configured to be driven by the rotation of.

The second frame transport means for transporting the lead frame L # F along the other frame guide mechanism 142 is configured as described above. 17 and FIG.
As shown in FIG. 8, one end of a flexible cable 185 for turning on the power to the two motors 151 and 171 is connected to the rear end of the movable table 136.

The frame moving means 43 having the above structure operates as follows.

First, when operating the frame moving means 43, the operator performs the following operation.

For example, lead of lead frame and IC
Leadframe various tests for such tension of the connection state and the wires of the wire to the chip pads are bonded processed by for example first unit bonder C ₁ among the bonder C ₁ -C ₃ shown in FIG. 1 When the operator wants to perform this operation, the operator selects one of the three selection buttons (not shown) corresponding to the bonders C _{1 to} C ₃ arranged on the front surface of the unloader D ₁ (shown in FIG. 1). Press the selection button corresponding to the _first bonder C1. Then, a control unit (not shown) that controls the operation of the entire automatic bonding apparatus performs the following operation control according to the selection signal.

[0105] First, a lead frame bonded in bonder _{C 1} is brought to on the fourth transporting mechanism 213 shown in FIG. 23. Then, a detection signal indicating that the lead frame has arrived on the transport mechanism 213 is issued to the control unit by the sensor 215a.
As a result, the cylinder 216 is operated, and the fourth transport mechanism 213 moves to the position shown in FIG. Subsequently, the transport mechanism comprising the bonder C ₁ of the first unit, the transport mechanism having the other bonder C ₂ and C _3, a frame conveying means including a belt 184 having a frame moving means 43 shown in FIG. 17 Respectively, whereby the lead frame is moved by the frame guide mechanism 1 of the frame moving means.
42. And this frame guide mechanism 1
The detection unit including an optical sensor (not shown) provided below 42 detects that the lead frame has arrived on the frame guide mechanism 142, and the control unit outputs a detection signal generated by the detection unit. Belt based on 18
4 is stopped. Thereafter, the following operation is performed.

That is, the cylinder 1 shown in FIGS.
38 is actuated and its output shaft protrudes, and the movable table 136 moves downward in FIG. Therefore,
Until the fifth transport mechanism comprising the upper bonder C ₃ as shown in FIG. 17 214 (or the fourth transport mechanism 21
The frame guide mechanism 142, which has formed the frame transport path together with 3), moves to the lateral position deviating from the frame transport path, that is, the inspection position, while holding the lead frame to be inspected. On this inspection position,
A microscope 45 shown in FIG. 1 is provided, and an operator can perform the above-described various inspections with the microscope 45. When a more detailed inspection needs to be performed, the frame guide mechanism 142 is detachable from the movable table 136. Therefore, the frame guide mechanism 142 is removed and transported to the inspection area to perform a required inspection. After removing the frame guide mechanism 142 for inspection, a new frame guide mechanism 142 having the same shape may be attached.

On the other hand, when the inspection frame guide mechanism 142 reaches the inspection position by moving the movable table 136, the outer frame guide mechanism 1 is placed on the movable table 136.
The other frame guide mechanism 141 provided in parallel with 42
There was consistent with the fifth of the preceding bonder C ₃ (or 4) transport mechanism 214 (213) of the frame conveying passage is ensured without cutting. Therefore, the inspection work can be performed while the line work is continued.

When the inspection of the lead frame is completed as described above, the operator presses a release button (not shown) different from the above selection button. By doing so, the detection means (disposed below the frame guide mechanism 142)
A reset signal is issued in response to the control command controlled by the detection signal, and the operation returns to the normal operation state.

As described above, each of the bonders C ₁ to C ₁
In C _3, because the identification mark corresponding to the respective bonder (shown in FIGS. 7 and 8) is attached, this as confirmation means inspected serving leadframe by the control unit or the operator to the lead frame Can also be used.

[0110] Incidentally, when the lead frame is bonded processed by bonder C ₁ as mentioned above is conveyed to the frame guide mechanism 142 is a test position throughout the conveying path, the other bonder C ₂ and C ₃ The sequence of the control unit is controlled so that the bonded lead frame is not positioned on the transport path. This is to prevent an accident or the like due to the presence of two or more lead frames in the transport path at the same time. Conversely, in order to bring the lead frame sent out from the bonder C ₁ to the inspection position, the bonder C ₁
Even if the selection button corresponding to is pressed, if the bonding of the lead frame has not yet been completed,
Lead frame made by other bonder C ₂ or C ₃ is fed to the conveying path arriving on said frame guiding mechanism 142, but at this time, the belt 184 by a signal from the detecting means (not shown) described above It is controlled so that it is not stopped and is sent out to the subsequent frame transport device 41 (see FIGS. 1 and 12 and the like), and is sequentially stored in the subsequent magazine stocker device 40 via the frame transport device 41. I have.

[0111]

As described above, according to the present invention,
Even when a plurality of bonders are incorporated as a line, it is possible to quickly determine which bonder the frame has been bonded to by using the identification mark attached to the frame, and to form a loop. In the event that a defect such as the above occurs, there is an effect that the bonder to be repaired and adjusted can be immediately known based on the inspection result of the frame and an appropriate measure can be taken.

[Brief description of the drawings]

FIG. 1 is a front view of an automatic bonding apparatus according to the present invention.

FIG. 2 is an enlarged plan view of a part of a bonder equipped with the automatic bonding apparatus shown in FIG.

FIG. 3 is a GG arrow view including a partial cross section with respect to FIG. 2;

FIG. 4 is an HH arrow view including a partial cross section related to FIG. 2;

FIG. 5 is an enlarged view of a part of the configuration shown in FIG. 3;

FIG. 6 is a view as viewed in the direction of an arrow II including a partial cross section with respect to FIG. 5;

FIG. 7 is a plan view of a lead frame to be subjected to a bonding process by the automatic bonding apparatus shown in FIG. 1;

FIG. 8 is a diagram showing a modification of the identification mark added to the lead frame shown in FIG. 7;

FIG. 9 is a plan view of a magazine stocker device as a frame accommodating portion provided in an unloader provided in the automatic bonding device shown in FIG. 1;

FIG. 10 is a longitudinal sectional view of the magazine stocker device shown in FIG. 9;

FIG. 11 is an enlarged view of a part of the magazine stocker device shown in FIGS. 9 and 10;

FIG. 12 is a front view including a partial cross section of a frame transfer device as a frame relay unit provided in an unloader provided in the automatic bonding device shown in FIG. 1;

FIG. 13 shows J including a partial cross-section with respect to FIG.
FIG.

FIG. 14 is a view taken in the direction of arrows KK in FIG. 12;

FIG. 15 shows M including a partial cross section with respect to FIG. 12;
FIG.

FIG. 16 shows an N including a partial cross-section with respect to FIG.
FIG.

FIG. 17 is a plan view of a frame moving unit provided in an unloader provided in the automatic bonding apparatus shown in FIG. 1;

FIG. 18 shows P including a partial cross section with respect to FIG.
FIG.

FIG. 19 shows Q including a partial cross section with respect to FIG. 17;
It is an arrow Q view.

FIG. 20 is a plan view of a frame guide mechanism included in the frame moving means shown in FIGS. 17 to 19;

FIG. 21 is a cross-sectional view of a part of FIG.
FIG.

FIG. 22 is a front view of a conventional automatic bonding apparatus.

FIG. 23 is a perspective view of a bonder included in the automatic bonding apparatus shown in FIG.

FIG. 24 is a side view of a part of the bonder shown in FIG. 23, including a partial cross section.

FIG. 25 is an explanatory diagram of the operation of the part shown in FIG. 24;

FIG. 26 is an explanatory diagram of the operation of the bonder shown in FIG. 23;

FIG. 27 is an explanatory diagram of the operation of the bonder shown in FIG. 23;

FIG. 28 is an explanatory diagram of the operation of the bonder shown in FIG. 23;

FIG. 29 is a longitudinal sectional view of a main part of a magazine stocker device provided in the automatic bonding device shown in FIG. 22.

FIG. 30 is an enlarged view of a part of the main part shown in FIG. 29;

FIG. 31 is an enlarged view of a part of a main part shown in FIG. 29;

FIG. 32 is a view as viewed in the direction of arrows WW in FIG. 31;

FIG. 33 is a view on arrow XX of FIG. 29;

FIG. 34 is an enlarged view of a part of the magazine stocker device provided in the automatic bonding device shown in FIG. 22;

FIG. 35 is a longitudinal sectional view of a main part of a curing device provided in the automatic bonding device shown in FIG. 22;

FIG. 36 is a schematic perspective view of the curing device shown in FIG. 35, and a die bonder device and a bonder before and after the curing device.

[Explanation of symbols]

A ₂ die bonder device B ₁ cure device C ₁ , C ₂ , C ₃ bonder D ₁ unloader E molding device 10 identification mark applying means 15, 138 cylinder 21 punch 26 stamping 35 IC chip (semiconductor component) 40 magazine stocker device (frame accommodation) Part) 41 frame transfer device (frame relay means) 43 frame moving means 45 microscope 81 base part 92 slide plate 100, 151, 171 motor 105, 132 guide rail 120, 144, 141a, 141b guide member 131 fixed base 136 movable table 141 , 142 Frame guide mechanism

Claims (2)

(57) [Claims] 1. A bonder for receiving a frame sequentially supplied while holding a semiconductor component on a bonding stage and performing a bonding process on the frame by a bonding head , on a frame supply side of the bonding stage relative to the bonding stage.
And attaching an identification mark corresponding to the bonder to the frame, which is provided separately from the bonding head.
An identification mark providing means, wherein the identification mark is provided to the frame by the identification mark providing means.
A configuration in which the bonding process is performed after attaching a mark;
Bonder, characterized in that it was. 2. A plurality of bonders for receiving a sequentially supplied frame holding semiconductor components on a bonding stage and performing bonding processing on the frame by a bonding head , and receiving the frame passing through each of the bonders. automatic bonding apparatus odor and a unloader to accommodate Te
The bonding stage of each of the bonders.
And the bonding head on the frame supply side.
And an identification mark attaching means for separately attaching an identification mark corresponding to each of the bonders to the frame.
The identification mark is given to the frame by the identification mark applying means.
A configuration in which the bonding process is performed after attaching a mark;
Automated bonding apparatus characterized by the.