CN103974608B - The carrying method of base board delivery device, substrate - Google Patents
The carrying method of base board delivery device, substrate Download PDFInfo
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- CN103974608B CN103974608B CN201410045181.XA CN201410045181A CN103974608B CN 103974608 B CN103974608 B CN 103974608B CN 201410045181 A CN201410045181 A CN 201410045181A CN 103974608 B CN103974608 B CN 103974608B
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Abstract
The present invention provides a kind of base board delivery device, the carrying method of substrate, it will not make components number and cost increase, the densification of realization device.The base board delivery device（14）To the central area for carrying electronic unit（A）Conveying substrate（W）, substrate is maintained at defined height in central area, it has：Multiple delivery sections（41、46）, central area is divided into multiple cut zone in the conveying direction（A1、A2）, above-mentioned multiple delivery sections respectively correspondingly set with multiple cut zone；And elevating mechanism（61）, it is provided with multiple curb girder portions corresponding with multiple delivery sections by making（63、66）Support workbench（62）, multiple delivery sections are supported via multiple curb girder portions, so as to realize the lifting of multiple delivery sections, elevating mechanism is by moving the curb girder portion of a part from the Support Position of the multiple delivery sections of support, so as to optionally make multiple delivery sections rise to defined height.
Description
Technical field
The present invention relates to a kind of in the erecting device of electronic unit is installed on substrate, towards carrying region conveying substrate
Base board delivery device and substrate carrying method.
Background technology
Currently, in erecting device, as the base board delivery device to carrying region conveying substrate, it is known that following structures,
That is, multiple conveyer belts are configured to a row and form transport path（For example, referring to patent document 1）.On transport path, from upper
Trip is set with towards downstream：As follow-up substrate standby region move into buffering area, as substrate carry region in
Heart district domain, the standby region as the substrate after boarded parts take out of buffering area.Moving into buffering area, central area, removing
Go out and accordingly configure conveyer belt on buffering area respectively, the conveying of substrate is carried out by conveying the transmission of substrate of interband.
In the lower section of the conveyer belt of central area, the support workbench for jacking up conveyer belt is provided with.In central area
Conveyer belt top, be provided with the holding plate along the both sides of upper surface of base plate.If from buffering area is moved into central area
Substrate is moved into, then using supporting workbench to jack up conveyer belt, substrate is pressed against on holding plate.Then, existed with defined height
Substrate is gripped between conveyer belt and holding plate, mounting head is moved to surface in this condition, implements electronic unit
Installation.
Patent document 1：Japanese Unexamined Patent Publication 2010-219142 publications
In the base board delivery device described in patent document 1, it is necessary to set on transport path and move into buffering area, take out of
Buffering area, this 3 regions of central area, there are the problem of larger-scale unit.Therefore, it is proposed to a kind of base board delivery device, its
Substitute buffering area, central area is divided into multiple cut zone in the conveying direction, using without the cut zone of carrying as
Buffering area uses.But in the base board delivery device, it is necessary to which for each cut zone of central area, support work is set
Platform and driving source, the problem of increasing there are components number and increase cost.
The content of the invention
The present invention in view of above-mentioned actual conditions and propose, its object is to a kind of, there is provided base board delivery device with
And the carrying method of substrate, it will not make components number and cost increase, it is possible to achieve the densification of device.
The base board delivery device of the present invention, will in the carrying region to the carrying region conveying substrate for carrying electronic unit
The substrate is maintained at defined height, it is characterised in that has：Multiple delivery sections, by the carrying region in conveying direction
On be divided into multiple cut zone, the plurality of delivery section is respectively correspondingly set with the multiple cut zone；And elevating mechanism,
It is by making with the support workbench with the corresponding multiple supporting parts of the multiple delivery section, via the multiple supporting part
The multiple delivery section is supported, thus allows for the lifting of the multiple delivery section, the elevating mechanism, by defeated from supporting
Sending the Support Position in portion makes a part for the multiple supporting part mobile, so as to rise to optionally the multiple delivery section
Height as defined in described.
The carrying method of the substrate of the present invention is to the carrying region conveying substrate for carrying electronic unit, in the carrying region
The substrate is maintained at defined height, it is characterised in that there is following step：By the carrying region in the conveying direction
It is divided into multiple cut zone, using the multiple delivery sections respectively correspondingly set with the multiple cut zone, conveys the base
The step of plate；And by making the support workbench with multiple supporting parts corresponding with the multiple delivery section, via described
Multiple supporting parts support the multiple delivery section, so that using the elevating mechanism for the lifting that can realize the multiple delivery section,
Make a part for the multiple supporting part mobile from the Support Position of support delivery section, thus optionally make the multiple conveying
Portion rises to the step of defined height.
According to said structure, made by regarding the cut zone without carrying in multiple cut zone as buffering area
With the space without in addition setting buffering area on transport path.Furthermore it is possible to after carrying region for segmentation
Multiple cut zone, using shared support workbench and driving source, optionally rise to multiple delivery sections defined
Highly.Therefore, components number and cost increase will not be made, it is possible to achieve the densification of device.In addition, by by a part
Cut zone is used as buffering area, so as to improve conveying beat.
In addition, in the aforesaid substrate conveying device of the present invention, the elevating mechanism and the substrate on conveying direction
Length it is corresponding, the multiple delivery section is increased.According to the structure, can in the case where substrate is longer,
Multiple delivery sections is increased at the same time, in the case where substrate is shorter, the delivery section of a part is increased.Therefore, can be with base
The length of plate is corresponding and delivery section is increased, it is possible to achieve the province of elevating mechanism is energetic.
In addition, in the aforesaid substrate conveying device of the present invention, the elevating mechanism only makes on the support workbench
The supporting part movement.According to the structure, rise to multiple delivery sections while simple structure selectivity can be utilized defined
Highly.
In addition, in the aforesaid substrate conveying device of the present invention, the multiple supporting part is slidably disposed in the branch
Support on workbench.According to the structure, simple structure selectivity can be utilized multiple delivery sections are made to rise to defined height.
In addition, in the aforesaid substrate conveying device of the present invention, the support workbench is divided into the conveying direction
Multiple segmentation workbench, the elevating mechanism makes the supporting part and divided segmentation workbench moves together in the conveying direction
It is dynamic.According to the structure, simple structure selectivity can be utilized multiple delivery sections are made to rise to defined height.
In addition, in the aforesaid substrate conveying device of the present invention, the multiple delivery section can be with the width of the substrate
It is corresponding and adjust conveying width, it is described support workbench conveying width on be divided into multiple segmentation workbench, institute
Stating elevating mechanism has independent driving source corresponding with the segmentation workbench split on conveying width, with the substrate
Width it is corresponding and adjust the driving quantity of driving source.According to the structure, small-sized driving source can be used, makes support work
Platform lifts.In addition, by the driving quantity for suitably controlling driving source corresponding with the width of substrate, so as to realize lifting
The province of mechanism is energetic.
The effect of invention
According to the present invention, it is multiple cut zone by region segmentation is carried, by optionally making and segmentation area pair
The delivery section answered rises to defined height, thus will not make components number and cost increase, it is possible to achieve device it is compact
Change.
Brief description of the drawings
Fig. 1 is the oblique view of the erecting device involved by present embodiment.
Fig. 2 is the schematic diagram of the base board delivery device involved by present embodiment.
Fig. 3 is acted the central area first half involved by present embodiment as the carrying-in/carrying-out for carrying region
Explanatory drawin.
Fig. 4 is acted the central area latter half involved by present embodiment as the carrying-in/carrying-out for carrying region
Explanatory drawin.
Fig. 5 is the explanation for integrally acting the central area involved by present embodiment as the carrying-in/carrying-out for carrying region
Figure.
Fig. 6 is the schematic diagram of the base board delivery device involved by variation.
Fig. 7 is the schematic diagram of the base board delivery device involved by other variations.
The explanation of symbol
1 erecting device
13 mounting heads
14 base board delivery devices
41 the 1st delivery sections（Delivery section）
46 the 2nd delivery sections（Delivery section）
61 elevating mechanisms
62 support workbench
63rd, 66 curb girder portion（Supporting part）
64th, 67 cylinder
65 elevating motors（Driving source）
71st, 72 holding plate
81st, 82 segmentation workbench
A central areas（Carry region）
A1, A2 cut zone
W substrates
Embodiment
In the following, referring to the drawings, the embodiment that the present invention will be described in detail.Fig. 1 is the installation dress involved by present embodiment
The oblique view put.In addition, it is following, the situation that the base board delivery device of the present invention is applied to electronic component mounting apparatus is carried out
Explanation, but it is not limited to the structure.The base board delivery device of the present invention can also be applied to other processing unit (plant)s.
As shown in Figure 1, erecting device 1 is configured to, supplied by the use of mounting head 13 using from the component as assembly supply device
The electronic unit that device 12 supplies（It is not shown）Carried on to substrate W.In the center of the pedestal 11 of erecting device 1, match somebody with somebody along X-direction
Put base board delivery device 14.From the one end of X-direction, the substrate W before component is installed is moved into peace base board delivery device 14
The lower section of dress first 13, and the substrate W after component mounting is taken out of from the another side of X-direction.In addition, on the base 11,
Across the both sides of base board delivery device 14, multiple part feeders 12 are configured with horizontally disposed way.
Tep reel 21 is detachably installed on each part feeder 12, is wound with tep reel 21 and encapsulates multiple electricity
The material containing band of subassembly.Each part feeder 12 is by the rotation of tep reel 21, the transmission position that direction is picked up by mounting head 13
Put and extract electronic unit out successively.At the transmission position of mounting head 13, taken from material containing and peel off the covering band on surface, make material containing
Electronic unit in the bag of band exposes to outside.
Installation head moving mechanism 15 is provided with the base 11, which makes mounting head 13 along X-axis side
To and Y direction movement.Installation head moving mechanism 15 is supported by the column sections 16 being uprightly arranged on the corner of pedestal 11, from
11 upper surface of pedestal makes mounting head 13 be moved along X-direction and Y direction with defined height.Installation head moving mechanism 15 has
Have：The Y-axis workbench 23 parallel with Y direction and sliding guide portion 24, it is supported in column sections 16；And and X-axis
The parallel X-axis workbench 25 in direction, it is supported in Y-axis workbench 23 and sliding guide portion 24.In X-axis workbench 25
On, mounting head 13 can be movably supported along X-direction.
Installation head moving mechanism 15 utilizes motor（It is not shown）, mounting head 13 is moved to X-direction along X-axis workbench 25
It is dynamic.In addition, installation head moving mechanism 15 utilizes motor（It is not shown）Make mounting head 13 together with X-axis workbench 25, along Y-axis work
Make platform 23 and sliding guide portion 24 to move to Y direction.By this structure, mounting head 13 can be in the top water of substrate W
Translation is dynamic, and the electronic unit supplied from part feeder 12 is kept, and to installing on the desired locations of substrate W.
Mounting head 13 has the absorption suction nozzle that can adsorb electronic unit（It is not shown）.Absorption suction nozzle passes through θ (not shown)
Motor and rotate about the z axis, moved up and down by Z axis motor along Z-direction.Mounting head 13 is configured to, by driving respectively
Each absorption suction nozzle, so as to adsorb multiple electronic units from part feeder 12.In addition, as long as the suction nozzle of mounting head 13 can
Electronic unit is taken out from part feeder 12, such as can also be by clamping suction nozzle.
In addition, in mounting head 13, the shoot part 26 and height sensor of teaching are provided with（It is not shown）.Shoot part
26 pairs of electronic units of transmission position for being delivered to part feeder 12 and the mark of substrate W are shot.Based on shoot part 26
Shooting image, the installation site of absorption position and substrate W to the electronic unit in X-direction and Y direction adjusts
It is whole.Height sensor towards electronic unit and substrate W irradiation lights, and to reflected light by carrying out light, so as to carry out height survey
It is fixed.According to the measurement result of height sensor, the installation site of absorption position and substrate W to the electronic unit in Z-direction
It is adjusted.
On the base 11, on from part feeder 12 towards the mobile route of the mounting head 13 of substrate W, it is provided with progress
The filming apparatus 17 of high-precision component identification.Filming apparatus 17 carries out the electronic unit being maintained in mounting head 13 from downside
Shooting.The state of electronic unit is kept to shoot mounting head 13 by using filming apparatus 17, so as to electronic unit
Classification, position offset of electronic unit etc. are checked.In addition, on erecting device 1, be provided with obtain above-mentioned shooting image and
Measurement result simultaneously performs the processor of various processing and various memories etc..Memory is according to purposes by ROM（Read Only
Memory）、RAM（Random Access Memory）One or more storage medium in is formed.
In the erecting device 1 so formed, using base board delivery device 14 by from the substrate W that previous process obtains to
As the central area A for carrying region（With reference to Fig. 2）Conveying, is defined height by substrate W position adjustments in central area A
（Carry altitude datum）.Then, in the state of after substrate W position adjustments, mounting head 13 is moved to surface, implement electricity
The installation of subassembly.In the case, central area A is divided into multiple cut zone A1, A2（With reference to Fig. 2）, at each point
Cut region A1, A2 and position adjustment is carried out to the height of substrate W respectively.Therefore, such as along institutes such as the shorter substrate W of conveying direction
Show, in the case of the cut zone using only a part, using remaining cut zone as buffering area（Temporarily keep the area of substrate
Domain）Use.
In the following, with reference to Fig. 2, the base board delivery device involved by present embodiment is described in detail.Fig. 2 is present embodiment institute
The schematic diagram for the base board delivery device being related to.Fig. 2A is the upper surface schematic diagram of base board delivery device, and Fig. 2 B are substrate conveying dresses
The side schematic view put.
As shown in Figure 2 A and 2 B, base board delivery device 14 by loading unit 31, the 1st delivery section 41, the 2nd delivery section 46, remove
Each conveyer belt 33,43,48,38 for going out portion 36 is configured to a row, the transport path of forming substrate W.Loading unit 31 is located at transport road
The upstream side in footpath, is configured to, and a pair of of conveyer belt 33 is set on the opposite face of a pair of of conveying 32.A pair of of conveyer belt 33 is to pass
The conveying mechanism with mode of movement is sent, conveying motor 34 is linked with the driving pulley of conveying mechanism.In a pair of of conveyer belt
The both ends of the width of substrate W are loaded on 33, using conveyer belt 33 by from the substrate W that previous process obtains to the 1st conveying
Portion 41 conveys.
1st, the 2nd delivery section 41,46 is configured to, and is formed in the center of transport path as the central area A for carrying region,
A pair of of conveyer belt 43,48 is set on the opposite face of a pair of of conveying 42,47 respectively.1st delivery section 41 forms central area A
First half cut zone A1, the 2nd delivery section 46 formed central area A latter half cut zone A2.It is a pair of defeated
The conveying mechanism that band 43,48 is conveyer belt mode of movement is sent, it is electronic to be linked with conveying on the driving pulley of conveying mechanism respectively
Machine 44,49.If conveyer belt 43,48 receives substrate W from conveyer belt 33, in central area, A positions substrate W.
Moving section 36 is located at the downstream of transport path, is configured to, and one is set on the opposite face of a pair of of conveying 37
To conveyer belt 38.A pair of of conveyer belt 38 is the conveying mechanism of conveyer belt mode of movement, is linked on the driving pulley of conveying mechanism
There is conveying motor 39.If conveyer belt 38 receives substrate W from conveyer belt 48, substrate W is taken out of to the latter process.Separately
Outside, a pair of of conveying 32,37,42,47 makes fixed guide rail and movable guiding rail opposite, the link width adjustment electricity on movable guiding rail
Motivation 51.Make movable guiding rail with fixed guide rail away from or closer to the width dimensions with substrate W using width adjustment motor 51
It is corresponding and adjust conveying width.
On the A of central area, as multiple substrate detection sensors, it is provided with and moves into sensor 53, the 1st stop sensor
54th, the 2nd stop sensor 55, take out of sensor 56.Sensor 53 is moved into examine moving into for substrate W in cut zone A1
Survey.1st stop sensor 54 in the cut zone A1 of central area A first halfs, examine by the stopping timing to substrate W
Survey.2nd stop sensor 55 in the cut zone A2 of central area A latter halfs, examine by the stopping timing to substrate W
Survey.Sensor 56 is taken out of in cut zone A2, taking out of for substrate W is detected.In addition, for being passed using the detection of each substrate
The control of sensor, describes below.
In the top of the 1st, the 2nd delivery section 41,46, be provided with a pair of of the holding plate 71 opposite with a pair of of conveyer belt 43,48,
72.Lower surface 71a, 72a of holding plate 71,72 are corresponding with the carrying altitude datum for implementing electro part carrying.The the 1st, the 2nd
The lower section of delivery section 41,46, sets the elevating mechanism 61 for selectively lifting the 1st, the 2nd delivery section 41,46.Elevating mechanism
61 rise the 1st, the 2nd delivery section 41,46, and substrate W is gripped between conveyer belt 43,48 and holding plate 71,72.At this time,
Upper surface Wa by making substrate W is abutted with lower surface 71a, 72a of holding plate 71,72, so that substrate W is positioned at carrying base
Quasi- height.
Elevating mechanism 61 has the support workbench 62 for supporting the 1st, the 2nd delivery section 41,46 from below.Support workbench 62
In an initial condition from the 1st, the 2nd delivery section 41,46 downwards away from, by elevating motor 65 and rise, it is defeated with the 1st, the 2nd
Portion 41,46 is sent to abut.In addition, in the lower part of the 1st, the 2nd delivery section 41,46,62 side of oriented support workbench protrusion are set more
A abutting part 74,75.It is corresponding with multiple abutting parts 74,75 of the 1st, the 2nd delivery section 41,46, and in support workbench 62
On be provided with curb girder portion 63,66 as supporting part.
By making each curb girder portion 63,66 be abutted with abutting part 74,75, so that via curb girder portion 63,66 in support workbench
The the 1st, the 2nd delivery section 41,46 is supported on 62.1st, the 2nd delivery section 41,46 via curb girder portion 63,66 by being supported on support work
Make to lift on platform 62.In addition, each curb girder portion 63,66 links with cylinder 64,67, support workbench 62 is slidably disposed in
On.Each curb girder portion 63,66 is supporting the Support Position of the 1st, the 2nd delivery section 41,46 and is deviateing support on support workbench 62
Moved between the non-supported position of position.
If making curb girder portion 63,66 be moved to Support Position, curb girder portion 63,66 abuts with each abutting part 74,75, is propping up
Support and the 1st, the 2nd delivery section 41,46 is supported on workbench 62.If curb girder portion 63,66 is set to be moved to non-supported position, curb girder portion
63rd, 66 separated from each abutting part 74,75, make the 1st, the 2nd delivery section 41,46 away from support workbench 62.It is as noted above, pass through
Curb girder portion 63,66 is moved, support of the support workbench 62 to the 1st, the 2nd delivery section 41,46 is released, so as to optionally
Lift the 1st, the 2nd delivery section 41,46.
With reference to Fig. 3 to Fig. 5, the carrying-in/carrying-out action to the base board delivery device involved by present embodiment illustrates.
Fig. 3 is the explanatory drawin for acting the central area first half involved by present embodiment as the carrying-in/carrying-out for carrying region.
Fig. 4 is the explanatory drawin for acting the central area latter half involved by present embodiment as the carrying-in/carrying-out for carrying region.
Fig. 5 is the explanatory drawin for integrally acting the central area involved by present embodiment as the carrying-in/carrying-out for carrying region.In addition,
Fig. 3 to Fig. 5 shows an example, can suitably change.
With reference to Fig. 3, following structures are illustrated, i.e. using the cut zone A1 of central area A first halfs as carrying
Region, to substrate W shorter in the conveying direction（For example, 50mm to 230mm）Conveyed.In the structure shown here, by cylinder 64
Setting disconnects, and curb girder portion 63 is positioned on Support Position.In addition, cylinder 67 is set connection, curb girder portion 66 is positioned at non-
On Support Position.
In the A of section, prepare output signal and connect, that implements substrate W moves into action.If move into base from previous process
Plate W simultaneously makes to move into sensor 53 and connects, then is driven conveying motor 44, using conveyer belt 43 by substrate W to center
The cut zone A1 conveyings of domain A first halfs.
If connecting the 1st stop sensor 54 by the conveying of substrate W, conveying motor 44 is set to slow down, and drive
Dynamic elevating motor 65.Conveying motor 44 stops at substrate W from the test position of the 1st stop sensor 54 to advance about
On position after 20mm.
As shown in Figure 3 C, if rising support workbench 62 using elevating motor 65, the abutting of the 1st delivery section 41
Portion 74 is abutted with the curb girder portion 63 of Support Position, and the curb girder portion 66 of the abutting part 75 of the 2nd delivery section 46 not with non-supported position supports
Connect.Thus, only the 1st delivery section 41 is risen with the state being supported on support workbench 62.Then, the substrate W on conveyer belt 43
Upper surface Wa abutted with holding plate 71, substrate W is gripped between conveyer belt 43 and holding plate 71.In this way, substrate W is removed
Enter to cut zone A1 and be positioned at carrying altitude datum.In interval B, mounting head 13（With reference to Fig. 1）Moved to the top of substrate W
It is dynamic, implement the installation action of electronic unit.
In the C of section, that implements substrate W takes out of action.If support workbench 62 decline, make conveying motor 44,
49 drivings, start again at the conveying of substrate W.If the 2nd stop sensor 55 is connected, preparation takes out of signal connection, and previous
A substrate W's takes out of action concurrently, and that implements follow-up substrate W moves into action.Then, moved into from previous process follow-up
Substrate W, moves into sensor 53 and connects, and follow-up substrate W is conveyed together with previous substrate W using conveyer belt 43.This
When, cut zone A1, previous substrate W that follow-up substrate W is delivered to central area A first halfs are delivered to central area A
The cut zone A2 of latter half.Then, with the conveying of previous substrate W, the 1st stop sensor the 54 and the 2nd stops passing
Sensor 55 disconnects successively.
The 1st stop sensor 54 is connected if over the conveying of follow-up substrate W, then conveying motor 44 is carried out
Slow down, and drive elevating motor 65.Conveying motor 44 makes follow-up substrate W stop at from the 1st stop sensor 54
On position after test position advance about 20mm.In addition, with the conveying of previous substrate W, take out of sensor 56 and connect, it is right
Conveying motor 49 slows down.It is big from the test position advance for taking out of sensor 56 that conveying motor 49 stops at substrate W
On position after about 5mm.If rising support workbench 62 using elevating motor 65, only the 1st delivery section 41 is with support
State on support workbench 62 rises.
Then, the upper surface Wa of the substrate W on conveyer belt 43 is abutted with holding plate 71, conveyer belt 43 and holding plate 71 it
Between grip substrate W.Thus, substrate W is positioned at carrying altitude datum.Mounting head 13 in this condition（With reference to Fig. 1）To
It is mobile above substrate W, implement the installation process of electronic unit.At this time, previous substrate W is standby in cut zone A2.
In the D of section, signal connection is moved into preparation, is started again at the conveying of previous substrate W, is taken out of to the latter process
The action that takes out of of previous substrate W starts.It is as noted above, shown in Fig. 3 carrying-in/carrying-out action in, elevating motor 65 with
The connection of 1st stop sensor 54 drives for triggering.In addition, the cut zone A2 of central area A latter halfs, as follow-up
The standby buffering area of previous substrate W when moving into action of substrate W use.
With reference to Fig. 4, illustrate following structures, i.e. using the cut zone A2 of central area A latter halfs as carrying region,
To substrate W shorter in the conveying direction（For example, 50mm to 230mm）Conveyed.In the structure shown here, cylinder 64 is set as
Connect, curb girder portion 63 is positioned at non-supported position.In addition, cylinder 67 is set to OFF, curb girder portion 66 is positioned at support
Position.
In the A of section, preparation takes out of signal connection, and start substrate W moves into action.If move into base from previous process
Plate W, moves into sensor 53 and connects, then driving conveying motor 44, using conveyer belt 43 by substrate W to central area A first halfs
The cut zone A1 conveyings divided.If over the conveying of substrate W, the 1st stop sensor 54 is connected, then driving conveying motor
49, substrate W is conveyed to the cut zone A2 of central area A latter halfs using conveyer belt 48.
Then, after making substrate W advance predetermined distances after the connection of the 2nd stop sensor 55, conveying motor 44,49 is subtracted
Speed, and drive elevating motor 65.Conveying motor 44,49 makes substrate W stop at the check bit from the 2nd stop sensor 55
Put on the position after the about 20mm that advances.If conveying motor 44 stops, preparation takes out of signal connection, with previous substrate
Concurrently, start follow-up substrate W moves into action to the installation process of W.
As shown in Figure 4 C, if rising support workbench 62 using elevating motor 65, the abutting of the 2nd delivery section 46
Portion 75 is abutted with the curb girder portion 66 of Support Position, and the curb girder portion 63 of the abutting part 74 of the 1st delivery section 41 not with non-supported position supports
Connect.Thus, the state for only making the 2nd delivery section 46 to be supported on support workbench 62 rises.Then, the base on conveyer belt 48 is made
The upper surface Wa of plate W is abutted with holding plate 72, and substrate W is gripped between conveyer belt 48 and holding plate 72.In this way, by substrate
W is moved into cut zone A2 and is positioned at carrying altitude datum.
In interval B, make mounting head 13（With reference to Fig. 1）Moved to the top of substrate W, the installation for implementing electronic unit is moved
Make.During installation process, connected if making to move into sensor 53 due to follow-up moving into for substrate W, driving conveying
Motor 44, is conveyed follow-up substrate W to the cut zone A1 of central area A first halfs using conveyer belt 43.
In the C of section, that implements substrate W takes out of action.If support workbench 62 declines, driving conveying motor
49, start again at the conveying of previous substrate W.On the other hand, if passing the 1st stopping due to the conveying of follow-up substrate W
Sensor 54 is connected, then conveying motor 44 is slowed down.Then, follow-up substrate W is standby in cut zone A1, until previous base
The processing that takes out of of plate W is completed.If over the conveying of previous substrate W, the 2nd stop sensor 55 disconnects, then takes out of sensor
56 connect, and conveying motor 49 is slowed down.Conveying motor 49 makes substrate W stop at before the test position for taking out of sensor 56
Into on the position after about 5mm.
In the D of section, signal connection is moved into preparation, is started again at the conveying of previous substrate W, is taken out of to the latter process
The action that takes out of of previous substrate W starts.As noted above, in carrying-in/carrying-out action shown in Fig. 4, elevating motor 65 will
Driven after predetermined distance is moved the 2nd stop sensor 55 is connected as triggering.In addition, central area A first halfs
Cut zone A1, used by the standby buffering area of subsequent substrate W when taking out of action as previous substrate W.Therefore, exist
When taking out of action of previous substrate W, can make follow-up substrate W close to before extremely carrying region and standby, so as to shorten beat
Time.
With reference to Fig. 5, illustrate following structures, i.e. using central area A integrally as carrying region, in the conveying direction compared with
Long substrate W（For example, 230mm to 570mm）Conveyed.In the structure shown here, cylinder 64,67 is set to OFF, by curb girder
Portion 63,66 is positioned on Support Position.
In the A of section, preparation takes out of signal connection, and start substrate W moves into action.If move into base from previous process
Plate W, moves into sensor 53 and connects, then driving conveying motor 44, using conveyer belt 43 by substrate W to central area A first halfs
The cut zone A1 conveyings divided.The 1st stop sensor 54 is connected if over the conveying of substrate W, then driving conveying is electronic
Machine 49, is conveyed substrate W to the cut zone A2 of central area A latter halfs using conveyer belt 48.Then, stop passing the 2nd
After sensor 55 connects metacoxal plate W advance predetermined distances, conveying motor 44,49 is slowed down, and elevating motor 65 is carried out
Driving.Conveying motor 44,49 makes substrate W stop at after the test position of the 2nd stop sensor 55 advances about 20mm
On position.
As shown in Figure 5 C, if rising support workbench 62 using elevating motor 65, the 1st, the 2nd delivery section 41,
46 abutting part 74,75 is abutted with the curb girder portion 63,66 of Support Position.Thus, the 1st, the 2nd delivery section 41,46 is to be supported on
The state supportted on workbench 62 rises.Then, the upper surface Wa and holding plate 71,72 for making the substrate W on conveyer belt 43,48 are supported
Connect, substrate W is gripped between conveyer belt 43,48 and holding plate 71,72.In this way, substrate W is moved into central area A simultaneously
It is positioned at carrying altitude datum.
In interval B, make mounting head 13（With reference to Fig. 1）It is mobile above to substrate W, implement the installation action of electronic unit.
In the C of section, decline support workbench 62, driving conveying motor 44,49, start substrate W takes out of action.Such as above-mentioned institute
Show, in the carrying-in/carrying-out action shown in Fig. 5, elevating motor 65 will move regulation since being connected the 2nd stop sensor 55
Driven after distance as triggering.
As noted above, involved base board delivery device 14, smaller in the length of conveying direction according to the present embodiment
Substrate W conveying when, use, therefore, there is no need to using some in multiple cut zone A1, A2 as standby buffering area
In addition the space of buffering area is set on transport path.Furthermore it is possible to the cut zone A1 obtained for segmentation central area A,
A2, using shared support workbench 62 and elevating motor 65, optionally lifts the 1st, the 2nd delivery section 41,46.Cause
This, will not make components number and cost increase, it is possible to achieve the densification of device.
In addition, the present invention is not limited to the above embodiment, it can make various changes and implement.In above-mentioned embodiment party
In formula, size and shape for being illustrated in attached drawing etc., it's not limited to that, can suitably become in the range of effect of the present invention is played
More.In addition, without departing from the scope of the object of the invention, it can suitably change and implement.
For example, being configured in the present embodiment, move the curb girder portion 63,66 on support workbench 62, but it is and unlimited
Due to the structure.Can also as shown in fig. 6, in the conveying direction will support workbench 62 be divided into it is multiple segmentation workbench 81,
Curb girder portion 63,66 is set to be moved together with segmentation workbench 81.In the case, it is not to link cylinder in curb girder portion 63,66, and
It is to link cylinder on each segmentation workbench 81.
In addition, in the present embodiment, illustrate the structure conveyed to the substrate W being of same size, but do not limit
In the structure.Can also it is corresponding with the width dimensions of substrate W and adjust conveying width.In this case as well, it is possible to such as Fig. 7 institutes
Show, support workbench 62 is divided into multiple segmentation workbench 82, adjustment and the width dimensions of substrate W on conveying width
Corresponding and powered segmentation workbench 82.In the case, elevating mechanism 61 and each segmentation workbench 82 are corresponding and have
There is independent driving source.
As shown in Figure 7 A, in the case of the width dimensions of substrate W are less, make the conveying between conveying 42,47 wide
Degree narrows, using only a segmentation workbench 82.As shown in Figure 7 B, in the case where the width dimensions of substrate W are larger, conveying is made
Conveying width between guide rail 42,47 broadens, and uses 2 segmentation workbench 82.Thus, it is possible to using small-sized driving source, make branch
Support workbench 62 lifts.In addition, the driving quantity of driving source is suitably controlled by corresponding with the width dimensions of substrate W,
So as to realize that the province of elevating mechanism is energetic.
In addition, being configured in the present embodiment, central area A is divided into 2 cut zone A1, A2, but it is and unlimited
Due to the structure.As long as central area A is divided into multiple cut zone, such as can also be divided into more than or equal to 3
It is a.
In addition, in the present embodiment, conveyer belt 43,48 is set on conveying 42,47, the 1st, the 2nd conveying is formed
Portion 41,46, but it is not limited to the structure.As long as the 1st, the 2nd delivery section 41,46 is configured to form transport path, and can be defeated
Substrate W is sent, can be arbitrary structure.
In addition, being configured in the present embodiment, curb girder portion 63,66 is mounted slidably on support workbench 62, but
It is not limited to the structure.Curb girder portion 63,66, which may be set to be, to be passed in and out on support workbench 62.This structure can be kept away
Exempt from the contact between the delivery section of a part and curb girder portion 63,66, the delivery section of a part is used as buffering area.
Industrial applicibility
As described above, the present invention has following effects, i.e. and will not increase components number and cost, can be with
The densification of realization device, especially suitable for the base board delivery device to carrying region conveying substrate and the conveying side of substrate
Method.
Claims (7)
1. a kind of base board delivery device, it is to the carrying region conveying substrate for carrying electronic unit, in the region of carrying by institute
State substrate and be maintained at defined height,
It is characterized in that, have：
Multiple delivery sections, are divided into multiple cut zone in the conveying direction by the carrying region, the plurality of delivery section with it is described
Multiple cut zone are respectively correspondingly set；And
Elevating mechanism, its by making the support workbench with the corresponding multiple supporting parts of the multiple delivery section, via
The multiple supporting part supports the multiple delivery section, thus allows for the lifting of the multiple delivery section,
The elevating mechanism, the part by making the multiple supporting part from the Support Position of support delivery section is mobile, so that
A part for the multiple delivery section corresponding with a part of supporting part is optionally set to rise to the defined height.
2. base board delivery device according to claim 1, it is characterised in that
The elevating mechanism, it is corresponding with the length of the substrate on conveying direction, optionally make the multiple delivery section
Rise.
3. base board delivery device according to claim 1, it is characterised in that
The elevating mechanism only makes the supporting part movement on the support workbench.
4. base board delivery device according to claim 1, it is characterised in that
The multiple supporting part is slidably disposed on the support workbench.
5. base board delivery device according to claim 1, it is characterised in that
The support workbench is divided into multiple segmentation workbench in the conveying direction,
The elevating mechanism makes the supporting part and divided segmentation workbench moves together in the conveying direction.
6. base board delivery device according to claim 1, it is characterised in that
The multiple delivery section can be corresponding with the width of the substrate and adjustment conveys width,
The support workbench is divided into multiple segmentation workbench on conveying width,
The elevating mechanism have with the corresponding independent driving source of divided segmentation workbench on conveying width, with
The width of the substrate is corresponding and adjusts the driving quantity of driving source.
7. a kind of carrying method of substrate, it, will in the carrying region to the carrying region conveying substrate for carrying electronic unit
The substrate is maintained at defined height,
It is characterized in that, there is following step：
The carrying region is divided into multiple cut zone in the conveying direction, using corresponding respectively with the multiple cut zone
Multiple delivery sections that ground is set, the step of conveying the substrate；And
By making the support workbench with multiple supporting parts corresponding with the multiple delivery section, via the multiple supporting part
The multiple delivery section is supported, so that using the elevating mechanism for the lifting that can realize the multiple delivery section, is conveyed from support
The Support Position in portion makes a part for the multiple supporting part mobile, thus optionally makes the supporting part a part of with this corresponding
The multiple delivery section a part rise to it is described as defined in height the step of.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-021190 | 2013-02-06 | ||
| JP2013021190A JP6045376B2 (en) | 2013-02-06 | 2013-02-06 | Substrate transfer device and substrate transfer method |
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| CN103974608A CN103974608A (en) | 2014-08-06 |
| CN103974608B true CN103974608B (en) | 2018-04-20 |
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| CN107801372B (en) * | 2016-08-29 | 2022-06-21 | Juki株式会社 | Mounting head and mounting device |
| JP7164319B2 (en) * | 2018-05-10 | 2022-11-01 | Juki株式会社 | Conveying device, mounting device, conveying method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101643145A (en) * | 2008-08-07 | 2010-02-10 | 富葵精密组件(深圳)有限公司 | Substrate conveying system |
| CN102157424A (en) * | 2010-01-21 | 2011-08-17 | 东京毅力科创株式会社 | Substrate conveying apparatus and substrate conveying method |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3659003B2 (en) * | 1998-07-03 | 2005-06-15 | 松下電器産業株式会社 | Electronic component mounting method |
| JP4564191B2 (en) * | 2001-03-07 | 2010-10-20 | Ｊｕｋｉ株式会社 | Substrate transfer device |
| JP4832244B2 (en) * | 2006-10-12 | 2011-12-07 | 富士機械製造株式会社 | Predetermined working method and predetermined working apparatus on printed circuit board |
| CN101801815B (en) * | 2007-09-19 | 2012-05-30 | 平田机工株式会社 | Substrate transfer system |
| JP2010219142A (en) * | 2009-03-13 | 2010-09-30 | Juki Corp | Obstacle detector of substrate carrier, and obstacle avoiding method |
| JP5438398B2 (en) * | 2009-07-03 | 2014-03-12 | Ｊｕｋｉ株式会社 | Board transfer speed setting device for surface mount equipment |
| JP2012059798A (en) * | 2010-09-07 | 2012-03-22 | Panasonic Corp | Component mounting apparatus |
| JP5931389B2 (en) * | 2011-09-29 | 2016-06-08 | 川崎重工業株式会社 | Transport system |
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2013
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101643145A (en) * | 2008-08-07 | 2010-02-10 | 富葵精密组件(深圳)有限公司 | Substrate conveying system |
| CN102157424A (en) * | 2010-01-21 | 2011-08-17 | 东京毅力科创株式会社 | Substrate conveying apparatus and substrate conveying method |
Also Published As
| Publication number | Publication date |
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| JP6045376B2 (en) | 2016-12-14 |
| JP2014154620A (en) | 2014-08-25 |
| CN103974608A (en) | 2014-08-06 |
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