JP2526488Y2 - Frame transport switching device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a bonding apparatus, and in particular, performs wire bonding between a lead of a lead frame manufactured by thermosetting with a die bonder apparatus and a heating apparatus and an electrode on a chip. Therefore, a lead frame transport mechanism that transports a lead frame transported by a transport mechanism from a loader side onto a bonding stage, and then discharges the lead frame to an unloader side after bonding, and performs bonding using a plurality of bonding apparatuses. The present invention relates to a frame transport switching device capable of performing the above.

2. Description of the Related Art Conventionally, in a device of this type, a lead frame for wire bonding, in which a plurality of IC chips (semiconductors) are arranged in a longitudinal direction, is intermittently fed one pitch at a time by a transfer means for transferring in a longitudinal direction. The sent lead frame is transferred to the bonding stage heated by the heater block, and then placed on the lead frame.
The electrodes of the chip and the surrounding leads are bonded and connected by wires. The lead frame transferred by this transfer means is guided by being regulated by a pair of guide rails 61a and 61b arranged in parallel as shown in FIG. On the loader side (lead frame supply side) 62 where the lead frame is guided on the bonding stage along the guide surfaces of the guide rails 61a and 61b, a transport mechanism is provided in a direction orthogonal to the longitudinal direction of the guide rails 61a and 61b. It is arranged. This transport mechanism is also provided on the unloader side (lead frame discharge side) 63.

As shown in FIG. 8, this transport mechanism connects a chip and a lead of a lead frame transported on a bonding stage located at the center of a pair of guide rails 61a and 61b provided in the main body of the bonding apparatus 1 by wires. A bonding head 2 for performing a bonding connection is provided on the main body of the apparatus, and the bonding head 2 is mounted on an XY table, and is configured to be movable in the X and Y directions. The bonding connection is made after positioning the bonding position coordinates and the like by the bonding head 2.

The transfer mechanism 64 on the loader side 62 in FIG. 8 (the transfer mechanism 65 on the unloader side also has the same configuration) mounts a lead frame between the transfer unit stretched between the belts 64c and 64d and the belt of the transfer unit. A mounting table 64e (shown in FIG. 9) and an up / down drive mechanism (not shown) for vertically moving the transfer unit to a position lower and higher than the mounting surface of the mounting table 64e.

To briefly explain the operation of this conventional device, a lead frame transferred from an external device (not shown) is mounted on the mounting surface of the mounting table 64e. At this time, the belt 6
4c and 64d are waiting at a position lower than the mounting surface of the mounting table 64e. After that, the transfer unit is lifted by the vertical drive mechanism, and the lead frame is separated from the mounting surface of the mounting table 64e and held on the belt. I do. Thereafter, the transfer unit is lowered to a position lower than the mounting surface of the mounting table 64e, and the lead frame is held by the mounting surface of the mounting table during the lowering. In this state, the lead frame is moved by the pushers (not shown) to guide rails 61a and 61a.
1b, and is intermittently fed one pitch at a time by a guide rail transport mechanism (not shown) to be bonded. After this bonding, the lead frame is sent again to the transfer section 66 disposed parallel to the longitudinal direction of the bonding stage and discharged by the same operation of the transfer section on the unloader side as described above.

[Problem to be Solved by the Invention] However, the conventional lead frame transfer mechanism has the following disadvantages.

That is, in the lead frame transfer mechanism shown in FIG. 8, first, when the lead frame is transferred, the transfer section is raised to raise the lead frame while holding the lead frame placed on the mounting surface of the mounting table. And stop, drive the belt of the transfer section to feed the lead frame to the entrance of the guide rail, lower the transfer section and place the lead frame on the mounting surface of the mounting table. However, there is a disadvantage that the time efficiency of the automatic machine is low.

Second, the lead frame requires accuracy such as the relative height between the lead and the chip at the time of bonding connection. However, in a transfer unit such as a conventional device, an operation such as ascending → transfer → descent is performed. And the lead frame is easily damaged. Particularly, the unloader side after the bonding connection is easily affected.

Third, in the conventional apparatus, the lead frame is transported in parallel with the guide rail, whereas the belt of the transfer section is disposed in a direction orthogonal to the lead frame. Have to run away. Therefore, the surface for holding the lead frame is held at two or three points. However, since a plurality of chips are usually arranged in one lead frame, the stability of the lead frame is small if the holding surface is small. However, there is a disadvantage that the lead frame is easily damaged due to warpage of the lead frame or damage to the lead frame. This cannot be ignored after the bonding connection as described above, and since it is an automatic machine, only the damaged frame cannot be immediately taken out of the machine by stopping the machine.

The present invention has been made in view of the above-mentioned disadvantages of the prior art,
The frame transported by the transport mechanism from the loader can be transported onto the bonding stage without damaging the leads and chips of the frame, and the frame supply path and discharge path are provided separately and high-speed processing It is another object of the present invention to provide a frame transport switching device suitable for use in a plurality of bonding apparatuses.

Means for Solving the Problems According to the present invention, a guide means for guiding a frame on a bonding stage on which a bonding operation is performed, and a transfer surface having the same height as a frame guide surface of the guide means are arranged in parallel. Frame supply and conveyance means, and a conveyance means provided in parallel with a plurality of conveyance mechanisms capable of conveying a frame in a direction parallel to the frame guide direction of the guide means,
The transport unit is configured to be movable in a direction orthogonal to the frame guide direction, and at least one frame guide surface of the plurality of transport mechanisms has the same height as the frame guide surface of the guide unit and is higher than the frame supply transport unit. A switching means for switching to a lower position so as to be able to move forward and backward freely is provided.

Embodiment Next, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a view schematically showing a configuration of a lead frame transport mechanism according to the present invention.

In FIG. 1, a bonding head 2 mounted on a main body of a bonding apparatus (shown by a two-dot chain line) 1
Includes a bonding tool for performing bonding, a camera having a lens and an illumination lamp, and is mounted on an XY table driving mechanism (not shown) movable in the X and Y directions. An IC chip (island), which is a component to be bonded, on a bonding stage (this bonding stage includes a bonding work section for performing bonding connection and a plurality of chips before and after the chip) is bonded by the bonding head 2. An image is taken and the leads of the lead frame and the electrodes on the chip are connected by bonding. A lead frame on which a chip to be imaged by the bonding head 2 is disposed is a first guide rail.
The positioning is adjusted to an optimum interval position by the 3a and the second guide rail 3b. These first and second guide rails 3a
And 3b and both ends of the lead frame are approximately equal in this embodiment.
It is set to 0.1mm. A third transport mechanism 4 for discharging the lead frame is provided on the side facing the bonding head 2 in parallel with the first and second guide rails 3a and 3b. The third transport mechanism 4 includes a pair of rollers 4a and 4b supported by one shaft, and two belts 4c and 4d stretched between the rollers 4a and 4b. The roller 4b is formed by a double roller,
4b and another roller 4e other than the above are wrapped around with a belt 4f,
The roller shaft and the shaft of the drive motor 4g are connected and driven. The belts 4c and 4d of the third transport mechanism 4 are configured to be capable of normal and reverse rotation by the rotational driving force of the drive motor 4g. At the center between the two belts 4c and 4d, near the unloader side (lead frame transport direction), a detection sensor 5 for detecting arrival of the lead frame is arranged. The detection sensor 5 is constituted by a reflection type optical sensor or the like.

 Next, the transfer means on the loader side will be described.

The transfer means on the loader side (lead frame supply side) is the first
And second transport mechanisms 6 and 7. The first and second transport mechanisms 6 and 7 are driven by one motor 8.

First, the first and second transport mechanisms 6 and 7 are provided on the loader unit 9 in parallel in a direction parallel to the longitudinal direction of the first and second guide rails 3a and 3b. The end of the loader unit 9 is a cylinder 10 for sliding back and forth.
Of the bonding apparatus 1 in a direction orthogonal to the longitudinal direction of the first and second guide rails 3a and 3b. The timing control of the forward and backward movement of the cylinder (switching means) 10 is controlled by a control circuit comprising a microprocessor or the like (not shown), and the forward and backward positions of the cylinder are controlled by the first and second transport mechanisms 6 and 7. The center is controlled so that the center of the first and second guide rails 3a and 3b coincides with the center of the third transport mechanism 4 (a portion indicated by a chain line). This control of the center position is, of course, adjustable. The first and second transport mechanisms 6 and 7
Has substantially the same configuration as the third transport mechanism 4 described above,
A pair of rollers 6a and 6b supported by two shafts are provided, and two belts 6 are stretched between the rollers 6a and 6b.
c and 6d are arranged in parallel, and the first and second transfer mechanisms 6 and 6 are driven by the other roller shaft 6b.
And 7 are connected, one of the rollers 6b of the first transport mechanism 6 is formed of a double roller, and the roller 6b and another roller 6e other than the above are wound around a belt 6f. The shaft of the roller 6e and the shaft of the drive motor 8 are connected so that the first and second transport mechanisms 6 and 7 are coaxially driven to rotate. Also, the first and second transport mechanisms 6 and 7 have a lead frame detection sensor 11 near the lead frame supply side to the first and second guide rails 3a and 3b,
12 are arranged.

Next, FIGS. 2 and 3 are cross-sectional views showing the detailed configuration of the loader unit on which the first and second transport mechanisms of FIG. 1 are mounted, as viewed from a direction orthogonal to the lead frame transport direction. is there.

In FIG. 2, the first base 17 is fixed on the main body of the bonding apparatus 1. A cam 18 is provided on the first base 17. A continuous inclined surface is formed at the center of the cam surface of the cam 18 so that the cam 18 can be moved linearly. On the left side of the first base 17, a support frame for supporting the front and rear slide cylinder 10 is provided.
20 are provided vertically. A second base 21 having a substantially U-shaped cross section is connected to the tip of the shaft of the cylinder 10.
A coupling 23 for receiving a connecting shaft 22 connecting the first and second transport mechanisms 6 and 7 is provided in the second base 21, and the other end of the connecting shaft 22 is connected to the second base 21. The motor shaft of the fixed belt drive motor 8 is connected via a coupling 23. As described with reference to FIG. 1, the first transport mechanism 6 has support bases 24a and 24b for supporting a roller shaft on which two belts are stretched, and is formed vertically on the second base 21. Similarly to the first transport mechanism 6, the second transport mechanism 7 has a support 25a for supporting the roller shaft.
And 25b are formed vertically on the second base 21.
A holding base 26 having a substantially U-shaped cross section is provided on both sides of the support bases 25a and 25b of the second transport mechanism 7.
A guide 27 for up and down is provided on the side surface of. The vertical guide 27 is configured to fit in a groove formed in the coupling 23 and to be slidable up and down. Lower surface of holding table 26
A support 28 is provided on 26a, and a ball bearing 29 is rotatably provided at the tip of the support 28. This post
28, the tip of the ball bearing 29 is in contact with the cam surface of the cam 18 through a hole 30 formed in the second base 21. Further, guide rails 31a and 31b having a substantially L-shaped cross section are provided at the upper end of the holding base 26 so as to face each other. The guide rails 31a and 31b are configured to be adjustable depending on the width of the lead frame. The heights of the guide surfaces of the guide rails 31a and 31b are the first and second guide rails 3a and 3b.
The height is set to be at least equal to or substantially equal to the height of the transfer surface of the lead frame.

The vertical operation including the loader unit 9 will be described below with reference to FIGS.

FIG. 2 shows a state in which the shaft 10a of the cylinder 10 is being sucked, and the position of the second base 21 connected to the end of the shaft is controlled while being pulled. At this time, the first
The second transport mechanisms 6 and 7 are in a state where the first and second guide rails 3a and 3b and the transport path of the third transport mechanism 4 coincide with each other, ie, the state shown in FIG. At this time, the bearing 29 provided on the lower surface of the holding base 26 is located at the uppermost portion of the cam surface.
Located at 18H. Therefore, when the lead frame is located on the lowermost portion 18L of the cam surface shown in FIGS. 1 and 3, the lead frame placed on the belts 7c and 7d of the second transport mechanism 7 is replaced by the suction action of the cylinder. As a result, both ends of the lead frame are held by the guide rails 31a and 31b of the holding base 26 and rise, and the lead frame is gently separated from the belts 7c and 7d. This is because linear continuous movement is possible by the surface of the cam 18. In the state shown in FIG. 2, the lead frame is also supplied onto the belt of the first transport mechanism 6 by another device (not shown). Therefore, in this state, the lead frame can be continuously transported on the transport path of the third transport mechanism 4.

Next, the lead frame placed on the guide surfaces of the guide rails 31a and 31b of the second transport mechanism 7 is moved by the lead frame pusher cylinder 19 to the first and second guide rails.
When the shaft 10a is pushed out onto the conveying paths 3a and 3b, the shaft 10a of the front-rear sliding cylinder 10 projects and shifts to the state shown in FIG. 3 (FIG. 1). That is, the second base 21 is moved from 18H to 18L along the cam surface. At this time, since the guide surfaces of the guide rails 31a and 31b of the holding base 26 have been lowered to a position lower than the position of the belt upper surface (see FIG. 3), a new lead frame is transported from an external device (not shown). Is done. At this time, since the first transport mechanism 6 is located at a position deviated from the transport path, no lead frame is placed on the belt.

 The above is the operation of the loader unit 9.

 Next, the transfer means on the unloader side will be described.

The transfer means on the unloader side (lead frame discharge side) includes a fourth transfer mechanism 13 and a fifth transfer mechanism 14.

The fourth transport mechanism 13 and the fifth transport mechanism 14 are provided in parallel in a direction parallel to the longitudinal direction of the first and second guide rails 3a and 3b. The ends of the fourth transport mechanism 13 and the fifth transport mechanism 14 are the front and rear slide cylinders 1.
0 'is connected to the tip of the shaft 10'a,
The upper surface of the main body of the bonding apparatus 1 is configured to be movable in a direction orthogonal to the longitudinal direction of the guide rails 3a and 3b. The timing control of the forward and backward movement of the cylinder (switching means) 10 'is controlled by a control circuit comprising a microprocessor or the like (not shown), and the forward and backward positions of the cylinder (the state shown in FIG. 4) are set to the fourth position. Transport mechanism 13 and fifth
And the first and second guide rails 3a, 3
Control is performed so that the center of b and the center of the third transport mechanism 4 (portion indicated by a dashed line) coincide with each other. This control of the center position is, of course, adjustable. The transport path of the fourth transport mechanism 13 is provided with a pair of rollers 13a and 13b which are supported by one shaft.
, And 13b, and a drive motor 13e (shown in FIG. 6) connected to the shaft of the roller 13b. The transport path of the fifth transport mechanism 14 has the same configuration as that of the fourth transport mechanism 13.

Thus, the fourth transport mechanism 13 and the fifth transport mechanism
The details of the structure of the fourteenth switching means will be described with reference to FIGS. 6 and 7 are cross-sectional views as viewed from a direction orthogonal to the lead frame transport direction.

In FIG. 6, the third base 35 is fixed to the bonding apparatus 1 main body. A cam 36 is provided on the third base 35. The cam surface of the cam 36 has a continuous inclined surface so that it can be moved linearly. A first transfer base 37 having a substantially U-shaped cross section can be slid up and down through a slide mechanism 40 at the end of a shaft 10'a of a front-rear slide cylinder 10 'supported by a support frame (not shown). It is connected to the. This slide mechanism
Reference numeral 40 denotes a structure which is slidable by fitting into the groove of the first transport base 37. On the other hand, a second transfer base 38 having a substantially U-shaped cross section is also connected to a shaft 10'a of the cylinder 10 'via a connecting member 39 which moves in parallel.

A support 41 is provided on the lower surface 37a of the first transport base 37, and a ball bearing 42 is rotatably provided at the tip of the support 41 and is movably abutted along the cam surface of the cam 36. I have. A holding table 43 having a substantially U-shaped cross section is provided in the first transport base 37. A support 44 is provided on the lower surface 43a of the holding base 43, and a ball bearing 45 is rotatably provided at the tip of the support 44. The tip of the ball bearing 45 is in contact with the cam surface of the cam 46 through a hole 37a formed in the first transport base 37. Further, guide rails 31a 'and 31b' having a substantially L-shaped cross section are provided at the upper end of the holding base 43. The guide rails 31a 'and 31b' are configured to be adjustable depending on the width of the lead frame. This guide rail 31
The heights of the guide surfaces a 'and 31b' are set to be at least equal to or substantially equal to the heights of the transfer surfaces of the lead frames of the first and second guide rails 3a and 3b.

Fourth and fifth transport mechanisms 13 configured as described above
And 14 are from the state of FIG. 6 (FIG. 4) to FIG. 7 (FIG. 5).
, The lead frame can be discharged through the lower transport path.

In addition, by fixing the sixth transfer mechanism 15 shown by a two-dot chain line in FIG. 1 and FIG. By connecting the devices, the transport path can be configured in two stages, upper and lower. Further, the fourth transport mechanism 13 and the fifth transport mechanism 14 are provided with a photodetector (not shown) for detecting the presence or absence of a lead frame.

Next, a path through which a lead frame is transported using the present apparatus will be described in detail with reference to FIGS.

First, as shown in FIG. 1, a lead frame (L / F) is supplied from the direction of the arrow onto the transport path of the second transport mechanism 7. When the detection sensor 12 detects the lead frame, the rotation of the transport drive motor 8 driving the belt is stopped by a command from the control circuit. Thereafter, the front and rear cylinders 10 operate in the suction direction, and the loader unit 9 is moved.
Is moved to the state shown in FIG. At this time, the transport paths of the first transport mechanism 6 and the second transport mechanism 7 are the same as the transport paths of the first and second guide rails 3a and 3b having the bonding stage and the transport path of the third transport mechanism 4. I will stop. Then, as shown in FIG. 2, the lead frame placed on the guide rails 31a and 31b of the second transport mechanism 7 is guided by the lead frame pusher cylinder 19 on the first and second guide rails 3a and 3b. The lead frame is extruded on the surface. The lead frames sent onto the guide rails 3a and 3b are intermittently fed one pitch at a time while being clamped by a transport mechanism (not shown), and then heated to a predetermined temperature on a bonding stage for bonding. During this time, since the transport path of the first transport mechanism 6 coincides with the transport path of the third transport mechanism 4, the lead frames are sequentially supplied to other devices other than the present apparatus via the third transport mechanism 4. can do.

Next, as shown in FIG. 4, the lead frame bonded and connected on the bonding stage is discharged onto a transport path of a fourth transport mechanism 13 provided on the unloader side,
After the rotation of the motor is stopped by being detected by a lead frame detection sensor (not shown), the front / rear cylinder 10 'on the unloader side acts in the protruding direction to move the unloader unit to the state shown in FIG. At this time, the bonded lead frame is placed on the guide surfaces of the guide rails 31a 'and 31b' as shown in FIG.
7, the fourth transport mechanism 13 enters the lower surface of the third transport mechanism 3 and the guide rails 31a 'and 31b' also descend, so that the belts 13d and 14d
The lead frame is moved and mounted on the upper surface. In this state, a command is issued from the motor 13e by a control circuit (not shown), and the motor 13e is rotated and driven, and the lead frame is discharged to another device.

As described above, according to the present apparatus, the lead frame is supplied by the upper transport mechanism, and the lead frame is discharged by the lower transport mechanism, so that the lead frame transport time can be reduced. .

Conversely, a configuration may be employed in which the supply of the lead frame is performed by the lower transport mechanism and the discharge of the lead frame is performed by the upper transport mechanism.

Although the fourth transport mechanism 13 and the fifth transport mechanism 14 and the like are described with two rails in the present embodiment, more rails may be provided, and a cylinder is used as a switching means. It is, of course, possible to combine them appropriately using the configuration.

In this embodiment, wire bonding is described as an example, but the present invention is also suitable for use in tape bonding or the like.

[Effects of the Invention] As described above, according to the present invention, a guide means for guiding a frame on a bonding stage on which a bonding operation is performed, and a conveying surface height equal to the frame guide surface of the guide means are provided. And a frame supply / conveying means arranged in parallel, and a conveying means provided in parallel with a plurality of conveying mechanisms capable of conveying a frame in a direction parallel to a frame guiding direction of the guiding means, wherein the conveying means Is configured to be movable in a direction orthogonal to the frame guiding direction, and at least one of the frame guiding surfaces of the first and second transport mechanisms is set at the same height as the frame guiding surface of the guiding means and the frame supply / transporting means. To the lower position so that the entire frame can be held, the frame can be prevented from warping, etc. In addition, since the supply and discharge of the frame can be performed by an independent transport mechanism, the transport time can be shortened.

[Brief description of the drawings]

FIG. 1 is an embodiment of the present invention, FIG. 1 is a view schematically showing the configuration of a lead frame transport mechanism according to the present invention, FIG. 2 is a schematic sectional view of the loader unit of FIG. FIG. 3 is a sectional view showing a state where the loader unit of FIG. 2 has moved,
4 and 5 are explanatory views for explaining a lead frame transport path using the lead frame transport mechanism according to the present invention, and FIG. 6 is a fourth and fifth transports serving as the unloader unit of FIG. FIG. 7 is a sectional view showing a state in which the unloader unit of FIG. 6 is moved, FIG. 8 is a perspective view showing a conventional lead frame transfer mechanism, and FIG. 9 is a transfer view of FIG. It is a partial sectional view of a mechanism. 1 ... bonding apparatus, 2 ... bonding head,
3a 1st guide rail, 3b 2nd guide rail, 4 3rd conveyance mechanism, 6 ... 1st conveyance mechanism, 7
... Second transport mechanism, 9... Loader unit, 10.
Cylinder for forward / backward slide, 13 Fourth transport mechanism, 14
... Fifth transport mechanism, 15 sixth transport mechanism, 17 first base, 18 cam, 19 lead frame pusher cylinder, 21 second base, 23 cup Ring, 26 ... Holder, 27 ... Vertical guide, 29 ... Ball bearing, 31a, 31b ... Guide rail, 35 ... Third
Base, 36 ... cam, 37 ... first transport base, 38 ...
... Second transport base, 39 ... Connecting member, 40 ... Slide mechanism, 61a, 61b ... Guide rail, 62 ... Loader, 63 ...
… Unloader, 64,65 …… Transfer mechanism.

Claims (2)

(57) [Scope of request for utility model registration] 1. A guide means for guiding a frame on a bonding stage on which a bonding operation is performed, and a frame supply / conveyance arranged in parallel with a conveyance surface height equal to the frame guide surface of the guide means. Means, and a transport means provided in parallel with a plurality of transport mechanisms capable of transporting a frame in a direction parallel to a frame guide direction of the guide means, wherein the transport means is moved in a direction orthogonal to the frame guide direction. Switching means configured to be able to advance and retreat at least one frame guide surface of the plurality of transport mechanisms to the same height as the frame guide surface of the guide means and to a position lower than the frame supply / transport means. A frame transfer switching device, characterized in that: 2. A frame transport switching device according to claim 1, wherein said switching means is formed by a cam.