JP4290505B2 - Unloader control method - Google Patents

Description

The present invention relates to a die bonder with unloader and the unloader, for example, those related to the unloading da control method for accommodating a substrate such as a lead frame bonded to a semiconductor chip (die) to the magazine.

A semiconductor device is generally manufactured by bonding (bonding) the back surface of a semiconductor chip (die) to a substrate such as a lead frame or a printed circuit board through a bonding material such as soft solder, hard solder, silver paste, or resin. ing.

In a die bonder for bonding such a semiconductor chip (die) to a substrate, as shown in FIGS. 16A and 16B, a loader 200, a transfer device 220, and an unloader 230 are arranged. 210 is supplied to the transfer device 220 one by one, the substrate 210 is transferred in a predetermined direction on the rail 221 of the transfer device 220, and bonded to the bonding region (island) 211 of the substrate 210 at the bonding material application position PS in the middle of transfer. A material 212 is applied, a semiconductor chip (die) 213 is bonded via the bonding material 212 at a bonding position PB, and the unloader 230 accommodates it in a magazine or the like.

As the loader 200, for example, a magazine in which a plurality of substrates 210 are vertically stored at a predetermined pitch is placed on an elevator that can be moved up and down, and the elevator is lowered (or raised) at a predetermined pitch, In some cases, the substrates 210 are cut out one by one from the upper side and loaded onto the transfer device 220.

Although not shown in the figure as the transfer device 220, conventionally, the front end of the substrate 210 placed on the rail 221 is gripped by a clamper (a), horizontally advanced (b) → substrate released (c ) → clamper ascending (d) → horizontal return movement (e) → descent (f) → clamper system in which conveyance is performed intermittently by the square motion of gripping by the clamper (a).

Further, a circular or square feed claw hole is formed at one or both ends in the width direction of the substrate 210, and the tip of the feed claw is hooked on this feed claw hole (a), and the feed claw is moved horizontally forward. (B) → Up (c) → Horizontal return movement (d) → Descent (e) → Feeding intermittently by the square motion of (a) hooking the tip of the feed claw into the feed claw hole There is a nail method.

As the unloader 230, as shown in FIG. 17, an empty magazine 232 is placed on the elevator 231 and the elevator 231 is lowered (or raised) at a predetermined pitch, and the magazine 232 is moved downward (or upward). There is one in which the substrates 210 to which the semiconductor chips 213 are bonded are stored one by one.

As an example of the above-described unloader, in a stack device disposed adjacent to another device on a semiconductor device manufacturing line, a supply unit that supplies a plurality of magazines and a plurality of magazines supplied to the supply unit A transmission / reception work unit having an intermittent movement mechanism that moves intermittently in the vertical direction in conjunction with other devices in the previous period according to the transmission / reception work, and a magazine that has been intermittently moved by the transmission / reception work part and has completed the transmission / reception work. A stopping part for stopping, and the supply part and the stopping part are connected to the upper side and the lower side of the transmission / reception working part so as to be spaced apart from each other, and the supply part extends in the horizontal direction. A stack apparatus has been proposed (see, for example, Patent Document 1).

JP 2001-253507 A

By the way, in the above-described unloader, there are various width and length dimensions of the substrate 210, and in particular, since the magazine has various width dimensions according to the width dimension of the substrate 210, conventionally, Depending on the width of the magazine, a dedicated unloader was used.

However, the use of a dedicated unloader according to the width of the magazine in this way is limited to the type of the width of the magazine at a production plant that unloads the magazine by bonding semiconductor chips to various sizes of substrates. The type of unloader is required, and not only the capital investment amount is high, but also the floor occupancy area is increased by the various types of unloader. Further, although all the unloaders corresponding to the substrates of all sizes are in operation, there is a problem that the operation rate of the unloader is lowered when only some types of unloaders are operated.

In addition, the stack apparatus described in Patent Document 1 has not only the same problems as described above, but also a transfer that pushes and transfers a magazine containing a substrate on which bonding has been completed from a transmission / reception operation unit toward a stop unit. Since the means (the third air cylinder and the pushing plate) are attached to the base, it is used only for the operation of simply transferring the magazine containing the substrate on which the bonding has been completed from the transmission / reception operation portion to the stop portion. This is a mechanism, and there is a problem that the cost performance is low because it is not at all other times.

SUMMARY OF THE INVENTION Accordingly, the main object of the present invention is to provide an unloader control method capable of storing workpieces of various sizes in a magazine.

Further, according to the present invention, transfer means that pushes and transfers a magazine containing a substrate for which bonding has been completed from the transmission / reception work unit toward the stop part is used as positioning means for the magazine supplied from the supply unit to the transmission / reception work unit. The purpose is to make it more multifunctional so as to achieve the above functions.

The unloader control method according to claim 1 of the present invention includes a magazine supply unit for disposing an empty magazine, a plate-like lifting platform, and a transfer of an empty magazine from the magazine supply unit to the lifting platform. 1 push plate, elevating means for elevating the elevating table, a magazine receiving unit arranged below the magazine supply unit for receiving a magazine storing work, and attached to the elevating table, A control method for an unloader comprising a second push plate for restricting a position of a magazine transferred to a lifting platform by a plate and transferring a magazine storing a work from the lifting platform to a magazine receiving portion, The second push plate moves horizontally to a position suitable for the width of the magazine and stands by. When the first push plate is advanced and the magazine is transferred to the lift platform, the magazine supply section lifts the lift platform. The distal end surface of the transfer has been the magazine by pushing the front of the second push plate, is characterized in that by the position regulating the tip end surface of the magazine in the proper position of the lifting platform for accommodating the workpiece in the magazine.

The unloader control method according to claim 2 of the present invention is characterized in that a detection means for detecting a state during the lifting operation of the lifting means is provided below the magazine supply section.

According to a third aspect of the present invention, there is provided an unloader control method comprising a lowered position detecting means for detecting that the lifting platform is lowered to a predetermined position.

The method of unloader according to claim 4 of the present invention, the magazine receiving section, it is characterized in that the magazine is provided with a full state detecting means for detecting that becomes full.

According to the unloader control method of the first aspect of the present invention, the empty magazine that is moved from the magazine supply unit to the lifting platform by the first transfer means by the second transfer means that also serves as the position restricting means. Since the supply position can be regulated, it can be shared for magazines of various sizes, the amount of capital investment can be reduced, and the operating rate of the unloader can be improved. In addition, the second transfer means not only has a function of transferring a magazine containing a substrate on which bonding has been completed from the lifting platform to the magazine receiving unit, but also removing an empty magazine from the magazine supply unit to the lifting platform. Since it also functions as positioning means when supplying, cost performance is improved.

Further, according to the unloader control method of the first aspect of the present invention, since the second transfer means is attached to the lifting platform, the lifting platform is in the raised position, and the magazine supply section When an empty magazine is supplied, the second transfer means can stand by at a position corresponding to the size of the empty magazine to regulate the empty magazine supply position, and the lifting platform is lowered. When the magazine is transferred from the lifting platform to the magazine receiving portion, it operates as a transfer means for transferring the magazine from the lifting platform, so that the magazine can be transferred from the lifting platform to the magazine receiving portion. it can.

According to the unloader control method of the second aspect of the present invention, since the elevating operation detecting means for detecting the state during the elevating operation of the elevating means is provided below the magazine supply section, Based on the detection output, the magazine is transferred from the magazine supply unit to the lifting platform by the first transfer means while the magazine is being lifted, or the magazine is transferred from the lifting platform to the magazine receiving portion by the second transfer means. Malfunction can be prevented.

According to the unloader control method of the third aspect of the present invention, since the descending position detecting means for detecting that the elevator base is lowered to the predetermined position is provided, the lifting platform is detected by the detection output of the descending position detecting means. Can be stopped at a predetermined position at the same height as the magazine receiving portion, and the second transfer means can smoothly transfer the magazine from the lifting platform to the magazine receiving portion.

In the unloader control method according to the fourth aspect of the present invention, the magazine receiving unit is provided with the full state detecting means for detecting that the magazine is full. By stopping the operation of the transfer means, it is possible to prevent a malfunction in which the second transfer means forcibly transfers the magazine to the full magazine receiver. Alternatively, the detection output, to notify by a warning lamp that magazine receiving unit is full, Ru can be removed the magazine from the magazine receiving portion.

Hereinafter, an embodiment of an unloader control method of the present invention will be described with reference to the drawings.

As shown in FIG. 1, the unloader 10 of the present invention is roughly divided into a magazine supply unit 11 that supplies a plurality of empty magazines M, an elevator 12, and an empty magazine M from the magazine supply unit 11. A first transfer means 13 to be transferred to 12; an elevating means 14 for moving the elevating table 12 up and down; a magazine receiving section 15 disposed below the magazine supply section 11; The magazine M also serves as a position regulating means for regulating the position of the empty magazine M supplied from the magazine supply unit 11 to the lifting platform 12 and transfers the magazine M in which the substrate 1 is stored from the lifting platform 12 to the magazine receiving unit 15. Second transfer means 16 is provided.

The magazine supply unit 11 has a substantially rectangular shape and is horizontally arranged, and has a size on which a plurality of empty magazines M can be placed so that the side surfaces in the length direction face each other. is doing. A plurality of recesses 111 are formed at the front end of the magazine supply unit 11, that is, the end on the lifting platform 12 side. In addition, the magazine supply unit 11 has two long holes 112 in the direction toward the elevator 12, and the lower part of the magazine supply 11 detects the lifting operation of the elevator toward the elevator 12 described later. A reflection type sensor 113 is attached as an example of the lifting operation detecting means.

The lifting platform 12 is substantially rectangular and has a size on which only one magazine M of various sizes can be placed, and enters the recess 111 of the magazine supply unit 11 at the end on the magazine supply unit 11 side. A plurality of convex portions 121 are provided. Therefore, in a state where the lifting platform 12 is raised to the same height as the magazine supply unit 11, the convex portion 121 of the lifting platform 12 enters the recess 111 of the magazine supply unit 11, and is empty from the magazine supply unit 11 to the lifting platform 12. The magazine can be supplied smoothly.

The first transfer means 13 includes a guide way 131, two linear guides 132, a magnet type rodless cylinder (hereinafter referred to as a cylinder) 133, a push plate 134, and a compressed gas or a vacuum suction force to the cylinder 133. And a driving force supply unit 135 that feeds and moves the push plate 134 forward or backward.

The guide way 131 is disposed below the central portion of the magazine supply unit 11 so as to extend toward the lifting platform 12. The two rear guides 132 are disposed along the long hole 112 below the long hole 112. The moving member of the cylinder 133 is slidably mounted on the guide way 131 and the two linear guides 132. The push plate 134 has an L-shaped cross section and is attached to the moving member of the cylinder 133. The driving force supply unit 135 for supplying the vacuum suction force or the compressed gas moves the moving member of the cylinder 133 along the guide way 131 and the linear guide 132 by the supplied compressed gas or the vacuum suction force. Yes. That is, by supplying compressed gas to the driving force supply unit 135, the moving member of the cylinder 133 moves forward toward the lifting platform 12, and the empty plate placed on the magazine supply unit 11 on the front surface of the push plate 134 is moved. The top magazine M can be transferred to the lift 12 by pushing the side surface in the length direction of the magazine M and moving it toward the lift 12. Further, after the magazine M is transferred to the lifting platform 12, the moving member of the cylinder 133 and the push plate 134 can be moved backward by supplying a vacuum suction force to the driving force supply unit 135.

The lifting platform 12 includes a single planted ball screw shaft 141, linear guides 142 on both sides thereof, and a lifting member that is engaged with the ball screw shaft 141 and moves up and down along the two linear guides 142. 143 and a timing motor 144 that rotationally drives the ball screw shaft 141. By this elevating means 14, the elevating platform 12 is intermittently lowered by one pitch of the magazine.

A lower position of the elevating means 14 is provided with a lowered position detecting means 145 for detecting that the elevating platform 12 is lowered to a predetermined position. The descending position detecting means 145 includes an L-shaped light shielding member 146 attached to the lower part of the lifting platform 11 and a transmissive sensor 147 that operates when the light shielding member 146 is lowered.

The magazine receiving unit 15 has a size that allows a plurality of magazines M to be placed therein, and has a full state detecting means 151 that detects that the magazine M is full. The full state detecting means 151 is substantially L-shaped and normally protrudes from the surface of the magazine receiving portion 15 with its elastic force, and the leaf spring member 152 resists the elastic force by the weight of the magazine M. The transmission sensor 153 operates by being pushed down.

The second transfer means 16 also serving as a position restricting means includes an attachment member 161 attached to the lifting platform 12, a ball screw shaft 162, and two linear guides 163 disposed on both sides of the ball screw shaft 162. , A push plate 164 serving also as a position restricting member attached to the tip of the lifting / lowering base 12 side of the ball screw shaft 162 and the linear guide 163, a driving source of the ball screw shaft 162, for example, a timing motor 165, and a rotation of the timing motor 165 A drive pulley 166 attached to the shaft, a passive pulley 167 attached to the ball screw shaft 162, and a timing belt 168 spanned between these pulleys 166 and 167 are provided.

Next, the operation of the unloader 10 will be described.

First, a plurality of empty magazines M are placed on the magazine supply unit 11 such that the side portions in the length direction face each other and face the lifting platform 12. Further, as shown in FIG. 1, the lifting platform 12 is stopped at the upper position at the same height as the magazine supply unit 11 by the lifting means 14. Then, the push plate 164 of the second transfer member 16 that also serves as the position restricting means is horizontally moved to a position suitable for the width dimension of the magazine M by the timing motor 165 and is kept on standby.

In this state, when compressed gas is supplied to the driving force supply unit 135, the moving member of the cylinder 133 moves forward toward the lifting platform 12, and thereby the length of the magazine M on the front surface of the push plate 134 fixed to the moving member. The side portion in the vertical direction is pushed, and the top one magazine M is transferred to the lifting platform 12. At this time, the position of the front end surface of the magazine M is restricted by the push plate 164 serving as a position restricting means, and the magazine M is transferred to an appropriate position on the lifting platform 12. When the position of the leading magazine M is restricted by the position restricting means, the forward movement of the first transfer means 13 is stopped. Then, a vacuum suction force is supplied to the driving force supply unit 135, and the moving member of the cylinder 133 and the push plate 134 move backward.

On the other hand, when the magazine M is transferred to the elevator 12, the elevator 12 is intermittently lowered by one pitch of the magazine M by the timing motor 144 of the elevator 14, and the semiconductor chip is bonded from the transfer device 70. Each of the substrates 1 is stored in the magazine M one by one.

During the lowering operation of the lifting platform 12, the reflection type sensor 113 detects that the lifting platform 12 is descending, so the transfer operation of the magazine M to the lifting platform 12 by the first transfer means 13 is performed. Stopped.

In this manner, when the magazine 1 has been stored in the magazine 1, the light shielding member 146 of the lowering position detecting means 145 provided at the lower part of the lifting / lowering base 12 is moved down by the lowering of the lifting / lowering base 12. Since it is detected from the output of the transmission type sensor 147 that the substrate 1 has been stored in the magazine M, the lowering operation of the lifting platform 12 by the lifting means 14 is stopped.

Thereafter, the timing motor 165 of the second transfer means 16 is driven, and the ball screw shaft 141 is rotated via the drive pulley 166, the timing belt 168, and the passive pulley 167, whereby the push plate 164 is moved to the magazine receiver 15. The magazine M is transferred from the lifting platform 12 to the magazine receiving unit 15.

When the magazine M is transferred from the elevator 12 to the magazine receiver 15, the timing motor 165 reverses and the push plate 164 returns to its original position, and the elevator 12 is raised by the elevator 14 to return to the original position. Return to the raised position. The first transfer means 11 and the second transfer means 16 can be prevented from operating by the reflective sensor 113 even during the lifting operation of the lifting platform 12. Thereafter, the same operation is repeated, and the magazines M are sequentially transferred to the magazine receiving unit 15 one by one.

In this way, when the magazine M of the magazine receiving unit 15 becomes full, the leaf spring 152 of the full state detecting means 151 is pushed down against its elastic force by the weight of the leading magazine M, so that the transmission type sensor Since 153 is shielded from light and it is detected that the magazine M is full, the operation of transferring the magazine M from the lifting platform 12 to the magazine receiving unit 15 is stopped by the second transfer means 16 based on the detected output. To do. Alternatively, a warning lamp is turned on with the detection output to notify the worker, and the worker removes the magazine M from the magazine receiving unit 15.

As described above, according to the unloader control method of the present invention, an empty magazine M is transferred from the magazine supply unit 11 to the lifting platform 12 by the first transfer means 13, and the lifting platform 12 is intermittently lowered. Then, the bonded substrates 1 are stored one by one in the magazine M. When the substrates 1 are stored in the magazine M, the magazine M storing the substrates 1 is moved up and down by the second transfer means 16. 12 can be transferred to the magazine receiving section 15.

Further, when the lifting platform 12 is in the raised position, the second transfer means 16 places the push plate 164 at a position corresponding to the width dimension of the magazine M, so that the magazine supply unit 11 moves to the lifting platform 12. Since the front position of the transferred magazine M can be regulated, the magazine M can be positioned at an appropriate position even if the width dimension of the magazine M changes. In other words, the unloader 10 used in the unloader control method of the present invention can be shared for magazines M of various sizes, and a dedicated unloader corresponding to the size of the conventional magazine M is installed. Compared to the above, not only can the capital investment be reduced, but the operating rate of the unloader can be improved.

Further, the second transfer means 16 not only has a function of transferring the magazine M containing the bonded substrates 1 from the lifting platform 12 to the magazine receiving section 15 but also as described above. Since it also functions as a positioning means when transferring M from the magazine supply unit 11 to the lifting platform 12, the cost performance of the second transfer means 16 is improved.

Next, a reference example of a die bonder incorporating the unloader 10 will be described.

As shown in FIG. 5, the die bonder 50 includes a loader 20 that supplies a substrate 1 such as a lead frame or a printed circuit board, which is an example of a workpiece, a transport device 70 that transports the substrate 1, A bonding material application device 30 that applies a bonding material to the substrate 1 at the bonding material application position PS on the near side, and a bonding region of the substrate 1 to which the bonding material is applied at a bonding position PB on the front side in the middle of the conveyance device 70 A bonding head 40 for bonding a semiconductor chip (die) and an unloader 10 for receiving the substrate 1 bonded with the semiconductor chip are provided. The unloader 10 has the configuration shown in FIGS.

For example, as shown in FIGS. 6 (A) and 6 (B), the substrate 1 is a rectangular and flat plate having a length dimension of L, a width dimension of W, and a thickness dimension of t. It has a bonding area 2 for the chip, and has a holding area 3 without the bonding area 2 along the length direction on one side in the width direction. The gripping area 3 does not require a feed claw hole as in the conventional feed claw method, but even a substrate on which a conventional feed claw hole is formed can be used without any trouble.

The loader 20 stocks a large number of substrates 1 and supplies them one by one to the transfer device 70. As shown in FIG. 7A, a large number of substrates 1 are stored in the elevator 21 at predetermined pitch intervals. The magazine 22 is placed, and the elevator 21 is lowered (or raised) by a predetermined pitch, and the pusher 23 of the pusher 23 cuts out the substrates 1 one by one from the lower side (or upper side) and supplies them to the transfer device 70. It is. Alternatively, as shown in FIG. 7B, a large number of substrates 1 are stacked and sucked one by one from the uppermost substrate 1 by one or a plurality of work sucking means 25, and the transfer device 70 It may be what is supplied to.

The transport device 70 grips and transports the grip region 3 of the substrate 1 shown in FIG. 6, and is particularly suitable for combination with the unloader 10 shown in FIGS. Will be described later.

For example, as shown in FIG. 8, the bonding material application device 30 stores a bonding material 33 in a syringe 32 attached to a mounting member 31 and discharges the bonding material 33 from the nozzle 35 by a predetermined amount by a compressed gas 34. In this way, the X-axis drive motor is configured to be intermittently movable in the width direction (X direction) of the substrate 1, and sequentially into the bonding regions 2 arranged in a line along the width direction of the substrate 1. The bonding material 33 is applied.

The attachment member 31 to which the syringe 32 is attached may be configured to be movable along the traveling direction of the substrate 1 by a Y-axis drive motor. In this case, for example, a first image recognition device (not shown) such as a CCD camera or a CMOS camera can display an image of the state of the bonding region 2 before applying the bonding material and the state of the bonding region 2 after applying the bonding material. In the case of recognition, the attachment member 31 can be moved and retracted in the Y direction to make it easier to recognize the image.

The semiconductor chip bonding head 40 uses vacuum suction force to pick up semiconductor chips 65 one by one from the pick-up position P1 of the semiconductor chip one by one as shown in FIG. Bonding is sequentially performed on the bonding region 2 to which the bonding material 33 is applied.

At the pick-up position P1 of the semiconductor chip 65, for example, as shown in FIG. 10C, there is a semiconductor chip assembly 60 in which a large number of semiconductor chips 65 are bonded to an adhesive sheet 62 attached to a wafer ring 61. Has been placed. As shown in FIG. 10 (A), the semiconductor chip assembly 60 has a semiconductor wafer 63 attached to an adhesive sheet 62 attached to a wafer ring 61, and a dicer 64 as shown in FIG. 10 (B). After the semiconductor wafer 63 is cut vertically and horizontally and divided into individual semiconductor chips 65, as shown in FIG. 10C, the adhesive sheet 62 is placed on the fixing ring 66, and the wafer ring 61 is pushed down to adhere the adhesive sheet. By stretching 62, the individual semiconductor chips 65 are separated from each other, and the adhesive force between the adhesive sheet 62 and the semiconductor chip 65 is reduced.

In the die bonder for bonding the semiconductor chip to the substrate, the operation of the bonding head 40 that moves between the pickup position P1 of the semiconductor chip and the bonding position P2 will be described in detail. The bonding head at the pickup position P1 of the semiconductor chip. 40 is lowered (a), and the bonding head 40 that vacuum-sucks the semiconductor chip 65 from the semiconductor chip assembly 60 is raised (pickup) (b), then moved horizontally (c), and at the bonding position P2, the bonding head 40 is moved. (D) The semiconductor chip 65 is bonded to the substrate 1 via the bonding material 2, and when the bonding is completed, the bonding head 40 is raised (e) and then moved horizontally (f) to the original pickup position. Return to above P1.

During the operations a to f in the bonding head 40, the semiconductor chip assembly 60 moves horizontally by one pitch, and the next semiconductor chip 65 to be picked up is moved to the pickup position P1. Thereafter, the same operation is repeated, and the semiconductor chips 65 are sequentially picked up and bonded to the substrate 1.

Next, the configuration and operation of the transfer device 70 will be described. As shown in FIGS. 11 and 12, the conveying device 70 has a lower timing belt (hereinafter referred to as a lower belt) 71 and an upper timing belt (hereinafter referred to as an upper belt) 72 facing each other vertically. It is arranged. The lower belt 71 is supported in a horizontal state on the upper belt 72 side by a drive pulley 73, a driven pulley 74, and a number of feed pulleys 75, 76 that are arranged and fixed at a predetermined height position. It moves to the right). The upper belt 72 is moved in the direction indicated by the arrow (from left to right) with the lower belt 71 side being supported in a horizontal state by the drive pulley 77, the driven pulley 78, and the multiple feed pulleys 79 and 80. ing.

As shown in FIGS. 13 (A) and 13 (B), the drive pulleys 73 and 77 have pulleys 73A and 77A fixed to the other end of the rotating shaft. A single drive motor is attached to the pulleys 73A and 77A. A timing belt 84 is stretched around a pulley 82 attached to a rotation shaft 81 and a tension pulley 83, and is driven to rotate synchronously and in the opposite direction.

The driving pulley 73 of the lower belt 71, the driven pulley 74 and the driving pulleys 77 and 78 of the upper belt 72, and the pulley 82 and the tension pulley 83 attached to the driving motor 81 are all wrinkled and This is for a timing belt having irregularities meshing with the irregularities formed on the inner circumferential surfaces of the upper and lower belts 71 and 72 on the surface.

Of the feed pulleys 75 and 76 of the upper belt 71 and the feed pulleys 79 and 80 of the lower belt 72, the feed pulleys 75 and 79 (shown by A in FIG. 11) are uneven on the circumferential surface of the upper and lower belts 71 and 72. The feed pulleys 76 and 80 (shown by B in FIG. 11) do not have irregularities meshing with the irregularities of the upper and lower belts 71 and 72 on the circumferential surface, and are merely for support. Is.

Further, as apparent from FIG. 14 (B) and FIG. 14 (C) in which an arrow A portion in FIG. 14 (B) is enlarged, the lower pulley 71 side feed pulley 75 and the upper belt 72 side feed. The pulley 79 is provided with a hook so that the upper and lower belts 71 and 72 do not fall off.

On the other hand, as is clear from FIG. 14D in which the portion B shown in FIG. 14B is enlarged, the feed pulley 76 on the lower belt 71 side and the feed pulley 80 on the upper belt 72 side are free of wrinkles. Is. In this way, the feed pulleys 76 and 80 are inexpensively arranged without ridges and irregularities, and are arranged alternately with the expensive feed pulleys 75 and 79 having ridges and irregularities, thereby reducing the cost. .

Further, the shafts 79a, 80a of the feed pulleys 79, 80 of the upper belt 72 are slightly closer to the loader 20 side than the shafts 75a, 76a of the feed pulleys 75, 76 of the lower belt 71, as shown in FIG. It is provided eccentrically. Moreover, as shown in FIG. 14A, the unloader 50 side of each of the feed pulleys 79 and 80 is always urged by a tension spring 85 so as to be pulled obliquely downward. For this reason, the upper belt 72 is always pressed against the lower belt 71 by the elastic force of the tension spring 85 acting on the feed pulleys 79 and 80.

Therefore, the substrate 1 can be held by the upper and lower belts 71 and 72, and when the force against the elastic force of the tension spring 85 is applied, the feed pulleys 79 and 80 of the upper belt 72 cause the shafts 79a and 80a to move. By rotating counterclockwise about the center, the unloader 50 side of the feed pulleys 79 and 80 is configured to be able to move up against the elastic force of the tension spring 85. Based on such a configuration, when the thickness dimension t of the substrate 1 supplied between the upper and lower belts 71 and 72 is increased to t1 (> t), the unloader 50 side of the feed pulleys 79 and 80 becomes elastic of the tension spring 85. By rising against the force, the upper belt 72 rises and the thick substrate 1 can be gripped by the upper and lower belts 71 and 72.

The return portion 71a of the lower belt 71 is provided with a guide roll 86 that is fixedly arranged and a tension roll 87 that can be moved up and down. The return portion 72a of the upper belt 72 has an appropriate number of tension rolls. 88 is provided, and appropriate tension is applied to the upper and lower belts 71 and 72, respectively.

Further, as shown in FIG. 11, the movement path of the bonding head 40 in the return portion 72a of the upper belt 72 is made by direction changing rolls 89, 90, 91, 92 so as not to hinder the movement of the bonding head 40. A portion 93 having a reduced height is provided. That is, the pickup position P1 for picking up the semiconductor chip 65 from the semiconductor chip assembly 60 is disposed on the front (lower side in the drawing) side of the upper and lower belts 71 and 72, as shown in FIG. Since the substrate 1 to which the semiconductor chip 65 is bonded is located on the other side of the upper and lower belts 71 and 72 (the upper side in the figure), the bonding head 40 is located on the front side of the upper and lower belts 71 and 722. And the substrate 1 on the other side of the upper and lower belts 71 and 72 must be reciprocated.

Therefore, if the return portion 72a of the upper belt 72 remains high, such as on both sides of the lowered portion 93, the bonding head 40 raises the return portion 72a of the high upper belt 72 → horizontally moves → descends. Thus, the upper belt 72 has to get over the return portion 72a, and the bonding head 40 needs to move up and down, so that not only the drive mechanism of the bonding head 40 is large and expensive, but also the bonding speed is high. It is inevitable that it falls.

On the other hand, as shown in FIG. 11, if the lowered portion 93 is provided in the return portion 72a of the upper belt 72, the bonding head 40 does not move up and down greatly through the lowered portion 93. The semiconductor chip pickup position P1 on the front side of the upper and lower belts 71 and 72 and the bonding region 2 of the substrate 1 at the bonding position P2 on the other side of the upper and lower belts 71 and 72 can be reciprocated at a high speed. Can be improved.

As is clear from FIGS. 5 and 11, the transfer device 70 includes a workpiece moving table 94 disposed along the moving direction of the substrate 1 on the other side of the upper and lower belts 71 and 72. The substrate 1 supplied from the loader 20 is transported on the work moving table 94.

Next, the operation of the die bonder 50 incorporating the unloader 10 will be described. First, the drive motor 81 of the transfer device 70 is driven, and the upper and lower belts 71 and 72 are moved intermittently by an amount corresponding to one pitch of the bonding region 2 of the substrate 1 in synchronization with the arrow direction in FIG. Keep it.

When the substrate 1 is supplied from the loader 20 to the transport device 70 with the grip region 3 on the near side (upper and lower belts 71 and 72 side), the upper and lower belts 71 and 72 of the transport device 70 are held by the grip region of the substrate 1. 3 is gripped from above and below and conveyed intermittently from the left end to the right end in FIG. At this time, the bonding material application device 30 is retracted to a position outside the bonding material application region PS.

When the bonding region 2 in the first row of the substrate 1 comes to the bonding material application position PS, the bonding is temporarily stopped at that position, and the image of the bonding region 2 is recognized by the first image recognition device (not shown). It is inspected whether or not the bonding area 2 is located at a regular position. If the bonding area 2 is not located at the proper position, the drive mechanism of the transfer device 70 is operated by the detection output to automatically correct the bonding area 2 to the normal position.

When it is confirmed that the bonding area 2 is located at the regular position, the bonding material application device 30 is lowered, the bonding material 33 is applied to the bonding area 2 of the substrate 1 and is raised. Then, the mounting member 31 is moved horizontally by one pitch in the width direction of the workpiece and lowered by the X direction drive motor, and the bonding material 33 is applied to the second bonding region 2 in the first row of the substrate 1. ,To rise. Hereinafter, similarly, the bonding material 33 is sequentially applied to the third to last bonding regions 2 in the first row of the substrate 1 and then raised.

When the bonding material 33 has been applied to all the bonding regions 2 in the first row of the substrate 1 in this way, the bonding material application state of the bonding region 2 is image-recognized by the first image recognition device. First, if there is a bonding area 2 in which the application state is defective, the bonding area 2 in the defective application state is stored in the storage device, and the application condition by the bonding material application apparatus 30 is automatically corrected by the detection output.

In this way, when the bonding material 33 is applied to at least all the bonding regions 2 in the first row and the application state is recognized, the substrate 1 is intermittently equivalent to one pitch by the movement of the upper and lower belts 71 and 72. It is conveyed to. Hereinafter, in the same manner as described above, the state before application of the bonding material in all the bonding regions 2 and / or the bonding material application state of the bonding region 2 in each of the second, third,. Is done.

Note that if a CMOS camera having a higher resolution than a CCD camera is used as the first image recognition device, at least one row of all bonding regions 2 of the substrate 1 is contained in one field of view and image recognition is performed collectively. Can do. At this time, not only all bonding regions 2 in the first row of the substrate 1 but also all bonding regions 2 in the second and subsequent rows can be collectively recognized. With respect to the state before application and / or after application of the bonding material, it is possible to collectively recognize images of all the bonding regions 2 up to several lines in one field of view.

Therefore, as compared with the CCD camera, the CMOS camera does not need to move in the width direction of the substrate 1, so that the support mechanism of the CMOS camera is simple, downsized, and inexpensive. Further, since the horizontal movement time of the CMOS camera and the waiting time until the image shake accompanying the horizontal movement is eliminated are unnecessary, the image recognition can be speeded up. Furthermore, the image can be processed by using the idle time after the image recognition of the bonding regions 2 for one row or several rows of the substrate 1 is collectively performed. Further, by using the free time after the image recognition of the bonding areas 2 for several rows at once, the image of the single or plural bonding areas 2 in all the bonding areas 2 is sequentially divided and enlarged, A more accurate inspection of the bonding material application state can be performed.

The substrate 1 on which the bonding material 33 is applied is intermittently conveyed toward the right in FIG. 5 by the upper and lower belts 71 and 72, and when the bonding region 2 in the first row comes to the bonding position PB, the CMOS camera A second image recognition device (not shown) such as the above recognizes all the bonding regions 2 to which the bonding material in the first row has been applied. Therefore, the bonding material application state before the bonding of the semiconductor chip is again inspected by image recognition by the second CMOS camera or the like.

If there is a bonding region 2 in which the bonding material application state is poor in the first row by the inspection of the bonding material application state and / or the inspection by the first image recognition device, these bonding material application states The semiconductor chip 65 is bonded by the bonding head 40 while skipping the defective bonding region 2.

At this bonding position PB, as shown in FIG. 9, the semiconductor chip 65 is picked up one by one from the semiconductor chip assembly 60 at the pickup position P1 by the bonding head 40, and the bonding region 2 of the substrate 1 is bonded at the bonding position P2. The substrates are sequentially bonded to the substrate 1 through the bonding material 33 applied thereto.

At this time, as described above, since the lowered portion 93 is provided in the return portion 72a of the upper belt 72, the bonding head 40 is located between the pickup position P1 of the semiconductor chip 65 and the bonding position P2 of the substrate 1. It can reciprocate without moving up and down greatly, the support mechanism of the bonding head 40 can be made small and inexpensive, and the bonding speed can be improved. When the bonding of the semiconductor chip 65 to the bonding region 2 in the first row of the substrate 1 is completed, the substrate 1 is intermittently transferred by one pitch, and hereinafter the bonding regions 2 in the second row and the third row. Then, the semiconductor chips 65 are bonded sequentially.

As described above, if a CMOS camera having a higher resolution than a CCD camera is used as the second image recognition device, at least one row of all bonding regions 2 of the substrate 1 is contained in one field of view. Image recognition. At this time, not only all bonding regions 2 in the first row of the substrate 1 but also all bonding regions 2 in the second and subsequent rows can be collectively recognized, so that the semiconductor chip As for the state before bonding and / or after bonding, all the bonding regions 2 up to several rows in one field of view can be collectively recognized.

Therefore, as described above, the CMOS camera does not need to move in the width direction of the substrate 1 as compared with the CCD camera, so that the support mechanism of the CMOS camera is simple, downsized, and inexpensive. Further, since the horizontal movement time of the CMOS camera and the waiting time until the image shake accompanying the horizontal movement is eliminated are unnecessary, the image recognition can be speeded up. Furthermore, the captured image can be processed using the idle time after the image recognition of the bonding regions 2 for one row or several rows of the substrate 1 is collectively performed. Further, by using the free time after the image recognition of the bonding areas 2 for several rows at once, the image of the single or plural bonding areas 2 in all the bonding areas 2 is sequentially divided and enlarged, It is possible to inspect the bonding state of the semiconductor chip with higher accuracy.

The substrate 1 to which the semiconductor chip 65 is bonded is intermittently conveyed to the right, and is sequentially stored in the magazine M in accordance with the downward movement of the lifting platform 12 by one pitch by the unloader 10 at the right end. Is done.

Next, the operation of the transfer apparatus 70 when the thickness dimension t of the substrate 1 supplied from the loader 20 varies will be described. First, when the substrate 1 having a thickness of t is supplied, as described above, the shafts 79a and 80a of the feed pulleys 79 and 80 on the upper belt 72 side are eccentrically attached to the loader 20 side, and Since the unloader 50 side of the feed pulleys 79 and 80 is urged toward the lower belt 71 by the tension spring 85, the unloader 50 side of the feed pulleys 79 and 80 is tension spring 85 as shown in FIG. The upper belt 72 is lifted by rising by the thickness dimension of the substrate 1 against the elastic force of the substrate 1, and the upper belt 72 is always directed toward the lower belt 71 by the elastic force of the tension spring 85. Since it is biased, the upper and lower belts 71 and 72 can reliably grip and transport the grip region 3 of the substrate 1 having the thickness dimension t.

Next, when the substrate 1a having the thickness dimension t1 (> t) is supplied, the feed pulleys 79 and 80 on the upper belt 72 side are centered on the shafts 79a and 80a as shown in FIG. Although the shafts 79a and 80a of the feed pulleys 79 and 80 are eccentrically attached to the loader 20 side, the unloader 50 side of the feed pulleys 79 and 80 is connected to the tension spring 85. The upper belt 72 is raised by rising by the thickness dimension of the substrate 1a against the elastic force, and the gripping region 3 of the substrate 1a having the thickness dimension t1 (> t) is lifted by the upper and lower belts 71 and 72. It can be gripped and transported.

As described above, in the transport device 10, the unloader 50 side of the feed rolls 79 and 80 moves up and down against the elastic force of the tension spring 85 in response to the variation in the thickness dimension of the substrate 1, and the upper belt 72. As a result of moving up and down, it is possible to respond smoothly without using an adapter or adjusting the mounting position of the feed rolls 79 and 80. For this reason, the diameter dimension of the feed rolls 79 and 80 of the upper belt 72 and the eccentric dimension of the shafts 79a and 80a are appropriately set in advance according to the variation range of the thickness dimension of the substrate transported by the transport device 70. It is necessary to keep.

Even if the substrate 1b having the length L1 (≠ L) or the substrate 1c having the width W1 (≠ W) is supplied by switching the type of the substrate 1, as described above, the upper and lower belts 71 and 72 are Since the grip region 3 at the end of the substrates 1b and 1c is gripped, the grip region 3 of the substrates 1b and 1c is gripped smoothly regardless of the length dimension L1 and the width dimension W1 of the substrates 1b and 1c. It can be conveyed intermittently.

As described above, the transfer device 70 can be used for various sizes of substrates and can be shared. The unloader 10 described above can be used for the push plate 164 in the second transfer means 16 even if the width of the magazine M changes. This means that this die bonder 50 can be used for various sizes of boards together with the fact that it can be handled and shared by changing the standby position, and a dedicated die bonder is manufactured and used for each board size. In comparison with the case where the number of die bonders is set, the number of installed die bonders can be reduced, the amount of capital investment and the occupied floor area can be reduced, and the operation rate of the die bonders can be improved.

In addition, said embodiment demonstrated the specific form of this invention, This invention is not limited to this embodiment, Various deformation | transformation are possible.

For example, in the unloader, the magazine supply unit 11, the first transfer unit 13, the lifting unit 14, the magazine receiving unit 15, the second transfer unit 16, and the like shown in the above embodiment each have their intended functions. As long as it plays, it can be set as arbitrary configurations.

Further, in the die bonder, the loader 20, the transfer device 70, the bonding material coating device 30, the bonding head 40, and the like can be arbitrarily configured as long as they each have their intended functions. In particular, the transport device 70 has been described with respect to the case where the gripping area 3 of the substrate 1 is gripped and transported by the upper and lower timing belts 71 and 72, but a conventionally known clamper type or feed claw type transport device may be employed. it can.

Control how the unloader of the present invention is particularly useful in die bonder semiconductor chip can be applied to various electronic component chips of the unloader and the die bonder, such as chip resistors and chip capacitors.

It is a schematic front view of the unloader which concerns on embodiment of this invention. It is a top view of the unloader of FIG. It is a left view of the unloader of FIG. It is a right view of the unloader of FIG. It is a schematic plan view of the die bonder incorporating the unloader of FIG. (A) is a top view of an example of the board | substrate used with the die bonder of FIG. 5, (B) is a front view of the board | substrate of (A). (A) is a schematic front sectional view of an example of a loader in the die bonder of FIG. 5, and (B) is a schematic front view of a different example of the loader in the die bonder of FIG. It is a general | schematic expanded sectional view of the bonding material application apparatus in the die bonder of FIG. It is operation | movement explanatory drawing of the bonding head in the die bonder of FIG. It is sectional drawing which shows the manufacturing process of a semiconductor chip aggregate, (A) is the state which stuck the wafer sheet which stuck the semiconductor wafer to the wafer ring, (B) is the state which divided | segmented the semiconductor wafer into each semiconductor chip with the dicer, (C) is a state where the wafer sheet is stretched. It is a front view which shows the arrangement | positioning state of the up-and-down timing belt and pulley of the conveying apparatus in the die bonder of FIG. It is an expanded sectional view of the conveying apparatus of FIG. (A) is a rear view of the drive pulley part in the conveyance apparatus of FIG. 11, (B) is a right view of the drive pulley part of (A). (A) is a schematic front view of a drive roller, a passive roller, and an upper feed roller portion in the conveying device of FIG. 11, (B) is a schematic plan view of an upper feed roller portion of (A), and (C) is a view of (B). The enlarged side sectional view of an arrow A part, (D) is the enlarged side sectional view of an arrow B part of (B). (A) is an enlarged front view showing the state of the upper and lower belts and the upper and lower feed rollers of the transport device when a substrate with a small thickness is supplied. (B) is the transport when a substrate with a large thickness is supplied. It is an enlarged front view which shows the state of the up-and-down belt and up-and-down feed roller of an apparatus. (A) is a schematic front view of the conventional die bonder, (B) is a schematic plan view in the die bonder of (A). It is a schematic front view of the unloader in the conventional die bonder.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Bonding area | region 3 Grasp area | region 10 Unloader 11 Magazine supply part 113 Lifting motion detection means (reflection type sensor)
12 Lifting table 13 First transfer means 134 Push plate 14 Lifting means 145 Lowering position detection means 15 Magazine receiving portion 151 Full state detection means 16 Second transfer means 164 Push plate 20 Loader 30 Bonding material coating device 40 Bonding Head 50 die bonder

Claims (4)

A magazine supply unit for disposing an empty magazine, a flat plate-like elevator, a first push plate for transferring an empty magazine from the magazine supply unit to the elevator, and an elevator for moving the elevator A magazine receiving unit that is arranged at a lower position of the magazine supply unit and receives a magazine storing workpieces;
A second push plate which is attached to the lift and restricts the position of the magazine transferred to the lift by the first push plate, and transfers a magazine storing workpieces from the lift to the magazine receiving portion; An unloader control method comprising:
The second push plate moves horizontally to a position suitable for the width dimension of the magazine and waits. When the first push plate is advanced and the magazine is transferred to the lifting platform, the magazine supply unit moves from the lifting platform to the lifting platform. A method for controlling an unloader, comprising: pressing a front end surface of a transferred magazine with a front surface of a second push plate; and restricting the front end surface of the magazine to an appropriate position of a lifting platform and storing a work in the magazine. . 2. The unloader control method according to claim 1, further comprising an elevating operation detecting means for detecting a state during the elevating operation of the elevating means below the magazine supply unit. 3. The unloader control method according to claim 1, further comprising a lowered position detecting means for detecting that the lifting platform is lowered to a predetermined position. 4. The unloader control method according to claim 1, wherein the magazine receiving section is provided with a full state detecting means for detecting that the magazine is full.