KR101027050B1 - Loading and unloading apparatus for wafer of solar battery - Google Patents

Abstract

An apparatus for loading and unloading a wafer for a solar cell is disclosed. An apparatus for loading and unloading a wafer for a solar cell of the present invention may include a carrier transfer unit in which a carrier on which a plurality of wafers for a solar battery are to be loaded is loaded; And a wafer transfer unit for transferring a plurality of solar cell wafers to a carrier transfer unit, the wafer transfer unit having at least one transfer conveyor having a plurality of vacuum holes formed on a surface thereof. do. According to the present invention, the wafer can be transported at high speed on the transport conveyor to which the wafer is transported to reduce the tact time, but the wafer can be transported safely at high speed without being separated from the transport conveyor.

Description

Loading and unloading device for solar cell wafers {Loading and unloading apparatus for wafer of solar battery}

The present invention relates to a device for loading and unloading a wafer for a solar cell, and more particularly, in order to reduce tact time, the wafer is transferred at a high speed on a transfer conveyor to which the wafer is transferred, but the wafer is separated from the transfer conveyor. The present invention relates to an apparatus for loading and unloading a wafer for a solar cell, which can be safely and quickly transported.

Solar batteries convert solar energy into electrical energy and have a structure different from that of conventional chemical cells. It is also called a physical battery. Such solar cells generate electricity by using two types of semiconductors called P-type semiconductors and N-type semiconductors.

Briefly look at the principle of solar cells. When light shines on a solar cell, electrons and holes are generated inside. The generated charges move to the P and N poles, and a potential difference (photovoltaic power) is generated between the P pole and the N pole by this phenomenon. At this time, when a load is connected to the solar cell, current flows. This is called a photoelectric effect.

Solar cell modules draw power by connecting multiple solar cells in series and in parallel in large systems. The cell is the smallest unit that generates electricity, and the module is the smallest unit that draws electricity. An array is a series of panels sandwiched in series and in parallel. A subarray is a unit that organizes several modules for the convenience of installation work or maintenance.

The type of solar cell is roughly classified into using a silicon semiconductor as a material and a compound semiconductor as a material. The silicon semiconductor is classified into a crystalline system and an amorphous system. Of course, in addition to this classification, including what is currently under development can be even more diverse. Regarding the development of solar cell technology, improvement of conversion efficiency and price adjustment are planned. Silicon and compound semiconductor solar cells also develop solar cells that exceed 20% conversion efficiency or develop thin film solar cells that can lower prices. Focus on.

Currently, solar cells generally used as photovoltaic power generation systems are mostly made of silicon semiconductors. In particular, single crystal and polycrystalline solar cells of a silicon semiconductor crystal system are widely used due to the excellent conversion efficiency and reliability.

Meanwhile, in order to manufacture a solar cell using a silicon semiconductor, a wafer for a solar cell must be transferred to various processes such as cleaning, deposition, and etching. It is loaded and moved.

However, in the prior art, a series of operations for loading (unloading) a plurality of wafers into a carrier or vice versa (reloading) a plurality of wafers in a carrier have been relied on manually. Therefore, there is a problem in that the tact time is increased and the productivity is lowered due to the decrease in the work efficiency such as a large amount of work time is required.

Therefore, a series of operations for stacking a plurality of wafers into a carrier or vice versa can be automatically performed to improve work efficiency and reduce tact time. Research on solar cell loading and unloading devices that can increase productivity by increasing the productivity is required. In particular, in order to reduce the tact time, the wafer is transferred at a high speed on the transfer conveyor to which the wafer is transferred, but the wafer is removed from the transfer conveyor. There is a need for a method that can be transported safely and at high speed.

SUMMARY OF THE INVENTION An object of the present invention is to load and unload a wafer for a solar cell, which transfers the wafer at a high speed on a transport conveyor to which the wafer is transported to reduce the tact time, but can be safely transported at high speed without leaving the wafer from the transport conveyor. It is to provide a device.

The object is, according to the present invention, a carrier transfer unit is loaded with a carrier (carrier) to be loaded a plurality of wafer (wafer of solar battery); And a wafer transfer unit for transferring the plurality of solar cell wafers to the carrier transfer unit, the wafer transfer unit including at least one transfer conveyor having a plurality of vacuum holes formed on a surface thereof. Achieved by a loading and unloading device.

Here, the transfer conveyor may be a plurality of transfer conveyors are formed long along the Y axis, which is the direction in which the wafer for the solar cell is substantially loaded on the carrier, spaced apart from each other along the X axis intersecting the Y axis.

The transfer conveyor, the conveyor body is formed recessed from the surface to the lower surface for forming a vacuum, the vacuum body is formed along the Y axis; And a conveyor belt slidably coupled to the conveyor body to block an upper portion of the vacuum groove and having a plurality of vacuum holes formed on a surface thereof.

The transfer conveyor may include a driving sprocket provided at one end of the conveyor belt; A driven sprocket provided at the other end of the conveyor belt; And a servo motor coupled to the driving sprocket for providing and releasing a driving force for the transfer and stop operation of the conveyor belt.

The wafer transfer unit includes: at least one input conveyor for transferring the injected solar cell wafer along an X axis transverse to a direction in which the solar cell wafer is substantially loaded on the carrier; And a transfer provided between the input conveyor and the transfer conveyor to transfer the solar cell wafer on the input conveyor to the transfer conveyor.

The at least one input conveyor may be a plurality of input conveyors spaced apart from each other along the Y axis crossing the X axis.

Each of the plurality of input conveyors may be further provided with a crack detection sensor for detecting the crack (crack) for the wafer for the solar cell transported along each of the plurality of input conveyors.

At the rear of the input conveyors, a defective wafer storage tray may be further provided to store the defective wafer in which the crack is generated.

The transfer may include a plurality of adsorption heads for adsorbing the solar cell wafer; Head connection unit for integrally connecting the plurality of adsorption head; A horizontal moving unit for moving the head connection unit to the X axis or the Y axis crossing the X axis; And an elevating driving unit configured to elevate and drive the plurality of adsorption heads on the Z axis intersecting the X axis and the Y axis.

The plurality of adsorption heads may be a plurality of adsorption heads each of which is independently turned on / off.

Each of the adsorption heads may include four adsorption units for adsorbing four upper surfaces of one solar cell wafer.

The adsorption unit may be made of a peak (PEEK, Polyether Ether Ketone) material that does not damage the wafer for solar cells.

The apparatus may further include a wafer transfer unit provided between the wafer transfer unit and the carrier transfer unit to transfer the solar cell wafer on the wafer transfer unit to a carrier on the carrier transfer unit.

The wafer transfer unit may include an index for rotating the solar cell wafer on the wafer transfer unit in one direction and transferring the wafer for a predetermined loading position; And a loader for loading the wafer for the solar cell placed in the loading position by the index while reciprocating between the loading position and the carrier on the carrier transfer unit.

A wafer lifter may be further provided at a rear end portion of the transfer conveyor along the Y axis, in a region adjacent to the index, to lift the solar cell wafer toward the index side.

The carrier transport unit, the carrier lifting unit for supporting the carrier and the carrier lifting; A carrier inlet conveyor connected to the carrier lifting unit and introducing a carrier to the carrier lifting unit; And a carrier withdrawal conveyor connected to the carrier lifting unit and withdrawing a carrier from the carrier lifting unit.

At least one of the carrier inlet conveyor and the carrier outlet conveyor may be provided by a combination of a plurality of unit conveyors which are divided and driven independently of each other.

According to the present invention, the wafer can be transported at high speed on the transport conveyor to which the wafer is transported to reduce the tact time, but the wafer can be transported safely at high speed without being separated from the transport conveyor.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

1 is a schematic plan view of an apparatus for loading and unloading a wafer for a solar cell according to an embodiment of the present invention, FIG. 2 is a side view of FIG. 1, FIG. 3 is a plan view of a transfer conveyor, and FIG. 4 is of FIG. 3. 5 is an enlarged structural diagram of a transfer, FIG. 6 is an enlarged structural diagram of an index, FIG. 7 is an enlarged structural diagram of a carrier transfer unit, and FIG. 8 is a structural diagram of a unit conveyor.

As shown in these figures, the solar cell wafer loading and unloading apparatus according to the present embodiment, a wafer transfer for transporting a plurality of wafers (W, Wafer of solar battery, wafer for convenience) The wafer transfer unit 200 is provided between the unit 100, the carrier transfer unit 200 on which the carrier C on which the wafers W are to be loaded, and the wafer transfer unit 200, and the wafer transfer unit 100 and the carrier transfer unit 200. And a wafer transfer unit 300 for transferring the wafer W on the carrier 100 to the carrier C on the carrier transfer unit 200.

Here, the loading process of the wafer (W) means that the operation of the device proceeds in the order of the wafer transfer unit 100, the wafer transfer unit 300 and the carrier transfer unit 200 so that the wafer (W) The inside is loaded in the empty carrier C, and the unloading process of the wafer W means that the operation of the apparatus is performed by the carrier transfer unit 200, the wafer transfer unit 300, and the wafer transfer unit 100. ) Means that the wafer W loaded in the carrier C is taken out from the carrier C in this order.

Typically, the solar cell wafer loading and unloading apparatus according to the present embodiment is generally used to load approximately 100 wafers W in a height direction in one carrier C, but the operation of the apparatus On the contrary, in the case of driving, the wafers W may be taken out one by one from the carrier C loaded with about 100 wafers W, which may be appropriately used when needed in various manufacturing processes of the solar cell.

Therefore, the present invention extends to the unloading process in which the wafer W is taken out from the carrier C in addition to the loading process in which the wafer W is loaded on the carrier C.

For reference, although the drawings of this embodiment are not shown in detail with respect to the wafer W and the carrier C, the wafer W has a thin thin plate shape of approximately square shape, and the carrier C has such a wafer W. Have a shape of a structure having a plurality of wafer loading slots (not shown) into which a wafer W may be loaded, such as a CD case for storing CDs, for example, a stackable stack in a height direction. (See Figure 2). Of course, since the scope of the present invention does not need to be limited to these shapes, the shapes of the wafers W and the carriers C may be variously changed from the outlined shapes.

Looking at the configuration of the solar cell wafer loading and unloading apparatus according to the present embodiment, first, the wafer transfer unit 100 transfers the wafer (W) to load (load) the wafer (W) in the carrier (C) It plays a role.

Such a wafer transfer unit 100 includes an injection conveyor 110 for transferring a wafer W injected by a robot (not shown) from the outside of the apparatus along the X-axis direction of FIG. 1, and the Y-axis of FIG. 1. The transfer conveyor 120 which transfers the wafer W to the area where the index 310 is located, and is provided between the input conveyor 110 and the transfer conveyor 120 to transfer the wafer W on the input conveyor 110. And transfer 130 to the conveyor 120.

The input conveyor 110 is a portion into which the wafer W is first introduced into the apparatus as shown in FIG. 1. In the present embodiment, the input conveyor 110 is applied to the input conveyor 110 of five rows spaced apart from each other along the Y axis. Due to this structure, five wafers (W) instead of sheets are put together at one time, and then are directed toward the transfer conveyor 120 by the transfer 130.

As such, when five wafers W are introduced at a time, the yield can be improved as compared with transferring the wafers one by one, thereby contributing to productivity.

However, since the scope of the present invention is not limited thereto, a single wafer W may be input, that is, a single row input conveyor may be applied, or a multi-row input conveyor except five rows may be applied. As a result, the number of input conveyors is sufficient if appropriately selected and adapted to the manufacturer or process situation.

Each of the five rows of input conveyors 110 is provided with a crack detection sensor 111 that detects cracks on the wafers W transported along each of the five rows of input conveyors 110. That is, as shown in Figure 1, the crack detection sensor 111 is provided on each of the input conveyors 110 of five rows, and detects whether or not the crack for the wafer (W) transported along the corresponding input conveyor at the corresponding position. Done.

Here, the crack refers to a crack or a portion of the wafer (W) is broken, the crack detection sensor 111 of the present embodiment serves to detect the damage to the four corner areas of the wafer (W). . However, in addition to the sensor having such a function, a sensor for detecting another function may be additionally applied.

As such, if the crack detection sensor 111 provided on each of the five rows of the input conveyors 110 detects the crack on the wafer W, if the cracked wafer is detected, the wafer is taken out on the line. Should be.

To this end, a defective wafer storage tray 112 for storing a cracked defective wafer (not shown) is further provided at the rear ends of the input conveyors 110.

The operation of storing the defective wafer into the defective wafer storage tray 112 may include a control unit (not shown) that receives a signal from the crack detection sensor 111 to allow the transfer 130 to transfer the defective wafer along the corresponding input conveyor. By controlling not to hold, the defective wafer can be continuously transported along the input conveyor and finally stored in the defective wafer storage tray 112.

As shown in FIG. 1, the transport conveyor 120 is formed to be long along the Y axis, and is applied to two rows of the transport conveyor 120 spaced apart from each other along the X axis. When two rows of transfer conveyors 120 are applied as in the present embodiment, since the transfer operation of the wafers W may be simultaneously performed in parallel on the two rows of transfer conveyors 120, the productivity may be further increased. However, the scope of the present invention need not be limited thereto.

Looking at the structure of the conveying conveyor 120, the conveying conveyor 120, as shown in Figure 3 and 4, is formed in the vacuum groove along the Y axis is formed recessed from the surface to the lower surface for the vacuum formation ( The conveyor belt 121a is slidably coupled to the conveyor body 121 so as to block the upper portion of the vacuum groove 121 and the conveyor belt 121a has a plurality of vacuum holes 122a formed on the surface thereof. 122).

Thus, when a vacuum is provided and a vacuum is formed in the vacuum groove 121a of the conveyor body 121, the vacuum is placed on the surface of the conveyor belt 122 by the back holes 122a of the conveyor belt 122. W) can be adsorbed by vacuum without shaking.

This is a method for allowing the wafer W to be safely transported from the transport conveyor 120 without departing from the wafer W when it is transported at a high speed on the transport conveyor 120 to reduce the tact time. That is, when simply placing the wafer W on the transfer conveyor 120 and trying to transfer the transfer conveyor 120 at high speed, the wafer W is separated from the transfer conveyor 120 by the speed of the transfer conveyor 120. Concern to be quite high.

However, as shown in the present embodiment, the conveyor belt 122 forming the transfer conveyor 120 provides a vacuum hole 122a in which vacuum is formed, and a vacuum is formed through the vacuum hole 122a, so that the conveyor belt 122 is formed. When the transfer conveyor 120 is transported in a state in which the wafer W is attached to the surface of the wafer W, even if the transfer conveyor 120 is transferred at high speed, the wafer W may be prevented from being separated.

In particular, when this method is applied, it is possible to prevent the wafer W from falling off, falling off, or misaligned from the conveying conveyor 120, so that the wafer W can be quickly and safely transported. Therefore, mutual organic control with the index 310 at the rear end also has the advantage of being much easier.

For example, if the position of the wafer W on the transfer conveyor 120 is misaligned, the position of the index 310 according to the misaligned position of the wafer W should be corrected, or the like. Although additional control may be required, even if the wafer W is transferred at a high speed as in the present embodiment, when the position is not changed, since the index 310 always needs to rotate by a predetermined angle at the corresponding position, a different control is performed. It is not necessary.

The back holes 122a which provide such an effect are formed in the conveyor belt 122, and the back holes 122a may be formed in a row at intervals along the longitudinal direction of the conveyor belt 122 as shown in the drawing. Or may be formed in the form of multiple rows. In addition, considering that the size of the wafer W transferred on the conveyor belt 122 may be changed, the back hole 122a may be formed over the entire surface of the conveyor belt 122.

In addition to the above-described configuration, the transfer conveyor 120 having the above characteristics includes a drive sprocket 123 provided at one end of the conveyor belt 122, and a driven sprocket 124 provided at the other end of the conveyor belt 122. It is further provided with a servo motor 125 coupled to the drive sprocket 123 to provide and release the driving force for the transfer and stop operation of the conveyor belt 122.

The servomotor 125 drives the operation of the transfer conveyor 120 so that the wafer W transferred at high speed on the transfer conveyor 120 may be stopped in the index 310 region. In this case, since it is difficult to control the feeding and stopping operations of the conveyor belt 122 step by step, the servo motor 125 is applied in the present embodiment.

On the other hand, at the rear end of the transfer conveyor 120 along the Y axis, a wafer lifter 126 is further provided in the region where the index 310 is located, to up the wafer W to the index 310 side. As shown in FIG. 1, the lifter 126 has a structure in which a lifter 126 is provided in pairs with the transfer conveyor 120 interposed therebetween to operate together.

The lifter 126 is provided for the index 310 to easily hold the wafer W. The lifter 126 lifts the wafer W up by the back hole 122a by the conveyor belt 122. The wafer W that has stuck to the surface of the wafer) falls, so that the index 310 can grasp and transport the wafer W in a short time, so that the lifter 126 also reduces the tact time. There is a number.

The transfer 130 is provided between the input conveyor 110 and the transfer conveyor 120 to transfer the wafer W on the input conveyor 110 to the transfer conveyor 120.

As shown in FIG. 5, the transfer 130 integrates a plurality of adsorption heads 131 and a plurality of adsorption heads 131 that adsorb the wafers W that reach the ends on the input conveyors 110. Head connecting portion 132 for connecting to the horizontal, horizontal moving portion 133 for moving the head connecting portion 132 on the X-axis, and lifting and lowering driving portion 134 for driving the plurality of suction heads 131 up and down on the Z-axis. It is provided.

As described above, in the present embodiment, since the input conveyor 110 is composed of five rows, and thus the five wafers W are simultaneously fed, a plurality of suction heads for adsorbing the wafers W ( 131) also five. As a result, the number of suction heads 131 is provided to correspond to the number of the input conveyor 110.

As described above, when there are defective wafers in which cracks are generated among the wafers W introduced along the input conveyor 110 having five rows, the five suction heads 131 provided in the transfer 130 are provided. The adsorption head 131 at a position corresponding to the defective wafer should not be driven, so that the defective wafer can be continuously transported along the input conveyor and stored in the defective wafer storage tray 112.

Therefore, the five suction heads 131 provided in the transfer 130 of the present embodiment have a structure that is independently turned on / off (on / off) driven. Here, the method in which the five adsorption heads 131 are independently turned on or off may be implemented through on / off control of a vacuum provided to the five adsorption heads 131, or five adsorption heads ( It may be implemented through the individual control of the elevating drive unit 134 for elevating 131.

In the present embodiment, since each of the five suction heads 131 is provided with a lift driver 134 individually, the latter method, i.e., the lift driver 134 lifts and lowers the five suction heads 131 individually. Through control, the independent on / off driving of the five suction heads 131 can be implemented. However, the scope of the present invention is not necessarily limited thereto.

1 and 5, each of the adsorption heads 131 includes four adsorption parts 131a for adsorbing four upper surfaces of one wafer W. As shown in FIG.

The four adsorption parts 131a have an approximately funnel shape and adsorb the wafer W by a vacuum formed therein. In this embodiment, the adsorption parts 131a are made of PEEK (polyether ether ketone) material. By fabricating, it is possible to prevent damage such as scratches on the wafer W when the wafer W is adsorbed.

The head connection part 132 is a part which connects five adsorption heads 131 integrally. Due to the head connection 132, the five suction heads 131 are operated simultaneously. The horizontal moving part 133 serves to move the head connection part 132 which integrally connects the five suction heads 131 to the X axis of FIG. 1, and the lifting and lowering drive part 134 moves the five suction heads 131. ) Is driven up and down by the Z-axis in the vertical direction.

The horizontal moving unit 133 may be applied as a linear motor, and the elevating driving unit 134 may be applied as a cylinder, but this is not necessarily the case. In particular, in the present embodiment, the horizontal moving part 133 serves to move the head connecting part 132 which integrally connects the five suction heads 131 to the X axis of FIG. 1, but to the Y axis of FIG. 1. It can also serve as a transporter.

On the other hand, prior to the description of the carrier transfer unit 200, the wafer transfer unit 300 will be described first, the wafer transfer unit 300, as shown in Figure 1, 2 and 6, the wafer transfer unit ( The index 310 which rotates the wafer W on one side in one direction and transfers the wafer W to a predetermined loading position, and the index 310 reciprocates between the loading position and the carrier C on the carrier transfer unit 200. And a loader 330 for loading (loading) the wafer W placed at the loading position into the carrier C.

As shown in FIG. 1, the index 310 has a substantially cross structure. The wafer 310 is transferred along the wafer transfer unit 100 while rotating in steps of 90 degrees and reaches the distal end of the wafer transfer unit 100. By holding one by one serves to deliver to the position of the loader 330 loading position.

As shown in detail in FIG. 6, the index 310 has a main body part 311 which is provided to be rotated in steps of 90 degrees with respect to a predetermined axis of rotation, and a radial direction at an outer surface of the main body part 311. Four arms 312 provided to extend outwardly, and the holding part 313 provided in each of the four arms 312 for holding the wafer W by vacuum are provided.

The main body 311 may be rotated in steps of 90 degrees by the rotation motor 311a provided in the lower region thereof.

In addition, the holding portion 313 which is in contact with the surface of the wafer W and grips the wafer W has the structure of the above-mentioned suction head 131 of the transfer 130 and the lifting drive unit 134 attached thereto. It may be provided approximately similar to.

That is, the gripping portion 313 includes a plurality of suction heads 313a, a head portion 313b connecting the plurality of suction heads 313a, and a lifting portion 313c for raising and lowering the head portion 313b. The plurality of adsorption heads 313a may be made of the same material as the adsorption part 131a described above. As a result, when the rotation of the index 310 is completed, the plurality of adsorption heads 313a are lowered due to the elevating portion 313c of the gripper 313 to adsorb the wafer W, and the adsorption is completed again. Ascending operation can be performed.

As the index 310 having such a structure is applied, in particular, an operation of loading the wafer W on the wafer transfer unit 100 into the carrier C on the carrier transfer unit 200 may be performed more quickly. There is this.

As described above, the loader 330 serves to load (load) the wafer W placed in the loading position by the index 310 into the carrier C. For this purpose, the loader 330 is loaded at the loading position. The linear reciprocation of the carrier (C) on the carrier transfer unit 200 should be. The loader 330 may be applied as a linear motor having a smooth linear motion and easy distance control.

Lastly, referring to FIGS. 1, 2, 7 and 8, the carrier transfer unit 200 is a wafer W transferred by the above-described wafer transfer unit 100 and the wafer transfer unit 300. Into the apparatus, a hollow carrier C having a plurality of wafer loading slots (not shown) formed therein is inserted into the apparatus so that the wafer can be loaded, and approximately 100 wafers W are loaded (loaded) in the carrier C. After that, the wafer W serves to draw the carrier C loaded thereon.

To this end, the carrier transporting unit 200 supports the carrier C and the carrier lifting unit 210 for lifting the carrier C up and down, connected to the carrier lifting unit 210 and the carrier lifting unit ( A carrier inlet conveyor 220 for introducing a carrier C having an empty inside into the carrier 210, a carrier connected to the carrier lifting unit 210 and loaded with a wafer W from the carrier lifting unit 210. And a carrier take-out conveyor 230 for drawing C).

The carrier lifting unit 210 includes a carrier holder 211 for chucking the carrier C, and an up / down driving unit 212 for driving the carrier C up and down. .

The carrier holder 211 may have a structure in which the carrier C is chucked to the carrier C in a hook manner when the carrier C is inserted into a predetermined position in the carrier lifting unit 210, or at both sides of the carrier C. The structure which approaches toward the carrier C and chucks while pressing the side surface of the carrier C from both sides may be applied. Whatever method is applied, the carrier holder 211 is preferably not shaken without leaving the seat when the carrier (C) drawn up to a predetermined position in the carrier lifting unit 210 up / down.

The up / down driving unit 212 may move up / down the carrier C step by step, that is, the index 310 moves up step by step in conjunction with an operation in which the index 310 is rotated step by step by 90 degrees. It serves to raise the carrier (C) to be up). The up / down driving unit 212 may be applied as a linear motor as shown, but may be replaced by a cylinder or the like.

As shown in FIG. 7, the carrier inlet conveyor 220 which draws the carrier C having an empty inside of the carrier into the lifting unit 210, lifts and lowers the carrier C on which the wafer W is loaded. It is provided in the lower region of the carrier take-out conveyor 230 to withdraw from the unit 210.

As such, as the carrier inlet conveyor 220 is provided in the lower region of the carrier takeout conveyor 230, the carrier C may move the carrier inlet conveyor 220 in an empty state in the (-) Y direction of FIG. 7. After being drawn in, the wafer W is loaded therein while being stepped up in the positive (+) Z direction of FIG. 7 by the carrier elevating unit 210, and then the positive (Y) direction of FIG. As a result, approximately 100 wafers W are loaded through the carrier takeout conveyor 230.

Of course, since the scope of the present invention does not need to be limited thereto, the carrier inlet conveyor 220 does not necessarily need to be provided in the lower region of the carrier takeout conveyor 230.

Meanwhile, referring to the structures of the carrier inlet conveyor 220 and the carrier takeout conveyor 230, both the carrier inlet conveyor 220 and the carrier takeout conveyor 230 may be divided and driven independently along the Y axis of FIG. 1. It is provided by a combination of the unit conveyor 250 of. That is, the unit conveyors 250 shown in FIG. 8 are disposed along the Y axis of FIG. 1 to manufacture the carrier inlet conveyor 220 and the carrier outlet conveyor 230. In the present exemplary embodiment, the carrier inlet conveyor 220 is manufactured by using four unit conveyors 250, and the carrier outlet conveyor 230 is manufactured by using three unit conveyors 250.

Referring to the unit conveyor 250, the unit conveyor 250, as shown in Figure 8, the drive and driven to rotate the unit driving belt 251 and the unit driving belt 251 of the closed loop shape at both ends Pulleys 252 and 253 and independent drive units 254 coupled to the drive pulley 252.

Accordingly, the unit conveyor 250 has an operation of independently rotating the unit driving belt 251 based on the rotation of the driving and driven pulleys 252 and 253 during the operation of the independent driving unit 254.

When the unit conveyor 250 which can be driven as such is arranged on the Y-axis of FIG. 1 to manufacture the carrier inlet conveyor 220 and the carrier outlet conveyor 230, a buffer during the inlet and outlet of the carrier C. ) Function can be performed. That is, since the driving can be controlled for each unit conveyor 250 in a state in which one carrier C is loaded in one unit conveyor 250, drawing and drawing are sequentially possible, and unnecessary power loss can be reduced. There is an advantage.

As shown in FIG. 1, an idle roller 260 is further provided between the unit conveyors 250 so as not to disturb the movement of the carrier C.

The operation of loading (loading) the solar cell wafer W into the carrier C by such a configuration will be described with reference to FIGS. 1 and 7 as follows.

First, the empty carrier C is introduced through the carrier inlet conveyor 220 in the (-) Y direction of FIG. 7, and then disposed on the carrier lifting unit 210, and then chucked to the carrier holder 211. do.

Subsequently, when five wafers W are transferred along the X-axis of FIG. 1 along the five rows of input conveyors 110, the five wafers W are transferred to one of the two rows of transfer conveyors 120 by the transfer 130. Is passed to 120.

In this case, the defective wafer in which the crack is generated among the wafers W transported along the input conveyor 110 in five rows is detected by the crack detection sensor 111 and the adsorption of the transfer 130 by the control unit receiving the detection signal. The bad wafer is separated and stored in the bad wafer storage tray 112 by being controlled so as not to be applied by the head 131.

Five wafers W transferred onto any one transfer conveyor 120 are transferred along the Y axis by the operation of the transfer conveyor 120. That is, the first wafer W of the five wafers W is the index of the wafer transfer unit 300 based on the operation in which the transfer conveyor 120 is stopped by the servomotor 125 after a predetermined distance is stopped. 310 is located in the area.

In this case, since the vacuum hole 122a is formed on the surface of the conveyor belt 122, a vacuum is formed through the vacuum hole 122a, and the wafer W is formed on the surface of the conveyor belt 122. When the transfer conveyor 120 is transported in a state of being stuck, even when the transfer conveyor 120 is transferred at high speed, the wafer W may be prevented from being separated. In particular, when the wafer W is transferred in such a manner, that is, by vacuum suction method by the vacuum hole 122a, the wafer W is prevented from being separated, dropped, or displaced from the conveying conveyor 120, resulting in a result. As a result, it is possible to achieve rapid and safe transfer of the wafer W, and therefore, mutual organic control with the index 310 at the rear end may be much easier.

When the first wafer W is positioned in the index 310 region of the wafer transfer unit 300 by an operation of one of the transfer conveyors 120, the first wafer W is provided in the distal end region of the transfer conveyor 120 in the index 310 region. The first wafer W is up by the lifter 126 and the index 310 grasps the first wafer W, rotates 90 degrees, and then transfers it to the loading position of the loader 330. 330 advances and loads the first wafer W on the carrier C on the carrier transfer unit 200.

Meanwhile, with the operation of the index 310 and the loader 330, the transport conveyor 120 is stopped after being transported by a predetermined distance again, and this time, the second wafer W is located in the index 310 region. .

Then, the index 310 and the loader 330 operate in the same manner as above to load the second wafer (W) in the carrier (C), in this case the carrier (C) disposed in the carrier lifting unit 210 The up / down driving unit 212 of the carrier raising and lowering unit 210 is pre-up (up) to a position where the second wafer (W) can be loaded and waits.

In this way, when all 100 wafers W are loaded into the carrier C, for example, the carrier C is completely up by the up / down driving unit 212, after which the carrier take-out conveyor is carried out. Through (230) is drawn out in the (+) Y direction of Figure 7, again through the carrier inlet conveyor 220 a new carrier is introduced to proceed the same operation.

As described above, this series of operations is an operation of loading (loading) a plurality of wafers W into the carrier C, but on the contrary, when the above-mentioned configurations are operated in reverse, they are loaded into the carrier C. The wafers W may be taken out (unloaded) in sheets.

As such, according to the present exemplary embodiment, the wafer W is transferred at a high speed on the transfer conveyor 120 to which the wafer W is transferred to reduce the tact time, but the wafer W is transferred from the transfer conveyor 120. Can be transported safely and at high speed without deviation.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

1 is a schematic plan view of an apparatus for loading and unloading a wafer for a solar cell according to an embodiment of the present invention.

2 is a side view of FIG. 1.

3 is a plan view of the transfer conveyor.

4 is a side view of FIG. 3.

5 is an enlarged structural diagram of a transfer.

6 is an enlarged structural diagram of an index.

7 is an enlarged structural diagram of a carrier transfer unit.

8 is a structural diagram of a unit conveyor.

* Explanation of symbols for the main parts of the drawings

100: wafer transfer unit 110: input conveyor

120: conveying conveyor 130: transfer

200: carrier transfer unit 210: carrier lifting unit

220 carrier carrier conveyor 230 carrier carrier conveyor

250: unit conveyor 300: wafer transfer unit

310: index 330: loader

Claims (17)

A carrier transfer unit on which a carrier on which a plurality of wafers of solar batteries are to be loaded is loaded; And It includes a wafer transfer unit for transferring the plurality of solar cell wafers to the carrier transfer unit, The wafer transfer unit, At least one transfer conveyor having a plurality of vacuum holes adsorbed on the plurality of solar cell wafers on a surface thereof; At least one input conveyor for transferring the solar cell wafer along an X axis transverse to a direction in which the solar cell wafer is loaded on the carrier; And A transfer provided between the input conveyor and the transfer conveyor to transfer the solar cell wafer on the input conveyor to the transfer conveyor, The at least one input conveyor is a plurality of input conveyors are spaced apart from each other along the Y axis crossing the X axis, Each of the plurality of input conveyors, the loading of the solar cell wafer, characterized in that the crack detection sensor for detecting whether the crack (cracks) for the wafer for the solar cell transported along each of the plurality of input conveyors is provided And unloading device. The method of claim 1, The transfer conveyor is formed of a plurality of transfer conveyors are formed long along the Y axis, the direction in which the solar cell wafer is loaded on the carrier, spaced apart from each other along the X axis intersecting the Y axis and Unloading device. The method of claim 1, The transfer conveyor, A conveyor body recessed from a surface to a lower surface to form a vacuum, the vacuum body being formed along a Y axis in a direction to be loaded on the carrier; And An apparatus for loading and unloading a wafer for a solar cell, the conveyor belt being slidably coupled to the conveyor body to block an upper portion of the vacuum groove, and having a plurality of vacuum holes formed on a surface thereof. The method of claim 3, The transfer conveyor, A drive sprocket provided at one end of the conveyor belt; A driven sprocket provided at the other end of the conveyor belt; And And a servo motor coupled to the driving sprocket for providing and releasing a driving force for the transfer and stop operation of the conveyor belt. delete delete delete The method of claim 1, An apparatus for loading and unloading a wafer for a solar cell, further comprising a defective wafer storage tray in which the cracked defective wafer is stored at the rear of the input conveyors. The method of claim 1, The transfer, A plurality of adsorption heads for adsorbing the solar cell wafer; Head connection unit for integrally connecting the plurality of adsorption head; A horizontal moving unit for moving the head connection unit to the X axis or the Y axis crossing the X axis; And An apparatus for loading and unloading a wafer for a solar cell, comprising: a lift driver configured to lift and lower the plurality of suction heads to a Z axis crossing the X and Y axes. 10. The method of claim 9, And the plurality of adsorption heads are a plurality of adsorption heads each of which is independently turned on / off. The method of claim 10, Each of the adsorption heads, the solar cell wafer loading and unloading apparatus, characterized in that it comprises four adsorption portion for adsorbing four upper surface of one solar cell wafer. The method of claim 11, The adsorption unit loading and unloading device of the solar cell wafer, characterized in that the peak (PEEK, Polyether Ether Ketone) material is not damaged to the solar cell wafer. The method of claim 1, And a wafer transfer unit provided between the wafer transfer unit and the carrier transfer unit to transfer the solar cell wafer on the wafer transfer unit to a carrier on the carrier transfer unit. . The method of claim 13, The wafer transfer unit, An index for rotating the solar cell wafer on the wafer transfer unit in one direction and transferring the wafer for a predetermined loading position; And And a loader for loading the solar cell wafer placed in the loading position by the index into the carrier while reciprocating between the loading position and the carrier on the carrier transfer unit. Device. The method of claim 14, A wafer lifter is further provided at a rear end portion of the transfer conveyor along the Y axis, which is a direction to be loaded on the carrier, in a region adjacent to the index to up the wafer for the solar cell to the index side. Device for loading and unloading wafers for solar cells. The method of claim 1, The carrier transfer unit, A carrier lifting unit supporting the carrier and lifting the carrier up and down; A carrier inlet conveyor connected to the carrier lifting unit and introducing a carrier to the carrier lifting unit; And And a carrier takeout conveyor connected to the carrier lift unit and extracting a carrier from the carrier lift unit. The method of claim 16, At least one of the carrier pull-in conveyor and the carrier pull-out conveyor is divided by each other is provided by a combination of a plurality of unit conveyors driven independently of the solar cell wafer loading and unloading apparatus.

Images