JPH03155154A - Cooling method for lead frame and cooling mechanism thereof - Google Patents

Abstract

PURPOSE:To immediately send a heated lead frame to a bonding device without waiting until its temperature drops by cooling the frame passed over a conveying passage by cooling means provided oppositely to the passage for conveying the heated frame. CONSTITUTION:When a heated lead frame is sent onto the belt 55d of a conveying mechanism 55, the end of the frame is held between a frame retaining roller 61 and the belt 55d, and dragg to a conveying direction. This roller 61 is rockably formed to easily hold the frame, and to press the frame to the belt 55d side, thereby effectively conveying it in close contact with the belt. When the frame is sent to the conveying direction, air is always diffused from air diffusers 66, 67. Accordingly, the heated frame is conveyed while being effectively cooled, and the heat of the frame does not affect the mechanism 55.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a bonding device, and in particular, the present invention relates to a bonding device, and in particular, when a lead frame manufactured by being thermally hardened by a Gui bonder device and a heating device is conveyed to the bonding device, it is heated. The present invention relates to a lead frame cooling method for cooling a lead frame and its cooling mechanism.

[Background Art] Conventionally, a lead frame formed by bonding using a bonding device is thermally hardened using a heating device such as an electric furnace.

The heated lead frame waits in the heating device until the temperature drops due to natural cooling, and then is sent to the bonding device and bonded.

[Problems to be Solved by the Invention] However, conventional devices have the disadvantage that they cannot be sent to a bonding device immediately because they wait until the temperature of the lead frame drops. Additionally, in conventional devices, if the lead frame is sent onto the bonding device's conveyance mechanism before its temperature drops, the belt may be damaged by heat if the conveyance mechanism is made of a resin belt or the like. There is a drawback. This is usually done in consideration of the balance between the throughput of the die bonder and the bonding apparatus, so there is a high possibility that the die will be sent without being completely cooled, which is undesirable from the standpoint of equipment safety.

The present invention was made in view of the above-mentioned drawbacks of the prior art, and when transporting a lead frame manufactured by thermosetting with a die bonder device and a heating device to a bonding device,
It is an object of the present invention to provide a lead frame cooling method and a cooling mechanism capable of cooling a heated lead frame and transporting the heated lead frame to a bonding apparatus.

[Means for Solving the Problems] The present invention is such that a lead frame passing on a conveyance path surface is cooled by a cooling means provided opposite to a conveyance path surface on which a heated lead frame is conveyed. be.

Further, the present invention includes a conveyance means for conveying a heated lead frame, a cooling means provided opposite to a lead frame conveyance path surface of the conveyance means, and a support means for supporting the cooling means, The lead frame passing over the conveyance path is cooled by the cooling means.

Further, the present invention provides a conveying means for conveying the heated lead frame, a cooling means provided opposite to a lead frame conveying path surface of the conveying means, and a cooling means for conveying the heated lead frame between the conveying means and the cooling means. The lead frame holding means is configured to include lead frame holding means that is swingable in a direction away from the road surface.

[Example] Next, an example of the present invention will be described in detail using the drawings.

FIG. 1 is a diagram schematically showing the configuration of a lead frame conveyance mechanism of a bonding apparatus.

In Figure 1, the bonding device (indicated by a two-dot chain line)
The bonding head 2 placed on the main body of the bonding head 1 includes a camera having a camera head, a lens, and an illumination light,
XY table drive mechanism that can move in the X and Y directions (
(not shown). This bonding head 2 connects an IC chip (island), which is a component to be bonded, on a bonding stage (this bonding stage includes a bonding work section that performs bonding connections and a plurality of chips before and after the chip). The image is taken and the leads of the lead frame are bonded to the electrodes on the chip. The lead claims on which the chips to be imaged by the bonding head 2 are arranged are positioned and adjusted to optimal spacing positions by the first guide rail 3a and the second guide rail 3b.

In this embodiment, the distance between the first and second guide rails 3a and 3b and both ends of the lead frame is set to about 0.1 mm. These first and second guide rails 3a
A third transport mechanism 4 is provided in parallel with and 3b.

This third conveyance mechanism 4 includes a pair of rollers 4a supported by one shaft.

Two belts 4b are provided, and two belts 4c and 4d are provided between the rollers 4a and 4b, and the roller 4b is formed of a double roller. The roller 4e is connected to another roller 4e by a belt 4f, and the roller shaft and the shaft of the drive motor 4g are connected and driven. The belts 4C and 4d of the third conveyance mechanism 4 are configured to be rotatable in forward and reverse directions by the rotational driving force of the drive motor 4g. These two belts 4C and 4d
A detection sensor 5 for detecting the arrival of a lead frame is arranged near the unloader side (lead frame transport direction) at the center of the gap. The detection sensor 5 is composed of a reflective optical sensor or the like.

Next, the transport means on the loader side will be explained.

The transport means on the loader side (lead frame supply side) is composed of first and second transport mechanisms 6 and 7. This first
The second transport mechanisms 6 and 7 are driven by one motor 8.

First, the first and second transport mechanisms 6 and 7 are provided in parallel on the Rogue unit 9 in a direction parallel to the longitudinal direction of the first and second guide rails 3a and 3b. The end of this loader unit 9 is connected to the tip of the shaft 10a of the longitudinal sliding cylinder 10, and the first and second
It is configured to be movable on the upper surface of the bonding apparatus 1 main body in a direction perpendicular to the longitudinal direction of the guide rails 3a and 3b. Timing control of the forward and backward movement of the cylinder (switching means) 10 is controlled by a control circuit including a microprocessor (not shown), and the forward and backward positions of the cylinder are controlled by the first and second transport mechanisms 6.7. Control is performed so that the center coincides with the center of the first and second guide rails 3a, 3b and the center of the third transport mechanism 4 (the portion shown by the - dotted chain line). Needless to say, the center position control is adjustable. This first and second
The transport mechanisms 6 and 7 have substantially the same configuration as the third transport mechanism 4 described above, and include a pair of rollers 6 supported by one shaft.
A conveyance mechanism consisting of two belts 6c and 6d are disposed in parallel, and two belts 6c and 6d are disposed between the rollers 6a and 6b. axis 6
The first and second conveyance mechanisms 6 and 7 are connected at b, and one of the rollers 6b of the first conveyance mechanism 6 is formed of a double roller, and the roller 6b and other rollers other than the above are connected. The roller 6e is suspended by a belt 6f, and the shaft of the roller 6e is connected to the shaft of the drive motor 8, so that the first and second conveyance mechanisms 6 and 7 are driven to rotate coaxially. ing. Further, the first and second transport mechanisms 6 and 7 include a first
And a lead frame detection sensor 11.12 near the lead frame supply side to the second guide rails 3a and 3b.
is installed.

Next, the fourth and fifth transport mechanisms 13 and 14 have the same configuration as the above-mentioned first and second transport mechanisms 6 and 7,
It is provided on the unloader side. The third and fourth transport mechanisms 13 and 14 are also driven by one motor like the first and second transport mechanisms 6 and 7, but the fourth and fifth transport mechanisms 13 and 14 are driven by one motor. It may also be driven by a drive motor. Further, the lead frame detection sensors 15 and 16 are connected to the lead frame ejection side, that is,
It is arranged near the belt tip in FIG.

Next, FIGS. 2 and 3 are cross-sectional views showing the detailed structure of the loader unit in which the first and second transport mechanisms shown in FIG. 1 are mounted, viewed from a direction perpendicular to the lead frame transport direction. It is.

In FIG. 2, the first base 17 is fixed on the main body of the bonding device 1. As shown in FIG. A cam 18 is disposed on this first base 17. A continuous inclined surface is formed at the center of the cam surface of the cam 18, so that linear movement is possible. In addition, the first base 17
A support frame 20 that supports the longitudinal sliding cylinder 10 (16) is vertically provided on the left side of the cylinder. A second base 21 having a circular cross section is connected to the shaft end of the cylinder 10. Inside this second base 21 is a connecting shaft 22 that connects the first and second transport mechanisms 6 and 7.
A coupling 23 for receiving the connecting shaft 2 is provided.
The other end of the belt drive motor 2 is connected via a coupling 23 to a motor shaft of a belt drive motor 8 fixed to the second base 21 . As already explained in FIG. 1, the first conveyance mechanism 6 has support stands 24a and 24b formed vertically on the second base 21 to support roller shafts on which two belts are passed. . Further, in the second conveyance mechanism 7, like the first conveyance mechanism 6, support stands 25a and 25b for supporting roller shafts are vertically formed on the second base 21.

A holding stand 26 having a U-shaped cross section is provided on both sides of the support stands 25a and 25b of the second transport mechanism 7, and a vertical guide 27 is provided on the side surface of this holding stand 26. The vertical guide 27 is configured to fit into a groove formed in the bearing 23 so as to be able to slide vertically. A column 28 is provided on the lower surface 26a of the holding table 26, and a ball bearing 29 is rotatably provided at the tip of this column 28. The tip of the ball bearing 29 of this support column 28 is brought into contact with the cam surface of the cam 18 through a hole 30 made in the second base 21 . Furthermore, guide rails 31a and 31b each having a curved cross section are provided at the upper end of the holding table 26. The guide rails 31a and 31b are configured to be adjustable depending on the width of the lead frame.

The height of the guide surfaces of the guide rails 31a and 31b is set to be at least the same as or approximately the same as the height of the conveying surfaces of the lead frames of the first and second guide rails 3a and 3b.

The above configuration has the same configuration on the loader side and the unloader side.

The operation of the upper and lower parts including the Rogue unit 9 will be explained below with reference to FIGS. 2 and 3.

In FIG. 2, the shaft 10a of the cylinder 10 is in a suctioned state, and the position of the second base 21 connected to the tip of the shaft is controlled in a pulled state. At this time,
The first and second transport mechanisms 6 and 7 are first and second guide rails 3a.

3b and the conveyance path of the third conveyance mechanism 4 coincide with each other, that is, the state shown in FIG. 1 is reached. At this time, the bearing 29 provided on the lower surface of the holding base 26 is attached to the uppermost portion 18 of the cam surface.
It is located at H. Therefore, when the lead frame is located at the lowermost part 18L of the cam surface shown in FIG. Both ends of the lead frame are held and raised by the guide rails 31a and 31b of 26, and the lead frame is gently separated from above the belts 7c and 7d. This is because the cam 18 surface allows continuous movement. In the state shown in FIG. 2, the lead frame is also conveyed onto the belt of the first conveyance mechanism 6 from an external device (not shown). Therefore, in this state, the lead frame can be continuously transported on the transport path of the third transport lit mechanism 4.

Next, the guide rails 31a and 31 of the second transport mechanism 7
When the lead frame placed on the guide surface b is pushed out onto the conveyance path of the first and second guide rails 3a and 3b by the lead frame pusher cylinder 19, the shaft 10a of the longitudinal slide cylinder 10 protrudes. The state shifts to the state shown in FIG. That is, the second base 21 is moved from 18H to 18L along the cam surface.

At this time, the guide surfaces of the guide rails 31a and 31b of the holding stand 26 descend to a position lower than the top surface of the belt (
(see FIG. 3), a new lead frame is transported from an external device (not shown). At this time, the first conveyance mechanism 6 is located at a position farther from the conveyance path, so no lead frame is placed on the belt.

The above is the operation of the rogue unit 9, and the same operation is performed on the unloader side as well.

Next, the route along which the lead frame is conveyed using this apparatus will be explained in detail with reference to FIGS. 4 to 6.

First, the shaft 10a of the longitudinal sliding cylinder 10 on the loader side protrudes from the state shown in FIG. 1, and the rogue unit 9 is moved to the state shown in FIG. 4.

A lead frame (L/F
) is supplied from the direction of the arrow. When the detection sensor 12 detects this lead frame, the rotation of the transport drive motor 8 that drives the belt is stopped by a command from the control circuit. Thereafter, the front and rear cylinders 10 operate in the suction direction to move the Rogue unit 9 to the state shown in FIG. At this time, the transport paths of the first and second transport mechanisms 6 and 7 coincide with the transport paths of the first and second guide rails 3a and 3b where the bonding stage is located, and the transport path of the third transport mechanism 4. Stop. The first and second guide rails 3a and 3b are moved by the lead frame beam busher cylinder 19 placed on the guide rails 31a and 31b of the second transport mechanism 7 shown in FIG.
The lead frame is pushed out onto the upper guide surface. The lead frames sent onto the guide rails 3a and 3b are not clamped by a transport mechanism (not shown) and are intermittently fed by l pitches, and then heated to a predetermined temperature on a bonding stage and bonded. During this time, since the conveyance path of the first conveyance mechanism 6 coincides with the conveyance path of the third conveyance mechanism 4, the fifth conveyance mechanism 14 is connected to other devices other than this device.
The lead frame can be supplied via. Next, the lead frame bonded and connected on the bonding stage is discharged onto the transport path of the fourth transport mechanism 13 provided on the unloader side, and after being detected by the lead frame detection sensor 15 and the rotation of the motor is stopped, The front and rear cylinder 16 on the unloader side acts in the projecting direction to move the unloader unit to the state shown in FIG.

Then, the lead frame whose bonding connection has been completed is transported to the next device.

The above is a series of operations in which lead frame bonding and the like are performed using the transport mechanism and the like of this apparatus.

FIG. 7 shows bonding devices C+, Cm, and Cs equipped with the above-mentioned lead frame conveyance mechanism arranged in series.
FIG. 2 is a diagram showing the configuration of a system in which a lead frame formed by a die bonder device A and a heating device B is wire-bonded using the bonding device, and the bonded lead frame is stored in a magazine stocker device. . Although three bonding devices are shown in this embodiment, more than three bonding devices can be connected.

FIG. 8 is a diagram showing one embodiment of the present invention, and is a front view showing a schematic configuration of a lead frame cooling mechanism, and FIG.
FIG. 10 is a plan view of FIG. 8, and FIG. 10 is a side view of FIG. This lead frame cooling mechanism is designated by reference numeral E in FIG.

The configuration of this lead frame cooling mechanism is shown in Figures 8 to 1.
This will be explained using Figure 0.

In the figure, an end portion 50a of the first base member 50 is fixed to a bonding device mounting portion Ca with a bolt. A hook-shaped second base member 51 is fixed to the other end 50b of the first base member 50 with a bolt. A transport mechanism base 52 is fixed to this second base member 51, and a transport mechanism 55 is mounted on this transport mechanism base 52. Further, a drive mechanism 60 for driving the conveyance mechanism 55 is mounted on the first base member 50 .

In the conveyance mechanism 55, roller frames 55a and 55a' formed in an abbreviated shape are arranged facing each other on the conveyance mechanism base 52, and rollers 55b are disposed on the roller frames.
and 55b' are rotatably provided. Furthermore, a substantially T-shaped belt support plate 55c is fixed to the center of the conveyance mechanism 55. A belt 55d made of resin or the like is passed between the rollers 55b and 55b. The end of the roller 55b is connected to the roller 6 that constitutes the drive mechanism 60.
A belt 60c is passed between the end of 0a.

This roller 60a is rotatably supported by a convex roller frame 60e fixed to the first base member 50, and is configured to be connected and driven by a drive roller 60b and a belt 60d. Drive roller 60
b is driven by a motor (not shown).

Next, a frame pressing roller 61 is rotatably supported opposite the conveying surface of the belt 55d of the conveying mechanism 55.

This frame presser roller 61 is pivotally supported by the free end of a frame presser roller swinging member 62, and the other end of this swinging member 62 is connected to a bearing presser 63 as shown in FIG. 1O.
The roller shaft of the bearing presser 63 is rotatably supported by air blowing device support members 64 fixed to both ends of the transport mechanism base 52. therefore,
The frame pressing roller 61 is configured to be swingable in a direction away from the belt 55d.

Furthermore, air blowing vibrators 66 and 67 as shown in FIG. 9 are arranged in parallel on the air blowing device support member 64. The lower surface of the air blowing pipes 66 and 67,
That is, a plurality of air outlets 66a are provided on the belt 55d side.
- 66 an and 67 a - 67 an are formed. An air suction device connecting member 68 connected to the ends of the air blowing vibrators 66 and 67 is connected to this air blowing port.
Air is sent in and blown out by an air compression device (not shown) that is connected to a compressor or the like. Although this air is blown out in this embodiment, a method of cooling with refrigerant gas or the like using another device may also be used.

Next, the operation of the lead frame cooling mechanism having the above structure will be explained.

First, a semiconductor wafer is bonded to a lead frame by a bonder device A as shown in FIG. 7, and then this bonded lead frame is heated to a predetermined temperature while being intermittently fed by a heating device B to be thermoset. be done. Normally, lead frames that have been bonded are stocked in heating device B considering the processing capacity of the bonding device, but as shown in Fig. 7, in the device of this embodiment, multiple bonding devices are connected. Therefore, it is transported onto the transport path without being sufficiently cooled in the heating device B.

Therefore, when the heated lead frame is sent onto the belt 55d of the transport mechanism 55 shown in FIG. 8, the leading end of the lead frame is held between the frame presser roller 61 and the belt 55d and arched in the transport direction. . Since the frame pressing roller 61 is configured to be swingable, it can easily hold the lead frame, and by pressing the frame against the belt 55dllll, it can be conveyed while being firmly attached to the belt. . When the lead frame is sent in the transport direction, air is constantly blown out from the air outlets 66a and 66b, so that the heated lead frame is reliably cooled while being transported. therefore,
There is no effect on the transport mechanism 55 due to heating of the lead frame.

The lead frame that has passed through the transport mechanism 55 as described above is transported via the transport mechanism explained in FIGS. 1 to 6.

Although the first and second transport mechanisms 6, 7, etc. in this embodiment are explained using two rails, they may be provided with more than two rails, and a cylinder is used as a switching means, but other configurations may also be used. Of course, it is possible to use and combine them as appropriate.

Note that although wire bonding is described as an example in this embodiment, it is also suitable for use in tape bonding or the like.

[Effects of the Invention] As explained above, according to the present invention, the lead frame passing on the conveyance path surface is cooled by the cooling means provided opposite to the conveyance path surface on which the heated lead frame is conveyed. Therefore, there is no need to wait until the temperature of the heated lead frame falls (it can be immediately sent to the bonding equipment, which has the effect of improving time efficiency.Furthermore, according to the present invention, the heating Even if the heated lead frame is directly sent onto the conveying mechanism on the bonding device side, there is an effect that no damage is caused to the resin belt, etc. Furthermore, the present invention has the advantage of not causing damage to the resin belt, etc. a conveyance means, a cooling means provided opposite to a lead frame conveyance path surface of the conveyance means, and a lead frame holding means that is swingable in a direction away from the conveyance path surface between the conveyance means and the cooling means. Therefore, if the tip of the heated lead frame slightly hangs on the conveyance path of the conveyance mechanism, the lead frame is pressed against the conveyance path by the frame pressing means and can be reliably conveyed.

[Brief explanation of the drawing]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a diagram schematically showing the configuration of a lead frame transport mechanism according to the present invention, and FIG. 2 is a schematic sectional view of the loader unit in FIG. Figure 3 is a sectional view showing the state in which the loader unit in Figure 2 has moved;
FIGS. 4, 5, and 6 are explanatory diagrams illustrating a lead frame conveyance path using the lead frame conveyance mechanism according to the present invention, and FIG. 7 is an illustration of an apparatus in which the present invention is used. FIG. 8 is a diagram showing an embodiment of the present invention; FIG. 9 is a front view showing a schematic structure of a lead frame cooling mechanism; FIG. 9 is a plan view of FIG. 1
Figure 0 is a side view of Figure 8. DESCRIPTION OF SYMBOLS 1... Bonding device, 2... Bonding head, 3a... First guide rail, 3b... Second guide rail, 4... Third transport mechanism, 6... First
transport mechanism, 7... second transport mechanism, 9... loader unit, 10... cylinder for longitudinal sliding 1
3... Fourth transport mechanism, 14... Fifth transport mechanism,
17...first base, 18...cam, 19...
Lead frame butcher cylinder, 21...2nd
base, 23... coupling, 26... holding stand, 27... vertical guide, 29... ball bearing, 31a. 31b... Guide rail, 55... Conveyance mechanism, 55
a, 55a...Roller frame, 55b, 55b
'...Roller, 55c...Belt support plate, 55
d...Belt, 60...Drive mechanism, 60a...Roller, 60b...Drive roller, 60c...Belt,
61... Frame presser roller, 62... Frame presser roller swinging member, 63... Bearing presser, 64...
... Air blowing device support member, 66.67... Air blowing pipe, 68... Air suction device connection member.

Claims (4)

[Claims] (1) A method for cooling a lead frame, characterized in that the lead frame passing on the conveyance path surface is cooled by a cooling means provided opposite to the conveyance path surface on which the heated lead frame is conveyed. (2) The lead frame cooling method according to claim 1, wherein the cooling means is cooled by air. (3) A conveying means for conveying a heated lead frame, a cooling means provided opposite to a lead frame conveying path surface of the conveying means, and a supporting means for supporting the cooling means, A lead frame cooling mechanism characterized by cooling a lead frame passing on a conveyance path. (4) A conveyance means for conveying the heated lead frame, a cooling means provided opposite to the lead frame conveyance path surface of the conveyance means, and a separation from the conveyance path surface between the conveyance means and the cooling means. 1. A lead frame cooling mechanism characterized by comprising a lead frame holding means that is swingable in a direction in which the lead frame is held down.